300mA , Low Power, Low Dropout, Linear Regulators SG2011 GENERAL DESCRIPTION FEATURES The SG2011 low-power, low-dropout, CMOS linear voltage regulators operate from a 2.5V to 5.5V input and deliver up to 300mA. They are perfect choice for low voltage, low power applications. An ultra low ground current (110µA at 300mA output) makes them attractive for battery operated power systems. The SG2011 series also offer ultra low dropout voltage (210mV at 300mA output) to prolong battery life in portable electronics. - Ultra-Low Dropout Voltage: The output voltage is preset to voltages in the range of 1.5V to 5.0V. Other features include foldback current limit and thermal shut-down protection. 210mV at 300mA output - Low 80µA No-Load Supply Current - Low 110µA Operating Supply Current - at 300mA Output Thermal-Overload Protection Output Current Limit Preset Output Voltages (±1.8% Accuracy) Output Voltage: Available in Fixed Outputs of 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, and 3.6V SG2011 comes in 3-pin SOT23 and 3-pin SOT89 packages. PIN CONFIGURATIONS（TOP VIEW） APPLICATIONS Cellular Telephones Digital Cameras MP3、MP4 USB 2.0 Modems PC Cameras Hand-Held Instruments Electronic Dictionarys Portable/Battery-Powered Equipment GND 1 3 IN OUT 2 SOT23-3 IN GND TYPICAL OPERATION CIRCUIT INPUT OUTPUT IN 1 2 3 1 2 3 OUT GND IN GND IN OUT SOT89-3 SOT89-3(L-Type) OUT CIN 1μF COUT 1μF GND SG Microelectronics Co, Ltd Tel: 86/451/84348461 www.sg-micro.com REV. B ORDERING INFORMATION MODEL VOUT (V) SG2011-1.5 1.5V SG2011-1.8 1.8V SG2011-2.5 2.5V SG2011-2.8 2.8V SG2011-3.0 3.0V PINPACKAGE SOT23-3 SOT89-3 SOT89-3(L-Type) SOT23-3 SOT89-3 SOT89-3(L-Type) SPECIFIED TEMPERATURE RANGE - 40°C to +125°C - 40°C to +125°C SOT23-3 SOT89-3 SOT89-3(L-Type) SOT23-3 SOT89-3 SOT89-3(L-Type) SOT23-3 SOT89-3 - 40°C to +125°C - 40°C to +125°C - 40°C to +125°C SOT89-3(L-Type) SG2011-3.3 3.3V SG2011-3.6 3.6V SOT23-3 SOT89-3 SOT89-3(L-Type) SOT23-3 SOT89-3 SOT89-3(L-Type) - 40°C to +125°C - 40°C to +125°C ORDERING NUMBER PACKAGE MARKING PACKAGE OPTION SG2011-1.5XN3/TR SG2011-1.5XK3/TR SG2011-1.5XK3L/TR SG2011-1.8XN3/TR SG2011-1.8XK3/TR SG2011-1.8XK3L/TR XB15 SG2011-1.5XK3 SG2011-1.5XK3L XB18 SG2011-1.8XK3 SG2011-1.8XK3L Tape and Reel, 3000 Tape and Reel, 1000 Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 Tape and Reel, 1000 SG2011-2.5XN3/TR XB25 Tape and Reel, 3000 SG2011-2.5XK3/TR SG2011-2.5XK3L/TR SG2011-2.8XN3/TR SG2011-2.8XK3/TR SG2011-2.8XK3L/TR SG2011-3.0XN3/TR SG2011-3.0XK3/TR SG2011-2.5XK3 SG2011-2.5XK3L XB28 SG2011-2.8XK3 SG2011-2.8XK3L XB30 SG2011-3.0XK3 Tape and Reel, 1000 Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 SG2011-3.0XK3L/TR SG2011-3.0XK3L Tape and Reel, 1000 SG2011-3.3XN3/TR SG2011-3.3XK3/TR SG2011-3.3XK3L/TR SG2011-3.6XN3/TR SG2011-3.6XK3/TR SG2011-3.6XK3L/TR XB33 SG2011-3.3XK3 SG2011-3.3XK3L XB36 SG2011-3.6XK3 SG2011-3.6XK3L Tape and Reel, 3000 Tape and Reel, 1000 Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 Tape and Reel, 1000 ABSOLUTE MAXIMUM RATINGS SOT89-3, θJA.........................................................................175°C/W Operating Temperature Range............................- 40°C to +125°C Junction Temperature...........................................................+150°C Storage Temperature.............................................- 65°C to +150°C Lead Temperature (soldering, 10s).......................................260°C ESD Susceptibility HBM..........................................................................................7000V MM..............................................................................................400V IN to GND.....................................................................- 0.3V to +6V Output Short-Circuit Duration............................................Infinite OUT to GND...................................................- 0.3V to (VIN + 0.3V) Power Dissipation, PD @ TA = 25℃ SOT23-3 .....................................................................................0.4W SOT89-3 ................................................................................0.571W Package Thermal Resistance SOT23-3, θJA....................................................................... 250℃/W Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PIN DESCRIPTION NAME IN GND OUT FUNCTION Regulator Input. Supply voltage can range from 2.5V to 5.5V. Ground. Regulator Output. ２ SG2011 ELECTRICAL CHARACTERISTICS (VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), TA = - 40°C to +125°C, unless otherwise noted. Typical values are at TA = + 25°C.) PARAMETER Input Voltage SYMBOL CONDITIONS MIN VIN IOUT = 0.1mA, TA = +25°C TYP MAX UNITS 2.5 5.5 V -1.8 1.8 IOUT = 0.1mA to 300mA, Output Voltage Accuracy 2.5 TA = 0°C to +70°C IOUT = 0.1mA to 300mA, 2.9 TA = - 40°C to +125°C 300 Output Current Current Limit Ground Pin Current ILIM IQ Dropout Voltage(Note1) Line Regulation ΔVLNR Load Regulation ΔVLDR Output Voltage Noise Power Supply Rejection Rate en % 310 mA 750 No load 80 IOUT = 300mA 110 mA 140 µA IOUT = 1mA 0.8 IOUT = 300mA 210 340 0.004 0.15 %/V 0.0005 0.002 %/mA VIN = 2.5V or (VOUT + 0.1V) to 5.5V, IOUT = 1mA IOUT = 0.1mA to 300mA, COUT = 1µF 120 µVRMS f = 100Hz, 74 dB f = 1KHz, 54 dB TSHDN 160 ℃ ΔTSHDN 15 ℃ PSRR f = 10Hz to 100KHz, COUT = 10µF mV ILOAD = 50mA, COUT = 1µF THERMAL PROTECTION Thermal Shutdown Temperature Thermal Shutdown Hysteresis Specifications subject to change without notice. Note 1: The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT + 0.5V. (Only applicable for VOUT = +2.5V to +5.0V) ３ SG2011 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, TA = +25℃, unless otherwise noted. Ground Pin Current vs.Input Voltage Ground Pin Current vs.Input Voltage 200 Iload = 50mA 80 Ground Pin Current(µA) Ground Pin Current(µA) 100 60 No Load 40 20 Iload = 50mA 150 100 No Load 50 VOUT = 2.5V VOUT = 3.3V 0 0 0 1 2 3 4 Input Voltage(V) 5 6 0 1 Output Voltage vs.Input Voltage 5 6 Ground Pin Current vs.Load Current 6 160 No Load 150 5 140 Ground Current(µA) Output Voltage(V) 2 3 4 Input Voltage(V) 4 VOUT = 3.3V 3 2 VOUT = 2.5V 1 130 VOUT = 3.3V 120 110 100 VOUT = 2.5V 90 80 70 60 0 0 1 2 3 4 Input Voltage(V) 5 0 6 100 150 200 Load Current(mA) 250 300 Output Vlotage vs.Load Current Output Voltage vs.Load Current 2.6 3.35 2.55 3.325 Output Voltage(V) Output Voltage(V) 50 2.5 2.45 3.3 3.275 VOUT = 3.3V VOUT = 2.5V 3.25 2.4 0 100 200 Load Current(mA) 0 300 ４ 100 200 Load Current(mA) 300 SG2011 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, TA = +25℃, unless otherwise noted. Line-Transient Response Load-Transient Response VIN = VOUT + 0.5V 4.5V 3.5V ILOAD = 0mA to 50mA VIN CIN = 1μF 3.05V 3V 2.95V ILOAD = 150mA VOUT 3.1V 3V VOUT 2.9V 50mA 0mA ILOAD VOUT = 3V VOUT = 3V 40µS/div 100µS/div Power-Supply Rejection Ratio vs.Frequency Load-Transient Response Near Dropout 80 VOUT = 3V 3.05V ILOAD = 50mA 70 VOUT 3V 60 PSRR(dB) 2.95V 50mA ILOAD 0mA 50 COUT = 10μF 40 30 20 CIN = 1μF VIN = VOUT + 0.1V COUT = 1μF 10 ILOAD = 0mA to 50mA 0 0.01 0.1 1 10 1000 Current limit vs.Temperature Region of Stable COUT ESR vs.Load Current 1200 100 VOUT = 3.3V 1100 1 Current limit(mA) COUT = 10μF 10 COUT ESR(Ω) 100 Frequency(kHz) 40µS/div COUT = 1μF Stable Region 0.1 1000 900 800 700 600 500 400 0.02 0.01 300 0 50 100 150 200 Load Current(mA) 250 300 -40 -20 ５ 0 20 40 60 80 Temperature(℃) 100 120 140 SG2011 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, TA = +25℃, unless otherwise noted. Output Voltage vs.Temperature Output Voltage vs.Temperature 3.4 2.6 ILOAD = 300mA Output Voltage(V) 2.55 2.5 2.45 3.35 3.3 3.25 VOUT = 3.3V VOUT = 2.5V 3.2 2.4 -40 -20 0 20 40 60 80 Temperature(℃) -40 -20 100 120 140 Ground Pin Current vs.Temperature 20 40 60 80 100 120 140 Dropout Voltage vs.Load Current 360 180 320 VOUT = 3.3V 160 Dropout Voltage(mV) Ground Pin Current(μA) 0 Temperature(℃) 200 140 120 VOUT = 2.5V 100 80 60 280 TA = +125℃ TA = +85℃ 240 200 TA = +25℃ 160 TA = -40℃ 120 80 40 ILOAD = 300mA VOUT = 2.5V 0 40 -40 -20 0 20 40 60 80 Temperature(℃) 0 100 120 140 30 60 90 120 150 180 210 240 270 300 Load Current(mA) Start Up Dropout Voltage vs.Load Current Input Voltage(V) 350 300 TA = +125℃ 250 TA = +85℃ 200 TA = +25℃ 150 100 50 VOUT = 3.3V 0 0 50 100 VOUT = 2.5V ILOAD = 1mA 6 4 2 0 TA = -40℃ Output Voltage(V) Dropout Voltage(mV) Output Voltage(V) ILOAD = 300mA 150 200 250 300 Load Current(mA) 2 1 0 Time(10µs/div) ６ SG2011 Application Notes When LDO is used in handheld products, Attention must be paid to voltage spike which would damage SG2011. In such applications, voltage spike will be generated at changer interface and VBUS pin of USB interface when changer adapters and USB equipments are hot-inserted. Besides this, handheld products will be tested on the production line on the condition of no battery. Test Engineer will apply power from the connector pin which connects with positive pole of the battery. When external power supply is turned on suddenly, the voltage spike will be generated at the battery connector. The voltage spike will be very high, it always exceeds the absolute maximum input voltage (6.0V) of LDO. In order to get robust design. Design Engineer needs to clear up this voltage spike. Zener diode is a cheap and effective solution to eliminate such voltage spike. For example, BZM55B5V6 is a 5.6V small package Zener diode which can be used to remove voltage spike in cell phone design. The schematic is shown in below: Vcc Input BZM55B5V6 IN 1uF C1 SG2011 VOUT VOUT C2 4.7uF GND ７ SG2011 PACKAGE OUTLINE DIMENSIONS SOT23-3 D θ b 0.20 Symbol L E E1 L 0 e C e1 Min Max Min Max 1.050 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.400 0.012 0.016 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 A1 e A L A2 Dimensions In Inches A e1 ８ Dimensions In Millimeters 0.950TYP 1.800 2.000 0.700REF 0.037TYP 0.071 0.079 0.028REF L1 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8° SG2011 PACKAGE OUTLINE DIMENSIONS SOT89-3 D D1 A Symbol L E1 E A b b1 c D D1 E E1 e e1 L e b e1 c ９ Dimensions In Millimeters Min Max Dimensions In Inches Min Max 1.400 1.600 0.320 0.520 0.360 0.560 0.350 0.440 4.400 4.600 1.400 1.800 2.300 2.600 3.940 4.250 1.500TYP 2.900 3.100 0.900 1.100 0.055 0.063 0.013 0.020 0.014 0.022 0.014 0.017 0.173 0.181 0.055 0.071 0.091 0.102 0.155 0.167 0.060TYP 0.114 0.122 0.035 0.043 SG2011 REVISION HISTORY Location Page 9/05— Data Sheet changed from preliminary to REV. A 12/06— Data Sheet changed from REV. A to REV. B Changed to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Added Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Shengbang Microelectronics Co, Ltd Unit 3, ChuangYe Plaza No.5, TaiHu Northern Street, YingBin Road Centralized Industrial Park Harbin Development Zone Harbin, HeiLongJiang 150078 P.R. China Tel.: 86-451-84348461 Fax: 86-451-84308461 www.sg-micro.com １０ SG2011