19-0564; Rev 0; 7/06 KIT ATION EVALU ABLE AVAIL High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod Features The MAX2023 low-noise, high-linearity, direct upconversion/downconversion quadrature modulator/demodulator is designed for single and multicarrier 1500MHz to 2300MHz DCS 1800/PCS 1900 EDGE, cdma2000 ® , WCDMA, and PHS/PAS base-station applications. Direct conversion architectures are advantageous since they significantly reduce transmitter or receiver cost, part count, and power consumption as compared to traditional IF-based double-conversion systems. In addition to offering excellent linearity and noise performance, the MAX2023 also yields a high level of component integration. This device includes two matched passive mixers for modulating or demodulating in-phase and quadrature signals, two LO mixer amplifier drivers, and an LO quadrature splitter. On-chip baluns are also integrated to allow for single-ended RF and LO connections. As an added feature, the baseband inputs have been matched to allow for direct interfacing to the transmit DAC, thereby eliminating the need for costly I/Q buffer amplifiers. The MAX2023 operates from a single +5V supply. It is available in a compact 36-pin thin QFN package (6mm x 6mm) with an exposed paddle. Electrical performance is guaranteed over the extended -40°C to +85°C temperature range. o 1500MHz to 2300MHz RF Frequency Range o Scalable Power: External Current-Setting Resistors Provide Option for Operating Device in Reduced-Power/Reduced-Performance Mode o 36-Pin, 6mm x 6mm TQFN Provides High Isolation in a Small Package Modulator Operation: o Meets GSM Spurious Emission of -75dBc at 600kHz Offset at POUT = +6dBm o +23.5dBm Typical OIP3 o +61dBm Typical OIP2 o +16dBm Typical OP1dB o -54dBm Typical LO Leakage o 48dBc Typical Sideband Suppression o -165dBc/Hz Output Noise Density o Broadband Baseband Input of 450MHz Allows a Direct Launch DAC Interface, Eliminating the Need for Costly I/Q Buffer Amplifiers o DC-Coupled Input Allows Ability for Offset Voltage Control Demodulator Operation: o +38dBm Typical IIP3 o +59dBm Typical IIP2 o +30dBm Typical IP1dB o 9.5dB Typical Conversion Loss o 9.6dB Typical NF o 0.025dB Typical I/Q Gain Imbalance o 0.56° I/Q Typical Phase Imbalance Applications Single-Carrier DCS 1800/PCS 1900 EDGE Base Stations Single and Multicarrier WCDMA/UMTS Base Stations Single and Multicarrier cdmaOne™ and cdma2000 Base Stations Predistortion Transmitters and Receivers Ordering Information PHS/PAS Base Stations TEMP RANGE PINPACKAGE -40°C to +85°C 36 Thin QFN-EP* (6mm x 6mm) T3666-2 MAX2023ETX-T -40°C to +85°C 36 Thin QFN-EP* (6mm x 6mm) T3666-2 Video-on-Demand (VOD) and DOCSIS Compliant Edge QAM Modulation MAX2023ETX+ -40°C to +85°C 36 Thin QFN-EP* (6mm x 6mm) T3666-2 Cable Modem Termination Systems (CMTS) MAX2023ETX+T -40°C to +85°C 36 Thin QFN-EP* (6mm x 6mm) T3666-2 Fixed Broadband Wireless Access PART Military Systems Microwave Links Digital and Spread-Spectrum Communication Systems cdma2000 is a registered trademark of Telecommunications Industry Association. cdmaOne is a trademark of CDMA Development Group. MAX2023ETX PKG CODE *EP = Exposed paddle. +Denotes lead-free package. T = Tape-and-reel package. _______________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX2023 General Description MAX2023 High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod ABSOLUTE MAXIMUM RATINGS VCC_ to GND ........................................................-0.3V to +5.5V BBI+, BBI-, BBQ+, BBQ- to GND..................-4V to (VCC + 0.3V) LO, RF to GND Maximum Current ......................................30mA RF Input Power ...............................................................+30dBm Baseband Differential I/Q Input Power ..........................+20dBm LO Input Power...............................................................+10dBm RBIASLO1 Maximum Current .............................................10mA RBIASLO2 Maximum Current .............................................10mA RBIASLO3 Maximum Current .............................................10mA θJA (without air flow) ..........................................…………34°C/W θJA (2.5m/s air flow) .........................................................28°C/W θJC (junction to exposed paddle) ...................................8.5°C/W Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering 10s, leaded) .....................+245°C Lead Temperature (soldering 10s, lead free) ..................+260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (MAX2023 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q inputs terminated into 100Ω differential, LO input terminated into 50Ω, RF output terminated into 50Ω, 0V common-mode input, R1 = 432Ω, R2 = 562Ω, R3 = 300Ω, TC = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +5V, TC = +25°C, unless otherwise noted.) (Note 1) PARAMETER CONDITIONS Supply Voltage Supply Current (Note 2) MIN TYP MAX UNITS 4.75 5.00 5.25 V 255 295 345 mA AC ELECTRICAL CHARACTERISTICS (Modulator) (MAX2023 Typical Application Circuit, when operated as a modulator, VCC = +4.75V to +5.25V, GND = 0V, I/Q differential inputs driven from a 100Ω DC-coupled source, 0V common-mode input, 50Ω LO and RF system impedance, R1 = 432Ω, R2 = 562Ω, R3 = 300Ω, TC = -40°C to +85°C. Typical values are at VCC = +5V, VBBI = VBBQ = 2.66VP-P differential, fIQ = 1MHz, PLO = 0dBm, TC = +25°C, unless otherwise noted.) (Note 1) PARAMETER CONDITIONS MIN TYP MAX UNITS BASEBAND INPUT Baseband Input Differential Impedance fI/Q = 1MHz BB Common-Mode Input Voltage Range VBBI = VBBQ = 1VP-P differential Baseband 0.5dB Bandwidth 55 Ω ±3.5 V 450 MHz LO INPUT LO Input Frequency Range 1500 LO Input Drive -3 LO Input Return Loss 15 2300 MHz +3 dBm dB RF OUTPUT fLO = 1750MHz +24.2 fLO = 1850MHz +23.5 fLO = 1950MHz +22 Output IP3 POUT = 0dBm, fBB1 = 1.8MHz, fBB2 = 1.9MHz Output IP2 POUT = 0dBm, fBB1 = 1.8MHz, fBB2 = 1.9MHz, fLO = 1850MHz Output P1dB Output Power 2 CW tone (Note 3) +61 fLO = 1750MHz +15.9 fLO = 1850MHz +14.3 fLO = 1950MHz +12.5 +5.6 ________________________________________________________________________________________________ dBm dBm dBm dBm High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod (MAX2023 Typical Application Circuit, when operated as a modulator, VCC = +4.75V to +5.25V, GND = 0V, I/Q differential inputs driven from a 100Ω DC-coupled source, 0V common-mode input, 50Ω LO and RF system impedance, R1 = 432Ω, R2 = 562Ω, R3 = 300Ω, TC = -40°C to +85°C. Typical values are at VCC = +5V, VBBI = VBBQ = 2.66VP-P differential, fIQ = 1MHz, PLO = 0dBm, TC = +25°C, unless otherwise noted.) (Note 1) Output Power Variation Over Temperature POUT = +5.6dBm, fI/Q = 100kHz, TC = -40°C to +85°C 0.25 dB Output-Power Flatness fLO = 1850MHz, PRF flatness for fLO swept over ±50MHz range 0.2 dB RF Return Loss fLO = 1850MHz 17 dB Single Sideband Rejection No external calibration POUT = +6dBm, fLO = 1850MHz, EDGE input Spurious Emissions Error Vector Magnitude EDGE input Output Noise Density (Note 4) Output Noise Floor POUT = 0dBm (Note 5) Un-nulled, baseband inputs terminated in 50Ω LO Leakage fLO = 1750MHz 51 fLO = 1850MHz 48 fLO = 1950MHz 48 200kHz offset -37.2 400kHz offset -71.4 600kHz offset -84.7 1.2MHz offset -85 RMS 0.67 Peak 1.5 dBc dBc/ 30kHz % -174 dBm/Hz -165 dBm/Hz fLO = 1750MHz -59 fLO = 1850MHz -54 fLO = 1950MHz -48 dBm AC ELECTRICAL CHARACTERISTICS (Demodulator) (MAX2023 Typical Application Circuit when operated as a demodulator, VCC = +4.75V to +5.25V, GND = 0V, 50Ω LO and RF system impedance, R1 = 432Ω, R2 = 562Ω, R3 = 300Ω, TC = -40°C to +85°C. Typical values are at VCC = +5V, PRF = 0dBm, fBB = 1MHz, PLO = 0dBm, fLO = 1850MHz, TC = +25°C, unless otherwise noted.) (Note 1) PARAMETER CONDITIONS MIN TYP MAX UNITS 2300 MHz RF INPUT RF Input Frequency 1500 Conversion Loss fBB = 25MHz Noise Figure 9.5 dB 9.6 dB 20.3 dB Noise Figure Underblocking Conditions fBLOCKER = 1950MHz, PBLOCKER = +11dBm, fRF = 1850MHz (Note 6) Input Third-Order Intercept Point fRF1 = 1875MHz, fRF2 = 1876MHz, fLO = 1850MHz, PRF = PLO = 0dBm, fIM3 = 24MHz 38 dBm Input Second-Order Intercept Point fRF1 = 1875MHz, fRF2 = 1876MHz, fLO = 1850MHz, PRF = PLO = 0dBm, fIM2 = 51MHz 59 dBm Input 1dB Compression Point fBB = 25MHz 29.7 dBm I/Q Gain Mismatch fBB = 1MHz 0.025 dB I/Q Phase Mismatch fBB = 1MHz 0.56 Degrees _________________________________________________________________________________________________ 3 MAX2023 AC ELECTRICAL CHARACTERISTICS (Modulator) (continued) TC is the temperature on the exposed paddle. Guaranteed by production test. VI/Q = 2.66VP-P differential CW input. No baseband drive input. Measured with the baseband inputs terminated in 50Ω. At low output power levels, the output noise density is equal to the thermal noise floor. See Output Noise Density vs. Output Power plots in Typical Operating Characteristics. Note 5: The output noise vs. POUT curve has the slope of LO noise (Ln dBc/Hz) due to reciprocal mixing. Measured at 10MHz offset from carrier. Note 6: The LO noise (L = 10(Ln/10)), determined from the modulator measurements can be used to deduce the noise figure underblocking at operating temperature (TP in Kelvin), fBLOCK = 1 + (LCN - 1) TP / TO + LPBLOCK / (1000kTO), where TO = 290K, PBLOCK in mW, k is Boltzmann’s constant = 1.381 x 10(-23) J/K, and LCN = 10(LC/10), LC is the conversion loss. Noise figure underblocking in dB is NFBLOCK = 10 x log (fBLOCK). Refer to Application Note 3632. Note 1: Note 2: Note 3: Note 4: Typical Operating Characteristics (MAX2023 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q differential inputs driven from a 100Ω DC-coupled source (modulator), VBBI = VBBQ = 2.6VP-P differential (modulator), PRF = +6dBm (demodulator), I/Q differential output drives 50Ω differential load (demodulator), 0V common-mode input/output, PLO = 0dBm, 1500MHz ≤ fLO ≤ 2300MHz, 50Ω LO and RF system impedance, R1 = 432Ω, R2 = 562Ω, R3 = 300Ω, TC = -40°C to +85°C. Typical values are at VCC = +5V, fLO = 1850MHz, TC = +25°C, unless otherwise noted.) VCC = 5V VCC = 5.25V 320 300 280 260 VCC = 4.75V 240 PLO = 0dBm 55 50 45 40 PLO = +3dBm 35 30 -15 10 35 TEMPERATURE (°C) 60 1.5 85 1.6 MODULATOR SINGLE-SIDEBAND SUPPRESSION vs. LO FREQUENCY 65 TC = +85°C 60 50 45 TC = -40°C 40 35 TC = +25°C 30 28 26 22 20 TC = -40°C 18 TC = +85°C 16 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 2.3 VCC = 4.75V 35 30 VCC = 5.25V 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 2.3 30 f1 = 1.8MHz f2 = 1.9MHz 28 26 24 22 20 18 VCC = 4.75V, 5V, 5.25V 16 14 f1 = 1.8MHz f2 = 1.9MHz 12 10 10 1.5 40 2.3 24 12 20 45 MODULATOR OUTPUT IP3 vs. LO FREQUENCY TC = +25°C 14 25 2.2 30 OUTPUT IP3 (dBm) 55 50 MODULATOR OUTPUT IP3 vs. LO FREQUENCY MAX2023 toc04 70 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) OUTPUT IP3 (dBm) -40 55 20 20 200 VCC = 5V 60 25 25 220 4 65 MAX2023 toc03 60 MAX2023 toc06 340 70 PLO = -3dBm MAX2023 toc05 SUPPLY CURRENT (mA) 360 70 65 SIDEBAND REJECTION (dBc) 380 MODULATOR SINGLE-SIDEBAND SUPPRESSION vs. LO FREQUENCY SIDEBAND REJECTION (dBc) MAX2023 toc01 400 MODULATOR SINGLE-SIDEBAND SUPPRESSION vs. LO FREQUENCY MAX2023 toc02 SUPPLY CURRENT vs. TEMPERATURE (TC) SIDEBAND REJECTION (dBc) MAX2023 High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 2.3 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) ________________________________________________________________________________________________ 2.2 2.3 High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod PLO = +3dBm PLO = -3dBm 18 80 16 24.5 24.0 23.5 10 65 60 TC = -40°C 2.2 2.3 -3.5 -2.5 -1.5 -0.5 0.5 1.5 2.5 I/Q COMMON-MODE VOLTAGE (V) MODULATOR OUTPUT IP2 vs. LO FREQUENCY 1.5 3.5 75 PLO = 0dBm 75 68 67 65 60 OUTPUT IP2 (dBm) OUTPUT IP2 (dBm) VCC = 5V 70 65 PLO = +3dBm 60 55 f1 = 1.8MHz f2 = 1.9MHz 50 f1 = 1.8MHz f2 = 1.9MHz 2.2 2.3 MODULATOR OUTPUT POWER vs. INPUT POWER 20 16 VCC = 4.75V, 5V, 5.25V 12 10 8 6 18 16 OUTPUT POWER (dBm) 18 f1 = 1.8MHz f2 = 1.9MHz 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 -3.5 2.3 PLO = 0dBm 14 12 10 PLO = -3dBm 8 6 4 4 2 2 0 PLO = +3dBm 3.5 8 7 TC = -40°C 6 5 TC = +25°C 4 TC = +85°C 3 2 0 10 12 14 16 18 20 22 24 26 28 30 INPUT POWER (dBm) -2.5 -1.5 -0.5 0.5 1.5 2.5 I/Q COMMON-MODE VOLTAGE (V) MODULATOR OUTPUT POWER vs. LO FREQUENCY MODULATOR OUTPUT POWER vs. INPUT POWER MAX2023 toc13 20 63 60 1.5 OUTPUT POWER (dBm) 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) MAX2023 toc14 1.6 64 61 50 1.5 65 62 VCC = 4.75V 55 2.3 66 PLO = -3dBm 70 2.2 MAX2023 toc12 80 MAX2023 toc10 VCC = 5.25V 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) MODULATOR OUTPUT IP2 vs. I/Q COMMON-MODE VOLTAGE MODULATOR OUTPUT IP2 vs. LO FREQUENCY 80 1.6 MAX2023 toc15 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) MAX2023 toc11 1.6 f1 = 1.8MHz f2 = 1.9MHz 50 22.0 1.5 OUTPUT IP2 (dBm) 70 55 22.5 12 OUTPUT POWER (dBm) TC = +25°C 23.0 14 14 TC = +85°C 75 25.0 22 20 25.5 OUTPUT IP3 (dBm) OUTPUT IP3 (dBm) 24 f1 = 1.8MHz f2 = 1.9MHz OUTPUT IP2 (dBm) PLO = 0dBm 26 26.0 MAX2023 toc08 f1 = 1.8MHz f2 = 1.9MHz MAX2023 toc07 30 28 MODULATOR OUTPUT IP2 vs. LO FREQUENCY MODULATOR OUTPUT IP3 vs. I/Q COMMON-MODE VOLTAGE MAX2023 toc09 MODULATOR OUTPUT IP3 vs. LO FREQUENCY 10 12 14 16 18 20 22 24 26 28 30 INPUT POWER (dBm) 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 _________________________________________________________________________________________________ 2.3 5 MAX2023 Typical Operating Characteristics (continued) (MAX2023 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q differential inputs driven from a 100Ω DC-coupled source (modulator), VBBI = VBBQ = 2.6VP-P differential (modulator), PRF = +6dBm (demodulator), I/Q differential output drives 50Ω differential load (demodulator), 0V common-mode input/output, PLO = 0dBm, 1500MHz ≤ fLO ≤ 2300MHz, 50Ω LO and RF system impedance, R1 = 432Ω, Typical Operating Characteristics (continued) (MAX2023 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q differential inputs driven from a 100Ω DC-coupled source (modulator), VBBI = VBBQ = 2.6VP-P differential (modulator), PRF = +6dBm (demodulator), I/Q differential output drives 50Ω differential load (demodulator), 0V common-mode input/output, PLO = 0dBm, 1500MHz ≤ fLO ≤ 2300MHz, 50Ω LO and RF system impedance, R1 = 432Ω, -9 -10 -11 -12 -60 -70 PRF = -7dBm -80 PRF = -1dBm, LO LEAKAGE NULLED AT TA = +25°C -50 TC = -40°C -60 -70 -80 -90 PRF = -1dBm TC = +25°C -100 -100 20 30 40 50 60 BASEBAND FREQUENCY (MHz) 70 1.80 MODULATOR LO LEAKAGE vs. LO FREQUENCY -70 -80 PLO = +3dBm -90 -160 -165 TC = +85°C -170 -175 PLO = 0dBm -100 -180 1.80 1.82 1.84 1.86 1.88 LO FREQUENCY (GHz) 1.90 TC = -40°C -23 -18 DEMODULATOR CONVERSION LOSS vs. LO FREQUENCY 11.5 INPUT IP3 (dBm) 10.0 9.5 35 33 PLO = -3dBm 2.2 -23 -18 2.3 -13 -8 -3 2 OUTPUT POWER (dBm) 7 12 45 43 TC = +25°C 41 TC = +85°C 37 35 33 31 TC = -40°C 29 f1 = fLO + 25MHz f2 = fLO + 26MHz f1 = fLO + 25MHz f2 = fLO + 26MHz 27 25 25 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) -175 39 37 27 8.0 1.6 PLO = +3dBm -170 DEMODULATOR INPUT IP3 vs. LO FREQUENCY PLO = +3dBm 29 TC = -40°C 1.5 -165 12 31 TC = +25°C 8.5 7 PLO = 0dBm 39 10.5 9.0 PLO = 0dBm -160 -180 -13 -8 -3 2 OUTPUT POWER (dBm) 43 41 1.90 TC = +25°C 45 TC = +85°C 11.0 PLO = -3dBm -155 DEMODULATOR INPUT IP3 vs. LO FREQUENCY MAX2023 toc22 12.0 1.84 1.86 1.88 LO FREQUENCY (GHz) -150 OUTPUT NOISE DENSITY (dBm/Hz) -60 -155 1.82 MODULATOR OUTPUT NOISE DENSITY vs. OUTPUT POWER INPUT IP3 (dBm) -50 1.80 1.90 -150 OUTPUT NOISE DENSITY (dBm/Hz) PRF = -1dBm, LO LEAKAGE NULLED AT PLO = 0dBm PLO = -3dBm 1.84 1.86 1.88 LO FREQUENCY (GHz) MODULATOR OUTPUT NOISE DENSITY vs. OUTPUT POWER MAX2023 toc19 -40 1.82 MAX2023 toc20 10 MAX2023 toc23 0 MAX2023 toc21 -15 -90 LO LEAKAGE NULLED AT PRF = -1dBm MAX2023 toc24 fLO - fBB -14 LO LEAKAGE (dBm) -40 TC = +85°C -13 6 PRF = +5dBm LO LEAKAGE (dBm) -8 -50 LO LEAKAGE (dBm) OUTPUT POWER (dBm) fLO + fBB PRF = -40dBm MAX2023 toc17 PI/Q-COMBINED = 0dBm -7 -40 MAX2023 toc16 -5 -6 MODULATOR LO LEAKAGE vs. LO FREQUENCY MODULATOR LO LEAKAGE vs. LO FREQUENCY MAX2023 toc18 MODULATOR OUTPUT POWER vs. BASEBAND FREQUENCY CONVERSION LOSS (dB) MAX2023 High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 2.3 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) ________________________________________________________________________________________________ 2.2 2.3 High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod DEMODULATOR I/Q PHASE IMBALANCE vs. LO FREQUENCY TC = +85°C 65 60 TC = -40°C PLO = +3dBm 3 PLO = 0dBm 2 PLO = -3dBm 1 f1 = fLO + 25MHz f2 = fLO + 26MHz 55 4 PLO = -6dBm 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 1.5 2.3 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 PLO = -3dBm PLO = -6dBm 22 PLO = -3dBm 0.02 PLO = 0dBm 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 10 15 RETURN LOSS (dB) PLO = +3dBm PLO = 0dBm 20 PLO = -6dBm 0.03 2.2 2.3 24 26 MAX2023 toc29 14 18 0.04 RF PORT RETURN LOSS 12 16 PLO = +3dBm 0.05 0 2.3 LO PORT RETURN LOSS 10 MAX2023 toc28 1.6 RETURN LOSS (dB) 1.5 0.06 0.01 0 50 MAX2023 toc27 5 70 0.07 MAX2023 toc26 75 I/Q PHASE IMBALANCE (deg) TC = +25°C INPUT IP2 (dBm) 6 MAX2023 toc25 80 DEMODULATOR I/Q AMPLITUDE IMBALANCE vs. LO FREQUENCY I/Q AMPLITUDE IMBALANCE (dB) DEMODULATOR INPUT IP2 vs. LO FREQUENCY 20 25 PLO = -6dBm, -3dBm, 0dBm, +3dBm 30 35 28 40 30 1.5 1.6 1.7 1.8 1.9 2.0 2.1 LO FREQUENCY (GHz) 2.2 2.3 1.5 1.6 1.7 1.8 1.9 2.0 2.1 RF FREQUENCY (GHz) 2.2 2.3 _________________________________________________________________________________________________ 7 MAX2023 Typical Operating Characteristics (continued) (MAX2023 Typical Application Circuit, VCC = +4.75V to +5.25V, GND = 0V, I/Q differential inputs driven from a 100Ω DC-coupled source (modulator), VBBI = VBBQ = 2.6VP-P differential (modulator), PRF = +6dBm (demodulator), I/Q differential output drives 50Ω differential load (demodulator), 0V common-mode input/output, PLO = 0dBm, 1500MHz ≤ fLO ≤ 2300MHz, 50Ω LO and RF system impedance, R1 = 432Ω, R2 = 562Ω, R3 = 300Ω, TC = -40°C to +85°C. Typical values are at VCC = +5V, fLO = 1850MHz, TC = +25°C, unless otherwise noted.) High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod MAX2023 Pin Description PIN NAME 1, 5, 9–12, 14, 16–19, 22, 24, 27–30, 32, 34, 35, 36 2 3 4 6 7 8 13 15 20 21 23 25 26 31 33 EP GND FUNCTION Ground RBIASLO3 3rd LO Amplifier Bias. Connect a 300Ω resistor to ground. LO Input Buffer Amplifier Supply Voltage. Bypass to GND with 22pF and 0.1µF VCCLOA capacitors as close to the pin as possible. LO Local Oscillator Input. 50Ω input impedance. Requires a DC-blocking capacitor. RBIASLO1 1st LO Input Buffer Amplifier Bias. Connect a 432Ω resistor to ground. N.C. No Connection. Leave unconnected. RBIASLO2 2nd LO Amplifier Bias. Connect a 562Ω resistor to ground. I-Channel 1st LO Amplifier Supply Voltage. Bypass to GND with 22pF and 0.1µF VCCLOI1 capacitors as close to the pin as possible. I-Channel 2nd LO Amplifier Supply Voltage. Bypass to GND with 22pF and 0.1µF VCCLOI2 capacitors as close to the pin as possible. BBI+ Baseband In-Phase Noninverting Port BBIBaseband In-Phase Inverting Port RF RF Port. This port is matched to 50Ω. Requires a DC-blocking capacitor. BBQBaseband Quadrature Inverting Port BBQ+ Baseband Quadrature Noninverting Port Q-Channel 2nd LO Amplifier Supply Voltage. Bypass to GND with 22pF and 0.1µF VCCLOQ2 capacitors as close to the pin as possible. Q-Channel 1st LO Amplifier Supply Voltage. Bypass to GND with 22pF and 0.1µF VCCLOQ1 capacitors as close to the pin as possible. Exposed Ground Paddle. The exposed paddle MUST be soldered to the ground plane GND using multiple vias. Detailed Description The MAX2023 is designed for upconverting differential in-phase (I) and quadrature (Q) inputs from baseband to a 1500MHz to 2300MHz RF frequency range. The device can also be used as a demodulator, downconverting an RF input signal directly to baseband. Applications include single and multicarrier 1500MHz to 2300MHz DCS/PCS EDGE, UMTS/WCDMA, cdma2000, and PHS/PAS base stations. Direct conversion architectures are advantageous since they significantly reduce transmitter or receiver cost, part count, and power consumption as compared to traditional IF-based double-conversion systems. The MAX2023 integrates internal baluns, an LO buffer, a phase splitter, two LO driver amplifiers, two matched double-balanced passive mixers, and a wideband quadrature combiner. The MAX2023’s high-linearity mixers, in conjunction with the part’s precise in-phase and quadrature channel matching, enable the device to possess excellent dynamic range, ACLR, 1dB compression point, and LO and sideband suppression characteristics. These features make the MAX2023 ideal for single-carrier GSM and multicarrier WCDMA operation. 8 LO Input Balun, LO Buffer, and Phase Splitter The MAX2023 requires a single-ended LO input, with a nominal power of 0dBm. An internal low-loss balun at the LO input converts the single-ended LO signal to a differential signal at the LO buffer input. In addition, the internal balun matches the buffer’s input impedance to 50Ω over the entire band of operation. The output of the LO buffer goes through a phase splitter, which generates a second LO signal that is shifted by 90° with respect to the original. The 0° and 90° LO signals drive the I and Q mixers, respectively. LO Driver Following the phase splitter, the 0° and 90° LO signals are each amplified by a two-stage amplifier to drive the I and Q mixers. The amplifier boosts the level of the LO signals to compensate for any changes in LO drive levels. The two-stage LO amplifier allows a wide input power range for the LO drive. The MAX2023 can tolerate LO level swings from -3dBm to +3dBm. ________________________________________________________________________________________________ High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod The I and Q signals directly modulate the 0° and 90° LO signals and are upconverted to the RF frequency. The outputs of the I and Q mixers are combined through a balun to produce a singled-ended RF output. Applications Information LO Input Drive The LO input of the MAX2023 is internally matched to 50Ω, and requires a single-ended drive at a 1500MHz to 2300MHz frequency range. An integrated balun converts the singled-ended input signal to a differential signal at the LO buffer differential input. An external DC-blocking capacitor is the only external part required at this interface. The LO input power should be within the -3dBm to +3dBm range. An LO input power of 0dBm is recommended for best overall peformance. MAX5895 dual interpolating DAC. These DACs have ground-referenced differential current outputs. Typical termination of each DAC output into a 50Ω load resistor to ground, and a 10mA nominal DC output current results in a 0.5V common-mode DC level into the modulator I/Q inputs. The nominal signal level provided by the DACs will be in the -12dBm range for a single CDMA or WCDMA carrier, reducing to -18dBm per carrier for a four-carrier application. The I/Q input bandwidth is greater than 450MHz at -0.5dB response. The direct connection of the DAC to the MAX2023 ensures the maximum signal fidelity, with no performance-limiting baseband amplifiers required. The DAC output can be passed through a lowpass filter to remove the image frequencies from the DAC’s output response. The MAX5895 dual interpolating DAC can be operated at interpolation rates up to x8. This has the benefit of moving the DAC image frequencies to a very high, remote frequency, easing the design of the baseband filters. The DAC’s output noise floor and interpolation filter stopband attenuation are sufficiently good to ensure that the 3GPP noise floor requirement is met for large frequency offsets, 60MHz for example, with no filtering required on the RF output of the modulator. Figure 1 illustrates the ease and efficiency of interfacing the MAX2023 with a Maxim DAC, in this case the MAX5895 dual 16-bit interpolating-modulating DAC. Baseband I/Q Input Drive Drive the MAX2023 I and Q baseband inputs differentially for best performance. The baseband inputs have a 50Ω differential input impedance. The optimum source impedance for the I and Q inputs is 100Ω differential. This source impedance achieves the optimal signal transfer to the I and Q inputs, and the optimum output RF impedance match. The MAX2023 can accept input power levels of up to +20dBm on the I and Q inputs. Operation with complex waveforms, such as CDMA carriers or GSM signals, utilize input power levels that are far lower. This lower power operation is made necessary by the high peak-to-average ratios of these complex waveforms. The peak signals must be kept below the compression level of the MAX2023. The input common-mode voltage should be confined to the -3.5V to +3.5V DC range. WCDMA Transmitter Applications The MAX2023 is designed to interface directly with Maxim high-speed DACs. This generates an ideal total transmitter lineup, with minimal ancillary circuit elements required for widespread applications. Such DACs include the MAX5875 series of dual DACs, and the MAX5895 DUAL 16-BIT INTERP DAC MAX2023 RF MODULATOR 50Ω BBI FREQ 50Ω I/Q GAIN AND OFFSET ADJUST LO 0° 90° ∑ 50Ω BBQ FREQ 50Ω Figure 1. MAX5895 DAC Interfaced with MAX2023 for cdma2000 and WCDMA Base Stations _________________________________________________________________________________________________ 9 MAX2023 I/Q Modulator The MAX2023 modulator is composed of a pair of matched double-balanced passive mixers and a balun. The I and Q differential baseband inputs accept signals from DC to 450MHz with differential amplitudes up to 4VP-P. The wide input bandwidths allow operation of the MAX2023 as either a direct RF modulator or as an image-reject mixer. The wide common-mode compliance range allows for direct interface with the baseband DACs. No active buffer circuitry is required between the baseband DACs and the MAX2023 for wideband applications. MAX2023 High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod MAX5873 DUAL DAC MAX4395 QUAD AMP MAX2021/MAX2023 MAX2058/MAX2059 RF DIGITAL VGAs I 12 0° 90° 31dB ∑ 17dB 31dB RFOUT Q SPI LOGIC 12 MAX9491 VCO + SYNTH 45, 80, OR 95MHz LO LOOPBACK Rx OFF OUT (FEEDS BACK INTO Rx CHAIN FRONT-END) SPI CONTROL Figure 2. Complete Transmitter Lineup for GSM/EDGE DCS/PCS-Band Base Stations The MAX5895 DAC has programmable gain and differential offset controls built in. These can be used to optimize the LO leakage and sideband suppression of the MAX2023 quadrature modulator. GSM Transmitter Applications The MAX2023 is an ideal modulator for a zero-IF (ZIF), single-carrier GSM transmitter. The device’s wide dynamic range enables a very efficient overall transmitter architecture. Figure 2 illustrates the exceptionally simple complete lineup for a high-performance GSM/EDGE transmitter. The single-carrier GSM transmit lineup generates baseband I and Q signals from a simple 12-bit dual DAC such as the MAX5873. The DAC clock rate can be a multiple of the GSM system clock rate of 13MHz. The ground-referenced outputs of the dual DAC are filtered by simple discrete element lowpass filters to attenuate both the DAC images and the noise floor. The I and Q baseband signals are then level shifted and amplified by a MAX4395 quad operational amplifier, configured as a differential input/output amplifier. This amplifier can deliver a baseband power level of greater than +15dBm to the MAX2023, enabling very high RF output power levels. The MAX2023 will deliver up to +5dBm for GSM vectors with full conformance to the required system specifications with large margins. The exceptionally low phase noise of the MAX2023 allows the cir10 cuit to meet the GSM system level noise requirements with no additional RF filters required, greatly simplifying the overall lineup. The output of the MAX2023 drives a MAX2059 RF VGA, which can deliver up to +15dBm of GSM carrier power and includes a very flexible digitally controlled attenuator with over 56dB of adjustment range. This accommodates the full static and dynamic power-control requirements, with extra range for lineup gain compensation. RF Output The MAX2023 utilizes an internal passive mixer architecture that enables the device to possess an exceptionally low-output noise floor. With such architectures, the total output noise is typically a power summation of the theoretical thermal noise (kTB) and the noise contribution from the on-chip LO buffer circuitry. As demonstrated in the Typical Operating Characteristics, the MAX2023’s output noise approaches the thermal limit of -174dBm/Hz for lower output power levels. As the output power increases, the noise level tracks the noise contribution from the LO buffer circuitry, which is approximately -165dBc/Hz. The I/Q input power levels and the insertion loss of the device determine the RF output power level. The input power is a function of the delivered input I and Q voltages to the internal 50Ω termination. For simple sinu- _______________________________________________________________________________________________ High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod become terminated in 25Ω (R/2). The RC network provides a path for absorbing the 2fLO and fLO leakage, while the inductor provides high impedance at fLO and 2fLO to help the diplexing process. External Diplexer RF Demodulator LO leakage at the RF port can be nulled to a level less than -80dBm by introducing DC offsets at the I and Q ports. However, this null at the RF port can be compromised by an improperly terminated I/Q IF interface. Care must be taken to match the I/Q ports to the driving DAC circuitry. Without matching, the LO’s second-order (2fLO) term may leak back into the modulator’s I/Q input port where it can mix with the internal LO signal to produce additional LO leakage at the RF output. This leakage effectively counteracts against the LO nulling. In addition, the LO signal reflected at the I/Q IF port produces a residual DC term that can disturb the nulling condition. As demonstrated in Figure 3, providing an RC termination on each of the I+, I-, Q+, Q- ports reduces the amount of LO leakage present at the RF port under varying temperature, LO frequency, and baseband termination conditions. See the Typical Operating Characteristics for details. Note that the resistor value is chosen to be 50Ω with a corner frequency 1 / (2πRC) selected to adequately filter the fLO and 2fLO leakage, yet not affecting the flatness of the baseband response at the highest baseband frequency. The common-mode fLO and 2fLO signals at I+/I- and Q+/Q- effectively see the RC networks and thus The MAX2023 can also be used as an RF demodulator, downconverting an RF input signal directly to baseband. The single-ended RF input accepts signals from 1500MHz to 2300MHz with power levels up to +30dBm. The passive mixer architecture produces a conversion loss of typically 9.5dB. The downconverter is optimized for high linearity and excellent noise performance, typically with a +38dBm IIP3, an input P1dB of +29.7dBm, and a 9.6dB noise figure. C = 2.2pF 50Ω I MAX2023 RF MODULATOR L = 11nH 50Ω C = 2.2pF LO 0° 90° ∑ 50Ω Q L = 11nH 50Ω A wide I/Q port bandwidth allows the port to be used as an image-reject mixer for downconversion to a quadrature IF frequency. The RF and LO inputs are internally matched to 50Ω. Thus, no matching components are required, and only DC-blocking capacitors are needed for interfacing. Power Scaling with Changes to the Bias Resistors Bias currents for the LO buffers are optimized by fine tuning resistors R1, R2, and R3. Maxim recommends using ±1%-tolerant resistors; however, standard ±5% values can be used if the ±1% components are not readily available. The resistor values shown in the Typical Application Circuit were chosen to provide peak performance for the entire 1500MHz to 2300MHz band. If desired, the current can be backed off from this nominal value by choosing different values for R1, R2, and R3. Contact the factory for additional details. Layout Considerations A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin traces directly to the exposed paddle under the package. The PC board exposed paddle MUST be connected to the ground plane of the PC board. It is suggested that multiple vias be used to connect this paddle to the lower level ground planes. This method provides a good RF/thermal conduction path for the device. Solder the exposed paddle on the bottom of the device package to the PC board. The MAX2023 evaluation kit can be used as a reference for board layout. Gerber files are available upon request at www.maxim-ic.com. C = 2.2pF Figure 3. Diplexer Network Recommended for DCS 1800/ PCS 1900 EDGE Transmitter Applications ________________________________________________________________________________________________ 11 MAX2023 soidal baseband signals, a level of 89mVP-P differential on the I and the Q inputs results in a -17dBm input power level delivered to the I and Q internal 50Ω terminations. This results in an RF output power of -26.6dBm. Power-Supply Bypassing Exposed Paddle RF/Thermal Considerations Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass all VCC_ pins with 22pF and 0.1µF capacitors placed as close to the pins as possible, with the smallest capacitor placed closest to the device. To achieve optimum performance, use good voltagesupply layout techniques. The MAX2023 has several RF processing stages that use the various VCC_ pins, and while they have on-chip decoupling, off-chip interaction between them may degrade gain, linearity, carrier suppression, and output power-control range. Excessive coupling between stages may degrade stability. The EP of the MAX2023’s 36-pin thin QFN-EP package provides a low thermal-resistance path to the die. It is important that the PC board on which the IC is mounted be designed to conduct heat from this contact. In addition, the EP provides a low-inductance RF ground path for the device. The exposed paddle (EP) MUST be soldered to a ground plane on the PC board either directly or through an array of plated via holes. An array of 9 vias, in a 3 x 3 array, is suggested. Soldering the pad to ground is critical for efficient heat transfer. Use a solid ground plane wherever possible. GND GND VCCLOQ1 GND VCCLOQ2 GND GND GND 36 35 34 33 32 31 30 29 28 1 5 RBIASLO1 6 N.C. 7 RBIASLO2 8 GND 9 Σ BIAS LO1 BIAS LO2 10 11 12 EP 13 14 15 16 17 18 GND GND 0° GND 4 GND LO 90° VCCLOI2 3 GND VCCLOA VCCLOI1 2 GND RBIASLO3 MAX2023 BIAS LO3 GND GND GND Pin Configuration/Functional Diagram GND MAX2023 High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod 27 GND 26 BBQ+ 25 BBQ- 24 GND 23 RF 22 GND 21 BBI- 20 BBI+ 19 GND THIN QFN 12 _______________________________________________________________________________________________ High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2300MHz Quadrature Mod/Demod C12 0.1µF 36 VCC C1 22pF VCCLOA C3 8pF LO LO GND RBIASLO1 R1 432Ω N.C. RBIASLO2 R2 562Ω GND 33 VCCLOQ2 GND 32 1 GND 28 29 27 MAX2023 BIAS LO3 2 GND GND 30 31 26 3 25 90° 4 24 0° 5 6 Σ 22 7 21 BIAS LO2 8 20 EP 9 19 10 GND VCC GND BBQ+ BBQGND Q+ QC9 2pF RF 23 RF BIAS LO1 11 GND 12 GND C5 0.1µF 13 14 GND C6 22pF 15 VCCLOI2 RBIASLO3 GND 34 35 VCCLOI1 GND C2 0.1µF GND GND R3 300Ω C11 0.1µF VCC C10 22pF C13 22pF VCCLOQ1 VCC 16 GND 17 GND C7 22pF GND BBIBBI+ II+ GND 18 GND C8 0.1µF VCC Table 1. Component List Referring to the Typical Application Circuit COMPONENT VALUE DESCRIPTION C1, C6, C7, C10, C13 22pF 22pF ±5%, 50V C0G ceramic capacitors (0402) C2, C5, C8, C11, C12 0.1µF 0.1µF ±10%, 16V X7R ceramic capacitors (0603) C3 8pF 8pF ±0.25%, 50V C0G ceramic capacitor (0402) C9 2pF R1 432Ω 432Ω ±1% resistor (0402) 2pF ±0.1pF, 50V C0G ceramic capacitor (0402) R2 562Ω 562Ω ±1% resistor (0402) R3 300Ω 300Ω ±1% resistor (0402) Chip Information PROCESS: SiGe BiCMOS Package Information For the latest package outline information, go to www.maxim-ic.com/packages. Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 13 © 2006 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc. JACKSON MAX2023 Typical Application Circuit