W7MG1M32SVx-BN W7MG21M32SVx-BN White Electronic Designs PRELIMINARY* 8MB/4MB (2x1Mx32 / 1Mx32) MirrorBit™ 3.0V, Boot Sector Flash Memory Module DESCRIPTION The W7MG1M32SVx-BN and W7MG21M32SVx-BN are organized as one and two banks of 1Mx32 respectively. The modules are based on AMDs MirrorBit™ AM29LV160M - 1Mx16 or S29AL016M (optional) Flash device in TSOP packages which are mounted on an FR4 substrate. Both modules offer access times between 70 and 120ns allowing for operation of high-speed microprocessors without wait states. FEATURES 1Mx32 and 2x1Mx32 Densities Based on AMD - AM29LV160M Flash Device Spansion™ - S29AL016M (optional) High Performance • Access time as fast as 70ns • 0.7s typical sector erase time 3V for read, erase, and program operations Flexible, Sector Architecture • One 16Kbyte, two 8Kbyte, one 32Kbyte and thirty-one 64Kbyte sectors. • Any combination of sectors can be erased • Also supports full chip erase Top boot block configurations • Bottom boot block optional. Contact WEDC. Embedded Erase Algorithms • Automatically preprograms and erases the chip or any combination of sectors Embedded Program Algorithms • Automatically programs and verifies data at specified address Data Polling and Toggle Bit feature for detection of program or erase cycle completion Low Power Dissipation • 30mA per Device Active Current • 10µA per Device CMOS Standby Current Single 3.3V ±10% Supply CMOS and TTL Compatible Inputs and Outputs Commercial and industrial operating temperature range • BNC = 0°C to 70°C Commercial • BNI = -40°C to 85°C Industrial Package • 80 Pin SIMM (JEDEC) Standard * This product is under development, is not qualified or characterized and is subject to change without notice. FIG. 1 – BLOCK DIAGRAMS W7MG1M32SVx-BN: 1Mx32 80 PIN SIMM W7MG21M32SVx-BN: 2x1Mx32 80 PIN SIMM WE2# WE2# 1Mx16 WE# DQ0-15 CE# CE# 1Mx16 WE# DQ16-31 DQ16-31 DQ0-15 Addr 0-19 CE# CE# Addr 0-19 1Mx16 WE# WE0# WE0# 1Mx16 WE# DQ0-15 CE# CE# DQ0-15 CE# CE# 1Mx16 WE# Addr 0-19 DQ0-15 DQ0-15 DQ0-15 CE# CE# Addr 0-19 Addr 0-19 1Mx16 WE# CE0# DQ0-15 CE0# CE# CE# Addr 0-19 CE1# OE# Addr 0-19 OE# Addr 0-19 May 2004 Rev. 2 1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W7MG1M32SVx-BN W7MG21M32SVx-BN White Electronic Designs PRELIMINARY FIGURE 2 – DECOUPLING CAPACITORS ARE PROVIDED FOR IMPROVED NOISE IMMUNITY. 1 1 2 C8 .1 µF 2 C7 .1 µF 2 C6 .1 µF 2 2 C5 .1 µF 1 1 1 1 Notes: Unless otherwise specified. 1. Population Configuration for 1M x 32 Version Part Number Configuration W7MG1M32SVxxxBNX 1M x 32 2. Population Configuration for 2 x 1M x 32 Version Part Number Configuration W7MG21M32SVxxxBNX 2 x 1M x 32 C4 .1 µF 2 C3 .1 µF 2 C2 .1 µF 2 C1 .1 µF 1 1 VCC Component 1M x 8 Component 1M x 8 xx = Speed: 70, 90, 120ns X = Temerature Range Please refer to part number matrix pg. 8 or 9 May 2004 Rev. 2 2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W7MG1M32SVx-BN W7MG21M32SVx-BN White Electronic Designs PRELIMINARY FIGURE 3 – W7MG1M32SVxxxBNX & W7MG21M32SVxxxBNX PIN CONFIGURATION Pin Symbol Pin Symbol Pin Symbol Pin Symbol 1 GND 21 CE3 41 A11 61 DQ9 2 VCC 22 CE2 42 A10 62 DQ8 3 NC 23 CE1 43 A9 63 DQ7 4 OE# 24 CE0 44 A8 64 DQ6 5 WE0# 25 GND 45 A7 65 DQ5 6 NC 26 DQ29 46 A6 66 DQ4 7 NC* 27 DQ30 47 A5 67 DQ3 8 DQ16 28 DQ31 48 A4 68 DQ2 9 DQ17 29 WE2# 49 A3 69 DQ1 10 DQ18 30 NC 50 A2 70 DQ0 11 DQ19 31 NC 51 A1 71 NC 12 DQ20 32 NC 52 A0 72 VCC 13 DQ21 33 A19 53 NC 73 PD1 14 DQ22 34 A18 54 GND 74 PD2 15 DQ23 35 A17 55 DQ15 75 PD3 16 DQ24 36 A16 56 DQ14 76 PD4 17 DQ25 37 A15 57 DQ13 77 PD5 18 DQ26 38 A14 58 DQ12 78 PD6 19 DQ27 39 A13 59 DQ11 79 PD7 20 DQ28 40 A12 60 DQ10 80 GND Notes: Unless otherwise specified. 1. Population Configuration for 1M x 32 Version Part Number Configuration W7MG1M32SVxxxBNX 1M x 32 2. Population Configuration for 2 x 1M x 32 Version Part Number Configuration W7MG21M32SVxxxBNX 2 x 1M x 32 PIN NAMES Component 1M x 8 A0 - A19 Address DQ0 - DQ31 Data Input/Output Component 1M x 8 CE1#, CE2# Chip Enable xx = Speed: 70, 90, 120ns X = Temerature Range Please refer to part number matrix pg. 8 or 9 NC* = Pin 7 can offer custom module options. For optional "Reset" or "Ready Busy." Contact WEDC. May 2004 Rev. 2 3 WE0#, WE2# Write Enable OE# Output Enable VCC Power Supply NC No Connection PD Presence Detect GND Ground White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W7MG1M32SVx-BN W7MG21M32SVx-BN White Electronic Designs PRELIMINARY PRESENCE DETECT TRUTH TABLE Module Organization PD1 PD2 PD3 PD4 1M x 32 1 0 1 0 2 x 1M x 32 0 1 0 0 MODULE SPEED IDENTIFICATION PRESENCE DETECT PIN Speed PD5 PD6 PD7 70 ns 0 0 1 90 ns 1 1 0 120 ns 0 1 0 LEGEND: 0 = Connected to GND 1 = Open circuit (no connection) CAPACITANCE f = 1.0MHZ, VIN = VCC or VSS Parameter Address Lines Data lines May 2004 Rev. 2 1Meg 2x1Meg Max Max 35 70 Symbol CA Unit pF CDQ 15 30 pF Chip & Write Enable Lines CC 15 30 pF Output Enable lines CG 35 70 pF 4 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs W7MG1M32SVx-BN W7MG21M32SVx-BN PRELIMINARY ABSOLUTE MAXIMUM RATINGS OPERATING RANGES Storage Temperature Plastic Packages ................................. –65°C to +150°C Commercial (C) Devices Ambient Temperature with Power Applied ............................... –65°C to +125°C Industrial (I) Devices Ambient Temperature (TA) ........................ 0°C to +70°C Ambient Temperature (TA) .................... –40°C to +85°C Voltage with Respect to Ground VCC Supply Voltages VCC (Note 1) ...................................... –0.5 V to +4.0 V VCC for all devices .................................... 2.7 V to 3.6 V A9, OE#, and RESET# (Note 2) ...... –0.5 V to +12.5 V Operating ranges define those limits between which the functionality of the device is guaranteed. All other pins (Note 1) .................. –0.5 V to VCC+0.5 V Output Short Circuit Current (Note 3) ................. 200 mA Notes: 1. Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions, input or I/O pins may overshoot VSS to –2.0 V for periods of up to 20 ns. See Figure 7. Maximum DC voltage on input or I/O pins is VCC +0.5 V. During voltage transitions, input or I/O pins may overshoot to VCC +2.0 V for periods up to 20 ns. See Figure 8. 2. Minimum DC input voltage on pins A9, OE#, and RESET# is -0.5 V. During voltage transitions, A9, OE#, and RESET# may overshoot VSS to –2.0 V for periods of up to 20 ns. See Figure 7. Maximum DC input voltage on pin A9 is +12.5 V which may overshoot to 14.0 V for periods up to 20 ns. 3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater than one second. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability. May 2004 Rev. 2 5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W7MG1M32SVx-BN W7MG21M32SVx-BN White Electronic Designs PRELIMINARY ORDERING INFORMATION FOR W7MG1M32SVx COMMERCIAL Part Number W7MG1M32SVx70BNC W7MG1M32SVx90BNC W7MG1M32SVx120BNC Speed (ns) 70 90 120 Package 346 346 346 TA Commercial Range 0°C to +70°C 0°C to +70°C 0°C to +70°C Height* 21.59 (0.850") 21.59 (0.850") 21.59 (0.850") Speed (ns) 70 90 120 Package 346 346 346 TA Industrial Range -40°C to +85°C -40°C to +85°C -40°C to +85°C Height* 21.59 (0.850") 21.59 (0.850") 21.59 (0.850") INDUSTRIAL Part Number W7MG1M32SVx70BNI W7MG1M32SVx90BNI W7MG1M32SVx120BNI PACKAGE NO. 346: 80 PIN SIMM (JEDEC) 118.24 (4.655) MAX. 3.05 (0.120) MAX 111.35 (4.384) 21.59 (0.850) MAX R1 R3 J1 J3 6.35 (0.250) 153 1.27 (0.050) TYP 6.35 (0.250) 105.41 (4.150) 1.57 (0.062) R 10.16 (0.400) 1.57 (0.062) R 55.68 (2.192) 57.02 (2.245) 3.18 (0.125) MIN * ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES) May 2004 Rev. 2 6 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W7MG1M32SVx-BN W7MG21M32SVx-BN White Electronic Designs PRELIMINARY ORDERING INFORMATION FOR W7MG21M32SVx COMMERCIAL Part Number W7MG21M32SVx70BNC W7MG21M32SVx90BNC W7MG21M32SVx120BNC Speed (ns) 70 90 120 Package 361 361 361 TA Commercial Range 0°C to +70°C 0°C to +70°C 0°C to +70°C Height* 21.59 (0.850") 21.59 (0.850") 21.59 (0.850") Speed (ns) 70 90 120 Package 361 361 361 TA Industrial Range -40°C to +85°C -40°C to +85°C -40°C to +85°C Height* 21.59 (0.850") 21.59 (0.850") 21.59 (0.850") INDUSTRIAL Part Number W7MG21M32SVx70BNI W7MG21M32SVx90BNI W7MG21M32SVx120BNI PACKAGE NO. 361: 80 PIN SIMM (JEDEC) 118.24 (4.655) MAX. 4.32 (0.170) MAX 111.35 (4.384) 21.59 (0.850) MAX R1 R3 J1 J3 6.35 (0.250) 153 1.27 (0.050) TYP 6.35 (0.250) 105.41 (4.150) 1.57 (0.062) R 10.16 (0.400) 1.57 (0.062) R 55.68 (2.192) 57.02 (2.245) 3.18 5.72 (0.125) (0.225) MIN MIN * ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES) May 2004 Rev. 2 7 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs W7MG1M32SVx-BN W7MG21M32SVx-BN PRELIMINARY FLASH PART NUMBER MATRIX W 7 M G 1 M 32 S V X XX BN X White Electronics Design Flash MirrorBit™ FR4 with gold contacts Module Address depth: 1M Module Bus width: x32 Component width: x16 Voltage: 3.3V T = Top / B = Bottom Boot Block Speed: 70, 90, 120 Package: 80 Pin SIMM Temperature range: C = 0˚C to 70˚C Commercial I = -40˚C to 85˚C Industrial May 2004 Rev. 2 8 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs W7MG1M32SVx-BN W7MG21M32SVx-BN PRELIMINARY FLASH PART NUMBER MATRIX W 7 M G 2 1 M 3 2 S V X XX BN X White Electronics Design Flash MirrorBit™ FR4 with gold contacts Bank Module Address depth: 1M Module Bus width: x32 Component width: x16 Voltage: 3.3V T = Top / B = Bottom Boot Block Speed: 70, 90, 120 Package: 80 Pin SIMM Temperature range: C = 0˚C to 70˚C Commercial I = -40˚C to 85˚C Industrial May 2004 Rev. 2 9 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs W7MG1M32SVx-BN W7MG21M32SVx-BN PRELIMINARY Document Title 8MB/4MB (2x1Mx32 / 1Mx32) CMOS, MirrorBit™ 3.0V, Boot Sector Flash Memory Revision History Rev # History Release Date Status Rev 0 Created 5-04 Advanced Rev 1 Added T/B (top or bottom boot block option) 6-04 Advanced Rev. 2 Changed status from advanced to preliminary 6-04 Preliminary May 2004 Rev. 2 10 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com