WEDC W7MG21M32SVT70BNI

W7MG1M32SVx-BN
W7MG21M32SVx-BN
White Electronic Designs
PRELIMINARY*
8MB/4MB (2x1Mx32 / 1Mx32) MirrorBit™ 3.0V, Boot Sector
Flash Memory Module
DESCRIPTION
The W7MG1M32SVx-BN and W7MG21M32SVx-BN are
organized as one and two banks of 1Mx32 respectively.
The modules are based on AMDs MirrorBit™ AM29LV160M
- 1Mx16 or S29AL016M (optional) Flash device in TSOP
packages which are mounted on an FR4 substrate.
Both modules offer access times between 70 and 120ns
allowing for operation of high-speed microprocessors
without wait states.
FEATURES
1Mx32 and 2x1Mx32 Densities
Based on AMD - AM29LV160M Flash Device
Spansion™ - S29AL016M (optional)
High Performance
• Access time as fast as 70ns
• 0.7s typical sector erase time
3V for read, erase, and program operations
Flexible, Sector Architecture
• One 16Kbyte, two 8Kbyte, one 32Kbyte and
thirty-one 64Kbyte sectors.
• Any combination of sectors can be erased
• Also supports full chip erase
Top boot block configurations
• Bottom boot block optional. Contact WEDC.
Embedded Erase Algorithms
• Automatically preprograms and erases the chip
or any combination of sectors
Embedded Program Algorithms
• Automatically programs and verifies data at
specified address
Data Polling and Toggle Bit feature for detection of
program or erase cycle completion
Low Power Dissipation
• 30mA per Device Active Current
• 10µA per Device CMOS Standby Current
Single 3.3V ±10% Supply
CMOS and TTL Compatible Inputs and Outputs
Commercial and industrial operating temperature
range
• BNC = 0°C to 70°C Commercial
• BNI = -40°C to 85°C Industrial
Package
• 80 Pin SIMM (JEDEC) Standard
* This product is under development, is not qualified or characterized and is subject to
change without notice.
FIG. 1 – BLOCK DIAGRAMS
W7MG1M32SVx-BN: 1Mx32 80 PIN SIMM
W7MG21M32SVx-BN: 2x1Mx32 80 PIN SIMM
WE2#
WE2#
1Mx16
WE#
DQ0-15
CE#
CE#
1Mx16
WE#
DQ16-31
DQ16-31
DQ0-15
Addr
0-19
CE#
CE#
Addr
0-19
1Mx16
WE#
WE0#
WE0#
1Mx16
WE#
DQ0-15
CE#
CE#
DQ0-15
CE#
CE#
1Mx16
WE#
Addr
0-19
DQ0-15
DQ0-15
DQ0-15
CE#
CE#
Addr
0-19
Addr
0-19
1Mx16
WE#
CE0#
DQ0-15
CE0#
CE#
CE#
Addr
0-19
CE1#
OE#
Addr 0-19
OE#
Addr 0-19
May 2004
Rev. 2
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
W7MG1M32SVx-BN
W7MG21M32SVx-BN
White Electronic Designs
PRELIMINARY
FIGURE 2 – DECOUPLING CAPACITORS ARE PROVIDED FOR IMPROVED NOISE IMMUNITY.
1
1
2
C8
.1 µF
2
C7
.1 µF
2
C6
.1 µF
2
2
C5
.1 µF
1
1
1
1
Notes:
Unless otherwise specified.
1. Population Configuration for 1M x 32 Version
Part Number
Configuration
W7MG1M32SVxxxBNX 1M x 32
2. Population Configuration for 2 x 1M x 32 Version
Part Number
Configuration
W7MG21M32SVxxxBNX 2 x 1M x 32
C4
.1 µF
2
C3
.1 µF
2
C2
.1 µF
2
C1
.1 µF
1
1
VCC
Component
1M x 8
Component
1M x 8
xx = Speed: 70, 90, 120ns
X = Temerature Range
Please refer to part number matrix pg. 8 or 9
May 2004
Rev. 2
2
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
W7MG1M32SVx-BN
W7MG21M32SVx-BN
White Electronic Designs
PRELIMINARY
FIGURE 3 – W7MG1M32SVxxxBNX & W7MG21M32SVxxxBNX PIN CONFIGURATION
Pin
Symbol
Pin
Symbol
Pin
Symbol
Pin
Symbol
1
GND
21
CE3
41
A11
61
DQ9
2
VCC
22
CE2
42
A10
62
DQ8
3
NC
23
CE1
43
A9
63
DQ7
4
OE#
24
CE0
44
A8
64
DQ6
5
WE0#
25
GND
45
A7
65
DQ5
6
NC
26
DQ29
46
A6
66
DQ4
7
NC*
27
DQ30
47
A5
67
DQ3
8
DQ16
28
DQ31
48
A4
68
DQ2
9
DQ17
29
WE2#
49
A3
69
DQ1
10
DQ18
30
NC
50
A2
70
DQ0
11
DQ19
31
NC
51
A1
71
NC
12
DQ20
32
NC
52
A0
72
VCC
13
DQ21
33
A19
53
NC
73
PD1
14
DQ22
34
A18
54
GND
74
PD2
15
DQ23
35
A17
55
DQ15
75
PD3
16
DQ24
36
A16
56
DQ14
76
PD4
17
DQ25
37
A15
57
DQ13
77
PD5
18
DQ26
38
A14
58
DQ12
78
PD6
19
DQ27
39
A13
59
DQ11
79
PD7
20
DQ28
40
A12
60
DQ10
80
GND
Notes:
Unless otherwise specified.
1. Population Configuration for 1M x 32 Version
Part Number
Configuration
W7MG1M32SVxxxBNX 1M x 32
2. Population Configuration for 2 x 1M x 32 Version
Part Number
Configuration
W7MG21M32SVxxxBNX 2 x 1M x 32
PIN NAMES
Component
1M x 8
A0 - A19
Address
DQ0 - DQ31
Data Input/Output
Component
1M x 8
CE1#, CE2#
Chip Enable
xx = Speed: 70, 90, 120ns
X = Temerature Range
Please refer to part number matrix pg. 8 or 9
NC* = Pin 7 can offer custom module options. For optional "Reset" or
"Ready Busy." Contact WEDC.
May 2004
Rev. 2
3
WE0#, WE2#
Write Enable
OE#
Output Enable
VCC
Power Supply
NC
No Connection
PD
Presence Detect
GND
Ground
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
W7MG1M32SVx-BN
W7MG21M32SVx-BN
White Electronic Designs
PRELIMINARY
PRESENCE DETECT TRUTH TABLE
Module Organization
PD1
PD2
PD3
PD4
1M x 32
1
0
1
0
2 x 1M x 32
0
1
0
0
MODULE SPEED IDENTIFICATION PRESENCE DETECT PIN
Speed
PD5
PD6
PD7
70 ns
0
0
1
90 ns
1
1
0
120 ns
0
1
0
LEGEND: 0 = Connected to GND
1 = Open circuit (no connection)
CAPACITANCE
f = 1.0MHZ, VIN = VCC or VSS
Parameter
Address Lines
Data lines
May 2004
Rev. 2
1Meg
2x1Meg
Max
Max
35
70
Symbol
CA
Unit
pF
CDQ
15
30
pF
Chip & Write Enable Lines
CC
15
30
pF
Output Enable lines
CG
35
70
pF
4
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
W7MG1M32SVx-BN
W7MG21M32SVx-BN
PRELIMINARY
ABSOLUTE MAXIMUM RATINGS
OPERATING RANGES
Storage Temperature
Plastic Packages ................................. –65°C to +150°C
Commercial (C) Devices
Ambient Temperature
with Power Applied ............................... –65°C to +125°C
Industrial (I) Devices
Ambient Temperature (TA) ........................ 0°C to +70°C
Ambient Temperature (TA) .................... –40°C to +85°C
Voltage with Respect to Ground
VCC Supply Voltages
VCC (Note 1) ...................................... –0.5 V to +4.0 V
VCC for all devices .................................... 2.7 V to 3.6 V
A9, OE#, and RESET# (Note 2) ...... –0.5 V to +12.5 V
Operating ranges define those limits between which the functionality of the device is
guaranteed.
All other pins (Note 1) .................. –0.5 V to VCC+0.5 V
Output Short Circuit Current (Note 3) ................. 200 mA
Notes:
1.
Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions,
input or I/O pins may overshoot VSS to –2.0 V for periods of up to 20 ns. See
Figure 7. Maximum DC voltage on input or I/O pins is VCC +0.5 V. During voltage
transitions, input or I/O pins may overshoot to VCC +2.0 V for periods up to 20
ns. See Figure 8.
2.
Minimum DC input voltage on pins A9, OE#, and RESET# is -0.5 V. During
voltage transitions, A9, OE#, and RESET# may overshoot VSS to –2.0 V for
periods of up to 20 ns. See Figure 7. Maximum DC input voltage on pin A9 is
+12.5 V which may overshoot to 14.0 V for periods up to 20 ns.
3.
No more than one output may be shorted to ground at a time. Duration of the
short circuit should not be greater than one second.
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the operational sections of this
data sheet is not implied. Exposure of the device to absolute maximum rating conditions
for extended periods may affect device reliability.
May 2004
Rev. 2
5
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
W7MG1M32SVx-BN
W7MG21M32SVx-BN
White Electronic Designs
PRELIMINARY
ORDERING INFORMATION FOR W7MG1M32SVx
COMMERCIAL
Part Number
W7MG1M32SVx70BNC
W7MG1M32SVx90BNC
W7MG1M32SVx120BNC
Speed (ns)
70
90
120
Package
346
346
346
TA Commercial Range
0°C to +70°C
0°C to +70°C
0°C to +70°C
Height*
21.59 (0.850")
21.59 (0.850")
21.59 (0.850")
Speed (ns)
70
90
120
Package
346
346
346
TA Industrial Range
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
Height*
21.59 (0.850")
21.59 (0.850")
21.59 (0.850")
INDUSTRIAL
Part Number
W7MG1M32SVx70BNI
W7MG1M32SVx90BNI
W7MG1M32SVx120BNI
PACKAGE NO. 346: 80 PIN SIMM (JEDEC)
118.24
(4.655) MAX.
3.05
(0.120)
MAX
111.35
(4.384)
21.59
(0.850)
MAX
R1 R3
J1
J3
6.35
(0.250)
153
1.27
(0.050) TYP
6.35 (0.250)
105.41
(4.150)
1.57
(0.062) R
10.16
(0.400)
1.57 (0.062) R
55.68
(2.192)
57.02
(2.245)
3.18
(0.125)
MIN
* ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES)
May 2004
Rev. 2
6
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
W7MG1M32SVx-BN
W7MG21M32SVx-BN
White Electronic Designs
PRELIMINARY
ORDERING INFORMATION FOR W7MG21M32SVx
COMMERCIAL
Part Number
W7MG21M32SVx70BNC
W7MG21M32SVx90BNC
W7MG21M32SVx120BNC
Speed (ns)
70
90
120
Package
361
361
361
TA Commercial Range
0°C to +70°C
0°C to +70°C
0°C to +70°C
Height*
21.59 (0.850")
21.59 (0.850")
21.59 (0.850")
Speed (ns)
70
90
120
Package
361
361
361
TA Industrial Range
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
Height*
21.59 (0.850")
21.59 (0.850")
21.59 (0.850")
INDUSTRIAL
Part Number
W7MG21M32SVx70BNI
W7MG21M32SVx90BNI
W7MG21M32SVx120BNI
PACKAGE NO. 361: 80 PIN SIMM (JEDEC)
118.24
(4.655) MAX.
4.32
(0.170)
MAX
111.35
(4.384)
21.59
(0.850)
MAX
R1 R3
J1
J3
6.35
(0.250)
153
1.27
(0.050) TYP
6.35 (0.250)
105.41
(4.150)
1.57
(0.062) R
10.16
(0.400)
1.57 (0.062) R
55.68
(2.192)
57.02
(2.245)
3.18 5.72
(0.125) (0.225)
MIN MIN
* ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES)
May 2004
Rev. 2
7
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
W7MG1M32SVx-BN
W7MG21M32SVx-BN
PRELIMINARY
FLASH PART NUMBER MATRIX
W 7 M G 1 M 32 S V X XX BN X
White Electronics Design
Flash
MirrorBit™
FR4 with gold contacts
Module Address depth: 1M
Module Bus width: x32
Component width: x16
Voltage: 3.3V
T = Top / B = Bottom Boot Block
Speed: 70, 90, 120
Package: 80 Pin SIMM
Temperature range:
C = 0˚C to 70˚C Commercial
I = -40˚C to 85˚C Industrial
May 2004
Rev. 2
8
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
W7MG1M32SVx-BN
W7MG21M32SVx-BN
PRELIMINARY
FLASH PART NUMBER MATRIX
W 7 M G 2 1 M 3 2 S V X XX BN X
White Electronics Design
Flash
MirrorBit™
FR4 with gold contacts
Bank
Module Address depth: 1M
Module Bus width: x32
Component width: x16
Voltage: 3.3V
T = Top / B = Bottom Boot Block
Speed: 70, 90, 120
Package: 80 Pin SIMM
Temperature range:
C = 0˚C to 70˚C Commercial
I = -40˚C to 85˚C Industrial
May 2004
Rev. 2
9
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
W7MG1M32SVx-BN
W7MG21M32SVx-BN
PRELIMINARY
Document Title
8MB/4MB (2x1Mx32 / 1Mx32) CMOS, MirrorBit™ 3.0V, Boot Sector Flash Memory
Revision History
Rev #
History
Release Date
Status
Rev 0
Created
5-04
Advanced
Rev 1
Added T/B (top or bottom boot block option)
6-04
Advanced
Rev. 2
Changed status from advanced to preliminary
6-04
Preliminary
May 2004
Rev. 2
10
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com