19-3702; Rev 1; 10/05 I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller The MAX6917 provides all the features of a real-time clock (RTC) plus a microprocessor (µP) supervisory circuit, NV RAM controller, and backup-battery monitor function. In addition, 96 x 8 bits of static RAM are available for scratchpad storage. The MAX6917 communicates with a µP through an I2C-bus-compatible serial interface. The real-time clock/calendar provides seconds, minutes, hours, day, date, month, and year information. The end of the month date is automatically adjusted for months with fewer than 31 days, including corrections for leap years through 2099. The clock operates in either 24hr or 12hr format with an AM/PM indicator. A time/date-programmable alarm function is provided with an open-drain, active-low alarm output. The µP supervisory circuit features an open-drain, active-low reset available in three different reset thresholds. A manual reset input and a watchdog function are included as well. The NV RAM controller provides power for external SRAM from a backup battery plus chip-enable gating. The backup battery also provides data retention of the on-board 96 x 8 bits of RAM. An open-drain, active-low, battery-on signal alerts the system when operating from a battery. The battery-test circuitry periodically tests the backup battery for a low-battery condition. An optional external resistor network selects different battery thresholds. A freshness seal prevents battery drain until the first VCC power-up. The MAX6917 has a crystal-fail-detect circuit and a data-valid bit. The MAX6917 is available in a 20-pin QSOP package and is guaranteed to operate over the extended (-40°C to +85°C) temperature range. Applications Features ♦ Real-Time Clock Counts Seconds, Minutes, Hours, Date, Month, Day of Week, and Year with Leap-Year Compensation Through 2099 ♦ Fast (400kHz) I2C-Bus-Compatible Interface ♦ 96 x 8 Bits of RAM for Scratchpad Data Storage ♦ Uses Standard 32.768kHz, 6pF Load, Watch Crystal ♦ Single-Byte or Multiple-Byte (Burst Mode) Data Transfer for Read or Write of Clock Registers or RAM ♦ Battery Monitor and Low-Battery Warning Output Internal Default for Lithium Backup-Battery Testing Pins Available for Other Backup-Battery Testing Configurations ♦ Dual Power-Supply Pins for Primary and Backup Power ♦ Battery-On Output ♦ NV RAM Controller Chip-Enable Gating (Control of CE with Reset and Power Valid) VOUT for SRAM Power ♦ Microprocessor Supervisor with Watchdog Input ♦ Programmable Time/Date Alarm Output ♦ Data Valid Bit (Loss of All Voltage Alerts User of Corrupt Data) ♦ Crystal-Fail Detect Point-of-Sale Equipment ♦ Reference Output Frequencies—1Hz and 32.768kHz Programmable Logic Controllers ♦ Small, 20-Pin, QSOP Surface-Mount Package Intelligent Instruments Fax Machines Ordering Information Digital Thermostats Industrial Control Pin Configuration and Selector Guide appear at end of data sheet. PART TEMP RANGE PINPACKAGE PKG CODE MAX6917EO30+ -40°C to +85°C 20 QSOP E20-2 MAX6917EO33+ -40°C to +85°C 20 QSOP E20-2 MAX6917EO50+ -40°C to +85°C 20 QSOP E20-2 +Denotes lead-free package. ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX6917 General Description MAX6917 I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller ABSOLUTE MAXIMUM RATINGS VBATT, VCC to GND ...............................................-0.3V to +6.0V All Other Pins to GND ................................-0.3V to (VCC + 0.3V) All Other Pins to GND ............................-0.3V to (VBATT + 0.3V) Input Currents VCC ..................................................................................200mA VBATT .................................................................................20mA GND ....................................................................................20mA All Other Pins ....................................................................±20mA Output Currents VOUT Continuous ..........................................................200mA All Other Outputs ............................................................20mA Continuous Power Dissipation 20-Pin QSOP (derate 9.1mW/°C over TA = +70°C) .....727mW Operating Temperature Range ...........................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Notes 1, 2) PARAMETER Operating Voltage Range (Note 3) Operating Voltage Range BATT (Note 4) Timekeeping Current VBATT (Note 5) Active Supply Current VCC (Note 6) 2 SYMBOL VCC VBATT IBATT ICCA CONDITIONS MIN TYP MAX MAX6917EO30 2.7 3.0 3.3 MAX6917EO33 3.0 3.3 3.6 MAX6917EO50 4.5 5.0 5.5 MAX6917EO30 2.0 5.5 MAX6917EO33 2.0 5.5 MAX6917EO50 2.0 5.5 1Hz, 32kHz outputs disabled; XTAL FAIL disabled VBATT = 2V, VCC = 0 1 VBATT = 3V, VCC = 0 1.4 VBATT = 3.6V, VCC = 0 1.9 VBATT = 5.5V, VCC = 0 3.8 1Hz, 32kHz outputs disabled; XTAL FAIL enabled VBATT = 2V, VCC = 0 1.23 VBATT = 3V, VCC = 0 1.61 VBATT = 3.6V, VCC = 0 2.3 VBATT = 5.5V, VCC = 0 4.08 1Hz, 32kHz enabled, outputs open; XTAL FAIL disabled VBATT = 2V, VCC = 0 2.82 1Hz, 32kHz enabled, outputs open; XTAL FAIL enabled 1Hz, 32kHz outputs disabled; XTAL FAIL disabled VBATT = 3V, VCC = 0 4.7 VBATT = 3.6V, VCC = 0 6.1 VBATT = 5.5V, VCC = 0 10.6 VCC = 3.3V, VBATT = 0 0.1 VCC = 3.6V, VBATT = 0 0.12 VCC = 5.5V, VBATT = 0 0.2 VCC = 3.3V, VBATT = 0 0.9 VCC = 3.6V, VBATT = 0 0.11 VCC = 5.5V, VBATT = 0 0.18 _______________________________________________________________________________________ UNITS V V µA mA I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller (VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Notes 1, 2) PARAMETER Standby Current VCC (Note 5) SYMBOL ICCS CONDITIONS MIN TYP MAX 1Hz, 32kHz enabled, outputs open; XTAL FAIL enabled VCC = 3.3V, VBATT = 0 27 VCC = 3.6V, VBATT = 0 30 VCC = 5.5V, VBATT = 0 81 1Hz, 32kHz outputs disabled; XTAL FAIL disabled VCC = 3.3V, VBATT = 0 20 VCC = 3.6V, VBATT = 0 25 VCC = 5.5V, VBATT = 0 76 UNITS µA VOUT VOUT in VCC Mode (Note 4) VOUT in Battery-Backup Mode (Notes 4, 7) VOUT VOUT VCC = 2.7V, VBATT = 0, IOUT = 35mA VCC 0.2 VCC = 3.0V, VBATT = 0, IOUT = 35mA VCC 0.2 VCC = 4.5V, VBATT = 0, IOUT = 70mA VCC 0.2 VBATT = 2V, VCC = 0, IOUT = 400µA VBATT 0.02 VBATT = 3V, VCC = 0, IOUT = 800µA VBATT 0.03 VBATT = 4.5V, VCC = 0, IOUT = 1.5mA VBATT 0.05 V V VBATT-to-VCC Switchover Threshold VTRU Power-up (VCC < VRST) switch from VBATT to VCC (Note 7) VBATT + 0.1 VCC-to-VBATT Switchover Threshold VTRD Power-down (VCC < VRST) switch from VCC to VBATT (Note 7) VBATT V V - 0.1 CE_IN AND CE_OUT (Figures 10, 14, 15, 16) CE_IN Leakage Current IIL, IIH Disabled, VCC < VRST, VCE_IN = VCC or GND -1 +1 µA CE_IN-to-CE_OUT Resistance VCC = VCC(MIN), VIH = 0.9VCC, CE_OUT connected to GND; VIL = 0.1VCC, CE_OUT connected to VCC 46 140 Ω CE_IN-to-CE_OUT Propagation Delay tCED 50Ω source-impedance driver, CLOAD = 10pF, VCC = VCC(MIN), VIH = 0.9VCC, VIL = 0.1VCC (Note 8); measured from 50% point on CE_IN to the 50% point of CE_OUT 10 20 ns RESET Active to CE_OUT High Delay tRCE MR high to low 10 50 µs 2 _______________________________________________________________________________________ 3 MAX6917 DC ELECTRICAL CHARACTERISTICS (continued) MAX6917 I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller DC ELECTRICAL CHARACTERISTICS (continued) (VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Notes 1, 2) PARAMETER SYMBOL CE_OUT Active-Low Delay After VCC > VRST tRP CE_OUT High Voltage VOH CONDITIONS IOH = -100µA, VBATT = 2V, VCC = 0, RESET = low MIN TYP MAX UNITS 140 200 280 ms 0.8 x VBATT V MR INPUT (Figure 10) MR Input Voltage VIL 0.8 2.0 VIH MR Pullup Resistance Internal pullup resistor MR Minimum Pulse Width 50 kΩ 1 MR Glitch Immunity tGW MR to RESET Delay tRD VCC = VCC(MIN), VBATT = 0 V µs 35 ns 450 600 ns s WDI INPUT (Figure 12) VCC > VRST from rising edge of RESET 1.00 1.6 2.25 tWDL Long watchdog timeout period 1.00 1.6 2.25 s tWDS Short watchdog timeout period 140 200 280 ms WDI Initial Timeout Period Watchdog Timeout Period Minimum WDI Input Pulse Width WDI Input Threshold tWDI ns 0.8 2.0 VIH WDI Input-Leakage Current VCC Standby Current with WDI Max Frequency 100 VIL VWDI = VCC or GND ICCSW -100 Watchdog frequency = 1MHz, VCC = VCC(MAX), 1Hz, 32kHz outputs disabled (Note 5) V +100 nA 450 µA BATTERY TEST AND TRIP (Figures 17, 18, and 19) VBATT Trip Point VBTP Internal mode 2.45 2.6 2.70 V TRIP Input Threshold VTRIP VCC = VCC(MAX), VBATT = 2V, external mode 1.14 1.24 1.31 V TRIP Input Comparator Hysteresis VTRIP_HYST 10 TRIP Input Current ITRIP_LKG External mode Battery Test Load RLOAD_INT Internal TEST Output-High Voltage VTEST_HIGH ITEST = -5mA TEST Output-Low Voltage VTEST_LOW -100 0.50 0.91 mV +100 nA 1.30 MΩ VOUT 0.3V V ITEST = 5mA 0.3 VBATT = 2V, VCC = 0, IOL = 5mA 0.5 VCC = 2.7V, VBATT = 0, IOL = 10mA 0.5 VCC = 4.5V, VBATT = 0, IOL = 20mA 0.5 V BATT_LO, ALM OUTPUT Output Low Voltage Off-Leakage 4 VOL ILKG -100 _______________________________________________________________________________________ +100 V nA I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller (VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Notes 1, 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS BATT_ON OUTPUT Output Low Voltage VOL Off-Leakage VBATT = 2V, VCC = 0, IOL = 5mA 0.5 VBATT = 2.7V, VCC = 0, IOL = 10mA 0.5 VBATT = 4.5V, VCC = 0, IOL = 20mA 0.5 ILKG -100 +100 V nA RESET RESET Threshold Voltage VRST Hysteresis VRST MAX6917EO30 2.5 2.63 2.7 MAX6917EO33 2.8 2.93 3.0 MAX6917EO50 4.1 4.38 4.5 VHYST VCC Falling-Reset Delay tRPD 30 VCC falling from VRST(MAX) MAX6917EO30 to VRST(MIN), measured MAX6917EO33 from the beginning of VCC MAX6917EO50 falling to RESET low Main Reset Active-Timeout Period tRP 140 RESET Output Voltage VOL Off-Leakage ILKG -100 Input High Voltage VIH 0.7 x VCC Input Low Voltage VIL V mV 27 75 37 90 50 120 200 280 ms 0.2 V +100 nA RESET asserted, IOL = 1.6mA, VBATT = 2V, VCC = 0 µs I2C DIGITAL INPUTS SCL, SDA Input Hysteresis 0.3 x VCC 0.05 x VCC VHYS Input Leakage Current VIN = 0 to VCC Input Capacitance SDA Output Low Voltage VOL V -100 V V +100 nA (Note 8) 10 pF IOL = 4mA, VCC = VCC(MIN) 0.4 V VCC = 0, VBATT = 2V, IOL = 100µA 0.2 VCC = 2.7V, VBATT = 0, IOL = 1mA 0.4 VCC = 4.5V, VBATT = 0, IOL = 2mA 0.5 FREQUENCY OUTPUTS (32kHz and 1Hz) 32kHz and 1Hz OUT Low Voltage VOL V _______________________________________________________________________________________ 5 MAX6917 DC ELECTRICAL CHARACTERISTICS (continued) MAX6917 I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller DC ELECTRICAL CHARACTERISTICS (continued) (VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Notes 1, 2) PARAMETER SYMBOL 32kHz and 1Hz OUT High Voltage VOH CONDITIONS MIN VCC = 0, VBATT = 2V, IOH = -100µA VOUT 0.1V VCC = 2.7V, VBATT = 0, IOH = -1mA VOUT 0.3V VCC = 4.5V, VBATT = 0, IOH = -2mA VOUT 0.4V TYP MAX UNITS V AC ELECTRICAL CHARACTERISTICS (VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 800 400,000 Hz tTIMEOUT 1 2 s tBUF 1.3 µs 0.6 µs 0.6 µs FAST I2C-BUS TIMING (Figure 2 (Note 9)) SCL Clock Frequency Bus Timeout fSCL Bus Free Time Between STOP and START Conditions Hold Time After (Repeated) START Conditions tHD:STA Repeated START Condition Setup Time tHD:STA (Note 10) After this period, the first clock is generated STOP Condition Setup Time tSU:STO Data Hold Time tHD:DAT 0.6 Data Setup Time tSU:DAT 100 ns SCL Low Period tLOW 1.3 µs SCL High Period tHIGH 0.6 µs (Notes 11, 14) µs 0 0.9 µs SCL/SDA Rise Time (Receiving) tR (Note 12) 20 + 0.1 × Cb 300 ns SCL/SDA Fall Time (Receiving) tF (Notes 12, 13) 20 + 0.1 × Cb 300 ns SCL/SDA Fall Time (Transmitting) tF (Notes 12, 13) 20 + 0.1 × Cb 250 ns Pulse Width of Spike Suppressed tSP 50 ns Capacitive Load for Each Bus Line Cb 400 pF BATTERY-TEST TIMING (Figure 18) Battery Test to BATT_LO Active 0 tBL (Note 8) Battery-Test Cycle—Normal tBTCN (Note 8) Battery-Test Pulse Width tBTPW (Note 8) 1 24 s hr 1 s Note 1: VRST is the reset threshold for VCC. See the Selector Guide section. Note 2: All parameters are 100% tested at T A = +85°C. Limits overtemperature are guaranteed by design and are not production tested. 6 _______________________________________________________________________________________ I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller (VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2) Note 3: Note 4: Note 5: Note 6: Note 7: Note 8: Note 9: Note 10: Note 11: Note 12: Note 13: Note 14: I2C serial interface is operational for VCC > VRST. See the Detailed Description section (VOUT function). IBATT is specified with SDA = SCL = VCC, CE_IN = WDI = GND, VOUT , CE_OUT, and MR floating. ICCS is specified with SDA = SCL = VCC, CE_IN = WDI = GND, VOUT, CE_OUT, and MR floating. I2C serial interface operating at 400kHz, SDA pulled high, and WDI = VCC or GND, VOUT and CE_OUT floating. For OUT switchover to BATT, VCC must fall below VRST and VBATT. For OUT switchover to VCC, VCC must be above VRST or above VBATT. Guaranteed by design. Not subject to production testing. All values are referred to VIH (MIN) and VIL(MAX) levels. Minimum SCL clock frequency is limited by the MAX6917 bus timeout feature, which resets the serial bus interface if either SDA or SCL is held low for 1s to 2s. When using the burst read or write command, all 96 bytes of RAM must be read/written within the timeout period. See the Timeout Feature section. A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the V IH(MIN) of the SCL signal) to bridge the undefined region of the falling edge of SCL. Cb is the total capacitance of one bus line in pF. The maximum tF for the SDA and SCL bus lines is specified at 300ns. The maximum fall time for the SDA output stage tF is specified at 250ns. This allows series-protection resistors to be connected between the SDA/SCL pins and the SDA/SCL bus lines without exceeding the maximum specified tF. The maximum tHD:DAT only has to be met if the device does not stretch the LOW period (tLOW) of the SCL signal. Typical Operating Characteristics (VCC = 3V, VBATT = 3V, TA = +25°C, unless otherwise noted.) VCC-TO-OUT VOLTAGE vs. TEMPERATURE VCC = 3V VBATT = 0V IOUT = 35mA 30 25 VCC = 3.3V VBATT = 0V IOUT = 35mA 20 15 MAX6917 toc02 VCC-TO-OUT VOLTAGE (mV) 35 BATT-TO-OUT VOLTAGE vs. TEMPERATURE 10 9 BATT-TO-OUT VOLTAGE (mV) MAX6917 toc01 40 8 VCC = 0V VBATT = 3V IOUT = 800µA 7 6 5 4 3 VCC = 0V VBATT = 2V IOUT = 400µA 2 1 10 0 15 10 35 60 85 -40 10 35 60 TEMPERATURE (°C) TIMEKEEPING CURRENT vs. TEMPERATURE TIMEKEEPING CURRENT vs. TEMPERATURE 1.6 MAX6917 toc03a 1.6 VBATT = 3V 1.4 VBATT = 3V 1.4 85 1.2 IBATT (µA) 1.2 IBATT (µA) 15 TEMPERATURE (°C) MAX6917 toc03b -40 1.0 0.8 1.0 0.8 SCL = SDA = VCC = 0V 1Hz, 32kHz OUTPUTS DISABLED XTAL FAIL DISABLED 0.6 SCL = SDA = VCC = 0V 1Hz, 32kHz OUTPUTS DISABLED XTAL FAIL ENABLED 0.6 0.4 0.4 -40 15 10 35 TEMPERATURE (°C) 60 85 -40 15 10 35 60 85 TEMPERATURE (°C) _______________________________________________________________________________________ 7 MAX6917 AC ELECTRICAL CHARACTERISTICS (continued) Typical Operating Characteristics (continued) (VCC = 3V, VBATT = 3V, TA = +25°C, unless otherwise noted.) RESET TIMEOUT PERIOD vs. TEMPERATURE 2.8 2.6 SCL = SDA = VCC = 0V 1Hz, 32kHz OUTPUTS ENABLED XTAL FAIL DISABLED 210 205 200 195 180 85 1 -40 15 10 TEMPERATURE (°C) 40 RESET THRESHOLD (V) RESET COMPARATOR DELAY (µs) MAX6917 toc06 VCC FALLING AT 10V/ms 35 30 25 20 15 10 5 15 10 35 60 2.675 2.670 2.665 2.660 2.645 2.640 RESET GOES LOW BELOW THIS THRESHOLD 2.635 2.630 2.625 2.620 2.615 85 RESET ASSERTS ABOVE THIS LINE 60 50 40 30 20 210 205 200 195 190 180 15 10 35 60 85 -40 8 RISING EDGE OF CE_IN TO RISING EDGE OF CE_OUT 7 VCC = 3V VCC = 3.3V 4 3 2 10 35 60 85 CHIP-ENABLED PROPAGATION DELAY vs. CE_OUT LOAD CAPACITANCE 6 5 15 TEMPERATURE (°C) VCC = 5V 1 0 100 150 200 250 300 350 400 450 500 8 WD TIME BIT SET TO 1 215 CHIP-ENABLED PROPAGATION DELAY vs. CE_OUT LOAD CAPACITANCE 70 1000 185 -40 CHIP-ENABLED PROPAGATION DELAY (ns) 90 100 220 TEMPERATURE (°C) MAX6917 toc09 100 10 WATCHDOG TIMEOUT PERIOD vs. TEMPERATURE 2.655 2.650 MAXIMUM TRANSIENT DURATION vs. RESET COMPARATOR OVERDRIVE OVERDRIVE (mV) 1 VCC FALLING (V/ms) RESET GOES HIGH ABOVE THIS THRESHOLD TEMPERATURE (°C) 80 0.1 85 RESET THRESHOLD vs. TEMPERATURE (MAX6917EO30) 50 -40 60 TEMPERATURE (°C) RESET COMPARATOR DELAY vs. TEMPERATURE 45 35 MAX6917 toc08 60 WATCHDOG TIMEOUT PERIOD (ms) 35 8 CHIP-ENABLED PROPAGATION DELAY (ns) 10 MAX6917 toc07 15 10 190 185 2.2 -40 100 FALLING EDGE OF CE_IN TO FALLING EDGE OF CE_OUT 7 6 MAX6917 toc10b 2.4 215 MAX6917 toc10a IBATT (µA) 3.0 1000 RESET DELAY (µs) 3.2 220 MAX6917 toc04 VBATT = 3V RESET TIMEOUT PERIOD (ms) MAX6917 toc03c 3.4 RESET COMPARATOR DELAY vs. VCC FALLING MAX6917 toc05 TIMEKEEPING CURRENT vs. TEMPERATURE MAXIMUM TRANSIENT DURATION (µs) MAX6917 I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller VCC = 3V 5 VCC = 3.3V 4 3 VCC = 5V 2 1 0 0 10 20 30 40 50 60 70 80 90 100 LOAD CAPACITANCE (pF) 0 10 20 30 40 50 60 70 80 90 100 LOAD CAPACITANCE (pF) _______________________________________________________________________________________ I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller 0.070 0.035 0.030 0.025 2.25 0.060 0.055 0.050 1.50 0.040 1.25 4.7 5.1 0.50 2.7 5.5 3.1 SUPPLY VOLTAGE (V) MAX6917 toc12b SCL = SDA = VCC = 0V 1Hz, 32kHz OUTPUTS DISABLED XTAL FAIL ENABLED 2.25 IBATT (µA) 2.00 1.75 TA = +85°C 1.50 1.25 1.00 TA = -40°C TA = +25°C 0.75 0.50 2.5 3.0 3.5 4.0 4.5 5.0 5.5 8.0 7.5 7.0 6.5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 4.7 5.1 5.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VBATT (V) VCC TO VOUT vs. OUTPUT CURRENT (NORMAL MODE) SCL = SDA = VCC = 0V 1Hz, 32kHz OUTPUTS ENABLED XTAL FAIL DISABLED TA = +85°C 0.08 0.07 VCC = +2.7V 0.06 VCC = +3.3V 0.05 0.04 VCC = +5V 0.03 0.02 TA = -40°C 0.01 TA = +25°C 0 2.0 2.5 3.0 3.5 VBATT (V) 4.0 4.5 5.0 0 5.5 10 20 30 40 50 60 70 80 90 100 OUTPUT CURRENT (mA) VBATT (V) VBATT-TO-VOUT vs. OUTPUT CURRENT (BATTERY BACKUP MODE) 0.025 VBATT-TO-VOUT DROP (V) 2.0 4.3 TIMEKEEPING CURRENT vs. SUPPLY VOLTAGE 3.00 2.50 3.9 SUPPLY VOLTAGE (V) TIMEKEEPING CURRENT vs. SUPPLY VOLTAGE 2.75 3.5 VCC TO VOUT DROP (V) 4.3 MAX6917 toc12c 3.9 TA = +25°C 0.020 MAX6917 toc14 3.5 TA = -40°C 0.75 0.025 3.1 TA = +85°C 1.00 TA = -40°C, +25°C, +85°C 0.030 2.7 1.75 0.045 0.035 TA = -40°C, +25°C, +85°C 2.00 MAX6917 toc13 0.040 IBATT (µA) 2.50 IBATT (µA) 0.065 0.060 0.055 0.050 0.045 SCL = SDA = VCC = 0V 1Hz, 32kHz OUTPUTS DISABLED XTAL FAIL DISABLED 2.75 0.065 ICCA (mA) ICCA (mA) 0.075 0.070 SCL = 400kHz, SDA = VCC 1Hz, 32kHz OUTPUTS DISABLED XTAL FAIL DISABLED 0.075 3.00 MAX6917 toc11b SCL = 400kHz, SDA = VCC 1Hz, 32kHz OUTPUTS ENABLED XTAL FAIL ENABLED TIMEKEEPING CURRENT vs. SUPPLY VOLTAGE 0.080 MAX6917 toc11a 0.085 0.080 ACTIVE SUPPLY CURRENT vs. SUPPLY VOLTAGE MAX6917 toc12a ACTIVE SUPPLY CURRENT vs. SUPPLY VOLTAGE VBATT = +2V 0.015 VBATT = +3.3V 0.010 VBATT = +5V 0.005 0 0 0.4 0.8 1.2 1.6 2.0 2.4 OUTPUT CURRENT (mA) _______________________________________________________________________________________ 9 MAX6917 Typical Operating Characteristics (continued) (VCC = 3V, VBATT = 3V, TA = +25°C, unless otherwise noted.) MAX6917 I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller Pin Description PIN FUNCTION 1 VOUT Supply Output for External SRAM or Other ICs Requiring Use of Backup-Battery Power. When VCC rises above the reset threshold or above VBATT, VOUT is connected to VCC. When VCC falls below VRESET and VBATT, VBATT is connected to VOUT. Connect a 0.1µF low-leakage bypass capacitor from VOUT to GND. Leave open if not used. 2 TEST External Battery Test. Active high for 1s during each battery test. Intended to drive an external MOSFET or bipolar transistor for an external battery-test configuration. External test must be selected in the control register to use TEST; otherwise, it remains low. Leave open if not used. 3 TRIP External Trip Set. If a different battery-low threshold is desired other than the internal POR default of VBTP, then connect RSET+ between VBATT and TRIP and RSET- between TRIP and the drain or collector of an external transistor whose base or gate is connected to TEST; Figure 17 (see the Battery Test section). External test must be selected in the control register to use TRIP. Leave open if not used. 4 BATT_ON 5 CE_IN Open-Drain Battery-On Indicator. BATT_ON is active low when the MAX6917 is powered from VBATT. Chip-Enable Input. The input to the chip-enable gating circuitry. Connect CE_IN to GND if unused. MR Manual-Reset Input. A logic low on MR asserts RESET. RESET remains asserted as long as MR is low and for tRP after MR returns high. The active-low MR input has an internal pullup resistor. MR can be driven from a TTL or CMOS-logic line or shorted to ground with a switch. Internal debouncing circuitry ensures noise immunity. Leave MR open if unused. 7 WDI Watchdog Input. If WDI remains either high or low for longer than the watchdog timeout period, the internal watchdog timer runs out and RESET is asserted. The internal watchdog timer clears while RESET is asserted or when WDI sees a rising or falling edge. The watchdog function can be disabled from the control register. The timeout period is configurable in the control register for 200ms or 1.6s. 8 GND 9 X1 32.768kHz Crystal-Oscillator Input 10 X2 32.768kHz Crystal-Oscillator Output 6 10 NAME Ground ______________________________________________________________________________________ I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller PIN NAME 11 32KHZ 12 1HZ 1Hz Output. Buffered push-pull output that is enabled from the FOUT configuration register. 13 SDA Open-Drain Data Input/Output. I2C bus serial data input/output connection. 14 SCL Serial Clock Input. I2C bus clock for input/output data transfers. 15 ALM Open-Drain, Active-Low Alarm Output. ALM goes low when RTC time matches alarm thresholds set in the alarm threshold registers. ALM stays low until cleared by reading or writing to the alarm configuration register or to any of the alarm threshold registers. 16 CE_OUT Chip-Enable Output. CE_OUT goes low only when CE_IN is low and RESET is not asserted. If CE_IN is low when RESET is asserted, CE_OUT remains low for tRCE or until CE_IN goes high, whichever occurs first. CE_OUT is pulled to VOUT. 17 BATT_LO Open-Drain, Battery-Low Indicator. BATT_LO is active low when the VBATT input is tested below VBTP if the internal trip is selected in the control register (POR default). If external trip is selected in the control register, then BATT_LO is active low when TRIP is less than VTRIP. 18 RESET 19 VCC 20 VBATT FUNCTION 32.768kHz Output. Buffered push-pull output that is enabled from the FOUT configuration register. Open-Drain, Active-Low Reset Output. RESET pulses low for tRP when triggered, and stays low whenever VCC is below the reset threshold or when MR is logic low. RESET remains low for tRP after either VCC rises above the reset threshold or MR goes from low to high. Main Supply Input. Connect a 0.1µF bypass capacitor from VCC to GND. Backup-Battery Input. When VCC falls below the reset threshold and VBATT, VOUT switches from VCC to VBATT. When VCC rises above VBATT or the reset threshold, VOUT reconnects to VCC. VBATT may exceed VCC. Connect VBATT to GND if no backup-battery supply is used. Connect a 0.1µF low-leakage bypass capacitor from VBATT to GND. Detailed Description Functional Description The MAX6917 contains eight 8-bit timekeeping registers, seven 8-bit alarm threshold registers, one status register, one control register, one alarm-configuration register, and 96 x 8 bits of SRAM. In addition to single-byte reads and writes to registers and RAM, there is a burst timekeeping register read/write command, a burst RAM read/write command, and a battery-test command that allows software-commanded testing of the backup battery at any time. An I2C-bus-compatible interface allows serial communication with a µP. When VCC is less than the reset threshold, the serial interface is disabled to prevent erroneous data from being written to the MAX6917. A µP supervisory section and an NVRAM controller are provided for ease of implementation with µP-based systems. A crystal fail-detect circuit and a data-valid bit can be used to guarantee RAM data integrity and valid timekeeping data. Two reference frequencies outputs, 32.768kHz and 1Hz, are provided for external device clocking. Time and calendar data are stored in a binary-coded decimal (BCD) format. Figure 1 shows the functional diagram of the MAX6917. Real-Time Clock The RTC provides seconds, minutes, hours, day, date, month, and year information. The end of the months is automatically adjusted for months with fewer than 31 days, including corrections for leap years through 2099. Crystal Oscillator The MAX6917 uses an external, standard 6pF load watch crystal. No other external components are required for this timekeeping oscillator. Power-up oscillator start time is dependent mainly upon applied VCC and ambient temperature. The MAX6917, because of its low timekeeping current, exhibits a typical startup time of 1s to 2s. I2C-Compatible Interface The I2C bus allows bidirectional, 2-wire communication between different ICs. The two lines are serial data line (SDA) and serial clock line (SCL). Both lines must be connected to a positive supply through individual pullup resistors (see the Typical Application Circuit). Data transfer can only be initiated when the bus is not busy (both SDA and SCL are high). Figure 2 shows a timing diagram for I2C communication. ______________________________________________________________________________________ 11 MAX6917 Pin Description (continued) MAX6917 I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller WATCHDOG TIMER WDI RESET MAX6917 DEBOUNCE CIRCUIT MR CRYSTALFAIL DETECT X1 X2 RESET LOGIC XTAL FAIL DIVIDERS OSCILLATOR 32.768kHz CE CONTROL CE_IN 32KHZ CLOCK BURST SECONDS 1HZ MINUTES TEST HOURS TRIP GND VBATT VOUT VCC BATT_LO DATE POWER CONTROL AND MONITOR MONTH CONTROL LOGIC BATT_ON DAY YEAR CONTROL CENTURY SCL INPUTSHIFT REGISTERS SDA ALARM CONFIG ADDRESS REGISTER BATT TEST STATUS 96 x 8 RAM ALM ALARM CONTROL LOGIC DATA VALID LOGIC CONFIG ALARM THRESHOLDS FOUT CONFIG RAM BURST Figure 1. Functional Diagram 12 ______________________________________________________________________________________ CE_OUT I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller MAX6917 SDA tBUFF tF tR tLOW SCL tHD:STA tSP tR tF tHD:DAT tHD:STA tSU:DAT tSU:STA tHIGH S tSU:STO Sr P S S = START CONDITION P = STOP CONDITION Sr = REPEATED START CONDITION Figure 2. I2C Communication Timing Diagram To maximize battery life and prevent erroneous data from being entered into the MAX6917, the serial bus interface is disabled when VCC is below VRST. If the SDA or SCL serial interface lines are held low for longer than 1s to 2s, the serial bus interface resets and awaits for a new START condition (see the START and STOP Conditions section). I2C System Configuration 2 I C-compatible bus that generates a A device on the message is called a transmitter and a device that receives the message is called a receiver. The device that controls the message is the master and the devices that are controlled by the master are called slaves (Figure 3). The word message refers to data in the form of three 8-bit bytes for a single read or write. The first byte is the slave ID byte, the second byte is the address/command byte, and the third is the data. START and STOP Conditions Data transfer can only be initiated when the bus is not busy (both SDA and SCL are high). A high-to-low transition of SDA while SCL is high defines a START (S) condition; low-to-high transition of SDA while SCL is high defines a STOP (P) condition (Figures 2, 4). Any time a START condition occurs, the slave ID must follow immediately, regardless of completion of a previous data transfer. Bit Transfer After the START condition occurs, 1 bit of data is transferred for each clock pulse. The data on SDA must remain stable during the high portion of the clock pulse as changes in data during this time are interpreted as a control signal (Figure 5). Acknowledge The acknowledge bit is a clocked 9th bit that the recipient uses to handshake receipt of each byte of data (Figure 6). Thus, each byte transferred effectively requires 9 bits. The master generates the 9th clock pulse, and the recipient pulls down SDA during the acknowledge clock pulse, such that the SDA line is stable low during the high portion of the clock pulse. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this case, the transmitter must leave the SDA high to enable the master to generate a STOP condition. If a STOP condition is received before the current byte of data transfer is completed in burst mode, the last incomplete byte is ignored if it is a burst transaction to RAM or the whole burst transaction is ignored if it is a burst transaction to the timekeeping registers. There is no limit to the number of bytes that can be transmitted between a START and a STOP condition. Slave Address Before any data is transmitted on the I2C-bus-compatible serial interface, the device that is expected to respond must be addressed first. The first byte sent after the START (S) condition is the address byte or 7bit slave ID. The MAX6917 acts as a slave transmitter/receiver. Therefore, SCL is only an input clock signal and SDA is a bidirectional data line. The slave address for the MAX6917 is shown in Figure 7. ______________________________________________________________________________________ 13 MAX6917 I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller Address/Command Byte The second byte of data sent after the START condition is the address/command byte (Figure 8). Each data transfer is initiated by an address/command byte. Bits 7–1 specify the designated register or RAM location to be read or written to, and the LSB (bit 0) specifies a write operation if logic zero or a read operation if logic one. The command byte is always input starting with the MSB (bit 7). Reading from the Timekeeping Registers The timekeeping registers (seconds, minutes, hours, date, month, day, and year) and the control register can be read either with a single read or a burst read (Figure 9). Since the RTC runs continuously and a read takes a finite amount of time, there is the possibility that the clock counters could change during a read operation, thereby reporting inaccurate timekeeping data. In the MAX6917, each clock counter’s data is buffered by a latch. Clock counter data is latched by the I2C bus read command (on the falling edge of SCL when the slave acknowledge bit is sent, after the address/command byte has been sent by the master to read a timekeeping register). Collision-detection circuitry ensures that this does not happen coincident with a seconds counter update to ensure accurate time data is being read. This avoids time-data changes during a read operation. The clock counters continue to count and keep accurate time during the read operation. If single reads are used to read each of the timekeeping registers individually, then it is necessary to do some error checking on the receiving end. An error can occur when the seconds counter increments before all the other registers are read out. For example, suppose a carry of 13:59:59 to 14:00:00 occurs during singleread operations of the timekeeping registers. Then the net data could become 14:59:59, which is erroneous real-time data. To prevent this with single-read operations, read the seconds register first (initial seconds) and store this value for future comparison. When the remaining timekeeping registers have been read out, read the seconds register again (final seconds). If the initial seconds value is 59, check that the final-seconds value is still 59; if not, repeat the entire single-read process for the timekeeping registers. A comparison of the initial-seconds value with the final-seconds value can indicate if there was a bus-delay problem in reading the timekeeping data (difference should always be 1s or less). Using a 100kHz bus speed, and sequential single reads, it would take under 2.5ms to read all seven of the timekeeping registers plus a second read of the seconds register. The most accurate way to read the timekeeping registers is to perform a burst read. With burst reads, the main timekeeping registers (seconds, minutes, hours, date, month, day, year) and the control register are read sequentially, in the order listed with the seconds register first. They must be all read out as a group of SDA SDA SCL MASTER TRANSMITTER/ RECEIVER SLAVE RECEIVER SLAVE TRANSMITTER/ RECEIVER MASTER TRANSMITTER MASTER TRANSMITTER/ RECEIVER Figure 3. I2C System Configuration SCL DATA LINE STABLE; DATA VALID CHANGE OF DATA ALLOWED Figure 5. Bit Transfer START CONDITION SDA SCL SCL S P START CONDITION STOP CONDITION CLOCK PULSE FOR ACKNOWLEDGE 1 2 SDA BY TRANSMITTER SDA BY RECEIVER S Figure 4. START and STOP Conditions 14 Figure 6. Acknowledge ______________________________________________________________________________________ 8 9 I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller 1 0 1 0 0 0 MSB R/W MAX6917 1 SDA ACK LSB SCL Figure 7. MAX6917 Slave Address BIT 7 A7 eight registers, with 8 bytes each, for proper execution of the burst-read function. All seven timekeeping registers are latched upon the receipt of the burst-read command. The worst-case error that can occur between the actual time and the read time is 1s. BIT 0 A6 A5 A4 A3 A2 A1 R/W Writing to the Timekeeping Registers The time and date can be set by writing to the timekeeping registers (seconds, minutes, hours, date, month, day, year, and century). To avoid changing the Figure 8. Address/Command Byte SINGLE WRITE S 1 1 0 1 0 0 0 0 AS R/W START CONDITION SINGLE READ S ACKNOWLEDGE FROM SLAVE 1 1 0 1 0 0 0 0 AS R/W START CONDITION BURST WRITE S ACKNOWLEDGE FROM SLAVE ACKNOWLEDGE FROM SLAVE 1 1 0 1 0 0 0 0 AS ACKNOWLEDGE FROM SLAVE ADDR ACKNOWLEDGE FROM SLAVE 0 AS 8-BIT DATA ACKNOWLEDGE FROM SLAVE ADDR AS P ACKNOWLEDGE FROM SLAVE 1 AS Sr NO ACKNOWLEDGE FROM MASTER 1 1 0 1 0 0 0 1 AS 8-BIT DATA AM P R/W REPEATED START CONDITION ACKNOWLEDGE FROM SLAVE ADDR ACKNOWLEDGE FROM SLAVE 0 AS FIRST 8-BIT DATA STOP CONDITION ACKNOWLEDGE FROM SLAVE AS LAST 8-BIT DATA AS P R/W STOP CONDITION START CONDITION BURST READ S ACKNOWLEDGE FROM SLAVE 1 1 0 1 0 0 0 0 AS R/W START CONDITION ADDR = 7-BIT RAM OR REGISTER ADDRESS S = START CONDITION Sr = REPEATED START CONDITION P = STOP CONDITION AS = ACKNOWLEDGE FROM SLAVE AM = ACKNOWLEDGE FROM MASTER AM = NOT ACKNOWLEDGE FROM MASTER ACKNOWLEDGE FROM SLAVE ADDR ACKNOWLEDGE FROM SLAVE 1 AS Sr 1 1 0 1 0 0 0 1 AS R/W REPEATED START CONDITION ACKNOWLEDGE FROM MASTER FIRST 8-BIT DATA AM NO ACKNOWLEDGE FROM MASTER LAST 8-BIT DATA AM P STOP CONDITION Figure 9. Read and Write Operations ______________________________________________________________________________________ 15 MAX6917 I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller current time by an incomplete write operation, the current time value is buffered from being written directly to the clock counters. The new data sent replaces the current contents of this input buffer. This time update data is loaded into the clock counters after the stop bit at the end of the I2C bus write operation. Collision-detection circuitry ensures that this does not happen coincident with a seconds-counter update to guarantee that accurate time data is being written. This avoids time data changes during a write operation. An incomplete write operation aborts the time-update procedures and the contents of the input buffer are discarded. The clock counters reflect the new time data beginning with the first 1s clock cycle after the stop bit. The clock counter is reset immediately after a write to the seconds register or a burst write to the timekeeping registers. This ensures that 1s clock tick is synchronous to timekeeping writes. If single-write operations (Figure 9) are used to write to each of the timekeeping registers, then error checking is needed. If the seconds register is the one to be updated, update it first and then read it back and store its value as the initial seconds. Update the remaining timekeeping registers and then read the seconds register again (final seconds). If initial seconds was 59, ensure it is still 59. If initial seconds was not 59, ensure that final seconds is within 1s of initial seconds. If the seconds register is not to be written to, then read the seconds register first and save it as initial seconds. Write to the required timekeeping registers and then read the seconds register again (final seconds). If initial seconds was 59, ensure it is still 59. If initial seconds was not 59, ensure that final seconds is within 1s of initial seconds. Although both single writes and burst writes are possible, the most accurate way to write to the timekeeping counters is to do a burst write (Figure 9). In the burst write, the main timekeeping registers (seconds, minutes, hours, date, month, day, year) and the control register are written sequentially. They must be all written to as a group of eight registers, with 8 bytes each, for proper execution of the burst-write function. All seven timekeeping registers and the control register are simultaneously loaded into the input buffer at the end of the 2-wire bus write operation. The worst-case error that can occur between the actual time and the write time update is 1s. 16 To avoid rollover issues when writing time data to the MAX6917, the remaining time and date registers must be written within 1s of updating the seconds register when using single writes. For burst writes, all eight registers must be written within this period (1s). The weekday data in the day register increments at midnight. Values that correspond to the day of the week are user defined, but must be sequential (i.e., if 1 equals Sunday, then 2 equals Monday, and so on). If invalid values are written to the timekeeping registers, the operation becomes undefined. Timeout Feature The purpose of the bus timeout feature is to reset the serial bus interface and change the SDA line of the MAX6917 from an output to an input, which puts the SDA line into a high-impedance state. This is necessary when the MAX6917 is transmitting data and becomes stuck at a logic-low level. If the SDA line is stuck low, any other device on the bus is not able to communicate. The timeout feature looks for a valid START and STOP condition to determine whether SDA has been stuck low. A valid START condition initiates the timeout counter in reference to the internal 1Hz clock. Counting begins on the first rising edge of the 1Hz clock after a valid START condition. If a valid STOP condition is detected before the next rising edge of the 1Hz clock, the timeout counter is stopped and awaits a new valid START condition. If a valid STOP condition is not detected before the next rising edge of the 1Hz clock, the I2C interface resets to the idle state and waits for a new I2C transaction. Depending on the occurrence of the START condition, that initiates the timeout counter, in reference to the internal 1Hz clock, the timeout period can be 1s to 2s. The lower limit of the timeout period (1s) imposes a limit on the SCL frequency of the MAX6917 because a burst read/write requires up to 96 bytes of information to be transmitted in between a START and STOP condition. ______________________________________________________________________________________ I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller Control Register The control register contains bits for configuring the MAX6917 for custom applications. Bit D0 (BATT ON BLINK) and D1 (BATT LO BLINK) are used to enable a 1Hz blink rate on BATT_ON and BATT_LO when they are active; see the Battery Test section for details. D2 (WD TIME) and D3 (WD EN) are used to enable the watchdog function and select its timeout. For details, see the Watchdog Input section. D5 (INT/EXT TEST) sets whether the internal resistor ratio or an external resistor ratio is to be used to check for the low-battery condition; see the Battery Test section for details. D6 (XTAL EN) enables the crystal-fail-detect circuitry when set. See the Crystal-Fail Detect section for details. D7 (WP) is the write protect bit. Before any write operation to the registers (except the control register) or RAM, bit 7 must be zero. When set to one, the write-protect bit prevents write operations to any register (except the control register) or RAM location. Timekeeping and Alarm Thresholds Registers Time and date data is stored in the timekeeping and alarm threshold registers in BCD format as shown in Table 1. The weekday data in the day register is user defined (a common format is 1 = Sunday, 2 = Monday, etc.) AM/PM and 12hr/24hr Mode For both timekeeping and alarm threshold registers (Table 1), D7 of the hours register is defined as the 12hr or 24hr mode-select bit. When set to one, the 12hr mode is selected. In the 12hr mode, D5 is the AM/PM bit with logic one being PM. In the 24hr mode, D5 is the second 10hr bit (20hr to 23hr). Clock-Burst Mode Addressing the clock-burst register specifies burstmode operation. In this mode, the first eight clock/calendar registers (seven timekeeping and the control register) can be consecutively read or written to by using the address/command byte 00h for a write or 01h for a read (Table 1). If the write-protect bit is set to one when a write-clock/calendar-burst mode is specified, no data transfer occurs to any of the seven timekeeping registers or the control register. When writing to the clock/calendar registers in the burst mode, the first eight registers must be written to for the data to be transferred. RAM The static RAM consists of 96 x 8 bits addressed consecutively in the RAM address/command space. Even address/commands (3Eh to FCh) are used for RAM writes and odd address/commands (3Fh to FDh) are used for RAM reads (Table 2). RAM-Burst Mode Sending the RAM-burst address/command (FEh for write, FFh for read) specifies burst-mode operation. In this mode, the 96 RAM locations can be consecutively read or written to starting with bit 7 of address/command 3Eh for writes, and 3Fh for reads. A burst read outputs all 96 bytes of RAM. When writing to RAM in burst mode, it is not necessary to write all 96 bytes for the data to transfer; each complete byte written is transferred to the RAM. When reading from RAM, data are output until all 96 bytes have been read, or until the data transfer is stopped by the I2C master. Status Register The status register contains individual bits for monitoring the status of several functions of the MAX6917. Bits D0–D3 are unused and always read zero (Table 1). D4 (ALM OUT) reflects the state of the alarm function; see the Alarm-Generation Function section for details. D5 (BATT LO) indicates the state of the battery connected to VBATT; see the Battery Test section for more information. D6 (DATA VALID) alerts the user if all power was lost. See the Data Valid Bit section for details. D7 (XTAL FAIL) is the output of the crystal-fail detect circuit. See the Crystal-Fail Detect section for details. ______________________________________________________________________________________ 17 MAX6917 Registers Tables 1 and 2 show the register map, as well as the register descriptions for the MAX6917. Table 1. Register Map REGISTER ADDRESS FUNCTION A7 A6 CLOCK BURST 0 0 SEC 1 0 A5 0 A4 0 A3 0 A2 0 REGISTER FUNCTION A1 0 A0 0 1 0 0 0 0 0 R 1 0 0 0 0 0 R 1 0 0 0 0 0 R W DATE 0 MONTH 1 0 1 0 0 0 0 R W 0 0 1 1 1 0 0 0 0 0 0 0 1 CENTURY 0 1 0 0 1 1 0 0 0 0 0 0 0 0 1 1 0 0 0 0 0 0 1 0 1 0 0 0 0–59 0 0 1 0 1 1 0 0 1 1 0 0 0 0 0 0 1 SEC 0 0 0 0 0 10 MIN 0 0 0 1 MIN 0 0 0 12/24 0 POR STATE 0 01–28/29 01–30/31 POR STATE 0–59 POR STATE 0 0 10 HR 00–23 01–12 1 HR AM/ PM 10 HR 0 0 0 0 0 0 0 10 DATE 0 0 0 0 0 0 10 M 0 0 0 0 0 0 0 0 R 01–07 POR STATE 0 0 0 0 0 0 0 0 0 0 00–99 POR STATE 0 1 1 1 0 0 WP XTAL EN 0 WD EN WD TIME POR STATE 0 1 0 1 0 00–99 POR STATE 0 0 1 1 DAY DATE 0 0 R R R ONE YEAR SEC R 0 32kHz VCC EN W R W POR STATE 1 0 INT/ EXT TEST 0 XTAL FAIL 0 0 0 0 1 WEEKDAY 0 0 1 0 0 BATT BATT LO ON BLINK BLINK 0 0 0 0 1 HR MIN SEC 0 0 0 0 1kHz VBAT EN 0 0 0 0 0 0 0 0 0 0 BATT LO ALM OUT 0 0 0 0 0 0 0 0 0 0 POR STATE DEFINES THE POWER-ON RESET STATE OF THE REGISTER. 18 1 100 YEAR 1kHz 32kHz VCC VBATT EN EN 1 0 1 YEAR 1000 YEAR 0 0 1 MONTH 10 YEAR R W 0 1 DATE 01–12 POR STATE STATUS D0 10 SEC 0 W 0 D1 0 POR STATE POR STATE FOUT CONFIGURATION D2 POR STATE W ALARM CONFIGURATION D3 R W CONTROL D4 W W YEAR D5 MONTH DAY D6 W W HR D7 R W MIN VALUE DATA VALID MAX6917 I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller ______________________________________________________________________________________ I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller MAX6917 Table 1. Register Map (continued) REGISTER ADDRESS FUNCTION BATT TEST REGISTER FUNCTION A7 A6 A5 A4 A3 A2 A1 A0 0 0 0 1 1 0 1 0 0 0 0 1 1 1 0 VALUE D7 D6 D5 D4 D3 D2 D1 D0 ALARM THRESHOLDS: SEC R W MIN 0 0 0 1 1 1 1 R W HR 0 0 1 0 0 0 0 R W DATE 0 MONTH 0 DAY 0 YEAR 0 0 1 0 0 0 1 0 1 0 0 1 0 0 1 0 0 1 1 0 1 0 1 0 0 R W 0 0 0 0 1 0 1 0 1 0 1 10 SEC 1 1 1 1 SEC 1 1 0 1 10 MIN 1 1 1 1 12/24 0 POR STATE 1 0 1 1 1 1 01–28/29 01–30/31 POR STATE 0 0 0 0 10 DATE 1 1 0–59 POR STATE 0 0 1 1 1 1 1 1 DATE 1 1 1 1 1 MONTH 1 1 1 10 HR 00–23 01–12 AM/ PM 10 HR 1 HR R 01–12 0 0 0 POR STATE 0 0 0 R 01–07 POR STATE 0 0 0 0 0 0 0 0 0 0 W R R W 1 1 MIN W W TEST CONFIGURATION (FACTORY RESERVED) 0–59 POR STATE 10 M 1 10 YEAR WEEK DAY 1 1 1 1 YEAR 00–99 POR STATE 1 1 1 1 1 1 1 1 POR STATE 0 0 0 0 0 0 0 0 RAM DATA 0 00h-FFh X X X X X X X X RAM DATA 95 00h-FFh X X X X X X X X RAM REGISTERS: RAM 0 1 1 1 1 1 R W 1 1 1 1 ... ... RAM 95 1 1 0 R W RAM BURST 1 1 1 1 1 1 1 R W POR STATE DEFINES THE POWER-ON RESET STATE OF THE REGISTER. ______________________________________________________________________________________ 19 MAX6917 I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller Power Control Alarm-Generation Function VBATT provides power as a battery backup. VCC provides the primary power in dual-supply systems where VBATT is connected as a backup source to maintain timekeeping in the absence of primary power. When VCC rises above the reset threshold, VRST, VCC powers the MAX6917. When VCC falls below the reset threshold, VRST, and is less than VTRD, VBATT powers the MAX6917. If VCC falls below the reset threshold, VRST, and is more than VTRU, VCC still powers the MAX6917. VCC slew rate in power-down is limited to 10V/ms (max) for proper data retention. The alarm function is configured using the alarm-configuration register and the alarm-threshold registers (Table 1). Writing a one to D7 (ONE SEC) in the alarmconfiguration register sets the alarm function to occur once every second, regardless of any other setting in the alarm-configuration register or in any of the alarmthreshold registers. When the alarm is triggered, D4 (ALM OUT) in the status register is set to one and the open-drain alarm output ALM goes low. The alarm is cleared by reading or writing to the alarm-configuration register or by reading or writing to any of the alarmthreshold registers. This resets the ALM output to a high and the ALM OUT bit to zero. When D7 (ONE SEC) is set to zero in the alarm-configuration register, then the alarm function is set by the remaining bits in the alarm-configuration register and the contents of the respective alarm-threshold register. For example, writing 01h (0000 0001) to the alarm-configuration register causes the alarm to trigger every time the seconds-timekeeping register matches the seconds alarm-threshold register (i.e., once every minute on a specific second). Writing 02h (0000 0010) to the alarm configuration register causes the alarm to trigger on a minutes match (i.e., once every hour). Writing a 4Fh (0100 1111) to the alarm configuration register causes the alarm to be triggered on a specific second, of a specific minute, of a specific hour, of a specific date, of a specific year. When setting the alarm-threshold registers, ensure that both the hour-timekeeping register and the hour-alarmthreshold register are using the same-hour format (either 12hr or 24hr format). The alarm function, as well as the ALM output, is operational in both VCC and battery-backup mode. VOUT Function VOUT is an output supply voltage for battery-backed-up devices such as SRAM. When V CC rises above the reset threshold or is greater than VBATT, VOUT connects to VCC (Figure 19). When VCC falls below V RST and V BATT , V OUT connects to V BATT . There is a typical ±100mV hysteresis associated with the switching between VCC and VBATT on the VOUT output. Connect a 0.1µF capacitor from VOUT to GND. Power-On Reset (POR) The MAX6917 contains an integral POR circuit that ensures all registers are reset to a known state on powerup. Once either VCC or VBATT rises above 1.6V (typ), the POR circuit releases the registers for normal operation. When VCC or VBATT drops to less than 0.9V (typ), the MAX6917 resets all register contents to the POR defaults. Oscillator Start Time The MAX6917 oscillator typically takes 1s to 2s to begin oscillating. To ensure the oscillator is operating correctly, the system software should validate proper timekeeping. This is accomplished by reading the seconds register. Any reading with more than 0s, from the POR value of 0s, is a validation of proper startup. 20 ______________________________________________________________________________________ I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller MAX6917 Table 2. Hex Register Address and Description WRITE ADDRESS/COMMAND (HEX) READ ADDRESS/COMMAND (HEX) DESCRIPTION POR SETTING (HEX) 00 01 Clock burst N/A 02 03 Seconds 00 04 05 Minutes 00 06 07 Hour 00 01 08 09 Date 0A 0B Month 01 0C 0D Day 01 0E 0F Year 70 10 11 Control 48 12 13 Century 00 14 15 Alarm configuration 19 16 17 FOUT configuration C0 18 19 Status 00 N/A 1A N/A Battery test 1C 1D Seconds alarm threshold 7F 1E 1F Minutes alarm threshold 7F 20 21 Hours alarm threshold BF 22 23 Date alarm threshold 3F 24 25 Month alarm threshold 1F 26 27 Day alarm threshold 07 28 29 Year alarm threshold FF 2A 2B Test configuration 00 3E 3F RAM 0 Indeterminate 40 41 RAM 1 Indeterminate 42 43 RAM 2 Indeterminate 44 45 RAM 3 Indeterminate 46 47 RAM 4 Indeterminate • • • • • • • • • • • • F4 F5 RAM 91 Indeterminate F6 F7 RAM 92 Indeterminate F8 F9 RAM 93 Indeterminate FA FB RAM 94 Indeterminate FC FD RAM 95 Indeterminate FE FF RAM BURST Indeterminate ______________________________________________________________________________________ 21 MAX6917 I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller Crystal-Fail Detect The crystal-fail detect circuit looks for a loss of oscillation from the 32.768kHz oscillator for 30 cycles (typ) or more. Both the control register and the status register are used in the crystal-failure detection scheme (Table 1). The crystal-fail detect circuit sets the XTAL FAIL bit in the status register to one for a crystal failure and to zero for normal operation. Once the status register is read, the XTAL FAIL bit is reset to zero, if it was previously one. If the crystal-fail-detect circuit continues to sense a failed crystal, then the XTAL FAIL bit is set again. On initial power-up, the crystal-fail detect circuit is enabled. Since it takes a while for the low-power, 32.768kHz oscillator to start, the XTAL FAIL bit in the status register can be set to one indicating a crystal failure. The XTAL FAIL bit should be polled a number of times to see if it is set to zero for successive polls. If the polling is far enough apart, a few polled results could guarantee that a maximum of 10s had elapsed since power-on, at which time the oscillator would be considered truly failed if the XTAL FAIL bit remains one. On subsequent power-ups, when XTAL EN is set to one, if XTAL FAIL is set to one, time data should be considered suspect. The crystal-fail-detection circuit functions in both VCC and VBATT modes when the XTAL EN bit is set in the control register. Manual Reset Input A logic low on MR asserts RESET. RESET remains asserted while MR is low, and for tRP after it returns high (Figure 10). MR has an internal pullup resistor, so it can be left open if it is not used. Internal debounce circuitry requires a minimum low time on the MR input of 1µs with 35ns maximum glitch immunity. Reset Output A µP’s reset input starts the µP in a known state. The MAX6917’s µP supervisory circuit asserts a reset to prevent code-execution errors during power-up, powerdown, and brownout conditions. The RESET output is guaranteed to be active for 0V < VCC < VRST, provided VBATT is greater than VBATT (min). If VCC drops below and then exceeds the reset threshold, an internal timer keeps RESET active for the reset timeout period tRP; after this interval, RESET becomes inactive high. This condition occurs at either power-up or after a V CC brownout. 22 MR CE OUT tRCE tRP tRP RESET CE IN Figure 10. Manual-Reset Timing Diagram The RESET output is also activated when the watchdog interrupt function is enabled but no transition is detected on the WDI input. In this case, RESET is active for the period tRP before becoming inactive again. When RESET is active, all inputs—WDI, MR, CE_IN, SDA, and SCL—are disabled. The MAX6917EO30 is optimized to monitor 3.0V ±10% power supplies. Except when MR is asserted, RESET is not active until VCC falls below 2.7V (3.0V - 10%), but is guaranteed to occur before the power supply falls below 2.5V (3.0V - 15%). The MAX6917EO33 is optimized to monitor 3.3V ±10% power supplies. Except when MR is asserted, RESET is not active until VCC falls below 3.0V (3.0V is just above 3.3V - 10%), but is guaranteed to occur before the power supply falls below 2.8V (3.3V - 15%). The MAX6917EO50 is optimized to monitor 5.0V ±10% power supplies. Except when MR is asserted, RESET is not active until VCC falls below 4.5V (5.0V - 10%), but is guaranteed to occur before the power supply falls below 4.1V (4.1V is just below 5.0V - 15%). Negative-Going VCC Transients The MAX6917 is relatively immune to short-duration negative transients (glitches) while issuing resets to the µP during power-up, power-down, and brownout conditions. Therefore, resetting the µP when VCC experiences only small glitches is usually not recommended. Typically, a VCC transient that goes 150mV below the reset threshold and lasts for 90µs or less does not cause a reset pulse to be issued. A 0.1µF capacitor mounted close to the VCC pin provides additional transient immunity. ______________________________________________________________________________________ I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller MAX6917 BUFFER VCC VRST VCC VCC VCC tRP µP MAX6917 RESET 4.7kΩ RESET tRP tWD tWD RESET WDI GND WD EN AND WD TIME ARE SET TO ZERO AND THE WATCHDOG FUNCTION IS DISABLED. GND Figure 11. Interfacing to µP with Bidirectional Reset I/O Interfacing to µPs with Bidirectional Reset Pins Microprocessors with bidirectional reset pins, such as the Motorola 68HC11 series, can contend with the MAX6917 RESET output. If, for example, the RESET output is driven high and the µP wants to pull it low, indeterminate logic levels can result. To correct this, connect a 4.7kΩ resistor between the RESET output and the µP reset I/O as shown in Figure 11. Buffer the RESET output to other system components. Battery-On Output The battery-on output, BATT_ON, is an open-drain output that indicates when the MAX6917 is powered from the backup-battery input, VBATT. When VCC falls below the reset threshold, V RST , and below V BATT , V OUT switches from VCC to VBATT and BATT_ON becomes low. When VCC rises above the reset threshold, VRST, VOUT reconnects to VCC and BATT_ON becomes high (open-drain output with pullup resistor). If desired, the BATT_ON output can be register selected, through the BATT ON BLINK bit in the control register, to toggle on and off 0.5s on, 0.5s off when active. The POR default is logic zero for no blink. Watchdog Input The watchdog circuit monitors the µP’s activity. If the µP does not toggle the watchdog input (WDI) within the register-selectable watchdog-timeout period, RESET is asserted for tRP. At the same time, the WD EN and WD TIME bits in the control register (Table 1) are reset to zero and can only be set again by writing the appropriate command to the control register. Thus, once a RESET is asserted due to a watchdog timeout, the watchdog function is disabled (Figure 12). Figure 12. Watchdog Timing Diagram WDI can detect pulses as short as tWDI. Data bit D2 in the control register controls the selection of the watchdog-timeout period. The power-up default is 1.6s (D2 = 0). A reset condition returns the timeout to 1.6s (D2 = 0). If D2 is set to one, then the watchdog-timeout period is changed to 200ms. Data bit D3 in the control register is the watchdog-enable function. A logic zero disables the watchdog function, while a logic one enables it. The POR state of WD EN is logic one, or the watchdog function is enabled. Disable the watchdog function by writing a zero to the WD EN bit in the control register, within the 1.6s POR default timeout after power-up. WDI does not include a pulldown or pullup feature. For this reason, WDI should not be left floating. When the WD EN bit in the control register is set to zero, WDI should be connected to VCC or GND. WDI is disabled and does not draw cross-conduction current when VCC falls below VRST. Watchdog Software Considerations There is a way to help the watchdog-timer monitor software execution more closely, which involves setting and resetting the watchdog input at different points in the program rather than “pulsing” the watchdog input. This technique avoids a “stuck” loop, in which the watchdog timer would continue to be reset within the loop, keeping the watchdog from timing out. Figure 13 shows an example of a flow diagram where the I/O driving the watchdog input is set high at the beginning of the program, set low at the beginning of every subroutine or loop, then set high again when the program returns to the beginning. If the program should “hang” in any subroutine, the problem would quickly be corrected since the I/O is continually set low and the watchdog timer is allowed to time out, causing a reset to be issued. ______________________________________________________________________________________ 23 MAX6917 I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller START MAX6917 VOUT SET WDI HIGH CHIP-ENABLE OUTPUT CONTROL PROGRAM CODE RESET GENERATOR SUBROUTINE OF PROGRAM LOOP SET WDI HIGH CE_IN CE_OUT RETURN Figure 13. Watchdog Flow Diagram Figure 14. Chip-Enable Gating Chip-Enable Gating Internal gating of chip-enable (CE) signals prevents erroneous data from corrupting external SRAM in the event of an undervoltage condition. The MAX6917 uses a transmission gate from CE_IN to CE_OUT (Figure 14). During normal operation (RESET inactive), the transmission gate is enabled and passes all CE transitions. When reset is asserted, this path becomes disabled, preventing erroneous data from corrupting the external SRAM. The short CE propagation delay from CE_IN to CE_OUT enables the MAX6917 to be used with most µPs. If CE_IN is low when reset asserts, CE_OUT remains low for tRCE to permit completion of the current write cycle. The propagation delay through the CE transmission gate depends on VCC, the source impedance of the driver connected to CE_IN, and the loading on CE_OUT (see the Chip-Enable Propagation Delay vs. CE_OUT Load Capacitance graph in the Typical Operating Characteristics). For minimum propagation delay, the capacitive load at CE_OUT should be minimized, and a low-output-impedance driver should be used on CE_IN (Figure 15). VCC Chip-Enable Input The CE transmission gate is disabled and CE_IN is high impedance (disabled mode) while RESET is active. During a power-down sequence when VCC passes the reset threshold, the CE transmission gate disables and CE_IN immediately becomes high impedance if the voltage at CE_IN is high. If CE_IN is low when RESET becomes active, the CE transmission gate disables at the moment CE_IN goes high or tRCE after RESET is active, whichever occurs first (see the Chip-Enable Timing diagram). This permits the current write cycle to complete during powerdown. The CE transmission gate remains disabled and CE_IN remains high impedance (regardless of CE_IN activity) for most of the reset-timeout period (tRST) any time a RESET is generated. When the CE transmission gate is enabled, the impedance of CE_IN appears as a 46Ω (typ) load in series with the load at CE_OUT. 24 VCC BATT 3.6V 25Ω EQUIVALENT SOURCE IMPEDANCE MAX6917 50Ω 50Ω CABLE CE_IN CE_OUT CL 10pF 50Ω GND CL INCLUDES LOAD CAPACITANCE AND SCOPE PROBE CAPACITANCE. Figure 15. Propagation Delay Test Circuit ______________________________________________________________________________________ I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller MAX6917 VRST VRST 2.0V VCC tRP tRPD RESET tRP VCC CE_OUT VBATT tRCE tCED CE_IN Figure 16. Chip-Enable Timing Diagram Chip-Enable Output When the CE transmission gate is enabled, the impedance seen at CE_OUT is equivalent to a 46Ω (typ) resistor in series with the source driving CE_IN. In the disabled mode, the transmission gate is off and an active pullup connects CE_OUT to VOUT (see Figures 14, 16). This pullup turns off when the transmission gate is enabled. Test Configuration Register This is a read-only register. from a reset condition caused by VCC < VRST, the DATA VALID bit can be read to see if the data stored during operation from the backup power supply is still valid (i.e., the backup power supply did not drop out). A one indicates valid data and a zero indicates corrupted data. Any time the internal supply to the MAX6917 (either VBATT or VCC depending upon the operating conditions) drops below 1.5V to 1.6V (typ), the DATA VALID bit is set to zero even if it has recently been set by a read of the status register. Data Valid Bit DATA VALID has a POR setting of zero, indicating that the data in the MAX6917 RTC is not guaranteed to be valid (Table 1). A read of the status register sets the DATA VALID bit to one, indicating valid data in the MAX6917 RTC. In a system that uses a backup power supply, the DATA VALID bit should be set to one by the system software on first system power-up by reading the status register. After that, any time the system recovers ______________________________________________________________________________________ 25 MAX6917 I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller VBATT VCC BATT_LO BATT_LO CONTROL LOGIC 1.24V RSET+_EXT RSET+_INT 480kΩ RLOAD_EXT (OPTIONAL) INT/EXT TEST TRIP INT/EXT TEST = 0 RSET-_EXT VOUT TEST RSET-_INT 430kΩ BATT TEST (±5mA) MAX6917 QEXT Figure 17. MAX6917 Battery Load and Test Circuit Battery Test Battery-Test Normal Operation In normal operation, the battery-test circuitry uses the control register POR settings of INT/EXT TEST, which is set to logic low as default (Table 1). In this mode, all battery-test load resistors and threshold settings are internal. When VCC rises above VRST, the MAX6917 automatically performs one power-on battery monitor test. Additionally, a battery check is performed every time that a reset is issued, either from a manual reset or a watchdog timeout. After that, periodic battery voltage monitoring at the factory-programmed time interval of 24hr begins while VCC is applied. After each 24hr period (t BTCN ) has elapsed, the MAX6917 connects VBATT to an internal 0.91MΩ (typ) test resistor (R SET+_Int + R SET-_Int ) for 1s (t BTPW ) (Figure 17). During this 1s, if VBATT falls below the factory-programmed battery trip point V BTP, the opendrain, battery-low output, BATT_LO, is asserted active low and the BATT LO bit in the status register is set to one. The BATT LO output can be register selected to toggle at a 1Hz rate (0.5s on, 0.5s off) when active. Once BATT LO is active, the 24hr tests stop until a fresh battery is inserted and BATT LO is cleared by writing any data to the battery test register at address 26 0x0D (Figure 18). Writing to this register performs a battery test and provided that the fresh battery is not low, deactivates the BATT LO output and resets BATT LO in the status register. Normal 24hr testing resumes. If a different load or BATT LO thresholds are desired for testing the backup battery, then external program resistors can be used in conjunction with the TRIP and TEST inputs (see the Battery Test-Control Register and Other Test Options section). Battery replacement following BATT_LO activation should be done with VCC nominal and not in batterybackup mode so that SRAM data is not lost. Alternatively, if SRAM data need not be saved, the battery can be replaced with the VCC supply removed. If a battery is replaced in battery-backup mode, sufficient time must be allowed for the voltage on the VOUT output to decay to zero. This ensures that the freshnessseal mode of operation has been reset and is active when VCC is powered up again. If insufficient time is allowed, then VCC must exceed VBATT during the subsequent power-up to ensure that the MAX6917 has left battery-backup mode (Figure 19). The MAX6917 does not constantly monitor an attached battery because such monitoring would drastically reduce the life of the battery. As a result, the MAX6917 ______________________________________________________________________________________ I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller MAX6917 VRST VCC VBATT VBTP (BATTERY TEST POINT) tBTCN tBTPW BATTERYTEST ACTIVE tBL ONCE THE BATTERY IS DETECTED AS LOW, THE PERIODIC BATTERY TESTING CEASES. A BATTERY CHECK CAN BE INITIATED BY WRITING TO THE REGISTER 0x1A. BATT_LO Figure 18. Battery-Test Timing Diagram VBATT VRST VRST VRST VRST VCC VBATT 0V BATTERY DETACH BATTERY ATTACH BATTERY DETACH BATTERY ATTACH VBATT FLOATING VBATT FLOATING EXIT FRESHNESS SEAL MODE VOUT 0V VBATT CONNECTED TO VOUT VCC CONNECTED TO VOUT VBATT CONNECTED TO VOUT FRESHNESS SEAL RESET VCC CONNECTED TO VOUT VBATT CONNECTED TO VOUT Figure 19. Battery Switchover Diagram only tests the battery for 1s every 24hr. If a good battery (one that has not been previously flagged with BATT_LO) is removed between battery tests, the MAX6917 does not immediately sense the removal and does not activate BATT_LO until the next-scheduled battery test. For this reason, a software-commanded battery test should be performed after a battery replacement by writing any data to the battery-test register at address 1Ah. Battery monitoring is only a useful technique when testing can be done regularly over the entire life of a lithium battery. Because the MAX6917 only performs battery monitoring when VCC is nominal, systems that are pow- ered down for excessively long periods can completely drain their lithium cells without receiving any advanced warning. To prevent such an occurrence, systems using the MAX6917 battery-monitoring feature should be powered up periodically (at least every few months) to perform battery testing. Furthermore, anytime BATT_LO is activated on the first battery test after a power-up, data integrity should be checked through a checksum or other technique. Timekeeping data would also be suspect and should be checked for accuracy against an accurate known reference. ______________________________________________________________________________________ 27 MAX6917 I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller Rf MAX6917 Rd Cg 12pF Cd 12pF X1 X2 EXTERNAL CRYSTAL Figure 20. Oscillator Functional Schematic GROUND PLANE VIA CONNECTION * GUARD RING * MAX6917 * * * * X1 * ** * GROUND PLANE VIA CONNECTION X2 * SM WATCH CRYSTAL * ** * GROUND PLANE VIA CONNECTION ** *LAYER 1 TRACE **LAYER 2 LOCAL GROUND PLANE CONNECT ONLY TO PIN 8 GROUND PLANE VIA CONNECTION Figure 21. Crystal Layout Freshness-Seal Mode When the battery is first attached to the MAX6917 without VCC power applied, the device does not immediately provide battery-backup power to VOUT (Figure 19). Only after VCC exceeds VRST and later falls below both VRST and VBATT does the MAX6917 leave freshness-seal mode and provide battery-backup power. This mode allows a battery to be attached during manufacturing but not used until after the system has been activated for the first time. As a result, no battery energy is drained during storage and shipping. Battery-Test Control Register and Other Test Options There are two warning formats for the BATT_LO and BATT_ON outputs. By setting D0 (BATT ON BLINK) 28 and/or D1 (BATT LO BLINK) in the control register to one, the respective warning output toggles on every 0.5s and off every 0.5s when set to active low by the internal MAX6917 logic. This allows a more noticeable warning indicator in systems where an LED is connected as a status or warning light for the end user. The POR default settings of zero leave these outputs set to logic low when they are active. D5 (INT/EXT TEST) selects whether the battery-test circuit is configured as internal or external (Table 1). If D5 is set to zero (default value), then the internal resistordivider is used between VBATT and GND to select the battery-low trip point (Figure 17). The internal resistors, RSET+_INT and RSET-_IINT, are used to divide VBATT in half, as well as to provide the battery-test-load resistance of 0.91MΩ (typ). If D5 (INT/EXT TEST) is set to one, then the two external resistors, RSET+_EXT and RSET-_EXT, are used to divide VBATT down to the ratio for a trip point set at TRIP of 1.24V (VTRIP) (typ). RSET+_EXT plus RSET-_EXT in series provide the load resistance used during the 1s every24hr-battery test. If additional load resistance is desired, then an external load resistor, RLOAD_EXT, can be placed between VBATT and the collector or drain of the transistor driven by TEST. The equivalent load resistance used to test the battery is then RLOAD_EXT in parallel with the series combination of RSET+_EXT plus R SET-_EXT . In this mode, the internal resistors are removed from TRIP and are not used as a load during the battery-test pulse. TEST pulses high to perform the battery test and remains low between tests. One final battery-test feature of the MAX6917 is the software write address/command of 1Ah that forces a 1s battery test to be performed every time it is sent. Frequency Outputs The 1Hz and 32kHz (32.768kHz) frequency outputs provide buffered, push-pull outputs for timing or clocking of external devices. Each push-pull output is referenced to GND for logic-low output levels and referenced to V OUT for logic-high output levels. Disabled frequency outputs are held at a logic-low level. The FOUT configuration register (Table 1) contains individual enable bits that control the state of the respective frequency output for V CC operating mode and for VBATT operating mode. Bits D5 (32kHz VBATT EN) and D4 (1Hz VBATT EN) in the FOUT configuration register enable the respective frequency output when operating from VBATT, if set to one, or disable the respective frequency output if set to zero. POR settings disable all frequency outputs when operating from VBATT. ______________________________________________________________________________________ I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller Applications Information Crystal Selection Connect a 32.768kHz watch crystal directly to the MAX6917 through pins 9 and 10 (X1, X2) (Figure 20). Use a crystal with a specified load capacitance (CL) of 6pF. Refer to Applications Note 616: Considerations for Maxim Real-Time Clock Crystal Selection from the Maxim website (www.maxim-ic.com) for more information regarding crystal parameters and crystal selection, as well as a list of crystal manufacturers. When designing the PC board, keep the crystal as close to the X1 and X2 pins of the MAX6917 as possible. Keep the trace lengths short and small to reduce capacitive loading and prevent unwanted noise pickup. Place a guard ring around the crystal and tie the ring to ground to help isolate the crystal from unwanted noise pickup. Keep all signals out from beneath the crystal and the X1 and X2 pins to prevent noise coupling. Finally, an additional local ground plane on an adjacent PC board layer can be added under the crystal to shield it from unwanted pickup from traces on other layers of the board. This plane should be isolated from the regular PC board ground, tied to the GND pin of the MAX6917, and needs to be no larger than the perimeter of the guard ring. Ensure that this ground plane does not contribute to significant capacitance between the signal line and ground on the connections that run from X1 and X2 to the crystal. See Figure 21. For frequency stability overtemperature, refer to the Applications Note: Real-Time-Clock Selection and Optimization from the Maxim website (www.maxim-ic.com.) Chip Information PROCESS: CMOS ______________________________________________________________________________________ 29 MAX6917 Bits D7 (32kHz VCC EN) and D6 (1Hz VCC EN) in the FOUT configuration register enable the respective frequency output when operating from VCC, if set to one, or disable the respective frequency output if set to zero. POR settings enable both output frequencies when operating from VCC. I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller MAX6917 Pin Configuration Selector Guide PART SUPPLY VOLTAGE (V) MAX6917EO30 3.0 MAX6917EO33 3.3 MAX6917EO50 5.0 TOP VIEW VOUT 1 20 VBATT TEST 2 19 VCC TRIP 3 18 RESET BATT_ON 4 17 BATT_LO MAX6917 CE_IN 5 16 CE_OUT MR 6 15 ALM WDI 7 14 SCL GND 8 13 SDA X1 9 12 1HZ X2 10 11 32KHZ QSOP Typical Application Circuit 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V LED ALM INTO SDA SDA SCL SCL 1HZ INT1 BATT_LO N.C. BATT_ON X1 CRYSTAL X2 3.3V VCC 0.1µF MAX6917 CE_IN CS RESET RST WDI P1.0 TEST N.C. TRIP N.C. µC GND N 32KHZ VBATT 3.0V N.C. 0.1µF I/O VOUT 0.1µF CMOS SRAM USER RESET MR CE_OUT CE GND GND 30 ______________________________________________________________________________________ I2C-Compatible RTC with Microprocessor Supervisor, Alarm, and NV RAM Controller QSOP.EPS PACKAGE OUTLINE, QSOP .150", .025" LEAD PITCH 21-0055 E 1 1 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 31 © 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc. MAX6917 Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)