MOTOROLA SEMICONDUCTOR TECHNICAL DATA % $ # ! !"# # $ ! !## ADDITIONAL VOLTAGES AVAILABLE !""! Motorola Preferred Device This dual monolithic silicon zener diode is designed for applications requiring transient overvoltage protection capability. It is intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. Its dual junction common anode design protects two separate lines using only one package. These devices are ideal for situations where board space is at a premium. SOT-23 DUAL ZENER OVERVOLTAGE TRANSIENT SUPPRESSOR 5.6 VOLTS 24 WATTS PEAK POWER 3 Specification Features: • SOT-23 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration • Peak Power — 24 Watts @ 1.0 ms (Unidirectional), per Figure 5 Waveform • Maximum Clamping Voltage @ Peak Pulse Current • Low Leakage < 5.0 µA • ESD Rating of Class N (exceeding 16 kV) per the Human Body Model 1 2 Mechanical Characteristics: • Void Free, Transfer-Molded, Thermosetting Plastic Case • Corrosion Resistant Finish, Easily Solderable • Package Designed for Optimal Automated Board Assembly • Small Package Size for High Density Applications • Available in 8 mm Tape and Reel Use the Device Number to Order the 7 inch/3,000 Unit Reel Replace “T1” with “T3” in the Device Number to Order the 13 inch/10,000 Unit Reel CASE 318-07 STYLE 12 LOW PROFILE SOT-23 PLASTIC 1 3 2 PIN 1. CATHODE 2. CATHODE 3. ANODE WAFER FAB LOCATION: Phoenix, Arizona ASSEMBLY/TEST LOCATION: Seremban, Malaysia THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Value Unit Peak Power Dissipation @ 1.0 ms (1) @ TA ≤ 25°C Ppk 24 Watts Total Power Dissipation on FR-5 Board (2) @ TA = 25°C Derate above 25°C °PD° °225 1.8 °mW° mW/°C Thermal Resistance Junction to Ambient RθJA 556 °C/W Total Power Dissipation on Alumina Substrate (3) @ TA = 25°C Derate above 25°C °PD° °300 2.4 °mW mW/°C Thermal Resistance Junction to Ambient RθJA 417 °C/W Junction and Storage Temperature Range TJ Tstg °– 55 to +150° °C TL 260 °C Characteristic Lead Solder Temperature — Maximum (10 Second Duration) (1) Non-repetitive current pulse per Figure 5 and derate above TA = 25°C per Figure 6. (2) FR-5 = 1.0 x 0.75 x 0.62 in. (3) Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina Thermal Clad is a trademark of the Bergquist Company. Preferred devices are Motorola recommended choices for future use and best overall value. Motorola TVS/Zener Device Data 24 Watt Peak Power Data Sheet 5-55 MMBZ5V6ALT1 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to pins 1 and 3 or Pins 2 and 3) (VF = 0.9 V Max @ IF = 10 mA) Max Reverse Leakage Current Breakdown Voltage VZT(4) (V) @ I ZT (mA) Min Nom Max 5.32 5.6(7) 5.88 IR @ VR (uA) (V) 20 5.0 Max Zener Impedance (6) ZZT @ IZT (Ω) (mA) 3.0 ZZK @ IZK (Ω) (mA) 11 1600 0.25 Max Reverse S Surge Current IRSM(5) (A) Max Reverse Voltage @ IRSM(5) (Clamping Voltage) VRSM (V) Maximum Temperature Coefficient of VZ (mV/°C) 3.0 8.0 1.26 (4) VZ measured at pulse test current IT at an ambient temperature of 25°C. (5) Surge current waveform per Figure 5 and derate per Figure 6. (6) ZZT and ZZK are measured by dividing the AC voltage drop across the device by the AC current supplied. The specfied limits are IZ(AC) = 0.1 IZ(DC), with AC frequency = 1 kHz. (7) Other voltages may be available upon request. Please contact your Motorola representative. . TYPICAL CHARACTERISTICS 10000 VZ @ IT IR, REVERSE LEAKAGE CURRENT (nA) VZ, BREAKDOWN VOLTAGE (VOLTS) 8 7 BIDIRECTIONAL 6 5 UNIDIRECTIONAL 4 – 50 0 50 100 1000 100 – 50 150 0 50 100 150 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 1. Typical Breakdown Voltage versus Temperature Figure 2. Typical Leakage Current versus Temperature 300 300 280 PD , POWER DISSIPATION (mW) C, CAPACITANCE (pF) 260 240 UNIDIRECTIONAL 220 200 180 BIDIRECTIONAL 160 140 120 100 0 1 2 3 250 ALUMINA SUBSTRATE 200 150 100 FR-5 BOARD 50 0 0 25 50 75 100 125 150 BIAS (V) TA, AMBIENT TEMPERATURE (°C) Figure 3. Typical Capacitance versus Bias Voltage Figure 4. Steady State Power Derating Curve 24 Watt Peak Power Data Sheet 5-56 Motorola TVS/Zener Device Data 175 MMBZ5V6ALT1 tr PEAK VALUE — IRSM VALUE (%) 100 PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IRSM. tr ≤ 10 µs IRSM HALF VALUE — 2 50 tP 0 0 1 2 3 4 PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25 ° C TYPICAL CHARACTERISTICS 80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (°C) Figure 5. Pulse Waveform Figure 6. Pulse Derating Curve 175 200 BIDIRECTIONAL 10 UNIDIRECTIONAL 1.0 10 100 1000 Ppk(NOM), NNOMINAL PEAK POWER (W) 100 RECTANGULAR WAVEFORM, TA = 25°C Ppk PEAK SURGE POWER (W) 90 t, TIME (ms) 100 1.0 0.1 100 RECTANGULAR WAVEFORM, TA = 25°C BIDIRECTIONAL 10 UNIDIRECTIONAL 1.0 0.1 1.0 10 100 PW, PULSEWIDTH (ms) PW, PULSEWIDTH (ms) Figure 7. Maximum Non-repetitive Surge Power, Ppk versus PW Figure 8. Maximum Non-repetitive Surge Power, Ppk(NOM) versus PW Power is defined as VRSM x IZ(pk) where VRSM is the clamping voltage at IZ(pk). Motorola TVS/Zener Device Data 1000 Power is defined as VZ(NOM) x IZ(pk) where VZ(NOM) is the nominal zener voltage measured at the low test current used for voltage classification. 24 Watt Peak Power Data Sheet 5-57 MMBZ5V6ALT1 TYPICAL COMMON ANODE APPLICATIONS A dual junction common anode design in a SOT-23 package protects two separate lines using only one package. This adds flexibility and creativity to PCB design especially when board space is at a premium. Two simplified examples of MMBZ5V6ALT1 TVS applications are illustrated below. Computer Interface Protection A KEYBOARD TERMINAL PRINTER ETC. B C I/O FUNCTIONAL DECODER D GND MMBZ5V6ALT1 Microprocessor Protection VDD VGG ADDRESS BUS RAM ROM DATA BUS CPU I/O MMBZ5V6ALT1 CLOCK CONTROL BUS GND MMBZ5V6ALT1 24 Watt Peak Power Data Sheet 5-58 Motorola TVS/Zener Device Data MMBZ5V6ALT1 INFORMATION FOR USING THE SOT-23 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.037 0.95 0.037 0.95 0.079 2.0 0.035 0.9 0.031 0.8 inches mm SOT-23 SOT-23 POWER DISSIPATION The power dissipation of the SOT-23 is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet for the SOT-23 package, PD can be calculated as follows: PD = TJ(max) – TA RθJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 225 milliwatts. PD = 150°C – 25°C = 225 milliwatts 556°C/W The 556°C/W for the SOT-23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternatives to achieving higher power dissipation from the SOT-23 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. Motorola TVS/Zener Device Data SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. • Always preheat the device. • The delta temperature between the preheat and soldering should be 100°C or less.* • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C. • The soldering temperature and time shall not exceed 260°C for more than 10 seconds. • When shifting from preheating to soldering, the maximum temperature gradient shall be 5°C or less. • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. • Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. 24 Watt Peak Power Data Sheet 5-59 Transient Voltage Suppressors — Surface Mounted 24 Watt Peak Power NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L 3 B 1 V S DIM A B C D G H J K L S V 2 G C H D INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0180 0.0236 0.0350 0.0401 0.0830 0.0984 0.0177 0.0236 MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.45 0.60 0.89 1.02 2.10 2.50 0.45 0.60 J K STYLE 12: PIN 1. CATHODE 2. CATHODE 3. ANODE CASE 318-07 PLASTIC (Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.) MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS Package Option Type No. Suffix MPQ (Units) Tape and Reel T1 3K Tape and Reel T3 10K (Refer to Section 10 for more information on Packaging Specifications.) 24 Watt Peak Power Data Sheet 5-60 Motorola TVS/Zener Device Data Order this document by MMBZ15VDLT1/D SEMICONDUCTOR TECHNICAL DATA ! " ! ! Motorola Preferred Devices SOT–23 COMMON CATHODE DUAL ZENER OVERVOLTAGE TRANSIENT SUPPRESSORS 40 WATTS PEAK POWER Transient Voltage Suppressors for ESD Protection These dual monolithic silicon zener diodes are designed for applications requiring transient overvoltage protection capability. They are intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. Their dual junction common cathode design protects two separate lines using only one package. These devices are ideal for situations where board space is at a premium. 3 1 Specification Features: • SOT–23 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration 2 CASE 318–08 TO–236AB LOW PROFILE SOT–23 • Peak Power — 40 Watts @ 1.0 ms (Bidirectional), per Figure 5 Waveform • Maximum Clamping Voltage @ Peak Pulse Current • Low Leakage < 100 nA • ESD Rating of Class N (exceeding 16 kV) per the Human Body Model 1 Mechanical Characteristics: 3 • Void Free, Transfer–Molded, Thermosetting Plastic Case 2 • Corrosion Resistant Finish, Easily Solderable TERMINAL 1 – ANODE TERMINAL 2 – ANODE TERMINAL 3 – CATHODE • Package Designed for Optimal Automated Board Assembly • Small Package Size for High Density Applications • Available in 8 mm Tape and Reel Use the Device Number to order the 7 inch/3,000 unit reel. Replace the “T1” with “T3” in the Device Number to order the 13 inch/10,000 unit reel. THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Value Unit Peak Power Dissipation @ 1.0 ms (1) @ TA ≤ 25°C Ppk 40 Watts Total Power Dissipation on FR–5 Board (2) @ TA = 25°C Derate above 25°C °PD° 225 1.8 °mW° mW/°C Thermal Resistance Junction to Ambient RθJA 556 °C/W Total Power Dissipation on Alumina Substrate (3) @ TA = 25°C Derate above 25°C °PD° 300 2.4 °mW mW/°C Thermal Resistance Junction to Ambient RθJA 417 °C/W Junction and Storage Temperature Range TJ Tstg °– 55 to +150° °C TL 230 °C Characteristic Lead Solder Temperature — Maximum (10 Second Duration) 1. Non–repetitive current pulse per Figure 5 and derate above TA = 25°C per Figure 6. 2. FR–5 = 1.0 x 0.75 x 0.62 in. 3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value. Rev 1 Motorola, Inc. 1996 MMBZ15VDLT1 MMBZ27VCLT1 MOTOROLA 61 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3) (VF = 0.9 V Max @ IF = 10 mA) Breakdown Voltage VBR(4) (V) Min Nom Max 14.3 15 15.8 @ IT (mA) Reverse Voltage Working Peak VRWM (V) Max Reverse Leakage Current IRWM IR (nA) Max Reverse Surge Current IRSM(5) (A) Max Reverse Voltage @ IRSM(5) (Clamping Voltage) VRSM (V) Maximum Temperature Temperat re Coefficient of VBR (mV/°C) 1.0 12.8 100 1.9 21.2 12 @ IT (mA) Reverse Voltage Working Peak VRWM (V) Max Reverse Leakage Current IRWM IR (nA) Max Reverse Surge Current IRSM(5) (A) Max Reverse Voltage V lt @ IRSM(5) (Clamping Voltage) VRSM (V) Maximum Temperature T t Coefficient of VBR (mV/°C) 1.0 22 50 1.0 38 26 (VF = 1.1 V Max @ IF = 200 mA) Breakdown Voltage VBR(4) (V) Min Nom Max 25.65 27 28.35 (4) VBR measured at pulse test current IT at an ambient temperature of 25°C. (5) Surge current waveform per Figure 5 and derate per Figure 6. TYPICAL CHARACTERISTICS MMBZ15VDLT1 MMBZ27VCLT1 29 BREAKDOWN VOLTAGE (VOLTS) (VBR @ I T ) BREAKDOWN VOLTAGE (VOLTS) (VBR @ I T ) 17 BIDIRECTIONAL 16 15 14 UNIDIRECTIONAL 13 – 40 + 25 + 85 TEMPERATURE (°C) Figure 1A. Typical Breakdown Voltage versus Temperature MOTOROLA 62 + 125 BIDIRECTIONAL 28 27 26 25 – 55 + 25 + 85 TEMPERATURE (°C) + 125 Figure 1B. Typical Breakdown Voltage versus Temperature MMBZ15VDLT1 MMBZ27VCLT1 MMBZ15VDLT1 100 10000 90 80 C, CAPACITANCE (pF) IR (nA) 100 10 1 0.1 70 UNIDIRECTIONAL 60 50 40 BIDIRECTIONAL 30 20 10 0.01 – 40 + 25 + 85 TEMPERATURE (°C) 0 + 125 1 BIAS (V) Figure 2. Typical Leakage Current versus Temperature Figure 3. Typical Capacitance versus Bias Voltage 300 tr 250 ALUMINA SUBSTRATE PEAK VALUE — IRSM 100 200 VALUE (%) PD , POWER DISSIPATION (mW) 12.8 150 HALF VALUE — PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IRSM. tr ≤ 10 µs IRSM 2 50 100 FR–5 BOARD tP 50 0 0 25 50 75 100 125 TEMPERATURE (°C) 150 175 0 0 1 PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25 ° C Figure 4. Steady State Power Derating Curve 2 3 t, TIME (ms) 4 Figure 5. Pulse Waveform 100 90 80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (°C) 175 200 Figure 6. Pulse Derating Curve MMBZ15VDLT1 MMBZ27VCLT1 MOTOROLA 63 INFORMATION FOR USING THE SOT–23 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.037 0.95 0.037 0.95 0.079 2.0 0.035 0.9 0.031 0.8 inches mm SOT–23 SOT–23 POWER DISSIPATION The power dissipation of the SOT–23 is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA . Using the values provided on the data sheet for the SOT–23 package, PD can be calculated as follows: PD = TJ(max) – TA RθJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 225 milliwatts. PD = 150°C – 25°C 556°C/W = 225 milliwatts The 556°C/W for the SOT–23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternatives to achieving higher power dissipation from the SOT–23 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. • Always preheat the device. • The delta temperature between the preheat and soldering should be 100°C or less.* • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C. • The soldering temperature and time shall not exceed 260°C for more than 10 seconds. • When shifting from preheating to soldering, the maximum temperature gradient shall be 5°C or less. • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. • Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. MOTOROLA 64 MMBZ15VDLT1 MMBZ27VCLT1 OUTLINE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L 3 B S 1 V 2 G C D H K J CASE 318–08 ISSUE AE TO–236AB MMBZ15VDLT1 MMBZ27VCLT1 DIM A B C D G H J K L S V INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0140 0.0285 0.0350 0.0401 0.0830 0.1039 0.0177 0.0236 MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.35 0.69 0.89 1.02 2.10 2.64 0.45 0.60 STYLE 9: PIN 1. ANODE 2. ANODE 3. CATHODE MOTOROLA 65 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA / EUROPE: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, Toshikatsu Otsuki, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–3521–8315 MFAX: [email protected] – TOUCHTONE (602) 244–6609 INTERNET: http://Design–NET.com HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 MOTOROLA 66 ◊ *MMBZ15VDLT1/D* MMBZ15VDLT1/D MMBZ15VDLT1 MMBZ27VCLT1 Transient Voltage Suppressors — Surface Mounted 40 Watt Peak Power NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A DIM A B C D G H J K L S V INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0180 0.0236 0.0350 0.0401 0.0830 0.0984 0.0177 0.0236 MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.45 0.60 0.89 1.02 2.10 2.50 0.45 0.60 0.037 0.95 0.037 0.95 L STYLE 9: PIN 1. ANODE 2. ANODE 3. CATHODE 3 B 1 V S 2 0.035 0.9 G 0.031 0.8 C D 0.079 2.0 inches mm SOT-23 Footprint H K J CASE 318-07 PLASTIC (Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.) MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS Package Option Type No. Suffix MPQ (Units) Tape and Reel T1 3K Tape and Reel T3 10K (Refer to Section 10 for more information on Packaging Specifications.) Motorola TVS/Zener Device Data 24 Watt Peak Power Data Sheet 5-67 MOTOROLA SEMICONDUCTOR TECHNICAL DATA GENERAL DATA GENERAL DATA APPLICABLE TO ALL SERIES IN THIS GROUP 600 WATT PEAK POWER Zener Transient Voltage Suppressors The SMB series is designed to protect voltage sensitive components from high voltage, high energy transients. They have excellent clamping capability, high surge capability, low zener impedance and fast response time. The SMB series is supplied in Motorola’s exclusive, cost-effective, highly reliable Surmetic package and is ideally suited for use in communication systems, numerical controls, process controls, medical equipment, business machines, power supplies and many other industrial/consumer applications. Specification Features: Standard Zener Breakdown Voltage Range — 6.8 to 200 V Stand-off Voltage Range — 5 to 170 V Peak Power — 600 Watts @ 1 ms Maximum Clamp Voltage @ Peak Pulse Current Low Leakage < 5 µA Above 10 V UL Recognition Response Time Typically < 1 ns • • • • • • • PLASTIC SURFACE MOUNT ZENER OVERVOLTAGE TRANSIENT SUPPRESSORS 6.8–200 VOLTS 600 WATT PEAK POWER Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic FINISH: All external surfaces are corrosion resistant and leads are readily solderable POLARITY: Cathode indicated by molded polarity notch. When operated in zener mode, will be positive with respect to anode MOUNTING POSITION: Any LEADS: Modified L-Bend providing more contact area to bond pad MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds WAFER FAB LOCATION: Phoenix, Arizona ASSEMBLY/TEST LOCATION: Seremban, Malaysia CASE 403A PLASTIC MAXIMUM RATINGS Rating Symbol Value Unit Peak Power Dissipation (1) @ TL ≤ 25°C PPK 600 Watts Forward Surge Current (2) @ TA = 25°C IFSM 100 Amps Thermal Resistance from Junction to Lead (typical) RqJL 25 °C/W TJ, Tstg – 65 to +150 °C Operating and Storage Temperature Range NOTES: 1. Nonrepetitive current pulse per Figure 2 and derated above TA = 25°C per Figure 3. NOTES: 2. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum. REV 1 600 Watt Peak Power Data Sheet 5-68 Motorola TVS/Zener Device Data GENERAL DATA — 600 WATT PEAK POWER NONREPETITIVE PULSE WAVEFORM SHOWN IN FIGURE 2 tr 100 10 PEAK VALUE – IRSM VALUE (%) PP, PEAK POWER (kW) 100 I HALF VALUE – RSM 2 50 1 PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IRSM. tr ≤ 10 µs tP 0.1 0.1 µs 1 µs 10 µs 100 µs 1 ms 10 ms 0 0 1 2 tP, PULSE WIDTH 4 t, TIME (ms) Figure 1. Pulse Rating Curve Figure 2. Pulse Waveform 160 PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25° C 3 TYPICAL PROTECTION CIRCUIT 140 Zin 120 100 80 LOAD Vin VL 60 40 20 0 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (°C) Figure 3. Pulse Derating Curve APPLICATION NOTES RESPONSE TIME In most applications, the transient suppressor device is placed in parallel with the equipment or component to be protected. In this situation, there is a time delay associated with the capacitance of the device and an overshoot condition associated with the inductance of the device and the inductance of the connection method. The capacitive effect is of minor importance in the parallel protection scheme because it only produces a time delay in the transition from the operating voltage to the clamp voltage as shown in Figure 4. The inductive effects in the device are due to actual turn-on time (time required for the device to go from zero current to full current) and lead inductance. This inductive effect produces an overshoot in the voltage across the equipment or component being protected as shown in Figure 5. Minimizing this overshoot is very important in the application, since the main purpose for adding a transient suppressor is to clamp voltage spikes. The SMB series have a very good response time, typically < 1 ns and negligible inductance. However, external inductive effects could produce unacceptable overshoot. Proper circuit layout, minimum lead lengths and placing Motorola TVS/Zener Device Data the suppressor device as close as possible to the equipment or components to be protected will minimize this overshoot. Some input impedance represented by Zin is essential to prevent overstress of the protection device. This impedance should be as high as possible, without restricting the circuit operation. DUTY CYCLE DERATING The data of Figure 1 applies for non-repetitive conditions and at a lead temperature of 25°C. If the duty cycle increases, the peak power must be reduced as indicated by the curves of Figure 6. Average power must be derated as the lead or ambient temperature rises above 25°C. The average power derating curve normally given on data sheets may be normalized and used for this purpose. At first glance the derating curves of Figure 6 appear to be in error as the 10 ms pulse has a higher derating factor than the 10 µs pulse. However, when the derating factor for a given pulse of Figure 6 is multiplied by the peak power value of Figure 1 for the same pulse, the results follow the expected trend. 600 Watt Peak Power Data Sheet 5-69 GENERAL DATA — 600 WATT PEAK POWER V V Vin (TRANSIENT) Vin (TRANSIENT) OVERSHOOT DUE TO INDUCTIVE EFFECTS VL VL Vin td tD = TIME DELAY DUE TO CAPACITIVE EFFECT t t Figure 4. Figure 5. 1 0.7 0.5 DERATING FACTOR 0.3 0.2 PULSE WIDTH 10 ms 0.1 0.07 0.05 1 ms 0.03 100 µs 0.02 10 µs 0.01 0.1 0.2 0.5 1 2 5 10 D, DUTY CYCLE (%) 20 50 100 Figure 6. Typical Derating Factor for Duty Cycle UL RECOGNITION The entire series has Underwriters Laboratory Recognition for the classification of protectors (QVGV2) under the UL standard for safety 497B and File #116110. Many competitors only have one or two devices recognized or have recognition in a non-protective category. Some competitors have no recognition at all. With the UL497B recognition, our parts successfully passed several tests including Strike Voltage 600 Watt Peak Power Data Sheet 5-70 Breakdown test, Endurance Conditioning, Temperature test, Dielectric Voltage-Withstand test, Discharge test and several more. Whereas, some competitors have only passed a flammability test for the package material, we have been recognized for much more to be included in their Protector category. Motorola TVS/Zener Device Data 1SMB5.0AT3 through 1SMB170AT3 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted). mA Maximum Clamping Voltage VC @ Ipp Volts Peak Pulse Current (See Figure 2) Ipp{ Amps Maximum Reverse Re erse Leakage @ VR IR µA Device Marking 6.40 6.67 7.22 7.78 10 10 10 10 9.2 10.3 11.2 12.0 65.2 58.3 53.6 50.0 800 800 500 200 KE KG KK KM 7.5 8.0 8.5 9.0 8.33 8.89 9.44 10.0 1.0 1.0 1.0 1.0 12.9 13.6 14.4 15.4 46.5 44.1 41.7 39.0 100 50 10 5.0 KP KR KT KV 1SMB10AT3 1SMB11AT3 1SMB12AT3 1SMB13AT3 10 11 12 13 11.1 12.2 13.3 14.4 1.0 1.0 1.0 1.0 17.0 18.2 19.9 21.5 35.3 33.0 30.2 27.9 5.0 5.0 5.0 5.0 KX KZ LE LG 1SMB14AT3 1SMB15AT3 1SMB16AT3 1SMB17AT3 14 15 16 17 15.6 16.7 17.8 18.9 1.0 1.0 1.0 1.0 23.2 24.4 26.0 27.6 25.8 24.0 23.1 21.7 5.0 5.0 5.0 5.0 LK LM LP LR 1SMB18AT3 1SMB20AT3 1SMB22AT3 1SMB24AT3 18 20 22 24 20.0 22.2 24.4 26.7 1.0 1.0 1.0 1.0 29.2 32.4 35.5 38.9 20.5 18.5 16.9 15.4 5.0 5.0 5.0 5.0 LT LV LX LZ 1SMB26AT3 1SMB28AT3 1SMB30AT3 1SMB33AT3 26 28 30 33 28.9 31.1 33.3 36.7 1.0 1.0 1.0 1.0 42.1 45.4 48.4 53.3 14.2 13.2 12.4 11.3 5.0 5.0 5.0 5.0 ME MG MK MM 1SMB36AT3 1SMB40AT3 1SMB43AT3 1SMB45AT3 36 40 43 45 40.0 44.4 47.8 50.0 1.0 1.0 1.0 1.0 58.1 64.5 69.4 72.7 10.3 9.3 8.6 8.3 5.0 5.0 5.0 5.0 MP MR MT MV 1SMB48AT3 1SMB51AT3 1SMB54AT3 1SMB58AT3 48 51 54 58 53.3 56.7 60.0 64.4 1.0 1.0 1.0 1.0 77.4 82.4 87.1 93.6 7.7 7.3 6.9 6.4 5.0 5.0 5.0 5.0 MX MZ NE NG 1SMB60AT3 1SMB64AT3 1SMB70AT3 1SMB75AT3 60 64 70 75 66.7 71.1 77.8 83.3 1.0 1.0 1.0 1.0 96.8 103 113 121 6.2 5.8 5.3 4.9 5.0 5.0 5.0 5.0 NK NM NP NR 1SMB78AT3 1SMB85AT3 1SMB90AT3 1SMB100AT3 78 85 90 100 86.7 94.4 100 111 1.0 1.0 1.0 1.0 126 137 146 162 4.7 4.4 4.1 3.7 5.0 5.0 5.0 5.0 NT NV NX NZ 1SMB110AT3 1SMB120AT3 1SMB130AT3 1SMB150AT3 110 120 130 150 122 133 144 167 1.0 1.0 1.0 1.0 177 193 209 243 3.4 3.1 2.9 2.5 5.0 5.0 5.0 5.0 PE PG PK PM 1SMB160AT3 1SMB170AT3 160 170 178 189 1.0 1.0 259 275 2.3 2.2 5.0 5.0 PP PR Breakdown Voltage* Device{{ Reverse Stand-Off Voltage VR Volts (1) Volts Min 1SMB5.0AT3 1SMB6.0AT3 1SMB6.5AT3 1SMB7.0AT3 5.0 6.0 6.5 7.0 1SMB7.5AT3 1SMB8.0AT3 1SMB8.5AT3 1SMB9.0AT3 VBR @ IT Note 1: A transient suppressor is normally selected according to the reverse ”Stand Off Voltage” (VR) which should be equal to or greater than the DC or continuous peak operating voltage level. * * VBR measured at pulse test current IT at an ambient temperaure of 25°C. {{ Surge current waveform per Figure 2 and derate per Figure 3 of the General Data — 600 Watt at the beginning of this group. {{ T3 suffix designates tape and reel of 2500 units. ABBREVIATIONS AND SYMBOLS VR Stand Off Voltage. Applied reverse voltage to assure a non-conductive condition (See Note 1). V(BR)min This is the minimum breakdown voltage the device will exhibit and is used to assure that conduction does not occur prior to this voltage level at 25°C. VC Maximum Clamping Voltage. The maximum peak voltage appearing across the transient suppressor when IPP PP IR subjected to the peak pusle current in a one millisecond time interval. The peak pulse voltages are the combination of voltage rise due to both the series resistance and thermal rise. Peak Pulse Current — See Figure 2 Peak Pulse Power Reverse Leakage Devices listed in bold, italic are Motorola preferred devices. Motorola TVS/Zener Device Data 600 Watt Peak Power Data Sheet 5-71 P6SMB6.8AT3 through P6SMB200AT3 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted). mA Maximum Clamping Voltage VC @ Ipp Volts Peak Pulse Current (See Figure 2) Ipp{ Amps Maximum Reverse Re erse Leakage @ VR IR µA Device Marking 11.1 12.2 13.3 14.4 1.0 1.0 1.0 1.0 17.0 18.2 19.9 21.5 35.3 33.0 30.2 27.9 5.0 5.0 5.0 5.0 KXC KZC LEC LGC 14 15 16 17 15.6 16.7 17.8 18.9 1.0 1.0 1.0 1.0 23.2 24.4 26.0 27.6 25.8 24.0 23.1 21.7 5.0 5.0 5.0 5.0 LKC LMC LPC LRC 1SMB18CAT3 1SMB20CAT3 1SMB22CAT3 1SMB24CAT3 18 20 22 24 20.0 22.2 24.4 26.7 1.0 1.0 1.0 1.0 29.2 32.4 35.5 38.9 20.5 18.5 16.9 15.4 5.0 5.0 5.0 5.0 LTC LVC LXC LZC 1SMB26CAT3 1SMB28CAT3 1SMB30CAT3 1SMB33CAT3 26 28 30 33 28.9 31.1 33.3 36.7 1.0 1.0 1.0 1.0 42.1 45.4 48.4 53.3 14.2 13.2 12.4 11.3 5.0 5.0 5.0 5.0 MEC MGC MKC MMC 1SMB36CAT3 1SMB40CAT3 1SMB43CAT3 1SMB45CAT3 36 40 43 45 40.0 44.4 47.8 50.0 1.0 1.0 1.0 1.0 58.1 64.5 69.4 72.7 10.3 9.3 8.6 8.3 5.0 5.0 5.0 5.0 MPC MRC MTC MVC 1SMB48CAT3 1SMB51CAT3 1SMB54CAT3 1SMB58CAT3 48 51 54 58 53.3 56.7 60.0 64.4 1.0 1.0 1.0 1.0 77.4 82.4 87.1 93.6 7.7 7.3 6.9 6.4 5.0 5.0 5.0 5.0 MXC MZC NEC NGC 1SMB60CAT3 1SMB64CAT3 1SMB70CAT3 1SMB75CAT3 60 64 70 75 66.7 71.1 77.8 83.3 1.0 1.0 1.0 1.0 96.8 103 113 121 6.2 5.8 5.3 4.9 5.0 5.0 5.0 5.0 NKC NMC NPC NRC 1SMB78CAT3 78 86.7 1.0 126 4.7 5.0 NTC Breakdown Voltage* Reverse Stand-Off Voltage VR Volts (1) Volts Min 1SMB10CAT3 1SMB11CAT3 1SMB12CAT3 1SMB13CAT3 10 11 12 13 1SMB14CAT3 1SMB15CAT3 1SMB16CAT3 1SMB17CAT3 Device{{ VBR @ IT Note 1: A transient suppressor is normally selected according to the reverse ”Stand Off Voltage” (VR) which should be equal to or greater than the DC or continuous peak operating voltage level. * * VBR measured at pulse test current IT at an ambient temperaure of 25°C. {{ Surge current waveform per Figure 2 and derate per Figure 3 of the General Data — 600 Watt at the beginning of this group. {{ T3 suffix designates tape and reel of 2500 units. ABBREVIATIONS AND SYMBOLS VR Stand Off Voltage. Applied reverse voltage to assure a non-conductive condition (See Note 1). V(BR)min This is the minimum breakdown voltage the device will exhibit and is used to assure that conduction does not occur prior to this voltage level at 25°C. VC Maximum Clamping Voltage. The maximum peak voltage appearing across the transient suppressor when IPP PP IR subjected to the peak pusle current in a one millisecond time interval. The peak pulse voltages are the combination of voltage rise due to both the series resistance and thermal rise. Peak Pulse Current — See Figure 2 Peak Pulse Power Reverse Leakage Devices listed in bold, italic are Motorola preferred devices. 600 Watt Peak Power Data Sheet 5-72 Motorola TVS/Zener Device Data 1SMB10CAT3 through 1SMB78CAT3 Bi–Directional ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) VF = 3.5 V Max, IF** = 50 A for all types. D i {{ Device Min Nom Max mA Working Peak R Reverse Voltage VRWM Volts P6SMB6.8AT3 P6SMB7.5AT3 P6SMB8.2AT3 P6SMB9.1AT3 6.45 7.13 7.79 8.65 6.8 7.5 8.2 9.1 7.14 7.88 8.61 9.55 10 10 10 1 5.8 6.4 7.02 7.78 1000 500 200 50 57 53 50 45 10.5 11.3 12.1 13.4 0.057 0.061 0.065 0.068 6V8A 7V5A 8V2A 9V1A P6SMB10AT3 P6SMB11AT3 P6SMB12AT3 P6SMB13AT3 9.5 10.5 11.4 12.4 10 11 12 13 10.5 11.6 12.6 13.7 1 1 1 1 8.55 9.4 10.2 11.1 10 5 5 5 41 38 36 33 14.5 15.6 16.7 18.2 0.073 0.075 0.078 0.081 10A 11A 12A 13A P6SMB15AT3 P6SMB16AT3 P6SMB18AT3 P6SMB20AT3 14.3 15.2 17.1 19 15 16 18 20 15.8 16.8 18.9 21 1 1 1 1 12.8 13.6 15.3 17.1 5 5 5 5 28 27 24 22 21.2 22.5 25.2 27.7 0.084 0.086 0.088 0.09 15A 16A 18A 20A P6SMB22AT3 P6SMB24AT3 P6SMB27AT3 P6SMB30AT3 20.9 22.8 25.7 28.5 22 24 27 30 23.1 25.2 28.4 31.5 1 1 1 1 18.8 20.5 23.1 25.6 5 5 5 5 20 18 16 14.4 30.6 33.2 37.5 41.4 0.092 0.094 0.096 0.097 22A 24A 27A 30A P6SMB33AT3 P6SMB36AT3 P6SMB39AT3 P6SMB43AT3 31.4 34.2 37.1 40.9 33 36 39 43 34.7 37.8 41 45.2 1 1 1 1 28.2 30.8 33.3 36.8 5 5 5 5 13.2 12 11.2 10.1 45.7 49.9 53.9 59.3 0.098 0.099 0.1 0.101 33A 36A 39A 43A P6SMB47AT3 P6SMB51AT3 P6SMB56AT3 P6SMB62AT3 44.7 48.5 53.2 58.9 47 51 56 62 49.4 53.6 58.8 65.1 1 1 1 1 40.2 43.6 47.8 53 5 5 5 5 9.3 8.6 7.8 7.1 64.8 70.1 77 85 0.101 0.102 0.103 0.104 47A 51A 56A 62A P6SMB68AT3 P6SMB75AT3 P6SMB82AT3 P6SMB91AT3 64.6 71.3 77.9 86.5 68 75 82 91 71.4 78.8 86.1 95.5 1 1 1 1 58.1 64.1 70.1 77.8 5 5 5 5 6.5 5.8 5.3 4.8 92 103 113 125 0.104 0.105 0.105 0.106 68A 75A 82A 91A P6SMB100AT3 P6SMB110AT3 P6SMB120AT3 P6SMB130AT3 95 105 114 124 100 110 120 130 105 116 126 137 1 1 1 1 85.5 94 102 111 5 5 5 5 4.4 4 3.6 3.3 137 152 165 179 0.106 0.107 0.107 0.107 100A 110A 120A 130A P6SMB150AT3 P6SMB160AT3 P6SMB170AT3 P6SMB180AT3 143 152 162 171 150 160 170 180 158 168 179 189 1 1 1 1 128 136 145 154 5 5 5 5 2.9 2.7 2.6 2.4 207 219 234 246 0.108 0.108 0.108 0.108 150A 160A 170A 180A P6SMB200AT3 190 200 210 1 171 5 2.2 274 0.108 200A Breakdown Voltage* VBR @ IT Volts Maximum Reverse L k Leakage @ VRWM IR µA Maximum Reverse S Surge Current IRSM{ Amps Maximum Reverse Voltage g @ IRSM (Clamping Voltage) VRSM Volts Maximum Temperature Coefficient of VBR %/°C D i Device Marking * * VBR measured at pulse test current IT at an ambient temperaure of 25°C. * * 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum. {{ Surge current waveform per Figure 2 and derate per Figure 3 of the General Data — 600 Watt at the beginning of this group. {{ T3 suffix designates tape and reel of 2500 units. Devices listed in bold, italic are Motorola preferred devices. Motorola TVS/Zener Device Data 600 Watt Peak Power Data Sheet 5-73 P6SMB11CAT3 through P6SMB91CAT3 Bi–Directional ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) VF = 3.5 V Max, IF** = 50 A for all types. Maximum Reverse Leakage @ VRWM IR µA Maximum Reverse Surge Current IRSM{ Amps Maximum Reverse Voltage @ IRSM (Clamping Voltage) VRSM Volts Maximum Temperature Coefficient of VBR %/°C D i Device Marking Device D i {{ Min Nom Max mA Working Peak Reverse Voltage VRWM Volts P6SMB11CAT3 P6SMB12CAT3 P6SMB13CAT3 10.5 11.4 12.4 11 12 13 11.6 12.6 13.7 1 1 1 9.4 10.2 11.1 5 5 5 38 36 33 15.6 16.7 18.2 0.075 0.078 0.081 11C 12C 13C P6SMB15CAT3 P6SMB16CAT3 P6SMB18CAT3 P6SMB20CAT3 14.3 15.2 17.1 19 15 16 18 20 15.8 16.8 18.9 21 1 1 1 1 12.8 13.6 15.3 17.1 5 5 5 5 28 27 24 22 21.2 22.5 25.2 27.7 0.084 0.086 0.088 0.09 15C 16C 18C 20C P6SMB22CAT3 P6SMB24CAT3 P6SMB27CAT3 P6SMB30CAT3 20.9 22.8 25.7 28.5 22 24 27 30 23.1 25.2 28.4 31.5 1 1 1 1 18.8 20.5 23.1 25.6 5 5 5 5 20 18 16 14.4 30.6 33.2 37.5 41.4 0.092 0.094 0.096 0.097 22C 24C 27C 30C P6SMB33CAT3 P6SMB36CAT3 P6SMB39CAT3 P6SMB43CAT3 31.4 34.2 37.1 40.9 33 36 39 43 34.7 37.8 41 45.2 1 1 1 1 28.2 30.8 33.3 36.8 5 5 5 5 13.2 12 11.2 10.1 45.7 49.9 53.9 59.3 0.098 0.099 0.1 0.101 33C 36C 39C 43C P6SMB47CAT3 P6SMB51CAT3 P6SMB56CAT3 P6SMB62CAT3 44.7 48.5 53.2 58.9 47 51 56 62 49.4 53.6 58.8 65.1 1 1 1 1 40.2 43.6 47.8 53 5 5 5 5 9.3 8.6 7.8 7.1 64.8 70.1 77 85 0.101 0.102 0.103 0.104 47C 51C 56C 62C P6SMB68CAT3 P6SMB75CAT3 P6SMB82CAT3 P6SMB91CAT3 64.6 71.3 77.9 86.5 68 75 82 91 71.4 78.8 86.1 95.5 1 1 1 1 58.1 64.1 70.1 77.8 5 5 5 5 6.5 5.8 5.3 4.8 92 103 113 125 0.104 0.105 0.105 0.106 68C 75C 82C 91C Breakdown Voltage* VBR @ IT Volts * * VBR measured at pulse test current IT at an ambient temperaure of 25°C. * * 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum. {{ Surge current waveform per Figure 2 and derate per Figure 3 of the General Data — 600 Watt at the beginning of this group. {{ T3 suffix designates tape and reel of 2500 units. 600 Watt Peak Power Data Sheet 5-74 Motorola TVS/Zener Device Data Transient Voltage Suppressors — Surface Mounted 600 Watt Peak Power 0.089 2.261 S 0.108 2.743 A D 0.085 2.159 B inches mm SMB Footprint C K P J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. H CASE 403A PLASTIC DIM A B C D H J K P S INCHES MIN MAX 0.160 0.180 0.130 0.150 0.075 0.095 0.077 0.083 0.0020 0.0060 0.006 0.012 0.030 0.050 0.020 REF 0.205 0.220 MILLIMETERS MIN MAX 4.06 4.57 3.30 3.81 1.90 2.41 1.96 2.11 0.051 0.152 0.15 0.30 0.76 1.27 0.51 REF 5.21 5.59 (Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.) MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS Package Option Type No. Suffix MPQ (Units) Tape and Reel T3 (13 inch reel) 2.5K (Refer to Section 10 for more information on Packaging Specifications.) Devices listed in bold, italic are Motorola preferred devices. Motorola TVS/Zener Device Data 600 Watt Peak Power Data Sheet 5-75 MOTOROLA SEMICONDUCTOR TECHNICAL DATA GENERAL DATA GENERAL DATA APPLICABLE TO ALL SERIES IN THIS GROUP 1500 WATT PEAK POWER Zener Transient Voltage Suppressors The SMC series is designed to protect voltage sensitive components from high voltage, high energy transients. They have excellent clamping capability, high surge capability, low zener impedance and fast response time. The SMC series is supplied in Motorola’s exclusive, cost-effective, highly reliable Surmetic package and is ideally suited for use in communication systems, numerical controls, process controls, medical equipment, business machines, power supplies and many other industrial/consumer applications. Specification Features: Standard Zener Breakdown Voltage Range — 6.8 to 91 V Stand-off Voltage Range — 5 to 78 V Peak Power — 1500 Watts @ 1 ms Maximum Clamp Voltage @ Peak Pulse Current Low Leakage < 5 µA Above 10 V UL Recognition Maximum Temperature Coefficient Specified Available in Tape and Reel Response Time Typically < 1 ns • • • • • • • • • PLASTIC SURFACE MOUNT ZENER OVERVOLTAGE TRANSIENT SUPPRESSORS 6.8–91 VOLTS 1500 WATT PEAK POWER CASE 403 PLASTIC Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic FINISH: All external surfaces are corrosion resistant and leads are readily solderable POLARITY: Cathode indicated by molded polarity notch. When operated in zener mode, will be positive with respect to anode MOUNTING POSITION: Any LEADS: Modified L-Bend providing more contact area to bond pads MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds WAFER FAB LOCATION: Phoenix, Arizona ASSEMBLY/TEST LOCATION: Seremban, Malaysia MAXIMUM RATINGS Rating Symbol Value Unit Peak Power Dissipation (1) @ TL ≤ 25°C PPK 1500 Watts Forward Surge Current (2) @ TA = 25°C IFSM 200 Amps RqJL 15 °C/W TJ, Tstg – 65 to +150 °C Thermal Resistance from Junction to Lead (typical) Operating and Storage Temperature Range NOTES: 1. Nonrepetitive current pulse per Figure 2 and derated above TA = 25°C per Figure 3. NOTES: 2. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum. REV 1 1500 Watt Peak Power Data Sheet 5-76 Motorola TVS/Zener Device Data GENERAL DATA — 1500 WATT PEAK POWER NONREPETITIVE PULSE WAVEFORM SHOWN IN FIGURE 2 100 10 PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IRSM. tr PEAK VALUE – IRSM VALUE (%) PP, PEAK POWER (kW) 100 tr ≤ 10 µs I HALF VALUE – RSM 2 50 tP 1 0.1 µs 1 µs 10 µs 100 µs 1 ms 0 10 ms 0 1 2 tP, PULSE WIDTH 3 4 t, TIME (ms) Figure 1. Pulse Rating Curve Figure 2. Pulse Waveform 1000 140 120 100 80 60 40 20 0 TL = 25°C tP = 10 µs 500 I Z , ZENER CURRENT (AMPS) PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25° C 160 0 25 50 75 100 125 150 VZ (NOM) = 6.8 TO 13 V 20 V 43 V 24 V 75 V 200 100 120 V 50 180 V 20 10 5 2 1 0.3 0.5 0.7 1 2 3 5 7 10 20 30 TA, AMBIENT TEMPERATURE (°C) ∆VZ, INSTANTANEOUS INCREASE IN VZ ABOVE VZ (NOM) (VOLTS) Figure 3. Pulse Derating Curve Figure 4. Dynamic Impedance UL RECOGNITION The entire series has Underwriters Laboratory Recognition for the classification of protectors (QVGV2) under the UL standard for safety 497B and File #116110. Many competitors only have one or two devices recognized or have recognition in a non-protective category. Some competitors have no recognition at all. With the UL497B recognition, our parts successfully passed several tests including Strike Voltage Motorola TVS/Zener Device Data Breakdown test, Endurance Conditioning, Temperature test, Dielectric Voltage-Withstand test, Discharge test and several more. Whereas, some competitors have only passed a flammability test for the package material, we have been recognized for much more to be included in their Protector category. 1500 Watt Peak Power Data Sheet 5-77 GENERAL DATA — 1500 WATT PEAK POWER APPLICATION NOTES RESPONSE TIME In most applications, the transient suppressor device is placed in parallel with the equipment or component to be protected. In this situation, there is a time delay associated with the capacitance of the device and an overshoot condition associated with the inductance of the device and the inductance of the connection method. The capacitive effect is of minor importance in the parallel protection scheme because it only produces a time delay in the transition from the operating voltage to the clamp voltage as shown in Figure 5. The inductive effects in the device are due to actual turn-on time (time required for the device to go from zero current to full current) and lead inductance. This inductive effect produces an overshoot in the voltage across the equipment or component being protected as shown in Figure 6. Minimizing this overshoot is very important in the application, since the main purpose for adding a transient suppressor is to clamp voltage spikes. The SMC series have a very good response time, typically < 1 ns and negligible inductance. However, external inductive effects could produce unacceptable overshoot. Proper circuit layout, minimum lead lengths and placing the suppressor device as close as possible to the equipment or components to be protected will minimize this overshoot. Some input impedance represented by Zin is essential to prevent overstress of the protection device. This impedance should be as high as possible, without restricting the circuit operation. DUTY CYCLE DERATING The data of Figure 1 applies for non-repetitive conditions and at a lead temperature of 25°C. If the duty cycle increases, the peak power must be reduced as indicated by the curves of Figure 7. Average power must be derated as the lead or ambient temperature rises above 25°C. The average power derating curve normally given on data sheets may be normalized and used for this purpose. At first glance the derating curves of Figure 7 appear to be in error as the 10 ms pulse has a higher derating factor than the 10 µs pulse. However, when the derating factor for a given pulse of Figure 7 is multiplied by the peak power value of Figure 1 for the same pulse, the results follow the expected trend. TYPICAL PROTECTION CIRCUIT Zin LOAD Vin VL Vin (TRANSIENT) V V Vin (TRANSIENT) OVERSHOOT DUE TO INDUCTIVE EFFECTS VL VL Vin td tD = TIME DELAY DUE TO CAPACITIVE EFFECT t Figure 5. t Figure 6. 1 0.7 0.5 DERATING FACTOR 0.3 0.2 PULSE WIDTH 10 ms 0.1 0.07 0.05 1 ms 0.03 100 µs 0.02 10 µs 0.01 0.1 0.2 0.5 1 2 5 10 D, DUTY CYCLE (%) 20 50 100 Figure 7. Typical Derating Factor for Duty Cycle 1500 Watt Peak Power Data Sheet 5-78 Motorola TVS/Zener Device Data 1SMC5.0AT3 through 1SMC78AT3 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted). mA Maximum Clamping Voltage VC @ Ipp Volts Peak Pulse Current (See Figure 2) Ipp{ Amps Maximum Reverse Re erse Leakage @ VR IR µA Device Marking 6.40 6.67 7.22 7.78 10 10 10 10 9.2 10.3 11.2 12.0 163.0 145.6 133.9 125.0 1000 1000 500 200 GDE GDG GDK GDM 7.5 8.0 8.5 9.0 8.33 8.89 9.44 10.0 1.0 1.0 1.0 1.0 12.9 13.6 14.4 15.4 116.3 110.3 104.2 97.4 100 50 20 10 GDP GDR GDT GDV 1SMC10AT3 1SMC11AT3 1SMC12AT3 1SMC13AT3 10 11 12 13 11.1 12.2 13.3 14.4 1.0 1.0 1.0 1.0 17.0 18.2 19.9 21.5 88.2 82.4 75.3 69.7 5.0 5.0 5.0 5.0 GDX GDZ GEE GEG 1SMC14AT3 1SMC15AT3 1SMC16AT3 1SMC17AT3 14 15 16 17 15.6 16.7 17.8 18.9 1.0 1.0 1.0 1.0 23.2 24.4 26.0 27.6 64.7 61.5 57.7 53.3 5.0 5.0 5.0 5.0 GEK GEM GEP GER 1SMC18AT3 1SMC20AT3 1SMC22AT3 1SMC24AT3 18 20 22 24 20.0 22.2 24.4 26.7 1.0 1.0 1.0 1.0 29.2 32.4 35.5 38.9 51.4 46.3 42.2 38.6 5.0 5.0 5.0 5.0 GET GEV GEX GEZ 1SMC26AT3 1SMC28AT3 1SMC30AT3 1SMC33AT3 26 28 30 33 28.9 31.1 33.3 36.7 1.0 1.0 1.0 1.0 42.1 45.4 48.4 53.3 35.6 33.0 31.0 28.1 5.0 5.0 5.0 5.0 GFE GFG GFK GFM 1SMC36AT3 1SMC40AT3 1SMC43AT3 1SMC45AT3 36 40 43 45 40.0 44.4 47.8 50.0 1.0 1.0 1.0 1.0 58.1 64.5 69.4 72.7 25.8 23.2 21.6 20.6 5.0 5.0 5.0 5.0 GFP GFR GFT GFV 1SMC48AT3 1SMC51AT3 1SMC54AT3 1SMC58AT3 48 51 54 58 53.3 56.7 60.0 64.4 1.0 1.0 1.0 1.0 77.4 82.4 87.1 93.6 19.4 18.2 17.2 16.0 5.0 5.0 5.0 5.0 GFX GFZ GGE GGG 1SMC60AT3 1SMC64AT3 1SMC70AT3 1SMC75AT3 60 64 70 75 66.7 71.1 77.8 83.3 1.0 1.0 1.0 1.0 96.8 103 113 121 15.5 14.6 13.3 12.4 5.0 5.0 5.0 5.0 GGK GGM GGP GGR 1SMC78AT3 78 86.7 1.0 126 11.4 5.0 GGT Breakdown Voltage* Device{{ Reverse Stand-Off Voltage VR Volts (1) Volts Min 1SMC5.0AT3 1SMC6.0AT3 1SMC6.5AT3 1SMC7.0AT3 5.0 6.0 6.5 7.0 1SMC7.5AT3 1SMC8.0AT3 1SMC8.5AT3 1SMC9.0AT3 VBR @ IT Note 1: A transient suppressor is normally selected according to the reverse ”Stand Off Voltage” (VR) which should be equal to or greater than the DC or continuous peak operating voltage level. * * VBR measured at pulse test current IT at an ambient temperaure of 25°C. {{ Surge current waveform per Figure 2 and derate per Figure 3 of the General Data — 1500 Watt at the beginning of this group. {{ T3 suffix designates tape and reel of 2500 units. ABBREVIATIONS AND SYMBOLS VR Stand Off Voltage. Applied reverse voltage to assure a non-conductive condition (See Note 1). V(BR)min This is the minimum breakdown voltage the device will exhibit and is used to assure that conduction does not occur prior to this voltage level at 25°C. VC Maximum Clamping Voltage. The maximum peak voltage appearing across the transient suppressor when IPP PP IR subjected to the peak pusle current in a one millisecond time interval. The peak pulse series resistance and thermal rise. Peak Pulse Current — See Figure 2 Peak Pulse Power Reverse Leakage Devices listed in bold, italic are Motorola preferred devices. Motorola TVS/Zener Device Data 1500 Watt Peak Power Data Sheet 5-79 1SMC6.8AT3 through 1.5SMC91AT3 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) VF = 3.5 V Max, IF** = 100 A for all types. D i {{ Device Min Nom Max mA Working Peak R Reverse Voltage VRWM Volts 1.5SMC6.8AT3 1.5SMC7.5AT3 1.5SMC8.2AT3 1.5SMC9.1AT3 6.45 7.13 7.79 8.65 6.8 7.5 8.2 9.1 7.14 7.88 8.61 9.55 10 10 10 1 5.8 6.4 7.02 7.78 1000 500 200 50 143 132 124 112 10.5 11.3 12.1 13.4 0.057 0.061 0.065 0.068 6V8A 7V5A 8V2A 9V1A 1.5SMC10AT3 1.5SMC11AT3 1.5SMC12AT3 1.5SMC13AT3 9.5 10.5 11.4 12.4 10 11 12 13 10.5 11.6 12.6 13.7 1 1 1 1 8.55 9.4 10.2 11.1 10 5 5 5 103 96 90 82 14.5 15.6 16.7 18.2 0.073 0.075 0.078 0.081 10A 11A 12A 13A 1.5SMC15AT3 1.5SMC16AT3 1.5SMC18AT3 1.5SMC20AT3 14.3 15.2 17.1 19 15 16 18 20 15.8 16.8 18.9 21 1 1 1 1 12.8 13.6 15.3 17.1 5 5 5 5 71 67 59.5 54 21.2 22.5 25.2 27.7 0.084 0.086 0.088 0.09 15A 16A 18A 20A 1.5SMC22AT3 1.5SMC24AT3 1.5SMC27AT3 1.5SMC30AT3 20.9 22.8 25.7 28.5 22 24 27 30 23.1 25.2 28.4 31.5 1 1 1 1 18.8 20.5 23.1 25.6 5 5 5 5 49 45 40 36 30.6 33.2 37.5 41.4 0.092 0.094 0.096 0.097 22A 24A 27A 30A 1.5SMC33AT3 1.5SMC36AT3 1.5SMC39AT3 1.5SMC43AT3 31.4 34.2 37.1 40.9 33 36 39 43 34.7 37.8 41 45.2 1 1 1 1 28.2 30.8 33.3 36.8 5 5 5 5 33 30 28 25.3 45.7 49.9 53.9 59.3 0.098 0.099 0.1 0.101 33A 36A 39A 43A 1.5SMC47AT3 1.5SMC51AT3 1.5SMC56AT3 1.5SMC62AT3 44.7 48.5 53.2 58.9 47 51 56 62 49.4 53.6 58.8 65.1 1 1 1 1 40.2 43.6 47.8 53 5 5 5 5 23.2 21.4 19.5 17.7 64.8 70.1 77 85 0.101 0.102 0.103 0.104 47A 51A 56A 62A 1.5SMC68AT3 1.5SMC75AT3 1.5SMC82AT3 1.5SMC91AT3 64.6 71.3 77.9 86.5 68 75 82 91 71.4 78.8 86.1 95.5 1 1 1 1 58.1 64.1 70.1 77.8 5 5 5 5 16.3 14.6 13.3 12 92 103 113 125 0.104 0.105 0.105 0.106 68A 75A 82A 91A Breakdown Voltage* VBR @ IT Volts Maximum Reverse L k Leakage @ VRWM IR µA Maximum Reverse S Surge Current IRSM{ Amps Maximum Reverse Voltage g @ IRSM (Clamping Voltage) VRSM Volts Maximum Temperature Coefficient of VBR %/°C D i Device Marking * * VBR measured at pulse test current IT at an ambient temperaure of 25°C. * * 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum. {{ Surge current waveform per Figure 2 and derate per Figure 3 of General Data — 1500 Watt at the beginning of this group. {{ T3 suffix designates tape and reel of 2500 units. Devices listed in bold, italic are Motorola preferred devices. 1500 Watt Peak Power Data Sheet 5-80 Motorola TVS/Zener Device Data 1.5SMC6.8AT3 through 1.5SMC91AT3 Transient Voltage Suppressors — Surface Mounted 1500 Watt Peak Power 0.171 4.343 S A 0.150 3.810 D B 0.110 2.794 C K P J H CASE 403 (SMC) inches mm SMC Footprint NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. DIM A B C D H J K P S INCHES MILLIMETERS MIN MAX MIN MAX 6.60 7.11 0.260 0.280 5.59 6.10 0.220 0.240 1.90 2.41 0.075 0.095 2.92 3.07 0.115 0.121 0.0020 0.0060 0.051 0.152 0.15 0.30 0.006 0.012 0.76 1.27 0.030 0.050 0.020 REF 0.51 REF 7.75 8.13 0.305 0.320 (Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.) MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS Package Option Type No. Suffix MPQ (Units) Tape and Reel T3 (13 inch reel) 2.5K (Refer to Section 10 for more information on Packaging Specifications.) Devices listed in bold, italic are Motorola preferred devices. Motorola TVS/Zener Device Data 1500 Watt Peak Power Data Sheet 5-81