FEATURES FUNCTIONAL BLOCK DIAGRAM 4.72 mm × 3.76 mm × 1.0 mm surface-mount package High SNR of 62 dBA Sensitivity of −42 dBV Flat frequency response from 100 Hz to 15 kHz Low current consumption of <250 μA Single-ended analog output High PSR of 70 dB Compatible with Sn/Pb and Pb-free solder processes RoHS/WEEE compliant OUTPUT AMPLIFIER ADMP401 OUTPUT POWER VDD GND 07712-001 Data Sheet Omnidirectional Microphone with Bottom Port and Analog Output ADMP401 Figure 1. APPLICATIONS Smartphones and feature phones Teleconferencing systems Digital video cameras Bluetooth headsets Video phones Tablets GENERAL DESCRIPTION The ADMP4011 is a high quality, high performance, low power, analog output, bottom-ported omnidirectional MEMS microphone. The ADMP401 consists of a MEMS microphone element, an impedance converter, and an output amplifier. The ADMP401 sensitivity specification makes it an excellent choice for both near field and far field applications. The ADMP401 has a high SNR and flat wideband frequency response, resulting in natural sound with high intelligibility. Low current consumption 1 enables long battery life for portable applications. The ADMP401 complies with the TIA-920 standard, Telecommunications Telephone Terminal Equipment Transmission Requirements for Wideband Digital Wireline Telephones. The ADMP401 is available in a thin, 4.72 mm × 3.76 mm × 1.0 mm surface-mount package. It is reflow solder compatible with no sensitivity degradation. The ADMP401 is halide free. Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; 7,961,897. Other patents are pending. Rev. E Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2010–2012 Analog Devices, Inc. All rights reserved. Powered by TCPDF (www.tcpdf.org) IMPORTANT LINKS for the ADMP401* Last content update 09/20/2013 09:49 pm DOCUMENTATION PARAMETRIC SELECTION TABLES AN-1181: Using a MEMS Microphone in a 2-Wire Microphone Circuit AN-1165: Op Amps for MEMS Microphone Preamp Circuits AN-1140: Microphone Array Beamforming AN-1124: Recommendations for Sealing Analog Devices, Inc., BottomPort MEMS Microphones from Dust and Liquid Ingress AN-1112: Microphone Specifications Explained AN-1068: Reflow Soldering of the MEMS Microphone AN-1003: Recommendations for Mounting and Connecting Analog Devices, Inc., Bottom-Ported MEMS Microphones Introducing iMEMS(R) Microphones This video compares the ADMP401 Analog MEMS and the ADMP421 Digital MEMS with a BK Type 4939 Measurement microphone. UG-278: EVAL-ADMP401Z-FLEX: Bottom-Ported Analog Output MEMS Microphone Evaluation Board UG-126: EVAL-ADMP401Z Bottom-Ported Analog Output MEMS Microphone Evaluation Board MS-2472: Analog and Digital MEMS Microphone Design Considerations MS-2275: Common Inter-IC Digital Interfaces for Audio Data Transfer A History of Consumer Microphones: Industrial ICs Solutions Bulletin, Volume 10, Issue 8 Industrial ICs Find Similar Products By Operating Parameters Consider ADMP404: Omnidirectional Microphone with Bottom Port and Analog Output Consider ADMP405: Omnidirectional Microphone with Bottom Port and Analog Output Consider ADMP421: Omnidirectional Microphone with Bottom Port and Analog Output Consider ADMP441: Omnidirectional Microphone with Bottom Port and Analog Output Consider ADMP504: Omnidirectional Microphone with Bottom Port and Analog Output Consider ADMP521: Omnidirectional Microphone with Bottom Port and Analog Output DESIGN TOOLS, MODELS, DRIVERS & SOFTWARE Microphone Beamforming Simulation Tool (32-bit) - Documentation for the microphone beamforming simulator Microphone Beamforming Simulation Tool (64-bit) - Documentation for the microphone beamforming simulator PRODUCT RECOMMENDATIONS & REFERENCE DESIGNS CN-0262: Low Noise Analog MEMS Microphone and Preamp with Compression and Noise Gating CN-0207: High Performance Analog MEMS Microphone's Simple Interface to SigmaDSP Audio Codec EVALUATION KITS & SYMBOLS & FOOTPRINTS MEMS Microphone Evaluation Boards ADMP401Z Evaluation Board ADMP401 Flex Evaluation Board Symbols and Footprints DESIGN COLLABORATION COMMUNITY Collaborate Online with the ADI support team and other designers about select ADI products. Follow us on Twitter: www.twitter.com/ADI_News Like us on Facebook: www.facebook.com/AnalogDevicesInc DESIGN SUPPORT Submit your support request here: Linear and Data Converters Embedded Processing and DSP Telephone our Customer Interaction Centers toll free: Americas: Europe: China: India: Russia: 1-800-262-5643 00800-266-822-82 4006-100-006 1800-419-0108 8-800-555-45-90 Quality and Reliability Lead(Pb)-Free Data SAMPLE & BUY ADMP401 View Price & Packaging Request Evaluation Board Request Samples Check Inventory & Purchase Find Local Distributors * This page was dynamically generated by Analog Devices, Inc. and inserted into this data sheet. Note: Dynamic changes to the content on this page (labeled 'Important Links') does not constitute a change to the revision number of the product data sheet. This content may be frequently modified. ADMP401 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Connecting the ADMP401 to a Codec ......................................8 Applications ....................................................................................... 1 Connecting the ADMP401 to an Op Amp Gain Stage ............8 Functional Block Diagram .............................................................. 1 Supporting Documents ................................................................8 General Description ......................................................................... 1 Handling Instructions .......................................................................9 Revision History ............................................................................... 2 Pick-and-Place Equipment ..........................................................9 Specifications..................................................................................... 3 Reflow Solder .................................................................................9 Absolute Maximum Ratings ............................................................ 4 Board Wash ....................................................................................9 ESD Caution .................................................................................. 4 Reliability Specifications ................................................................ 10 Pin Configuration and Function Descriptions ............................. 5 Outline Dimensions ....................................................................... 11 Printed Circuit Board (PCB) Land Pattern Layout ...................... 6 Ordering Guide .......................................................................... 11 Typical Performance Characteristics ............................................. 7 Applications Information ................................................................ 8 REVISION HISTORY 7/12—Rev. D to Rev. E Changes to Features Section, General Description Section, and Page 1 Layout .................................................................................... 1 Add Note 1......................................................................................... 1 Changes to Frequency Response Parameter, Table 1 and Powers Supply Rejection Parameter, Table 1 .............................................. 3 Changes to Temperature Range Parameter, Table 2..................... 4 Changes to Figure 6, Figure 7, and Figure 8.................................. 7 Changes to Applications Information Section and Figure 10..... 8 Added Supporting Documents Section, Application Notes Section, Circuit Notes Section, and Evaluation Board User Guides Section .................................................................................. 8 Changes to THB Description Column, Table 5 and Temperature Cycle Column, Table 5 ................................................................... 10 Changes to Ordering Guide .......................................................... 11 1/12—Rev. C to Rev. D Updated Outline Dimensions ....................................................... 11 Changes to Figure 12 ...................................................................... 11 Added Figure 13.............................................................................. 11 Change to Ordering Guide ............................................................ 11 8/11—Rev. B to Rev. C Changes to Figure 1 ...........................................................................1 Changes to Table 3.............................................................................4 Removed Terminal Side Down from Figure 3 ...............................5 Changes to Bullet 2 in Pick-and-Place Equipment Section .........9 Changes to Ordering Guide .......................................................... 11 12/10—Rev. A to Rev. B Changes to Applications and General Description Sections .......1 Changes to Table 1.............................................................................3 8/10—Rev. 0 to Rev. A Changes to Frequency Response Parameter, Table 1 ....................3 Changes to Supply Voltage Parameter, Table 2 ..............................4 Changes to Applications Information Section, Figure 9, and Figure 10 .............................................................................................8 Updated Outline Dimensions ....................................................... 11 4/10—Revision 0: Initial Version Rev. E | Page 2 of 12 Data Sheet ADMP401 SPECIFICATIONS TA = 25°C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not guaranteed. Table 1. Parameter PERFORMANCE Directionality Sensitivity Signal-to-Noise Ratio Equivalent Input Noise Dynamic Range Frequency Response 1 Symbol Total Harmonic Distortion Power Supply Rejection Maximum Acoustic Input POWER SUPPLY Supply Voltage Supply Current OUTPUT CHARACTERISTICS Output Impedance Output DC Offset Output Current Limit THD PSR 1 Test Conditions/Comments Min 1 kHz, 94 dB SPL −45 SNR EIN Derived from EIN and maximum acoustic input Low frequency, −3 dB point High frequency, −3 dB point Deviation limits from flat response within pass band 105 dB SPL 217 Hz, 100 mV p-p square wave superimposed on VDD = 1.8 V Peak VDD IS Typ Omni −42 62 32 88 60 15 −3/+2 Rev. E | Page 3 of 12 −39 dBV dBA dBA SPL dB Hz kHz dB % dB dB SPL 3 3.3 250 200 0.8 90 See Figure 6 and Figure 7. Unit 70 120 1.5 ZOUT Max V µA Ω V µA ADMP401 Data Sheet ABSOLUTE MAXIMUM RATINGS ESD CAUTION Table 2. Parameter Supply Voltage Sound Pressure Level (SPL) Mechanical Shock Vibration Temperature Range Rating −0.3 V to +3.6 V 160 dB 10,000 g Per MIL-STD-883 Method 2007, Test Condition B −40°C to +85°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CRITICAL ZONE TL TO TP tP TP tL TSMAX TSMIN tS RAMP-DOWN PREHEAT 07712-002 TEMPERATURE RAMP-UP TL t25°C TO PEAK TIME Figure 2. Recommended Soldering Profile Limits Table 3. Recommended Soldering Profile Limits Profile Feature Average Ramp Rate (TL to TP) Preheat Minimum Temperature (TSMIN) Maximum Temperature (TSMAX) Time (TSMIN to TSMAX), tS Ramp-Up Rate (TSMAX to TL) Time Maintained Above Liquidous (tL) Liquidous Temperature (TL) Peak Temperature (TP) Time Within 5°C of Actual Peak Temperature (tP) Ramp-Down Rate Time 25°C (t25°C) to Peak Temperature Rev. E | Page 4 of 12 Sn-Pb 1.25°C/sec maximum Pb Free 1.25°C/sec maximum 100°C 150°C 60 sec to 75 sec 1.25°C/sec 45 sec to 75 sec 183°C 215°C +3°C/−3°C 20 sec to 30 sec 3°C/sec maximum 5 min maximum 100°C 200°C 60 sec to 75 sec 1.25°C/sec ~50 sec 217°C 245°C +0°C/−5°C 20 sec to 30 sec 3°C/sec maximum 5 min maximum Data Sheet ADMP401 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTPUT GND 2 1 GND 3 GND 6 VDD 4 5 BOTTOM VIEW Not to Scale 07712-003 GND Figure 3. Pin Configuration (Bottom View) Table 4. Pin Function Descriptions Pin No. 1 2 3 4 5 6 Mnemonic OUTPUT GND GND GND VDD GND Description Analog Output Signal Ground Ground Ground Power Supply Ground Rev. E | Page 5 of 12 ADMP401 Data Sheet PRINTED CIRCUIT BOARD (PCB) LAND PATTERN LAYOUT A suggested solder paste stencil pattern layout is shown in Figure 5. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port of the microphone. A minimum diameter of 0.5 mm is recommended. The recommended PCB land pattern for the ADMP401 should have a 1:1 ratio to the solder pads on the microphone package, as shown in Figure 4. Take care to avoid applying solder paste to the sound hole in the PCB. 2.62 ø0.90 (3×) ø1.10 ø1.68 2.54 2.40 1.20 1.27 07712-004 ø0.70 (2×) 0.79 Figure 4. PCB Land Pattern Layout (Dimensions Shown in mm) 1.8mm/1.3mm DIA. 0.2032 CUT WIDTH (4×) 0.649mm DIA. (2×) 0.85mm DIA. (3×) 2.4mm 2.54mm 1.2mm 2.62mm 3.41mm Figure 5. Suggested Solder Paste Stencil Pattern Layout Rev. E | Page 6 of 12 07712-005 1.27mm Data Sheet ADMP401 TYPICAL PERFORMANCE CHARACTERISTICS 0 10 8 –10 6 –30 2 PSR (dB) SENSITIVITY (dB) –20 4 0 –2 –40 –50 –4 –60 –6 100 10k 1k FREQUENCY (Hz) –80 100 07712-006 –10 50 Figure 6. Frequency Response Mask Figure 8. Typical Power Supply Rejection vs. Frequency 0 –10 100 1k 10k FREQUENCY (Hz) 07712-007 AMPLITUDE (dB) 10 –20 10 1k FREQUENCY (Hz) Figure 7. Typical Frequency Response (Measured) Rev. E | Page 7 of 12 10k 07712-008 –70 –8 ADMP401 Data Sheet APPLICATIONS INFORMATION CONNECTING THE ADMP401 TO AN OP AMP GAIN STAGE GAIN = (R1 + R2)/R1 0.1µF R1 VDD ADMP401 R2 VREF 1µF MINIMUM VO OUTPUT 10kΩ fC = 1/(2π × C × R) ADA4897-1 GND VREF where R is the input impedance of the codec. A minimum value of 2.2 µF is recommended in Figure 9 because the input impedance of the ADAU1361/ADAU1761 can be as low as 2 kΩ at its highest PGA gain setting, which results in a high-pass filter corner frequency at about 37 Hz. Figure 10 shows the ADMP401 connected to the ADA4897-1 op amp configured as a noninverting preamplifier. CONNECTING THE ADMP401 TO A CODEC 07712-010 The ADMP401 output can be connected to a dedicated codec microphone input (see Figure 9) or to a high input impedance gain stage (see Figure 10). A 0.1 µF ceramic capacitor placed close to the ADMP401 supply pin is used for testing and is recommended to adequately decouple the microphone from noise on the power supply. A dc-blocking capacitor is required at the output of the microphone. This capacitor creates a highpass filter with a corner frequency at Figure 10. ADMP401 Connected to the ADA4897-1 Op Amp SUPPORTING DOCUMENTS Application Notes AN-1003, Recommendations for Mounting and Connecting Analog Devices, Inc., Bottom-Ported MEMS Microphones AN-1068, Reflow Soldering of the MEMS Microphone AN-1112, Microphone Specifications Explained MICBIAS AN-1124, Recommendations for Sealing Analog Devices, Inc., Bottom-Port MEMS Microphones from Dust and Liquid Ingress 0.1µF ADAU1761 VDD ADMP401 OUTPUT OR 2.2µF MINIMUM ADAU1361 AN-1140, Microphone Array Beamforming LINN Circuit Notes GND CM 07712-009 LINP Figure 9. ADMP401 Connected to the Analog Devices ADAU1761 or ADAU1361 Codec CN-0207, High Performance Analog MEMS Microphone’s Simple Interface to SigmaDSP Audio Codec CN-0262, Low Noise Analog MEMS Microphone and Preamp with Compression and Noise Gating Evaluation Board User Guides UG-126, EVAL-ADMP401Z: Bottom-Ported Analog Output MEMS Microphone Evaluation Board UG-278, EVAL-ADMP401Z-FLEX: Bottom-Ported Analog Output MEMS Microphone Evaluation Board Rev. E | Page 8 of 12 Data Sheet ADMP401 HANDLING INSTRUCTIONS PICK-AND-PLACE EQUIPMENT REFLOW SOLDER The MEMS microphone can be handled using standard pickand-place and chip shooting equipment. Care should be taken to avoid damage to the MEMS microphone structure as follows: For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste that is used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 2 and Table 3. • • • • • Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. Use care during pick-and-place to ensure that no high shock events above 10 kg are experienced because such events may cause damage to the microphone. Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. Do not pull air out or blow air into the microphone port. Do not use excessive force to place the microphone on the PCB. BOARD WASH When washing the PCB, ensure that water does not make contact with the microphone port. Blow-off procedures and ultrasonic cleaning must not be used. Rev. E | Page 9 of 12 ADMP401 Data Sheet RELIABILITY SPECIFICATIONS The microphone sensitivity after stress must deviate by no more than ±3 dB from the initial value. Table 5. Stress Test Low Temperature Operating Life High Temperature Operating Life THB Temperature Cycle High Temperature Storage Low Temperature Storage Component CDM ESD Component HBM ESD Component MM ESD Description −40°C, 500 hours, powered +125°C, 500 hours, powered +85°C/85% relative humidity, 500 hours, powered −40°C/+125°C, one cycle per hour, 1000 cycles +150°C, 500 hours −40°C, 500 hours All pins, 0.5 kV All pins, 1.5 kV All pins, 0.2 kV Rev. E | Page 10 of 12 Data Sheet ADMP401 OUTLINE DIMENSIONS 4.82 4.72 4.62 3.30 REF REFERENCE CORNER 4.10 REF PIN 1 3.86 3.76 3.66 2.40 BSC 3.14 REF 1 2 1.68 DIA. 3 1.10 DIA. 6 4 5 0.68 REF 2.54 BSC 1.27 BSC 0.25 DIA. (THRU HOLE) 1.20 BSC TOP VIEW 1.10 1.00 0.90 0.79 BSC 2.62 BSC 0.90 DIA. (PINS 1, 5, 6) 0.61 REF 0.70 DIA. (PINS 2, 4) BOTTOM VIEW SIDE VIEW 12-12-2011-C 0.73 REF 0.24 REF Figure 11. 6-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] 4.72 mm × 3.76 mm Body (CE-6-1) Dimensions shown in millimeters DIRECTION OF FEED 07712-011 PIN 1 Figure 12. Microphone Orientation in Tape Until Date Code 1213 DIRECTION OF FEED 07712-012 PIN 1 Figure 13. Microphone Orientation in Tape Starting with Date Code 1213 ORDERING GUIDE Model 1 ADMP401ACEZ-RL ADMP401ACEZ-RL7 EVAL-ADMP401Z EVAL-ADMP401Z-FLEX 1 2 Temperature Range −40°C to +85°C −40°C to +85°C Package Description 6-Terminal LGA_CAV, 13” Tape and Reel 6-Terminal LGA_CAV, 7” Tape and Reel Evaluation Board Evaluation Board Z = RoHS Compliant Part. The CE-6-1 package option is halide free. Rev. E | Page 11 of 12 Package Option 2 CE-6-1 CE-6-1 Ordering Quantity 4,500 1,000 ADMP401 Data Sheet NOTES ©2010–2012 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. 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