FREQUENCY QEN62 Plastic J LEAD SMD XO – Communications Equipment Application Specification (Rev-F) Electrical Characteristics ......................................................P01 Mechanical Characteristics ...................................................P02 Ordering Information .............................................................P03 Suggested Reflow Soldering profile ......................................P03 Tape Drawing........................................................................P04 Reel Drawing ........................................................................P04 Frequency QEN62 Plastic J LEAD SMD XO – Communications Equipment Application February 06th, 2006 Specification (rev-F) Electrical Characteristics Electrical Parameters Frequency range Output logic Operating temperature range (see table 1) Storage temperature range Power supply voltage (Vcc) Frequency Stability (see note 1) Aging (First Year) Input current Minimum MHz 1 Typical Maximum Test conditions 66.667 HCMOS / TTL Output °C -10 to +70 -40 to +85 °C -55 +125 V +3.3 +5.0 ± ppm 50 ± ppm 100 Refer to Ordering Information Refer to Ordering Information Refer to Ordering Information 5 Ref at 25°C 30 10 Refer to Ordering Information mA (see table 2) Output load HCMOS load TTL load Duty cycle Rise & Fall time Start-up time Unit pF LS-TTL 15 1 % 40/60 ns 8 ns 10 From 10% Vcc to 90% Vcc From 10% Vcc to 90% Vcc Note 1: Include 25°C tolerance, operating temperature range, input voltage change (±5%), load change (±10%), first year aging, shock and vibration. Table 1 : Stability Codes ± 50ppm ± 100ppm -10 to +70°C B A - 40 to +85°C F D Table 2 : Input Current Frequency range (MHz) 1.000 to 23.99 24.00 to 49.99 50.00 to 66.667 Vcc=5V Cl=15 pF 20 mA 30 mA 40 mA Vcc=3.3V Cl=15pF 15 mA 20 mA 30 mA 1 TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost. Frequency QEN62 Plastic J LEAD SMD XO – Communications Equipment Application February 06th, 2006 Specification (rev-F) Mechanical Characteristics BOTTOM VIEW #4 SUGGESTED PAD #3 1.27 3.81 9.8 max 1.27 #1 14.0 max #2 3.0 5.8 3.0 4.7 max 0.52 1.52 7.62 5.08 #1 #2 #3 #4 Line 1 Line 2 Line 3 0.25 min Tri state function Pin #1 Output (Pin #3) Open Active “1” Active “0” High Z Pin connections Tri state Ground Output +Vcc Marking QEN62 + stability/supply voltage/output code Frequency in MHz (6 digits) Date code (YYWW)+Manugacturing code Example for QEN62AAB / 3.6864MHz Line 1 : QEN62AAB Line 2 : 3.6864 Line 3 : 0547-N 2 TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost. Frequency QEN62 Plastic J LEAD SMD XO – Communications Equipment Application February 06th, 2006 Specification (rev-F) Ordering Information Part numbering system A QEN62 A Package type Temperature Stability SMD Package QEN62 : Plastic J Lead SMD Supply Voltage A : ± 100ppm vs -10 to +70°C A : + 5.0V B : ± 50ppm vs -10 to +70°C D : +3.3V D : ± 100ppm vs -40 to +85°C F : ± 50ppm vs -40 to +85°C B 3.6864MHZ Output Nominal Frequency (MHz) A : HCMOS 15pF B : HCMOS 30pF Please enter the nominal frequency Suggested Reflow Soldering Profile 3 TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost. Frequency QEN62 Plastic J LEAD SMD XO – Communications Equipment Application February 06th, 2006 Specification (rev-F) Tape Drawing Item Code Dimension Tolerance P 12 ± 0.1 Po 4.0 ± 0.1 P1 2.0 ± 0.1 W 24.0 ± 0.3 W0 11.5 ± 0.1 A 14.65 ± 0.1 B 9.60 ± 0.1 Gap of hold down tape and carrier tape W2 1.75 ± 0.1 Diameter of sprocket hole Do ∅ 1.55 ± 0.05 Diameter of feed hole D1 ∅ 1.55 ± 0.25 K 5.60 ± 0.1 Pitch of components Pitch of sprocket hole Length from hole center to component center Width of carrier tape Width of adhesive tape Height of component hole Width of component hole Total of tape thickness Reel Drawing 25 1.5 Multiple : 1Kpcs per Reel Ø20.2 Ø13 Ø330 Ø100 Unit : mm 4 TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.