MAXIM MAX11626EEE+

19-5323; Rev 3; 10/11
KIT
ATION
EVALU
E
L
B
A
IL
AVA
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
Features
The MAX11626–MAX11629/MAX11632/MAX11633 are
serial 12-bit analog-to-digital converters (ADCs) with an
internal reference. These devices feature on-chip FIFO,
scan mode, internal clock mode, internal averaging,
and AutoShutdown™. The maximum sampling rate is
300ksps using an external clock. The MAX11632/
MAX11633 have 16 input channels; the MAX11628/
MAX11629 have 8 input channels; and the MAX11626/
MAX11627 have 4 input channels. These six devices
operate from either a +3V supply or a +5V supply, and
contain a 10MHz SPI™-/QSPI™-/MICROWIRE™-compatible serial port.
The MAX11626–MAX11629 are available in 16-pin
QSOP packages. The MAX11632/MAX11633 are available in 24-pin QSOP packages. All six devices are
specified over the extended -40°C to +85°C temperature range.
o Analog Multiplexer with Track/Hold
16 Channels (MAX11632/MAX11633)
8 Channels (MAX11628/MAX11629)
4 Channels (MAX11626/MAX11627)
o Single Supply
2.7V to 3.6V (MAX11627/MAX11629/MAX11633)
4.75V to 5.25V
(MAX11626/MAX11628/MAX11632)
o Internal Reference
2.5V (MAX11627/MAX11629/MAX11633)
4.096V (MAX11626/MAX11628/MAX11632)
o External Reference: 1V to VDD
o 16-Entry First-In/First-Out (FIFO)
o Scan Mode, Internal Averaging, and Internal Clock
o Accuracy: ±1 LSB INL, ±1 LSB DNL, No Missing
Codes Over Temperature
o 10MHz 3-Wire SPI-/QSPI-/MICROWIRE-Compatible
Interface
o Small Packages
16-Pin QSOP (MAX11626–MAX11629)
24-Pin QSOP (MAX11632/MAX11633)
________________________Applications
System Supervision
Data-Acquisition Systems
Industrial Control Systems
Patient Monitoring
Ordering Information
Data Logging
Instrumentation
PART
AutoShutdown is a trademark of Maxim Integrated Products, Inc.
SPI/QSPI are trademarks of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor Corp.
Pin Configurations
TOP VIEW
AIN0 1
+
16 EOC
AIN1 2
15 DOUT
AIN2 3
14 DIN
AIN3 4
AIN4 (N.C.) 5
MAX11626–
MAX11629
13 SCLK
SUPPLY
VOLTAGE
RANGE (V)
PIN
PACKAGE
MAX11626EEE+
4
4.75 to 5.25
16 QSOP
MAX11627EEE+
4
2.7 to 3.6
16 QSOP
MAX11628EEE+
8
4.75 to 5.25
16 QSOP
MAX11628EEE/V+
8
4.75 to 5.25
16 QSOP
MAX11629EEE+
8
2.7 to 3.6
16 QSOP
MAX11632EEG+
16
4.75 to 5.25
24 QSOP
MAX11633EEG+
16
2.7 to 3.6
24 QSOP
Note: All devices are specified over the -40°C to +85°C operating
temperature range.
+Denotes a lead(Pb)-free/RoHS-compliant package.
/V denotes an automotive qualified part.
12 CS
AIN5 (N.C.) 6
11 VDD
AIN6 (N.C.) 7
10 GND
AIN7/(CNVST) 8
NUMBER
OF
INPUTS
9
REF
QSOP
() MAX11626/MAX11627 ONLY
Pin Configurations continued at end of data sheet.
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
MAX11626–MAX11629/MAX11632/MAX11633
General Description
MAX11626–MAX11629/MAX11632/MAX11633
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
ABSOLUTE MAXIMUM RATINGS
VDD to GND ..............................................................-0.3V to +6V
CS, SCLK, DIN, EOC, DOUT to GND.........-0.3V to (VDD + 0.3V)
AIN0–AIN13, AIN_, CNVST/AIN_,
REF to GND ...........................................-0.3V to (VDD + 0.3V)
Maximum Current into Any Pin............................................50mA
Continuous Power Dissipation (TA = +70°C)
16-Pin QSOP (derate 8.3mW/°C above +70°C)...........667mW
24-Pin QSOP (derate 9.5mW/°C above +70°C)...........762mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-60°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VDD = +2.7V to +3.6V (MAX11627/MAX11629/MAX11633); VDD = +4.75V to +5.25V (MAX11626/MAX11628/MAX11632), fSAMPLE =
300kHz, fSCLK = 4.8MHz (50% duty cycle), VREF = 2.5V (MAX11627//MAX11629/MAX11633); VREF = 4.096V (MAX11626/MAX11628/
MAX11632), TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
±1.0
LSB
±1.0
LSB
±0.5
±4.0
LSB
±0.5
±4.0
LSB
DC ACCURACY (Note 1)
Resolution
RES
Integral Nonlinearity
INL
Differential Nonlinearity
DNL
12
No missing codes over temperature
Offset Error
Gain Error
Bits
(Note 2)
±2
ppm/°C
FSR
Gain Temperature Coefficient
±0.8
ppm/°C
Channel-to-Channel Offset
Matching
±0.1
LSB
Offset Error Temperature
Coefficient
DYNAMIC SPECIFICATIONS (30kHz sine-wave input, 2.5VP-P, 300ksps, fSCLK = 4.8MHz)
Signal-to-Noise Plus Distortion
Total Harmonic Distortion
SINAD
THD
MAX11627/MAX11629/MAX11633
71
MAX11626/MAX11628/MAX11632
73
Up to the 5th
harmonic
MAX11627/MAX11629/
MAX11633
-80
MAX11626/MAX11628/
MAX11632
-88
dB
dBc
MAX11627/MAX11629/MAX11633
81
MAX11626/MAX11628/MAX11632
89
76
dBc
Full-Power Bandwidth
fIN1 = 29.9kHz, fIN2 = 30.2kHz
-3dB point
1
MHz
Full-Linear Bandwidth
S/(N + D) > 68dB
100
kHz
Spurious-Free Dynamic Range
Intermodulation Distortion
2
SFDR
IMD
_______________________________________________________________________________________
dBc
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
(VDD = +2.7V to +3.6V (MAX11627/MAX11629/MAX11633); VDD = +4.75V to +5.25V (MAX11626/MAX11628/MAX11632), fSAMPLE =
300kHz, fSCLK = 4.8MHz (50% duty cycle), VREF = 2.5V (MAX11627//MAX11629/MAX11633); VREF = 4.096V (MAX11626/MAX11628/
MAX11632), TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
CONVERSION RATE
Power-Up Time
t PU
Acquisition Time
External reference
0.8
Internal reference (Note 3)
65
Internally clocked
3.5
µs
tACQ
Conversion Time
tCONV
External Clock Frequency
f SCLK
0.6
Externally clocked (Note 4)
2.7
Externally clocked conversion
0.1
µs
µs
4.8
Data I/O
10
MHz
Aperture Delay
30
ns
Aperture Jitter
< 50
ps
ANALOG INPUT
Input Voltage Range
Unipolar
Input Leakage Current
VIN = VDD
Input Capacitance
During acquisition time (Note 5)
0
±0.01
VREF
V
±1
µA
24
pF
INTERNAL REFERENCE
REF Output Voltage
REF Temperature Coefficient
TCREF
MAX11626/MAX11628/MAX11632
4.024
4.096
4.168
MAX11627/MAX11629/MAX11633
2.48
2.50
2.52
MAX11626/MAX11628/MAX11632
±20
MAX11627/MAX11629/MAX11633
±30
Output Resistance
REF Output Noise
REF Power-Supply Rejection
PSRR
V
ppm/°C
6.5
k
200
µVRMS
-70
dB
EXTERNAL REFERENCE INPUT
REF Input Voltage Range
REF Input Current
VREF
IREF
1.0
VDD + 50mV
VREF = 2.5V (MAX11627/MAX11629/
MAX11633); VREF = 4.096V
(MAX11626/MAX11628/MAX11632),
f SAMPLE = 300ksps
40
VREF = 2.5V (MAX11627/MAX11629/
MAX11633); VREF = 4.096V
(MAX11626/MAX11628/MAX11632),
f SAMPLE = 0
±0.1
V
100
µA
±5
_______________________________________________________________________________________
3
MAX11626–MAX11629/MAX11632/MAX11633
ELECTRICAL CHARACTERISTICS (continued)
MAX11626–MAX11629/MAX11632/MAX11633
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
ELECTRICAL CHARACTERISTICS (continued)
(VDD = +2.7V to +3.6V (MAX11627/MAX11629/MAX11633); VDD = +4.75V to +5.25V (MAX11626/MAX11628/MAX11632), fSAMPLE =
300kHz, fSCLK = 4.8MHz (50% duty cycle), VREF = 2.5V (MAX11627//MAX11629/MAX11633); VREF = 4.096V (MAX11626/MAX11628/
MAX11632), TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DIGITAL INPUTS (SCLK, DIN, CS, CNVST)
Input Voltage Low
VIL
Input Voltage High
VIH
Input Hysteresis
MAX11626/MAX11628/MAX11632
0.8
MAX11627/MAX11629/MAX11633
VDD x 0.3
MAX11626/MAX11628/MAX11632
2.0
MAX11627/MAX11629/MAX11633
VDD x 0.7
VHYST
Input Leakage Current
I IN
Input Capacitance
CIN
V
200
VIN = 0V or VDD
V
±0.01
mV
±1.0
15
µA
pF
DIGITAL OUTPUTS (DOUT, EOC)
Output Voltage Low
VOL
Output Voltage High
VOH
Three-State Leakage Current
Three-State Output Capacitance
I SINK = 2mA
0.4
I SINK = 4mA
0.8
I SOURCE = 1.5mA
VDD - 0.5
V
V
IL
CS = VDD
±0.05
C OUT
CS = VDD
15
±1
µA
pF
POWER REQUIREMENTS
Supply Voltage
MAX11627/MAX11629/MAX11633
Supply Current (Note 6)
MAX11626/MAX11628/MAX11632
Supply Current (Note 6)
VDD
MAX11626/MAX11628/MAX11632
4.75
5.25
MAX11627/MAX11629/MAX11633
2.7
3.6
Internal
reference
IDD
External
reference
Internal
reference
IDD
PSR
1750
2000
f SAMPLE = 0, REF on
1000
1200
Shutdown
f SAMPLE = 300ksps
Shutdown
0.2
5
1050
1200
0.2
5
f SAMPLE = 300ksps
2300
2550
f SAMPLE = 0, REF on
1050
1350
Shutdown
External
reference
Power-Supply Rejection
f SAMPLE = 300ksps
f SAMPLE = 300ksps
Shutdown
0.2
5
1550
1700
0.2
5
VDD = 2.7V to 3.6V; full-scale input
±0.2
±1
VDD = 4.75V to 5.25V; full-scale input
±0.2
±1.2
MAX11627/MAX11629/MAX11633 tested at VDD = +3V. MAX11626/MAX11628/MAX11632 tested at VDD = +5V.
Offset nulled.
Time for reference to power up and settle to within 1 LSB.
Conversion time is defined as the number of clock cycles multiplied by the clock period; clock has 50% duty cycle.
See Figure 3 (Equivalent Input Circuit) and the Sampling Error vs. Source Impedance curve in the Typical Operating
Characteristics section.
Note 6: Supply current is specified depending on whether an internal or external reference is used for voltage conversions.
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
4
_______________________________________________________________________________________
V
µA
µA
mV
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
(VDD = +2.7V to +3.6V (MAX11627/MAX11629/MAX11633); VDD = +4.75V to +5.25V (MAX11626/MAX11628/MAX11632), fSAMPLE =
300kHz, f SCLK = 4.8MHz (50% duty cycle), V REF = 2.5V (MAX11627//MAX11629/MAX11633); V REF = 4.096V (MAX11626/
MAX11628/MAX11632), TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
SCLK Clock Period
tCP
SCLK Pulse Width High
tCH
SCLK Pulse Width Low
CONDITIONS
MIN
Externally clocked conversion
208
Data I/O
100
TYP
MAX
UNITS
ns
40
tCL
ns
40
ns
SCLK Fall to DOUT Transition
tDOT
CLOAD = 30pF
40
ns
CS Rise to DOUT Disable
tDOD
CLOAD = 30pF
40
ns
CS Fall to DOUT Enable
tDOE
CLOAD = 30pF
40
ns
DIN to SCLK Rise Setup
tDS
40
ns
SCLK Rise to DIN Hold
tDH
0
ns
CS Low to SCLK Setup
tCSS0
40
ns
CS High to SCLK Setup
tCSS1
40
ns
CS High After SCLK Hold
tCSH1
0
ns
CS Low After SCLK Hold
tCSH0
0
tCSPW
CNVST Pulse Width Low
CS or CNVST Rise to EOC
Low (Note 7)
4
µs
CKSEL = 00
40
ns
CKSEL = 01
1.4
µs
Voltage conversion
7
Reference power-up
65
µs
Note 7: This time is defined as the number of clock cycles needed for conversion multiplied by the clock period. If the internal reference needs to be powered up, the total time is additive.
Typical Operating Characteristics
(VDD = +3V, VREF = +2.5V, fSCLK = 4.8MHz, CLOAD = 30pF, TA = +25°C, unless otherwise noted.)
0.6
0.8
0.6
0.8
0.6
0.2
0.2
0
0
-0.2
-0.4
-0.4
-0.6
-0.6
MAX11626/MAX11628/MAX11632
fSAMPLE = 300ksps
-0.8
DNL (LSB)
0.4
0.2
INL (LSB)
0.4
0.4
-0.2
0
1024
2048
3072
OUTPUT CODE (DECIMAL)
4096
0
-0.2
-0.4
MAX11627/MAX11629/MAX11633
fSAMPLE = 300ksps
-0.8
-0.6
MAX11626/MAX11628/MAX11632
fSAMPLE = 300ksps
-0.8
-1.0
-1.0
-1.0
MAX11626 toc03
0.8
1.0
MAX11626 toc02
1.0
MAX11626 toc01
1.0
INL (LSB)
DIFFERENTIAL NONLINEARITY
vs. OUTPUT CODE
INTEGRAL NONLINEARITY
vs. OUTPUT CODE
INTEGRAL NONLINEARITY
vs. OUTPUT CODE
0
1024
2048
3072
OUTPUT CODE (DECIMAL)
4096
0
1024
2048
3072
4096
OUTPUT CODE (DECIMAL)
_______________________________________________________________________________________
5
MAX11626–MAX11629/MAX11632/MAX11633
TIMING CHARACTERISTICS (Figure 1)
Typical Operating Characteristics (continued)
(VDD = +3V, VREF = +2.5V, fSCLK = 4.8MHz, CLOAD = 30pF, TA = +25°C, unless otherwise noted.)
SINAD vs. FREQUENCY
MAX11626/MAX11628/MAX11632
75
SINAD (dB)
0.4
0.2
0
-0.2
MAX11626/MAX11628/ MAX11632
90
70
SFDR (dB)
0.6
100
MAX11626 toc05
0.8
SFDR vs. FREQUENCY
80
MAX11626 toc04
1.0
MAX11627/MAX11629/MAX11633
65
80
MAX11627/MAX11629/MAX11633
70
60
-0.6
MAX11627/MAX11629/MAX11633
fSAMPLE = 300ksps
-0.8
60
55
50
-1.0
0
1024
2048
3072
1
4096
10
1
10
FREQUENCY (kHz)
OUTPUT CODE (DECIMAL)
100
FREQUENCY (kHz)
SUPPLY CURRENT vs. SAMPLING RATE
THD vs. FREQUENCY
3000
MAX11626 toc07
-50
-60
MAX11626/MAX11628/MAX11632
VDD = 5V
2500
MAX11627/MAX11629/MAX11633
2000
-70
IVDD (µA)
THD (dB)
50
1000
100
MAX11626 toc08
-0.4
INTERNAL REFERENCE
1500
-80
1000
EXTERNAL REFERENCE
-90
500
MAX11626/MAX11628/MAX11632
0
-100
10
100
1
1000
10
SUPPLY CURRENT vs. SUPPLY VOLTAGE
SUPPLY CURRENT vs. SAMPLING RATE
MAX11627/MAX11629/MAX11633
VDD = 3V
1600
1400
INTERNAL REFERENCE
2400
2200
INTERNAL REFERENCE
IDD (µA)
1200
IVDD (µA)
2600
MAX11626 toc09
1800
1000
100
SAMPLING RATE (ksps)
FREQUENCY (kHz)
MAX11626 toc10
1
1000
800
600
2000
1800
EXTERNAL REFERENCE
1600
EXTERNAL REFERENCE
1400
400
MAX11626/MAX11628/MAX11632
fSAMPLE = 300ksps
1200
200
1000
0
1
10
100
SAMPLING RATE (ksps)
6
MAX11626 toc06
DIFFERENTIAL NONLINEARITY
vs. OUTPUT CODE
DNL (LSB)
MAX11626–MAX11629/MAX11632/MAX11633
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
1000
4.75
4.85
4.95
5.05
5.15
VDD (V)
_______________________________________________________________________________________
5.25
1000
12-Bit 300ksps ADCs with FIFO,
Temp Sensor, Internal Reference
SHUTDOWN SUPPLY CURRENT
vs. SUPPLY VOLTAGE
SUPPLY CURRENT vs. SUPPLY VOLTAGE
INTERNAL REFERENCE
0.8
1600
MAX11626 toc12
1800
MAX11626 toc11
2000
0.7
0.6
1400
IDD (µA)
IDD (µA)
1200
EXTERNAL REFERENCE
1000
800
0.5
0.4
0.3
600
0.2
400
MAX11627/MAX11629/MAX11633
fSAMPLE = 300ksps
200
MAX11626/MAX11628/MAX11632
VDD = 5V
0.1
0
0
4.75
2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
4.85
4.95
SHUTDOWN SUPPLY CURRENT
vs. SUPPLY VOLTAGE
5.15
5.25
SUPPLY CURRENT vs. TEMPERATURE
0.4
INTERNAL REFERENCE
2200
IDD (µA)
0.3
MAX11626 toc14
2500
MAX11626 toc13
0.5
IDD (µA)
5.05
VDD (V)
VDD (V)
1900
1600
0.2
EXTERNAL REFERENCE
1300
0.1
MAX11626/MAX11628/MAX11632
VDD = 5V
fSAMPLE = 300ksps
MAX11627/MAX11629/MAX11633
VDD = 3V
1000
0
-40
2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
-15
10
35
60
TEMPERATURE (°C)
SUPPLY CURRENT vs. TEMPERATURE
SHUTDOWN SUPPLY CURRENT
vs. TEMPERATURE
2.5
MAX11626 toc15
1800
INTERNAL REFERENCE
1600
85
MAX11626 toc16
VDD (V)
MAX11626/MAX11628/MAX11632
VDD = 5V
2.0
MAX11627/MAX11629/MAX11633
VDD = 3V
fSAMPLE = 300ksps
1200
IDD (µA)
IDD (µA)
1400
1.5
1.0
1000
800
0.5
EXTERNAL REFERENCE
600
0
-40
-15
10
35
TEMPERATURE (°C)
60
85
-40
-15
10
35
60
85
TEMPERATURE (°C)
_______________________________________________________________________________________
7
MAX11626–MAX11629/MAX11632/MAX11633
Typical Operating Characteristics (continued)
(VDD = +3V, VREF = +2.5V, fSCLK = 4.8MHz, CLOAD = 30pF, TA = +25°C, unless otherwise noted.)
Typical Operating Characteristics (continued)
(VDD = +3V, VREF = +2.5V, fSCLK = 4.8MHz, CLOAD = 30pF, TA = +25°C, unless otherwise noted.)
SHUTDOWN SUPPLY CURRENT
vs. TEMPERATURE
4.096
0.2
4.095
2.501
VREF (V)
4.097
0.4
2.502
MAX11626 toc19
4.098
VREF (V)
2.500
2.499
2.498
MAX11627/MAX11629/MAX11633
VDD = 3V
MAX11626/MAX11628/MAX11632
VDD = 5V
4.094
35
60
85
2.497
4.75
4.85
4.95
5.05
5.15
TEMPERATURE (°C)
VDD (V)
INTERNAL REFERENCE VOLTAGE
vs. TEMPERATURE
INTERNAL REFERENCE VOLTAGE
vs. TEMPERATURE
4.11
2.51
VREF (V)
4.10
4.09
2.50
2.48
MAX11626/MAX11628/MAX11632
VDD = 5V
4.07
-15
10
35
60
85
0.4
-15
10
35
60
85
1.02
4.95
1.00
5.25
1.1
0.9
0.7
MAX11626/MAX11628/MAX11632
fSAMPLE = 300ksps
MAX11627/MAX11629/MAX11633
fSAMPLE = 300ksps
0.5
-1.0
3.6
5.15
1.3
OFFSET ERROR (LSB)
-0.2
-0.6
5.05
OFFSET ERROR vs. TEMPERATURE
0.2
MAX11627/MAX11629/MAX11633
fSAMPLE = 300ksps
VDD (V)
4.85
1.5
MAX11626 toc24
0.6
OFFSET ERROR (LSB)
1.03
3.3
4.75
VDD (V)
1.0
MAX11626 toc23
1.04
3.0
MAX11626/MAX11628/MAX11632
fSAMPLE = 300ksps
OFFSET ERROR vs. TEMPERATURE
1.05
2.7
-0.2
TEMPARATURE (°C)
1.06
1.01
0
-0.6
-40
OFFSET ERROR vs. SUPPLY VOLTAGE
1.07
0.2
-0.4
MAX11627/MAX11629/MAX11633
VDD = 3V
TEMPARATURE (°C)
1.08
3.6
3.3
0.6
2.47
-40
3.0
OFFSET ERROR vs. SUPPLY VOLTAGE
2.49
4.08
2.7
VDD (V)
2.52
MAX11626 toc20
4.12
5.25
MAX11626 toc22
10
MAX11626 toc25
-15
OFFSET ERROR (LSB)
-40
MAX11626 toc21
IDD (µA)
0.6
0
VREF (V)
4.099
MAX11626 toc18
MAX11627/MAX11629/MAX11633
VDD = 3V
0.8
8
INTERNAL REFERENCE VOLTAGE
vs. SUPPLY VOLTAGE
INTERNAL REFERENCE VOLTAGE
vs. SUPPLY VOLTAGE
MAX11626 toc17
1.0
OFFSET ERROR (LSB)
MAX11626–MAX11629/MAX11632/MAX11633
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
-40
-15
10
35
TEMPERATURE (°C)
60
85
-40
-15
10
35
TEMPERATURE (°C)
_______________________________________________________________________________________
60
85
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
GAIN ERROR vs. SUPPLY VOLTAGE
GAIN ERROR vs. SUPPLY VOLTAGE
MAX11626 toc27
0.6
-0.1
0.5
GAIN ERROR (LSB)
GAIN ERROR (LSB)
0
MAX11626 toc26
0.7
0.4
0.3
-0.2
-0.3
0.2
-0.4
MAX11626/MAX11628/MAX11632
fSAMPLE = 300ksps
0.1
0
MAX11627/MAX11629/MAX11633
-0.5
4.85
4.95
5.05
5.25
5.15
2.7
3.0
VDD (V)
GAIN ERROR vs. TEMPERATURE
0.3
-0.2
-0.6
0.1
-0.1
-0.3
MAX11626/MAX11628/MAX11632
fSAMPLE = 300ksps
-1.0
-15
10
35
TEMPERATURE (°C)
60
85
0
-2
-4
-6
-8
-10
-0.5
-40
2
SAMPLING ERROR (LSB)
0.2
MAX11627/MAX11629/MAX11633
fSAMPLE = 300ksps
MAX11626 toc29
0.5
GAIN ERROR (LSB)
GAIN ERROR (LSB)
0.6
SAMPLING ERROR
vs. SOURCE IMPEDANCE
GAIN ERROR vs. TEMPERATURE
MAX11626 toc28
1.0
3.6
3.3
VDD (V)
MAX11626 toc30
4.75
-40
-15
10
35
TEMPERATURE (°C)
60
85
0
2
4
6
8
10
SOURCE IMPEDANCE (kΩ)
_______________________________________________________________________________________
9
MAX11626–MAX11629/MAX11632/MAX11633
Typical Operating Characteristics (continued)
(VDD = +3V, VREF = +2.5V, fSCLK = 4.8MHz, CLOAD = 30pF, TA = +25°C, unless otherwise noted.)
MAX11626–MAX11629/MAX11632/MAX11633
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
Pin Description
MAX11626
MAX11627
(4 CHANNELS)
MAX11628
MAX11629
(8 CHANNELS)
5, 6, 7
—
—
N.C.
—
—
1–15
AIN0–AIN14
Analog Inputs
—
1–7
—
AIN0–AIN6
Analog Inputs
1–4
—
—
AIN0–AIN3
Analog Inputs
—
—
16
CNVST/AIN15
Active-Low Conversion Start Input/Analog Input 15.
See Table 3 for details on programming the setup
register.
—
8
—
CNVST/AIN7
Active-Low Conversion Start Input/Analog Input 7.
See Table 3 for details on programming the setup
register.
8
—
—
CNVST
Active-Low Conversion Start Input. See Table 3 for
details on programming the setup register.
9
9
17
REF
Reference Input. Bypass to GND with a 0.1µF
capacitor.
10
10
18
GND
Ground
11
11
19
VDD
Power Input. Bypass to GND with a 0.1µF
capacitor.
12
12
20
CS
Active-Low Chip-Select Input. When CS is low, the
serial interface is enabled. When CS is high, DOUT
is high impedance.
13
13
21
SCLK
Serial Clock Input. Clocks data in and out of the serial
interface. (Duty cycle must be 40% to 60%.) See
Table 3 for details on programming the clock mode.
14
14
22
DIN
Serial Data Input. DIN data is latched into the serial
interface on the rising edge of SCLK.
15
15
23
DOUT
Serial Data Output. Data is clocked out on the falling
edge of SCLK. High impedance when CS is
connected to VDD.
16
16
24
EOC
End of Conversion Output. Data is valid after EOC
pulls low.
10
MAX11632
MAX11633
(16 CHANNELS)
NAME
FUNCTION
No Connection. Not internally connected.
______________________________________________________________________________________
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
MAX11626–MAX11629/MAX11632/MAX11633
CS
tCP
tCH
tCSS0
tCSH1
tCL
tCSH0
tCSS1
SCLK
tDH
tDS
DIN
tDOT
tDOD
tDOE
DOUT
Figure 1. Detailed Serial-Interface Timing Diagram
CS
DIN
SCLK
SERIAL
INTERFACE
OSCILLATOR
CONTROL
DOUT
EOC
CNVST
AIN1
AIN2
T/H
AIN15
12-BIT
SAR
ADC
FIFO AND
ACCUMULATOR
INTERNAL
REFERENCE
REF
MAX11626–MAX11629/MAX11632/MAX11633
Figure 2. Functional Diagram
Detailed Description
The MAX11626–MAX11629/MAX11632/MAX11633 are
low-power, serial-output, multichannel ADCs with FIFO
capability for system monitoring, process-control, and
instrumentation applications. These 12-bit ADCs have
internal track and hold (T/H) circuitry supporting singleended inputs. Data is converted from analog voltage
sources in a variety of channel and data-acquisition configurations. Microprocessor (µP) control is made easy
through a 3-wire SPI-/QSPI-/MICROWIRE-compatible
serial interface.
Figure 2 shows a simplified functional diagram of the
MAX11626–MAX11629/MAX11632/MAX11633 internal
architecture. The MAX11632/MAX11633 have 16 single-ended analog input channels. The MAX11628/
MAX11629 have 8 single-ended analog input channels.
The MAX11626/MAX11627 have 4 single-ended analog
input channels.
______________________________________________________________________________________
11
MAX11626–MAX11629/MAX11632/MAX11633
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
Converter Operation
The MAX11626–MAX11629/MAX11632/MAX11633
ADCs use a successive-approximation register (SAR)
conversion technique and an on-chip T/H block to convert voltage signals into a 12-bit digital result. This single-ended configuration supports unipolar signal
ranges.
Input Bandwidth
The ADC’s input-tracking circuitry has a 1MHz smallsignal bandwidth, so it is possible to digitize high-speed
transient events and measure periodic signals with
bandwidths exceeding the ADC’s sampling rate by
using undersampling techniques. Anti-alias prefiltering
of the input signals is necessary to avoid high-frequency
signals aliasing into the frequency band of interest.
Analog Input Protection
Internal ESD protection diodes clamp all pins to VDD
and GND, allowing the inputs to swing from (GND 0.3V) to (VDD + 0.3V) without damage. However, for
accurate conversions near full scale, the inputs must
not exceed VDD by more than 50mV or be lower than
GND by 50mV. If an off-channel analog input voltage
exceeds the supplies, limit the input current to 2mA.
3-Wire Serial Interface
The MAX11626–MAX11629/MAX11632/MAX11633 feature a serial interface compatible with SPI/QSPI and
MICROWIRE devices. For SPI/QSPI, ensure the CPU
serial interface runs in master mode so it generates the
serial clock signal. Select the SCLK frequency of 10MHz
or less, and set clock polarity (CPOL) and phase
(CPHA) in the µP control registers to the same value.
The MAX11626–MAX11629/MAX11632/MAX11633 operate with SCLK idling high or low, and thus operate with
CPOL = CPHA = 0 or CPOL = CPHA = 1. Set CS low to
latch input data at DIN on the rising edge of SCLK.
Output data at DOUT is updated on the falling edge of
SCLK. Results are output in binary format.
Serial communication always begins with an 8-bit input
data byte (MSB first) loaded from DIN. A high-to-low
transition on CS initiates the data input operation. The
input data byte and the subsequent data bytes are
clocked from DIN into the serial interface on the rising
edge of SCLK. Tables 1–5 detail the register descriptions. Bits 5 and 4, CKSEL1 and CKSEL0, respectively,
control the clock modes in the setup register (see Table
3). Choose between four different clock modes for various ways to start a conversion and determine whether
the acquisitions are internally or externally timed. Select
clock mode 00 to configure CNVST/AIN_ to act as a
conversion start and use it to request the programmed,
internally timed conversions without tying up the serial
12
bus. In clock mode 01, use CNVST to request conversions one channel at a time, controlling the sampling
speed without tying up the serial bus. Request and
start internally timed conversions through the serial
interface by writing to the conversion register in the
default clock mode 10. Use clock mode 11 with SCLK
up to 4.8MHz for externally timed acquisitions to
achieve sampling rates up to 300ksps. Clock mode 11
disables scanning and averaging. See Figures 4–7 for
timing specifications and how to begin a conversion.
These devices feature an active-low, end-of-conversion
output. EOC goes low when the ADC completes the last
requested operation and is waiting for the next input
data byte (for clock modes 00 and 10). In clock mode
01, EOC goes low after the ADC completes each
requested operation. EOC goes high when CS or
CNVST goes low. EOC is always high in clock mode 11.
Single-Ended Inputs
The single-ended analog input conversion modes can
be configured by writing to the setup register (see
Table 3). Single-ended conversions are internally referenced to GND (see Figure 3).
AIN0–AIN3 are available on the MAX11626–MAX11629/
MAX11632/MAX11633. AIN4–AIN7 are only available on
the MAX11628–MAX11633. AIN8–AIN15 are only available on the MAX11632/MAX11633. See Tables 2–5 for
more details on configuring the inputs. For the inputs
that can be configured as CNVST or an analog input,
only one can be used at a time.
Unipolar
The MAX11626–MAX11629/MAX11632/MAX11633
always operate in unipolar mode. The analog inputs are
internally referenced to GND with a full-scale input
range from 0 to VREF.
REF
GND
DAC
AIN0-AIN15
CIN+
COMPARATOR
+
HOLD
CINGND
HOLD
VDD/2
Figure 3. Equivalent Input Circuit
______________________________________________________________________________________
HOLD
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
tACQ = 9 x (RS + RIN) x 24pF + tPWR
where RIN = 1.5kΩ, RS is the source impedance of the
input signal, and tPWR = 1µs, the power-up time of the
device. The varying power-up times are detailed in the
explanation of the clock mode conversions. tACQ is never
less than 1.4µs, and any source impedance below 300Ω
does not significantly affect the ADC’s AC performance.
A high-impedance source can be accommodated either
by lengthening t ACQ or by placing a 1µF capacitor
between the positive and negative analog inputs.
Internal FIFO
The MAX11626–MAX11629/MAX11632/MAX11633 contain a FIFO buffer that can hold up to 16 ADC results.
This allows the ADC to handle multiple internally clocked
conversions, without tying up the serial bus. If the FIFO is
filled and further conversions are requested without
reading from the FIFO, the oldest ADC results are overwritten by the new ADC results. Each result contains 2
bytes, with the MSB preceded by four leading zeros.
After each falling edge of CS, the oldest available byte of
data is available at DOUT, MSB first. When the FIFO is
empty, DOUT is zero.
Internal Clock
The MAX11626–MAX11629/MAX11632/MAX11633 operate from an internal oscillator, which is accurate within
10% of the 4.4MHz nominal clock rate. The internal
oscillator is active in clock modes 00, 01, and 10. Read
out the data at clock speeds up to 10MHz. See Figures
4–7 for details on timing specifications and starting a
conversion.
Applications Information
Register Descriptions
The MAX11626–MAX11629/MAX11632/MAX11633 communicate between the internal registers and the external circuitry through the SPI-/QSPI-compatible serial
interface. Table 1 details the registers and the bit
names. Tables 2–5 show the various functions within
the conversion register, setup register, averaging register, and reset register.
Conversion Time Calculations
The conversion time for each scan is based on a number of different factors: conversion time per sample,
samples per result, results per scan, and if the external
reference is in use.
Use the following formula to calculate the total conversion time for an internally timed conversion in clock
modes 00 and 10 (see the Electrical Characteristics
section as applicable):
Total Conversion Time = tCNV x nAVG x nRESULT + tRP
where
tCNV = tACQ (max) + tCONV (max).
nAVG = samples per result (amount of averaging).
nRESULT = number of FIFO results requested;
determined by the number of channels being
scanned or by NSCAN1, NSCAN0.
tRP = internal reference wake-up; set to zero if internal reference is already powered up or external reference is being used .
In clock mode 01, the total conversion time depends on
how long CNVST is held low or high, including any time
required to turn on the internal reference. Conversion
time in externally clocked mode (CKSEL1, CKSEL0 = 11)
depends on the SCLK period and how long CS is held
high between each set of eight SCLK cycles. In clock
mode 01, the total conversion time does not include the
time required to turn on the internal reference.
Table 1. Input Data Byte (MSB First)
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
Conversion
REGISTER NAME
1
CHSEL3
CHSEL2
CHSEL1
CHSEL0
SCAN1
SCAN0
X
Setup
0
1
CKSEL1
CKSEL0
REFSEL1
REFSEL0
X
X
Averaging
0
0
1
AVGON
NAVG1
NAVG0
NSCAN1
NSCAN0
Reset
0
0
0
1
RESET
X
X
X
X = Don’t care.
______________________________________________________________________________________
13
MAX11626–MAX11629/MAX11632/MAX11633
True Differential Analog Input T/H
The equivalent circuit of Figure 3 shows the
MAX11626–MAX11629/MAX11632/MAX11633’s input
architecture. In track mode, a positive input capacitor is
connected to AIN0–AIN15. A negative input capacitor is
connected to GND. For external T/H timing, use clock
mode 01. After the T/H enters hold mode, the difference
between the sampled positive and negative input voltages is converted. The time required for the T/H to
acquire an input signal is determined by how quickly its
input capacitance is charged. If the input signal’s
source impedance is high, the required acquisition time
lengthens. The acquisition time, tACQ, is the maximum
time needed for a signal to be acquired, plus the
power-up time. It is calculated by the following equation:
MAX11626–MAX11629/MAX11632/MAX11633
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
Conversion Register
Select active analog input channels per scan and scan
modes by writing to the conversion register. Table 2
details channel selection and the four scan modes.
Request a scan by writing to the conversion register
when in clock mode 10 or 11, or by applying a low
pulse to the CNVST pin when in clock mode 00 or 01.
A conversion is not performed if it is requested on a
channel that has been configured as CNVST. Do not
request conversions on channels 8–15 on the
MAX11626–MAX11629. Set CHSEL3:CHSEL0 to the
lower channel’s binary values.
Select scan mode 00 or 01 to return one result per single-ended channel within the requested range. Select
scan mode 10 to scan a single input channel numerous
times, depending on NSCAN1 and NSCAN0 in the
averaging register (Table 4). Select scan mode 11 to
return only one result from a single channel.
Table 2. Conversion Register*
BIT
NAME
—
7 (MSB) Set to 1 to select conversion register.
6
Analog input channel select.
CHSEL2
5
Analog input channel select.
CHSEL1
4
Analog input channel select.
CHSEL0
3
Analog input channel select.
SCAN1
2
Scan mode select.
1
Scan mode select.
SCAN0
—
0 (LSB) Don’t care.
*See below for bit details.
CHSEL3
CHSEL2
CHSEL1
CHSEL0
SELECTED
CHANNEL (N)
0
0
0
0
AIN0
0
0
0
1
AIN1
0
0
1
0
AIN2
0
0
1
1
AIN3
0
1
0
0
AIN4
0
1
0
1
AIN5
0
1
1
0
AIN6
0
1
1
1
AIN7
1
0
0
0
AIN8
1
0
0
1
AIN9
1
0
1
0
AIN10
1
0
1
1
AIN11
1
1
0
0
AIN12
1
1
0
1
AIN13
1
1
1
0
AIN14
1
1
1
1
AIN15
Averaging Register
Write to the averaging register to configure the ADC to
average up to 32 samples for each requested result,
and to independently control the number of results
requested for single-channel scans.
Table 2 details the four scan modes available in the
conversion register. All four scan modes allow averaging as long as the AVGON bit, bit 4 in the averaging
register, is set to 1. Select scan mode 10 to scan the
same channel multiple times. Clock mode 11 disables
averaging.
14
FUNCTION
CHSEL3
Setup Register
Write a byte to the setup register to configure the clock,
reference, and power-down modes. Table 3 details the
bits in the setup register. Bits 5 and 4 (CKSEL1 and
CKSEL0) control the clock mode, acquisition and sampling, and the conversion start. Bits 3 and 2 (REFSEL1
and REFSEL0) control internal or external reference use.
Reset Register
Write to the reset register (as shown in Table 5) to clear
the FIFO or to reset all registers to their default states.
Set the RESET bit to 1 to reset the FIFO. Set the reset
bit to zero to return the MAX11626–MAX11629/
MAX11632/MAX11633 to the default power-up state.
BIT
SCAN1 SCAN0
SCAN MODE (CHANNEL N IS
SELECTED BY BITS CHSEL3–CHSEL0)
0
0
Scans channels 0 through N.
0
1
Scans channels N through the highest
numbered channel.
1
0
Scans channel N repeatedly. The averaging
register sets the number of results.
1
1
No scan. Converts channel N once only.
______________________________________________________________________________________
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
BIT NAME
BIT
—
7 (MSB)
Set to 0 to select setup register.
—
6
Set to 1 to select setup register.
CKSEL1
5
Clock mode and CNVST configuration. Resets to 1 at power-up.
CKSEL0
4
Clock mode and CNVST configuration.
REFSEL1
3
Reference mode configuration.
MAX11626–MAX11629/MAX11632/MAX11633
Table 3. Setup Register*
FUNCTION
REFSEL0
2
Reference mode configuration.
—
1
Don’t care.
—
0 (LSB)
Don’t care.
*See below for bit details.
CKSEL1
CKSEL0
CONVERSION CLOCK
ACQUISITION/SAMPLING
CNVST CONFIGURATION
0
0
Internal
Internally timed
CNVST
0
1
Internal
Externally timed through CNVST
CNVST
1
0
Internal
Internally timed
AIN15/AIN11/AIN7*
1
1
External (4.8MHz max)
Externally timed through SCLK
AIN15/AIN11/AIN7*
*For the MAX11626/MAX11627, CNVST has its own dedicated pin.
REFSEL1
REFSEL0
VOLTAGE REFERENCE
AutoShutdown
0
0
Internal
Reference off after scan; need
wake-up delay.
0
1
External
Reference off; no wake-up delay.
1
0
Internal
Reference always on; no wake-up
delay.
1
1
Reserved
Reserved. Do not use.
______________________________________________________________________________________
15
MAX11626–MAX11629/MAX11632/MAX11633
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
Table 4. Averaging Register*
BIT NAME
BIT
—
7 (MSB)
Set to 0 to select averaging register.
FUNCTION
—
6
Set to 0 to select averaging register.
Set to 1 to select averaging register.
—
5
AVGON
4
Set to 1 to turn averaging on. Set to 0 to turn averaging off.
NAVG1
3
Configures the number of conversions for single-channel scans.
NAVG0
2
Configures the number of conversions for single-channel scans.
NSCAN1
1
Single-channel scan count. (Scan mode 10 only.)
NSCAN0
0 (LSB)
Single-channel scan count. (Scan mode 10 only.)
*See below for bit details.
AVGON
NAVG1
NAVG0
FUNCTION
0
x
x
Performs one conversion for each requested result.
1
0
0
Performs four conversions and returns the average for each requested result.
1
0
1
Performs eight conversions and returns the average for each requested result.
1
1
0
Performs 16 conversions and returns the average for each requested result.
1
1
1
Performs 32 conversions and returns the average for each requested result.
NSCAN1
NSCAN0
0
0
Scans channel N and returns four results.
0
1
Scans channel N and returns eight results.
1
0
Scans channel N and returns 12 results.
1
1
Scans channel N and returns 16 results.
FUNCTION (APPLIES ONLY IF SCAN MODE 10 IS SELECTED)
Table 5. Reset Register
BIT NAME
BIT
—
7 (MSB)
Set to 0 to select reset register.
—
6
Set to 0 to select reset register.
—
5
Set to 0 to select reset register.
—
4
Set to 1 to select reset register.
RESET
3
Set to 0 to reset all registers. Set to 1 to clear the FIFO only.
x
2
Reserved. Don’t care.
x
1
Reserved. Don’t care.
x
0 (LSB)
Reserved. Don’t care.
16
FUNCTION
______________________________________________________________________________________
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
Output Data Format
Figures 4–7 illustrate the conversion timing for the
MAX11626–MAX11629/MAX11632/MAX11633. The
12-bit conversion result is output in MSB-first format
with four leading zeros. DIN data is latched into the serial interface on the rising edge of SCLK. Data on DOUT
transitions on the falling edge of SCLK. Conversions in
clock modes 00 and 01 are initiated by CNVST.
Conversions in clock modes 10 and 11 are initiated by
writing an input data byte to the conversion register.
Data output is binary.
Internally Timed Acquisitions and
Conversions Using CNVST
Performing Conversions in Clock Mode 00
In clock mode 00, the wake-up, acquisition, conversion,
and shutdown sequences are initiated through CNVST
and performed automatically using the internal oscillator. Results are added to the internal FIFO to be read
out later. See Figure 4 for clock mode 00 timing.
Initiate a scan by setting CNVST low for at least 40ns
before pulling it high again. The MAX11626–MAX11629/
MAX11632/MAX11633 then wake up, scan all requested channels, store the results in the FIFO, and shut
down. After the scan is complete, EOC is pulled low
and the results are available in the FIFO. Wait until EOC
goes low before pulling CS low to communicate with
the serial interface. EOC stays low until CS or CNVST is
pulled low again.
Do not initiate a second CNVST before EOC goes low;
otherwise, the FIFO can become corrupted.
Externally Timed Acquisitions and
Internally Timed Conversions with CNVST
Performing Conversions in Clock Mode 01
In clock mode 01, conversions are requested one at a
time using CNVST and performed automatically using the
internal oscillator. See Figure 5 for clock mode 01 timing.
Setting CNVST low begins an acquisition, wakes up the
ADC, and places it in track mode. Hold CNVST low for
at least 1.4µs to complete the acquisition. If the internal
reference needs to wake up, an additional 65µs is
required for the internal reference to power up.
Set CNVST high to begin a conversion. After the conversion is complete, the ADC shuts down and pulls
EOC low. EOC stays low until CS or CNVST is pulled
low again. Wait until EOC goes low before pulling CS or
CNVST low.
If averaging is turned on, multiple CNVST pulses need
to be performed before a result is written to the FIFO.
Once the proper number of conversions has been performed to generate an averaged FIFO result, as specified by the averaging register, the scan logic
automatically switches the analog input multiplexer to
the next-requested channel. The result is available on
DOUT once EOC has been pulled low.
CNVST
(UP TO 514 INTERNALLY CLOCKED ACQUISITIONS AND CONVERSIONS)
CS
SCLK
DOUT
MSB1
LSB1
MSB2
EOC
SET CNVST LOW FOR AT LEAST 40ns TO BEGIN A CONVERSION.
Figure 4. Clock Mode 00 Timing
______________________________________________________________________________________
17
MAX11626–MAX11629/MAX11632/MAX11633
Power-Up Default State
The MAX11626–MAX11629/MAX11632/MAX11633
power up with all blocks in shutdown, including the reference. All registers power up in state 00000000,
except for the setup register, which powers up in clock
mode 10 (CKSEL1 = 1)
MAX11626–MAX11629/MAX11632/MAX11633
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
CNVST
(CONVERSION2)
(ACQUISITION1)
(ACQUISITION2)
CS
(CONVERSION1)
SCLK
DOUT
LSB1
MSB1
MSB2
EOC
REQUEST MULTIPLE CONVERSIONS BY SETTING CNVST LOW FOR EACH CONVERSION.
Figure 5. Clock Mode 01 Timing
(CONVERSION BYTE)
DIN
(UP TO 514 INTERNALLY CLOCKED ACQUISITIONS AND CONVERSIONS)
CS
SCLK
DOUT
MSB1
LSB1
MSB2
EOC
THE CONVERSION BYTE BEGINS THE ACQUISITION. CNVST IS NOT REQUIRED.
Figure 6. Clock Mode 10 Timing
Internally Timed Acquisitions and
Conversions Using the Serial Interface
Performing Conversions in Clock Mode 10
In clock mode 10, the wake-up, acquisition, conversion,
and shutdown sequences are initiated by writing an
input data byte to the conversion register, and are performed automatically using the internal oscillator. This
is the default clock mode upon power-up. See Figure 6
for clock mode 10 timing.
Initiate a scan by writing a byte to the conversion register. The MAX11626–MAX11629/MAX11632/MAX11633
then power up, scan all requested channels, store the
results in the FIFO, and shut down. After the scan is
18
complete, EOC is pulled low and the results are available in the FIFO. EOC stays low until CS is pulled low
again.
Externally Clocked Acquisitions and
Conversions Using the Serial Interface
Performing Conversions in Clock Mode 11
In clock mode 11, acquisitions and conversions are initiated by writing to the conversion register and are performed one at a time using the SCLK as the conversion
clock. Scanning and averaging are disabled, and the
conversion result is available at DOUT during the conversion. See Figure 7 for clock mode 11 timing.
______________________________________________________________________________________
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
(ACQUISITION1)
(ACQUISITION2)
(CONVERSION1)
CS
SCLK
DOUT
MSB1
LSB1
MSB2
EOC
EXTERNALLY TIMED ACQUISITION, SAMPLING AND CONVERSION WITHOUT CNVST.
Figure 7. Clock Mode 11 Timing
Initiate a conversion by writing a byte to the conversion
register followed by 16 SCLK cycles. If CS is pulsed
high between the eight and ninth cycles, the pulse
width must be less than 100µs. To continuously convert
at 16 cycles per conversion, alternate 1 byte of zeros
between each conversion byte.
If reference mode 00 is requested, wait 65µs with CS
high after writing the conversion byte to extend the
acquisition and allow the internal reference to power up.
OUTPUT CODE
FULL-SCALE
TRANSITION
11 . . . 111
11 . . . 110
11 . . . 101
FS = VREF + VCOM
ZS = VCOM
Partial Reads and Partial Writes
If the first byte of an entry in the FIFO is partially read
(CS is pulled high after fewer than eight SCLK cycles),
the second byte of data that is read out contains the
next 8 bits (not b7–b0). The remaining bits are lost for
that entry. If the first byte of an entry in the FIFO is read
out fully, but the second byte is read out partially, the
rest of the entry is lost. The remaining data in the FIFO
is uncorrupted and can be read out normally after taking CS low again, as long as the 4 leading bits (normally zeros) are ignored. Internal registers that are written
partially through the SPI contain new values, starting at
the MSB up to the point that the partial write is stopped.
The part of the register that is not written contains previously written values. If CS is pulled low before EOC
goes low, a conversion cannot be completed and the
FIFO is corrupted.
Transfer Function
Figure 8 shows the unipolar transfer function. Code transitions occur halfway between successive-integer LSB
values. Output coding is binary, with 1 LSB = VREF/2.5V
(MAX11627/MAX11629/MAX11633) and 1 LSB = VREF/
4.096V (MAX11626/MAX11628/MAX11632).
V
1 LSB = REF
4096
00 . . . 011
00 . . . 010
00 . . . 001
00 . . . 000
0 1
(COM)
2
3
INPUT VOLTAGE (LSB)
FS
FS - 3/2 LSB
Figure 8. Unipolar Transfer Function, Full Scale (FS) = VREF
Layout, Grounding, and Bypassing
For best performance, use PCBs. Do not use wire wrap
boards. Board layout should ensure that digital and analog signal lines are separated from each other. Do not
run analog and digital (especially clock) signals parallel
to one another or run digital lines underneath the
MAX11626–MAX11629/MAX11632/MAX11633 package.
High-frequency noise in the V DD power supply can
affect performance. Bypass the VDD supply with a 0.1µF
capacitor to GND, close to the VDD pin. Minimize capacitor lead lengths for best supply-noise rejection. If the
power supply is very noisy, connect a 10Ω resistor in
series with the supply to improve power-supply filtering.
______________________________________________________________________________________
19
MAX11626–MAX11629/MAX11632/MAX11633
(CONVERSION BYTE)
DIN
MAX11626–MAX11629/MAX11632/MAX11633
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
Definitions
Integral Nonlinearity
Integral nonlinearity (INL) is the deviation of the values
on an actual transfer function from a straight line. This
straight line can be either a best-straight-line fit or a line
drawn between the end points of the transfer function,
once offset and gain errors have been nullified. INL for
the MAX11626–MAX11629/MAX11632/MAX11633 is
measured using the end-point method.
Differential Nonlinearity
Differential nonlinearity (DNL) is the difference between
an actual step width and the ideal value of 1 LSB. A
DNL error specification of less than 1 LSB guarantees
no missing codes and a monotonic transfer function.
Aperture Jitter
Aperture jitter (tAJ) is the sample-to-sample variation in
the time between the samples.
Aperture Delay
Aperture delay (t AD ) is the time between the rising
edge of the sampling clock and the instant when an
actual sample is taken.
Signal-to-Noise Ratio
For a waveform perfectly reconstructed from digital
samples, signal-to-noise ratio (SNR) is the ratio of the
full-scale analog input (RMS value) to the RMS quantization error (residual error). The ideal, theoretical minimum analog-to-digital noise is caused by quantization
error only and results directly from the ADC’s resolution
(N bits):
SNR = (6.02 x N + 1.76)dB
Signal-to-Noise Plus Distortion
Signal-to-noise plus distortion (SINAD) is the ratio of the
fundamental input frequency’s RMS amplitude to the
RMS equivalent of all other ADC output signals:
SINAD (dB) = 20 x log (SignalRMS/NoiseRMS)
Effective Number of Bits
Effective number of bits (ENOB) indicates the global
accuracy of an ADC at a specific input frequency and
sampling rate. An ideal ADC error consists of quantization noise only. With an input range equal to the fullscale range of the ADC, calculate the effective number
of bits as follows:
ENOB = (SINAD - 1.76)/6.02
Total Harmonic Distortion
Total harmonic distortion (THD) is the ratio of the RMS
sum of the first five harmonics of the input signal to the
fundamental itself. This is expressed as:
⎛
⎞
THD = 20 x log ⎜ ⎛⎝ V22 + V32 + V4 2 + V52 ⎞⎠ /V1⎟
⎝
⎠
where V1 is the fundamental amplitude, and V2–V5 are
the amplitudes of the first five harmonics.
Spurious-Free Dynamic Range
Spurious-free dynamic range (SFDR) is the ratio of the
RMS amplitude of the fundamental (maximum signal
component) to the RMS value of the next-largest distortion component.
In reality, there are other noise sources besides quantization noise, including thermal noise, reference noise,
clock jitter, etc. Therefore, SNR is calculated by taking
the ratio of the RMS signal to the RMS noise, which
includes all spectral components minus the fundamental, the first five harmonics, and the DC offset.
20
______________________________________________________________________________________
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
Chip Information
PROCESS: BiCMOS
TOP VIEW
Package Information
+
AIN0 1
24 EOC
AIN1 2
23 DOUT
AIN2 3
22 DIN
AIN3 4
21 SCLK
AIN4 5
MAX11632
MAX11633
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
20 CS
AIN5 6
19 VDD
AIN6 7
18 GND
AIN7 8
17 REF
AIN8 9
16 CNVST/AIN15
AIN9 10
15 AIN14
AIN10 11
14 AIN13
AIN11 12
13 AIN12
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
16 QSOP
E16+5
21-0055
90-0167
24 QSOP
E24+1
21-0055
90-0172
QSOP
______________________________________________________________________________________
21
MAX11626–MAX11629/MAX11632/MAX11633
Pin Configurations (continued)
MAX11626–MAX11629/MAX11632/MAX11633
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
Revision History
REVISION
NUMBER
REVISION
DATE
0
6/10
Initial release
—
1
8/10
Initial release of MAX11628/MAX11629 and changed internal reference voltage
1
2
3/11
Added MAX11628 automotive qualified part to data sheet
1
3
10/11
Initial release of MAX11626/MAX11627
1
DESCRIPTION
PAGES
CHANGED
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
22 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2011 Maxim Integrated Products
Maxim is a registered trademark of Maxim Integrated Products, Inc.