SGMICRO SGM2013

300mA, Low Power, Low Dropout,
3 -Terminal, Linear Regulators
SGM2013
GENERAL DESCRIPTION
FEATURES
The SGM2013 low-power, low-dropout, CMOS linear
voltage regulators operate from a 2.5V to 5.5V input and
deliver up to 300mA. They are perfect choice for low voltage,
low power applications. An ultra low ground current (200µA
at 300mA output) makes them attractive for battery
operated power systems. The SGM2013 series also offer
ultra low dropout voltage (300mV at 300mA output) to
prolong battery life in portable electronics
- Ultra-Low Dropout Voltage:
The output voltage is preset to voltages in the range of 1.8V
to 3.3V. Other features include foldback current limit and
thermal shut-down protection.
300mV at 300mA output
- Low 77µA No-Load Supply Current
- Low 200µA Operating Supply Current
-
at 300mA Output
High PSRR
Thermal-Overload Protection
Output Current Limit
Output Voltage:
Available in Fixed Outputs 1.8V, 2.5V, 2.7V, 2.8V,
2.9V, 3.0V and 3.3V
SGM2013 come in 3-pin SOT23 and 3-pin SOT89 package.
PIN CONFIGURATIONS(TOP VIEW)
APPLICATIONS
Cellular Telephones
Digital Cameras
MP3、MP4
USB 2.0
Modems
PC Cameras
Hand-Held Instruments
Electronic Dictionarys
Portable/Battery-Powered Equipment
GND
3
SOT23-3
GND
OUTPUT
IN
IN
OUT 2
TYPICAL OPERATION CIRCUIT
INPUT
1
IN
1
2
3
1
2
3
OUT
GND
IN
GND
IN
OUT
SOT89-3
SOT89-3(L-Type)
OUT
CIN
1μF
COUT
1μF
GND
SG Microelectronics Co, Ltd
Tel: 86/451/84348461
www.sg-micro.com
REV. C
ORDERING INFORMATION
MODEL
VOUT
(V)
PINPACKAGE
SPECIFIED
TEMPERATURE
RANGE
SOT23-3
SGM2013-1.8 1.8V
SGM2013-2.5 2.5V
SGM2013-2.7 2. 7V
SOT89-3
- 40°C to +125°C
SGM2013-3.0 3.0V
SGM2013-1.8XN3/TR
XD18
Tape and Reel, 3000
SGM2013-1.8XK3
Tape and Reel, 1000
SGM2013-1.8XK3/TR
SOT23-3
SGM2013-2.5XN3/TR
XD25
Tape and Reel, 3000
SGM2013-2.5XK3/TR
SGM2013-2.5XK3
Tape and Reel, 1000
SOT89-3
- 40°C to +125°C
SGM2013-1.8XK3L Tape and Reel, 1000
SOT89-3(L-Type)
SGM2013-2.5XK3L/TR
SOT23-3
SGM2013-2. 7XN3/TR
XD27
Tape and Reel, 3000
SGM2013-2. 7XK3/TR
SGM2013-2. 7XK3
Tape and Reel, 1000
SOT89-3
- 40°C to +125°C
SOT89-3
SGM2013-2.5XK3L Tape and Reel, 1000
SGM2013-2. 7XK3L/TR SGM2013-2. 7XK3L Tape and Reel, 1000
- 40°C to +125°C
SGM2013-2.8XN3/TR
XD28
Tape and Reel, 3000
SGM2013-2.8XK3/TR
SGM2013-2.8XK3
Tape and Reel, 1000
SOT89-3(L-Type)
SGM2013-2.8XK3L/TR
SOT23-3
SGM2013-2.9XN3/TR
XD29
Tape and Reel, 3000
SGM2013-2.9XK3/TR
SGM2013-2.9XK3
Tape and Reel, 1000
SOT89-3
- 40°C to +125°C
SGM2013-2.8XK3L Tape and Reel, 1000
SOT89-3(L-Type)
SGM2013-2.9XK3L/TR
SOT23-3
SGM2013-3.0XN3/TR
XD30
Tape and Reel, 3000
SGM2013-3.0XK3/TR
SGM2013-3.0XK3
Tape and Reel, 1000
SOT89-3
- 40°C to +125°C
SOT89-3(L-Type)
SGM2013-3.0XK3L/TR
SOT23-3
SGM2013-3.3 3.3V
PACKAGE
OPTION
SGM2013-1.8XK3L/TR
SOT23-3
SGM2013-2.9 2.9V
PACKAGE
MARKING
SOT89-3(L-Type)
SOT89-3(L-Type)
SGM2013-2.8 2.8V
ORDERING
NUMBER
SOT89-3
- 40°C to +125°C
SOT89-3(L-Type)
SGM2013-2.9XK3L Tape and Reel, 1000
SGM2013-3.0XK3L Tape and Reel, 1000
SGM2013-3.3XN3/TR
XD33
Tape and Reel, 3000
SGM2013-3.3XK3/TR
SGM2013-3.3XK3
Tape and Reel, 1000
SGM2013-3.3XK3L/TR
SGM2013-3.3XK3L Tape and Reel, 1000
ABSOLUTE MAXIMUM RATINGS
IN to GND.....................................................................- 0.3V to +6V
Output Short-Circuit Duration............................................Infinite
OUT to GND...................................................- 0.3V to (VIN + 0.3V)
Power Dissipation, PD @ TA = 25℃
SOT23-3 .....................................................................................0.4W
SOT89-3 ................................................................................0.571W
Package Thermal Resistance
SOT23-3, θJA....................................................................... 250℃/W
SOT89-3, θJA.........................................................................175°C/W
Operating Temperature Range................. ..........- 40°C to +125°C
Junction Temperature...........................................................+150°C
Storage Temperature.............................................- 65°C to +150°C
Lead Temperature (soldering, 10s).......................................260°C
ESD Susceptibility
HBM..........................................................................................4000V
MM..............................................................................................400V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational
sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
PIN DESCRIPTION
NAME
IN
GND
OUT
FUNCTION
Regulator Input. Supply voltage can range from 2.5V to 5.5V.
Ground.
Regulator Output.
2
SGM2013
ELECTRICAL CHARACTERISTICS
(VIN = VOUT (NOMINAL) + 0.5V (1), TA = - 40°C to +125°C, unless otherwise noted. Typical values are at TA = + 25°C.)
PARAMETER
Input Voltage
SYMBOL
CONDITIONS
MIN
VIN
IOUT =1mA to 300mA, TA = +25°C
VOUT + 0.5V≤VIN≤ 5.5V
Output Voltage Accuracy(1)
Maximum Output Current
Current Limit
Ground Pin Current
MAX
UNITS
2.5
5.5
V
-3
+3
%
300
ILIM
IQ
Dropout Voltage (2)
Line Regulation(1)
ΔVLNR
Load Regulation
ΔVLDR
Power Supply Rejection Rate
TYP
310
mA
750
mA
No load,
77
IOUT = 300mA,
200
IOUT = 1mA
0.8
IOUT = 300mA
300
380
0.03
0.15
%/V
0.0008
0.002
%/mA
VIN = 2.5V or (VOUT + 0.5V) to 5.5V,
IOUT = 1mA
IOUT = 0.1mA to 300mA, COUT = 1µF
145
µA
mV
f = 100Hz,
75
dB
f = 1KHz,
53
dB
TSHDN
160
℃
ΔTSHDN
15
℃
PSRR
ILOAD = 50mA, COUT = 1µF
THERMAL PROTECTION
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
Specifications subject to change without notice.
Note 1: VIN = VOUT(NOMINAL) + 0.5V or 2.5V, whichever is greater.
Note 2: The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT + 0.5V. (Only applicable for
VOUT = +2.5V to +5.0V.)
3
SGM2013
TYPICAL OPERATING CHARACTERISTICS
VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, TA = +25℃, unless otherwise noted.
Output Voltage vs.Load Current
3.4
2.85
3.35
Output Voltage(V)
Output Voltage(V)
Output Voltage vs.Load Current
2.9
2.8
2.75
3.3
3.25
VOUT = 2.8V
VOUT = 3.3V
2.7
3.2
0
100
200
Load Current(mA)
300
0
Ground Pin Current vs.Input Voltage
VOUT = 2.8V
VOUT = 3.3V
VOUT = 2.8V
160
Iload = 50mA
120
80
No Load
40
0
0
100
200
Load Current(mA)
300
0
Ground Pin Current vs.Input Voltage
5
6
No Load
Iload = 50mA
Output Voltage(V)
5
120
80
2
3
4
Input Voltage(V)
6
VOUT = 3.3V
160
1
Output Voltage vs.Input Voltage
200
Ground Pin Current(µA)
300
200
Ground Pin Current(µA)
Ground Pin Current(µA)
Ground Pin Current vs.Load Current
200
190
180
170
160
150
140
130
120
110
100
90
80
70
100
200
Load Current(mA)
No Load
40
VOUT = 3.3V
4
3
2
VOUT = 2.8V
1
0
0
0
1
2
3
4
Input Voltage(V)
5
0
6
4
1
2
3
4
Input Voltage(V)
5
6
SGM2013
TYPICAL OPERATING CHARACTERISTICS
VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, TA = +25℃, unless otherwise noted.
Power-Supply Rejection Ratio
vs.Frequency
Current limit vs.Temperature
90
1000
ILOAD = 50mA
VIN = VOUT+1V
80
900
Current limit(mA)
70
PSRR(dB)
60
50
COUT = 10μF
40
30
20
10
0
0.01
COUT = 1μF
0.1
1
10
Frequency(kHz)
800
700
V OUT = 3.3V
600
500
400
300
V OUT = 2.8V
200
100
100
-40 -20
1000
5
0
20 40 60 80
Temperature(℃)
100 120 140
SGM2013
TYPICAL OPERATING CHARACTERISTICS
VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, TA = +25℃, unless otherwise noted.
Output Voltage vs.Temperature
Output Voltage vs.Temperature
2.9
3.4
ILOAD = 150mA
Output Voltage(V)
2.85
2.8
2.75
3.35
3.3
3.25
VOUT = 3.3V
VOUT = 2.8V
2.7
3.2
-40 -20
0
20 40 60 80
Temperature(℃)
100 120 140
-40 -20
440
240
400
220
360
200
VOUT = 3.3V
180
160
140
120
VOUT = 2.8V
100
20 40 60 80
Temperature(℃)
100 120 140
TA = +125℃
320
TA = +85℃
280
TA = +25℃
240
200
TA = -40℃
160
120
80
ILOAD = 150mA
80
0
Dropout Voltage vs.Load Current
260
Dropout Voltage(mV)
Ground Pin Current(μA)
Ground Pin Current vs.Temperature
VOUT = 2.8V
40
0
60
-40 -20
0
20 40 60 80
Temperature(℃)
0
100 120 140
30
60
90 120 150 180 210 240 270 300
Load Current(mA)
Dropout Voltage vs.Load Current
Dropout Voltage(mV)
Output Voltage(V)
ILOAD = 150mA
360
330
300
270
240
210
180
150
120
90
60
30
0
TA = +125℃
TA = +85℃
TA = +25℃
TA = -40℃
VOUT = 3.3V
0
30
60
90 120 150 180 210 240 270 300
Load Current(mA)
6
SGM2013
Application Notes
When LDO is used in handheld products, Attention must be paid to voltage spike which would damage
SGM2013. In such applications, voltage spike will be generated at changer interface and VBUS pin of USB
interface when changer adapters and USB equipments are hot-inserted. Besides this, handheld products will
be tested on the production line on the condition of no battery. Test Engineer will apply power from the
connector pin which connects with positive pole of the battery. When external power supply is turned on
suddenly, the voltage spike will be generated at the battery connector. The voltage spike will be very high, it
always exceeds the absolute maximum input voltage (6.0V) of LDO. In order to get robust design. Design
Engineer needs to clear up this voltage spike. Zener diode is a cheap and effective solution to eliminate such
voltage spike. For example, BZM55B5V6 is a 5.6V small package Zener diode which can be used to
remove voltage spike in cell phone design. The schematic is shown in below:
Vcc
Input
BZM55B5V6
IN
1uF
C1
SGM2013
VOUT
VOUT
C2
4.7uF
GND
7
SGM2013
PACKAGE OUTLINE DIMENSIONS
SOT23-3
D
θ
b
0.20
Symbol
L
E
E1
L
0
e
C
e1
Min
Max
Min
Max
1.050
1.250
0.041
0.049
A1
0.000
0.100
0.000
0.004
A2
1.050
1.150
0.041
0.045
b
0.300
0.400
0.012
0.016
c
0.100
0.200
0.004
0.008
D
2.820
3.020
0.111
0.119
E
1.500
1.700
0.059
0.067
E1
2.650
2.950
0.104
0.116
A1
e
A
L
A2
Dimensions
In Inches
A
e1
8
Dimensions
In Millimeters
0.950TYP
1.800
2.000
0.700REF
0.037TYP
0.071
0.079
0.028REF
L1
0.300
0.600
0.012
0.024
θ
0°
8°
0°
8°
SGM2013
PACKAGE OUTLINE DIMENSIONS
SOT89-3
D
D1
A
Symbol
L
E1
E
A
b
b1
c
D
D1
E
E1
e
e1
L
e
b
e1
c
9
Dimensions
In Millimeters
Min
Max
Dimensions
In Inches
Min
Max
1.400
1.600
0.320
0.520
0.360
0.560
0.350
0.440
4.400
4.600
1.400
1.800
2.300
2.600
3.940
4.250
1.500TYP
2.900
3.100
0.900
1.100
0.055
0.063
0.013
0.020
0.014
0.022
0.014
0.017
0.173
0.181
0.055
0.071
0.091
0.102
0.155
0.167
0.060TYP
0.114
0.122
0.035
0.043
SGM2013
REVISION HISTORY
Location
Page
12/06— Data Sheet changed from REV. A to REV. B
Changed to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Added Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
03/07— Data Sheet changed from REV. B to REV. C
Changed to TYPICAL OPERATING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Shengbang Microelectronics Co, Ltd
Unit 3, ChuangYe Plaza
No.5, TaiHu Northern Street, YingBin Road Centralized Industrial Park
Harbin Development Zone
Harbin, HeiLongJiang 150078
P.R. China
Tel.: 86-451-84348461
Fax: 86-451-84308461
www.sg-micro.com
10
SGM2013