SONY CXK77K18R320GB 32Mb LW R-R HSTL High Speed Synchronous SRAM (2Mb x 18) 3/33/4 Preliminary Description The CXK77K18R320GB is a high speed CMOS synchronous static RAM with common I/O pins, organized as 2,097,152 words by 18 bits. This synchronous SRAMs integrates input registers, high speed RAM, output registers, and a one-deep write buffer onto a single monolithic IC. Register - Register (R-R) read operations and Late Write (LW) write operations are supported, providing a high-performance user interface. All address and control input signals except G (Output Enable) and ZZ (Sleep Mode) are registered on the rising edge of the K differential input clock. During read operations, output data is driven valid from the rising edge of K, one full clock cycle after the address is registered. During write operations, input data is registered on the rising edge of K, one full clock cycle after the address is registered. Sleep (power down) capability is provided via the ZZ input signal. Output drivers are series terminated, and output impedance is programmable via the ZQ input pin. By connecting an external control resistor RQ between ZQ and VSS, the impedance of the output drivers can be precisely controlled. 333 MHz operation is obtained from a single 1.8V power supply. JTAG boundary scan interface is provided using a subset of IEEE standard 1149.1 protocol. Features • 3 Speed Bins Cycle Time / Access Time -3 3.0ns / 1.6ns -33 3.3ns / 1.6ns -4 4.0ns / 2.0ns • Single 1.8V power supply (VDD): 1.8V ± 0.1V Note: 2.5V VDD is also supported. Please contact Sony Memory Marketing Department for further information. • Dedicated output supply voltage (VDDQ): 1.5V to 1.8V typical • HSTL-compatible I/O interface with dedicated input reference voltage (VREF): VDDQ/2 typical • Register - Register (R-R) read protocol • Late Write (LW) write protocol • Full read/write coherency • Byte Write capability • Differential input clocks (K/K) • Asynchronous output enable (G) • Sleep (power down) mode via dedicated mode pin (ZZ) • Programmable output driver impedance • JTAG boundary scan (subset of IEEE standard 1149.1) • 119 pin (7x17), 1.27mm pitch, 14mm x 22mm Ball Grid Array (BGA) package 32Mb LW R-R, rev 0.8 1 / 23 December 8, 2004 SONY® Preliminary CXK77K18R320GB 2Mb x 18 Pin Assignment (Top View) 1 2 3 4 5 6 7 A VDDQ SA SA NC SA SA VDDQ B NC SA SA SA (32M) SA SA NC C NC SA SA VDD SA SA NC D DQb NC VSS ZQ VSS DQa NC E NC DQb VSS SS VSS NC DQa F VDDQ NC VSS G VSS DQa VDDQ G NC DQb SBWb NC VSS NC DQa H DQb NC VSS NC VSS DQa NC J VDDQ VDD VREF VDD VREF VDD VDDQ K NC DQb VSS K VSS NC DQa L DQb NC VSS K SBWa DQa NC M VDDQ DQb VSS SW VSS NC VDDQ N DQb NC VSS SA VSS DQa NC P NC DQb VSS SA VSS NC DQa R NC SA M1 (1) VDD M2 (2) SA NC T NC SA (x18) SA NC (x36) SA SA (x18) ZZ U VDDQ TMS TDI TCK TDO RSVD (3) VDDQ Notes: 1. Pad Location 3R is defined as an M1 mode pin in LW SRAMs. However, it must be tied “low” in this device. 2. Pad Location 5R is defined as an M2 mode pin in LW SRAMs. However, it must be tied “high” in this device. 3. Pad Location 6U must be left unconnected. It is used by Sony for internal test purposes. 32Mb LW R-R, rev 0.8 2 / 23 December 8, 2004 SONY® CXK77K18R320GB Preliminary Pin Description Symbol Type Description SA Input Synchronous Address Inputs - Registered on the rising edge of K. DQa, DQb I/O Synchronous Data Inputs / Outputs - Registered on the rising edge of K during write operations. Driven from the rising edge of K during read operations. DQa - indicates Data Byte a DQb - indicates Data Byte b K, K Input Differential Input Clocks SS Input Synchronous Select Input - Registered on the rising edge of K. SS = 0 enables the device to accept read and write commands SS = 1 disables the device SW Input Synchronous Write Enable Input - Registered on the rising edge of K. SW = 0 specifies a write operation when the device is enabled SW = 1 specifies a read operation when the device is enabled SBWa, SBWb Input Synchronous Byte Write Enable Inputs - Registered on the rising edge of K. SBWa = 0 specifies write Data Byte a during a write operation SBWb = 0 specifies write Data Byte b during a write operation G Input Asynchronous Output Enable Input - Deasserted (high) disables the data output drivers. ZZ Input Asynchronous Sleep Mode Input - Asserted (high) forces the device into low-power mode. M1, M2 Input Read Operation Protocol Select - These mode pins must be tied “low” and “high” respectively to select Register - Register read operations. ZQ Input Output Driver Impedance Control Resistor Input - This pin must be connected to VSS through an external resistor RQ to program data output driver impedance. See the Programmable Output Driver Impedance section for further information. VDD 1.8V Core Power Supply - Core supply voltage. VDDQ Output Power Supply - Output buffer supply voltage. VREF Input Reference Voltage - Input buffer threshold voltage. VSS Ground TCK Input JTAG Clock TMS Input JTAG Mode Select - Weakly pulled “high” internally. TDI Input JTAG Data In - Weakly pulled “high” internally. TDO Output JTAG Data Out RSVD Reserved - This pin is reserved for Sony test purposes. It must be left unconnected. NC No Connect - These pins are true no-connects, i.e. there is no internal chip connection to these pins. They can be left unconnected or tied directly to VDD, VDDQ, or VSS. 32Mb LW R-R, rev 0.8 3 / 23 December 8, 2004 SONY® Preliminary CXK77K18R320GB •Clock Truth Table K ZZ SS (tn) SW (tn) SBWx (tn) G X 1 X X X X Sleep (Power Down) Mode ↑ 0 1 X X X Deselect ↑ 0 0 1 X 1 ↑ 0 0 1 X ↑ 0 0 0 ↑ 0 0 ↑ 0 0 DQ (tn) DQ (tn+1) Hi - Z Hi - Z *** Hi - Z Read Hi - Z Hi - Z 0 Read *** Q(tn) 0 X Write All Bytes *** D(tn) 0 X X Write Bytes With SBWx = 0 *** D(tn) 0 1 X Abort Write *** Hi - Z Operation Notes: 1. “1” = input “high”; “0” = input “low”; “X” = input “don’t care”. 2. “***” indicates that the input requirement or output state is determined by the previous operation. 3. DQs are tri-stated in response to Write and Deselect commands, one cycle after the command is sampled. •Sleep (Power Down) Mode Sleep (power down) mode is provided through the asynchronous input signal ZZ. When ZZ is asserted (high), the output drivers are disabled and the SRAM begins to draw standby current. Contents of the memory array are preserved. An enable time (tZZE) must be met before the SRAM is guaranteed to be in sleep mode, and a recovery time (tZZR) must be met before the SRAM can resume normal operation. •Programmable Impedance Output Drivers These devices have programmable impedance output drivers. The output impedance is controlled by an external resistor RQ connected between the SRAM’s ZQ pin and VSS, and is equal to one-fifth the value of this resistor, nominally. See the DC Electrical Characteristics section for further information. Output Driver Impedance Power-Up Requirements Output driver impedance will reach the programmed value within 8192 cycles after power-up. Consequently, it is recommended that Read operations not be initiated until after the initial 8192 cycles have elapsed. Output Driver Impedance Updates Output driver impedance is updated during Write and Deselect operations when the output driver is disabled. •Power-Up Sequence For reliability purposes, Sony recommends that power supplies power up in the following sequence: VSS, VDD, VDDQ, VREF, and Inputs. VDDQ should never exceed VDD. If this power supply sequence cannot be met, a large bypass diode may be required between VDD and VDDQ. Please contact Sony Memory Application Department for further information. 32Mb LW R-R, rev 0.8 4 / 23 December 8, 2004 SONY® Preliminary CXK77K18R320GB •Absolute Maximum Ratings Parameter Symbol Rating Units Supply Voltage VDD -0.5 to +2.5 V Output Supply Voltage VDDQ -0.5 to +2.3 V VIN -0.5 to VDDQ + 0.5 (2.3V max) V Input Voltage (M1, M2) VMIN -0.5 to VDD + 0.5 (2.5V max) V Input Voltage (TCK, TMS, TDI) VTIN -0.5 to VDD + 0.5 (2.5V max) V Operating Temperature TA 0 to 85 °C Junction Temperature TJ 0 to 110 °C Storage Temperature TSTG -55 to 150 °C Input Voltage (Address, Control, Data, Clock) Notes: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions other than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. •BGA Package Thermal Characteristics Parameter Junction to Case Temperature Symbol Rating Units ΘJC 3.6 °C/W •I/O Capacitance (TA = 25oC, f = 1 MHz) Parameter Input Capacitance Output Capacitance Symbol Test conditions Min Max Units Address CIN VIN = 0V --- 4.0 pF Control CIN VIN = 0V --- 4.0 pF Clock CKIN VKIN = 0V --- 4.5 pF Data COUT VOUT = 0V --- 5.0 pF Note: These parameters are sampled and are not 100% tested. 32Mb LW R-R, rev 0.8 5 / 23 December 8, 2004 SONY® Preliminary CXK77K18R320GB •DC Recommended Operating Conditions Parameter (VSS = 0V, TA = 0 to 85oC) Symbol Min Typ Max Units Notes Supply Voltage VDD 1.7 1.8 1.9 V Output Supply Voltage VDDQ 1.4 --- VDD V Input Reference Voltage VREF VDDQ/2 - 0.1 VDDQ/2 VDDQ/2 + 0.1 V 2 Input High Voltage (Address, Control, Data) VIH VREF + 0.1 --- VDDQ + 0.3 V 3 Input Low Voltage (Address, Control, Data) VIL -0.3 --- VREF - 0.1 V 4 Input High Voltage (M1, M2) VMIH VREF + 0.3 --- VDD + 0.3 V Input Low Voltage (M1, M2) VMIL -0.3 --- VREF - 0.3 V Clock Input Signal Voltage VKIN -0.3 --- VDDQ + 0.3 V Clock Input Differential Voltage VDIF 0.2 --- VDDQ + 0.6 V Clock Input Common Mode Voltage VCM VDDQ/2 - 0.1 VDDQ/2 VDDQ/2 + 0.1 V 1 1. VDD = 2.5V +/- 5% is also supported. Please contact Sony Memory Marketing Department for further information. 2. The peak-to-peak AC component superimposed on VREF may not exceed 5% of the DC component. 3. VIH (max) AC = VDDQ + 0.9V for pulse widths less than one-quarter of the cycle time (tCYC/4). 4. VIL (min) AC = -0.9V for pulse widths less than one-quarter of the cycle time (tCYC/4). 32Mb LW R-R, rev 0.8 6 / 23 December 8, 2004 SONY® Preliminary CXK77K18R320GB •DC Electrical Characteristics Parameter Symbol Input Leakage Current (Address, Control, Clock) ILI Input Leakage Current (M1, M2) IMLI Output Leakage Current ILO Average Power Supply Operating Current IDD-3 IDD-33 IDD-4 Power Supply Standby Current ISB Output High Voltage VOH Output Low Voltage VOL (VDD = 1.8V ± 0.1V, VSS = 0V, TA = 0 to 85oC) Test Conditions Min Typ Max VIN = VSS to VDDQ -5 --- 5 uA VMIN = VSS to VDD -5 --- 5 uA -5 --- 5 uA ------- ------- 650 600 540 mA --- --- 180 mA VDDQ - 0.4 --- --- V --- --- 0.4 V --- --- 35 Ω VOUT = VSS to VDDQ G = VIH IOUT = 0 mA SS = VIL, ZZ = VIL IOUT = 0 mA ZZ = VIH IOH = -6.0 mA RQ = 250Ω IOL = 6.0 mA RQ = 250Ω VOH, VOL = VDDQ/2 RQ < 150Ω Output Driver Impedance ROUT VOH, VOL = VDDQ/2 (RQ/5)* 150Ω ≤ RQ ≤ 300Ω 0.85 VOH, VOL = VDDQ/2 51 RQ > 300Ω (60*0.85) RQ/5 (30*1.15) (RQ/5)* --- 1.15 --- Units Notes 1 2 Ω Ω 3 1. This parameter is guaranteed at TA = 0 to 55oC. 2. For maximum output drive (i.e. minimum impedance), the ZQ pin can be tied directly to VSS. 3. For minimum output drive (i.e. maximum impedance), the ZQ pin can be left unconnected or tied to VDDQ. 32Mb LW R-R, rev 0.8 7 / 23 December 8, 2004 SONY® Preliminary CXK77K18R320GB •AC Electrical Characteristics (VDD = 1.8V ± 0.1V, VSS = 0V, TA = 0 to 85oC) -3 Parameter -33 -4 Symbol Units Notes Min Max Min Max Min Max Input Cycle Time tKHKH 3.0 --- 3.3 --- 4.0 --- ns Input Clock High Pulse Width tKHKL 1.2 --- 1.3 --- 1.5 --- ns Input Clock Low Pulse Width tKLKH 1.2 --- 1.3 --- 1.5 --- ns Address Input Setup Time tAVKH 0.3 --- 0.3 --- 0.3 --- ns Address Input Hold Time tKHAX 0.5 --- 0.5 --- 0.5 --- ns Write Enable Input Setup Time tWVKH 0.3 --- 0.3 --- 0.3 --- ns Write Enable Input Hold Time tKHWX 0.5 --- 0.5 --- 0.5 --- ns Sync Select Input Setup Time tSVKH 0.3 --- 0.3 --- 0.3 --- ns Sync Select Input Hold Time tKHSX 0.5 --- 0.5 --- 0.5 --- ns Data Input Setup Time tDVKH 0.3 --- 0.3 --- 0.3 --- ns Data Input Hold Time tKHDX 0.5 --- 0.5 --- 0.5 --- ns Input Clock High to Output Data Valid tKHQV --- 1.6 --- 1.6 --- 2.0 ns Input Clock High to Output Data Hold tKHQX 0.5 --- 0.5 --- 0.5 --- ns 2 Input Clock High to Output Data Low-Z tKHQX1 0.5 --- 0.5 --- 0.5 --- ns 2,3 Input Clock High to Output Data High-Z tKHQZ --- 1.8 --- 1.8 --- 2.2 ns 2,3 Output Enable Low to Output Data Valid tGLQV --- 2.5 --- 2.5 --- 2.5 ns Output Enable Low to Output Data Low-Z tGLQX 0.3 --- 0.3 --- 0.3 --- ns 2,3 Output Enable High to Output Data High-Z tGHQZ --- 2.5 --- 2.5 --- 2.5 ns 2,3 Sleep Mode Enable Time tZZE --- 15 --- 15 --- 15 ns 2 Sleep Mode Recovery Time tZZR 20 --- 20 --- 20 --- ns 2 1 1 1 1 1. These parameters are measured from VREF ± 200mV to the clock mid-point. 2. These parameters are guaranteed by design through extensive corner-lot characterization. 3. These parameters are measured at ± 50mV from steady state voltage. 32Mb LW R-R, rev 0.8 8 / 23 December 8, 2004 SONY® Preliminary CXK77K18R320GB •AC Test Conditions (VDDQ = 1.5V) Item (VDD = 1.8V ± 0.1V, VDDQ = 1.5V ± 0.1V, TA = 0 to 85°C) Symbol Conditions Units VREF 0.75 V Input High Level VIH 1.25 V Input Low Level VIL 0.25 V Input Rise & Fall Time 2.0 V/ns Input Reference Level 0.75 V Input Reference Voltage Notes Clock Input High Voltage VKIH 1.25 V VDIF = 1.0V Clock Input Low Voltage VKIL 0.25 V VDIF = 1.0V Clock Input Common Mode Voltage VCM 0.75 V Clock Input Rise & Fall Time 2.0 V/ns Clock Input Reference Level K/K cross V Output Reference Level 0.75 V Output Load Conditions RQ = 250Ω See Figure 1 below Figure 1: AC Test Output Load (VDDQ = 1.5V) 16.7Ω 50Ω 50Ω 0.75V 16.7Ω DQ 16.7Ω 50Ω 50Ω 32Mb LW R-R, rev 0.8 9 / 23 0.75V December 8, 2004 SONY® Preliminary CXK77K18R320GB •AC Test Conditions (VDDQ = 1.8V) Item (VDD = VDDQ = 1.8V ± 0.1V, TA = 0 to 85°C) Symbol Conditions Units VREF 0.9 V Input High Level VIH 1.4 V Input Low Level VIL 0.4 V Input Rise & Fall Time 2.0 V/ns Input Reference Level 0.9 V Input Reference Voltage Notes Clock Input High Voltage VKIH 1.4 V VDIF = 1.0V Clock Input Low Voltage VKIL 0.4 V VDIF = 1.0V Clock Input Common Mode Voltage VCM 0.9 V Clock Input Rise & Fall Time 2.0 V/ns Clock Input Reference Level K/K cross V Output Reference Level 0.9 V Output Load Conditions RQ = 250Ω See Figure 2 below Figure 2: AC Test Output Load (VDDQ = 1.8V) 16.7Ω 50Ω 50Ω 0.9V 16.7Ω DQ 16.7Ω 50Ω 50Ω 32Mb LW R-R, rev 0.8 10 / 23 0.9V December 8, 2004 SONY® Preliminary CXK77K18R320GB Read-Write-Read Timing Diagram Synchronously Controlled via SS and Deselect Operations (G = Low) Figure 3 Read Read Read Deselect Deselect Write Write Write Read Read Read A5 A6 A7 A8 A9 K K tKHKH SA A1 A2 tKHKL tKLKH tAVKH tKHAX A3 A4 tSVKH tKHSX SS tWVKH tKHWX SW tWVKH tKHWX SBWx G = VIL tKHQV DQ tKHQX Q1 tKHQZ Q2 Q3 tDVKH tKHDX D4 tKHQX1 D5 D6 Q7 Note: In the diagram above, two Deselect operations are inserted between Read and Write operations to control the data bus transition from output to input. This depiction is for clarity purposes only. It is NOT a requirement. Depending on the application, one Deselect operation may be sufficient. 32Mb LW R-R, rev 0.8 11 / 23 December 8, 2004 SONY® Preliminary CXK77K18R320GB Read-Write-Read Timing Diagram Asynchronously Controlled via G and Dummy Read Operations (SS = Low) Figure 4 Read Read Read Dummy Read Dummy Read Write Write Write Read Read Read A5 A6 A7 A8 A9 K K tKHKH SA A1 A2 tKHKL tKLKH tAVKH tKHAX A3 A4 SS = VIL tWVKH tKHWX SW tWVKH tKHWX SBWx G tGLQV tGHQZ tKHQV DQ tKHQX Q1 tKHQZ Q2 Q3 tGLQX tDVKH tKHDX D4 tKHQX1 D5 D6 Q7 Note: In the diagram above, two Dummy Read operations are inserted between Read and Write operations to control the data bus transition from output to input. This depiction is for clarity purposes only. It is NOT a requirement. Depending on the application, one Dummy Read operation may be sufficient. 32Mb LW R-R, rev 0.8 12 / 23 December 8, 2004 SONY® Preliminary CXK77K18R320GB Sleep (Power-Down) Mode Timing Diagram Figure 5 Read (note 1) Deselect (note 2) Deselect (note 3) Deselect (note 4) Read (note 5) Read Read A2 A3 A4 K K SA A1 SS SW SBWx G = VIL tZZE Begin ISB tZZR ZZ DQ Q1 Q2 Notes: 1: This can be any operation. The depiction of a Read operation here is provided only as an example. 2: Before ZZ is asserted, at least two (2) Deselect operations must be initiated after the last Read or Write operation is initiated, in order to ensure the successful completion of the last Read or Write operation. 3: While ZZ is asserted, all of the SRAM’s address, control, data, and clock inputs are ignored. 4: After ZZ is deasserted, Deselect operations must be initiated until the specified recovery time (tZZR) has been met. Read and Write operations may NOT be initiated during this time. 5: This can be any operation. The depiction of a Read operation here is provided only as an example. 32Mb LW R-R, rev 0.8 13 / 23 December 8, 2004 SONY® Preliminary CXK77K18R320GB •Test Mode Description These devices provide a JTAG Test Access Port (TAP) and Boundary Scan interface using a limited set of IEEE std. 1149.1 functions. This test mode is intended to provide a mechanism for testing the interconnect between master (processor, controller, etc.), SRAMs, other components, and the printed circuit board. In conformance with a subset of IEEE std. 1149.1, these devices contain a TAP Controller and four TAP Registers. The TAP Registers consist of one Instruction Register and three Data Registers (ID, Bypass, and Boundary Scan Registers). The TAP consists of the following four signals: TCK: TMS: TDI: TDO: Test Clock Test Mode Select Test Data In Test Data Out Induces (clocks) TAP Controller state transitions. Inputs commands to the TAP Controller. Sampled on the rising edge of TCK. Inputs data serially to the TAP Registers. Sampled on the rising edge of TCK. Outputs data serially from the TAP Registers. Driven from the falling edge of TCK. Disabling the TAP When JTAG is not used, TCK should be tied “low” to prevent clocking the SRAM. TMS and TDI should either be tied “high” through a pull-up resistor or left unconnected. TDO should be left unconnected. Note: Operation of the TAP does not interfere with normal SRAM operation except when the SAMPLE-Z instruction is selected. Consequently, TCK, TMS, and TDI can be controlled any number of ways without adversely affecting the functionality of the device. JTAG DC Recommended Operating Conditions Parameter (VDD = 1.8V ± 0.1V, VSS = 0V, TA = 0 to 85°C) Symbol Test Conditions Min Max Units JTAG Input High Voltage VTIH --- 1.2 VDD + 0.3 V JTAG Input Low Voltage VTIL --- -0.3 0.6 V JTAG Output High Voltage (CMOS) VTOH ITOH = -100uA VDD - 0.1 --- V JTAG Output Low Voltage (CMOS) VTOL ITOL = 100uA --- 0.1 V JTAG Output High Voltage (TTL) VTOH ITOH = -8.0mA VDD - 0.4 --- V JTAG Output Low Voltage (TTL) VTOL ITOL = 8.0mA --- 0.4 V VTIN = VSS to VDD -10 10 uA JTAG Input Leakage Current ITLI JTAG AC Test Conditions Parameter (VDD = 1.8V ± 0.1V, VSS = 0V, TA = 0 to 85°C) Symbol Conditions Units JTAG Input High Level VTIH 1.8 V JTAG Input Low Level VTIL 0.0 V JTAG Input Rise & Fall Time 1.0 V/ns JTAG Input Reference Level 0.9 V JTAG Output Reference Level 0.9 V JTAG Output Load Condition 32Mb LW R-R, rev 0.8 Notes See Fig.2 (page 10) 14 / 23 December 8, 2004 SONY® Preliminary CXK77K18R320GB JTAG AC Electrical Characteristics Parameter Symbol Min TCK Cycle Time tTHTH 50 ns TCK High Pulse Width tTHTL 20 ns TCK Low Pulse Width tTLTH 20 ns TMS Setup Time tMVTH 5 ns TMS Hold Time tTHMX 5 ns TDI Setup Time tDVTH 5 ns TDI Hold Time tTHDX 5 ns Capture Setup Time (Address, Control, Data, Clock) tCS 5 ns Capture Hold Time (Address, Control, Data, Clock) tCH 5 ns TCK Low to TDO Valid tTLQV TCK Low to TDO Hold tTLQX Max 10 0 Unit ns ns JTAG Timing Diagram Figure 6 tTHTL tTLTH tTHTH TCK tMVTH tTHMX TMS tDVTH tTHDX TDI tTLQV tTLQX TDO 32Mb LW R-R, rev 0.8 15 / 23 December 8, 2004 SONY® Preliminary CXK77K18R320GB TAP Controller The TAP Controller is a 16-state state machine that controls access to the various TAP Registers and executes the operations associated with each TAP Instruction. State transitions are controlled by TMS and occur on the rising edge of TCK. The TAP Controller enters the “Test-Logic Reset” state in one of two ways: 1. At power up. 2. When a logic “1” is applied to TMS for at least 5 consecutive rising edges of TCK. The TDI input receiver is sampled only when the TAP Controller is in either the “Shift-IR” state or the “Shift-DR” state. The TDO output driver is active only when the TAP Controller is in either the “Shift-IR” state or the “Shift-DR” state. TAP Controller State Diagram Figure 7 1 Test-Logic Reset 0 0 Run-Test / Idle 1 Select-DR 1 Select-IR 0 1 0 1 Capture-DR Capture-IR 0 0 0 Shift-DR 1 1 Exit1-DR Exit1-IR 0 0 0 Pause-DR 1 0 Exit2-IR 1 32Mb LW R-R, rev 0.8 0 16 / 23 0 1 Update-DR 1 0 Pause-IR 1 Exit2-DR 0 Shift-IR 1 1 1 Update-IR 1 0 December 8, 2004 SONY® CXK77K18R320GB Preliminary TAP Registers TAP Registers are serial shift registers that capture serial input data (from TDI) on the rising edge of TCK, and drive serial output data (to TDO) from the falling edge of TCK. They are divided into two groups: “Instruction Registers” (IR), which are manipulated via the “IR” states in the TAP Controller, and “Data Registers” (DR), which are manipulated via the “DR” states in the TAP Controller. Instruction Register (IR - 3 Bits) The Instruction Register stores the various TAP Instructions supported by these devices. It is loaded with the IDCODE instruction at power-up, and when the TAP Controller is in the “Test-Logic Reset” and “Capture-IR” states. It is inserted between TDI and TDO when the TAP Controller is in the “Shift-IR” state, at which time it can be loaded with a new instruction. However, newly loaded instructions are not executed until the TAP Controller has reached the “Update-IR” state. The Instruction Register is 3 bits wide, and is encoded as follows: Code (2:0) Instruction Description 000 BYPASS See code “111”. 001 IDCODE Loads a predefined device- and manufacturer-specific identification code into the ID Register when the TAP Controller is in the “Capture-DR” state, and inserts the ID Register between TDI and TDO when the TAP Controller is in the “Shift-DR” state. See the ID Register description for more information. 010 SAMPLE-Z Loads the individual logic states of all signals composing the SRAM’s I/O ring into the Boundary Scan Register when the TAP Controller is in the “Capture-DR” state, and inserts the Boundary Scan Register between TDI and TDO when the TAP Controller is in the “ShiftDR” state. Also disables the SRAM’s data output drivers. See the Boundary Scan Register description for more information. 011 PRIVATE Do not use. Reserved for manufacturer use only. 100 SAMPLE Loads the individual logic states of all signals composing the SRAM’s I/O ring into the Boundary Scan Register when the TAP Controller is in the “Capture-DR” state, and inserts the Boundary Scan Register between TDI and TDO when the TAP Controller is in the “ShiftDR” state. See the Boundary Scan Register description for more information. 101 PRIVATE Do not use. Reserved for manufacturer use only. 110 PRIVATE Do not use. Reserved for manufacturer use only. 111 BYPASS Loads a logic “0” into the Bypass Register when the TAP Controller is in the “Capture-DR” state, and inserts the Bypass Register between TDI and TDO when the TAP Controller is in the “Shift-DR” state. See the Bypass Register description for more information. Bit 0 is the LSB and Bit 2 is the MSB. When the Instruction Register is selected, TDI serially shifts data into the MSB, and the LSB serially shifts data out through TDO. 32Mb LW R-R, rev 0.8 17 / 23 December 8, 2004 SONY® Preliminary CXK77K18R320GB Bypass Register (DR - 1 Bit) The Bypass Register is one bit wide, and provides the minimum length serial path between TDI and TDO. It is loaded with a logic “0” when the BYPASS instruction has been loaded in the Instruction Register and the TAP Controller is in the “Capture-DR” state. It is inserted between TDI and TDO when the BYPASS instruction has been loaded into the Instruction Register and the TAP Controller is in the “Shift-DR” state. ID Register (DR - 32 Bits) The ID Register is loaded with a predetermined device- and manufacturer-specific identification code when the IDCODE instruction has been loaded into the Instruction Register and the TAP Controller is in the “Capture-DR” state. It is inserted between TDI and TDO when the IDCODE instruction has been loaded into the Instruction Register and the TAP Controller is in the “Shift-DR” state. The ID Register is 32 bits wide, and contains the following information: Device Revision Number (31:28) Part Number (27:12) Sony ID (11:1) Start Bit (0) 2Mb x 18 xxxx 0000 0000 0111 0100 0000 1110 001 1 Bit 0 is the LSB and Bit 31 is the MSB. When the ID Register is selected, TDI serially shifts data into the MSB, and the LSB serially shifts data out through TDO. Boundary Scan Registers (DR - 51 Bits) The Boundary Scan Register is equal in length to the number of active signal connections to the SRAM (excluding the TAP pins) plus a number of place holder locations reserved for functional and/or density upgrades. It is loaded with the individual logic states of all signals composing the SRAM’s I/O ring when the SAMPLE or SAMPLE-Z instruction has been loaded into the Instruction Register and the TAP Controller is in the “Capture-DR” state. It is inserted between TDI and TDO when the SAMPLE or SAMPLE-Z instruction has been loaded into the Instruction Register and the TAP Controller is in the “ShiftDR” state. The Boundary Scan Register contains the following bits: 2Mb x 18 DQ 18 SA 21 K, K 2 SS, SW, SBWx 4 G, ZZ 2 ZQ, M1, M2 3 Place Holder 1 Note: K and K are connected to a differential input receiver that generates a single-ended input clock signal to the device. Therefore, in order to capture deterministic values for these signals in the Boundary Scan Register, they must be at opposite logic levels when sampled. Note: When an external resistor RQ is connected between the ZQ pin and VSS, the value of the ZQ signal captured in the Boundary Scan Register is non-deterministic. Note: Place Holders are required for some NC pins to allow for future density and/or functional upgrades. They are connected to VSS internally, regardless of pin connection externally. 32Mb LW R-R, rev 0.8 18 / 23 December 8, 2004 SONY® Preliminary CXK77K18R320GB Boundary Scan Register Bit Order Assignments The tables below depict the order in which the bits are arranged in the Boundary Scan Register. Bit 1 is the LSB and bit 51 is the MSB. When the Boundary Scan Register is selected, TDI serially shifts data into the MSB, and the LSB serially shifts data out through TDO. 2Mb x 18 Bit Signal Pad Bit Signal Pad 1 M2 5R 36 SBWb 3G 2 SA 6T 37 ZQ 4D 3 SA 4P 38 SS 4E 4 SA 6R 39 SA 4B NC (1) 5 SA 5T 40 6 ZZ 7T 41 SW 4M 7 DQa 7P 42 DQb 2K 8 DQa 6N 43 DQb 1L 4H 9 DQa 6L 44 DQb 2M 10 DQa 7K 45 DQb 1N 11 SBWa 5L 46 DQb 2P 12 K 4L 47 SA 3T 13 K 4K 48 SA 2R 14 G 4F 49 SA 4N 15 DQa 6H 50 SA 2T 16 DQa 7G 51 M1 3R 17 DQa 6F 18 DQa 7E 19 DQa 6D 20 SA 6A 21 SA 6C 22 SA 5C 23 SA 5A 24 SA 6B 25 SA 5B 26 SA 3B 27 SA 2B 28 SA 3A 29 SA 3C 30 SA 2C 31 SA 2A 32 DQb 1D 33 DQb 2E 34 DQb 2G 35 DQb 1H Note 1: NC pin at pad location 4H is connected to VSS internally, regardless of pin connection externally. 32Mb LW R-R, rev 0.8 19 / 23 December 8, 2004 SONY® Preliminary CXK77K18R320GB •Ordering Information Part Number VDD I/O Type Size Speed (Cycle Time / Access Time) CXK77K18R320GB-3 1.8V HSTL 2Mb x 18 3.0ns / 1.6ns CXK77K18R320GB-33 1.8V HSTL 2Mb x 18 3.3ns / 1.6ns CXK77K18R320GB-4 1.8V HSTL 2Mb x 18 4.0ns / 2.0ns Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. 32Mb LW R-R, rev 0.8 20 / 23 December 8, 2004 SONY® Preliminary CXK77K18R320GB 119 Pin BGA Package Dimensions B A 0.6 ± 0.1 S X U T R P N M L K J H G F E D C B A 1.0 C X4 21.0 22.0 7 1.27 1. C 4- C 3- 0.35 S 0.6 ± 0.1 1. 5 1.5 0.20 0.15 7.62 1.27 3.19 20.32 14.0 13.0 0.84 2.1 ± 0.3 12 345 67 φ0.75 ± 0.15 φ0.4 S A φ0.2 S B S DETAIL A PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE BGA-119P-021 BORAD TREATMENT COPPER-CLAD LAMINATE EIAJ CODE BGA119-P-1422 LEAD MATERIAL SOLDER PACKAGE MASS 1.1g JEDEC CODE This product utilizes lead (Pb) as one of the elements composing the package solder ball. The quantity of lead (Pb) per package is approxmiately 70.81mg (1.7mg per ball * 119 balls * 35%). Lead (Pb) has been shown to be hazardous to the environment, and therefore may be subject to regulations within each country. 32Mb LW R-R, rev 0.8 21 / 23 December 8, 2004 SONY® Preliminary CXK77K18R320GB •Revision History Rev. # Rev. Date Description of Modification rev 0.0 11/30/01 Initial Version rev 0.1 03/22/02 1. Modified BGA Package Thermal Characteristics section (p. 6). ΘJC 1.0 °C/W to 3.6 °C/W 2. Modified DC Recommended Operating Conditions section (p. 7). VDDQ (max) VDD to 1.6V VREF, VCM (max) 1.0V to 0.85V Added note 1 regarding 2.5V VDD support. Added note 2 regarding 1.8V VDDQ support. 3. Modified DC Electrical Characteristics section (p. 8). ROUT RQ/5 ± 10% (GBD) to RQ/5 ± 15% (TESTED) 4. Modified AC Electrical Characteristics section (p. 9). Removed “-25” bin. Added “-33” bin. -3 tKHQV 1.7ns to 1.5ns tKHQZ, tGLQV, tGHQZ 1.9ns to 1.7ns 5. Removed 1.8V VDDQ AC Test Conditions. 6. Modified JTAG DC Recommended Operating Conditions section (p. 14). VTIH (min) 1.2V to 1.4V VTIL (max) 0.6V to 0.8V 7. Modified JTAG Instruction Register definition (p. 17). Changed codes “011” and “110” from BYPASS to PRIVATE. 8. Modified 119 Pin BGA Package Dimensions section (p. 21). Changed package from FC-BGA to WB-BGA. rev 0.2 04/02/02 1. Modified DC Recommended Operating Conditions section (p. 7). VDDQ (max) 1.6V to VDD VREF, VCM (min) 0.65V to VDDQ/2 - 0.1V VREF, VCM (max) 0.85V to VDDQ/2 + 0.1V 2. Added 1.8V VDDQ AC Test Conditions (p. 11). rev 0.3 06/24/02 1. Modified AC Electrical Characteristics section (p. 9). -3, -33 tAVKH, tWVKH, tSVKH, tDVKH -3, -33 tKHAX, tKHWX, tKHSX, tKHDX 2. Modified JTAG DC Recommended Operating Conditions section (p. 15). VTIH (min) VTIL (max) 3. Modified JTAG AC Electrical Characteristics section (p. 16). TCK Cycle Time TCK High / Low Pulse Widths TMS/TDI Input Setup & Hold Times TDO Output Valid Time Added Capture Setup & Hold Times rev 0.4 02/05/03 32Mb LW R-R, rev 0.8 1. Removed all x36 information (created separate x36 data sheet). 2. Modified DC Electrical Characteristics section (p. 7). IMLI, ILO (min/max) Added preliminary IDD, IDD2, and ISB specifications. 3. Modified AC Electrical Characteristics section (p. 8). -4 tAVKH, tWVKH, tSVKH, tDVKH -3, -33 tKHAX, tKHWX, tKHSX, tKHDX tKHQV tKHQZ, tGLQV, tGHQZ, 22 / 23 0.5ns to 0.3ns 0.5ns to 0.3ns 1.4V to 1.2V 0.8V to 0.6V 100ns to 50ns 40ns to 20ns 10ns to 5ns 20ns to 10ns 5ns ± 10uA to ± 5uA 0.5ns to 0.3ns 0.3ns to 0.5ns 1.7ns to 1.6ns 1.9ns to 1.8ns December 8, 2004 SONY® Rev. # CXK77K18R320GB Rev. Date Preliminary Description of Modification rev 0.5 06/09/03 1. Modified DC Electrical Characteristics section (p. 7). Removed IDD2 Power Supply Deselect Operating Current. 2. Modified JTAG ID Register definition (p. 18). Changed Part Number code from T.B.D. to 0000 0000 0111 0100. rev 0.6 07/08/03 1. Modified AC Electrical Characteristics section (p. 8). -3 tGLQV, tGHQZ -33 tGLQV, tGHQZ -4 tGLQV, tGHQZ 1.7ns to 2.5ns 1.8ns to 2.5ns 2.2ns to 2.5ns rev 0.7 03/31/04 1. Modified I/O Capacitance section (p. 5). 3.5pF to 4.0pF CIN CKIN 3.5pF to 4.5pF COUT 4.5pF to 5.0pF 2. Modified AC Electrical Characteristics section (p. 8). -3 tKHQV 1.5ns to 1.6ns tKHQZ 1.7ns to 1.8ns 3. Added note to Package Dimensions section regarding lead content in solder balls (p. 21). rev 0.8 12/08/04 3. Modified AC Electrical Characteristics section (p. 8). Added Note 1. 32Mb LW R-R, rev 0.8 23 / 23 December 8, 2004