WJA1021 +5V Active-Bias InGaP HBT Gain Block Product Features • • • • • • • • • • 50 – 4000 MHz 17.5 dB Gain @ 1.9GHz +19 dBm P1dB @ 1.9GHz +37.5 dBm OIP3 @ 1.9GHz +5V Single Supply Low current draw (90mA) Unconditionally stable Internally matched to 50 Ω Robust 1000V ESD, Class 1C Lead-free/green/RoHS-compliant SOT-89 package Applications • • • • GSM, PCS, CDMA, WCDMA WiMAX, WiBro Repeaters, BTS Transceivers RFID The WJA1021 is a cascadable gain block that offers high linearity in a low-cost surface-mount package. At 1.9 GHz, the WJA1021 typically provides 17.5 dB gain, +37.5 dBm OIP3, and +19 dBm P1dB. The device is housed in a leadfree/green/RoHS-compliant industry-standard SOT-89 SMT package using a NiPdAu plating to eliminate the possibility of tin whiskering. Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Device Voltage Device Current GND 4 The WJA1021 consists of Darlington pair amplifier using a high reliability InGaP/GaAs HBT process technology. The amplifier has been optimized internally to offer very high linearity performance at 1.9 GHz while drawing very low current. The MMIC amplifier is internally matched to 50Ω and only requires DC-blocking capacitors and a bias inductor for operation. An internal active bias is designed to enable stable performance over temperature and allow for operation directly from a +5V supply voltage. 1 2 3 RF IN GND RF OUT Function Input Output/Bias Ground Pin No. 1 3 2, 4 The broadband amplifier can be directly applied to various current and next generation wireless technologies such as GSM, CDMA, W-CDMA, WiBro, and WiMAX. The WJA1021 is ideal for general purpose applications such as LO buffering or amplification and pre-driver stages within the 50 to 4000 MHz frequency range. Specifications (1) Parameter Functional Diagram Product Description Typical Performance (3) Units Min MHz MHz dB dB dB dBm dBm dB V mA 50 16.1 +34 80 Typ 1900 17.5 -15 -10 +19 +37.4 6.3 5 90.5 Max Parameter Units 4000 Frequency S21 S11 S22 Output P1dB Output IP3 (2) Noise Figure MHz dB dB dB dBm dBm dB 19.1 Typical 200 19.5 -12 -20 +20.2 +37.8 5.3 900 18.4 -19 -13 +20.1 +39.8 5.6 1900 16.7 -29 -10 +19 +37.5 6.3 2100 16.4 -25 -10 +18 +36.9 6.6 3. Listed typical performance parameters measured on evaluation board. 100 1. Test conditions: 25 ºC, Supply Voltage = +5 V, 50 Ω System. S-parameters and 3OIP measured at device pins. All other specifications measured on evaluation board. 2. 3OIP measured with two tones at an output power of 3 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Storage Temperature Supply Voltage Thermal Resistance, Rth Junction Temperature Input Power Rating -55 to +150 °C +6.5 V 78.8 °C / W 150 °C +24 dBm Operation of this device above any of these parameters may cause permanent damage. Ordering Information Part No. WJA1021 WJA1021-PCB Description +5V Active Bias InGaP HBT Gain Block (lead-free/green/RoHS-compliant SOT-89 Package) 50 – 4000 MHz Fully Assembled Eval. Board Standard tape / reel size = 1000 pieces on a 7” reel Specifications and information are subject to change without notice TriQuint Semiconductor, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6633 • e-mail: [email protected] • Web site: www. TriQuint.com Page 1 of 4 April 2009 WJA1021 +5V Active-Bias InGaP HBT Gain Block Typical Evaluation Board RF Performance Supply Bias = +5V, Icc = 90 mA Return Loss vs. Frequency Gain vs. Frequency NFvs. Frequency 10 0 T=25°C 25 -5 8 15 10 5 -10 NF (dB) G a in (d B ) S11, S22 (dB) 20 -15 -20 +25C S11 2 S22 -35 1000 -40C +25C +85C +85C 0 0 4 -25 -30 -40C 6 2000 Frequency (MHz) 3000 0 0 4000 1000 2000 Frequency (MHz) 3000 4000 1000 2000 3000 Frequency(MHz) P1dB vs. Frequency OIP3 vs. Frequency Pout=3 dBm/tone 45 0 22 20 35 18 O IP 3 (d B m ) P 1 d B (d B m ) 40 16 30 14 25 12 20 +25°C -40°C +25°C +85°C -40°C +25°C 10 15 0 1000 2000 Frequency (MHz) 3000 4000 0 1000 2000 3000 4000 Frequency (MHz) Specifications and information are subject to change without notice TriQuint Semiconductor, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6633 • e-mail: [email protected] • Web site: www. TriQuint.com Page 2 of 4 April 2009 WJA1021 +5V Active-Bias InGaP HBT Gain Block Application Circuit Vcc =+5.00V Icc = 90 mA R4 0Ω C3 Bypass Capacitor L1 RF Choke RF IN RF OUT WJA1021 C2 Blocking Capacitor C1 Blocking Capacitor For optimal OIP3 performance, the ground plane to the left and right side around the backside paddle of the WJA1021 should be removed as shown in the above PCB layout. . Recommended Component Values (1) Ref. Name Value / Type L1 470 nH ferrite core wire wound inductor (2) C1, C2 1000 pF NPO chip capacitor C3 0.018 μF chip capacitor R4 0 Ω(3) C4, C5, C6, Do Not Place (3) R3, R5, R6, R7, R8 1. 2. 3. Size 0805 0603 0603 0603 The listed values are contained on the evaluation board to achieve optimal broadband performance For lower cost and performance (500 – 2000 MHz) option use 39 nH ceramic core wire wound inductor. Place holders for the 0Ω resistors and “Do Not Place” references are not needed for final design. Typical Device Data S-Parameters (Vdevice = +5 V, ICC = 90 mA, T = 25 °C, calibrated to device leads) Freq (GHz) S11 (dB) S11(ang) S21 (dB) S21 (ang) 10 -15.27 -76.97 22.78 168.92 50 -13.47 -152.73 20.29 167.37 100 -13.32 -167.56 19.92 167.89 200 -13.32 -176.11 19.69 162.64 400 -12.94 178.15 19.56 149.53 600 -12.38 175.26 19.41 135.79 800 -12.32 168.40 19.13 122.10 1000 -12.56 158.65 18.92 108.57 1200 -12.94 146.78 18.58 94.17 1400 -12.96 137.52 18.24 81.46 1590 -13.24 130.56 17.96 68.23 1600 -13.26 130.42 17.95 67.69 1800 -14.12 124.89 17.61 54.09 2000 -16.59 115.57 17.26 40.63 2200 -21.32 95.97 16.79 27.03 2400 -29.00 44.53 16.18 13.53 2600 -31.47 -55.07 15.66 0.14 2800 -22.56 -119.27 15.05 -13.34 3000 -16.22 -137.02 14.35 -27.33 3200 -12.35 -143.92 13.50 -40.56 3400 -10.00 -148.38 12.51 -53.24 3600 -8.71 -155.84 11.58 -65.24 3800 -7.94 -168.09 10.79 -76.83 4000 -7.03 175.94 9.72 -89.13 S12(dB) -25.80 -23.38 -23.14 -23.15 -23.10 -23.07 -23.01 -22.96 -23.04 -22.89 -22.87 -22.87 -22.79 -22.96 -22.94 -23.04 -23.06 -23.06 -23.15 -23.27 -23.47 -23.53 -23.40 -23.29 S12 (ang) 14.54 5.70 2.35 -0.19 -3.54 -6.98 -10.41 -12.83 -16.41 -20.13 -23.01 -22.74 -25.91 -29.81 -33.39 -36.47 -39.44 -42.87 -46.10 -49.30 -51.83 -54.62 -57.36 -61.41 S22 (dB) -10.81 -17.02 -18.91 -19.27 -19.05 -18.22 -16.64 -14.40 -12.71 -11.63 -11.35 -11.36 -11.04 -10.18 -8.81 -7.80 -7.42 -7.44 -7.52 -7.26 -6.61 -5.87 -5.50 -5.62 S22 (ang) -41.48 -114.67 -138.72 -150.77 -153.38 -155.49 -155.88 -155.90 -156.76 -159.26 -165.00 -165.60 -173.55 178.28 171.50 167.47 162.95 157.56 149.16 140.55 132.18 127.43 124.79 120.23 Device S-parameters are available for download from the website at: http://www.wj.com Specifications and information are subject to change without notice TriQuint Semiconductor, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6633 • e-mail: [email protected] • Web site: www. TriQuint.com Page 3 of 4 April 2009 WJA1021 +5V Active-Bias InGaP HBT Gain Block Mechanical Information This package is Lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Outline Drawing Product Marking The WJA1021 will be marked with an “A1021” designator with an alphanumeric lot code marked below the part designator. A1021 XXXX-X Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating Land Pattern ESD Rating: Value: Test: Standard: Class 1C Passes ≥ 1000V min. Human Body Model (HBM) JEDEC Standard JESD22-A114 ESD Rating: Value: Test: Standard: Class IV Passes ≥ 1000V min. Charged Device Model (CDM) JEDEC Standard JESD22-C101 MSL Rating: Level 3 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Specifications and information are subject to change without notice TriQuint Semiconductor, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6633 • e-mail: [email protected] • Web site: www. TriQuint.com Page 4 of 4 April 2009