009 CY7C109 CY7C1009 128K x 8 Static RAM Features • High speed — tAA = 10 ns • Low active power — 1017 mW (max., 12 ns) • Low CMOS standby power — 55 mW (max.), 4 mW (Low power version) • 2.0V Data Retention (Low power version) • Automatic power-down when deselected • TTL-compatible inputs and outputs • Easy memory expansion with CE1, CE2, and OE options active HIGH chip enable (CE2), an active LOW output enable (OE), and three-state drivers. Writing to the device is accomplished by taking chip enable one (CE1) and write enable (WE) inputs LOW and chip enable two (CE2) input HIGH. Data on the eight I/O pins (I/O0 through I/O7) is then written into the location specified on the address pins (A0 through A16). Reading from the device is accomplished by taking chip enable one (CE1) and output enable (OE) LOW while forcing write enable (WE) and chip enable two (CE2) HIGH. Under these conditions, the contents of the memory location specified by the address pins will appear on the I/O pins. Functional Description The eight input/output pins (I/O0 through I/O7) are placed in a high-impedance state when the device is deselected (CE1 HIGH or CE2 LOW), the outputs are disabled (OE HIGH), or during a write operation (CE1 LOW, CE2 HIGH, and WE LOW). The CY7C109 / CY7C1009 is a high-performance CMOS static RAM organized as 131,072 words by 8 bits. Easy memory expansion is provided by an active LOW chip enable (CE1), an The CY7C109 is available in standard 400-mil-wide SOJ and 32-pin TSOP type I packages. The CY7C1009 is available in a 300-mil-wide SOJ package. The CY7C1009 and CY7C109 are functionally equivalent in all other respects. Logic Block Diagram Pin Configurations SOJ Top View NC A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 GND I/O0 INPUT BUFFER I/O1 ROW DECODER I/O2 SENSE AMPS A0 A1 A2 A3 A4 A5 A6 A7 A8 512 x 256 x 8 ARRAY I/O3 I/O4 I/O5 COLUMN DECODER CE1 CE2 WE I/O7 A9 A 10 A 11 A 12 A 13 A14 A15 A16 OE I/O6 POWER DOWN 109–1 A11 A9 A8 A13 WE CE2 A15 VCC NC A16 A14 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC A15 CE2 WE A13 A8 A9 A11 OE A10 CE1 I/O7 I/O6 I/O5 I/O4 I/O3 109–2 TSOP I Top View (not to scale) 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE I/O7 I/O6 I/O5 I/O4 I/O3 GND I/O2 I/O1 I/O0 A0 A1 A2 A3 109–3 Selection Guide 7C109-10 7C1009-10 10 195 10 2 Maximum Access Time (ns) Maximum Operating Current (mA) Maximum CMOS Standby Current (mA) Maximum CMOS Standby Current (mA) Low Power Version 7C109-12 7C1009-12 12 185 10 2 7C109-15 7C1009-15 15 155 10 2 7C109-20 7C1009-20 20 140 10 — 7C109-25 7C1009-25 25 135 10 — 7C109-35 7C1009-35 35 125 10 — Shaded areas contain preliminary information. Cypress Semiconductor Corporation Document #: 38-05032 Rev. ** • 3901 North First Street • San Jose • CA 95134 • 408-943-2600 Revised August 24, 2001 CY7C109 CY7C1009 Maximum Ratings (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ................................. –65°C to +150°C Ambient Temperature with Power Applied............................................. –55°C to +125°C Static Discharge Voltage ........................................... >2001V (per MIL-STD-883, Method 3015) Latch-Up Current..................................................... >200 mA Operating Range Supply Voltage on VCC to Relative GND[1] .... –0.5V to +7.0V Range DC Voltage Applied to Outputs in High Z State[1] ....................................–0.5V to VCC + 0.5V Commercial DC Input Voltage[1] ................................–0.5V to VCC + 0.5V Industrial Ambient Temperature[2] VCC 0°C to +70°C 5V ± 10% −40°C to +85°C 5V ± 10% Current into Outputs (LOW) .........................................20 mA Electrical Characteristics Over the Operating Range[3] 7C109-10 7C1009-10 Parameter Description Test Conditions Min. Max. 2.4 7C109-12 7C1009-12 Min. Max. VOH Output HIGH Voltage VCC = Min., IOH = –4.0 mA 2.4 VOL Output LOW Voltage VCC = Min., IOL = 8.0 mA VIH Input HIGH Voltage 2.2 VCC + 0.3 2.2 VCC + 0.3 VIL Input LOW Voltage[1] –0.3 0.8 –0.3 IIX Input Load Current GND < VI < VCC –1 +1 IOZ Output Leakage Current GND < VI < VCC, Output Disabled –5 +5 IOS Output Short Circuit Current[3] VCC = Max., VOUT = GND –300 ICC VCC Operating Supply Current VCC = Max., IOUT = 0 mA, f = fMAX = 1/tRC ISB1 Automatic CE Power-Down Current —TTL Inputs ISB2 Automatic CE Power-Down Current —CMOS Inputs 0.4 7C109-15 7C1009–15 Min. Max. 2.4 V 0.4 V 2.2 VCC + 0.3 V 0.8 –0.3 0.8 V –1 +1 –1 +1 µA –5 +5 –5 +5 µA –300 –300 mA 195 185 155 mA Max. VCC, CE1 > VIH or CE2 < VIL, VIN > VIH or VIN < VIL, f = fMAX 45 45 40 mA Max. VCC, CE1 > VCC – 0.3V, or CE2 < 0.3V, VIN > VCC – 0.3V, or VIN < 0.3V, f=0 10 10 10 mA 2 2 2 L 0.4 Unit Shaded areas contain preliminary information. Document #: 38-05032 Rev. ** Page 2 of 12 CY7C109 CY7C1009 Electrical Characteristics Over the Operating Range (continued) 7C109-20 7C1009-20 Parameter Description Test Conditions Min. Max. 2.4 7C109-25 7C1009-25 Min. 7C109-35 7C1009-35 Max. 2.4 VOH Output HIGH Voltage VCC = Min., IOH = –4.0 mA VOL Output LOW Voltage VCC = Min., IOL = 8.0 mA VIH Input HIGH Voltage VIL Input LOW Voltage[1] IIX Input Load Current GND < VI < VCC IOZ Output Leakage Current GND < VI < VCC, Output Disabled IOS Output Short Circuit Current[3] VCC = Max., VOUT = GND –300 ICC VCC Operating Supply Current VCC = Max., IOUT = 0 mA, f = fMAX = 1/tRC ISB1 Automatic CE Power-Down Current —TTL Inputs ISB2 Automatic CE Power-Down Current —CMOS Inputs Min. Max. Unit 2.4 0.4 V 0.4 0.4 V V 2.2 VCC + 0.3 2.2 VCC + 0.3 2.2 VCC + 0.3 –0.3 0.8 –0.3 0.8 –0.3 0.8 V –1 +1 –1 +1 –1 +1 µA –5 +5 –5 +5 –5 +5 µA –300 –300 mA 140 135 125 mA Max. VCC, CE1 > VIH or CE2 < VIL, VIN > VIH or VIN < VIL, f = fMAX 30 30 25 mA Max. VCC, CE1 > VCC – 0.3V, or CE2 < 0.3V, VIN > VCC – 0.3V, or VIN < 0.3V, f=0 10 10 10 mA Capacitance[4] Parameter Description CIN Input Capacitance COUT Output Capacitance Test Conditions Max. Unit 9 pF 8 pF TA = 25°C, f = 1 MHz, VCC = 5.0V Notes: 1. VIL (min.) = –2.0V for pulse durations of less than 20 ns. 2. TA is the “instant on” case temperature. 3. Not more than one output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds. 4. Tested initially and after any design or process changes that may affect these parameters. AC Test Loads and Waveforms R1 480Ω R1 480 Ω 5V ALL INPUT PULSES 5V OUTPUT 3.0V 90% OUTPUT 30 pF R2 255Ω INCLUDING JIG AND SCOPE (a) R2 255Ω 5 pF INCLUDING JIG AND SCOPE (b) GND ≤ 3ns 10% 90% 10% ≤ 3 ns 109–3 109–4 THÉVENIN EQUIVALENT 167Ω 1.73V OUTPUT Equivalent to: Document #: 38-05032 Rev. ** Page 3 of 12 CY7C109 CY7C1009 Switching Characteristics[3, 5] Over the Operating Range 7C109-10 7C1009-10 Parameter Min. Description Max. 7C109-12 7C1009-12 Min. Max. 7C109-15 7C1009-15 Min. Max. Unit READ CYCLE tRC Read Cycle Time tAA Address to Data Valid tOHA Data Hold from Address Change tACE CE1 LOW to Data Valid, CE2 HIGH to Data Valid 10 12 15 ns tDOE OE LOW to Data Valid 5 6 7 ns tLZOE OE LOW to Low Z tHZOE OE HIGH to High Z[6, 7] tLZCE 10 12 10 3 12 3 0 CE1 LOW to Low Z, CE2 HIGH to Low Z tHZCE CE1 HIGH to High Z, CE2 LOW to High Z tPU CE1 LOW to Power-Up, CE2 HIGH to Power-Up tPD CE1 HIGH to Power-Down, CE2 LOW to Power-Down 3 [6, 7] ns 3 0 10 ns 7 6 ns 7 ns 0 12 ns ns 0 3 0 15 6 5 ns 3 0 5 [7] 15 ns 15 ns WRITE CYCLE[8,9] tWC Write Cycle Time 10 12 15 ns tSCE CE1 LOW to Write End, CE2 HIGH to Write End 8 10 12 ns tAW Address Set-Up to Write End 8 10 12 ns tHA Address Hold from Write End 0 0 0 ns tSA Address Set-Up to Write Start 0 0 0 ns tPWE WE Pulse Width 8 10 12 ns tSD Data Set-Up to Write End 6 7 8 ns tHD Data Hold from Write End 0 0 0 ns 3 3 3 ns tLZWE tHZWE WE HIGH to Low Z [7] WE LOW to High Z [6, 7] 5 6 7 ns Shaded areas contain preliminary information. Notes: 5. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified IOL/IOH and 30-pF load capacitance. 6. tHZOE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage. 7. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device. 8. The internal write time of the memory is defined by the overlap of CE1 LOW, CE2 HIGH, and WE LOW. CE1 and WE must be LOW and CE2 HIGH to initiate a write, and the transition of any of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write. 9. The minimum write cycle time for Write Cycle no. 3 (WE controlled, OE LOW) is the sum of tHZWE and TSD. Document #: 38-05032 Rev. ** Page 4 of 12 CY7C109 CY7C1009 Switching Characteristics[3, 5] Over the Operating Range 7C109-20 7C1009-20 Parameter Description Min. Max. 7C109-25 7C1009-25 Min. Max. 7C109-35 7C1009-35 Min. Min. Unit 35 ns READ CYCLE tRC Read Cycle Time tAA Address to Data Valid tOHA Data Hold from Address Change tACE CE1 LOW to Data Valid, CE2 HIGH to Data Valid 20 25 35 ns tDOE OE LOW to Data Valid 8 10 15 ns tLZOE OE LOW to Low Z tHZOE OE HIGH to High Z[6, 7] tLZCE 20 25 20 3 5 0 CE1 LOW to Low Z, CE2 HIGH to Low Z tHZCE CE1 HIGH to High Z, CE2 LOW to High Z tPU CE1 LOW to Power-Up, CE2 HIGH to Power-Up tPD CE1 HIGH to Power-Down, CE2 LOW to Power-Down 5 8 5 0 20 ns 15 10 0 ns 0 10 3 [6, 7] ns 5 0 8 [7] 35 25 ns 15 0 25 ns ns ns 35 ns WRITE CYCLE[8] tWC Write Cycle Time 20 25 35 ns tSCE CE1 LOW to Write End, CE2 HIGH to Write End 15 20 25 ns tAW Address Set-Up to Write End 15 20 25 ns tHA Address Hold from Write End 0 0 0 ns tSA Address Set-Up to Write Start 0 0 0 ns tPWE WE Pulse Width 12 15 20 ns tSD Data Set-Up to Write End 10 15 20 ns tHD Data Hold from Write End 0 0 0 ns 3 5 5 ns tLZWE tHZWE [7] WE HIGH to Low Z [6, 7] WE LOW to High Z 8 10 15 ns Max Unit Data Retention Characteristics Over the Operating Range (L Version Only) Parameter Description VDR VCC for Data Retention ICCDR Data Retention Current tCDR Chip Deselect to Data Retention Time tR Operation Recovery Time Conditions No input may exceed VCC + 0.5V VCC = VDR = 2.0V, CE1 > VCC – 0.3V or CE2 < 0.3V, VIN > VCC – 0.3V or VIN < 0.3V Min. 2.0 V 50 µA 0 ns tRC ns Shaded areas contain preliminary information. Document #: 38-05032 Rev. ** Page 5 of 12 CY7C109 CY7C1009 Data Retention Waveform DATA RETENTION MODE VCC 4.5V 4.5V VDR > 2V tR tCDR CE 109-5 Switching Waveforms Read Cycle No. 1[10, 11] tRC ADDRESS tAA tOHA DATA OUT PREVIOUS DATA VALID DATA VALID 109–6 Read Cycle No. 2 (OE Controlled)[11, 12] ADDRESS tRC CE1 CE2 tACE OE tHZOE tDOE DATA OUT tLZOE HIGH IMPEDANCE tLZCE VCC SUPPLY CURRENT tHZCE HIGH IMPEDANCE DATA VALID tPD tPU 50% ICC 50% ISB 109–7 Notes: 10. Device is continuously selected. OE, CE1 = VIL, CE2 = VIH. 11. WE is HIGH for read cycle. 12. Address valid prior to or coincident with CE1 transition LOW and CE2 transition HIGH. Document #: 38-05032 Rev. ** Page 6 of 12 CY7C109 CY7C1009 Switching Waveforms (continued) Write Cycle No. 1 (CE1 or CE2 Controlled)[13, 14] tWC ADDRESS tSCE CE1 tSA CE2 tSCE tHA tAW tPWE WE tSD DATA I/O tHD DATA VALID 109–8 Write Cycle No. 2 (WE Controlled, OE HIGH During Write)[13, 14] tWC ADDRESS tSCE CE1 CE2 tSCE tAW tSA tHA tPWE WE OE tSD DATA I/O tHD DATAIN VALID NOTE 15 tHZOE 109–9 Notes: 13. Data I/O is high impedance if OE = VIH. 14. If CE1 goes HIGH or CE2 goes LOW simultaneously with WE going HIGH, the output remains in a high-impedance state. Document #: 38-05032 Rev. ** Page 7 of 12 CY7C109 CY7C1009 Switching Waveforms (continued) Write Cycle No. 3 (WE Controlled, OE LOW)[14] tWC ADDRESS tSCE CE1 CE2 tSCE tAW tHA tSA tPWE WE tSD NOTE 15 DATA I/O tHD DATA VALID tLZWE tHZWE 109–9 Note: 15. During this period the I/Os are in the output state and input signals should not be applied. Truth Table CE1 CE2 OE WE H X X X High Z Power-Down Standby (ISB) X L X X High Z Power-Down Standby (ISB) L H L H Data Out Read Active (ICC) L H X L Data In Write Active (ICC) L H H H High Z Selected, Outputs Disabled Active (ICC) Document #: 38-05032 Rev. ** I/O0 – I/O7 Mode Power Page 8 of 12 CY7C109 CY7C1009 Ordering Information Speed (ns) 10 12 15 20 25 35 Ordering Code Package Name Package Type CY7C109-10VC V33 32-Lead (400-Mil) Molded SOJ CY7C1009-10VC V32 32-Lead (300-Mil) Molded SOJ CY7C1009L-10VC V32 32-Lead (300-Mil) Molded SOJ CY7C109-12VC V33 32-Lead (400-Mil) Molded SOJ CY7C1009-12VC V32 32-Lead (300-Mil) Molded SOJ CY7C1009L-12VC V32 32-Lead (300-Mil) Molded SOJ CY7C109-12ZC Z32 32-Lead TSOP Type I CY7C109–15VC V33 32-Lead (400-Mil) Molded SOJ CY7C1009-15VC V32 32-Lead (300-Mil) Molded SOJ CY7C1009L-15VC V32 32-Lead (300-Mil) Molded SOJ CY7C109–15ZC Z32 32-Lead TSOP Type I Operating Range Commercial CY7C109–20VC V33 32-Lead (400-Mil) Molded SOJ CY7C1009-20VC V32 32-Lead (300-Mil) Molded SOJ CY7C109–20VI V33 32-Lead (400-Mil) Molded SOJ Industrial CY7C109–20ZC Z32 32-Lead TSOP Type I Commercial CY7C109-20ZI Z32 32-Lead TSOP Type I Industrial CY7C109–25VC V33 32-Lead (400-Mil) Molded SOJ Commercial CY7C1009-25VC V32 32-Lead (300-Mil) Molded SOJ CY7C109–25VI V33 32-Lead (400-Mil) Molded SOJ CY7C109–25ZC Z32 32-Lead TSOP Type I Commercial CY7C109-25ZI Z32 32-Lead TSOP Type I Industrial Commercial CY7C109–35VC V33 32-Lead (400-Mil) Molded SOJ CY7C1009-35VC V32 32-Lead (300-Mil) Molded SOJ CY7C109–35VI V33 32-Lead (400-Mil) Molded SOJ Industrial Industrial Shaded areas contain preliminary information. Document #: 38-05032 Rev. ** Page 9 of 12 CY7C109 CY7C1009 Package Diagrams 32-Lead (300-Mil) Molded SOJ V32 51-85041-A 32-Lead (400-Mil) Molded SOJ V33 51-85033-A Document #: 38-05032 Rev. ** Page 10 of 12 CY7C109 CY7C1009 Package Diagrams (continued) 32-Lead Thin Small Outline Package Z32 51-85056-B Document #: 38-05032 Rev. ** Page 11 of 12 © Cypress Semiconductor Corporation, 2001. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges. CY7C109 CY7C1009 Document Title: CY7C109, CY7C1009 128K x 8 Static RAM Document Number: 38-05032 REV. ECN NO. Issue Date Orig. of Change Description of Change ** 106826 09/15/01 SZV Change from Spec number: 38-00140 to 38-05032 Document #: 38-05032 Rev. ** Page 12 of 12