ETC UT62L51316(I)


UTRON
Preliminary Rev. 0.1
UT62L51316(I)
512K X 16 BIT LOW POWER CMOS SRAM
REVISION HISTORY
REVISION
Preliminary Rev. 0.1 Original.
DESCRIPTION
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882
FAX: 886-3-5777919
1
Draft Date
Apr. 15, 2003
P80086

UTRON
UT62L51316(I)
512K X 16 BIT LOW POWER CMOS SRAM
Preliminary Rev. 0.1
FEATURES
GENERAL DESCRIPTION
Fast access time : 55/70/100ns
CMOS low power operating
Operating current : 30/20/16 (Icc) (TYP.)
Standby current : 20uA (TYP.) L-version
2uA (TYP.) LL-version
Single 2.7V~3.6V power supply
Operation temperature:
Industrial : -40℃~85℃
All TTL compatible inputs and outputs
Fully static operation
Three state outputs
Data retention voltage:1.5V (min.)
Data byte control : LB (I/O1~I/O8)
UB (I/O9~I/O16)
Package : 48-pin 12mmX20mm TSOP-I
48-ball 6mm × 8mm TFBGA
The UT62L51316(I) is a 8,388,608-bit low power
CMOS static random access memory organized as
524,288 words by 16 bits.
The UT62L51316(I) operates from a single 2.7V ~
3.6V power supply and all inputs and outputs are fully
TTL compatible.
The UT62L51316(I) is designed for low power system
applications. It is particularly well suited for use in
high-density low power system applications.
FUNCTIONAL BLOCK DIAGRAM
A0-A18
DECODER
512K × 16
MEMORY
ARRAY
I/O DATA
CIRCUIT
COLUMN I/O
Vcc
Vss
I/O1-I/O8
Lower Byte
I/O9-I/O16
Upper Byte
CE2
CE
OE
WE
CONTROL
CIRCUIT
LB
UB
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882
FAX: 886-3-5777919
2
P80086

UTRON
UT62L51316(I)
512K X 16 BIT LOW POWER CMOS SRAM
Preliminary Rev. 0.1
PIN CONFIGURATION
A15
A14
A13
1
2
3
48
47
46
A12
A11
A10
A9
A8
NC
NC
WE
CE2
NC
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
UB
LB
A18
A17
A7
A6
A5
A4
A3
A2
A1
UT62L51316(I)
A16
NC
Vss
I/O16
I/O8
I/O15
I/O7
I/O14
I/O6
I/O13
I/O5
Vcc
I/O12
I/O4
I/O11
I/O3
I/O10
I/O2
I/O9
I/O1
OE
Vss
A
B
C
D
E
F
G
H
CE
A0
LB
OE
A0
A1
A2
CE2
I/O 9
UB
A3
A4
CE
I/O 1
I/O 1 0
I/O 1 1
A5
A6
I/O 2
I/O 3
V ss
I/O 1 2
A17
A7
I/O 4
V cc
V cc
I/O 1 3
NC
A16
I/O 5
V ss
I/O 1 5
I/O 1 4
A14
A15
I/O 6
I/O 7
I/O 1 6
NC
A12
A13
WE
I/O 8
A18
A8
A9
A10
A11
NC
1
2
3
4
5
6
TFBGA
TSOP-I
PIN DESCRIPTION
SYMBOL
A0 - A18
I/O1 - I/O16
CE , CE2
DESCRIPTION
Address Inputs
Data Inputs/Outputs
Chip Enable Input
WE
OE
Write Enable Input
LB
UB
VCC
VSS
NC
Lower-byte Control
Output Enable Input
Upper-byte Control
Power Supply
Ground
No Connection
TRUTH TABLE
MODE
Standby
Output Disable
Read
Write
Note:
CE
CE2
OE
WE
LB
UB
H
X
X
L
L
L
L
L
L
L
L
X
L
X
H
H
H
H
H
H
H
H
X
X
X
H
H
L
L
L
X
X
X
X
X
X
H
H
H
H
H
L
L
L
X
X
H
L
X
L
H
L
L
H
L
X
X
H
X
L
H
L
L
H
L
L
I/O OPERATION
I/O1-I/O8
I/O9-I/O16
High – Z
High – Z
High – Z
High – Z
High – Z
High – Z
High – Z
High – Z
High – Z
High – Z
DOUT
High – Z
DOUT
High – Z
DOUT
DOUT
High – Z
DIN
High – Z
DIN
DIN
DIN
SUPPLY
CURRENT
ISB, ISB1
ICC,ICC1, ICC2
ICC,ICC1, ICC2
ICC,ICC1, ICC2
H = VIH, L=VIL, X = Don't care.
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882
FAX: 886-3-5777919
3
P80086

UTRON
Preliminary Rev. 0.1
UT62L51316(I)
512K X 16 BIT LOW POWER CMOS SRAM
ABSOLUTE MAXIMUM RATINGS*
PARAMETER
Terminal Voltage with Respect to VSS
Operating Temperature
Industrial
Storage Temperature
Power Dissipation
DC Output Current
Soldering Temperature (under 10 secs)
SYMBOL
VTERM
TA
TSTG
PD
IOUT
Tsolder
RATING
-0.5 to 4.6
-40 to 85
-65 to 150
1
50
260
UNIT
V
℃
℃
W
mA
℃
*Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device or any other conditions above those indicated in the operational sections of this specification is
not implied. Exposure to the absolute maximum rating conditions for extended period may affect device reliability.
DC ELECTRICAL CHARACTERISTICS (Vcc = 2.7V~3.6V, TA = -40℃ to 85℃(I))
PARAMETER
SYMBOL TEST CONDITION
Power Voltage
VCC
*1
Input High Voltage
VIH
*2
Input Low Voltage
VIL
Input Leakage Current
ILI
VSS ≦VIN ≦VCC
Output Leakage Current
ILO
VSS ≦VI/O ≦VCC; Output Disable
Output High Voltage
VOH
IOH= -1mA
Output Low Voltage
VOL
IOL= 2.1mA
Cycle time=min, 100%duty
55
Operating Power
70
I/O=0mA, CE =VIL, CE2=VIH,
ICC
Supply Current
100
LB or UB =VIL
Cycle time=1µs, 100% duty, II/O=0mA,
ICC1
CE ≦0.2V,CE2≧VCC-0.2V, LB or UB ≦0.2V,
Average Operation
other pins at 0.2V or Vcc-0.2V
Current
Cycle time=500ns, 100% duty, II/O=0mA,
ICC2
CE ≦0.2V,CE2≧VCC-0.2V, LB or UB ≦0.2V,
other pins at 0.2V or Vcc-0.2V
Standby Current (TTL)
ISB
CE =VIH, or CE2=VIL, or LB = UB =VIH
-L
CE ≧VCC-0.2V, or CE2≦0.2V,
Standby Current (CMOS) ISB1
-LL
or LB = UB =VCC-0.2V,
MIN. TYP. MAX.
2.7 3.0
3.6
2.2
VCC+0.3
-0.2
0.6
-1
1
-1
1
2.2 2.7
0.4
30
40
20
30
16
25
UNIT
V
V
V
µA
µA
V
V
mA
mA
mA
-
4
5
mA
-
8
10
mA
-
0.3
20
0.5
80
mA
µA
-
2
20
µA
Notes:
1. Overshoot : Vcc+2.0v for pulse width less than 10ns.
2. Undershoot : Vss-2.0v for pulse width less than 10ns.
3. Overshoot and Undershoot are sampled, not 100% tested.
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882
FAX: 886-3-5777919
4
P80086

UTRON
UT62L51316(I)
512K X 16 BIT LOW POWER CMOS SRAM
Preliminary Rev. 0.1
CAPACITANCE (TA=25℃, f=1.0MHz)
PARAMETER
Input Capacitance
Input/Output Capacitance
SYMBOL
CIN
CI/O
MIN.
MAX
6
8
-
UNIT
pF
pF
Note : These parameters are guaranteed by device characterization, but not production tested.
AC TEST CONDITIONS
0.1VCC to 0.9VCC
5ns
1.5V
CL = 30pF+1 TTL, IOH/IOL = -1mA/2.1mA
Input Pulse Levels
Input Rise and Fall Times
Input and Output Timing Reference Levels
Output Load
AC ELECTRICAL CHARACTERISTICS (VCC = 2.7V~3.6V , TA = -40℃ to 85℃(I))
(1) READ CYCLE
PARAMETER
SYMBOL
Read Cycle Time
Address Access Time
Chip Enable Access Time
Output Enable Access Time
Chip Enable to Output in Low Z
Output Enable to Output in Low Z
Chip Disable to Output in High Z
Output Disable to Output in High Z
Output Hold from Address Change
tRC
tAA
tACE
tOE
tCLZ*
tOLZ*
tCHZ*
tOHZ*
tOH
tBA
tBHZ*
tBLZ*
LB , UB Access Time
LB , UB to High-Z Output
LB , UB to Low-Z Output
UT62L51316(I)-55
MIN.
MAX.
55
10
5
10
10
UT62L51316(I)-70
MIN.
MAX.
55
55
30
20
20
55
20
-
70
10
5
10
10
70
70
35
25
25
70
25
-
UT62L51316(I)-100
MIN.
MAX.
100
10
5
10
10
100
100
50
30
30
100
30
-
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
(2) WRITE CYCLE
PARAMETER
SYMBOL
Write Cycle Time
Address Valid to End of Write
Chip Enable to End of Write
Address Set-up Time
Write Pulse Width
Write Recovery Time
Data to Write Time Overlap
Data Hold from End of Write Time
Output Active from End of Write
Write to Output in High Z
tWC
tAW
tCW
tAS
tWP
tWR
tDW
tDH
tOW*
tWHZ*
tBW
UT62L51316(I)-55
MIN.
MAX.
55
50
50
0
45
0
25
0
5
50
UT62L51316(I)-70
MIN.
MAX.
20
-
70
60
60
0
55
0
30
0
5
60
LB , UB Valid to End of Write
* These parameters are guaranteed by device characterization, but not production tested.
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882
FAX: 886-3-5777919
5
25
-
UT62L51316(I)-100
UNIT
MIN.
MAX.
100
80
80
0
70
0
40
0
5
80
30
-
P80086
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns

UTRON
UT62L51316(I)
512K X 16 BIT LOW POWER CMOS SRAM
Preliminary Rev. 0.1
TIMING WAVEFORMS
READ CYCLE 1 (Address Controlled) (1,2)
tRC
Address
tAA
tOH
Dout
tOH
Previous data valid
Data Valid
READ CYCLE 2 ( CE and CE2 and OE Controlled) (1,3,4,5)
t RC
Address
tAA
CE
tACE
CE2
tBA
LB , UB
t BHZ
t BLZ
OE
t OE
t CHZ
t CLZ
t OLZ
Dout
t OHZ
t OH
High-Z
Data Valid
High-Z
Notes :
1. WE is high for read cycle.
2.Device is continuously selected OE =low, CE =low, CE2=high, LB or UB =low.
3.Address must be valid prior to or coincident with CE =low, CE2=high, LB or UB =low transition; otherwise tAA is the limiting parameter.
4.tCLZ, tBLZ, tOLZ, tCHZ, tBHZ and tOHZ are specified with CL=5pF. Transition is measured±500mV from steady state.
5.At any given temperature and voltage condition, tCHZ is less than tCLZ, tBHZ is less than tBLZ, tOHZ is less than tOLZ.
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882
FAX: 886-3-5777919
6
P80086

UTRON
UT62L51316(I)
512K X 16 BIT LOW POWER CMOS SRAM
Preliminary Rev. 0.1
WRITE CYCLE 1 ( WE Controlled) (1,2,3,5,6)
tW C
Address
t AW
CE
t CW
CE2
t AS
tW P
tW R
WE
t BW
LB , UB
t W HZ
t OW
High-Z
Dout
(4)
(4)
t DW
t DH
Din
Data Valid
WRITE CYCLE 2 ( CE and CE2 Controlled) (1,2,5,6)
tW C
A ddress
tA W
CE
tW R
tA S
tC W
CE2
tW P
WE
tB W
LB , U B
tW H Z
D out
H igh-Z
(4)
tD W
tD H
D in
D ata V alid
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882
FAX: 886-3-5777919
7
P80086

UTRON
UT62L51316(I)
512K X 16 BIT LOW POWER CMOS SRAM
Preliminary Rev. 0.1
WRITE CYCLE 3 ( LB , UB Controlled) (1,2,5,6)
tWC
Address
tAW
CE
tAS
tCW
tWR
CE2
tWP
WE
tBW
LB , UB
tWHZ
High-Z
Dout
tDW
Din
tDH
Data Valid
Notes :
1. WE , CE , LB , UB must be high or CE2 must be low during all address transitions.
2.A write occurs during the overlap of a low CE , high CE2, low WE , LB or UB =low.
3.During a WE controlled write cycle with OE low, tWP must be greater than tWHZ+tDW to allow the drivers to turn off and data to be placed on
the bus.
4.During this period, I/O pins are in the output state, and input signals must not be applied.
5.If the CE , LB , UB low transition and CE2 high transition occurs simultaneously with or after WE low transition, the outputs remain in a high
impedance state.
6.tOW and tWHZ are specified with CL = 5pF. Transition is measured ±500mV from steady state.
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882
FAX: 886-3-5777919
8
P80086

UTRON
UT62L51316(I)
512K X 16 BIT LOW POWER CMOS SRAM
Preliminary Rev. 0.1
DATA RETENTION CHARACTERISTICS (TA = -40℃ to 85℃(I))
PARAMETER
Vcc for Data Retention
Data Retention Current
Chip Disable to Data
Retention Time
Recovery Time
SYMBOL TEST CONDITION
VDR
CE ≧VCC-0.2V or CE2≦0.2V or
LB = UB ≧VCC-0.2V
IDR
Vcc=1.5V
-L
tCDR
CE ≧VCC-0.2V, CE2≦0.2V,
- LL
LB = UB ≧VCC-0.2V
See Data Retention
Waveforms (below)
tR
MIN.
1.5
TYP.
-
MAX.
3.6
UNIT
V
-
10
80
-
1
8
µA
µA
0
-
-
ns
tRC*
-
-
ns
tRC* = Ready Cycle Time
DATA RETENTION WAVEFORM
Low Vcc Data Retention Waveform (1) ( CE controlled)
VDR ≧ 1.5V
VCC
Vcc(min.)
Vcc(min.)
tCDR
CE
VIH
tR
CE ≧ VCC-0.2V
VIH
Low Vcc Data Retention Waveform (2) (CE2 controlled)
VDR ≧ 1.5V
VCC
CE2
VCC(min.)
VCC(min.)
tCDR
tR
VIL
CE2 ≦ 0.2V
VIL
Low Vcc Data Retention Waveform (3) ( LB , UB controlled)
VDR ≧ 1.5V
VCC
Vcc(min.)
Vcc(min.)
tCDR
LB,UB
VIH
tR
LB,UB ≧ VCC-0.2V
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882
FAX: 886-3-5777919
9
VIH
P80086

UTRON
Preliminary Rev. 0.1
UT62L51316(I)
512K X 16 BIT LOW POWER CMOS SRAM
PACKAGE OUTLINE DIMENSION
48 pin 12mm x 20mm TSOP-I Package Outline Dimension
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882
FAX: 886-3-5777919
10
P80086

UTRON
Preliminary Rev. 0.1
UT62L51316(I)
512K X 16 BIT LOW POWER CMOS SRAM
48 ball 6.0mmX8.0mm TFBGA Package Outline Dimension
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882
FAX: 886-3-5777919
11
P80086

UTRON
UT62L51316(I)
512K X 16 BIT LOW POWER CMOS SRAM
Preliminary Rev. 0.1
ORDERING INFORMATION
INDUSTRIAL TEMPERATURE
PART NO.
UT62L51316BS-55LI
UT62L51316BS-55LLI
UT62L51316BS-70LI
UT62L51316BS-70LLI
UT62L51316BS-100LI
UT62L51316BS-100LLI
UT62L51316LC-55LI
UT62L51316LC-55LLI
UT62L51316LC-70LI
UT62L51316LC-70LLI
UT62L51316LC-100LI
UT62L51316LC-100LLI
ACCESS TIME
( ns )
55
55
70
70
100
100
55
55
70
70
100
100
STANDBY CURRENT
( µA ) typ.
20
2
20
2
20
2
20
2
20
2
20
2
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882
FAX: 886-3-5777919
12
PACKAGE
48 BALL TFBGA
48 BALL TFBGA
48 BALL TFBGA
48 BALL TFBGA
48 BALL TFBGA
48 BALL TFBGA
48 PIN TSOP-I
48 PIN TSOP-I
48 PIN TSOP-I
48 PIN TSOP-I
48 PIN TSOP-I
48 PIN TSOP-I
P80086

UTRON
Preliminary Rev. 0.1
UT62L51316(I)
512K X 16 BIT LOW POWER CMOS SRAM
THIS PAGE IS LEFT BLANK INTENTIONALLY.
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882
FAX: 886-3-5777919
13
P80086