a Octal 14-Bit, Parallel Input, Voltage-Output DAC AD7841 GENERAL DESCRIPTION FEATURES Eight 14-Bit DACs in One Package Voltage Outputs Offset Adjust for Each DAC Pair Reference Range of ⴞ5 V Maximum Output Voltage Range of ⴞ10 V ⴞ15 V ⴞ 10% Operation Clear Function to User-Defined Voltage 44-Lead MQFP Package The AD7841 contains eight 14-bit DACs on one monolithic chip. It has output voltages with a full-scale range of ± 10 V from reference voltages of ± 5 V. The AD7841 accepts 14-bit parallel loaded data from the external bus into one of the input registers under the control of the WR, CS and DAC channel address pins, A0–A2. The DAC outputs are updated on reception of new data into the DAC registers. All the outputs may be updated simultaneously by taking the LDAC input low. APPLICATIONS Automatic Test Equipment Process Control General Purpose Instrumentation Each DAC output is buffered with a gain-of-two amplifier into which an external DAC offset voltage can be inserted via the DUTGNDx pins. The AD7841 is available in a 44-lead MQFP package. FUNCTIONAL BLOCK DIAGRAM VCC VSS VREF(+) AB VDD VREF(–) AB DUTGND CD AD7841 14 DUTGND AB R INPUT 14 REG A DAC 14 REG A DAC A VOUTA R DB13 14 INPUT 14 REG B DAC REG B DAC B VOUTB R 14 INPUT 14 REG C DAC REG C 14 R DAC C VOUTC WR R 14 ADDRESS DECODE CS A1 R 14 DB0 A0 R 14 A2 INPUT 14 REG D DAC REG D 14 INPUT 14 REG E DAC REG E 14 INPUT 14 REG F DAC REG F 14 INPUT 14 REG G DAC REG G 14 INPUT 14 REG H DAC REG H 14 R DAC D VOUTD DAC E VOUTE LDAC 14 R R R R R R R R DAC F VOUTF 14 DAC G VOUTG 14 DAC H VOUTH GND VREF(+) VREF(–) GH GH VREF(+) VREF(–) CDEF CDEF CLR DUTGND EF DUTGND GH REV. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 1999 (VCC = +5 V ⴞ 5%; VDD = +15 V ⴞ 10%; VSS = –15 V ⴞ 10%; GND = DUTGND = 1 L L A = TMIN to TMAX, unless otherwise noted) AD7841–SPECIFICATIONS 0 V; R = 5 k⍀ and C = 50 pF to GND, T Parameter A B Units ACCURACY Resolution Relative Accuracy Differential Nonlinearity 14 ±4 –0.9/2 14 ±2 ±1 Bits LSB max LSB max Zero-Scale Error ±8 ±8 LSB max Full-Scale Error ±8 ±8 LSB max Gain Error Gain Temperature Coefficient 2 ±2 0.5 10 120 ±2 0.5 10 120 LSB typ ppm FSR/°C typ ppm FSR/°C max µV max See Terminology. Typically 75 µV REFERENCE INPUTS2 DC Input Impedance Input Current VREF(+) Range VREF(–) Range [VREF(+) – VREF(–)] 100 ±1 0/+5 –5/0 +2/+10 100 ±1 0/+5 –5/0 +2/+10 MΩ typ µA max V min/max V min/max V min/max DUTGND INPUTS2 DC Input Impedance Max Input Current Input Range3 60 ± 0.3 –2/+2 60 ± 0.3 –2/+2 kΩ typ mA typ V min/max VSS + 2.5 V to VDD – 2.5 V 15 5 50 0.5 V typ mA max kΩ min pF max Ω max 2.4 0.8 2.4 0.8 V min V max ±1 ± 10 10 ±1 ± 10 10 µA max µA max pF max +4.75/+5.25 +15 V ± 10% –15 V ± 10% +4.75/+5.25 +15 V ± 10% –15 V ± 10% V min/max V min/max V min/max For Specified Performance For Specified Performance For Specified Performance 90 90 0.5 10 10 90 90 0.5 10 10 dB typ dB typ mA max mA max mA max VINH = VCC, VINL = GND. Dynamic Current Outputs Unloaded. Typically 8 mA Outputs Unloaded. Typically 8 mA DC Crosstalk2 OUTPUT CHARACTERISTICS2 Output Voltage Swing VSS + 2.5 V to VDD – 2.5 V Short Circuit Current 15 Resistive Load 5 Capacitive Load 50 DC Output Impedance 0.5 DIGITAL INPUTS2 VINH, Input High Voltage VINL, Input Low Voltage IINH, Input Current @ +25°C TMIN to TMAX CIN, Input Capacitance POWER REQUIREMENTS 4 VCC VDD VSS Power Supply Sensitivity2 ␣␣ ∆Full Scale/∆VDD ␣␣ ∆Full Scale/∆VSS ICC IDD ISS Test Conditions/Comments Guaranteed Monotonic Over Temperature for All Grades VREF(+) = +5 V, VREF(–) = –5 V. Typically within ±2 LSB VREF(+) = +5 V, VREF(–) = –5 V. Typically within ±2 LSB VREF(+) = +5 V, VREF(–) = –5 V Per Input. Typically ± 0.03 µA For Specified Performance. Can Go as Low as 0 V, but Performance Not Guaranteed Per Input VOUT = 2 × (VREF(–) + [VREF(+) – VREF(–)] × D) – VDUTGND To 0 V To 0 V Total for All Pins NOTES 1 Temperature range for A and B Versions: –40°C to +85°C. 2 Guaranteed by characterization. Not production tested. 3 See DUTGND Voltage Range section. 4 The AD7841 is functional with power supplies of ± 12 V ± 10% with reduced output range. Output amplifier requires 2.5 V of head room at the bottom and top ends of the transfer for function. At 12 V supplies it is recommended to restrict the reference range to ± 4 V. Specifications subject to change without notice. –2– REV. 0 AD7841 (These characteristics are included for Design Guidance and are not subject AC PERFORMANCE CHARACTERISTICS to production testing.) Parameter A&B Versions Units Test Conditions/Comments DYNAMIC PERFORMANCE Output Voltage Settling Time 31 µs typ Full-Scale Change to ± 1/2 LSB. DAC Latch Contents Alternately Loaded with All 0s and All 1s Slew Rate 0.7 Digital-to-Analog Glitch Impulse 230 V/µs typ nV-s typ Channel-to-Channel Isolation DAC-to-DAC Crosstalk Digital Crosstalk 99 40 0.2 dB typ nV-s typ nV-s typ Digital Feedthrough Output Noise Spectral Density ␣␣ @ 1 kHz 0.1 nV-s typ Measured with VREF(+) = +5 V, VREF(–) = –5 V. DAC Latch Alternately Loaded with 1FFF Hex and 2000 Hex. Not Dependent on Load Conditions See Terminology See Terminology Feedthrough to DAC Output Under Test Due to Change in Digital Input Code to Another Converter Effect of Input Bus Activity on DAC Output Under Test 200 nV/√Hz typ All 1s Loaded to DAC. VREF(+) = VREF(–) = 0 V TIMING SPECIFICATIONS1, 2 (V CC = +5 V ⴞ 5%; VDD = +15 V ⴞ 10%; VSS = –15 V ⴞ 10%; GND = DUTGND = 0 V) Parameter Limit at TMIN, TMAX Units Description t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 15 0 50 50 0 0 20 0 31 300 50 ns min ns min ns min ns min ns min ns min ns min ns min µs typ ns max ns min Address to WR Setup Time Address to WR Hold Time CS Pulsewidth Low WR Pulsewidth Low CS to WR Setup Time WR to CS Hold Time Data Setup Time Data Hold Time Settling Time CLR Pulse Activation Time LDAC Pulsewidth Low NOTES 1 All input signals are specified with tr = tf = 5 ns (10% to 90% of 5 V) and timed from a voltage level of 1.6 V. 2 Rise and fall times should be no longer than 50 ns. Specifications subject to change without notice. t1 t2 A0, A1, A2 t6 t5 CS t3 t4 WR t8 t7 DATA t9 VOUT t10 CLR VOUT t11 LDAC Figure 1. Timing Diagram REV. 0 –3– AD7841 ABSOLUTE MAXIMUM RATINGS 1, 2 Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C MQFP Package Power Dissipation . . . . . . . . . . . . . . . . . . (TJ Max – TA)/θJA θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 95°C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215°C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >4000 V (TA = +25°C unless otherwise noted) VCC to GND3 . . . . . . . . . . . . . . .–0.3 V, +7 V or VDD + 0.3 V (Whichever Is Lower) VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +17 V VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V, –17 V Digital Inputs to GND . . . . . . . . . . . . . . –0.3 V, VCC + 0.3 V VREF(+) to VREF(–) . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +18 V VREF(+) to GND . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V VREF(–) to GND . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V DUTGND to GND . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V VOUT (A–H) to GND . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V Operating Temperature Range Industrial (A Version) . . . . . . . . . . . . . . . . –40°C to +85°C Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2 Transient currents of up to 100 mA will not cause SCR latch-up. 3 V CC must not exceed VDD by more than 0.3 V. If it is possible for this to happen during power supply sequencing, the following diode protection scheme will ensure protection. VDD IN4148 VCC HP5082-2811 VDD VCC AD7841 ORDERING GUIDE Model Temperature Range Linearity Error (LSBs) DNL (LSBs) Package Description Package Option AD7841AS AD7841BS –40°C to +85°C –40°C to +85°C ±4 ±2 –0.9/+2 ±1 Plastic Quad Flatpack (MQFP) Plastic Quad Flatpack (MQFP) S-44 S-44 37 36 35 VOUTG 38 VOUTF DUTGND_EF 39 VDD 40 VREF(+)CDEF VOUTD 41 VOUTE 42 VREF(–)CDEF VOUTC 44 43 DUTGND_CD VOUTB PIN CONFIGURATION 34 DUTGND_AB 1 VOUTA 33 PIN 1 IDENTIFIER DUTGND_GH 32 VOUTH VREF(–)AB 3 31 VREF(–)GH VREF(+)AB 4 30 VREF(+)GH VDD 5 29 CLR VSS 6 28 DB13 LDAC 7 27 DB12 A2 8 26 DB11 A1 9 25 DB10 A0 10 24 DB9 CS 11 23 DB8 AD7841 DB0 DB1 18 19 20 21 22 DB7 GND 17 DB6 16 DB5 15 DB4 14 DB3 13 DB2 12 WR TOP VIEW (Not to Scale) VCC 2 –4– REV. 0 AD7841 PIN FUNCTION DESCRIPTIONS Pin No. Mnemonic Description 1 DUTGND_AB 2, 32, 34, 35, 37, 41, 43, 44 3, 4 5, 38 6, 29 7 VOUTA . . VOUTH Device Sense Ground for DACs A and B. VOUTA and VOUTB are referenced to the voltage applied to this pin. DAC Outputs. 8, 9, 10 A2, A1, A0 11 12 CS WR 13 14 15–28 VCC GND DB0␣ .␣ .␣ DB12 29 CLR 30, 31 33 VREF(+)GH, VREF(–)GH DUTGND_GH 36 DUTGND_EF 39 40 42 VREF(+)CDEF VREF(–)CDEF DUTGND_CD REV. 0 VREF(–)AB, VREF(+)AB VDD VSS LDAC Reference Inputs for DACs A and B. These reference voltages are referred to GND. Positive Analog Power Supply; +15 V ± 10% for Special Performance. Negative Analog Power Supply; –15 V ± 10% for Special Performance. Load DAC Logic Input (active low). When this logic input is taken low the contents of the registers are transferred to their respective DAC registers. LDAC can be tied permanently low enabling the outputs to be updated on the rising edge of WR. Address inputs. A0, A1 and A2 are decoded to select one of the eight input registers for a data transfer. Level-Triggered Chip Select Input (active low). The device is selected when this input is low. Level-Triggered Write Input (active low), used in conjunction with CS to write data to the AD7841 data registers. Data is latched into the selected input register on the rising edge of WR. Logic Power Supply; +5 V ± 5%. Ground. Parallel Data Inputs. The AD7841 can accept a straight 14-bit parallel word on DB0 to DB13 where DB13 is the MSB and DB0 is the LSB. Asynchronous Clear Input (level sensitive, active low). When this input is low, all analog outputs are switched to the externally set potential on the relevant DUTGND pin. The contents of input registers and DAC registers A to H are not affected when the CLR pin is taken low. When CLR is brought back high, the DAC outputs revert to their original outputs as determined by the data in their DAC registers. Reference Inputs for DACs G and H. These reference voltages are referred to GND. Device Sense Ground for DACs G and H. VOUTG and VOUTH are referenced to the voltage applied to this pin. Device Sense Ground for DACs E and F. VOUTE and VOUTF are referenced to the voltage applied to this pin. Reference Inputs for DACs C, D, E and F. These reference voltages are referred to GND. Reference Inputs for DACs C, D, E and F. These reference voltages are referred to GND. Device Sense Ground for DACs C and D. VOUTC and VOUTD are referenced to the voltage applied to this pin. –5– AD7841 TERMINOLOGY Relative Accuracy Full-Scale Error This is the error in DAC output voltage when all 1s are loaded into the DAC latch. Ideally the output voltage, with all 1s loaded into the DAC latch, should be 2 VREF(+) – 1 LSB. Relative accuracy or endpoint linearity is a measure of the maximum deviation from a straight line passing through the endpoints of the DAC transfer function. It is measured after adjusting for zero-scale error and full-scale error and is expressed in Least Significant Bits. Zero-Scale Error Zero-scale error is the error in the DAC output voltage when all 0s are loaded into the DAC latch. Ideally the output voltage, with all 0s in the DAC latch should be equal to 2 VREF(–). Zeroscale error is mainly due to offsets in the output amplifier. Differential Nonlinearity Differential nonlinearity is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of 1 LSB maximum ensures monotonicity. Gain Error Gain Error is defined as (Full-Scale Error) – (Zero-Scale Error). DC Crosstalk GENERAL DESCRIPTION DAC Architecture—General Although the common input reference voltage signals are internally buffered, small IR drops in the individual DAC reference inputs across the die can mean that an update to one channel can produce a dc output change in one or another of the channel outputs. Each channel consists of a straight 14-bit R-2R voltage-mode DAC. The full-scale output voltage range is equal to twice the reference span of VREF(+) – VREF(–). The DAC coding is straight binary; all 0s produces an output of 2 VREF(–); all 1s produces an output of 2 VREF(+) – 1 LSB. The eight DAC outputs are buffered by op amps that share common VDD and VSS power supplies. If the dc load current changes in one channel (due to an update), this can result in a further dc change in one or another of the channel outputs. This effect is most obvious at high load currents and reduces as the load currents are reduced. With high impedance loads the effect is virtually impossible to measure. The analog output voltage of each DAC channel reflects the contents of its own DAC register. Data is transferred from the external bus to the input register of each DAC on a per channel basis. This is the amount of time it takes for the output to settle to a specified level for a full-scale input change. Bringing the CLR line low switches all the signal outputs, VOUTA to VOUTH, to the voltage level on the relevant DUTGND pin. When the CLR signal is brought back high, the output voltages from the DACs will reflect the data stored in the relevant DAC registers. Digital-to-Analog Glitch Impulse Data Loading to the AD7841 This is the amount of charge injected into the analog output when the inputs change state. It is specified as the area of the glitch in nV-secs. It is measured with VREF(+) = +5 V and VREF(–) = –5 V and the digital inputs toggled between 1FFFH and 2000H. Data is loaded into the AD7841 in straight parallel 14-bit wide words. Output Voltage Settling Time The DAC output voltages, VOUTA – VOUTH are updated to reflect new data in the DAC registers. The actual input register being written to is determined by the logic levels present on the device’s address lines, as shown in Table I. Channel-to-Channel Isolation Channel-to-channel isolation refers to the proportion of input signal from one DAC’s reference input that appears at the output of another DAC. It is expressed in dBs. Table I. Address Line Truth Table DAC-to-DAC Crosstalk DAC-to-DAC crosstalk is defined as the glitch impulse that appears at the output of one converter due to both the digital change and subsequent analog O/P change at another converter. It is specified in nV-secs. Digital Crosstalk The glitch impulse transferred to the output of one converter due to a change in digital input code to the other converter is defined as the digital crosstalk and is specified in nV-secs. Digital Feedthrough A2 A1 A0 DAC Selected 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 INPUT REG A (DAC A) INPUT REG B (DAC B) INPUT REG C (DAC C) INPUT REG D (DAC D) INPUT REG E (DAC E) INPUT REG F (DAC F) INPUT REG G (DAC G) INPUT REG H (DAC H) When the device is not selected, high frequency logic activity on the device’s digital inputs can be capacitively coupled both across and through the device to show up as noise on the VOUT pins. This noise is digital feedthrough. DC Output Impedance This is the effective output source resistance. It is dominated by package lead resistance. –6– REV. 0 Typical Performance Characteristics– AD7841 1 2 VDD = +15V VSS = –15V VREF(+) = +5V VREF(–) = –5V TA = 258C 0 –1 0.5 0.25 0 –0.25 VDD = +15V VSS = –15V VREF(+) = +5V VREF(–) = –5V TA = 258C –0.5 –0.75 0 –1 2048 4096 6144 8192 10240 12288 14336 16384 0 –1 –40 Figure 3. Typical DNL Plot 0.5 ERROR – LSBs 100 VCC = +5V VDD = +15V VSS = –15V 5 4 ZERO-SCALE ERROR 0 3 DIGITAL INPUTS @ THRESHOLDS 2 1 FULL-SCALE ERROR –2 –0.5 80 6 VDD = +15V VSS = –15V VREF(+) = +5V VREF(–) = –5V 2 VDD = +15V VSS = –15V VREF(+) = +5V VREF(+) = –5V 0 20 40 60 TEMPERATURE – 8C Figure 4. Typical INL Error vs. Temperature 4 1 0 –20 CODE Figure 2. Typical INL Plot DNL ERROR – LSBs –2 2048 4096 6144 8192 10240 12288 14336 16384 CODE VDD = +15V VSS = –15V VREF(+) = +5V VREF(–) = –5V 0 ICC – mA –2 2 INL ERROR – LSBs DNL ERROR – LSBs INL ERROR – LSBs 1 4 0.75 DIGITAL INPUTS @ SUPPLIES 0 –1 –40 –20 0 20 40 60 TEMPERATURE – 8C 80 –4 –40 100 Figure 5. Typical DNL Error vs. Temperature –20 0 20 40 60 TEMPERATURE – 8C 80 100 –1 –40 Figure 6. Zero-Scale and Full-Scale Error vs. Temperature –20 0 20 40 60 TEMPERATURE – 8C 100 Figure 7. ICC vs. Temperature 10 0.6 VDD = +15V VSS = –15V VCC = +5V 10.19 0.5 0.3 0.2 0.1 10.18 IDD/ISS – mA VOUT – Volts 0.4 Volts 80 10.17 IDD 8 ISS 6 0 10.16 –0.1 –0.2 0 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 Figure 8. Typical Digital-to-Analog Glitch Impulse REV. 0 27 28 29 30 31 SETTLING TIME – ms 32 Figure 9. Settling Time (+) –7– 33 4 –40 –20 0 20 40 60 TEMPERATURE – °C 80 100 Figure 10. IDD, ISS vs. Temperature AD7841 When bipolar-zero and full-scale adjustment are not needed, R2 and R3 can be omitted. Pin 12 on the AD588 should be connected to Pin 11 and Pin 5 should be left floating. Unipolar Configuration Figure 11 shows the AD7841 in the unipolar binary circuit configuration. The VREF(+) input of the DAC is driven by the AD586, a +5 V reference. VREF(–) is tied to ground. Table II gives the code table for unipolar operation of the AD7841. Other suitable references include the REF02, a precision +5 V reference, and the REF195, a low dropout, micropower precision +5 V reference. R1 39kV 4 6 7 +15V 2 VDD 6 8 AD586 C1 1mF 5 C1 1mF +5V VOUT VREF(+) R3 100kV DUTGND 4 VREF(–) Figure 11. Unipolar +10 V Operation Many circuits will not require these offset and gain adjustments. In these circuits R1 can be omitted. Pin 5 of the AD586 may be left open circuit and Pin 2 (VREF(–)) of the AD7841 tied to 0 V. GND 8 13 SIGNAL GND Binary Number in DAC Register MSB LSB Analog Output (VOUT) 11 10 10 01 00 00 2[VREF(–) + VREF (16383/16384)] V 2[VREF(–) + VREF (8193/16384)] V 2[VREF(–) + VREF (8192/16384)] V 2[VREF(–) + VREF (8191/16384)] V 2[VREF(–) + VREF (1/16384)] V 2[VREF(–)] V 1111 0000 0000 1111 0000 0000 1111 0000 0000 1111 0000 0000 1111 0001 0000 1111 0001 0000 NOTES VREF = (VREF(+) – VREF(–)). For VREF(+) = +5 V, and VREF(–) = –5 V, VREF = 10 V, 1 LSB = 2 V REF V/214 = 20 V/16384 = 1.22 mV. Table II. Code Table for Unipolar Operation 1111 0000 1111 0001 0000 DUTGND VREF(–) Table III. Code Table for Bipolar Operation Offset and gain may be adjusted in Figure 11 as follows: To adjust offset, disconnect the VREF(–) input from 0 V, load the DAC with all 0s and adjust the VREF(–) voltage until VOUT = 0 V. For gain adjustment, the AD7841 should be loaded with all 1s and R1 adjusted until VOUT = 2 VREF(+) – 1 LSB = 10 V(16383/ 16384) = 9.99939 V. 1111 0000 1111 0000 0000 AD7841* 14 15 16 Figure 12. Bipolar ± 10 V Operation SIGNAL GND –15V 1111 0000 1111 0000 0000 VOUT (–10V TO +10V) VREF(+) 1 *ADDITIONAL PINS OMITTED FOR CLARITY *ADDITIONAL PINS OMITTED FOR CLARITY 11 10 01 00 00 VCC VSS 12 GND SIGNAL GND VDD –15V VSS Binary Number in DAC Register MSB␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ LSB AD588 10 11 VOUT (0 TO +10V) AD7841* R1 10kV 9 +5V VOUT 3 5 R2 100kV VCC 2 +15V Analog Output (VOUT) CONTROLLED POWER-ON OF THE OUTPUT STAGE A block diagram of the output stage of the AD7841 is shown in Figure 13. It is capable of driving a load of 5 kΩ in parallel with 50 pF. G1 to G6 are transmission gates used to control the power on voltage present at VOUT. On power up G1 and G2 are also used in conjunction with the CLR input to set VOUT to the user defined voltage present at the DUTGND pin. When CLR is taken back high, the DAC outputs reflect the data in the DAC registers. 2 VREF (16383/16384) V 2 VREF (8192/16384) V 2 VREF (8191/16384) V 2 VREF (1/16384) V 0V NOTES VREF = VREF(+); VREF(–) = 0 V for unipolar operation. For VREF(+) = +5 V, 1 LSB = +10 V/2 14 = +10 V/16384 = 610 µV. G1 Bipolar Configuration G6 DAC Figure 12 shows the AD7841 set up for ± 10 V operation. The AD588 provides precision ± 5 V tracking outputs that are fed to the VREF(+) and VREF(–) inputs of the AD7841. The code table for bipolar operation of the AD7841 is shown in Table III. VOUT G3 G2 In Figure 12, full-scale and bipolar zero adjustments are provided by varying the gain and balance on the AD588. R2 varies the gain on the AD588 while R3 adjusts the offset of both the +5 V and –5 V outputs together with respect to ground. G4 R R = 60kV G5 14kV DUTGND For bipolar-zero adjustment, the DAC is loaded with 1000␣ .␣ .␣ .␣ 0000 and R3 is adjusted until VOUT = 0 V. Full scale is adjusted by loading the DAC with all 1s and adjusting R2 until VOUT = 10(8191/8192) V = 9.99878 V. Figure 13. Block Diagram of AD7841 Output Stage –8– REV. 0 AD7841 Power-On with CLR Low G1 The output stage of the AD7841 has been designed to allow output stability during power-on. If CLR is kept low during power-on, then just after power is applied to the AD7841, the situation is as depicted in Figure 14. G1, G4 and G6 are open while G2, G3 and G5 are closed. G6 DAC VOUT G3 G2 G4 R G1 R G5 14kV G6 DAC VOUT G3 G2 Figure 16. Output Stage After CLR Is Taken High G4 R DUTGND R G5 Power-On with CLR High If CLR is high on the application of power to the device, the output stages of the AD7841 are configured as in Figure 17 while VDD is less than 7 V and VSS is more positive than –3 V. G1 is closed and G2 is open, thereby connecting the output of the DAC to the input of its output amplifier. G3 and G5 are closed while G4 and G6 are open, thus connecting the output amplifier as a unity gain buffer. VOUT is connected to DUTGND via G5 through a 14 kΩ resistor until VDD exceeds 7 V and VSS is more negative than –3 V. 14kV DUTGND Figure 14. Output Stage with VDD < 7 V or VSS > –3 V; CLR Low VOUT is kept within a few hundred millivolts of DUTGND via G5 and a 14 kΩ resistor. This thin-film resistor is connected in parallel with the gain resistors of the output amplifier. The output amplifier is connected as a unity gain buffer via G3, and the DUTGND voltage is applied to the buffer input via G2. The amplifier’s output is thus at the same voltage as the DUTGND pin. The output stage remains configured as in Figure 14 until the voltage at VDD exceeds 7 V and VSS is more negative than –3 V. By now the output amplifier has enough headroom to handle signals at its input and has also had time to settle. The internal power-on circuitry opens G3 and G5 and closes G4 and G6. This situation is shown in Figure 15. Now the output amplifier is configured in its noise gain configuration via G4 and G6. The DUTGND voltage is still connected to the noninverting input via G2 and this voltage appears at VOUT. G1 VOUT G3 G2 G5 14kV Figure 17. Output Stage Powering Up with CLR High While VDD < 7 V or VSS > –3 V When the difference between the supply voltages reaches +10 V, the internal power-on circuitry opens G3 and G5 and closes G4 and G6 configuring the output stage as shown in Figure 18. VOUT G3 G4 R DUTGND G6 G2 G4 R G1 DAC G6 DAC G1 R G6 DAC R VOUT G5 G3 14kV G2 G4 R DUTGND Figure 15.␣ Output Stage with VDD > 7 V and VSS < –3 V; CLR Low R VOUT has been disconnected from the DUTGND pin by the opening of G5, but will track the voltage present at DUTGND via the configuration shown in Figure 15. 14kV DUTGND Figure 18.␣ Output Stage Powering Up with CLR High When VDD > V and VSS < –3 V When CLR is taken back high, the output stage is configured as shown in Figure 16. The internal control logic closes G1 and opens G2. The output amplifier is connected in a noninverting gain-of-two configuration. The voltage that appears on the VOUT pins is determined by the data present in the DAC registers. REV. 0 G5 –9– AD7841 DUTGND Voltage Range mCONTROLLER/ DSP PROCESSOR* During power-on, the VOUT pins of the AD7841 are connected to the relevant DUTGND pins via G5 and the 14 kΩ thin-film resistor. The DUTGND potential must obey the max ratings at all times. Thus, the voltage at DUTGND must always be within the range VSS – 0.3 V, VDD + 0.3 V. However, in order that the voltages at the VOUT pins of the AD7841 stay within ± 2 V of the relevant DUTGND potential during power-on, the voltage applied to DUTGND should also be kept within the range GND – 2␣ V, GND + 2 V. Once the AD7841 has powered on and the on-chip amplifiers have settled, any voltage that is now applied to the DUTGND pin is subtracted from the DAC output, which has been gained up by a factor of two. Thus, for specified operation, the maximum voltage that can be applied to the DUTGND pin increases to the maximum allowable 2 VREF(+) voltage, and the minimum voltage that can be applied to DUTGND is the minimum 2 VREF(–) voltage. After the AD7841 has fully powered on, the outputs can track any DUTGND voltage within this minimum/maximum range. AD7841 D13 D13 D0 D0 DATA BUS UPPER BITS OF ADDRESS BUS ADDRESS DECODE A2 A1 A0 R/W CS LDAC A2 A1 A0 WR *ADDITIONAL PINS OMITTED FOR CLARITY Figure 19. AD7841 Parallel Interface APPLICATIONS Power Supply Bypassing and Grounding Power Supply Sequencing When operating the AD7841, it is important that ground be connected at all times to avoid high current states. The recommended power-up sequence is VDD/VSS followed by VCC. If VCC can exceed VDD on power-up, the diode scheme shown in the absolute maximum ratings section will ensure protection. The reference inputs and digital inputs should be powered up last. Should the references exceed VDD/VSS on power-up, current limiting resistors should be inserted in series with the reference inputs to limit the current to 20 mA. Logic inputs should not be applied before VCC. Current limiting resistors (470 Ω) in series with the logic inputs should be inserted if these inputs come up before VCC. MICROPROCESSOR INTERFACING Interfacing the AD7841—16-Bit Interface The AD7841 can be interfaced to a variety of 16-bit microcontrollers or DSP processors. Figure 19 shows the AD7841 interfaced to a generic 16-bit microcontroller/DSP processor. The lower address lines from the processor are connected to A0, A1 and A2 on the AD7841 as shown. The upper address lines are decoded to provide a chip select signal or an LDAC signal for the AD7841. The fast interface timing of the AD7841 allows direct interface to a wide variety of microcontrollers and DSPs as shown in Figure 19. In any circuit where accuracy is important, careful consideration of the power supply and ground return layout helps to ensure the rated performance. The printed circuit board on which the AD7841 is mounted should be designed such that the analog and digital sections are separated and confined to certain areas of the board. This facilitates the use of ground planes that can be easily separated. A minimum etch technique is generally best for ground planes as it gives the best shielding. Digital and analog ground planes should be joined at only one place. The GND pin of the AD7841 should be connected to the AGND of the system. If the AD7841 is in a system where multiple devices require an AGND-to-DGND connection, the connection should be made at one point only, a star ground point that should be established as close as possible to the AD7841. Digital lines running under the device should be avoided as these will couple noise onto the die. The analog ground plane should be allowed to run under the AD7841 to avoid noise coupling. The power supply lines of the AD7841 should use as large a trace as possible to provide low impedance paths and reduce the effects of glitches on the power supply line. Fast switching signals like clocks should be shielded with digital ground to avoid radiating noise to other parts of the board and should never be run near the analog inputs. Avoid crossover of digital and analog signals. Traces on opposite sides of the board should run at right angles to each other. This reduces the effects of feedthrough through the board. A microstrip technique is by far the best but not always possible with a double sided board. In this technique, the component side of the board is dedicated to ground plane while signal traces are placed on the solder side. The AD7841 should have ample supply bypassing located as close to the package as possible, ideally right up against the –10– REV. 0 AD7841 device. Figure 20 shows the recommended capacitor values of 10 µF in parallel with 0.1 µF on each of the supplies. The 10 µF capacitors are the tantalum bead type. The 0.1 µF capacitor should have low Effective Series Resistance (ESR) and Effective Series Inductance (ESI), such as the common ceramic types, which provide a low impedance path to ground at high frequencies to handle transient currents due to internal logic switching. VDD VCC 0.1mF 10mF 10mF 0.1mF 10mF 0.1mF AD7841 VSS Figure 20. Recommended Decoupling Scheme for AD7841 Automated Test Equipment The AD7841 is particularly suited for use in an automated test environment. Figure 21 shows the AD7841 providing the necessary voltages for the pin driver and the window comparator in a typical ATE pin electronics configuration. AD588s are used to provide reference voltages for the AD7841. In the configuration shown, the AD588s are configured so that the voltage at Pin 1 is 5 V greater than the voltage at Pin 9 and the voltage at Pin 15 is 5 V less than the voltage at Pin 9. VOFFSET +15V –15V 16 2 4 3 6 1 8 13 10 11 12 AD588 +15V VREF(+)AB 15 VREF(–)AB 14 9 –15V AD7841* 1mF DUTGND_GH +15V –15V VOUT 16 4 3 6 1 8 15 AD588 VOUTG VREF(+)GH VREF(–)GH 14 9 7 1mF DEVICE GND DEVICE GND VOUTH GND DEVICE GND The other AD588 is used to provide a reference voltage for DACs G and H. These provide the reference voltages for the window comparator shown in the diagram. Note that Pin 9 of this AD588 is connected to Device GND. This causes VREF(+)GH and VREF(–)GH to be referenced to Device GND. As DAC G and DAC H input codes vary from 000␣ .␣ .␣ .␣ 000 to 111␣ .␣ .␣ .␣ 111, VOUTG and VOUTH vary from –10 V to +10 V with respect to Device GND. Device GND is also connected to DUTGND. When the AD7841 is cleared, VOUTG and VOUTH are cleared to 0 V with respect to Device GND. Programmable Reference Generation for the AD7841 in an ATE Application The AD7841 is particularly suited for use in an automated test environment. The reference input for the AD7841 octal 14-bit DAC requires three differential references for the eight DACs. Programmable references may be a requirement in some ATE applications as the offset and gain errors at the output of a DAC can be adjusted by varying the voltages on the reference pins of the DAC. To trim offset errors, the DAC is loaded with the digital code 000␣ .␣ .␣ .␣ 000 and the voltage on the VREF(–) pin is adjusted until the desired negative output voltage is obtained. To trim out gain errors, first the offset error is trimmed. Then the DAC is loaded with the code 111␣ .␣ .␣ .␣ 111 and the voltage on the VREF(+) pin is adjusted until the desired full-scale voltage minus one LSB is obtained. It is not uncommon in ATE design, to have other circuitry at the output of the AD7841 that can have offset and gain errors of up to say ± 300 mV. These offset and gain errors can be easily removed by adjusting the reference voltages of the AD7841. The AD7841 uses nominal reference values of ± 5 V to achieve an output span of ± 10 V. Since the AD7841 has a gain of two from the reference inputs to the DAC output, adjusting the reference voltages by ± 150 mV will adjust the DAC offset and gain by ± 300 mV. DUTGND_AB 0.1mF 2 PIN DRIVER VOUTB 7 13 10 11 12 VOUTA VOFFSET. However, the output of the pin driver will vary from –10 V to +10 V with respect to DUTGND as the DAC input code varies from 000␣ .␣ .␣ .␣ 000 to 111␣ .␣ .␣ .␣ 111. The VOFFSET voltage is also applied to the DUTGND pins. When a clear is performed on the AD7841, the output of the pin driver will be 0 V with respect to DUTGND. WINDOW COMPARATOR TO TESTER *ADDITIONAL PINS OMITTED FOR CLARITY Figure 21. ATE Application One of the AD588s is used as a reference for DACs A and B. These DACs are used to provide high and low levels for the pin driver. The pin driver may have an associated offset. This can be nulled by applying an offset voltage to Pin 9 of the AD588. First, the code 1000␣ .␣ .␣ .␣ 0000 is loaded into the DACA latch and the pin driver output is set to the DACA output. The VOFFSET voltage is adjusted until 0 V appears between the pin driver output and DUTGND. This causes both VREF(+) and VREF(–) to be offset with respect to GND by an amount equal to There are a number of suitable 8- and 10-bit DACs available that would be suitable to drive the reference inputs of the AD7841, such as the AD7804, a quad 10-bit digital-to-analog converter with serial load capabilities. The voltage output from this DAC is in the form of VBIAS ± VSWING and rail-to-rail operation is achievable. The voltage reference for this DAC can be internally generated or provided externally. This DAC also contains an 8-bit SUB DAC which can be used to shift the complete transfer function of each DAC around the VBIAS point. This can be used as a fine trim on the output voltage. In this application two AD7804s are required to provide programmable reference capability for all eight DACs. One AD7804 is used to drive the VREF(+) pins and the second package used to drive the VREF(–) pins. Another suitable DAC for providing programmable reference capability is the AD8803. This is an octal 8-bit trimDAC® and provides independent control of both the top and bottom ends of the trimDAC. This is helpful in maximizing the resolution of devices with a limited allowable voltage control range. TrimDAC is a registered trademark of Analog Devices, Inc. REV. 0 –11– The AD8803 has an output voltage range of GND to VDD (0 V to +5 V). To trim the VREF(+) input, the appropriate trim range on the AD8803 DAC can be set using the VREFL and VREFH pins allowing 8 bits of resolution between the two points. This will allow the VREF(+) pin to be adjusted to remove gain errors. to provide a positive output voltage and then to level shift that analog voltage to the required negative range. Alternatively these DACs can be operated with supplies of 0 V and –5 V, with the VDD pin connected to 0 V and the GND pin connected to –5 V. Now these can be used to provide the negative reference voltages for the VREF(–) inputs on the AD7841. However, the digital signals driving the DACs need to be level-shifted from the 0 V to +5 V range to the –5 V to 0 V range. Figure 22 shows a typical application circuit to provide programmable reference capabilities for the AD7841. To trim the VREF(–) voltage, some method of providing a trim voltage in the required negative voltage range is required. Neither the AD7804 or the AD8803 can provide this range in normal operation as their output range is 0 V to +5 V. There are two methods of producing this negative voltage. One method is C3402–2–4/99 AD7841 ADDR BUS +5V ADDR DECODER FSIN/CS 8/10-BIT DAC VDD A0, A1, A2 0V TO +5V D IN SDATA VREF(+)AB SCLK SCLK VOUTA VOUTA GND CONTROLLER AD7841* LOGIC LEVEL SHIFT FSIN/CS 8/10-BIT DAC VDD 0V TO 25V D IN VREF(2)AB SCLK VOUTB VOUTB GND 25V DATA BUS DATA BUS GND *ADDITIONAL PINS OMITTED FOR CLARITY Figure 22. Programmable Reference Generation for the AD7841 OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 44-Lead MQFP (S-44) 0.096 (2.44) MAX 0.037 (0.94) 0.025 (0.64) 8° 0.8° 33 PRINTED IN U.S.A. 0.548 (13.925) 0.546 (13.875) 0.398 (10.11) 0.390 (9.91) 23 34 22 SEATING PLANE TOP VIEW (PINS DOWN) 12 44 0.040 (1.02) 0.032 (0.81) 0.040 (1.02) 0.032 (0.81) 1 11 0.033 (0.84) 0.029 (0.74) 0.083 (2.11) 0.077 (1.96) –12– 0.016 (0.41) 0.012 (0.30) REV. 0