Plastic Packages for Integrated Circuits Small Outline Transistor Plastic Packages (SC70-6) 0.20 (0.008) M P6.049A VIEW C C 6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE CL INCHES e b SYMBOL 6 5 4 CL CL E1 E 1 2 3 e1 C D CL SEATING PLANE A1 -C- WITH b PLATING b1 c MAX NOTES 0.031 0.039 0.80 1.00 - 0.001 0.004 0.025 0.10 - A2 0.034 0.036 0.85 0.90 - b 0.006 0.012 0.15 0.30 - b1 0.006 0.010 0.15 0.25 - c 0.004 0.008 0.10 0.20 6 c1 0.004 0.006 0.10 0.15 6 D 0.073 0.085 1.85 2.15 3 0.084 BSC 0.045 0.053 2.1 BSC 1.15 - 1.35 3 e 0.0256 Ref 0.65 Ref - e1 0.0512 Ref 1.30 Ref - L 0.10 (0.004) C MIN A E A2 MILLIMETERS MAX A1 E1 A MIN 0.010 0.018 0.26 0.46 4 L1 0.016 Ref. 0.400 Ref. - L2 0.006 BSC 0.15 BSC - N 6 6 5 R 0.004 - 0.10 - - α 0° 8° 0° 8° - c1 Rev. 0 7/05 NOTES: 1. Dimensioning and tolerance per ASME Y14.5M-1994. BASE METAL 2. Package conforms to EIAJ SC70 and JEDEC MO203AB. 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4X θ1 4. Footlength L measured at reference to gauge plane. R1 5. “N” is the number of terminal positions. 6. These Dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. R GAUGE PLANE SEATING PLANE L C L1 4X θ1 VIEW C 1 α L2 7. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only