Subject
Spec. No.
151-RJM-E2W00A
Low Resistance Value Chip Resistor
Part No.
ERJM1W
10 - 1
1.Dimension
ERJM1WT type
ERJM1WS type
a
a
W
W
L
L
T
1)
3)
2)
T
1)
4)
1) Protective Coating 2) Resistive Element
Resin
Alloy Metal
L
ERJM1WT
ERJM1WS
3) Terminal
Metal
W
T
3)
2)
4)
4) Outer
Terminal
Metal Plating
(Sn)
a
6.40+/-0.40
2.10+/-0.30
[.252+/-.016] 3.20+/-0.25 0.80+/-0.30 [.083+/-.012]
6.40+/-0.25 [.126+/-.010] [.031+/-.012] 1.00+/-0.25
[.252+/-.010]
[.039+/-.010]
Unit: mm, [inches]
2.Power Derating Curve
Category Temperature Range (Operating Temperature Range): -55 to +170 deg.C
120
70
Rated Load (%)
100
80
60
40
20
0
-55 -40
170
0
40
80
120
160
Ambient Temperature (deg.C)
Fig.1
PANASONIC ELECTRONIC DEVICES CO.,LTD.
200
Subject
Spec. No.
151-RJM-E2W00A
Low Resistance Value Chip Resistor
Part No.
ERJM1W
10 - 2
3.Ratings
Item
Specifications
Explanation
2.0W
(70deg.C)
When you use one at ambient temperature over
70deg.C, the load power shall be reduced as
shown in Fig.1.
Power Rating
The rated voltage at each resistance shall be calculated from the
equation below,
Rated Continuous
Voltage (RCWV)
Working
P × R
E＝
E: RCWV(V), P: Rated Power(W), R: Resistance Value(Ω)
Resistance Tolerance
F:+/-1%, J:+/-5%
Resistance Range
(Standard Resistance Value)
ERJM1WT type: 4mΩ (4mΩ)
ERJM1WS type: 5m to 10mΩ (5, 6, 7,10mΩ)
4. Explanation of Part Number
E
R
J
Chip Resistor
M
Structure
1
W
Rated Power
S
F
Type
Tolerance
5
M
0
Resistance Value
U
Packaging
(Ex.)
T
Wide Terminal
3M0
3mΩ
S
Standard Terminal
10M
10mΩ
F
+/- 1%
J
+/- 5%
U
Embossed Taping
5. Appearance and Construction
Item
Specifications and Explanation
Appearance and
Construction
1. The surface of resistor is covered with protective coating and hard to
fade, then don't have unevenness, flaw pinhole and discoloration.
2. The surface of terminal is covered by the plating. And the plating is
hard to fade, then don't have unevenness, flaw, pinhole and
discoloration.
3. The terminal is connected with resistive plate certainly.
PANASONIC ELECTRONIC DEVICES CO.,LTD.
Subject
Spec. No.
151-RJM-E2W00A
Low Resistance Value Chip Resistor
Part No.
ERJM1W
10 - 3
As far as there shall not designation especially, the following test and measurement
shall be operated under normal temperature(15 to 35deg.C), normal humidity(25 to
75%), normal atmospheric pressure(8.6×104 to 1.06×105Pa).
Resistance value shall be guaranteed as like followings.
<Measuring method: In measuring resistance value, 4 wires must be put on top terminal.>
Top terminal
Wire
×
×
×
×
6.Electrical Performance Characteristics
Item
DC
Resistance
Temperature
Coefficient
Specifications
DC Resistance value must be within
the specified tolerance.
ERJM1WT type
≥ 4mΩ
ERJM1WS type
≥ 5mΩ
Intermittent
Overload
+/-75×10-6/deg.C
Test Methods(Based on JIS - C5201)
Measuring current: 1A
20deg.C 65%RH
Sequence of temperature:
+25deg.C to +125deg.C
+/-75×10-6/deg.C
∆R = +/-(5%+0.5mΩ)
Resistance change after 1,000 cycles (1
second ON, 25 seconds OFF) at 5 W
Rated Power.
AC500V 1 minute
Dielectric
Withstanding
Insulation
Resistance
No evidence of flash over, mechanical
damage, arcing or insulation
breakdown.
Insulation
Resistance
Meter
or
AC Power
Supply
min.1GΩ
Measuring Voltage :DC500V
PANASONIC ELECTRONIC DEVICES CO.,LTD.
Subject
Spec. No.
151-RJM-E2W00A
Low Resistance Value Chip Resistor
Part No.
ERJM1W
10 - 4
7.Mechanical Performance Characteristics
Item
Specifications
Test Methods(Based on JIS-C5201)
Copper plate: t = 0.4mm
Pull speed :10mm/seconds
Fixed
Solder
Terminal Strength
min. 4.9N
P
Substrate : Glass Epoxy (t=1.6mm)
Span : 90mm
Bending Distance : 2mm (10 seconds)
ERJM1WT
ERJM1WS
A
B
C
3.1
2.1
2.2
4.2
3.4
A
Bending Strength
Without distinct deformation
in appearance
B
Unit: mm
A
C
Test Board
40mm
100mm
Solderability
Resistance to
Soldering Heat
min. 95% coverage
∆R = +/-(5%+0.5mΩ)
Resistors shall be dipped in the melted
solder bath at 230+/-5deg.C for 3+/-0.5
seconds. Next, flux shall be removed from
the surface of terminal with clean organic
solvent.
Resistors shall be dipped in the melted
solder bath at 270+/-3deg.C for 10+/-1
seconds.
PANASONIC ELECTRONIC DEVICES CO.,LTD.
Subject
Low Resistance Value Chip Resistor
Spec. No.
151-RJM-E2W00A
Part No.
ERJM1W
10 - 5
8.Enviromental Characteristics
Item
Specifications
Test Methods(Based on JIS-C5201)
High Temperature
Exposure
∆R = +/-(1%+0.5mΩ)
Resistors shall be exposed at 125+/-3deg.C
for 1000+48/-0 hours.
-55+/-3deg.C 30minutes
Temperature
Cycling
∆R = +/-(1%+0.5mΩ)
Normal temp. 30minutes
Humidity
(Steady State)
∆R = +/-(1%+0.5mΩ)
Load Life
∆R = +/-(3%+0.5mΩ)
Load Life in
Humidity
∆R = +/-(3%+0.5mΩ)
Used Printed Circuit Board
+125+/-3deg.C 30minutes
Resistors shall be exposed at 60+/-2deg.C
and 90 to 95% relative humidity in a humidity
test chamber for 1000+48/-0 hours.
Resistors shall be exposed at 70+/-2deg.C for
1000 +48/-0 hours. During this time the
rated voltage shall be applied intermittently for
1.5 hours ON,0.5 hours OFF.
Resistors shall be exposed at 60+/-2deg.C
and 90 to 95% relative humidity for
1000+48/-0 hours. During this time the rated
voltage shall be applied intermittently for 1.5
hours ON,0.5 hours OFF.
(Unit:mm)
68
28
T type2.2, S type4.2
48
35
Material:FR-4 (Test Board t=1.6mm)
Capper Thickness:70 micro meter
9.Resistance Value Marking
Express resistance value on resin side.
ERJM1WT type
ERJM1WS type
5 cycles
Example
4mΩ:R004
5mΩ:5M0 , 6mΩ:6M0 ,10mΩ:10M
PANASONIC ELECTRONIC DEVICES CO.,LTD.
Subject
Spec. No.
151-RJM-E2W00A
Low Resistance Value Chip Resistor
Part No.
ERJM1W
10 - 6
10.Recommended Pad Layout
ERJM1WT type
ERJM1WS type
3.1mm
2.1mm
Circuit Pattern
(Cu etc.)
Pad
3.4mm
3.4mm
Resist
2.2mm
4.2mm
11.Manufacturing Country
Indonesia
PANASONIC ELECTRONIC DEVICES CO.,LTD.
Subject
Low Resistance Value Chip Resistor
Spec. No.
151-RJM-E2W00A
Part No.
ERJM1W
10 - 7
12. Precautions in Handling Resistors
!
Precautions in Handling Resistors
(1) This specification shows the quality and performance of a unit component. Before adoption,
be sure to evaluate and verify the product mounting it in your product.
(2) We take no responsibility for troubles caused by the product usage that is not specified in this
specification.
(3) In traffic transportation equipment(trains, cars, traffic signal equipment, etc.), medical
equipment, aerospace equipment, electric heating appliances, combustion and gas
equipment, rotating equipment, disaster and crime preventive equipment, etc. in cases where
it is forecast that the failure of this product gives serious damage to the human life and
others, use fail-safe design and ensure safety by studying the following items to
•Ensure safety as the system by setting protective circuits and protective equipment.
•Ensure safety as the system by setting such redundant circuits as do not cause danger by
a single failure.
(4) When a doubt shall be occurred about safety for this product, be sure to inform us rapidly,
operate your technical examination.
(5) The products in this specification are intended for use in general standard applications for
general electronic equipment(AV products, household electric appliances, office equipment,
information and communication equipment, etc.); hence, they do not take the use under the
following special environments into consideration. Accordingly, the use in the following
special environments, and such environmental conditions may affect the performance of the
products; prior to use, verify the performance, reliability, etc. thoroughly
1) Use in liquids such as water, oil, chemical, and organic solvent
2) Use under direct sunlight and in outdoor and dusty atmospheres
3) Use in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, AND NOX.
4) Use in environment with large static electricity and strong electromagnetic waves.
5) Where the product is close to a heating component, and where an inflammable such as
a polyvinyl chloride wire is arranged close to the product.
6) Where the resistor is sealed and coated with resin, etc.
7) Where water or a water-soluble detergent is used in cleaning free soldering and in flux
cleaning after soldering. (Pay particular attention to a water-soluble flux.)
(6) If transient load (heavy load in a short time) like pulse is expected to be applied, carry out
evaluation and confirmation test with resistors actually mounted on your own board. When
the load more than rated power is applied under the load condition at steady state, it may
impair performance and/or reliability of resistor. Never exceed the rated power.
(7) The resistor temperature is dependent on the circuit board and pattern to be used, the heat
from the neighboring components and ambient temperatures. The resistor temperature may
rise up to 170deg.C (upper limit of Category Temperature Range (Operating Temperature
Range)) or higher even if you keep the rated power. Prior to use, be sure to evaluate the
product mounted on your own board, and then use it under the condition not to damage the
board and the neighboring components. When the product shall be used under special
condition, be sure to ask us in advance.
(8) Halogen type (Chlorine type, Bromine type, etc.) or other high-activity flux is not recommended
as the residue may affect performance or reliability of resistors.
(9) When soldering with soldering iron, never touch the body of the chip resistor with a tip of the
soldering iron. When using a soldering iron with a tip at high temperature, solder for a time
as short as possible. (3 seconds or less up to 350deg.C)
(10)Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers
or tweezers) as it may damage protective film or the body of resistor and may affect resistor's
performance.
(11)Keep the rated power and ambient temperature within the specified derating curve.
(12)Avoid immersion of chip resistor in solvent for a long time. Prior to use, verify the
performance.
PANASONIC ELECTRONIC DEVICES CO.,LTD.
Subject
Low Resistance Value Chip Resistor
Spec. No.
151-RJM-E2W00A
Part No.
ERJM1W
10 - 8
13.Storage Method
If the product is stored in the following environments and conditions, the
performance and solderability may be badly affected, avoid the storage in the
following environments.
1) Storage in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2
and NOX.
2) Storage in places exposed to direct sunlight.
3) Storage in places outside the temperature range of 5 to 35deg.C and humidity
range of 45 to 85%RH.
4) Storage over one year after our delivery (This item also applies to the case that
the storage method specified in Item 1) - 3) have been followed.)
14. Law, Regulation
1) This product has not been manufactured with any ozone depleting chemical
controlled under the Montreal Protocol.
2) This product complies with the RoHS Directive (Restriction of the use of certain
Hazardous. Substances in electrical and electronic equipment
(DIRECTIVE 2002/95/EC)).
3) All the materials used in this part are registered material under the Law
Concerning the Examination and Regulation of Manufactures, etc. of
Chemical substances.
4 All the materials used in this part contain no brominated materials of PBBOs
or PBBs as the flame-retardant.
5) If you need the notice by letter of "A preliminary judgement on the Laws of Japan
foreign exchange and Foreign Trade control", be sure to let us know.
PANASONIC ELECTRONIC DEVICES CO.,LTD.
Subject
Spec. No.
151-RJM-E2W00A
Low Resistance Value Chip Resistor
Part No.
ERJM1W
10 - 9
15. Recommendable reflow soldering profile
Recommendable reflow soldering
Temperature
Peak
Preheatin
Main heating
Time
<Lead-free solder>
Condition
Preheating 150 oC to 180 oC
Main
230 oC min.
heating
Peak
260 oC max.
Time
60 s to 120 s
30 s to 40 s
10 s max.
• Please measure temperature of terminals and study solderability every type of boards,
before actual use.
• Please inquire of us when you use the different conditions.
• Reflow soldering shall be within two times.
Recommendable flow soldering
Preheating
Soldering
<Lead-free solder>
Condition
Time
100 °C to 160 °C
60 s to 120 s
270 °C max.
10 s max.
Replacement with soldering iron
Note the followings in case of using soldering iron for replacement.
(1) The tip temperature should be less than 350 °C for the period within 3 s for each
terminal.
(2) The soldering iron tip should not touch the product directly.
PANASONIC ELECTRONIC DEVICES CO.,LTD.
Subject
Spec. No.
151-RJM-E2W00A
Low Resistance Value Chip Resistor
Part No.
ERJM1W
10 - 10
Taping
1. Application Range
This specification covers taping spec. of ERJM1W Type.
Min. 60.0
13.0 +/- 1.0
Carrier Tape
(Embossed)
Top Tape
Adhesive Tape
15.4 +/- 2.0
180.0 +0 / -3.0
Min. 60.0
2. Physical Dimensions
2-1 Structure and reel dimensions shall be as shown in the figure below.
13.0 +/- 1.0
Unit : mm
2-2 Carrier Tape Dimensions
T
φD0
P1
P2
P0
Sprocket Hole
E
F
B
W
φD1
Compartment
T2
Chip Resistor
A
A
B
W
F
E
P1
3.60+/-0.20
[.141+/-.008]
6.90+/-0.20
[.272+/-.008]
12.0+/-0.30
[.472+/-.012]
5.50+/-0.05
[.217+/-.002]
1.75+/-0.10
[.069+/-.004]
4.00+/-0.10
[.157+/-.004]
P2
P0
φD0
φD1
T
T2
2.00+/-0.05
[.079+/-.002]
4.00+/-0.10
[.157+/-.004]
1.50+0.10/-0
[.059+0.04/-0]
Min. 1.50
[Min. .059]
Max. 0.40
[Max. .016]
1.60+/-0.10
[.063+/-.004]
Unit: mm, [inches]
PANASONIC ELECTRONIC DEVICES CO.,LTD.
Subject
Low Resistance Value Chip Resistor
Spec. No.
151-RJM-E2W00A
Part No.
ERJM1W
10 - 11
3. Specifications
3-1 Specifications of Taping
• When the test shall be operated with the below conditions, the peel strength shall
be 0.098N to 0.686N and the tape shall not have flash and tear after peeling.
<Test Method>
Carrier Tape
Peeling Direction
10°
Top Tape
• Minimum Bending Radius
When the carrier tape shall be bent to Minimum Bending Radius (15mm), there
shall be no defection of chip and no break of the carrier tape. However the test
shall be done for 1 time.
• Resistance to climate
When resistors shall be exposed at 60deg.C, 90 to 95 %RH for 120 hours, there
shall be no defection of chip and no break of carrier tape. When the top tape
shall be peeled, it shall not have flash and tear.
3-2 Quantity in Reel : 3000 pcs./reel
3-3 Taping Condition
• Chip resistors shall not be sticking to top tape and bottom tape.
• Chip resistors shall be easy to take out from carrier tape.
• Compartment and sprocket hole shall not have flash and break.
4. Outer Packaging
Tape
Marking
• When reels shall not reach Max. quantity, the remaining empty space shall be
buried with buffer material.
• When the quantity shall be few, alternative packaging methods may be used. No
problem must occur during the exportation of the product.
5. Marking
• Side of Reel(Marking shall be on one side.)
1) Part Name('Fixed metal plate flat chip resistor' following part name on invoice)
2) Part Number 3) Quantity 4) Lot Number 5) Maker Name
6) Manufacturing Country
• Packaging Box
1) Part Number 2) Quantity 3) Maker Name
PANASONIC ELECTRONIC DEVICES CO.,LTD.