FAIRCHILD 74LVT245MSA

Revised March 2005
74LVT245 • 74LVTH245
Low Voltage Octal Bidirectional Transceiver
with 3-STATE Inputs/Outputs
General Description
Features
The LVT245 and LVTH245 contain eight non-inverting bidirectional buffers with 3-STATE outputs and are intended for
bus-oriented applications. The Transmit/Receive (T/R)
input determines the direction of data flow through the bidirectional transceiver. Transmit (active-HIGH) enables data
from A ports to B ports; Receive (active-LOW) enables
data from B ports to A ports. The Output Enable input,
when HIGH, disables both A and B ports by placing them in
a HIGH Z condition.
■ Input and output interface capability to systems at
5V VCC
The LVTH245 data inputs include bushold, eliminating the
need for external pull-up resistors to hold unused inputs.
These transceivers are designed for low-voltage (3.3V)
VCC applications, but with the capability to provide a TTL
interface to a 5V environment. The LVT245 and LVTH245
are fabricated with an advanced BiCMOS technology to
achieve high speed operation similar to 5V ABT while
maintaining a low power dissipation.
■ Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH245),
also available without bushold feature (74LVT245)
■ Live insertion/extraction permitted
■ Power Up/Down high impedance provides glitch-free
bus loading
■ Outputs source/sink, 32 mA/64 mA
■ Latch-up performance exceeds 500 mA
■ ESD performance:
Human-body model ! 2000V
Machine model ! 200V
Charged-device model ! 1000V
Ordering Code:
Order Number
Package
Package Description
Number
74LVT245WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LVT245SJ
M20D
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVT245MSA
MSA20
74LVT245MTC
MTC20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LVT245MTCX_NL
(Note 1)
MTC20
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
74LVTH245WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LVTH245SJ
M20D
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVTH245MSA
MSA20
74LVTH245MTC
MTC20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LVTH245MTCX_NL
(Note 1)
MTC20
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
© 2005 Fairchild Semiconductor Corporation
DS500203
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74LVT245 • 74LVTH245 Low Voltage Octal Bidirectional Transceiver with 3-STATE Inputs/Outputs
November 1999
74LVT245 • 74LVTH245
Pin Descriptions
Logic Symbols
Pin Names
IEEE/IEC
Description
OE
Output Enable Input
T/R
Transmit/Receive Input
A0–A7
Side A Inputs or 3-STATE Outputs
B0–B7
Side B Inputs or 3-STATE Outputs
Truth Table
Inputs
Outputs
OE
L
L
Bus B Data to Bus A
L
H
Bus A Data to Bus B
H
X
HIGH-Z State
H HIGH Voltage Level
L LOW Voltage Level
X Immaterial
Connection Diagram
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2
T/R
Symbol
Parameter
VCC
Supply Voltage
VI
DC Input Voltage
VO
Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Current
Value
Conditions
0.5 to 4.6
0.5 to 7.0
0.5 to 7.0
0.5 to 7.0
50
50
ICC
DC Supply Current per Supply Pin
IGND
DC Ground Current per Ground Pin
TSTG
Storage Temperature
Units
V
V
Output in 3-STATE
V
Output in HIGH or LOW State (Note 3)
VI GND
V
mA
VO GND
mA
64
VO ! VCC
Output at HIGH State
128
VO ! VCC
Output at LOW State
mA
r64
r128
65 to 150
mA
mA
qC
Recommended Operating Conditions
Symbol
Parameter
Min
Max
2.7
3.6
V
0
5.5
V
High-Level Output Current
32
mA
Low-Level Output Current
64
mA
VCC
Supply Voltage
VI
Input Voltage
IOH
IOL
TA
Free Air Operating Temperature
't/'V
Input Edge Rate, VIN
0.8V–2.0V, VCC
3.0V
Units
40
85
qC
0
10
ns/V
Note 2: Absolute Maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions
beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum rated conditions is not implied.
Note 3: IO Absolute Maximum Rating must be observed.
DC Electrical Characteristics
Symbol
VCC
Parameter
VIK
Input Clamp Diode Voltage
TA
(V)
40qC to 85qC
Min
Max
1.2
2.7
V
Conditions
II
18 mA
VO d 0.1V or
VIH
Input HIGH Voltage
2.7–3.6
VIL
Input LOW Voltage
2.7–3.6
VOH
Output HIGH Voltage
2.7–3.6
VCC - 0.2
V
IOH
100 PA
2.7
2.4
V
IOH
8 mA
3.0
2.0
V
IOH
32 mA
VOL
II(HOLD)
Output LOW Voltage
2.0
Units
0.8
0.2
V
IOL
100 PA
2.7
0.5
V
IOL
24 mA
3.0
0.4
V
IOL
16 mA
3.0
0.5
V
IOL
32 mA
3.0
0.55
V
IOL
75
PA
VI
0.8V
75
PA
VI
2.0V
500
PA
(Note 5)
PA
(Note 6)
3.0
II(OD)
Bushold Input Over-Drive
3.0
(Note 4)
Current to Change State
II
Input Current
(Note 4)
Power Off Leakage Current
IPU/PD
Power Up/Down
VO t VCC 0.1V
2.7
Bushold Input Minimum Drive
IOFF
V
500
64 mA
3.6
10
PA
VI
5.5V
Control Pins
3.6
r1
PA
VI
0V or VCC
Data Pins
3.6
5
PA
VI
0V
1
PA
VI
VCC
0
r100
PA
0V d VI or VO d 5.5V
0–1.5V
r100
PA
3-STATE Current
VO
VI
0.5V to VCC
GND to VCC
3-STATE Output Leakage Current
3.6
5
PA
VO
0.5V
IOZL (Note 4) 3-STATE Output Leakage Current
3.6
5
PA
VO
0.0V
3-STATE Output Leakage Current
3.6
5
PA
VO
3.0V
IOZL
IOZH
3
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74LVT245 • 74LVTH245
Absolute Maximum Ratings(Note 2)
74LVT245 • 74LVTH245
DC Electrical Characteristics
Symbol
(Continued)
VCC
Parameter
TA
(V)
40qC to 85qC
Min
Units
Conditions
Max
IOZH (Note 4) 3-STATE Output Leakage Current
3.6
5
PA
VO
IOZH
3-STATE Output Leakage Current
3.6
10
PA
VCC VO d 5.5V
ICCH
Power Supply Current
3.6
0.19
mA
Outputs HIGH
ICCL
Power Supply Current
3.6
5
mA
Outputs LOW
ICCZ
Power Supply Current
3.6
0.19
mA
ICCZ
Power Supply Current
'ICC
Increase in Power Supply Current
(Note 7)
3.6
0.19
mA
3.6
0.2
mA
3.6V
Outputs Disabled
VCC d VO d 5.5V,
Outputs Disabled
One Input at VCC 0.6V
Other Inputs at VCC or GND
Note 4: Applies to Bushold versions only (LVTH245).
Note 5: An external driver must source at least the specified current to switch from LOW-to-HIGH.
Note 6: An external driver must sink at least the specified current to switch from HIGH-to-LOW.
Note 7: This is the increase in supply current for each input that is at the specified voltage level rather than VCC or GND.
Dynamic Switching Characteristics
Symbol
(Note 8)
(V)
25qC
TA
VCC
Parameter
Min
Conditions
Units
Typ
CL
Max
50 pF, RL
VOLP
Quiet Output Maximum Dynamic VOL
3.3
0.8
V
(Note 9)
VOLV
Quiet Output Minimum Dynamic VOL
3.3
0.8
V
(Note 9)
500:
Note 8: Characterized in SOIC package. Guaranteed parameter, but not tested.
Note 9: Max number of outputs defined as (n). n1 data inputs are driven 0V to 3V. Output under test held LOW.
AC Electrical Characteristics
40qC to 85qC
TA
Symbol
tPLH
CL
Parameter
Propagation Delay
tPHL
tPZH
Output Enable Time
tPZL
tPHZ
Output Disable
tPLZ
tOSHL
Output to Output Skew
tOSLH
(Note 10)
50 pF, RL
500:
Units
VCC
3.3V r 0.3V
Min
Max
Min
1.2
3.6
1.2
4.0
1.2
3.5
1.2
4.0
1.3
5.5
1.3
7.1
1.7
5.7
1.7
6.7
VCC
2.7V
Max
2.0
5.9
2.0
6.5
2.0
5.0
2.0
5.1
1.0
ns
ns
ns
1.0
ns
Note 10: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH).
Capacitance
Symbol
(Note 11)
Parameter
Conditions
CIN
Input Capacitance
VCC
0V, VI
CI/O
Input/Output Capacitance
VCC
3.0V, VO
Note 11: Capacitance is measured at frequency f
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0V or VCC
0V or VCC
1 MHz, per MIL-STD-883, Method 3012.
4
Typical
Units
4
pF
8
pF
74LVT245 • 74LVTH245
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Package Number M20B
5
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74LVT245 • 74LVTH245
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
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6
74LVT245 • 74LVTH245
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
Package Number MSA20
7
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74LVT245 • 74LVTH245 Low Voltage Octal Bidirectional Transceiver with 3-STATE Inputs/Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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