EC1078 InGaP HBT Gain Block Product Features Product Description Functional Diagram GND DC – 3.5 GHz +21 dBm P1dB at 1 GHz +37 dBm OIP3 at 1 GHz 20 dB Gain at 1 GHz 4.4 dB Noise Figure at 2 GHz Available in Lead-free / green SOT-89 Package Style • Internally matched to 50 Ω • • • • • • Applications • • • • • The EC1078B is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 1000 MHz, the EC1078B typically provides 20 dB of gain, +37 dBm Output IP3, and +21 dBm P1dB. The EC1078B consists of Darlington pair amplifiers using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The device is ideal for wireless applications and is available in a low-cost, surface-mountable lead-free/green/RoHS-compliant SOT89 package. All devices are 100% RF and DC tested. 1 2 3 RF IN GND RF OUT Function Input Output/Bias Ground Pin No. 1 3 2, 4 The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the EC1078B will work for other various applications within the DC to 3.5 GHz frequency range such as CATV and mobile wireless. Mobile Infrastructure CATV / FTTX W-LAN / ISM RFID WiMAX / WiBro Specifications (1) Parameter 4 Typical Performance (1) Units Min MHz MHz dB dBm dBm MHz dB dB dB dB dBm dBm dB MHz dB V mA DC Operational Bandwidth Test Frequency Gain Output P1dB Output IP3 (2) Test Frequency Gain Large-signal Gain (3) Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Test Frequency Gain Device Voltage Device Current 14.7 13 5.3 Typ 1000 20 +21 +37 2000 17 16 12 8 +20 +33 4.4 3000 14.5 5.6 96 Max Parameter Units 3500 Frequency S21 S11 S22 Output P1dB Output IP3 (2) Noise Figure MHz dB dB dB dBm dBm dB Typical 500 20.7 -13 -12 +20.6 +37.5 3.1 900 20 -14 -12 +21 +37 3.5 1900 17.2 -14 -12 +20.5 +33.5 4.3 2140 16.6 -15 -12 +20 +32.5 4.4 5.9 1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +7 V, Rbias = 14 Ω, 50 Ω System. 2. 3OIP measured with two tones at an output power of +7 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Large-signal gain is tested with an input power level of +3 dBm. Absolute Maximum Rating Parameter Rating Operating Case Temperature Storage Temperature Device Current RF Input Power (continuous) Junction Temperature -40 to +85 °C -55 to +150 °C 150 mA +12 dBm +250 °C Ordering Information Part No. Description EC1078B-G InGaP HBT Gain Block EC1078B-PCB 700 – 2400 MHz Fully Assembled Eval. Board (lead-free/green/RoHS-compliant SOT-89 package) Operation of this device above any of these parameters may cause permanent damage. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 1 of 4 April 2007 EC1078 InGaP HBT Gain Block Typical Device RF Performance Supply Bias = +7 V, Rbias = 14 Ω, Icc = 96 mA Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure MHz dB dB dB dBm dBm dB 100 21.2 -13 -11 +20 +38 3.4 500 20.7 -13 -12 +20.6 +37.5 3.5 900 20 -14 -12 +21 +37 3.5 1900 17.2 -14 -12 +20.5 +33.5 3.8 2140 16.6 -15 -12 +20 +32.5 3.8 2400 15.9 -15 -11 +19 +32 3.9 3500 13.5 -13 -9.2 1. Test conditions: T = 25º C, Supply Voltage = +7 V, Device Voltage = 5.6 V, Rbias = 14 Ω, Icc = 96 mA typical, 50 Ω System. 2. 3OIP measured with two tones at an output power of +7 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. The performance data does not account for losses attributed to recommended input and output series resistances shown in the application circuit on page 3. S11, S22 vs. Frequency 25 -4 S11, S22 (dB) 0 Gain (dB) 20 15 120 -8 0 40 1 2 3 4 Frequency (GHz) 5 6 0 -20 0 OIP3 vs. Frequency 2 3 4 Frequency (GHz) 5 35 5 NF (dB) 6 30 1000 85°C 1500 2000 Frequency (MHz) -40°C 2500 3000 4 Vde (V) 6 8 P1dB vs. Frequency 4 2 500 2 24 3 25 25°C 0 6 Noise Figure vs. Frequency 40 20 500 1 P1dB (dBm) 0 25°C 80 S11 -16 5 OIP3 (dBm) 160 S22 -12 10 Icc vs. Vde 200 Icc (mA) Gain vs. Frequency 30 20 16 25°C 1000 1500 Frequency (MHz) 2000 12 500 1000 85°C -40°C 1500 2000 Frequency (MHz) 2500 3000 Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 2 of 4 April 2007 EC1078 InGaP HBT Gain Block Recommended Application Circuit (EC1078B-PCB) Vcc Icc = 96 mA Bias Resistor C4 Bypass Capacitor C3 0.018 µF L1 RF Choke RF IN RF OUT EC1078B R1 6Ω C1 Blocking Capacitor Reference Designator L1 C1, C2, C3 R2 6Ω 50 820 nH .018 µF C2 Blocking Capacitor Recommended Component Values Frequency (MHz) 500 900 1900 2200 220 nH 68 nH 27 nH 22 nH 1000 pF 100 pF 68 pF 68 pF 2500 18 nH 56 pF 3500 15 nH 39 pF 1. The proper values for the components are dependent upon the intended frequency of operation. 2. The component values in the table below are contained on the evaluation board to achieve optimal broadband performance. 3. R1 and R2 are shown in the circuit diagram to avoid potential instabilities. The configuration shown above assures of unconditional stability with the use of the device. It is expected that linearity parameters (OIP3 and P1dB) to degrade about only 0.5 dB, while overall gain will be about 1 dB less than the performance shown in page 1 and 2 of this datasheet. Input and output return loss is expected to improve with the use of the I/O series resistances at 2 GHz. Ref. Desig. L1 C1, C2 C3 C4 R1 R2 R3 Value / Type 39 nH wirewound inductor 56 pF chip capacitor 0.018 µF chip capacitor Do Not Place 6 Ω chip resistor 6 Ω chip resistor 14 Ω 1% tolerance Recommended Bias Resistor Values Supply R bias value Size Voltage 7V 14.6 ohms 1210 8V 25 ohms 1210 9V 35 ohms 2010 10 V 46 ohms 2010 12 V 67 ohms 2512 Size 0603 0603 0603 The proper value for R bias is dependent upon the supply voltage and allows for bias stability over temperature. WJ recommends a minimum supply bias of +7 V. A 1% tolerance resistor is recommended. 0603 0603 2010 Typical Device S-Parameters S-Parameters (Vdevice = +5.6 V, ICC = 96 mA, T = 25°C, calibrated to device leads) Freq (MHz) 50 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000 S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) -13.94 -13.75 -13.18 -12.31 -11.09 -9.97 -8.87 -7.79 -6.76 -5.72 -4.72 -3.91 -3.22 -3.83 -39.71 -77.85 -113.82 -148.03 -177.99 154.89 129.58 106.00 85.30 66.77 51.00 37.49 21.57 20.96 19.93 18.86 17.94 16.84 15.65 14.44 13.18 11.80 10.39 8.85 7.41 176.70 148.92 122.53 98.71 76.48 54.17 33.67 13.81 -5.36 -23.83 -41.03 -57.10 -71.74 -24.12 -23.37 -22.08 -20.68 -19.38 -18.50 -17.80 -17.41 -17.25 -17.22 -17.40 -17.84 -18.28 0.80 6.98 8.80 4.63 -1.93 -11.42 -21.55 -32.42 -43.17 -53.97 -64.41 -74.10 -83.92 -11.86 -11.69 -10.82 -9.54 -8.31 -7.34 -6.41 -5.63 -4.78 -4.07 -3.41 -2.93 -2.53 -4.93 -48.17 -90.17 -126.09 -158.11 173.96 148.41 125.43 105.05 86.50 70.24 56.07 43.40 Device S-parameters are available for download off of the website at: http://www.wj.com Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 3 of 4 April 2007 EC1078 InGaP HBT Gain Block EC1078B-G Mechanical Information This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded (maximum 245°C reflow temperature) soldering processes. Outline Drawing Product Marking The component will be marked with an “1078G” designator with an alphanumeric lot code on the top surface of the package. The obsolete tin-lead package is marked with an “1078” designator followed by an alphanumeric lot code. Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating Land Pattern ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes Thermal Specifications Parameter Rating Operating Case Temperature Thermal Resistance, Rth -40 to +85 °C 128 °C/W 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 4 of 4 April 2007