Ultralow Noise Microphone with Bottom Port and Analog Output ADMP504 Data Sheet FUNCTIONAL BLOCK DIAGRAM B SO OUTPUT POWER VDD GND Figure 1. 10140-011 Smartphones and feature phones Tablet computers Teleconferencing systems Digital still and video cameras Bluetooth headsets Notebook PCs Security and surveillance ADMP504 LE APPLICATIONS OUTPUT AMPLIFIER TE Tiny, 3.35 mm × 2.50 mm × 0.88 mm surface-mount package Omnidirectional response Very high SNR of 65 dBA Sensitivity of −38 dBV Extended frequency response from 100 Hz to 20 kHz Low current consumption: 180 µA Single-ended analog output 120 dB maximum SPL High PSR of 70 dBV Compatible with Sn/Pb and Pb-free solder processes RoHS/WEEE compliant 10140-001 FEATURES Figure 2. Isometric Views of ADMP504 Microphone Package GENERAL DESCRIPTION The ADMP5041 is a high performance, very low noise, low power, analog output, bottom-ported omnidirectional MEMS microphone. The ADMP504 consists of a MEMS microphone element, an impedance converter and an output amplifier. The ADMP504 sensitivity specification makes it an excellent choice for both near field and far field applications. The ADMP504 is function- and pin-compatible with the ADMP404 microphone, providing an easy upgrade path. The ADMP504 is available in an ultraminiature 3.35 mm × 2.5 mm × 0.88 mm surface-mount package. It is reflow solder compatible with no sensitivity degradation. The ADMP504 is halide free. O The ADMP504 has very high SNR and extended wideband frequency response, resulting in natural sound with high intelligibility. Low current consumption enables long battery life for portable applications. The ADMP504 complies with the TIA-920 Telecommunications Telephone Terminal Equipment Transmission Requirements for Wideband Digital Wireline Telephones standard. 1 Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; 7,961,897. Other patents are pending. Rev. A Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2011–2012 Analog Devices, Inc. All rights reserved. ADMP504 Data Sheet TABLE OF CONTENTS Supporting Documents ................................................................7 Applications ....................................................................................... 1 Handling Instructions .......................................................................8 Functional Block Diagram .............................................................. 1 Pick-and-Place Equipment ..........................................................8 General Description ......................................................................... 1 Reflow Solder .................................................................................8 Revision History ............................................................................... 2 Board Wash ....................................................................................8 Specifications..................................................................................... 3 PCB Land Pattern Layout .................................................................9 Absolute Maximum Ratings ............................................................ 4 Reliability Specifications ................................................................ 10 ESD Caution .................................................................................. 4 Outline Dimensions ....................................................................... 11 Pin Configuration and Function Descriptions ............................. 5 Ordering Guide .......................................................................... 11 Typical Performance Characteristics ............................................. 6 Applications Information ................................................................ 7 REVISION HISTORY O B SO 10/11—Revision 0: Initial Version LE 6/12—Rev. 0 to Rev. A Changes to Figure 2 .......................................................................... 1 Changes to General Description Section ...................................... 1 Change to Power Supply Rejection Parameter, Table 1 ............... 3 Changes to Supporting Documents Section ................................. 7 Changes to Reflow Solder Section.................................................. 8 TE Features .............................................................................................. 1 Rev. A | Page 2 of 12 Data Sheet ADMP504 SPECIFICATIONS TA = 25°C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not guaranteed. Maximum Acoustic Input POWER SUPPLY Supply Voltage Supply Current VDD IS ZOUT 1 kHz, 94 dB SPL 20 Hz to 20 kHz, A-weighted 20 Hz to 20 kHz, A-weighted Derived from EIN and maximum acoustic input Low frequency −3 dB point High frequency −3 dB point 104 dB SPL 217 Hz, 100 mV p-p square wave superimposed on VDD = 1.8 V Peak, 10% THD −41 1.6 Typ Max Unit −35 −70 dBV dBA dBA SPL dB Hz kHz % dBV 120 dB SPL Omni −38 65 29 91 100 >20 VDD = 1.8 V VDD = 3.3 V 180 200 120 dB SPL input, peak 20 Hz to 20 kHz, A-weighted, rms 200 0.8 90 0.25 −103 See Figure 5 and Figure 7. O 1 THD PSR Min B SO OUTPUT CHARACTERISTICS Output Impedance Output DC Offset Output Current Limit Maximum Output Voltage Noise Floor SNR EIN Test Conditions/Comments TE Total Harmonic Distortion Power Supply Rejection Symbol LE Table 1. Parameter PERFORMANCE Directionality Sensitivity Signal-to-Noise Ratio Equivalent Input Noise Dynamic Range Frequency Response 1 Rev. A | Page 3 of 12 3 3.3 200 225 V µA µA Ω V µA V dBV ADMP504 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Supply Voltage Sound Pressure Level (SPL) Mechanical Shock Vibration Temperature Range Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rating −0.3 V to +3.6 V 160 dB 10,000 g Per MIL-STD-883 Method 2007, Test Condition B −40°C to +85°C tP TP TSMIN tL tS RAMP-DOWN B SO PREHEAT 10140-002 TSMAX CRITICAL ZONE TL TO TP LE TEMPERATURE RAMP-UP TL TE ESD CAUTION t25°C TO PEAK TIME Figure 3. Recommended Soldering Profile Limits Table 3. Recommended Soldering Profile Limits O Profile Feature Average Ramp Rate (TL to TP) Preheat Minimum Temperature (TSMIN) Maximum Temperature (TSMAX) Time (TSMIN to TSMAX), tS Ramp-Up Rate (TSMAX to TL) Time Maintained Above Liquidous (tL) Liquidous Temperature (TL) Peak Temperature (TP) Time Within 5°C of Actual Peak Temperature (tP) Ramp-Down Rate Time 25°C to Peak Temperature Rev. A | Page 4 of 12 Sn63/Pb37 1.25°C/sec maximum Pb-Free 1.25°C/sec maximum 100°C 150°C 60 sec to 75 sec 1.25°C/sec 45 sec to 75 sec 183°C 215°C + 3°C/−3°C 20 sec to 30 sec 3°C/sec maximum 5 minutes maximum 150°C 200°C 60 sec to 75 sec 1.25°C/sec ~50 sec 217°C 260°C + 0°C/−5°C 20 sec to 30 sec 3°C/sec maximum 5 minutes maximum Data Sheet ADMP504 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS GND 1 2 OUTPUT 3 TOP VIEW (TERMINAL SIDE DOWN) Not to Scale 10140-003 ADMP504 VDD TE Figure 4. Pin Configuration Table 4. Pin Function Descriptions Mnemonic OUTPUT GND VDD Description Analog Output Signal Ground Power Supply O B SO LE Pin No. 1 2 3 Rev. A | Page 5 of 12 ADMP504 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 10 10 8 5 6 SENSITIVITY (dB) SENSITIVITY (dB) 4 2 0 –2 –4 –6 0 –5 –10 –15 1k 10k –20 20 FREQUENCY (Hz) LE –20 –30 –40 –70 –80 100 1k FREQUENCY (Hz) 10k 10140-005 –60 B SO –50 10k Figure 7. Typical Frequency Response (Measured) 0 –10 1k FREQUENCY (Hz) Figure 5. Frequency Response Mask Figure 6. Typical Power Supply Rejection vs. Frequency O PSR (dB) 100 Rev. A | Page 6 of 12 10140-006 100 10140-004 –10 TE –8 Data Sheet ADMP504 APPLICATIONS INFORMATION GAIN = (R1 + R2)/R1 R1 R2 The ADMP504 output can be connected to a dedicated codec microphone input (see Figure 8) or to a high input impedance gain stage (see Figure 9). A 0.1 μF ceramic capacitor placed close to the ADMP504 supply pin is used for testing and is recommended to adequately decouple the microphone from noise on the power supply. A dc-blocking capacitor is required at the output of the microphone. This capacitor creates a high-pass filter with a corner frequency at VREF 0.1µF VDD ADMP504 VOUT 10kΩ VREF 10140-008 OUTPUT GND fC = 1/(2π × C × R) Figure 9. ADMP504 Connected to the ADA4897-1 Op Amp where R is the codec’s input impedance. SUPPORTING DOCUMENTS 2.2µF MINIMUM OUTPUT GND ADAU1761 OR ADAU1361 LINN LINP AN-1003, Recommendations for Mounting and Connecting Analog Devices, Inc., Bottom-Ported MEMS Microphones AN-1068, Reflow Soldering of the MEMS Microphone AN-1112, Microphone Specifications Explained B SO CM LE VDD CN-0207, High Performance Analog MEMS Microphone’s Simple Interface to SigmaDSP Audio Codec Application Notes 10140-007 MICBIAS UG-325, EVAL-ADMP504Z-FLEX: Bottom-Ported Analog Output MEMS Microphone Evaluation Board Circuit Note Figure 9 shows the ADMP504 connected to an ADA4897-1 op amp configured as a noninverting preamplifier. 0.1µF Evaluation Board User Guide TE A minimum value of 2.2 μF is recommended in Figure 8 because the input impedance of the ADAU1361/ADAU1761 can be as low as 2 kΩ at its highest PGA gain setting, which would result in a high-pass filter corner frequency at about 37 Hz. ADMP504 ADA4897-1 1µF MINIMUM AN-1124, Recommendations for Sealing Analog Devices, Inc., Bottom-Port MEMS Microphones from Dust and Liquid Ingress AN-1140, Microphone Array Beamforming O Figure 8. ADMP504 Connected to the Analog Devices ADAU1761 or ADAU1361 Codec Rev. A | Page 7 of 12 ADMP504 Data Sheet HANDLING INSTRUCTIONS PICK-AND-PLACE EQUIPMENT REFLOW SOLDER The MEMS microphone can be handled using standard pickand-place and chip shooting equipment. Take care to avoid damage to the MEMS microphone structure as follows: For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 3 and Table 3. TE • When washing the PCB, ensure that water does not make contact with the microphone port. Blow-off procedures and ultrasonic cleaning must not be used. LE • BOARD WASH B SO • Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. Use care during pick-and-place to ensure that no high shock events above 10 kg are experienced because this may cause damage to the microphone. Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. Do not pull air out or blow air into the microphone port. Do not use excessive force to place the microphone on the PCB. O • Rev. A | Page 8 of 12 Data Sheet ADMP504 PCB LAND PATTERN LAYOUT paste stencil pattern layout is shown in Figure 11. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port of the microphone. A minimum diameter of 0.5 mm is recommended. The recommended PCB land pattern for the ADMP504 should be laid out to a 1:1 ratio to the solder pads on the microphone package, as shown in Figure 10. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder 1.52 0.68 1.22 TE 0.61 Ø1.55 1.90 Ø0.95 LE 10140-009 0.61 0.90 Figure 10. PCB Land Pattern Layout 1.55/1.05 DIA. 0.225 CUT WIDTH (2×) 2× B SO 0.8 × 0.6 0.2 × 45° TYP 1.52mm O Figure 11. Suggested Solder Paste Stencil Pattern Layout Rev. A | Page 9 of 12 10140-010 1.22 ADMP504 Data Sheet RELIABILITY SPECIFICATIONS The microphone sensitivity after stress must deviate by no more than 3 dB from the initial value. Table 5. TE Description −40°C, 1000 hrs, powered +125°C, 1000 hrs, powered +85°C/+85% relative humidity (RH), 1000 hrs, powered −40°C/+125°C, one cycle per hour, 1000 cycles +150°C, 1000 hrs −40°C, 1000 hrs All pins, 0.5 kV All pins, 1.5 kV All pins, 0.2 kV O B SO LE Stress Test Low Temperature Operating Life High Temperature Operating Life Temperature Humidity Bias (THB) Temperature Cycle High Temperature Storage Low Temperature Storage Component CDM ESD Component HBM ESD Component MM ESD Rev. A | Page 10 of 12 Data Sheet ADMP504 OUTLINE DIMENSIONS 3.425 3.350 3.275 0.75 REF REFERENCE CORNER 3.06 REF PIN 1 1.08 1.52 0.30 BSC 0.30 BSC 0.25 NOM DIA. 0.20 MIN THRU HOLE 0.90 × 0.68 (PINS 1, 3) 1.56 DIA. 1 2.575 2.500 2.425 (SOUND PORT) 0.95 DIA. 0.54 REF 2 1.22 BSC 2.21 REF 1.25 3 0.65 REF SIDE VIEW 0.21 REF BOTTOM VIEW 06-16-2010-A 0.98 0.88 0.78 0.64 REF 0.20 TYP × 45° TE TOP VIEW ORDERING GUIDE 1 Package Description 3-Terminal LGA_CAV, 13” Tape and Reel 3-Terminal LGA_CAV, 7” Tape and Reel Flex Evaluation Board Z = RoHS Compliant Part. This package option is halide free. O 2 Temperature Range −40°C to +85°C −40°C to +85°C B SO Model 1 ADMP504ACEZ-RL ADMP504ACEZ-RL7 EVAL-ADMP504Z-FLEX LE Figure 12. 3-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] 3.35 mm × 2.50 mm Body (CE-3-2) Dimensions shown in millimeters Rev. A | Page 11 of 12 Package Option 2 CE-3-2 CE-3-2 Ordering Quantity 10,000 1,000 ADMP504 Data Sheet O B SO LE TE NOTES ©2011–2012 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10140-0-6/12(A) Rev. A | Page 12 of 12