MT8889C Integrated DTMF Transceiver with Adaptive Micro Interface Features • • • • • • DS5433 March 2001 Ordering Information MT8889CE 20 Pin Plastic DIP MT8889CS 20 Pin SOIC MT8889CN 24 Pin SSOP -40°C to +85°C Central office quality DTMF transmitter/ receiver Low power consumption High speed adaptive micro interface Adjustable guard time Automatic tone burst mode Call progress tone detection to -30dBm The receiver section is based upon the industry standard MT8870 DTMF receiver while the transmitter utilizes a switched capacitor D/A converter for low distortion, high accuracy DTMF signalling. Internal counters provide a burst mode such that tone bursts can be transmitted with precise timing. A call progress filter can be selected allowing a microprocessor to analyze call progress tones. Applications • • • • • ISSUE 7 Credit card systems Paging systems Repeater systems/mobile radio Interconnect dialers Personal computers Description The MT8889C utilizes an adaptive micro interface, which allows the device to be connected to a number of popular microcontrollers with minimal external logic. The MT8889C is a monolithic DTMF transceiver with call progress filter. It is fabricated in CMOS technology offering low power consumption and high reliability. The MT8889C Integrated DTMF Transceiver consists of a high performance DTMF receiver with an internal gain setting amplifier and a DTMF generator, Functional Description TONE Tone Burst Gating Cct. IN+ + IN- - Row and Column Counters D/A Converters ∑ Dial Tone Filter GS OSC1 OSC2 Low Group Filter Oscillator Circuit Control Logic Bias Circuit VDD VRef VSS Status Register Control Logic High Group Filter Transmit Data Register Data Bus Buffer D0 D1 D2 D3 Interrupt Logic IRQ/CP Digital Algorithm and Code Converter Steering Logic ESt Control Register A Control Register B Receive Data Register DS/RD I/O Control CS R/W/WR RS0 St/GT Figure 1 - Functional Block Diagram 1 MT8889C 1 2 3 4 5 6 7 8 9 10 IN+ INGS VRef VSS OSC1 OSC2 TONE R/W/WR CS 20 19 18 17 16 15 14 13 12 11 IN+ INGS VRef VSS OSC1 OSC2 NC NC TONE R/W/WR CS VDD St/GT ESt D3 D2 D1 D0 IRQ/CP DS/RD RS0 20 PIN PLASTIC DIP/SOIC 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 VDD St/GT ESt D3 D2 D1 D0 NC NC IRQ/CP DS/RD RS0 24 PIN SSOP Figure 2 - Pin Connections Pin Description Pin # 2 Name Description 20 24 1 1 IN+ Non-inverting op-amp input. 2 2 IN- Inverting op-amp input. 3 3 GS Gain Select. Gives access to output of front end differential amplifier for connection of feedback resistor. 4 4 VRef Reference Voltage output (VDD/2). 5 5 VSS Ground (0V). 6 6 OSC1 DTMF clock/oscillator input. Connect a 4.7MΩ resistor to VSS if crystal oscillator is used. 7 7 OSC2 Oscillator output. A 3.579545 MHz crystal connected between OSC1 and OSC2 completes the internal oscillator circuit. Leave open circuit when OSC1 is driven externally. 8 10 TONE Output from internal DTMF transmitter. 9 11 R/W (Motorola) Read/Write or (Intel) Write microprocessor input. TTL compatible. (WR) 10 12 CS Chip Select input. This signal must be qualified externally by either address strobe (AS), valid memory address (VMA) or address latch enable (ALE) signal, see Figure 12. 11 13 RS0 Register Select input. Refer to Table 3 for bit interpretation. TTL compatible. 12 14 DS (RD) (Motorola) Data Strobe or (Intel) Read microprocessor input. Activity on this input is only required when the device is being accessed. TTL compatible. 13 15 IRQ/ Interrupt Request/Call Progress (open drain) output. In interrupt mode, this output goes CP low when a valid DTMF tone burst has been transmitted or received. In call progress mode, this pin will output a rectangular signal representative of the input signal applied at the input op-amp. The input signal must be within the bandwidth limits of the call progress filter, see Figure 8. 1417 18-21 18 22 19 23 20 24 VDD Positive power supply (5V typical). 8, 9, 16,17 NC No Connection. D0-D3 Microprocessor data bus. High impedance when CS = 1 or DS =0 (Motorola) or RD = 1 (Intel). TTL compatible. ESt Early Steering output. Presents a logic high once the digital algorithm has detected a valid tone pair (signal condition). Any momentary loss of signal condition will cause ESt to return to a logic low. St/GT Steering Input/Guard Time output (bidirectional). A voltage greater than VTSt detected at St causes the device to register the detected tone pair and update the output latch. A voltage less than VTSt frees the device to accept a new tone pair. The GT output acts to reset the external steering time-constant; its state is a function of ESt and the voltage on St. MT8889C which employs a burst counter to synthesize precise tone bursts and pauses. A call progress mode can be selected so that frequencies within the specified passband can be detected. The adaptive micro interface allows microcontrollers, such as the 68HC11, 80C51 and TMS370C50, to access the MT8889C internal registers. C1 INC2 Input Configuration IN+ R1 R4 R5 GS The input arrangement of the MT8889C provides a differential-input operational amplifier as well as a bias source (VRef), which is used to bias the inputs at VDD/2. Provision is made for connection of a feedback resistor to the op-amp output (GS) for gain adjustment. In a single-ended configuration, the input pins are connected as shown in Figure 3. Figure 4 shows the necessary connections for a differential input configuration. Separation of the low and high group tones is achieved by applying the DTMF signal to the inputs of two sixth-order switched capacitor bandpass filters, the bandwidths of which correspond to the low and high group frequencies (see Table 1). The filters also incorporate notches at 350 Hz and 440 Hz for exceptional dial tone rejection. Each filter output is followed by a single order switched capacitor filter section, which smooths the signals prior to limiting. Limiting is performed by high-gain comparators which are provided with hysteresis to prevent detection of unwanted low-level signals. The outputs of the comparators provide full rail logic swings at the frequencies of the incoming DTMF signals. IN+ IN- RIN RF GS VRef VOLTAGE GAIN (AV) = RF / RIN VRef MT8889C DIFFERENTIAL INPUT AMPLIFIER C1 = C2 = 10 nF R1 = R4 = R5 = 100 kΩ R2 = 60kΩ, R3 = 37.5 kΩ R3 = (R2R5)/(R2 + R5) VOLTAGE GAIN (AV diff) - R5/R1 INPUT IMPEDANCE (ZINdiff) = 2 R12 + (1/ωC)2 Receiver Section C R2 R3 MT8889C Figure 3 - Single-Ended Input Configuration Figure 4 - Differential Input Configuration FLOW FHIGH DIGIT D3 D2 D1 D0 697 1209 1 0 0 0 1 697 1336 2 0 0 1 0 697 1477 3 0 0 1 1 770 1209 4 0 1 0 0 770 1336 5 0 1 0 1 770 1477 6 0 1 1 0 852 1209 7 0 1 1 1 852 1336 8 1 0 0 0 852 1477 9 1 0 0 1 941 1336 0 1 0 1 0 941 1209 * 1 0 1 1 941 1477 # 1 1 0 0 697 1633 A 1 1 0 1 770 1633 B 1 1 1 0 852 1633 C 1 1 1 1 941 1633 D 0 0 0 0 0= LOGIC LOW, 1= LOGIC HIGH Table 1. Functional Encode/Decode Table 3 MT8889C Following the filter section is a decoder employing digital counting techniques to determine the frequencies of the incoming tones and to verify that they correspond to standard DTMF frequencies. A complex averaging algorithm protects against tone simulation by extraneous signals such as voice while providing tolerance to small frequency deviations and variations. This averaging algorithm has been developed to ensure an optimum combination of immunity to talk-off and tolerance to the presence of interfering frequencies (third tones) and noise. When the detector recognizes the presence of two valid tones (this is referred to as the “signal condition” in some industry specifications) the “Early Steering” (ESt) output will go to an active state. Any subsequent loss of signal condition will cause ESt to assume an inactive state. Steering Circuit Before registration of a decoded tone pair, the receiver checks for a valid signal duration (referred to as character recognition condition). This check is performed by an external RC time constant driven by ESt. A logic high on ESt causes vc (see Figure 5) to rise as the capacitor discharges. Provided that the signal condition is maintained (ESt remains high) for the validation period (tGTP), vc reaches the threshold (VTSt) of the steering logic to register the tone pair, latching its corresponding 4-bit code (see Table 1) into the Receive Data Register. At this point the GT output is activated and drives vc to VDD. GT continues to drive high as long as ESt remains high. Finally, after a short delay to allow the output latch to settle, the delayed steering output flag goes high, signalling that a received tone pair has been registered. The status of the delayed steering flag can be monitored by checking the appropriate bit in the status register. If Interrupt mode has been selected, the IRQ/CP pin will pull low when the delayed steering flag is active. The contents of the output latch are updated on an active delayed steering transition. This data is presented to the four bit bidirectional data bus when the Receive Data Register is read. The steering circuit works in reverse to validate the interdigit pause between signals. Thus, as well as rejecting signals too short to be considered valid, the receiver will tolerate signal interruptions (drop out) too short to be considered a valid pause. This facility, together with the capability of selecting the steering time constants externally, allows the designer to tailor performance to meet a wide variety of system requirements. VDD MT8889C C1 VDD Vc St/GT ESt R1 tGTA = (R1C1) In (VDD / VTSt) tGTP = (R1C1) In [VDD / (VDD-VTSt)] Figure 5 - Basic Steering Circuit Guard Time Adjustment The simple steering circuit shown in Figure 5 is adequate for most applications. Component values are chosen according to the following inequalities (see Figure 7): t REC ≥ t DPmax + t GTPmax - t DAmin t REC ≤ t DPmin + t GTPmin - t DAmax t ID ≥ t DAmax + t GTAmax - t DPmin t DO ≤ t DAmin + t GTAmin - t DPmax The value of tDP is a device parameter (see AC Electrical Characteristics) and tREC is the minimum signal duration to be recognized by the receiver. A value for C1 of 0.1 µF is recommended for most tGTP = (RPC1) In [VDD / (VDD-VTSt)] tGTA = (R1C1) In (VDD/VTSt) RP = (R1R2) / (R1 + R2) VDD C1 St/GT R1 ESt R2 a) decreasing tGTP; (tGTP < tGTA) tGTP = (R1C1) In [VDD / (VDD-VTSt)] tGTA = (RpC1) In (VDD/VTSt) RP = (R1R2) / (R1 + R2) VDD C1 St/GT R1 R2 ESt b) decreasing tGTA; (tGTP > tGTA) Figure 6 - Guard Time Adjustment 4 MT8889C applications, leaving R1 to be selected by the designer. Different steering arrangements may be used to select independent tone present (tGTP) and tone absent (tGTA) guard times. This may be necessary to meet system specifications which place both accept and reject limits on tone duration and interdigital pause. Guard time adjustment also allows the designer to tailor system parameters such as talk off and noise immunity. Increasing tREC improves talk-off performance since it reduces the probability that tones simulated by speech will maintain a valid signal condition long enough to be registered. Alternatively, a relatively short tREC with a long tDO would be appropriate for extremely noisy environments where fast acquisition time and immunity to tone drop-outs are required. Design information for guard time adjustment is shown in Figure 6. The receiver timing is shown in Figure 7 with a description of the events in Figure 9. DTMF signals cannot be detected if CP mode has been selected (see Table 7). Figure 8 indicates the useful detect bandwidth of the call progress filter. Frequencies presented to the input, which are within the ‘accept’ bandwidth limits of the filter, are hardlimited by a high gain comparator with the IRQ/CP pin serving as the output. The squarewave output obtained from the schmitt trigger can be analyzed by a microprocessor or counter arrangement to determine the nature of the call progress tone being detected. Frequencies which are in the ‘reject’ area will not be detected and consequently the IRQ/CP pin will remain low. LEVEL (dBm) -25 Call Progress Filter 0 A = Accept Figure 8 - Call Progress Response C tREC D TONE #n + 1 F TONE #n + 1 tDA tDP ESt E tDO tID TONE #n Vin 750 = May Accept B tREC 500 FREQUENCY (Hz) = Reject A call progress mode, using the MT8889C, can be selected allowing the detection of various tones, which identify the progress of a telephone call on the network. The call progress tone input and DTMF input are common, however, call progress tones can only be detected when CP mode has been selected. EVENTS 250 tGTP tGTA VTSt St/GT tPStRX RX0-RX3 DECODED TONE # (n-1) #n # (n + 1) tPStb3 b3 b2 Read Status Register IRQ/CP Figure 7 - Receiver Timing Diagram 5 MT8889C EXPLANATION OF EVENTS A) TONE BURSTS DETECTED, TONE DURATION INVALID, RX DATA REGISTER NOT UPDATED. B) TONE #n DETECTED, TONE DURATION VALID, TONE DECODED AND LATCHED IN RX DATA REGISTER. C) END OF TONE #n DETECTED, TONE ABSENT DURATION VALID, INFORMATION IN RX DATA REGISTER RETAINED UNTIL NEXT VALID TONE PAIR. D) TONE #n+1 DETECTED, TONE DURATION VALID, TONE DECODED AND LATCHED IN RX DATA REGISTER. E) ACCEPTABLE DROPOUT OF TONE #n+1, TONE ABSENT DURATION INVALID, DATA REMAINS UNCHANGED. F) END OF TONE #n+1 DETECTED, TONE ABSENT DURATION VALID, INFORMATION IN RX DATA REGISTER RETAINED UNTIL NEXT VALID TONE PAIR. EXPLANATION OF SYMBOLS Vin DTMF COMPOSITE INPUT SIGNAL. ESt EARLY STEERING OUTPUT. INDICATES DETECTION OF VALID TONE FREQUENCIES. St/GT STEERING INPUT/GUARD TIME OUTPUT. DRIVES EXTERNAL RC TIMING CIRCUIT. 4-BIT DECODED DATA IN RECEIVE DATA REGISTER RX 0-RX 3 b3 DELAYED STEERING. INDICATES THAT VALID FREQUENCIES HAVE BEEN PRESENT/ABSENT FOR THE REQUIRED GUARD TIME THUS CONSTITUTING A VALID SIGNAL. ACTIVE LOW FOR THE DURATION OF A VALID DTMF SIGNAL. b2 INDICATES THAT VALID DATA IS IN THE RECEIVE DATA REGISTER. THE BIT IS CLEARED AFTER THE STATUS REGISTER IS READ. INTERRUPT IS ACTIVE INDICATING THAT NEW DATA IS IN THE RX DATA REGISTER. THE INTERRUPT IS IRQ/CP CLEARED AFTER THE STATUS REGISTER IS READ. tREC MAXIMUM DTMF SIGNAL DURATION NOT DETECTED AS VALID. tREC MINIMUM DTMF SIGNAL DURATION REQUIRED FOR VALID RECOGNITION. tID MINIMUM TIME BETWEEN VALID SEQUENTIAL DTMF SIGNALS. MAXIMUM ALLOWABLE DROPOUT DURING VALID DTMF SIGNAL. tDO tDP TIME TO DETECT VALID FREQUENCIES PRESENT. tDA TIME TO DETECT VALID FREQUENCIES ABSENT. tGTP GUARD TIME, TONE PRESENT. tGTA GUARD TIME, TONE ABSENT. Figure 9 - Description of Timing Events DTMF Generator The DTMF transmitter employed in the MT8889C is capable of generating all sixteen standard DTMF tone pairs with low distortion and high accuracy. All frequencies are derived from an external 3.579545 MHz crystal. The sinusoidal waveforms for the individual tones are digitally synthesized using row and column programmable dividers and switched capacitor D/A converters. The row and column tones are mixed and filtered providing a DTMF signal with low total harmonic distortion and high accuracy. To specify a DTMF signal, data conforming to the encoding format shown in Table 1 must be written to the transmit Data Register. Note that this is the same as the receiver output code. The individual tones which are generated (fLOW and fHIGH) are referred to as Low Group and High Group tones. As seen from the table, the low group frequencies are 697, 770, 852 and 941 Hz. The high group frequencies are 1209, 1336, 1477 and 1633 Hz. Typically, the high group to low group amplitude ratio (twist) is 2 dB to com-pensate for high group attenuation on long loops. The period of each tone consists of 32 equal time segments. The period of a tone is controlled by varying the length of these time segments. During 6 write operations to the Transmit Data Register the 4 bit data on the bus is latched and converted to 2 of 8 coding for use by the programmable divider circuitry. This code is used to specify a time segment length, which will ultimately determine the frequency of the tone. When the divider reaches the appropriate count, as determined by the input code, a reset pulse is issued and the counter starts again. The number of time segments is fixed at 32, however, by varying the segment length as described above the frequency can also be varied. The divider output clocks another counter, which addresses the sinewave lookup ROM. The lookup table contains codes which are used by the switched capacitor D/A converter to obtain discrete and highly accurate DC voltage levels. Two identical circuits are employed to produce row and column tones, which are then mixed using a low noise summing amplifier. The oscillator described needs no “start-up” time as in other DTMF generators since the crystal oscillator is running continuously thus providing a high degree of tone burst accuracy. A bandwidth limiting filter is incorporated and serves to attenuate distortion products above 8 kHz. It can be seen from Figure 6 that the distortion products are very low in amplitude. MT8889C Scaling Information 10 dB/Div Start Frequency = 0 Hz Stop Frequency = 3400 Hz Marker Frequency = 697 Hz and 1209 Hz Figure 10 - Spectrum Plot Burst Mode ACTIVE INPUT In certain telephony applications it is required that DTMF signals being generated are of a specific duration determined either by the particular application or by any one of the exchange transmitter specifications currently existing. Standard DTMF signal timing can be accomplished by making use of the Burst Mode. The transmitter is capable of issuing symmetric bursts/pauses of predetermined duration. This burst/pause duration is 51 ms±1 ms which is a standard interval for autodialer and central office applications. After the burst/pause has been issued, the appropriate bit is set in the Status Register indicating that the transmitter is ready for more data. The timing described above is available when DTMF mode has been selected. However, when CP mode (Call Progress mode) is selected, the burst/pause duration is doubled to 102 ms ±2 ms. Note that when CP mode and Burst mode have been selected, DTMF tones may be transmitted only and not received. In applications where a non-standard burst/pause time is desirable, a software timing loop or external timer can be used to provide the timing pulses when the burst mode is disabled by enabling and disabling the transmitter. Single Tone Generation A single tone mode is available whereby individual tones from the low group or high group can be generated. This mode can be used for DTMF test equipment applications, acknowledgment tone generation and distortion measurements. Refer to Control Register B description for details. OUTPUT FREQUENCY (Hz) %ERROR SPECIFIED ACTUAL L1 697 699.1 +0.30 L2 770 766.2 -0.49 L3 852 847.4 -0.54 L4 941 948.0 +0.74 H1 1209 1215.9 +0.57 H2 1336 1331.7 -0.32 H3 1477 1471.9 -0.35 1633 1645.0 +0.73 Table 2. Actual Frequencies Versus Standard Requirements H4 Distortion Calculations The MT8889C is capable of producing precise tone bursts with minimal error in frequency (see Table 2). The internal summing amplifier is followed by a firstorder lowpass switched capacitor filter to minimize harmonic components and intermodulation products. The total harmonic distortion for a single tone can be calculated using Equation 1, which is the ratio of the total power of all the extraneous frequencies to the power of the fundamental frequency expressed as a percentage. V22f + V23f + V24f + .... V2nf THD (%) = 100 Vfundamental Equation 1. THD (%) For a Single Tone 7 MT8889C The Fourier components of the tone output correspond to V2f.... Vnf as measured on the output waveform. The total harmonic distortion for a dual tone can be calculated using Equation 2. VL and VH correspond to the low group amplitude and high group amplitude, respectively and V2IMD is the sum of all the intermodulation components. The internal switched-capacitor filter following the D/A converter keeps distortion products down to a very low level as shown in Figure 10. V22L + V23L + .... V2nL + V22H + kinds of microprocessors. Key functions of this interface include the following: • • • • V23H + .. V2nH + V2IMD • THD (%) = 100 V2L + V2H Equation 2. THD (%) For a Dual Tone DTMF Clock Circuit The internal clock circuit is completed with the addition of a standard television colour burst crystal. The crystal specification is as follows: Frequency: 3.579545 MHz Frequency Tolerance: ±0.1% Resonance Mode: Parallel Load Capacitance: 18pF Maximum Series Resistance:150 ohms Maximum Drive Level: 2mW e.g. CTS Knights MP036S Toyocom TQC-203-A-9S A number of MT8889C devices can be connected as shown in Figure 11 such that only one crystal is required. Alternatively, the OSC1 inputs on all devices can be driven from a TTL buffer with the OSC2 outputs left unconnected. MT8889C MT8889C MT8889C OSC1 OSC2 OSC1 OSC2 OSC1 OSC2 3.579545 MHz Continuous activity on DS/RD is not necessary to update the internal status registers. senses whether input timing is that of an Intel or Motorola controller by monitoring the DS (RD), R/W (WR) and CS inputs. generates equivalent CS signal for internal operation for all processors. differentiates between multiplexed and nonmultiplexed microprocessor buses. Address and data are latched in accordingly. compatible with Motorola and Intel processors. Figure 17 shows the timing diagram for Motorola microprocessors with separate address and data buses. Members of this microprocessor family include 2 MHz versions of the MC6800, MC6802 and MC6809. For the MC6809, the chip select (CS) input signal is formed by NANDing the (E+Q) clocks and address decode output. For the MC6800 and MC6802, CS is formed by NANDing VMA and address decode output. On the falling edge of CS, the internal logic senses the state of data strobe (DS). When DS is low, Motorola processor operation is selected. Figure 18 shows the timing diagram for the Motorola MC68HC11 (1 MHz) microcontroller. The chip select (CS) input is formed by NANDing address strobe (AS) and address decode output. Again, the MT8889C examines the state of DS on the falling edge of CS to determine if the micro has a Motorola bus (when DS is low). Additionally, the Texas Instruments TMS370CX5X is qualified to have a Motorola interface. Figure 12(a) summarizes connection of these Motorola processors to the MT8889C DTMF transceiver. Figures 19 and 20 are the timing diagrams for the Intel 8031/8051 (12 MHz) and 8085 (5 MHz) microcontrollers with multiplexed address and data buses. The MT8889C latches in the state of RD on the falling edge of CS. When RD is high, Intel processor operation is selected. By NANDing the address latch enable (ALE) output with the high-byte address (P2) decode output, CS can be generated. Figure 12(b) summarizes the connection of these Intel processors to the MT8889C transceiver. Figure 11 - Common Crystal Connection Microprocessor Interface The MT8889C design incorporates an adaptive interface, which allows it to be connected to various 8 NOTE: The adaptive micro interface relies on highto-low transition on CS to recognize the microcontroller interface and this pin must not be tied permanently low. MT8889C The adaptive micro interface provides access to five internal registers. The read-only Receive Data Register contains the decoded output of the last valid DTMF digit received. Data entered into the write-only Transmit Data Register will determine which tone pair is to be generated (see Table 1 for coding details). Transceiver control is accomplished with two control registers (see Tables 6 and 7), CRA and CRB, which have the same address. A write operation to CRB is executed by first setting the most significant bit (b3) in CRA. The following write operation to the same address will then be directed to CRB, and subsequent write cycles will be directed back to CRA. The read-only status register indicates the current transceiver state (see Table 8). A software reset must be included at the beginning of all programs to initialize the control registers upon power-up or power reset (see Figure 15). Refer to Tables 4-7 for bit descriptions of the two control registers. The multiplexed IRQ/CP pin can be programmed to generate an interrupt upon validation of DTMF signals or when the transmitter is ready for more data (burst mode only). Alternatively, this pin can be configured to provide a square-wave output of the call progress signal. The IRQ/CP pin is an open drain output and requires an external pull-up resistor (see Figure 13). MC6800/6802 MT8889 A0-A15 CS RS0 VMA D0-D3 D0-D3 RW Φ2 Motorola Intel RS0 R/W WR RD FUNCTION 0 0 0 1 Write to Transmit Data Register 0 1 1 0 Read from Receive Data Register 1 0 0 1 Write to Control Register 1 1 1 0 Read from Status Register Table 3. Internal Register Functions b3 b2 b1 b0 RSEL IRQ CP/DTMF TOUT Table 4. CRA Bit Positions b3 b2 b1 b0 C/R S/D TEST BURST ENABLE Table 5. CRB Bit Positions MT8889C MC68HC11 CS A8-A15 D0-D3 AS AD0-AD3 RS0 R/W/WR DS DS/RD DS/RD RW R/W/WR (a) MC6809 MT8889 A0-A15 Q E D0-D3 R/W CS 8031/8051 8080/8085 MT8889C A8-A15 CS RS0 D0-D3 ALE D0-D3 R/W/WR DS/RD RS0 P0 RD DS/RD R/W/WR WR (b) Figure 12 a) & b) - MT8889 Interface Connections for Various Intel and Motorola Micros 9 MT8889C BIT NAME DESCRIPTION b0 TOUT Tone Output Control. A logic high enables the tone output; a logic low turns the tone output off. This bit controls all transmit tone functions. b1 CP/DTMF Call Progress or DTMF Mode Select. A logic high enables the receive call progress mode; a logic low enables DTMF mode. In DTMF mode the device is capable of receiving and transmitting DTMF signals. In CP mode a retangular wave representation of the received tone signal will be present on the IRQ/CP output pin if IRQ has been enabled (control register A, b2=1). In order to be detected, CP signals must be within the bandwidth specified in the AC Electrical Characteristics for Call Progress. Note: DTMF signals cannot be detected when CP mode is selected. b2 IRQ Interrupt Enable. A logic high enables the interrupt function; a logic low de-activates the interrupt function. When IRQ is enabled and DTMF mode is selected (control register A, b1=0), the IRQ/CP output pin will go low when either 1) a valid DTMF signal has been received for a valid guard time duration, or 2) the transmitter is ready for more data (burst mode only). b3 RSEL Register Select. A logic high selects control register B for the next write cycle to the control register address. After writing to control register B, the following control register write cycle will be directed to control register A. Table 6. Control Register A Description BIT NAME DESCRIPTION b0 BURST Burst Mode Select. A logic high de-activates burst mode; a logic low enables burst mode. When activated, the digital code representing a DTMF signal (see Table 1) can be written to the transmit register, which will result in a transmit DTMF tone burst and pause of equal durations (typically 51 msec). Following the pause, the status register will be updated (b1 Transmit Data Register Empty), and an interrupt will occur if the interrupt mode has been enabled. When CP mode (control register A, b1) is enabled the normal tone burst and pause durations are extended from a typical duration of 51 msec to 102 msec. When BURST is high (de-activated) the transmit tone burst duration is determined by the TOUT bit (control register A, b0). 10 b1 TEST Test Mode Control. A logic high enables the test mode; a logic low de-activates the test mode. When TEST is enabled and DTMF mode is selected (control register A, b1=0), the signal present on the IRQ/CP pin will be analogous to the state of the DELAYED STEERING bit of the status register (see Figure 7, signal b3). b2 S/D Single or Dual Tone Generation. A logic high selects the single tone output; a logic low selects the dual tone (DTMF) output. The single tone generation function requires further selection of either the row or column tones (low or high group) through the C/R bit (control register B, b3). b3 C/R Column or Row Tone Select. A logic high selects a column tone output; a logic low selects a row tone output. This function is used in conjunction with the S/D bit (control register B, b2). Table 7. Control Register B Description MT8889C BIT NAME b0 IRQ STATUS FLAG SET STATUS FLAG CLEARED Interrupt has occurred. Bit one (b1) or bit two (b2) is set. Interrupt is inactive. Cleared after Status Register is read. b1 TRANSMIT DATA REGISTER EMPTY (BURST MODE ONLY) Pause duration has terminated and transmitter is ready for new data. Cleared after Status Register is read or when in non-burst mode. b2 RECEIVE DATA REGISTER FULL Valid data is in the Receive Data Register. Cleared after Status Register is read. b3 DELAYED STEERING Set upon the valid detection of the absence of a DTMF signal. Cleared upon the detection of a valid DTMF signal. Table 8. Status Register Description VDD MT8880C C1 R1 DTMF/CP INPUT R2 IN+ IN- St/GT GS ESt DTMF OUTPUT C4 RL D3 VSS D2 OSC1 D1 OSC2 D0 TONE IRQ/CP R/W/WR CS Notes: R1, R2 = 100 kΩ 1% R3 = 374 kΩ 1% R4 = 3.3 kΩ 10% R5 = 4.7 MΩ 10% RL = 10 k Ω (min.) C1 = 100 nF 5% C2 = 100 nF 5% C3 = 100 nF 10%* C4 = 10 nF 10% X-tal = 3.579545 MHz C2 R4 VRef R5 X-tal C3 VDD R3 To µP or µC DS/RD RS0 * Microprocessor based systems can inject undesirable noise into the supply rails. The performance of the MT8889C can be optimized by keeping noise on the supply rails to a minimum. The decoupling capacitor (C3) should be connected close to the device and ground loops should be avoided. Figure 13 - Application Circuit (Single-Ended Input) 11 MT8889C 5.0 VDC TEST POINT 130 pF MMD6150 (or equivalent) 5.0 VDC 2.4 kΩ 3 kΩ TEST POINT 24 kΩ 100 pF MMD7000 (or equivalent) Test load for D0-D3 pins Test load for IRQ/CP pin Figure 14 - Test Circuits INITIALIZATION PROCEDURE A software reset must be included at the beginning of all programs to initialize the control registers after power up. The initialization procedure should be implemented 100ms after power up. Description: Motorola Intel Data RS0 R/W WR RD b3 b2 b1 b0 1) Read Status Register 1 1 1 0 X X X X 2) Write to Control Register 1 0 0 1 0 0 0 0 3) Write to Control Register 1 0 0 1 0 0 0 0 4) Write to Control Register 1 0 0 1 1 0 0 0 5) Write to Control Register 1 0 0 1 0 0 0 0 6) Read Status Register 1 1 1 0 X X X X TYPICAL CONTROL SEQUENCE FOR BURST MODE APPLICATIONS Transmit DTMF tones of 50 ms burst/50 ms pause and Receive DTMF Tones. Sequence: RS0 1) Write to Control Register A 1 (tone out, DTMF, IRQ, Select Control Register B) 2) Write to Control Register B 1 (burst mode) 3) Write to Transmit Data Register 0 (send a digit 7) 4) Wait for an Interrupt or Poll Status Register 5) Read the Status Register 1 R/W 0 WR RD 0 1 b3 1 b2 1 b1 0 b0 1 0 0 1 0 0 0 0 0 0 1 0 1 1 1 1 1 0 X X X X -if bit 1 is set, the Tx is ready for the next tone, in which case ... Write to Transmit Register 0 0 0 (send a digit 5) 1 0 1 0 1 -if bit 2 is set, a DTMF tone has been received, in which case .... Read the Receive Data Register 0 1 1 0 X X X X -if both bits are set ... Read the Receive Data Register Write to Transmit Data Register 0 1 X 0 X 1 X 0 X 1 0 0 1 0 1 0 NOTE: IN THE TX BURST MODE, STATUS REGISTER BIT 1 WILL NOT BE SET UNTIL 100 ms ( ±2 ms) AFTER THE DATA IS WRITTEN TO THE TX DATA REGISTER. IN EXTENDED BURST MODE THIS TIME WILL BE DOUBLED TO 200 ms (± 4 ms) Figure 15 - Application Notes 12 MT8889C Absolute Maximum Ratings* Parameter Symbol 1 Power supply voltage VDD-VSS 2 Voltage on any pin 3 Current at any pin (Except VDD and VSS) 4 Storage temperature TST 5 Package power dissipation PD Min Max Units 6 V VDD+0.3 V 10 mA +150 °C 1000 mW VDD VI VSS-0.3 -65 * Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied. Recommended Operating Conditions - Voltages are with respect to ground (VSS) unless otherwise stated. Parameter Sym Min Typ‡ Max Units 5.00 5.25 V +85 °C 1 Positive power supply VDD 4.75 2 Operating temperature TO -40 Test Conditions 3 Crystal clock frequency fCLK 3.575965 3.579545 3.583124 MHz ‡ Typical figures are at 25 °C and for design aid only: not guaranteed and not subject to production testing. DC Electrical Characteristics† - Sym Min Typ‡ Max Units Operating supply voltage VDD 4.75 5.0 5.25 V Operating supply current IDD 7.0 11 mA Power consumption PC 57.8 mW Characteristics 1 2 3 4 5 6 S U P I N P U T S 7 8 9 10 O U T P U T S 13 14 15 16 17 18 19 High level input voltage (OSC1) VIHO Low level input voltage (OSC1) VILO Steering threshold voltage VTSt Low level output voltage (OSC2) VOLO High level output voltage (OSC2) VOHO 3.5 2.2 IOZ VRef output voltage VRef VRef output resistance ROR Low level input voltage VIL High level input voltage VIH Input leakage current IIZ Source current IOH -1.4 Sink current IOL ESt and St/GT Source current IRQ/ CP D i g i t a l Data Bus 2.3 2.4 Test Conditions V Note 9* 1.5 V Note 9* 2.5 V VDD=5V 0.1 V No load Note 9* V No load Note 9* 4.9 Output leakage current (IRQ) 11 12 VSS=0 V. 1 10 µA VOH=2.4 V 2.5 2.6 V No load, VDD=5V 1.3 kΩ 0.8 2.0 V V µA VIN=VSS to VDD -6.6 mA VOH=2.4V 2.0 4.0 mA VOL=0.4V IOH -0.5 -3.0 mA VOH=4.6V Sink current IOL 2 4 mA VOL=0.4V Sink current IOL 4 16 mA VOL=0.4V 10 † Characteristics are over recommended operating conditions unless otherwise stated. ‡ Typical figures are at 25 °C, VDD =5V and for design aid only: not guaranteed and not subject to production testing. * See “Notes” following AC Electrical Characteristics Tables. 13 MT8889C Electrical Characteristics Gain Setting Amplifier - Voltages are with respect to ground (VSS) unless otherwise stated, VSS= 0V. Characteristics Sym Min Typ Max Units Test Conditions 100 nA VSS ≤ VIN ≤ VDD 1 Input leakage current IIN 2 Input resistance RIN 3 Input offset voltage VOS 4 Power supply rejection PSRR 50 dB 5 Common mode rejection CMRR 40 dB 6 DC open loop voltage gain AVOL 40 dB CL = 20p 7 Unity gain bandwidth BW 1.0 MHz CL = 20p 8 Output voltage swing VO 0.5 VDD-0.5 V RL ≥ 100 kΩ to VSS 9 Allowable capacitive load (GS) CL 100 pF PM>40° kΩ VO = 4Vpp V RL = 50kΩ 10 Allowable resistive load (GS) RL 10 MΩ 25 mV 50 11 Common mode range VCM 1.0 VDD-1.0 Figures are for design aid only: not guaranteed and not subject to production testing. Characteristics are over recommended operating conditions unless otherwise stated. 1 kHz MT8889C AC Electrical Characteristics† - Voltages are with respect to ground (VSS) unless otherwise stated. Characteristics 1 R X Sym Valid input signal levels (each tone of composite signal) Min Typ‡ Max Units Notes* -29 +1 dBm 1,2,3,5,6 27.5 869 mVRMS 1,2,3,5,6 † Characteristics are over recommended operating conditions (unless otherwise stated) using the test circuit shown in Figure 13. AC Electrical Characteristics† - Voltages are with respect to ground (VSS) unless otherwise stated. Characteristics Sym Min Typ‡ Max Units fC=3.579545 MHz Notes* 1 Positive twist accept 8 dB 2,3,6,9 2 Negative twist accept 8 dB 2,3,6,9 3 4 Freq. deviation accept R X Freq. deviation reject ±1.5%± 2Hz 2,3,5 ±3.5% 2,3,5 5 Third tone tolerance -16 dB 2,3,4,5,9,10 6 Noise tolerance -12 dB 2,3,4,5,7,9,10 7 Dial tone tolerance 22 dB 2,3,4,5,8,9 † Characteristics are over recommended operating conditions unless otherwise stated. ‡ Typical figures are at 25°C, VDD = 5V, and for design aid only: not guaranteed and not subject to production testing. * *See “Notes” following AC Electrical Characteristics Tables. 14 MT8889C AC Electrical Characteristics†- Call Progress - Voltages are with respect to ground (VSS), unless otherwise stated. Characteristics Sym Min 310 Typ‡ Max Units Conditions 500 Hz @ -25 dBm, Note 9 1 Accept Bandwidth fA 2 Lower freq. (REJECT) fLR 290 Hz @ -25 dBm 3 Upper freq. (REJECT) fHR 540 Hz @ -25 dBm 4 Call progress tone detect level (total power) -30 dBm † Characteristics are over recommended operating conditions unless otherwise stated ‡ Typical figures are at 25°C, VDD=5V, and for design aid only: not guaranteed and not subject to production testing AC Electrical Characteristics†- DTMF Reception - Typical DTMF tone accept and reject requirements. Actual values are user selectable as per Figures 5, 6 and 7. Characteristics Sym Min Typ‡ Max Units 1 Minimum tone accept duration tREC 40 ms 2 Maximum tone reject duration tREC 20 ms 3 Minimum interdigit pause duration tID 40 ms Conditions 4 Maximum tone drop-out duration tDO 20 ms † Characteristics are over recommended operating conditions unless otherwise stated ‡ Typical figures are at 25°C, VDD=5V, and for design aid only: not guaranteed and not subject to production testing AC Electrical Characteristics† - Voltages are with respect to ground (VSS), unless otherwise stated. Characteristics 1 2 3 4 Sym Min Typ‡ Max Units Conditions T O N E Tone present detect time tDP 3 11 14 ms Note 11 Tone absent detect time tDA 0.5 4 8.5 ms Note 11 Delay St to b3 tPStb3 13 µs See Figure 7 I N Delay St to RX0-RX3 tPStRX 8 µs See Figure 7 5 Tone burst duration tBST 50 52 ms DTMF mode 6 Tone pause duration tPS 50 52 ms DTMF mode 7 Tone burst duration (extended) tBSTE 100 104 ms Call Progress mode Tone pause duration (extended) tPSE 100 104 ms Call Progress mode High group output level VHOUT -6.1 -2.1 dBm RL=10kΩ Low group output level VLOUT -8.1 -4.1 dBm RL=10kΩ Pre-emphasis dBP 0 3 dB RL=10kΩ Output distortion (Single Tone) THD dB 25 kHz Bandwidth 8 9 10 11 12 T O N E O U T 2 -35 13 RL=10kΩ 14 Frequency deviation 15 Output load resistance RLT Crystal/clock frequency fC 16 17 18 X T A L ±0.7 fD Clock input rise and fall time tCLRF Clock input duty cycle DCCL 10 ±1.5 % 50 kΩ 3.5759 3.5795 3.5831 40 50 fC=3.579545 MHz MHz 110 ns Ext. clock 60 % Ext. clock 19 Capacitive load (OSC2) CLO 30 pF † Timing is over recommended temperature & power supply voltages. ‡ Typical figures are at 25°C and for design aid only: not guaranteed and not subject to production testing. 15 MT8889C AC Electrical Characteristics†- MPU Interface - Voltages are with respect to ground (VSS), unless otherwise stated. Characteristics Sym Min Typ‡ Max Units Conditions 1 DS/RD/WR clock frequency fCYC 4.0 MHz Figure 16 2 DS/RD/WR cycle period tCYC 250 ns Figure 16 3 DS/RD/WR low pulse width tCL ns Figure 16 4 DS/RD/WR high pulse width tCH ns Figure 16 5 DS/RD/WR rise and fall time tR,tF ns Figure 16 6 R/W setup time tRWS 23 ns Figures 17 & 18 7 R/W hold time tRWH 20 ns Figures 17 & 18 8 Address setup time (RS0) tAS 0 ns Figures 17 - 20 9 Address hold time (RS0) tAH 40 ns Figures 17 - 20 10 Data hold time (read) tDHR 22 ns Figures 17 - 20 11 DS/RD to valid data delay (read) tDDR ns Figures 17 - 20 12 Data setup time (write) tDSW 45 ns Figures 17 - 20 13 Data hold time (write) tDHW 10 ns Figures 17 - 20 14 Chip select setup time tCSS 45 ns Figures 17 - 20 15 Chip select hold time tCSH 40 ns Figures 17 - 20 16 Input Capacitance (data bus) CIN 5 pF 17 Output Capacitance (IRQ/CP) COUT 5 pF 150 100 20 20 100 35 † Characteristics are over recommended operating conditions unless otherwise stated ‡ Typical figures are at 25°C, VDD=5V, and for design aid only: not guaranteed and not subject to production testing NOTES: 1) dBm=decibels above or below a reference power of 1 mW into a 600 ohm load. 2) Digit sequence consists of all 16 DTMF tones. 3) Tone duration=40 ms. Tone pause=40 ms. 4) Nominal DTMF frequencies are used. 5) Both tones in the composite signal have an equal amplitude. 6) The tone pair is deviated by ± 1.5 % ±2 Hz. 7) Bandwidth limited (3 kHz) Gaussian noise. 8) The precise dial tone frequencies are 350 and 440 Hz ( ±2 %). 9) Guaranteed by design and characterization. Not subject to production testing. 10) Referenced to the lowest amplitude tone in the DTMF signal. 11) For guard time calculation purposes. tCYC tR DS/RD/WR tF tCH tCL Figure 16 - DS/RD/WR Clock Pulse 16 MT8889C tRWH tRWS DS Q clk* A0-A15 (RS0) 16 bytes of Addr R/W(read) tDDR tDHR Read Data (D3-D0) R/W (write) tDSW➀ Write data (D3-D0) tDHW tCSH➀ tCSS tAH tAS CS = (E + Q).Addr [MC6809] tAH CS = VMA.Addr [MC6800, MC6802] tAS tCSH➀ tCSS *microprocessor pin Figure 17 - MC6800/MC6802/MC6809 Timing Diagram ➀ tDSW is from data to DS falling edge; t CSH is from DS rising edge to CS rising edge tRWS DS tRWH R/W tDHR tDDR tAS Read AD3-AD0 (RS0, D0-D3) Addr Data Write AD3-AD0 (RS0-D0-D3) Addr Data tDSW tAH Addr * non-mux tDHW tCSH High Byte of Addr AS * CS = AS.Addr tCSS * microprocessor pins Figure 18 - MC68HC11 Bus Timing (with multiplexed address and data buses) 17 MT8889C tCSS ALE* RD tAS P0* (RS0, D0-D3) tDHR tDDR tAH Data A0-A7 P2 * (Addr) A8-A15 Address tCSH CS = ALE.Addr * microprocessor pins Figure 19 - 8031/8051/8085 Read Timing Diagram ALE* tCSS WR tAS P0* (RS0, D0-D3) P2 * (Addr) tAH A0-A7 tDSW tDHW Data A8-A15 Address tCSH CS = ALE.Addr * microprocessor pins Figure 20 - 8031/8051/8085 Write Timing Diagram 18 Package Outlines 3 2 1 E1 E n-2 n-1 n D A2 A L C eA b2 e eC eB b Notes: D1 1) Not to scale 2) Dimensions in inches 3) (Dimensions in millimeters) Plastic Dual-In-Line Packages (PDIP) - E Suffix DIM 8-Pin 16-Pin 18-Pin 20-Pin Plastic Plastic Plastic Plastic Min A Max Min 0.210 (5.33) Max Min 0.210 (5.33) Max Min 0.210 (5.33) Max 0.210 (5.33) A2 0.115 (2.92) 0.195 (4.95) 0.115 (2.92) 0.195 (4.95) 0.115 (2.92) 0.195 (4.95) 0.115 (2.92) 0.195 (4.95) b 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) b2 0.045 (1.14) 0.070 (1.77) 0.045 (1.14) 0.070 (1.77) 0.045 (1.14) 0.070 (1.77) 0.045 (1.14) 0.070 (1.77) C 0.008 (0.203) 0.014 (0.356) 0.008 (0.203) 0.014(0.356) 0.008 (0.203) 0.014 (0.356) 0.008 (0.203) 0.014 (0.356) D 0.355 (9.02) 0.400 (10.16) 0.780 (19.81) 0.800 (20.32) 0.880 (22.35) 0.920 (23.37) 0.980 (24.89) 1.060 (26.9) D1 0.005 (0.13) E 0.300 (7.62) 0.325 (8.26) 0.300 (7.62) 0.325 (8.26) 0.300 (7.62) 0.325 (8.26) 0.300 (7.62) 0.325 (8.26) E1 0.240 (6.10) 0.280 (7.11) 0.240 (6.10) 0.280 (7.11) 0.240 (6.10) 0.280 (7.11) 0.240 (6.10) 0.280 (7.11) 0.005 (0.13) 0.005 (0.13) 0.005 (0.13) e 0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54) eA 0.300 BSC (7.62) 0.300 BSC (7.62) 0.300 BSC (7.62) 0.300 BSC (7.62) L 0.115 (2.92) eB eC 0.150 (3.81) 0.115 (2.92) 0.430 (10.92) 0 0.060 (1.52) 0.150 (3.81) 0.430 (10.92) 0 0.060 (1.52) NOTE: Controlling dimensions in parenthesis ( ) are in millimeters. General-8 0.115 (2.92) 0.150 (3.81) 0.115 (2.92) 0.430 (10.92) 0 0.060 (1.52) 0.150 (3.81) 0.430 (10.92) 0 0.060 (1.52) Package Outlines 3 2 1 E1 E n-2 n-1 n D α A2 A L C eA b2 e eB b Notes: D1 1) Not to scale 2) Dimensions in inches 3) (Dimensions in millimeters) Plastic Dual-In-Line Packages (PDIP) - E Suffix DIM 22-Pin 24-Pin 28-Pin 40-Pin Plastic Plastic Plastic Plastic Min A Max Min 0.210 (5.33) Max Min 0.250 (6.35) Max Min 0.250 (6.35) Max 0.250 (6.35) A2 0.125 (3.18) 0.195 (4.95) 0.125 (3.18) 0.195 (4.95) 0.125 (3.18) 0.195 (4.95) 0.125 (3.18) 0.195 (4.95) b 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) b2 0.045 (1.15) 0.070 (1.77) 0.030 (0.77) 0.070 (1.77) 0.030 (0.77) 0.070 (1.77) 0.030 (0.77) 0.070 (1.77) C 0.008 (0.204) 0.015 (0.381) 0.008 (0.204) 0.015 (0.381) 0.008 (0.204) 0.015 (0.381) 0.008 (0.204) 0.015 (0.381) D 1.050 (26.67) 1.120 (28.44) 1.150 (29.3) 1.290 (32.7) 1.380 (35.1) 1.565 (39.7) 1.980 (50.3) 2.095 (53.2) D1 0.005 (0.13) E 0.390 (9.91) 0.005 (0.13) 0.430 (10.92) E E1 0.330 (8.39) 0.380 (9.65) E1 0.005 (0.13) 0.600 (15.24) 0.670 (17.02) 0.290 (7.37) .330 (8.38) 0.485 (12.32) 0.580 (14.73) 0.246 (6.25) 0.254 (6.45) 0.005 (0.13) 0.600 (15.24) 0.670 (17.02) 0.600 (15.24) 0.670 (17.02) 0.485 (12.32) 0.580 (14.73) 0.485 (12.32) 0.580 (14.73) e 0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54) eA 0.400 BSC (10.16) 0.600 BSC (15.24) 0.600 BSC (15.24) 0.600 BSC (15.24) eA 0.300 BSC (7.62) eB L α 0.430 (10.92) 0.115 (2.93) 0.160 (4.06) 0.115 (2.93) 0.200 (5.08) 15° Shaded areas for 300 Mil Body Width 24 PDIP only 15° 0.115 (2.93) 0.200 (5.08) 15° 0.115 (2.93) 0.200 (5.08) 15° Package Outlines Pin 1 E A C L H e D L 4 mils (lead coplanarity) Notes: 1) Not to scale 2) Dimensions in inches 3) (Dimensions in millimeters) 4) A & B Maximum dimensions include allowable mold flash A1 B DIM 16-Pin 18-Pin 20-Pin 24-Pin 28-Pin Min Max Min Max Min Max Min Max Min Max A 0.093 (2.35) 0.104 (2.65) 0.093 (2.35) 0.104 (2.65) 0.093 (2.35) 0.104 (2.65) 0.093 (2.35) 0.104 (2.65) 0.093 (2.35) 0.104 (2.65) A1 0.004 (0.10) 0.012 (0.30) 0.004 (0.10) 0.012 (0.30) 0.004 (0.10) 0.012 (0.30) 0.004 (0.10) 0.012 (0.30) 0.004 (0.10) 0.012 (0.30) B 0.013 (0.33) 0.020 (0.51) 0.013 (0.33) 0.030 (0.51) 0.013 (0.33) 0.020 (0.51) 0.013 (0.33) 0.020 (0.51) 0.013 (0.33) 0.020 (0.51) C 0.009 (0.231) 0.013 (0.318) 0.009 (0.231) 0.013 (0.318) 0.009 (0.231) 0.013 (0.318) 0.009 (0.231) 0.013 (0.318) 0.009 (0.231) 0.013 (0.318) D 0.398 (10.1) 0.413 (10.5) 0.447 (11.35) 0.4625 (11.75) 0.496 (12.60) 0.512 (13.00) 0.5985 (15.2) 0.614 (15.6) 0.697 (17.7) 0.7125 (18.1) E 0.291 (7.40) 0.299 (7.40) 0.291 (7.40) 0.299 (7.40) 0.291 (7.40) 0.299 (7.40) 0.291 (7.40) 0.299 (7.40) 0.291 (7.40) 0.299 (7.40) e 0.050 BSC (1.27 BSC) 0.050 BSC (1.27 BSC) 0.050 BSC (1.27 BSC) 0.050 BSC (1.27 BSC) 0.050 BSC (1.27 BSC) H 0.394 (10.00) 0.419 (10.65) 0.394 (10.00) 0.419 (10.65) 0.394 (10.00) 0.419 (10.65) 0.394 (10.00) 0.419 (10.65) 0.394 (10.00) 0.419 (10.65) L 0.016 (0.40) 0.050 (1.27) 0.016 (0.40) 0.050 (1.27) 0.016 (0.40) 0.050 (1.27) 0.016 (0.40) 0.050 (1.27) 0.016 (0.40) 0.050 (1.27) Lead SOIC Package - S Suffix NOTES: 1. Controlling dimensions in parenthesis ( ) are in millimeters. 2. Converted inch dimensions are not necessarily exact. General-7 Package Outlines Pin 1 E A C L H e Notes: 1) Not to scale 2) Dimensions in inches 3) (Dimensions in millimeters) 4) Ref. JEDEC Standard M0-150/M0118 for 48 Pin 5) A & B Maximum dimensions include allowable mold flash D A2 A1 B 20-Pin 24-Pin 28-Pin 48-Pin Dim Min A A1 0.002 (0.05) B 0.0087 (0.22) C Max Min Max 0.079 (2) - 0.079 (2) 0.002 (0.05) 0.013 (0.33) 0.0087 (0.22) 0.008 (0.21) Min Max Min Max 0.079 (2) 0.095 (2.41) 0.110 (2.79) 0.008 (0.2) 0.016 (0.406) 0.008 (0.2) 0.0135 (0.342) 0.002 (0.05) 0.013 (0.33) 0.0087 (0.22) 0.008 (0.21) 0.013 (0.33) 0.008 (0.21) 0.010 (0.25) D 0.27 (6.9) 0.295 (7.5) 0.31 (7.9) 0.33 (8.5) 0.39 (9.9) 0.42 (10.5) 0.62 (15.75) 0.63 (16.00) E 0.2 (5.0) 0.22 (5.6) 0.2 (5.0) 0.22 (5.6) 0.2 (5.0) 0.22 (5.6) 0.291 (7.39) 0.299 (7.59) e 0.025 BSC (0.635 BSC) 0.025 BSC (0.635 BSC) 0.025 BSC (0.635 BSC) 0.025 BSC (0.635 BSC) A2 0.065 (1.65) 0.073 (1.85) 0.065 (1.65) 0.073 (1.85) 0.065 (1.65) 0.073 (1.85) 0.089 (2.26) 0.099 (2.52) H 0.29 (7.4) 0.32 (8.2) 0.29 (7.4) 0.32 (8.2) 0.29 (7.4) 0.32 (8.2) 0.395 (10.03) 0.42 (10.67) L 0.022 (0.55) 0.037 (0.95) 0.022 (0.55) 0.037 (0.95) 0.022 (0.55) 0.037 (0.95) 0.02 (0.51) 0.04 (1.02) Small Shrink Outline Package (SSOP) - N Suffix General-11 Package Outlines 3 2 1 E1 E n-2 n-1 n D A2 A L C eA b2 e eC eB b Notes: D1 1) Not to scale 2) Dimensions in inches 3) (Dimensions in millimeters) Plastic Dual-In-Line Packages (PDIP) - E Suffix DIM 8-Pin 16-Pin 18-Pin 20-Pin Plastic Plastic Plastic Plastic Min A Max Min 0.210 (5.33) Max Min 0.210 (5.33) Max Min 0.210 (5.33) Max 0.210 (5.33) A2 0.115 (2.92) 0.195 (4.95) 0.115 (2.92) 0.195 (4.95) 0.115 (2.92) 0.195 (4.95) 0.115 (2.92) 0.195 (4.95) b 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) b2 0.045 (1.14) 0.070 (1.77) 0.045 (1.14) 0.070 (1.77) 0.045 (1.14) 0.070 (1.77) 0.045 (1.14) 0.070 (1.77) C 0.008 (0.203) 0.014 (0.356) 0.008 (0.203) 0.014(0.356) 0.008 (0.203) 0.014 (0.356) 0.008 (0.203) 0.014 (0.356) D 0.355 (9.02) 0.400 (10.16) 0.780 (19.81) 0.800 (20.32) 0.880 (22.35) 0.920 (23.37) 0.980 (24.89) 1.060 (26.9) D1 0.005 (0.13) E 0.300 (7.62) 0.325 (8.26) 0.300 (7.62) 0.325 (8.26) 0.300 (7.62) 0.325 (8.26) 0.300 (7.62) 0.325 (8.26) E1 0.240 (6.10) 0.280 (7.11) 0.240 (6.10) 0.280 (7.11) 0.240 (6.10) 0.280 (7.11) 0.240 (6.10) 0.280 (7.11) 0.005 (0.13) 0.005 (0.13) 0.005 (0.13) e 0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54) eA 0.300 BSC (7.62) 0.300 BSC (7.62) 0.300 BSC (7.62) 0.300 BSC (7.62) L 0.115 (2.92) eB eC 0.150 (3.81) 0.115 (2.92) 0.430 (10.92) 0 0.060 (1.52) 0.150 (3.81) 0.430 (10.92) 0 0.060 (1.52) NOTE: Controlling dimensions in parenthesis ( ) are in millimeters. General-8 0.115 (2.92) 0.150 (3.81) 0.115 (2.92) 0.430 (10.92) 0 0.060 (1.52) 0.150 (3.81) 0.430 (10.92) 0 0.060 (1.52) Package Outlines 3 2 1 E1 E n-2 n-1 n D α A2 A L C eA b2 e eB b Notes: D1 1) Not to scale 2) Dimensions in inches 3) (Dimensions in millimeters) Plastic Dual-In-Line Packages (PDIP) - E Suffix DIM 22-Pin 24-Pin 28-Pin 40-Pin Plastic Plastic Plastic Plastic Min A Max Min 0.210 (5.33) Max Min 0.250 (6.35) Max Min 0.250 (6.35) Max 0.250 (6.35) A2 0.125 (3.18) 0.195 (4.95) 0.125 (3.18) 0.195 (4.95) 0.125 (3.18) 0.195 (4.95) 0.125 (3.18) 0.195 (4.95) b 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) b2 0.045 (1.15) 0.070 (1.77) 0.030 (0.77) 0.070 (1.77) 0.030 (0.77) 0.070 (1.77) 0.030 (0.77) 0.070 (1.77) C 0.008 (0.204) 0.015 (0.381) 0.008 (0.204) 0.015 (0.381) 0.008 (0.204) 0.015 (0.381) 0.008 (0.204) 0.015 (0.381) D 1.050 (26.67) 1.120 (28.44) 1.150 (29.3) 1.290 (32.7) 1.380 (35.1) 1.565 (39.7) 1.980 (50.3) 2.095 (53.2) D1 0.005 (0.13) E 0.390 (9.91) 0.005 (0.13) 0.430 (10.92) E E1 0.330 (8.39) 0.380 (9.65) E1 0.005 (0.13) 0.600 (15.24) 0.670 (17.02) 0.290 (7.37) .330 (8.38) 0.485 (12.32) 0.580 (14.73) 0.246 (6.25) 0.254 (6.45) 0.005 (0.13) 0.600 (15.24) 0.670 (17.02) 0.600 (15.24) 0.670 (17.02) 0.485 (12.32) 0.580 (14.73) 0.485 (12.32) 0.580 (14.73) e 0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54) eA 0.400 BSC (10.16) 0.600 BSC (15.24) 0.600 BSC (15.24) 0.600 BSC (15.24) eA 0.300 BSC (7.62) eB L α 0.430 (10.92) 0.115 (2.93) 0.160 (4.06) 0.115 (2.93) 0.200 (5.08) 15° Shaded areas for 300 Mil Body Width 24 PDIP only 15° 0.115 (2.93) 0.200 (5.08) 15° 0.115 (2.93) 0.200 (5.08) 15° Package Outlines Pin 1 E A C L H e D L 4 mils (lead coplanarity) Notes: 1) Not to scale 2) Dimensions in inches 3) (Dimensions in millimeters) 4) A & B Maximum dimensions include allowable mold flash A1 B DIM 16-Pin 18-Pin 20-Pin 24-Pin 28-Pin Min Max Min Max Min Max Min Max Min Max A 0.093 (2.35) 0.104 (2.65) 0.093 (2.35) 0.104 (2.65) 0.093 (2.35) 0.104 (2.65) 0.093 (2.35) 0.104 (2.65) 0.093 (2.35) 0.104 (2.65) A1 0.004 (0.10) 0.012 (0.30) 0.004 (0.10) 0.012 (0.30) 0.004 (0.10) 0.012 (0.30) 0.004 (0.10) 0.012 (0.30) 0.004 (0.10) 0.012 (0.30) B 0.013 (0.33) 0.020 (0.51) 0.013 (0.33) 0.030 (0.51) 0.013 (0.33) 0.020 (0.51) 0.013 (0.33) 0.020 (0.51) 0.013 (0.33) 0.020 (0.51) C 0.009 (0.231) 0.013 (0.318) 0.009 (0.231) 0.013 (0.318) 0.009 (0.231) 0.013 (0.318) 0.009 (0.231) 0.013 (0.318) 0.009 (0.231) 0.013 (0.318) D 0.398 (10.1) 0.413 (10.5) 0.447 (11.35) 0.4625 (11.75) 0.496 (12.60) 0.512 (13.00) 0.5985 (15.2) 0.614 (15.6) 0.697 (17.7) 0.7125 (18.1) E 0.291 (7.40) 0.299 (7.40) 0.291 (7.40) 0.299 (7.40) 0.291 (7.40) 0.299 (7.40) 0.291 (7.40) 0.299 (7.40) 0.291 (7.40) 0.299 (7.40) e 0.050 BSC (1.27 BSC) 0.050 BSC (1.27 BSC) 0.050 BSC (1.27 BSC) 0.050 BSC (1.27 BSC) 0.050 BSC (1.27 BSC) H 0.394 (10.00) 0.419 (10.65) 0.394 (10.00) 0.419 (10.65) 0.394 (10.00) 0.419 (10.65) 0.394 (10.00) 0.419 (10.65) 0.394 (10.00) 0.419 (10.65) L 0.016 (0.40) 0.050 (1.27) 0.016 (0.40) 0.050 (1.27) 0.016 (0.40) 0.050 (1.27) 0.016 (0.40) 0.050 (1.27) 0.016 (0.40) 0.050 (1.27) Lead SOIC Package - S Suffix NOTES: 1. Controlling dimensions in parenthesis ( ) are in millimeters. 2. Converted inch dimensions are not necessarily exact. General-7 Package Outlines Pin 1 E A C L H e Notes: 1) Not to scale 2) Dimensions in inches 3) (Dimensions in millimeters) 4) Ref. JEDEC Standard M0-150/M0118 for 48 Pin 5) A & B Maximum dimensions include allowable mold flash D A2 A1 B 20-Pin 24-Pin 28-Pin 48-Pin Dim Min A A1 0.002 (0.05) B 0.0087 (0.22) C Max Min Max 0.079 (2) - 0.079 (2) 0.002 (0.05) 0.013 (0.33) 0.0087 (0.22) 0.008 (0.21) Min Max Min Max 0.079 (2) 0.095 (2.41) 0.110 (2.79) 0.008 (0.2) 0.016 (0.406) 0.008 (0.2) 0.0135 (0.342) 0.002 (0.05) 0.013 (0.33) 0.0087 (0.22) 0.008 (0.21) 0.013 (0.33) 0.008 (0.21) 0.010 (0.25) D 0.27 (6.9) 0.295 (7.5) 0.31 (7.9) 0.33 (8.5) 0.39 (9.9) 0.42 (10.5) 0.62 (15.75) 0.63 (16.00) E 0.2 (5.0) 0.22 (5.6) 0.2 (5.0) 0.22 (5.6) 0.2 (5.0) 0.22 (5.6) 0.291 (7.39) 0.299 (7.59) e 0.025 BSC (0.635 BSC) 0.025 BSC (0.635 BSC) 0.025 BSC (0.635 BSC) 0.025 BSC (0.635 BSC) A2 0.065 (1.65) 0.073 (1.85) 0.065 (1.65) 0.073 (1.85) 0.065 (1.65) 0.073 (1.85) 0.089 (2.26) 0.099 (2.52) H 0.29 (7.4) 0.32 (8.2) 0.29 (7.4) 0.32 (8.2) 0.29 (7.4) 0.32 (8.2) 0.395 (10.03) 0.42 (10.67) L 0.022 (0.55) 0.037 (0.95) 0.022 (0.55) 0.037 (0.95) 0.022 (0.55) 0.037 (0.95) 0.02 (0.51) 0.04 (1.02) Small Shrink Outline Package (SSOP) - N Suffix General-11 Package Outlines 3 2 1 E1 E n-2 n-1 n D A2 A L C eA b2 e eC eB b Notes: D1 1) Not to scale 2) Dimensions in inches 3) (Dimensions in millimeters) Plastic Dual-In-Line Packages (PDIP) - E Suffix DIM 8-Pin 16-Pin 18-Pin 20-Pin Plastic Plastic Plastic Plastic Min A Max Min 0.210 (5.33) Max Min 0.210 (5.33) Max Min 0.210 (5.33) Max 0.210 (5.33) A2 0.115 (2.92) 0.195 (4.95) 0.115 (2.92) 0.195 (4.95) 0.115 (2.92) 0.195 (4.95) 0.115 (2.92) 0.195 (4.95) b 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) b2 0.045 (1.14) 0.070 (1.77) 0.045 (1.14) 0.070 (1.77) 0.045 (1.14) 0.070 (1.77) 0.045 (1.14) 0.070 (1.77) C 0.008 (0.203) 0.014 (0.356) 0.008 (0.203) 0.014(0.356) 0.008 (0.203) 0.014 (0.356) 0.008 (0.203) 0.014 (0.356) D 0.355 (9.02) 0.400 (10.16) 0.780 (19.81) 0.800 (20.32) 0.880 (22.35) 0.920 (23.37) 0.980 (24.89) 1.060 (26.9) D1 0.005 (0.13) E 0.300 (7.62) 0.325 (8.26) 0.300 (7.62) 0.325 (8.26) 0.300 (7.62) 0.325 (8.26) 0.300 (7.62) 0.325 (8.26) E1 0.240 (6.10) 0.280 (7.11) 0.240 (6.10) 0.280 (7.11) 0.240 (6.10) 0.280 (7.11) 0.240 (6.10) 0.280 (7.11) 0.005 (0.13) 0.005 (0.13) 0.005 (0.13) e 0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54) eA 0.300 BSC (7.62) 0.300 BSC (7.62) 0.300 BSC (7.62) 0.300 BSC (7.62) L 0.115 (2.92) eB eC 0.150 (3.81) 0.115 (2.92) 0.430 (10.92) 0 0.060 (1.52) 0.150 (3.81) 0.430 (10.92) 0 0.060 (1.52) NOTE: Controlling dimensions in parenthesis ( ) are in millimeters. General-8 0.115 (2.92) 0.150 (3.81) 0.115 (2.92) 0.430 (10.92) 0 0.060 (1.52) 0.150 (3.81) 0.430 (10.92) 0 0.060 (1.52) Package Outlines 3 2 1 E1 E n-2 n-1 n D α A2 A L C eA b2 e eB b Notes: D1 1) Not to scale 2) Dimensions in inches 3) (Dimensions in millimeters) Plastic Dual-In-Line Packages (PDIP) - E Suffix DIM 22-Pin 24-Pin 28-Pin 40-Pin Plastic Plastic Plastic Plastic Min A Max Min 0.210 (5.33) Max Min 0.250 (6.35) Max Min 0.250 (6.35) Max 0.250 (6.35) A2 0.125 (3.18) 0.195 (4.95) 0.125 (3.18) 0.195 (4.95) 0.125 (3.18) 0.195 (4.95) 0.125 (3.18) 0.195 (4.95) b 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) b2 0.045 (1.15) 0.070 (1.77) 0.030 (0.77) 0.070 (1.77) 0.030 (0.77) 0.070 (1.77) 0.030 (0.77) 0.070 (1.77) C 0.008 (0.204) 0.015 (0.381) 0.008 (0.204) 0.015 (0.381) 0.008 (0.204) 0.015 (0.381) 0.008 (0.204) 0.015 (0.381) D 1.050 (26.67) 1.120 (28.44) 1.150 (29.3) 1.290 (32.7) 1.380 (35.1) 1.565 (39.7) 1.980 (50.3) 2.095 (53.2) D1 0.005 (0.13) E 0.390 (9.91) 0.005 (0.13) 0.430 (10.92) E E1 0.330 (8.39) 0.380 (9.65) E1 0.005 (0.13) 0.600 (15.24) 0.670 (17.02) 0.290 (7.37) .330 (8.38) 0.485 (12.32) 0.580 (14.73) 0.246 (6.25) 0.254 (6.45) 0.005 (0.13) 0.600 (15.24) 0.670 (17.02) 0.600 (15.24) 0.670 (17.02) 0.485 (12.32) 0.580 (14.73) 0.485 (12.32) 0.580 (14.73) e 0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54) eA 0.400 BSC (10.16) 0.600 BSC (15.24) 0.600 BSC (15.24) 0.600 BSC (15.24) eA 0.300 BSC (7.62) eB L α 0.430 (10.92) 0.115 (2.93) 0.160 (4.06) 0.115 (2.93) 0.200 (5.08) 15° Shaded areas for 300 Mil Body Width 24 PDIP only 15° 0.115 (2.93) 0.200 (5.08) 15° 0.115 (2.93) 0.200 (5.08) 15° Package Outlines Pin 1 E A C L H e D L 4 mils (lead coplanarity) Notes: 1) Not to scale 2) Dimensions in inches 3) (Dimensions in millimeters) 4) A & B Maximum dimensions include allowable mold flash A1 B DIM 16-Pin 18-Pin 20-Pin 24-Pin 28-Pin Min Max Min Max Min Max Min Max Min Max A 0.093 (2.35) 0.104 (2.65) 0.093 (2.35) 0.104 (2.65) 0.093 (2.35) 0.104 (2.65) 0.093 (2.35) 0.104 (2.65) 0.093 (2.35) 0.104 (2.65) A1 0.004 (0.10) 0.012 (0.30) 0.004 (0.10) 0.012 (0.30) 0.004 (0.10) 0.012 (0.30) 0.004 (0.10) 0.012 (0.30) 0.004 (0.10) 0.012 (0.30) B 0.013 (0.33) 0.020 (0.51) 0.013 (0.33) 0.030 (0.51) 0.013 (0.33) 0.020 (0.51) 0.013 (0.33) 0.020 (0.51) 0.013 (0.33) 0.020 (0.51) C 0.009 (0.231) 0.013 (0.318) 0.009 (0.231) 0.013 (0.318) 0.009 (0.231) 0.013 (0.318) 0.009 (0.231) 0.013 (0.318) 0.009 (0.231) 0.013 (0.318) D 0.398 (10.1) 0.413 (10.5) 0.447 (11.35) 0.4625 (11.75) 0.496 (12.60) 0.512 (13.00) 0.5985 (15.2) 0.614 (15.6) 0.697 (17.7) 0.7125 (18.1) E 0.291 (7.40) 0.299 (7.40) 0.291 (7.40) 0.299 (7.40) 0.291 (7.40) 0.299 (7.40) 0.291 (7.40) 0.299 (7.40) 0.291 (7.40) 0.299 (7.40) e 0.050 BSC (1.27 BSC) 0.050 BSC (1.27 BSC) 0.050 BSC (1.27 BSC) 0.050 BSC (1.27 BSC) 0.050 BSC (1.27 BSC) H 0.394 (10.00) 0.419 (10.65) 0.394 (10.00) 0.419 (10.65) 0.394 (10.00) 0.419 (10.65) 0.394 (10.00) 0.419 (10.65) 0.394 (10.00) 0.419 (10.65) L 0.016 (0.40) 0.050 (1.27) 0.016 (0.40) 0.050 (1.27) 0.016 (0.40) 0.050 (1.27) 0.016 (0.40) 0.050 (1.27) 0.016 (0.40) 0.050 (1.27) Lead SOIC Package - S Suffix NOTES: 1. Controlling dimensions in parenthesis ( ) are in millimeters. 2. Converted inch dimensions are not necessarily exact. General-7 Package Outlines Pin 1 E A C L H e Notes: 1) Not to scale 2) Dimensions in inches 3) (Dimensions in millimeters) 4) Ref. JEDEC Standard M0-150/M0118 for 48 Pin 5) A & B Maximum dimensions include allowable mold flash D A2 A1 B 20-Pin 24-Pin 28-Pin 48-Pin Dim Min A A1 0.002 (0.05) B 0.0087 (0.22) C Max Min Max 0.079 (2) - 0.079 (2) 0.002 (0.05) 0.013 (0.33) 0.0087 (0.22) 0.008 (0.21) Min Max Min Max 0.079 (2) 0.095 (2.41) 0.110 (2.79) 0.008 (0.2) 0.016 (0.406) 0.008 (0.2) 0.0135 (0.342) 0.002 (0.05) 0.013 (0.33) 0.0087 (0.22) 0.008 (0.21) 0.013 (0.33) 0.008 (0.21) 0.010 (0.25) D 0.27 (6.9) 0.295 (7.5) 0.31 (7.9) 0.33 (8.5) 0.39 (9.9) 0.42 (10.5) 0.62 (15.75) 0.63 (16.00) E 0.2 (5.0) 0.22 (5.6) 0.2 (5.0) 0.22 (5.6) 0.2 (5.0) 0.22 (5.6) 0.291 (7.39) 0.299 (7.59) e 0.025 BSC (0.635 BSC) 0.025 BSC (0.635 BSC) 0.025 BSC (0.635 BSC) 0.025 BSC (0.635 BSC) A2 0.065 (1.65) 0.073 (1.85) 0.065 (1.65) 0.073 (1.85) 0.065 (1.65) 0.073 (1.85) 0.089 (2.26) 0.099 (2.52) H 0.29 (7.4) 0.32 (8.2) 0.29 (7.4) 0.32 (8.2) 0.29 (7.4) 0.32 (8.2) 0.395 (10.03) 0.42 (10.67) L 0.022 (0.55) 0.037 (0.95) 0.022 (0.55) 0.037 (0.95) 0.022 (0.55) 0.037 (0.95) 0.02 (0.51) 0.04 (1.02) Small Shrink Outline Package (SSOP) - N Suffix General-11 http://www.zarlink.com World Headquarters - Canada Tel: +1 (613) 592 0200 Fax: +1 (613) 592 1010 North America - West Coast Tel: (858) 675-3400 Fax: (858) 675-3450 Asia/Pacific Tel: +65 333 6193 Fax: +65 333 6192 North America - East Coast Tel: (978) 322-4800 Fax: (978) 322-4888 Europe, Middle East, and Africa (EMEA) Tel: +44 (0) 1793 518528 Fax: +44 (0) 1793 518581 Information relating to products and services furnished herein by Zarlink Semiconductor Inc. trading as Zarlink Semiconductor or its subsidiaries (collectively “Zarlink”) is believed to be reliable. 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Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink Semiconductor’s conditions of sale which are available on request. Purchase of Zarlink’s I2C components conveys a licence under the Philips I2C Patent rights to use these components in an I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips Zarlink and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright 2001, Zarlink Semiconductor Inc. All rights reserved. TECHNICAL DOCUMENTATION - NOT FOR RESALE