EVALUATION KIT AVAILABLE The MAX2022 low-noise, high-linearity, direct conversion quadrature modulator/demodulator is designed for single and multicarrier 1500MHz to 3000MHz UMTS/WCDMA, LTE/TD-LTE, cdma2000®, and DCS/PCS base-station applications. Direct conversion architectures are advantageous since they significantly reduce transmitter or receiver cost, part count, and power consumption as compared to traditional IF-based double conversion systems. In addition to offering excellent linearity and noise performance, the MAX2022 also yields a high level of component integration. This device includes two matched passive mixers for modulating or demodulating in-phase and quadrature signals, three LO mixer amplifier drivers, and an LO quadrature splitter. On-chip baluns are also integrated to allow for single-ended RF and LO connections. As an added feature, the baseband inputs have been matched to allow for direct interfacing to the transmit DAC, thereby eliminating the need for costly I/Q buffer amplifiers. The MAX2022 operates from a single +5V supply. It is available in a compact 36-pin TQFN package (6mm x 6mm) with an exposed paddle. Electrical performance is guaranteed over the extended -40°C to +85°C temperature range. Applications ● S ingle and Multicarrier WCDMA/UMTS, and LTE/TDLTE Base Stations ● Single and Multicarrier cdmaOne™ and cdma2000 Base Stations ● Single and Multicarrier DCS 1800/PCS 1900 EDGE Base Stations ● PHS/PAS Base Stations ● Predistortion Transmitters ● Fixed Broadband Wireless Access ● Wireless Local Loop ● Private Mobile Radio ● Military Systems ● Microwave Links ● Digital and Spread-Spectrum Communication Systems cdma2000 is a registered trademark of Telecommunications Industry Association. cdmaOne is a trademark of CDMA Development Group. 19-3572; Rev 1; 9/12 Benefits and Features ● 1500MHz to 3000MHz RF Frequency Range ● 1500MHz to 3000MHz LO Frequency Range ● Scalable Power: External Current-Setting Resistors Provide Option for Operating Device in ReducedPower/Reduced-Performance Mode ● 36-Pin, 6mm x 6mm TQFN Provides High Isolation in a Small Package Modulator Operation: (2140MHz): ● Meets Four-Carrier WCDMA 65dBc ACLR ● 23.3dBm Typical OIP3 ● 51.5dBm Typical OIP2 ● 45.7dBc Typical Sideband Suppression ● -40dBm Typical LO Leakage ● -173.2dBm/Hz Typical Output Noise, Eliminating the Need for an RF Output Filter ● Broadband Baseband Input ● DC-Coupled Input Provides for Direct Launch DAC Interface, Eliminating the Need for Costly I/Q Buffer Amplifiers Demodulator Operation (1890MHz): ● 39dBm Typical IIP3 ● 58dBm Typical IIP2 ● 9.2dB Typical Conversion Loss ● 9.4dB Typical NF Ordering Information appears at end of data sheet. For related parts and recommended products to use with this part, refer to www.maximintegrated.com/MAX2022.related. WCDMA, ACLR, ALTCLR and Noise vs. RF Output Power at 2140MHz for Single, Two, and Four Carriers -60 -125 4C ADJ -62 4C ALT -64 -135 -66 -145 -68 2C ADJ -70 1C ADJ -155 -72 -74 1C ALT -76 -78 -80 NOISE FLOOR -50 2C ALT 4C 2C 1C 0 -40 -30 -20 -10 RF OUTPUT POWER PER CARRIER (dBm) -165 -175 NOISE FLOOR (dBm/Hz) General Description High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator ACLR AND ALT CLR (dBc) MAX2022 MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator Absolute Maximum Ratings VCC_ to GND........................................................-0.3V to +5.5V BBIP, BBIN, BBQP, BBQN to GND........... -2.5V to (VCC + 0.3V) LO, RF to GND Maximum Current......................................50mA RF Input Power...............................................................+20dBm Baseband Differential I/Q Input Power............................+20dBm LO Input Power...............................................................+10dBm RBIASLO1 Maximum Current.............................................10mA RBIASLO2 Maximum Current.............................................10mA RBIASLO3 Maximum Current.............................................10mA Continuous Power Dissipation (Note 1)...............................7.6W Operating Case Temperature Range (Note 2).... -40°C to +85°C Maximum Junction Temperature......................................+150°C Storage Temperature Range............................. -65°C to +150°C Lead Temperature (soldering, 10s).................................. +300°C Soldering Temperature (reflow)........................................+260°C Note 1: Based on junction temperature TJ = TC + (θJC x VCC x ICC). This formula can be used when the temperature of the exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150°C. Note 2:TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics TQFN Junction-to-Ambient Thermal Resistance (θJA) (Notes 3, 4)......................+34°C/W Junction-to-Case Thermal Resistance (θJC) (Notes 1, 4).....................+8.5°C/W Note 3: Junction temperature TJ = TA + (θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is known. The junction temperature must not exceed +150°C. Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. DC Electrical Characteristics (MAX2022 Typical Application Circuit, VCC = 4.75V to 5.25V, VGND = 0V, I/Q ports terminated into 50Ω to GND, LO and RF ports terminated into 50Ω to GND, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, TC = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +5V, TC = +25°C, unless otherwise noted.) PARAMETER Supply Voltage Total Supply Current SYMBOL CONDITIONS VCC ITOTAL MIN TYP MAX 4.75 5.00 5.25 V 292 342 mA 1460 1796 mW TYP MAX UNITS Pins 3, 13, 15, 31, 33 all connected to VCC Total Power Dissipation UNITS Recommended AC Operating Conditions PARAMETER SYMBOL CONDITIONS MIN RF Frequency (Note 5) fRF 1500 3000 MHz LO Frequency (Note 5) fLO 1500 3000 MHz IF Frequency (Note 5) LO Power Range www.maximintegrated.com fIF PLO -3 1000 MHz +3 dBm Maxim Integrated │ 2 MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator AC Electrical Characteristics (Modulator) (MAX2022 Typical Application Circuit, VCC = 4.75V to 5.25V, VGND = 0V, I/Q differential inputs driven from a 100Ω differential DC-coupled source, 0V common-mode input, PLO = 0dBm, fLO = 1900MHz to 2200MHz, 50Ω LO and RF system impedance, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, TC = -40°C to +85°C. Typical values are at VCC = 5V, VBBI = 109mVP-P differential, VBBQ = 109mVP-P differential, fIQ = 1MHz, TC = +25°C, unless otherwise noted.) (Notes 6, 7) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS BASEBAND INPUT Baseband Input Differential Impedance 43 BB Common-Mode Input Voltage Range (Note 8) -2.5 Output Power TC = +25°C -24 0 Ω +1.5 V dBm RF OUTPUTS (fLO = 1960MHz) Output IP3 VBBI, VBBQ = 547mVP-P differential per tone into 50Ω, fBB1 = 1.8MHz, fBB2 = 1.9MHz 21.8 dBm Output IP2 VBBI, VBBQ = 547mVP-P differential per tone into 50Ω, fBB1 = 1.8MHz, fBB2 = 1.9MHz 48.9 dBm -20.5 dBm -0.004 dB/°C Output Power Output Power Variation Over Temperature TC = -40°C to +85°C Output-Power Flatness fLO = 1960MHz, sweep fBB, PRF flatness for fBB from 1MHz to 50MHz 0.6 dB ACLR (1st Adjacent Channel 5MHz Offset) Single-carrier WCDMA (Note 9), RFOUT = -16dBm 70 dBc LO Leakage No external calibration, with each baseband input terminated in 50Ω to GND -46.7 dBm Sideband Suppression No external calibration 47.3 dBc 15.3 dB -173.4 dBm/Hz 10.1 dB RF Return Loss Output Noise Density fmeas = 2060MHz (Note 10) LO Input Return Loss RF OUTPUTS (fLO = 2140MHz) Output IP3 VBBI, VBBQ = 547mVP-P differential per tone into 50Ω, fBB1 = 1.8MHz, fBB2 = 1.9MHz 23.3 dBm Output IP2 VBBI, VBBQ = 547mVP-P differential per tone into 50Ω, fBB1 = 1.8MHz, fBB2 = 1.9MHZ 51.5 dBm -20.8 dBm -0.005 dB/°C 0.32 dB Output Power Output Power Variation Over Temperature TC = -40°C to +85°C Output-Power Flatness fLO = 2140MHz, sweep fBB, PRF flatness for fBB from 1MHz to 50MHz www.maximintegrated.com Maxim Integrated │ 3 MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator AC Electrical Characteristics (Modulator) (continued) (MAX2022 Typical Application Circuit, VCC = 4.75V to 5.25V, VGND = 0V, I/Q differential inputs driven from a 100Ω differential DC-coupled source, 0V common-mode input, PLO = 0dBm, fLO = 1900MHz to 2200MHz, 50Ω LO and RF system impedance, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, TC = -40°C to +85°C. Typical values are at VCC = 5V, VBBI = 109mVP-P differential, VBBQ = 109mVP-P differential, fIQ = 1MHz, TC = +25°C, unless otherwise noted.) (Notes 6, 7) PARAMETER SYMBOL CONDITIONS ACLR (1st Adjacent Channel 5MHz Offset) Single-carrier WCDMA (Note 9), RFOUT = -16dBm, fLO = 2GHz LO Leakage Sideband Suppression MIN MAX UNITS 70 dBc No external calibration, with each baseband input terminated in 50Ω to GND -40.4 dBm No external calibration 45.7 dBc 13.5 dB -173.2 dBm/Hz 18.1 dB RF Return Loss Output Noise Density TYP fmeas = 2240MHz (Note 10) LO Input Return Loss AC Electrical Characteristics (Demodulator, LO = 1880MHz) (MAX2022 Typical Application Circuit when operated as a demodulator. I/Q outputs are recombined using network shown in Figure 5. Losses of combining network not included in measurements. RF and LO ports are driven from 50Ω sources. Typical values are for VCC = 5V, I/Q DC returns = 160Ω resistors to GND, PRF = 0dBm, PLO = 0dBm, fRF = 1890MHz, fLO = 1880MHz, fIF = 10MHz, TC = +25°C, unless otherwise noted.) (Notes 6, 11) PARAMETER Conversion Loss Noise Figure SYMBOL CONDITIONS MIN TYP MAX UNITS LC 9.2 dB NFSSB 9.4 dB Input Third-Order Intercept Point IIP3 fRF1 = 1890MHz, fRF2 = 1891MHz, PRF1 = PRF2 = 0dBm, fIF1 = 10MHz, fIF2 = 11MHz 39 dBm Input Second-Order Intercept Point IIP2 fRF1 = 1890MHz, fRF2 = 1891MHz, PRF1 = PRF2 = 0dBm, fIF1 = 10MHz, fIF2 = 11MHz, fIM2nd = 21MHz 58 dBm LO Leakage at RF Port Unnulled -40 dBm Gain Compression PRF = 20dBm 0.10 dB 35 dB 17 dB Image Rejection RF Port Return Loss C9 = 1.2pF LO Port Return Loss C3 = 22pF 9 dB 43 Ω Minimum Demodulation 3dB Bandwidth >500 MHz Minimum 1dB Gain Flatness >450 MHz IF Port Differential Impedance www.maximintegrated.com Maxim Integrated │ 4 MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator AC Electrical Characteristics (Demodulator, LO = 2855MHz) (MAX2022 Typical Application Circuit when operated as a demodulator. I/Q outputs are recombined using network shown in Figure 5. Losses of combining network not included in measurements. RF and LO ports are driven from 50Ω sources. Typical values are for VCC = 5V, I/Q DC returns = 160Ω resistors to GND, PRF = 0dBm, PLO = 0dBm, fRF = 2655MHz, fLO = 2855MHz, fIF = 200MHz, TC = +25°C, unless otherwise noted.) (Notes 6, 11) PARAMETER Conversion Loss Noise Figure SYMBOL CONDITIONS MAX UNITS LC 11.2 dB 11.4 dB 34.5 dBm 60 dBm -31.3 dBm IIP3 fRF1 = 2655MHz, fRF2 = 2656.2MHz, PRF1 = PRF2 = 0dBm, fIF1 = 10MHz, fIF2 = 198.8MHz Input Second-Order Intercept Point IIP2 fRF1 = 2655MHz, fRF2 = 2656.2MHz, PRF1 = PRF2 = 0dBm, fIF1 = 200MHz, fIF2 = 198.8MHz, fIM2nd = 398.8MHz LO Leakage at RF Port Gain Compression TYP NFSSB Input Third-Order Intercept Point LO Leakage at IF Port MIN I+ -25.2 I- -23.5 Q+ -26 Q- -22.3 PRF = 20dBm 0.10 dBm dB I/Q Gain Mismatch 0.3 dB I/Q Phase Mismatch 0.5 deg RF Port Return Loss C9 = 22pF, L1 = 4.7nH, C14 = 0.7pF 22.5 dB LO Port Return Loss C3 = 6.8pF 14.2 dB 43 Ω Minimum Demodulation 3dB Bandwidth >500 MHz Minimum 1dB Gain Flatness >450 MHz IF Port Differential Impedance Note 5: Recommended functional range, not production tested. Operation outside this range is possible, but with degraded performance of some parameters. Note 6: All limits include external component losses of components, PCB, and connectors. Note 7: It is advisable not to operate the I and Q inputs continuously above 2.5VP-P differential. Note 8: Guaranteed by design and characterization. Note 9: Single-carrier WCDMA peak-to-average ratio of 10.5dB for 0.1% complementary cumulative distribution function. Note 10:No baseband drive input. Measured with the baseband inputs terminated in 50Ω to GND. At low-output power levels, the output noise density is equal to the thermal noise floor. Note 11:It is advisable not to operate the RF input continuously above +17dBm. www.maximintegrated.com Maxim Integrated │ 5 MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator Typical Operating Characteristics (MAX2022 Typical Application Circuit, 50Ω LO input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, VCC = 5V, PLO = 0dBm, fLO = 2140MHz, VI = VQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100Ω differential DC-coupled source, common-mode input from 0V, TC = +25°C, unless otherwise noted.) MODULATOR ALTERNATE CHANNEL -66 -68 ADJACENT CHANNEL -70 -72 -74 -74 ALTERNATE CHANNEL -78 -78 -78 -80 -80 -80 -10 0 -40 -30 OUTPUT POWER vs. LO FREQUENCY VI = VQ = 0.611VP-P DIFFERENTIAL -2 -4 PLO = -3dBm, 0dBm, +3dBm -6 -7 1.7 1.9 2.1 2.3 TC = +25°C -5 TC = -40°C -6 TC = +85°C 1.5 1.7 -30 -20 -2 VI = VQ = 0.611VP-P DIFFERENTIAL -3 -4 VCC = 4.75V, 5.0V, 5.25V -5 -6 -7 1.9 2.1 2.3 -8 2.5 1.5 1.7 1.9 2.1 2.3 LO FREQUENCY (GHz) LO LEAKAGE vs. LO FREQUENCY LO LEAKAGE vs. LO FREQUENCY LO LEAKAGE vs. LO FREQUENCY -70 1.9 2.1 LO FREQUENCY (GHz) www.maximintegrated.com 2.3 -50 -70 PLO = 0dBm 1.7 TC = -40°C, +85°C -30 2.5 -90 1.7 1.9 2.1 LO FREQUENCY (GHz) 2.3 -30 VCC = 4.75V, 5.0V -50 -70 TC = +25°C 1.5 2.5 BASEBAND INPUTS TERMINATED IN 50Ω -10 LO LEAKAGE (dBm) LO LEAKAGE (dBm) -50 BASEBAND INPUTS TERMINATED IN 50Ω -10 -10 OUTPUT POWER vs. LO FREQUENCY LO FREQUENCY (GHz) PLO = -3dBm, +3dBm 1.5 -40 LO FREQUENCY (GHz) -30 -90 VI = VQ = 0.611VP-P DIFFERENTIAL -4 -8 2.5 BASEBAND INPUTS TERMINATED IN 50Ω -10 -50 OUTPUT POWER (dBm) MAX2022 toc08 1.5 0 OUTPUT POWER vs. LO FREQUENCY -7 MAX2022 toc07 -8 -10 -3 OUTPUT POWER (dBm) -3 -5 -20 FOUR CARRIER OUTPUT POWER (dBm) OUTPUT POWER (dBm) -20 -76 MAX2022 toc05 -30 MAX2022 toc04 -2 OUTPUT POWER (dBm) -72 -76 -40 ALTERNATE CHANNEL -70 -76 OUTPUT POWER (dBm) LO LEAKAGE (dBm) -68 MAX2022 toc06 -72 -74 -64 MAX2022 toc09 ACLR (dB) -70 ADJACENT CHANNEL -62 -66 -68 MAX2022 toc03 -64 ADJACENT CHANNEL -66 TWO CARRIER -62 ACLR vs. OUTPUT POWER -60 ACLR (dB) -64 ACLR (dB) MAX2022 toc01 SINGLE CARRIER -62 ACLR vs. OUTPUT POWER -60 MAX2022 toc02 ACLR vs. OUTPUT POWER -60 VCC = 5.25V 2.5 -90 1.5 1.7 1.9 2.1 2.3 2.5 LO FREQUENCY (GHz) Maxim Integrated │ 6 MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator Typical Operating Characteristics (continued) (MAX2022 Typical Application Circuit, 50Ω LO input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, VCC = 5V, PLO = 0dBm, fLO = 2140MHz, VI = VQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100Ω differential DC-coupled source, common-mode input from 0V, TC = +25°C, unless otherwise noted.) MODULATOR 30 20 10 1.5 1.9 2.1 2.3 30 20 PLO = +3dBm 0 2.5 MAX2022 toc12 VCC = 4.75, 5.0V, 5.25V 30 20 10 1.5 1.7 1.9 2.1 2.3 0 2.5 1.5 1.7 1.9 2.1 2.3 OUTPUT NOISE vs. OUTPUT POWER IF FLATNESS vs. BASEBAND FREQUENCY TC = +85°C -170 -164 -180 -180 -15 -10 -5 0 5 10 TC = +25°C -172 -176 -20 TC = +85°C -168 -14 AMX2022 toc14 -160 -175 -15 -16 fLO - fIQ -17 -18 -19 -20 fLO + fIQ -21 -22 -23 TC = -40°C -25 -20 -15 -10 -5 0 5 -24 10 fLO = 1960MHz, PBB = -12dBm/PORT INTO 50Ω 0 20 40 60 80 100 BASEBAND DIFFERENTIAL INPUT RESISTANCE vs. BASEBAND FREQUENCY BASEBAND DIFFERENTIAL INPUT RESISTANCE vs. BASEBAND FREQUENCY -15 -16 -17 fLO - fIQ -18 -19 -20 -21 fLO + fIQ -22 fLO = 2140MHz, PBB = -12dBm/PORT INTO 50Ω 20 40 60 80 BASEBAND FREQUENCY (MHz) www.maximintegrated.com 100 45.0 44.5 VCC = 4.75V 44.0 43.5 43.0 42.5 VCC = 5.25V VCC = 5.0V 42.0 41.5 41.0 fLO = 2GHz, PLO = 0dBm 0 20 40 60 80 BASEBAND FREQUENCY (MHz) 100 44.5 MAX2022 toc18 IF FLATNESS vs. BASEBAND FREQUENCY BASEBAND DIFFERENTIAL INPUT RESISTANCE (Ω) BASEBAND FREQUENCY (MHz) MAX2022 toc17 OUTPUT POWER (dBm) MAX2022 toc16 OUTPUT POWER (dBm) BASEBAND DIFFERENTIAL INPUT RESISTANCE (Ω) -25 PLO = 0dBm, fLO = 2140MHz IF POWER (dBm) TC = +25°C -165 -156 2.5 MAX2022 toc15 OUTPUT NOISE vs. OUTPUT POWER -160 0 40 LO FREQUENCY (GHz) TC = -40°C -23 fBB = 1MHz, VI = VQ = 112mVP-P 50 LO FREQUENCY (GHz) PLO = 0dBm, fLO = 1960MHz -14 IF POWER (dBm) PLO = 0dBm IMAGE REJECTION vs. LO FREQUENCY LO FREQUENCY (GHz) -155 OUTPUT NOISE (dBm/Hz) 1.7 OUTPUT NOISE (dBm/Hz) -150 -24 PLO = -3dBm 40 60 10 AMX2022 toc13 0 fBB = 1MHz, VI = VQ = 112mVP-P 50 IMAGE REJECTION (dB) IMAGE REJECTION (dB) TC = -40°C, +25°C, +85°C IMAGE REJECTION vs. LO FREQUENCY IMAGE REJECTION (dB) fBB = 1MHz, VI = VQ = 112mVP-P 50 40 60 MAX2022 toc11 IMAGE REJECTION vs. LO FREQUENCY MAX2022 toc10 60 44.0 PLO = +3dBm 43.5 43.0 42.5 PLO = 0dBm PLO = -3dBm fLO = 2GHz, VCC = 5.0V 0 20 40 60 80 100 BASEBAND FREQUENCY (MHz) Maxim Integrated │ 7 MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator Typical Operating Characteristics (continued) (MAX2022 Typical Application Circuit, 50Ω LO input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, VCC = 5V, PLO = 0dBm, fLO = 2140MHz, VI = VQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100Ω differential DC-coupled source, common-mode input from 0V, TC = +25°C, unless otherwise noted.) MODULATOR VCC = 4.75V 5 1.9 2.1 2.3 0 2.5 2.1 2.3 0 2.5 1.5 1.7 1.9 2.1 OUTPUT IP3 vs. COMMON-MODE BASEBAND VOLTAGE OUTPUT IP2 vs. LO FREQUENCY OUTPUT IP2 vs. LO FREQUENCY 70 TC = +25°C 60 TC = +85°C 50 OIP2 (dBm) fLO = 2140MHz 40 -1 0 1 2 30 0 3 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz 1.5 1.7 1.9 2.1 2.3 OUTPUT IP2 vs. COMMON-MODE BASEBAND VOLTAGE MAX2022 toc25 OIP2 (dBm) 40 PLO = 0dBm PLO = -3dBm 30 fLO = 1960MHz 50 50 fLO = 2140MHz 40 30 20 20 10 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz 10 1.5 1.7 1.9 2.1 LO FREQUENCY (GHz) www.maximintegrated.com 2.3 2.5 0 -2 -1 0 1 1.5 1.7 1.9 2.1 2.3 2.5 0 -20 2 COMMMON-MODE BASEBAND VOLTAGE (V) LO LEAKAGE vs. LO FREQUENCY NULLED AT fLO = 1960MHz AT PRF = -18dBm -40 -60 -80 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz -3 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz LO FREQUENCY (GHz) LO LEAKAGE (dBm) PLO = +3dBm 30 0 2.5 OUTPUT IP2 vs. LO FREQUENCY 60 VCC = 5.25V 10 LO FREQUENCY (GHz) 60 40 20 COMMMON-MODE BASEBAND VOLTAGE (V) 70 2.5 50 TC = -40°C 10 -2 2.3 VCC = 4.75V, 5.0V 60 20 fLO = 1960MHz 10 -3 70 OIP2 (dBm) VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz 20 OIP2 (dBm) 1.9 LO FREQUENCY (GHz) 30 0 1.7 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz LO FREQUENCY (GHz) 40 0 1.5 10 LO FREQUENCY (GHz) 50 OIP3 (dBm) 1.7 15 5 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz MAX2022 toc23 60 5 VBB = 0.61VP-P DIFFERENTIAL PER TONE, fBB1 = 1.8MHz, fBB2 = 1.9MHz 1.5 10 MAX2022 toc26 0 15 PLO = -3dBm PLO = 0dBm, +3dBm MAX2022 toc27 OIP3 (dBm) 10 MAX2022 toc22 OIP3 (dBm) 15 VCC = 5.0V, 5.25V 20 MAX2022 toc21 20 TC = -40°C, +25°C, +85°C 25 OIP3 (dBm) 20 OUTPUT IP3 vs. LO FREQUENCY MAX2022 toc24 25 MAX2022 toc19 25 OUTPUT IP3 vs. LO FREQUENCY MAX2022 toc20 OUTPUT IP3 vs. LO FREQUENCY 3 -100 1.945 1.950 1.955 1.960 1.965 1.970 1.975 LO FREQUENCY (GHz) Maxim Integrated │ 8 MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator Typical Operating Characteristics (continued) (MAX2022 Typical Application Circuit, 50Ω LO input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, VCC = 5V, PLO = 0dBm, fLO = 2140MHz, VI = VQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100Ω differential DC-coupled source, common-mode input from 0V, TC = +25°C, unless otherwise noted.) -76 -78 -80 NULLED AT -14dBm, -18dBm, -22dBm -82 -84 -86 fLO = 1960MHz -78 NULLED AT -14dBm, -18dBm, -22dBm -82 -84 -30 -25 -20 -15 -10 -40 -35 -30 -25 -20 -15 OUTPUT POWER PRF (dBm) OUTPUT POWER PRF (dBm) LO LEAKAGE vs. fLO WITH LO LEAKAGE NULLED AT SPECIFIC PRF LO LEAKAGE vs. DIFFERENTIAL DC OFFSET ON Q-SIDE fLO = 2140MHz, NULLED AT -10dBm PRF -40 -30 -40 -50 -60 fLO = 2140MHz fLO = 1960MHz -50 -60 2.10 2.15 2.20 -13 -12 -11 -10 2.00 2.05 -9 60 40 30 9MHz 20 10 0 -8 1.8MHz 50 fBB1 = 1.8MHz, fBB2 = 9MHz, fLO = 1960MHz, 1.8MHz BASEBAND TONE NULLED AT PRF = -20dBm -30 -25 -20 -15 SIDEBAND SUPRESSION vs. PRF RF PORT MATCH vs. LO FREQUENCY LO PORT MATCH vs. LO FREQUENCY 1.8MHz 30 20 fBB1 = 1.8MHz, fBB2 = 9MHz, fLO = 2140MHz, 1.8MHz BASEBAND TONE NULLED AT PRF = -20dBm -25 -20 -15 MODULATOR POUT (dBm) www.maximintegrated.com -5 -10 -5 LO PORT MATCH (dB) RF PORT MATCH (dB) 9MHz 0 VCC = 4.75V, 5.0V, 5.25V -15 -10 MAX2022 toc36 0 2.10 SIDEBAND SUPRESSION vs. PRF MODULATOR POUT (dBm) 40 -30 -14 1.95 DC DIFFERENTIAL OFFSET ON Q-SIDE (mV) 50 0 -15 1.90 LO FREQUENCY (GHz) 60 10 -80 2.25 MAX2022 toc34 SIDEBAND SUPPRESSION (dB) 70 2.05 MAX2022 toc35 2.00 fLO = 1960MHz, NULLED AT -10dBm PRF 1.85 70 -80 -90 -60 LO FREQUENCY (GHz) -70 -70 -50 -90 -10 PRF = -18dBm, I-SIDE NULLED LO LEAKAGE (dBm) -20 -40 -80 SIDEBAND SUPPRESSION (dB) -35 -90 -30 -70 MAX2022 toc32 -40 -10 LO LEAKAGE (dBm) NULLED AT -10dBm -80 -20 -88 MAX2022 toc31 0 -76 -10 -86 -88 -90 -74 MAX2022 toc30 -72 LO LEAKAGE (dBm) NULLED AT -10dBm 0 LO LEAKAGE vs. fLO WITH LO LEAKAGE NULLED AT SPECIFIC PRF MAX2022 toc33 -74 fLO = 2140Hz -70 LO LEAKAGE (dBm) -72 LO LEAKAGE vs. PRF WITH LO LEAKAGE NULLED AT SPECIFIC PRF MAX2022 toc29 -70 LO LEAKAGE (dBm) -68 MAX2022 toc28 -68 MODULATOR LO LEAKAGE vs. PRF WITH LO LEAKAGE NULLED AT SPECIFIC PRF VCC = 4.75V, 5.0V, 5.25V -10 -15 -20 -25 -10 -20 1.5 1.7 1.9 2.1 LO FREQUENCY (GHz) 2.3 2.5 -30 1.5 1.7 1.9 2.1 2.3 2.5 LO FREQUENCY (GHz) Maxim Integrated │ 9 MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator Typical Operating Characteristics (continued) (MAX2022 Typical Application Circuit, 50Ω LO input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, VCC = 5V, PLO = 0dBm, fLO = 2140MHz, VI = VQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100Ω differential DC-coupled source, common-mode input from 0V, TC = +25°C, unless otherwise noted.) MODULATOR PLO = -3dBm PLO = 0dBm -25 -30 -35 PLO = +3dBm 4 2 0 -2 -4 -6 6 4 2 0 -2 -4 -8 -8 -10 -10 2.1 2.3 2.5 -15 10 35 60 13 75 VCC = 5.0V 70 VCC = 4.75V 65 -40 -15 10 35 60 50 VCC = 5.25V 45 VCC = 5.0V 40 VCC = 4.75V 35 30 85 -40 -15 10 35 60 TEMPERATURE (°C) VCCLOI2 SUPPLY CURRENT vs. TEMPERATURE (TC) VCCLOQ1 SUPPLY CURRENT vs. TEMPERATURE (TC) VCCLOQ2 SUPPLY CURRENT vs. TEMPERATURE (TC) 60 55 VCC = 5.0V VCC = 4.75V 45 -15 10 35 TEMPERATURE (°C) www.maximintegrated.com 60 85 50 VCC = 5.25V 45 VCC = 5.0V 40 VCC = 4.75V 35 30 -40 -15 10 35 TEMPERATURE (°C) 60 85 70 VCCLOQ2 SUPPLY CURRENT (mA) VCC = 5.25V 65 MAX2022 toc44 TEMPERATURE (°C) MAX2022 toc43 TEMPERATURE (°C) 55 18 MAX2022 toc42 MAX2022 toc41 80 60 85 VCC = 5.25V 85 55 VCCLOI1 SUPPLY CURRENT (mA) VCC = 4.75V 90 VCCLOA SUPPLY CURRENT (mA) VCC = 5.0V -40 8 VCCLOI1 SUPPLY CURRENT vs. TEMPERATURE (TC) 260 40 3 -2 VCCLOA SUPPLY CURRENT vs. TEMPERATURE (TC) 280 50 18 TOTAL SUPPLY CURRENT vs. TEMPERATURE (TC) 300 70 13 INPUT POWER (PIN*) (dBm) VCC = 5.25V -40 8 INPUT POWER (PIN*) (dBm) 320 240 3 -2 LO FREQUENCY (GHz) MAX2022 toc40 340 1.9 TC = -40°C, +25°C, +85°C -6 TC = -40°C, +25°C, +85°C -50 1.7 PLO = 2140MHz *PIN IS THE AVAILABLE POWER FROM ONE OF THE FOUR 50Ω BASEBAND SOURCES 8 -45 1.5 OUTPUT POWER vs. INPUT POWER (PIN*) MAX2022 toc39 6 10 VCC = 5.25V 65 85 MAX2022 toc45 -20 -40 TOTAL SUPPLY CURRENT (mA) OUTPUT POWER (dBm) -15 fLO = 1960MHz *PIN IS THE AVAILABLE POWER FROM ONE OF THE FOUR 50Ω BASEBAND SOURCES 8 VCCLOQ1 SUPPLY CURRENT (mA) LO PORT MATCH (dB) -10 OUTPUT POWER vs. INPUT POWER (PIN*) OUTPUT POWER (dBm) -5 VCCLOI2 SUPPLY CURRENT (mA) 10 MAX2022 toc37 0 MAX2022 toc38 LO PORT MATCH vs. LO FREQUENCY 60 55 VCC = 5.0V VCC = 4.75V 50 45 40 -40 -15 10 35 60 85 TEMPERATURE (°C) Maxim Integrated │ 10 MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator Pin Configuration/Functional Diagram GND VCCLOQ1 GND VCCLOQ2 GND GND GND 36 35 34 33 32 31 30 29 28 1 RBIASLO1 6 N.C. 7 RBIASLO2 8 GND 9 ∑ BIAS LO1 BIAS LO2 10 11 12 27 GND 26 BBQP 25 BBQN 24 GND 23 RF 22 GND 21 BBIN 20 BBIP 19 GND EP 13 14 15 16 17 GND 5 GND GND 90° 0° VCCLOI1 4 GND LO VCCLOI1 3 GND VCCLOA GND 2 GND RBIASLO3 MAX2022 BIAS LO3 18 GND GND GND + GND TOP VIEW TQFN (6mm x 6mm) Pin Description PIN NAME 1, 5, 9–12, 14, 16–19, 22, 24, 27–30, 32, 34, 35, 36 GND 2 RBIASLO3 3 VCCLOA 4 LO 6 RBIASLO1 7 N.C. FUNCTION Ground 3rd LO Amplifier Bias. Connect a 301Ω resistor to ground. LO Input Buffer Amplifier Supply Voltage Local Oscillator Input. 50Ω input impedance. 1st LO Input Buffer Amplifier Bias. Connect a 432Ω resistor to ground. No internal connection and can be connected to ground or left open. 8 RBIASLO2 13 VCCLOI1 I-Channel 1st LO Amplifier Supply Voltage 15 VCCLOI2 I-Channel 2nd LO Amplifier Supply Voltage 20 BBIP www.maximintegrated.com 2nd LO Amplifier Bias. Connect a 562Ω resistor to ground. Baseband In-Phase Positive Input Maxim Integrated │ 11 MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator Pin Description (continued) PIN NAME 21 BBIN FUNCTION 23 RF 25 BBQN Baseband Quadrature Negative Input 26 BBQP Baseband Quadrature Positive Input 31 VCCLOQ2 Q-Channel 1st LO Amplifier Supply Voltage 33 VCCLOQ1 Q-Channel 2nd LO Amplifier Supply Voltage EP GND Baseband In-Phase Negative Input RF Port Exposed Ground Paddle. The exposed paddle MUST be soldered to the ground plane using multiple vias. Detailed Description The MAX2022 is designed for upconverting differential in-phase (I) and quadrature (Q) inputs from baseband to a 1500MHz to 3000MHz RF frequency range. The device can also be used as a demodulator, downconverting an RF input signal directly to baseband or an IF frequency. Applications include single and multicarrier 1500MHz to 3000MHz UMTS/WCDMA, LTE/TD-LTE, cdma2000, and DCS/PCS base stations. Direct conversion architectures are advantageous since they significantly reduce transmitter or receiver cost, part count, and power consumption as compared to traditional IF-based doubleconversion systems. The MAX2022 integrates internal baluns, an LO buffer, a phase splitter, two LO driver amplifiers, two matched double-balanced passive mixers, and a wideband quadrature combiner. Precision matching between the in-phase and quadrature channels, and highly linear mixers achieves excellent dynamic range, ACLR, 1dB compression point, and LO and sideband suppression, making it ideal for four-carrier WCDMA/UMTS operation. LO Input Balun, LO Buffer, and Phase Splitter The MAX2022 requires a single-ended LO input, with a nominal power of 0dBm. An internal low-loss balun at the LO input converts the single-ended LO signal to a differential signal at the LO buffer input. In addition, the internal balun matches the buffer’s input impedance to 50Ω over the entire band of operation. The output of the LO buffer goes through a phase splitter, which generates a second LO signal that is shifted by 90° with respect to the original. The 0° and 90° LO signals drive the I and Q mixers, respectively. www.maximintegrated.com LO Driver Following the phase splitter, the 0° and 90° LO signals are each amplified by a two-stage amplifier to drive the I and Q mixers. The amplifier boosts the level of the LO signals to compensate for any changes in LO drive levels. The two-stage LO amplifier allows a wide input power range for the LO drive. While a nominal LO power of 0dBm is specified, the MAX2022 can tolerate LO level swings from -3dBm to +3dBm. I/Q Modulator The MAX2022 modulator is composed of a pair of matched double-balanced passive mixers and a balun. The I and Q differential baseband inputs accept signals from DC to beyond 500MHz with differential amplitudes up to 2VP-P differential (common-mode input equals 0V). The wide input bandwidth allows for direct interface with the baseband DACs. No active buffer circuitry between the baseband DAC and the MAX2022 is required. The I and Q signals directly modulate the 0° and 90° LO signals and are upconverted to the RF frequency. The outputs of the I and Q mixers are combined through a balun to a singled-ended RF output. Applications Information LO Input Drive The LO input of the MAX2022 requires a single-ended drive at a 1500MHz to 3000MHz frequency. It is internally matched to 50Ω. An integrated balun converts the singleended input signal to a differential signal at the LO buffer differential input. An external DC-blocking capacitor is the only external part required at this interface. The LO input power should be within the -3dBm to +3dBm range. Maxim Integrated │ 12 MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator Modulator Baseband I/Q Input Drive The MAX2022 I and Q baseband inputs should be driven differentially for best performance. The baseband inputs have a 50Ω differential input impedance. The optimum source impedance for the I and Q inputs is 100Ω differential. This source impedance will achieve the optimal signal transfer to the I and Q inputs, and the optimum output RF impedance match. The MAX2022 can accept input power levels of up to +12dBm on the I and Q inputs. Operation with complex waveforms, such as CDMA or WCDMA carriers, utilize input power levels that are far lower. This lower power operation is made necessary by the high peak-to-average ratios of these complex waveforms. The peak signals must be kept below the compression level of the MAX2022. The input common-mode voltage should be confined to the -2V to +1.5V DC range. The MAX2022 is designed to interface directly with Maxim high-speed DACs. This generates an ideal total transmitter lineup, with minimal ancillary circuit elements. Such DACs include the MAX5875 series of dual DACs, and the MAX5895 dual interpolating DAC. These DACs have ground-referenced differential current outputs. Typical termination of each DAC output into a 50Ω load resistor to ground, and a 10mA nominal DC output current results in a 0.5V common-mode DC level into the modulator I/Q inputs. The nominal signal level provided by the DACs will MAX5895 DUAL 16-BIT INTERP DAC be in the -12dBm range for a single CDMA or WCDMA carrier, reducing to -18dBm per carrier for a four-carrier application. The I/Q input bandwidth is greater than 50MHz at -0.1dB response. The direct connection of the DAC to the MAX2022 insures the maximum signal fidelity, with no performance-limiting baseband amplifiers required. The DAC output can be passed through a lowpass filter to remove the image frequencies from the DAC’s output response. The MAX5895 dual interpolating DAC can be operated at interpolation rates up to x8. This has the benefit of moving the DAC image frequencies to a very high, remote frequency, easing the design of the baseband filters. The DAC’s output noise floor and interpolation filter stopband attenuation are sufficiently good to insure that the 3GPP noise floor requirement is met for large frequency offsets, 60MHz for example, with no filtering required on the RF output of the modulator. Figure 1 illustrates the ease and efficiency of interfacing the MAX2022 with a Maxim DAC, in this case the MAX5895 dual 16-bit interpolating-modulating DAC. The MAX5895 DAC has programmable gain and differential offset controls built in. These can be used to optimize the LO leakage and sideband suppression of the MAX2022 quadrature modulator. 50Ω MAX2022 RF MODULATOR BBI 50Ω FREQ 50Ω 0° LO I/Q GAIN AND OFFSET ADJUST 90° ∑ RF 50Ω FREQ 50Ω BBQ 50Ω Figure 1. MAX5895 DAC Interfaced with MAX2022 www.maximintegrated.com Maxim Integrated │ 13 MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator RF Output illustrates a complete transmitter lineup for a multicarrier WCDMA transmitter in the UMTS band. The MAX2022 utilizes an internal passive mixer architecture. This enables a very low noise floor of -173.2dBm/Hz for low-level signals, below about -20dBm output power level. For higher output level signals, the noise floor will be determined by the internal LO noise level at approximately -162dBc/Hz. The MAX5895 dual interpolating-modulating DAC is operated as a baseband signal generator. For generation of four carriers of WCDMA modulation, and digital predistortion, an input data rate of 61.44 or 122.88Mbps can be used. The DAC can then be programmed to operate in x8 or x4 interpolation mode, resulting in a 491.52Msps output sample rate. The DAC will generate four carriers of WCDMA modulation with an ACLR typically greater than 77dB under these conditions. The output power will be approximately -18dBm per carrier, with a noise floor typically less than -144dBc/Hz. The I/Q input power levels and the insertion loss of the device will determine the RF output power level. The input power is the function of the delivered input I and Q voltages to the internal 50Ω termination. For simple sinusoidal baseband signals, a level of 89mVP-P differential on the I and the Q inputs results in an input power level of -17dBm delivered to the I and Q internal 50Ω terminations. This results in a -23.5dBm RF output power. The MAX5895 DAC has built-in gain and offset fine adjustments. These are programmable by a 3-wire serial logic interface. The gain adjustment can be used to adjust the relative gains of the I and Q DAC outputs. This feature can be used to improve the native sideband suppression of the MAX2022 quadrature modulator. The gain adjustment resolution of 0.01dB allows sideband nulling down to approximately -60dB. The offset adjustment can similarly be used to adjust the offset DC output of each I and Q DAC. These offsets can then be used to improve the native LO leakage of the MAX2022. The DAC resolution of 4 LSBs will yield nulled LO leakage of typically less than -50dBc relative to four-carrier output levels. Generation of WCDMA Carriers The MAX2022 quadrature modulator makes an ideal signal source for the generation of multiple WCDMA carriers. The combination of high OIP3 and exceptionally low output noise floor gives an unprecedented output dynamic range. The output dynamic range allows the generation of four WCDMA carriers in the UMTS band with a noise floor sufficiently low to meet the 3GPP specification requirements with no additional RF filtering. This promotes an extremely simple and efficient transmitter lineup. Figure 2 MAX5895 I L-C FILTER MAX2022 RF-MODULATOR MAX2057 +12dB I I/Q GAIN AND OFFSET ADJUST ∑ TX OUTPUT Q Q SYNTH CLOCK Figure 2. Complete Transmitter Lineup for a Multicarrier WCDMA in the UMTS Band www.maximintegrated.com Maxim Integrated │ 14 MAX2022 The DAC outputs must be filtered by baseband filters to remove the image frequency signal components. The baseband signals for four-carrier operation cover DC to 10MHz. The image frequency appears at 481MHz to 491MHz. This very large frequency spread allows the use of very low-complexity lowpass filters, with excellent in-band gain and phase performance. The low DAC noise floor allows for the use of a very wideband filter, since the filter is not necessary to meet the 3GPP noise floor specification. The MAX2022 quadrature modulator then upconverts the baseband signals to the RF output frequency. The output power of the MAX2022 will be approximately -28dBm per carrier. The noise floor will be less than -169dBm/Hz, with an ACLR typically greater than 65dBc. This performance meets the 3GPP specification requirements with substantial margins. The noise floor performance will be maintained for large offset frequencies, eliminating the need for subsequent RF filtering in the transmitter lineup. The RF output from the MAX2022 is then amplified by a combination of a low-noise amplifier followed by a MAX2057 RF-VGA. This VGA can be used for lineup compensation for gain variance of transmitter and power amplifier elements. No significant degradation of the signal or noise levels will be incurred by this additional amplification. The MAX2057 will deliver an output power of -6dBm per carrier, 0dBm total at an ACLR of 65dB and noise floor of -142dBc/Hz. External Diplexer LO leakage at the RF port can be nulled to a level less than -80dBm by introducing DC offsets at the I and Q ports. However, this null at the RF port can be compromised by an improperly terminated I/Q interface. Care must be taken to match the I/Q ports to the external circuitry. Without matching, the LO’s second-order term (2fLO) it may reflect back into the modulator’s I/Q ports where it can remix with the internal LO signal to produce additional LO leakage at the RF output. This reflection effectively counteracts against the LO nulling. In addition, the LO signal reflected at the I/Q IF port produces a residual DC term that can disturb the nulling condition. www.maximintegrated.com High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator C = 2.2pF 50Ω I MAX2022 RF MODULATOR L = 11nH 50Ω C = 2.2pF LO 0° 90° ∑ RF 50Ω Q L = 11nH C = 2.2pF 50Ω Figure 3. Diplexer Network Recommended for UMTS Transmitter Applications As demonstrated in Figure 3, providing an RC termination on each of the I+, I-, Q+, Q- ports reduces the amount of LO leakage present at the RF port under varying temperature, LO frequency, and baseband termination conditions. See the Typical Operating Characteristics for details. Note that the resistor value is chosen to be 50Ω with a corner frequency 1 / (2�RC) selected to adequately filter the fLO and 2fLO leakage, yet not affecting the flatness of the baseband response at the highest baseband frequency. The common-mode fLO and 2fLO signals at I+/I- and Q+/Q- effectively see the RC networks and thus become terminated in 25Ω (R/2). The RC network provides a path for absorbing the 2fLO and fLO leakage, while the inductor provides high impedance at fLO and 2fLO to help the diplexing process. Maxim Integrated │ 15 MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator RF Demodulator The MAX2022 can also be used as an RF demodulator (see Figure 4), downconverting an RF input signal directly to baseband. The single-ended RF input accepts signals from 1500MHz to 3000MHz. The passive mixer architecture produces a conversion loss of typically 9.2dB and a noise figure of 9.4dB. The downconverter is optimized for high linearity of typically +39dBm IIP3. A wide I/Q port bandwidth allows the port to be used as an image-reject mixer for downconversion to a quadrature IF frequency. The RF and LO inputs are internally matched to 50Ω. Thus, no matching components are required, and only DC-blocking capacitors are needed for interfacing. Demodulator Output Port Considerations Much like in the modulator case, the four baseband ports require some form of DC return to establish a common mode that the on-chip circuitry drives. This is achieved by directly DC-coupling to the baseband ports (staying MAX2022 The network Ca, Ra, La, and Cb form a highpass/lowpass network to terminate the high frequencies into a load while passing the desired lower IF frequencies. Elements La, Cb, Lb, Cc, Lc, and Cd provide a possible impedance transformer. Depending on the impedance being transformed and the desired bandwidth, a fewer number of elements can be used. It is suggested that La and Cb always be used since they are part of the high-frequency diplexer. If power matching is not a concern, then this reduces the elements to just the diplexer. DIPLEXER/ DC RETURN 90 RF within the -2.5V to +1.5V common-mode range), through an inductor to ground, or through a low-value resistor to ground. Figure 6 shows a typical network that would be used to connect to each baseband port for demodulator operation. This network provides a common-mode DC return, implements a high-frequency diplexer to terminate unwanted RF terms, and also provides an impedance transformation to a possible higher impedance baseband amplifier. MATCHING ADC MATCHING ADC LO 0 DIPLEXER/ DC RETURN Figure 4. MAX2022 Demodulator Configuration I+ 3dB PAD DC BLOCK 0° MINI-CIRCUITS ZFSCJ-2-1 I- 3dB PAD DC BLOCK 180° 3dB PADS LOOK LIKE 160Ω TO GROUND AND PROVIDES THE COMMON-MODE DC RETURN FOR THE ON-CHIP CIRCUITRY. Q+ 3dB PAD DC BLOCK 0° MINI-CIRCUITS ZFSCJ-2-1 Q- 3dB PAD DC BLOCK MINI-CIRCUITS ZFSC-2-1W-S+ 0° COMBINER 90° 180° Figure 5. Demodulator Combining Diagram www.maximintegrated.com Maxim Integrated │ 16 MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator Ld Ra Ca MAX2022 I/Q OUTPUTS Rb La Lb Cb Lc Cc Cd Ce EXTERNAL STAGE Figure 6. Baseband Port Typical Filtering and DC Return Network Resistor Rb provides a DC return to set the commonmode voltage. In this case, due to the on-chip circuitry, the voltage is approximately 0V DC. It can also be used to reduce the load impedance of the next stage. Inductor Ld can provide a bit of high-frequency gain peaking for wideband IF systems. Capacitor Ce is a DC block. Typical values for Ca, Ra, La, and Cb would be 1.5pF, 50Ω, 11nH, and 4.7pF, respectively. These values can change depending on the LO, RF, and IF frequencies used. Resistor Rb is in the 50Ω to 200Ω range. The circuitry presented in Figure 6 does not allow for LO leakage at RF port nulling. Depending on the LO at RF leakage requirement, a trim voltage may need to be introduced on the baseband ports to null the LO leakage. Power Scaling with Changes to the Bias Resistors Bias currents for the LO buffers are optimized by fine tuning resistors R1, R2, and R3. Maxim recommends using ±1%-tolerance resistors; however, standard ±5% values can be used if the ±1% components are not readily available. The resistor values shown in the Typical Application Circuit were chosen to provide peak performance for the entire 1500MHz to 3000MHz band. If desired, the current can be backed off from this nominal value by choosing different values for R1, R2, and R3. Contact the factory for additional details. Layout Considerations A properly designed PCB is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin traces directly to the exposed pad under the package. The PCB exposed paddle MUST be connected to the ground plane of the PCB. It is suggested that www.maximintegrated.com multiple vias be used to connect this pad to the lowerlevel ground planes. This method provides a good RF/ thermal conduction path for the device. Solder the exposed pad on the bottom of the device package to the PCB. The MAX2022 evaluation kit can be used as a reference for board layout. Gerber files are available upon request at www.maximintegrated.com. Power-Supply Bypassing Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass all VCC pins with 22pF and 0.1µF capacitors placed as close to the pins as possible. The smallest capacitor should be placed closest to the device. To achieve optimum performance, use good voltagesupply layout techniques. The MAX2022 has several RF processing stages that use the various VCC pins, and while they have on-chip decoupling, off-chip interaction between them may degrade gain, linearity, carrier suppression, and output power-control range. Excessive coupling between stages may degrade stability. Exposed Pad RF/Thermal Considerations The EP of the MAX2022’s 36-pin thin QFN-EP package provides a low thermal-resistance path to the die. It is important that the PC board on which the IC is mounted be designed to conduct heat from this contact. In addition, the EP provides a low-inductance RF ground path for the device. The exposed paddle (EP) MUST be soldered to a ground plane on the PC board either directly or through an array of plated via holes. An array of 9 vias, in a 3 x 3 array, is suggested. Soldering the pad to ground is critical for efficient heat transfer. Use a solid ground plane wherever possible. Maxim Integrated │ 17 MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator Table 1. Component List Referring to the Typical Application Circuit COMPONENT VALUE DESCRIPTION C1, C6, C7, C10, C13 22pF 22pF ±5%, 50V C0G ceramic capacitors (0402) C2, C5, C8, C11, C12 0.1µF 0.1µF ±10%, 16V X7R ceramic capacitors (0603) C3 C9 C16 22pF 22pF ±5%, 50V C0G ceramic capacitor (0402), LO = 1500MHz to 2400MHz 6.8pF 6.8pF ±5%, 50V C0G ceramic capacitor (0402), LO = 2400MHz to 3000MHz 1.2pF 1.2pF ±0.1pF, 50V C0G ceramic capacitor (0402), RF = 1500MHz to 2400MHz 22pF 22pF ±5%, 50V C0G ceramic capacitor (0402), RF = 2400MHz to 3000MHz Short Replace with a short circuit or 0Ω resistor (0402), RF = 1500MHz to 2400MHz 0.7pF 0.7pF ±0.1pF, 50V C0G ceramic capacitor (0402), RF = 2400MHz to 3000MHz Not Used L1 Not installed for RF = 1500MHz to 2400MHz 4.7nH 4.7nH ±0.3nH inductor (0402) for RF = 2400MHz to 3000MHz R1 432Ω 432Ω ±1% resistor (0402) R2 562Ω 562Ω ±1% resistor (0402) R3 301Ω 301Ω ±1% resistor (0402) Ordering Information PART Chip Information TEMP RANGE PIN-PACKAGE MAX2022ETX+ -40°C to +85°C 36 TQFN-EP* (6mm x 6mm) MAX2022ETX+T -40°C to +85°C 36 TQFN-EP* (6mm x 6mm) +Denotes a lead(Pb)-free/RoHS-compliant package. **EP = Exposed pad. T = Tape and reel. www.maximintegrated.com Process: SiGe BiCMOS Package Information For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO. TQFN T3666+2 21-0141 90-0049 Maxim Integrated │ 18 MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator Typical Application Circuit 36 C1 22pF VCCLOA C2 0.1µF C3 LO LO GND RBIASLO1 R1 432Ω N.C. RBIASLO2 R2 562Ω GND 32 31 1 2 GND 30 GND 29 GND 28 27 MAX2022 BIAS LO3 26 3 25 90° 0° 4 24 5 22 7 21 BIAS LO2 8 20 9 VCC 19 EP 10 C5 0.1µF 11 GND 12 GND C6 22pF 13 14 GND 15 16 17 GND GND C7 22pF GND BBQP BBQN GND Q+ Q- C9 C16 RF 23 RF ∑ BIAS LO1 6 GND www.maximintegrated.com 33 34 GND VCCLOI2 VCC RBIASLO3 35 VCCLOI1 GND GND VCCLOQ2 GND GND R3 301Ω C11 0.1µF VCC C10 22pF C13 22pF VCCLOQ1 VCC C12 0.1µF L1 GND BBIN BBIP II+ GND 18 GND C8 0.1µF VCC Maxim Integrated │ 19 MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator Revision History REVISION NUMBER REVISION DATE PAGES CHANGED 0 4/05 Initial release 1 9/12 Update Benefits and Features, Ordering Info, Applications, Absolute Maximum Ratings; add new Electrical Characteristics tables, figures, and new sections. DESCRIPTION — 1–19 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com. Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. © 2012 Maxim Integrated Products, Inc. │ 20