TDK Corporation Corporate Headquarters 13-1,Nihonbashi 1-chome, chuo-ku Tokyo 103,Japan Phone: Tokyo (03)-3278-5111 Branch Office Sales div. Phone ( PRODUCT ) SPECIFICATION SPEC No.4CA-0600645 MESSRS: Coson DATE: Apr./2/2008 CUSTOMER’S PRODUCT NAME: TDK PRODUCT NAME: HHM1522E1 THIS SPECIFICATION IS: FULL RECEIVED DENIDE RECEIVED UNDER THE FOLLOWING CONDITIONS SIGNATURE: DATE: NAME (PRINT): TITLE: ELECTRONIC DEVICES BUSINESS GROUP DIVISION PREPARED BY APPROVED BY AUTHORIZED BY N.Ohyama T.Kono Y.Tsuya Apr./2/2008 Apr./2/2008 Apr./2/2008 SALES DIVISION PREPARED BY PRODUCT CLASSIFICATION CODE : AUTHORIZED BY No. 4CA-0600645 2/11 BALUN TRANSFORMER (TDK Part Number: HHM1522E1) Specification Apr./2/2007 TDK Corporation 1. Marking Direction mark 2. Mechanical Outline Package: Surface mount package Delivery medium: Tape on reel Soldering method: IR-reflow Size: 2.0 x 1.25mm typ. Height: 0.95mm typ. MECHANICAL DIMENSIONS 0.95+/-0.1 2.0+/-0.15 6 5 4 (TOP VIEW) 1.25+/-0.15 PIN FUNCTION 1 1 2 3 2 3 4 5 6 Unbalanced Port GND or DC feed+RF GND Balanced Port 1 Balanced Port 2 GND N.C. 0.3+/-0.2 0.2+/-0.2 0.65+/-0.2 1 2 0.35+/-0.2 3 (BOTTOM VIEW) 0.25+/-0.2 6 5 4 Unit: mm No. 4CA-0600645 3/11 Apr./2/2007 TDK Corporation 3. Coplanarity of HHM1522E1 0.1mm max. difference in Z-direction as follows 2.0mm Z 0.1mm max Terminal Each terminal extends the full of the HHM1522E1. Hence any coplanarity deviation between terminals is due to curvature in the substrate. TDK guarantees that the edge of each terminal is within 0.1mm of the horizontal plane. 4. Environment (Temperature & Humidity) 4-1 Operating & Storage condition Storage temperature range: -40 ~ +85 oC Operating temperature range: -40 ~ +85 oC Humidity: 0 ~ 90 % RH (Max. wet bulb temperature 38oC) 4-2 Storage condition before soldering Temperature: +5 ~ +30 oC Humidity: 20 ~ 70 % RH Term of storage: Within 6 months Baking: Unnecessary No. 4CA-0600645 4/11 Apr./2/2007 TDK Corporation 5. Electrical Specification Item Value Frequency 860-960MHz Insertion loss 1.2 dB Max Phase Difference at Balanced Port 180o+/-10o Amplitude Imbalance at Balanced Port 0+/-1 dB. Unbalanced Port Return Loss 10dB Min Unbalanced Port Impedance 50 ohm Balanced Port Impedance 50 ohm Power Capacity 0.5W Max. 6. Equivalent Circuit Unbalanced Port λ/4 λ/4 λ/4 λ/4 Balanced Port1 Balanced Port2 No. 4CA-0600645 5/11 Apr./2/2007 TDK Corporation 7. Test Circuit P h a s e B a la n c e a n d A m p lit u d e B a la n c e M e a s u r e m e n t N e tw o rk A n a ly z e r PORT1 PORT2 25ohm 50ohm S W IT C H 25ohm R e t u r n L o s s a n d I n s e r t io n L o s s M e a s u r e m e n t N e tw o rk A n a ly z e r PORT1 PORT2 N1 N2 T a p T ra n s N 1 /N 2 = 1 1 2 .5 o h m No. 4CA-0600645 6/11 Apr./2/2007 TDK Corporation 0.8 0.6 0.9 8. Recommended PCB Pattern Bal N.C Gnd Port2 0.4 0.3 0.3 0.2 HHM15 series 0.8 Unbal Port Gnd Bal Port1 0.7 φ0.3 thru-hole This width is 50 ohm. Micro-strip line for 0.4mm thick glass-epoxy substrate. No. 4CA-0600645 7/11 Apr./2/2007 TDK Corporation 9. Environmental and quality proposal The BALUN satisfies the electrical specification after the following tests. (When measured after two hours in normal conditions) Temperature All data initially taken at +25°C, then repeated at -40°C characteristics: and again at +85°C. Heat proof: +85 °C+/-2 °C for 500 hours Cold proof: -40 °C +/-2 °C or 500 hours Moisture proof: +60 °C +/-2 °C, 90~95% R.H. for 500 hours Heat shock: -40 ~ +85 °C for 96 cycles each cycle being 30 min Vibration: 10-500Hz vibration frequency with 1.52mmp-p amplitude for two hours in x,y,z directions Mechanical shock: 1.Acceleration 1000m/s2 2.Direction 3.Time Solderability X, Y, Z ,X’,Y’,Z’,axes 6ms duration and 3 times in each direction The dipped surface of the terminal shall be at least 75% covered with solder after dipped in solder bath of 235 o C+/-3 °C for 3+/-0.5 sec. Remark solder: Sn/Pb=60/40 Remark flux: Resin 25%, Alcohol 75% Solder heat shock: It shall be possible to hot air reflow the components twice with a temperature profile shown below. Drop shock: Dropped onto steel plate or concrete from 100cm height three times . Bending test: Solder specimen components on the test printed circuit board(L:100 x w:40 x t:0.8mm) in appended recommended PCB pattern Apply the load in direction of the arrow until bending reaches 2mm for 5+/-1 sec. No. 4CA-0600645 8/11 Apr./2/2007 TDK Corporation R340 2 gap+-1 45 45 Unit:mm Board adhesion Solder specimen components on the test printed circuit (Push test): board(L:100 x w:40 x t:0.8mm) in appended recommended PCB pattern Apply the load in direction of the arrow until 5N for 5 +/-1 sec . PCB DUT 5N No. 4CA-0600645 9/11 Apr./2/2007 TDK Corporation 10. Recommended reflowing temperature profile A. When using Pb free solder 3times reflow 260degC max 250+/-3degC within 10s 230degC 180degC Temp.(degC) 150degC More than 30s 90±30s Time B.When using Sn-Pb eutectic solder 3times reflow 240degC max 230+/-5degC within 10s 200degC Temp.(degC) 150degC Within 40s 90±30s Time No. 4CA-0600645 10/11 Apr./2/2007 TDK Corporation 11. Packing Carrier tape Sprocket hole J Loading Direction E K B C D A t H G F A B C D E F 1.5+/-0.2 2.2+/-0.2 8.0+/-0.3 3.5+/-0.05 1.75+/-0.1 4.0+/-0.1 G H J K t 2.0+/-0.05 4.0+/-0.1 1.5+0.1/0 1.2 MAX 0.3 max Unit : mm Reel dimensions 13+/-0.5 13+/-1.4 2.0+/-0.5 60+/-2.0 Label 21+/-0.5 Unit: mm 178+/-2.0 Standard packaging quantities 2000pcs/reel 9+/-0.3 No. 4CA-0600645 11/11 Apr./2/2007 TDK Corporation 12. Other This product is designed to be used with ordinary electronic equipment or devices, such as audio visual equipment office-automation equipment communications devices electrical appliances electronic toys If you want to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of which would directly endanger human life, such as medical instruments aerospace machinery military applications nuclear-reactor controllers fuel controllers other safety devices Please be sure to consult with our sales representative in advance.