KIT ATION EVALU E L B A AVAIL 19-3383; Rev 1; 3/11 Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer with LO Buffer/Switch The MAX9995 dual, high-linearity, downconversion mixer provides 6.1dB gain, +25.6dBm IIP3, and 9.8dB NF for WCDMA, TD-SCDMA, LTE, TD-LTE, and GSM/EDGE base-station applications. This device integrates baluns in the RF and LO ports, a dual-input LO selectable switch, an LO buffer, two doublebalanced mixers, and a pair of differential IF output amplifiers. The MAX9995 requires a typical LO drive of 0dBm and supply current is guaranteed to be below 380mA. These devices are available in a compact 36-pin TQFN package (6mm × 6mm) with an exposed pad. Electrical performance is guaranteed over the extended temperature range, from TC = -40°C to +85°C. Applications WCDMA, TD-SCDMA, and cdma2000® 3G Base Stations PHS/PAS Base Stations LTE and TD-LTE Base Stations Wireless Local Loop GSM/EDGE Base Stations Military Systems Fixed Broadband Wireless Access Features o 1700MHz to 2700MHz RF Frequency Range o 1400MHz to 2600MHz LO Frequency Range o 40MHz to 350MHz IF Frequency Range o o o o 6.1dB Conversion Gain +25.6dBm Input IP3 9.8dB Noise Figure 66dBc 2RF - 2LO Spurious Rejection at PRF = -10dBm o Dual Channels Ideal for Diversity Receiver Applications o Integrated LO Buffer o Integrated RF and LO Baluns for Single-Ended Inputs o Low -3dBm to +3dBm LO Drive o Built-In SPDT LO Switch with 50dB LO1 - LO2 Isolation and 50ns Switching Time o 44dB Channel-to-Channel Isolation Private Mobile Radio RFMAIN 29 LO_ADJ_M 1 MAX9995 27 LO2 TAPMAIN 2 26 GND GND 3 25 GND VCC 4 24 GND GND 5 23 LOSEL VCC 6 22 GND GND 7 21 VCC TAPDIV 8 20 GND RFDIV 9 19 LO1 13 14 15 16 17 18 IND_EXTD VCC LO_ADJ_D N.C. 12 GND IFD- 11 IFD_SET IFD+ 10 VCC EXPOSED PAD* 6mm x 6mm TQFN *EXPOSED PAD ON THE BOTTOM OF THE PACKAGE Ordering Information PART 28 N.C. 30 VCC 31 IND_EXTM 33 IFM+ 32 IFM- 34 GND 36 VCC TOP VIEW 35 IFM_SET Pin Configuration/ Functional Diagram TEMP RANGE PIN-PACKAGE MAX9995ETX+ TC* = -40°C to +85°C 36 TQFN-EP** MAX9995ETX+T TC* = -40°C to +85°C 36 TQFN-EP** +Denotes a lead(PB)-free and RoHS-compliant package. *TC = Case temperature. **EP = Exposed pad. T = Tape and reel. cdma2000 is a registered trademark of Telecommunications Industry Association. ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX9995 General Description MAX9995 Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer with LO Buffer/Switch ABSOLUTE MAXIMUM RATINGS VCC ........................................................................-0.3V to +5.5V LO1, LO2 to GND ...............................................................±0.3V IFM_, IFD_, IFM_SET, IFD_SET, LOSEL, LO_ADJ_M, LO_ADJ_D to GND.............-0.3V to (VCC + 0.3V) RFMAIN, RFDIV, and LO_ Input Power ..........................+20dBm RFMAIN, RFDIV Current (RF is DC shorted to GND through balun) ......................50mA Continuous Power Dissipation (Note 1) ...............................8.8W Operating Temperature Range (Note 2) .....TC = -40°C to +85°C Maximum Junction Temperature .....................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) .......................................+260°C Note 1: Based on junction temperature TJ = TC + (θJC x VCC x ICC). This formula can be used when the temperature of the exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150°C. Note 2: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS TQFN Junction-to-Ambient Thermal Resistance (θJA) (Note 3, 4) ....................................................................38°C/W Junction-to-Case Thermal Resistance (θJC) (Note 1, 4) ...................................................................7.4°C/W Note 3: Junction temperature TJ = TA + (θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is known. The junction temperature must not exceed +150°C. Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, no input RF or LO signals applied, VCC = 4.75V to 5.25V, TC = -40°C to +85°C. Typical values are at VCC = 5.0V, TC = +25°C, unless otherwise noted.) PARAMETER Supply Voltage SYMBOL CONDITIONS VCC MIN TYP MAX UNITS 4.75 5 5.25 V 332 380 Total supply current Supply Current LOSEL Input High Voltage LOSEL Input Low Voltage LOSEL Input Current ICC VCC (pin 16) 82 90 VCC (pin 30) 97 110 IFM+/IFM- (total of both) 70 90 IFD+/IFD- (total of both) 70 90 VIH 2 V VIL IIL and IIH mA -10 0.8 V +10 µA RECOMMENDED AC OPERATING CONDITIONS MAX UNITS RF Frequency Range PARAMETER fRF (Note 5) 1700 2700 MHz LO Frequency Range fLO (Note 5) 1400 2600 MHz IF Frequency Range fIF (Note 5) 40 350 MHz PLO (Note 5) -3 +3 dBm LO Drive Level 2 SYMBOL CONDITIONS MIN TYP _______________________________________________________________________________________ Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer with LO Buffer/Switch (Typical Application Circuit, VCC = 4.75V to 5.25V, RF and LO ports are driven from 50Ω sources, PLO = -3dBm to +3dBm, fRF = 1700MHz to 2200MHz, fLO = 1400MHz to 2000MHz, fIF = 200MHz, with fRF > fLO, TC = -40°C to +85°C. Typical values are at VCC = 5.0V, PLO = 0dBm, fRF = 1900MHz, fLO = 1700MHz, fIF = 200MHz, and TC = +25°C, unless otherwise noted.) (Notes 6, 7) PARAMETER Conversion Gain SYMBOL CONDITIONS GC VCC = 5.0V, TC = +25°C, PLO = 0dBm, PRF = -10dBm (Note 8) Gain Variation from Nominal MIN fRF = 1850MHz to 1910MHz 6.2 fRF = 2110MHz to 2170MHz 6.1 fRF = 1710MHz to 1875MHz ±0.5 ±1 fRF = 1850MHz to 1910MHz ±0.5 ±1 fRF = 2110MHz to 2170MHz ±0.5 ±1 ±0.75 NF Noise Figure (with Blocker) No blockers present MAX 6 Gain Variation with Temperature Noise Figure TYP fRF = 1710MHz to 1875MHz fRF = 1710MHz to 1875MHz 9.7 UNIT dB dB dB dB fRF = 1850MHz to 1910MHz 9.8 fRF = 2110MHz to 2170MHz 9.9 8dBm blocker tone applied to RF port at 2000MHz, fRF = 1900MHz, fLO = 1710MHz, PLO = -3dBm 22 dB Input 1dB Compression Point P1dB (Note 8) 9.5 12.6 dBm Input Third-Order Intercept Point IIP3 (Notes 8, 9) 23 25.6 dBm PRF = -10dBm 66 2x2 fRF = 1900MHz, fLO = 1700MHz, fSPUR = 1800MHz (Note 8) PRF = -5dBm 61 fRF = 1900MHz, fLO = 1700MHz, fSPUR = 1766.7MHz (Note 8) PRF = -10dBm 70 88 PRF = -5dBm 60 78 2RF - 2LO Spur Rejection 3RF - 3LO Spur Rejection 3x3 dBc dBc Maximum LO Leakage at RF Port fLO = 1400MHz to 2000MHz -29 dBm Maximum 2LO Leakage at RF Port fLO = 1400MHz to 2000MHz -17 dBm Maximum LO Leakage at IF Port fLO = 1400MHz to 2000MHz -25 dBm Minimum RF-to-IF Isolation fRF = 1700MHz to 2200MHz, fIF = 200MHz 37 dB LO1 - LO2 Isolation PLO1 = 0dBm, PLO2 = 0dBm (Note 10) 40 50.5 dB Minimum Channel-to-Channel Isolation PRF = -10dBm, RFMAIN (RFDIV) power measured at IFDIV (IFMAIN), relative to IFMAIN (IFDIV), all unused ports terminated at 50Ω 40 44 dB LO Switching Time 50% of LOSEL to IF settled to within 2° RF Return Loss LO Return Loss IF Return Loss 50 ns 14 dB LO port selected 18 LO port unselected 21 LO driven at 0dBm, RF terminated into 50Ω (Note 11) 21 dB dB _______________________________________________________________________________________ 3 MAX9995 AC ELECTRICAL CHARACTERISTICS—fRF = 1700MHz TO 2200MHz AC ELECTRICAL CHARACTERISTICS—fRF = 2540MHz (Typical Application Circuit, RF and LO ports are driven from 50Ω sources, fRF > fLO, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 2540MHz, fLO = 2400MHz, fIF = 140MHz, TC = +25°C, unless otherwise noted.) (Note 7) PARAMETER SYMBOL Conversion Gain GC Input Third-Order Intercept Point IIP3 2RF - 2LO Spurious Response 2x2 3RF - 3LO Spurious Response 3x3 CONDITIONS MIN TYP Two tones: fRF1 = 2540MHz, fRF2 = 2541MHz, PRF = -5dBm/tone MAX UNITS 5.2 dB 24.6 dBm PRF = -10dBm 58 PRF = -5dBm 63 PRF = -10dBm 72 PRF = -5dBm 82 dBc dBc LO Leakage at IF Port -45 dBm RF-to-IF Isolation 49 dB 48 dB PRF = -10dBm, RFMAIN (RFDIV) power measured at IFDIV (IFMAIN), relative to IFMAIN (IFDIV), all unused ports terminated at 50Ω Channel-to-Channel Isolation Note 5: Operation outside this frequency band is possible but has not been characterized. See the Typical Operating Characteristics. Note 6: Guaranteed by design and characterization. Note 7: All limits reflect losses of external components. Output measurements taken at IF outputs of Typical Application Circuit. Note 8: Production tested. Note 9: Two tones 3MHz spacing, -5dBm per tone at RF port. Note 10: Measured at IF port at IF frequency. fLO1 and fLO2 are offset by 1MHz. Note 11: IF return loss can be optimized by external matching components. Typical Operating Characteristics (Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25°C.) 6.0 TC = +25°C 5.5 5.0 TC = +85°C 4.5 6.4 6.2 6.1 6.0 5.9 5.8 6.2 6.1 6.0 5.9 5.7 5.7 5.6 5.6 1900 2000 RF FREQUENCY (MHz) 2100 2200 VCC = 5.25V 5.5 5.5 1800 VCC = 5.0V 5.8 3.5 1700 VCC = 4.75V 6.3 4.0 3.0 4 6.3 CONVERSION GAIN (dB) 6.5 PLO = -3dBm to +3dBm 6.4 CONVERSION GAIN (dB) TC = -20°C 7.0 6.5 MAX9995 toc03 MAX9995 toc01 7.5 CONVERSION GAIN vs. RF FREQUENCY CONVERSION GAIN vs. RF FREQUENCY 6.5 MAX9995 toc02 CONVERSION GAIN vs. RF FREQUENCY 8.0 CONVERSION GAIN (dB) MAX9995 Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer with LO Buffer/Switch 1700 1800 1900 2000 RF FREQUENCY (MHz) 2100 2200 1700 1800 1900 2000 RF FREQUENCY (MHz) _______________________________________________________________________________________ 2100 2200 Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer with LO Buffer/Switch INPUT IP3 vs. RF FREQUENCY 26.2 TC = -20°C TC = +25°C 25.2 PLO = +3dBm 25.8 PLO = -3dBm 25.2 1800 1900 2000 2100 1800 TC = +85°C 2100 2200 1700 PRF = -5dBm PLO = -3dBm 64 TC = +25°C TC = -20°C 50 45 60 PLO = 0dBm 58 PLO = +3dBm 56 52 50 50 2200 1700 FUNDAMENTAL FREQUENCY (MHz) PRF = -5dBm TC = -20°C PRF = -5dBm 86 PLO = 0dBm PLO = -3dBm 82 80 78 TC = +85°C 76 74 72 70 1900 2000 2100 FUNDAMENTAL FREQUENCY (MHz) 2200 1900 2000 2100 2200 3RF - 3LO vs. FUNDAMENTAL FREQUENCY 88 86 PRF = -5dBm VCC = 5.0V 84 82 PLO = +3dBm 80 78 82 80 VCC = 5.25V 78 76 76 74 74 VCC = 4.75V 72 72 1800 1800 FUNDAMENTAL FREQUENCY (MHz) 84 TC = +25°C 1700 1700 2200 3RF - 3LO vs. FUNDAMENTAL FREQUENCY 3RF - 3LO (dBc) 84 2100 3RF - 3LO (dBc) 86 2000 88 MAX9995 toc10 88 1900 FUNDAMENTAL FREQUENCY (MHz) 3RF - 3LO vs. FUNDAMENTAL FREQUENCY 90 1800 MAX9995 toc11 2100 VCC = 5.0V 56 35 2000 VCC = 5.25V 58 54 1900 VCC = 4.75V 60 52 1800 2200 62 54 1700 2100 PRF = -5dBm 64 40 30 2000 2RF - 2LO vs. FUNDAMENTAL FREQUENCY 2RF - 2LO (dBc) 60 1900 66 62 55 1800 RF FREQUENCY (MHz) 2RF - 2LO vs. FUNDAMENTAL FREQUENCY 2RF - 2LO (dBc) 2RF - 2LO (dBc) 65 3RF - 3LO (dBc) 2000 66 MAX9995 toc07 PRF = -5dBm 70 1900 RF FREQUENCY (MHz) RF FREQUENCY (MHz) 2RF - 2LO vs. FUNDAMENTAL FREQUENCY VCC = 5.0V 24.6 1700 2200 MAX9995 toc08 1700 VCC = 4.75V 25.0 25.4 24.4 25.8 25.4 25.6 24.8 75 26.2 26.0 MAX9995 toc09 25.6 VCC = 5.25V 26.6 IIP3 (dBm) IIP3 (dBm) 26.0 IIP3 (dBm) PLO = 0dBm 26.4 MAX9995 toc12 TC = +85°C 26.4 INPUT IP3 vs. RF FREQUENCY 27.0 MAX9995 toc05 MAX9995 toc04 26.6 MAX9995 toc06 INPUT IP3 vs. RF FREQUENCY 26.8 1700 1800 1900 2000 2100 FUNDAMENTAL FREQUENCY (MHz) 2200 1700 1800 1900 2000 2100 2200 FUNDAMENTAL FREQUENCY (MHz) _______________________________________________________________________________________ 5 MAX9995 Typical Operating Characteristics (continued) (Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25°C.) Typical Operating Characteristics (continued) (Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25°C.) INPUT P1dB vs. RF FREQUENCY 13.6 13.2 13.5 13.4 13.3 13.2 TC = -20°C 2000 2100 1800 LO SWITCH ISOLATION vs. LO FREQUENCY 2000 2100 2200 1700 1800 TC = -20°C 52 51 50 TC = +25°C 48 1900 2000 2100 2200 RF FREQUENCY (MHz) LO SWITCH ISOLATION vs. LO FREQUENCY LO SWITCH ISOLATION vs. LO FREQUENCY 53 LO SWITCH ISOLATION (dB) PLO = -3dBm 52 PLO = 0dBm 51 PLO = +3dBm 50 49 54 VCC = 4.75V TO 5.25V 53 52 51 50 49 TC = +85°C 48 48 46 45 47 47 1400 1500 1600 1700 1800 1900 2000 1400 1500 LO FREQUENCY (MHz) 1800 1900 TC = -20°C 40 PLO = 0dBm PLO = +3dBm 70 60 PLO = -3dBm 50 1900 2000 RF FREQUENCY (MHz) 2100 2200 1800 1900 2000 CHANNEL ISOLATION vs. RF FREQUENCY 80 VCC = 4.75V VCC = 5.0V 70 60 VCC = 5.25V 50 30 30 20 1700 40 40 30 1600 90 MAX9995 toc20 80 CHANNEL ISOLATION (dB) 60 1800 1500 LO FREQUENCY (MHz) 90 MAX9995 toc19 TC = +25°C 70 1700 1400 2000 CHANNEL ISOLATION vs. RF FREQUENCY CHANNEL ISOLATION vs. RF FREQUENCY 50 1700 LO FREQUENCY (MHz) 80 TC = +85°C 1600 MAX9995 toc21 47 CHANNEL ISOLATION (dB) LO SWITCH ISOLATION (dB) 54 6 1900 54 MAX9995 toc16 55 49 VCC = 4.75V RF FREQUENCY (MHz) RF FREQUENCY (MHz) 53 13.2 12.4 1700 2200 LO SWITCH ISOLATION (dB) 1900 MAX9995 toc17 1800 13.4 12.6 12.9 1700 13.6 12.8 13.0 12.4 VCC = 5.0V 13.8 13.0 PLO = +3dBm 13.1 12.8 14.0 MAX9995 toc18 13.6 PLO = -3dBm VCC = 5.25V 14.2 INPUT P1dB (dBm) INPUT P1dB (dBm) INPUT P1dB (dBm) 14.0 PLO = 0dBm 13.7 INPUT P1dB vs. RF FREQUENCY 14.4 MAX9995 toc14 MAX9995 toc13 TC = +85°C TC = +25°C 13.8 MAX9995 toc15 INPUT P1dB vs. RF FREQUENCY 14.4 CHANNEL ISOLATION (dB) MAX9995 Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer with LO Buffer/Switch 1700 1800 1900 2000 RF FREQUENCY (MHz) 2100 2200 1700 1800 1900 2000 RF FREQUENCY (MHz) _______________________________________________________________________________________ 2100 2200 Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer with LO Buffer/Switch LO LEAKAGE AT IF PORT vs. LO FREQUENCY -30 TC = -20°C -35 -40 -45 TC = +25°C TC = +85°C -50 -30 PLO = -3dBm -35 -40 -45 PLO = +3dBm -50 -55 VCC = 5.25V -35 VCC = 4.75V -40 -45 1700 1800 1900 1400 2000 1500 LO LEAKAGE AT RF PORT vs. LO FREQUENCY TC = -20°C -35 -40 TC = +25°C TC = +85°C -50 1800 1900 2000 1400 -25 -30 PLO = +3dBm -35 -40 -45 PLO = -3dBm -20 1700 1800 1900 2000 1500 1600 1700 1800 1900 41 TC = +25°C TC = -20°C PLO = -3dBm TO +3dBm 43 42 41 40 39 38 RF FREQUENCY (MHz) 1400 1500 2100 1600 1700 1800 1900 2000 RF-TO-IF ISOLATION vs. RF FREQUENCY 43.0 42.5 VCC = 5.25V 42.0 41.5 41.0 VCC = 4.75V VCC = 5.0V 40.5 39.5 36 2000 -50 40.0 37 1900 -45 38 39 1800 -40 2000 RF-TO-IF ISOLATION (dB) 42 1700 -35 LO FREQUENCY (MHz) 44 RF-TO-IF ISOLATION (dB) 43 40 45 2000 -30 RF-TO-IF ISOLATION vs. RF FREQUENCY 46 MAX9995 toc28 TC = +85°C 44 VCC = 4.75V TO 5.25V LO FREQUENCY (MHz) RF-TO-IF ISOLATION vs. RF FREQUENCY 1900 -60 1400 LO FREQUENCY (MHz) 45 1800 -55 PLO = 0dBm MAX9995 toc29 1600 1700 -25 -50 1500 1600 LO LEAKAGE AT RF PORT vs. LO FREQUENCY LO LEAKAGE AT RF PORT vs. LO FREQUENCY -55 1400 1500 LO FREQUENCY (MHz) MAX9995 toc26 -25 -45 1700 -20 LO LEAKAGE AT RF PORT (dBm) MAX9995 toc25 -20 -30 1600 LO FREQUENCY (MHz) MAX9995 toc27 1600 LO FREQUENCY (MHz) MAX9995 toc30 1500 -50 LO LEAKAGE AT RF PORT (dBm) 1400 LO LEAKAGE AT RF PORT (dBm) -30 VCC = 5.0V -55 -60 RF-TO-IF ISOLATION (dB) PLO = 0dBm LO LEAKAGE AT IF PORT vs. LO FREQUENCY -25 MAX9995 toc24 MAX9995 toc23 LO LEAKAGE AT IF PORT (dBm) MAX9995 toc22 LO LEAKAGE AT IF PORT (dBm) -25 -25 LO LEAKAGE AT IF PORT (dBm) LO LEAKAGE AT IF PORT vs. LO FREQUENCY -20 2200 1700 1800 1900 2000 RF FREQUENCY (MHz) 2100 2200 1700 1800 1900 2000 2100 2200 RF FREQUENCY (MHz) _______________________________________________________________________________________ 7 MAX9995 Typical Operating Characteristics (continued) (Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25°C.) Typical Operating Characteristics (continued) (Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25°C.) 10 9 8 PLO = 0dBm 10.0 9.9 9.8 10.4 PLO = +3dBm 10.2 VCC = 5.0V 10.1 10.0 9.9 9.8 TC = -20°C 9.7 9.7 7 VCC = 5.25V 10.3 NOISE FIGURE (dB) TC = +25°C PLO = -3dBm 10.1 NOISE FIGURE (dB) VCC = 4.75V 9.6 6 9.5 9.6 1700 1800 1900 2000 2100 2200 1700 1800 1900 2000 2100 1700 2200 1800 1900 2000 2200 RF FREQUENCY (MHz) RF FREQUENCY (MHz) RF RETURN LOSS vs. RF FREQUENCY IF RETURN LOSS vs. IF FREQUENCY LO RETURN LOSS vs. LO FREQUENCY (LO INPUT SELECTED) 10 IF RETURN LOSS (dB) 5 5 10 15 20 0 5 LO RETURN LOSS (dB) PLO = -3dBm TO +3dBm 15 20 25 30 35 25 MAX9995 toc36 0 MAX9995 toc34 0 10 PLO = +3dBm PLO = 0dBm 15 20 PLO = -3dBm 40 45 30 1800 1900 2000 2100 25 40 2200 80 120 160 200 240 280 320 360 1500 PLO = -3dBm TO +3dBm 360 355 SUPPLY CURRENT (mA) 5 1700 SUPPLY CURRENT vs. TEMPERATURE (TC) 365 MAX9995 toc37 0 1600 10 15 20 25 350 VCC = 5.25V 345 340 VCC = 5.0V 335 330 325 VCC = 4.75V 320 30 315 35 310 1400 1500 1600 1700 1800 LO FREQUENCY (MHz) 1900 2000 1800 LO FREQUENCY (MHz) LO RETURN LOSS vs. LO FREQUENCY (LO INPUT UN SELECTED) LO RETURN LOSS (dB) 1400 IF FREQUENCY (MHz) RF FREQUENCY (MHz) MAX9995 toc38 1700 8 2100 RF FREQUENCY (MHz) MAX9995 toc35 NOISE FIGURE (dB) TC = +85°C 11 10.5 MAX9995 toc32 MAX9995 toc31 13 12 NOISE FIGURE vs. RF FREQUENCY NOISE FIGURE vs. RF FREQUENCY 10.2 MAX9995 toc33 NOISE FIGURE vs. RF FREQUENCY 14 RF RETURN LOSS (dB) MAX9995 Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer with LO Buffer/Switch -20 -5 10 25 40 55 TEMPERATURE (°C) 70 _______________________________________________________________________________________ 85 1900 2000 Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer with LO Buffer/Switch PIN NAME 1 RFMAIN FUNCTION Main Channel RF Input. Internally matched to 50Ω. Requires an input DC-blocking capacitor. 2 TAPMAIN 3, 5, 7, 12, 20, 22, 24, 25, 26, 34 GND Ground 4, 6, 10, 16, 21, 30, 36 VCC Power Supply. Connect bypass capacitors as close as possible to the pin (see the Typical Application Circuit). 8 TAPDIV 9 RFDIV 11 IFD_SET 13, 14 IFD+, IFD- Diversity Mixer Differential IF Output. Connect pullup inductors from each of these pins to VCC (see the Typical Application Circuit). 15 IND_EXTD Connect a 10nH inductor from this pin to ground to increase the RF-IF and LO-IF isolation. 17 LO Diversity Amplifier Bias Control. Connect a 392Ω resistor from this pin to ground to set the LO_ADJ_D bias current for the diversity LO amplifier. 18, 28 Main Channel Balun Center Tap. Connect a 0.033µF capacitor from this pin to the board ground. Diversity Channel Balun Center Tap. Connect a 0.033µF capacitor from this pin to the ground. Diversity Channel RF Input. Internally matched to 50Ω. Requires an input DC-blocking capacitor. IF Diversity Amplifier Bias Control. Connect a 1.2kΩ resistor from this pin to ground to set the bias current for the diversity IF amplifier. N.C. No Connection. Not internally connected. 19 LO1 Local Oscillator 1 Input. This input is internally matched to 50Ω. Requires an input DC-blocking capacitor. 23 LOSEL Local Oscillator Select. Set this pin to high to select LO1. Set to low to select LO2. 27 LO2 Local Oscillator 2 Input. This input is internally matched to 50Ω. Requires an input DC-blocking capacitor. 29 LO_ADJ_M LO Main Amplifier Bias Control. Connect a 392Ω resistor from this pin to ground to set the bias current for the main LO amplifier. 31 IND_EXTM Connect a 10nH inductor from this pin to ground to increase the RF-IF and LO-IF isolation. 32, 33 IFM-, IFM+ Main Mixer Differential IF Output. Connect pullup inductors from each of these pins to VCC (see the Typical Application Circuit). 35 IFM_SET — EP IF Main Amplifier Bias Control. Connect a 1.2kΩ resistor from this pin to ground to set the bias current for the main IF amplifier. Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple via grounds are also required to achieve the noted RF performance. _______________________________________________________________________________________ 9 MAX9995 Pin Description MAX9995 Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer with LO Buffer/Switch Detailed Description The MAX9995 dual, high-linearity, downconversion mixer provides 6.1dB gain and +25.6dBm IIP3, with a 9.8dB noise figure. Integrated baluns and matching circuitry allow 50Ω single-ended interfaces to the RF and LO ports. A single-pole, double-throw (SPDT) LO switch provides 50ns switching time between LO inputs, with 50dB LO-to-LO isolation. Furthermore, the integrated LO buffer provides a high drive level to the mixer core, reducing the LO drive required at the MAX9995’s inputs to -3dBm. The IF port incorporates a differential output, which is ideal for providing enhanced 2RF - 2LO performance. Specifications are guaranteed over broad frequency ranges to allow for use in WCDMA, TD-SCDMA, LTE, TD-LTE, and GSM/EDGE base stations. The MAX9995 is specified to operate over an RF input range of 1700MHz to 2700MHz, an LO range of 1400MHz to 2600MHz, and an IF range of 40MHz to 350MHz. Operation beyond this is possible; however, performance is not characterized. This device is available in a compact 6mm x 6mm, 36-pin TQFN package with an exposed pad. RF Input and Balun The MAX9995’s two RF inputs (RFMAIN and RFDIV) are internally matched to 50Ω, requiring no external matching components. DC-blocking capacitors are required as the inputs are internally DC shorted to ground through the on-chip baluns. Input return loss is typically 14dB over the entire RF frequency range of 1700MHz to 2700MHz. LO Input, Switch, Buffer, and Balun The mixers can be used for either high-side or low-side injection applications with an LO frequency range of 1400MHz to 2600MHz. As an added feature, the MAX9995 includes an internal LO SPDT switch that can be used for frequency-hopping applications. The switch selects one of the two single-ended LO ports, allowing the external oscillator to settle on a particular frequency before it is switched in. LO switching time is typically less than 50ns, which is more than adequate for virtually all GSM applications. If frequency hopping is not employed, set the switch to either of the LO inputs. The switch is controlled by a digital input (LOSEL): logic-high selects LO1, and logic-low selects LO2. LO1 and LO2 inputs are internally matched to 50Ω, requiring only a 22pF DC-blocking capacitor. 10 A two-stage internal LO buffer allows a wide input power range for the LO drive. All guaranteed specifications are for an LO signal power from -3dBm to +3dBm. The on-chip low-loss balun, along with an LO buffer, drives the double-balanced mixer. All interfacing and matching components from the LO inputs to the IF outputs are integrated on-chip. High-Linearity Mixers The core of the MAX9995 is a pair of double-balanced, high-performance passive mixers. Exceptional linearity is provided by the large LO swing from the on-chip LO buffer. When combined with the integrated IF amplifiers, the cascaded IIP3, 2RF - 2LO rejection, and NF performance is typically +25.6dBm, 66dBc, and 9.8dB, respectively. Differential IF Output Amplifiers The MAX9995 mixers have an IF frequency range of 40MHz to 350MHz. The differential, open-collector IF output ports require external pullup inductors to VCC. Note that these differential outputs are ideal for providing enhanced 2RF - 2LO rejection performance. Singleended IF applications require a 4:1 balun to transform the 200Ω differential output impedance to a 50Ω singleended output. After the balun, VSWR is typically 1.5:1. Applications Information Input and Output Matching The RF and LO inputs are internally matched to 50Ω. No matching components are required. Return loss at each RF port is typically 14dB over the entire input range (1700MHz to 2700MHz), and return loss at the LO ports is typically 18dB (1400MHz to 2000MHz). RF and LO inputs require only DC-blocking capacitors for interfacing. The IF output impedance is 200Ω (differential). For evaluation, an external low-loss 4:1 (impedance ratio) balun transforms this impedance down to a 50Ω singleended output (see the Typical Application Circuit). Bias Resistors Bias currents for the LO buffer and the IF amplifier are optimized by fine tuning the resistors (R1, R2, R4, and R5). If reduced current is required at the expense of performance, contact the factory. If the ±1% bias resistor values are not readily available, substitute standard ±5% values. ______________________________________________________________________________________ Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer with LO Buffer/Switch Layout Considerations A properly designed PCB is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin traces directly to the exposed pad under the package. The PCB exposed pad MUST be connected to the ground plane of the PCB. It is suggested that multiple vias be used to connect this pad to the lower-level ground planes. This method provides a good RF/thermal-conduction path for the device. Solder the exposed pad on the bottom of the device package to the PCB. The MAX9995 evaluation kit can be used as a reference for board layout. Gerber files are available upon request at www.maxim-ic.com. Power-Supply Bypassing Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass each VCC pin with a capacitor as close as possible to the pin ( Typical Application Circuit). Exposed Pad RF/Thermal Considerations The exposed pad (EP) of the MAX9995’s 36-pin TQFNEP package provides a low thermal-resistance path to the die. It is important that the PCB on which the MAX9995 is mounted be designed to conduct heat from the EP. In addition, provide the EP with a lowinductance path to electrical ground. The EP MUST be soldered to a ground plane on the PCB, either directly or through an array of plated via holes. Table 1. Component Values COMPONENT VALUE DESCRIPTION C1, C8 4pF C2, C7 10pF Microwave capacitors (0402) Microwave capacitors (0402) C3, C6 0.033µF Microwave capacitors (0603) C4, C5, C14, C16 22pF Microwave capacitors (0402) C9, C13, C15, C17, C18 0.01µF Microwave capacitors (0402) C10, C11, C12, C19, C20, C21 150pF Microwave capacitors (0603) L1, L2, L4, L5 330nH Wire-wound high-Q inductors (0805) L3, L6 10nH Wire-wound high-Q inductors (0603) R1, R4 1.21kΩ ±1% resistors (0402) R2, R5 392Ω ±1% resistors (0402) R3, R6 10Ω ±1% resistors (1206) T1, T2 4:1 (200:50) IF baluns Chip Information PROCESS: SiGe BiCMOS Package Information For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO. 36 TQFN-EP T3666+2 21-0141 90-0049 ______________________________________________________________________________________ 11 MAX9995 INDEXTM and INDEXTD Inductors Short INDEXTM and INDEXTD to ground using 0Ω resistors. For applications requiring improved RF-to-IF and LO-to-IF isolation, use 10nH inductors (L3 and L6) in place of the 0Ω resistors. However, to ensure stable operation, the mixer IF ports must be presented with low common-mode load impedance. Contact the factory for details. Since approximately 100mA flows through INDEXTM and INDEXTD, it is important to use low-DCR wire-wound inductors. Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer with LO Buffer/Switch MAX9995 Typical Application Circuit C19 T1 L1 VCC IF MAIN OUTPUT C21 R3 L2 4:1 R1 C20 VCC C1 RFMAIN TAPMAIN C3 C2 GND VCC VCC C4 GND VCC VCC C5 GND C6 C7 TAPDIV RFDIV RF DIV INPUT C17 28 N.C. LO_ADJ_M R2 29 30 31 VCC IND_EXTM IFM32 IFM+ 33 GND 34 IFM_SET 35 36 VCC C18 RF MAIN INPUT VCC L3 C16 27 1 MAX9995 2 26 3 25 4 24 5 23 22 6 21 7 EXPOSED PAD 8 20 19 9 LO2 LO2 GND GND GND LOSEL LO SELECT GND VCC VCC C15 GND LO1 LO1 C14 18 N.C. 17 LO_ADJ_D VCC 16 15 14 IFD- 13 IFD+ 12 GND 11 R4 IND_EXTD C9 IFD_SET VCC VCC 10 C8 R5 VCC C13 L6 C11 T2 L5 VCC C12 R6 IF DIV OUTPUT L4 4:1 C10 12 ______________________________________________________________________________________ Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer with LO Buffer/Switch REVISION NUMBER REVISION DATE DESCRIPTION 0 8/04 Initial release 1 3/11 Updated the band coverage throughout the data sheet PAGES CHANGED — 1–13 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 13 © 2011 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc. MAX9995 Revision History