RICHTEK RT9004JGQW

RT9004
Preliminary
300mA, Low Noise, Ultra-Fast CMOS Triple LDOs Regulator
General Description
Features
The RT9004 is designed for portable RF and wireless
applications with demanding performance and space
requirements. The RT9004 performance is optimized for
battery-powered systems to deliver ultra low noise and
low quiescent current. Regulator ground current increases
only slightly in dropout, further prolonging the battery life.
The RT9004 also works with low-ESR ceramic capacitors,
reducing the amount of board space necessary for power
applications, critical in hand-held wireless devices. The
RT9004 consumes less than 0.01uA in shutdown mode
and has fast turn-on time less than 50us. RT9004 is short
circuit thermal folded back protected. RT9004 lowers its
OTP trip point from 165°C to 110°C when output short
circuit occurs (VOUT < 0.4V) providing maximum safety to
end users. The other features include ultra low dropout
voltage, high output accuracy, current limiting protection,
and high ripple rejection ratio. Available in the VDFN-10L
3x3 and WDFN-10L 3x3 packages, the RT9004 also offers
custom voltage, range of 1.5V to 3.5V with 0.1V per step.
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Ordering Information
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RT9004
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Operating Temperature Range
P : Pb Free with Commercial Standard
G : Green (Halogen Free with Commercial Standard)
Voltage Version : VOUT1/VOUT2/VOUT3
A : 2.8V/2.5V/1.8V
B : 3.0V/2.5V/1.8V
C : 2.8V/2.8V/1.8V
D : 2.8V/1.8V/1.8V
E : 3.3V/2.8V/1.8V
F : 3.3V/2.8V/2.8V
G : 2.5V/2.8V/2.5V
H : 2.8V/2.8V/1.5V
J : 1.5V/3.3V/3.3V
K : 3.0V/3.0V/1.8V
Richtek Pb-free and Green products are :
`RoHS compliant and compatible with the current require-
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Applications
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CDMA/GSM Cellular Handsets
Battery-Powered Equipment
Laptop, Palmtops, Notebook Computers
Hand-Held Instruments
PCMCIA Cards
Portable Information Appliances
Pin Configurations
(TOP VIEW)
VOUT1
VOUT2
GND
VOUT3
EN3
VIN1
EN1
8 VIN2
7 EN2
VIN3
1
10
2
9
3
GND
4
5
11
9
Note :
Package Type
QV : VDFN-10L 3x3 (V-Type)
QW : WDFN-10L 3x3 (W-Type)
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Short Circuit Thermal Folded Back Protection
Low-Noise for RF Application
Fast Response in Line/Load Transient
Quick Start-Up (Typically 50us)
Low Dropout : 220mV @ 300mA
Wide Operating Voltage Ranges : 2.5V to 5.5V
TTL-Logic-Controlled Shutdown Input
Low Temperature Coefficient
Thermal Shutdown Protection
Only 1uF Output Capacitor Required for Stability
High Power Supply Rejection Ratio
Custom Voltage Available
Small 10-Lead VDFN and WDFN Packages
RoHS Compliant and 100% Lead (Pb)-Free
V/WDFN-10L 3x3
Marking Information
For marking information, contact our sales representative
directly or through a Richtek distributor located in your
area, otherwise visit our website for detail.
ments of IPC/JEDEC J-STD-020.
`Suitable for use in SnPb or Pb-free soldering processes.
`100% matte tin (Sn) plating.
DS9004-00 February 2008
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1
RT9004
Preliminary
Typical Application Circuit
VIN
CIN
2.2uF
Chip Enable
Chip Shutdown
RT9004
VIN1
VOUT1
VOUT1
VIN2
VOUT2
VOUT2
VIN3
VOUT3
VOUT3
EN1
EN2
EN3
GND
COUT
1uF
VIN1
RT9004
VIN1
VOUT1
VOUT1
VIN2
VIN2
VOUT2
VIN3
VOUT2
VIN3
VOUT3
VOUT3
EN1
EN2
EN3
GND
CIN
1uF
Chip Enable
Chip Shutdown
COUT
1uF
Functional Pin Description
Pin Number
Pin Nam e
Pin Function
1
VOUT1
Output Voltage 1.
2
VOUT2
Output Voltage 2.
3
Exposed Pad (11)
GND
4
VOUT3
5
EN3
6
VIN3
7
EN2
8
VIN2
9
EN1
10
VIN1
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2
Ground. The exposed pad must be soldered to a large PCB and connected to GND
for maximum power dissipation.
Output Voltage 3.
Chip Enable 3 (Active High). Note that this pin is high impedance. There should be a
pull low 100kΩ resistor connected to GND when the control signal is floating.
Input Voltage 3.
Chip Enable 2 (Active High). Note that this pin is high impedance. There should be a
pull low 100kΩ resistor connected to GND when the control signal is floating.
Input Voltage 2.
Chip Enable 1 (Active High). Note that this pin is high impedance. There should be a
pull low 100kΩ resistor connected to GND when the control signal is floating.
Input Voltage 1.
DS9004-00 February 2008
RT9004
Preliminary
Function Block Diagram
EN1
Shutdown
and
Logic Control
VIN1
VREF
-
MOS Driver
+
Error
Amplifier
VOUT1
Current-Limit
and
Thermal
Protection
GND
EN2
Shutdown
and
Logic Control
VIN2
VREF
-
MOS Driver
+
Error
Amplifier
EN3
VOUT2
Current-Limit
and
Thermal
Protection
Shutdown
and
Logic Control
VIN3
VREF
-
MOS Driver
+
Error
Amplifier
DS9004-00 February 2008
VOUT3
Current-Limit
and
Thermal
Protection
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RT9004
Preliminary
Absolute Maximum Ratings
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(Note 1)
Supply Input Voltage -----------------------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C
V/WDFN-10L 3x3 ---------------------------------------------------------------------------------------------------------Package Thermal Resistance (Note 4)
V/WDFN-10L 3x3, θJA ---------------------------------------------------------------------------------------------------Junction Temperature ----------------------------------------------------------------------------------------------------Lead Temperature (Soldering, 10sec.) -------------------------------------------------------------------------------Storage Temperature Range -------------------------------------------------------------------------------------------ESD Susceptibility (Note 2)
HBM (Human Body Mode) ---------------------------------------------------------------------------------------------MM (Machine Mode) ------------------------------------------------------------------------------------------------------
Recommended Operating Conditions
6.0V
0.952 W
105°C/W
150°C
260°C
−65°C to 125°C
2kV
200V
(Note 3)
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Supply Input Voltage ------------------------------------------------------------------------------------------------------ 2.5V to 5.5V
Operation Ambient Temperature Range ------------------------------------------------------------------------------ −40°C to 85°C
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Operation Junction Temperature Range ------------------------------------------------------------------------------ −40°C to 125°C
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Electrical Characteristics
(VIN = VOUT + 1V, CIN = COUT = 1μF, TA = 25°C, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
Output Voltage Accuracy
ΔVOUT
IOUT = 1mA
−2
--
+2
%
Current Limit
ILIM
RLOAD = 1Ω
360
400
--
mA
Quiescent Current
IQ
--
90
--
μA
Dropout Voltage (Note 4)
VDROP
VEN >= 1.2V, IOUT = 0mA
IOUT = 200mA
--
170
--
IOUT = 300mA
--
220
--
Line Regulation
ΔVLINE
VIN = (VOUT + 1V) to 5.5V,
IOUT = 1mA
--
--
0.3
%
Load Regulation
ΔVLOAD 1mA < IOUT < 300mA
--
--
0.6
%
Standby Current
ISTBY
VEN = GND, Shutdown
--
0.01
1
μA
EN Input Bias Current
IIBSD
VEN = GND or VIN
--
0
100
nA
VIL
VIN = 3V to 5.5V, Shutdown
--
--
0.4
1.2
--
--
--
−60
--
--
−30
--
EN Threshold
Power Supply
Rejection Rate
Logic-Low Voltage
Logic-High Voltage VIH
f = 100Hz
f = 10kHz
PSRR
VIN = 3V to 5.5V, Start-Up
COUT = 1μF, IOUT = 100mA
mV
V
dB
Thermal Shutdown Temperature
TSD
--
165
--
°C
Thermal Shutdown Hysteresis
ΔTSD
--
30
--
°C
Thermal Folded Back Temperature
ΔTTFB
--
110
--
°C
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DS9004-00 February 2008
Preliminary
RT9004
Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. Devices are ESD sensitive. Handling precaution is recommended.
Note 3. The device is not guaranteed to function outside its operating conditions.
Note 4. θJA is measured in the natural convection at TA = 25°C on a low effective thermal conductivity test board (single-later,
1s) of JEDEC 51-3 thermal measurement standard.
DS9004-00 February 2008
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5
RT9004
Preliminary
Typical Operating Characteristics
Quiesent Current vs. Temperature
Output Voltage vs. Temperature
100
VIN = 5V
CIN = COUT = 1uF
VIN = 3.3V
VOUT = 1.5V
CIN = COUT = 1uF
95
Quiescent Current (uA)
Output Voltage (V)
2
1.9
1.8
No Load
1.7
90
85
80
75
70
65
60
1.6
-50
-25
0
25
50
75
100
-50
125
-25
0
VIN = 3.3V
VOUT = 1.5V
CIN = COUT = 1uF
0.75
0.5
125
VOUT = 1.5V
CIN = COUT = 1uF
500
450
400
350
300
0.25
-50
-25
0
25
50
75
100
2
125
2.5
3
Temperature (°C)
20
VOUT = 3.3V
CIN = COUT = 1uF
3.5
4
4.5
5
5.5
6
6.5
Input Voltage (V)
Dropout Voltage vs. Load Current
TJ = 125°C
250
PSRR
VOUT = 2.5V
CIN = COUT = 1uF, X7R
0
200
TJ = 25°C
PSRR (dB)
Dropout Voltage (mV)
100
550
Current Limit (mA)
EN Pin Threshold Voltage (V)
600
1
300
75
Current Limit vs. Input Voltage
EN Pin Shutdown Threshold vs. Temperature
1.25
50
Temperature (°C)
Temperature (°C)
1.5
25
150
TJ = -40°C
100
-20
-40
ILOAD = 100mA
-60
50
ILOAD = 10mA
0
-80
0
0.05
0.1
0.15
0.2
Load Current (A)
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0.25
0.3
10
0.01
100
0.1
1K
1
10K
10
100K
100
1M
1000
Frequency (kHz)
(Hz)
DS9004-00 February 2008
RT9004
Preliminary
Line Transient Response
Output Voltage
Deviation (mV)
Output Voltage
Deviation (mV)
3
20
0
-20
100
CIN = COUT = 1uF
Input Voltage
Deviation (V)
4
ILOAD = 250mA
5
4
3
50
0
-50
Time (100μs/Div)
Time (100μs/Div)
Load Transient Response
Load Transient Response
VIN = 3.3V
CIN = COUT = 1uF
VOUT = 1.5V
ILOAD= 1mA to 50mA
50
0
Output Voltage
Deviation (mV)
Output Voltage
Deviation (mV)
Load Current
(mA)
ILOAD = 50mA
Load Current
(mA)
Input Voltage
Deviation (V)
CIN = COUT = 1uF
5
Line Transient Response
50
0
-50
400
0
50
0
-50
Time (100μs/Div)
Start Up
Start Up
VIN = 3.3V, CIN = 2.2μF
VIN = 3.3V, CIN = 2.2μF
EN
(2V/Div)
VOUT1
(2V/Div)
EN
(2V/Div)
VOUT1
(2V/Div)
VOUT2
(2V/Div)
VOUT2
(2V/Div)
VOUT3
(200mV/Div)
VOUT3
(2V/Div)
DS9004-00 February 2008
VOUT = 1.5V
ILOAD = 1mA to 250mA
200
Time (100μs/Div)
Time (10μs/Div)
VIN = 3.3V
CIN = COUT = 1uF
Time (25μs/Div)
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7
RT9004
Preliminary
Noise
Noise
VOUT = 2.5V, ILOAD = 150mA
600
400
400
Noise (uV/Div)
Noise (uV/Div)
VOUT = 2.8V, ILOAD = 150mA
600
200
0
-200
200
0
-200
-400
-400
-600
-600
Time (1ms/Div)
Time (1ms/Div)
Noise
VOUT = 1.8V, ILOAD = 150mA
600
Noise (uV/Div)
400
200
0
-200
-400
-600
Time (1ms/Div)
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DS9004-00 February 2008
RT9004
Preliminary
Applications Information
Like any low-dropout regulator, the external capacitors used
with the RT9004 must be carefully selected for regulator
stability and performance. Using a capacitor whose value
is > 2.2μF on the RT9004 input and the amount of
capacitance can be increased without limit. The input
capacitor must be located a distance of not more than
0.5 inch from the input pin of the IC and returned to a
clean analog ground. Any good quality ceramic or tantalum
can be used for this capacitor. The capacitor with larger
value and lower ESR (equivalent series resistance) provides
better PSRR and line-transient response.
The output capacitor must meet both requirements for
minimum amount of capacitance and ESR in all LDOs
application. The RT9004 is designed specifically to work
with low ESR ceramic output capacitor in space-saving
and performance consideration. Using a ceramic capacitor
whose value is at least 1μF with ESR is > 20mΩ on the
RT9004 output ensures stability. The RT9004 still works
well with output capacitor of other types due to the wide
stable ESR range. Figure 1 shows the curves of allowable
ESR range as a function of load current for various output
capacitor values. Output capacitor of larger capacitance
can reduce noise and improve load transient response,
stability, and PSRR. The output capacitor should be located
not more than 0.5 inch from the VOUT pin of the RT9004
and returned to a clean analog ground.
Enable Function
The RT9004 features an LDO regulator enable/disable
function. To assure the LDO regulator will switch on, the
EN turn on control level must be greater than 1.2 volts.
The LDO regulator will go into the shutdown mode when
the voltage on the EN pin falls below 0.4 volts. For to
protecting the system, the RT9004 have a quick-discharge
function. If the enable function is not needed in a specific
application, it may be tied to VIN to keep the LDO
regulator in a continuously on state.
Thermal Considerations
Thermal protection limits power dissipation in RT9004.
When the operation junction temperature exceeds 165°C,
the OTP circuit starts the thermal shutdown function and
turns the pass element off. The pass element turn on again
after the junction temperature cools by 30°C.
RT9004 lowers its OTP trip level from 165°C to 110°C
when output short circuit occurs (VOUT < 0.4V) as shown
in Figure 2. This limits IC case temperature under 100°C
and provides maximum safety to end users when output
short circuit occurs.
VOUT Short to GND
0.4V
VOUT
Region of Stable COUT ESR vs. Load Current
100.00
100
IOUT
Instable
C OUT ESR (Ω)
10
10.00
TSD
COUT = 1uF
1.001
165 °C
110 °C
OTP Trip Point
110 °C
Stable
0.10
IC Temperature
80 °C
0.01
COUT = 1μF, X7R
Instable
0.00
0
50
100
150
200
Load Current (mA)
250
300
Figure 2. Short Circuit Thermal Folded Back Protection
when Output Short Circuit Occurs
Figure 1
DS9004-00 February 2008
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9
Preliminary
For continuous operation, do not exceed absolute
maximum operation junction temperature 125°C. The
power dissipation definition in device is :
PD = (VIN-VOUT) x IOUT + VIN x IQ
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
be calculated by following formula :
PD(MAX) = ( TJ(MAX) - TA ) /θJA
Where T J(MAX) is the maximum operation junction
temperature 125°C, TA is the ambient temperature and the
θJA is the junction to ambient thermal resistance.
For recommended operating conditions specification of
RT9004, where T J(MAX) is the maximum junction
temperature of the die (125°C) and TA is the maximum
ambient temperature. The junction to ambient thermal
resistance θJA is layout dependent. For VDFN-10L 3x3
and WDFN-10L 3x3 packages, the thermal resistance θJA
is 105°C/W on the standard JEDEC 51-3 single-layer 1s
thermal test board and 70°C/W on the standard JEDEC
51-7 4-layers 2S2P thermal test board. The maximum
power dissipation at TA = 25°C can be calculated by
following formula :
1500
Maximum Power Dissipation (mW)
(mΩ)
RT9004
1350
1200
4-Layers Board
1050
900
750
600
450
Single-Layer Board
300
150
0
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 3. Derating Curves for RT9004 Package
PD(MAX) = ( 125°C - 25°C ) / 105 = 0.952 W for single-layer
1s board
PD(MAX) = ( 125°C - 25°C ) / 70 = 1.428 W for 4-layers
2S2P board
The maximum power dissipation depends on operating
ambient temperature for fixed T J(MAX) and thermal
resistance θJA. For RT9004 packages, the Figure 3 of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
allowed.
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DS9004-00 February 2008
RT9004
Preliminary
Outline Dimension
D2
D
L
E
E2
1
e
SEE DETAIL A
2
b
A3
Symbol
1
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
0.800
1.000
0.031
0.039
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.180
0.300
0.007
0.012
D
2.950
3.050
0.116
0.120
D2
2.300
2.650
0.091
0.104
E
2.950
3.050
0.116
0.120
E2
1.500
1.750
0.059
0.069
e
L
2
DETAIL A
Pin #1 ID and Tie Bar Mark Options
A
A1
1
0.500
0.350
0.020
0.450
0.014
0.018
V-Type 10L DFN 3x3 Package
DS9004-00 February 2008
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11
RT9004
Preliminary
D2
D
L
E
E2
1
e
SEE DETAIL A
2
b
A3
Symbol
2
1
DETAIL A
Pin #1 ID and Tie Bar Mark Options
A
A1
1
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.180
0.300
0.007
0.012
D
2.950
3.050
0.116
0.120
D2
2.300
2.650
0.091
0.104
E
2.950
3.050
0.116
0.120
E2
1.500
1.750
0.059
0.069
e
L
0.500
0.350
0.020
0.450
0.014
0.018
W-Type 10L DFN 3x3 Package
Richtek Technology Corporation
Richtek Technology Corporation
Headquarter
Taipei Office (Marketing)
5F, No. 20, Taiyuen Street, Chupei City
8F, No. 137, Lane 235, Paochiao Road, Hsintien City
Hsinchu, Taiwan, R.O.C.
Taipei County, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611
Tel: (8862)89191466 Fax: (8862)89191465
Email: [email protected]
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DS9004-00 February 2008