CY62128BN MoBL® 1-Mbit (128K x 8) Static RAM Functional Description[1] Features • Temperature Ranges The CY62128BN is a high-performance CMOS static RAM organized as 128K words by 8 bits. Easy memory expansion is provided by an active LOW Chip Enable (CE1), an active HIGH Chip Enable (CE2), an active LOW Output Enable (OE), and tri-state drivers. This device has an automatic power-down feature that reduces power consumption by more than 75% when deselected. — Commercial: 0°C to 70°C — Industrial: –40°C to 85°C — Automotive-A: –40°C to 85°C — Automotive-E: –40°C to 125°C • 4.5V–5.5V operation Writing to the device is accomplished by taking Chip Enable One (CE1) and Write Enable (WE) inputs LOW and Chip Enable Two (CE2) input HIGH. Data on the eight I/O pins (I/O0 through I/O7) is then written into the location specified on the address pins (A0 through A16). • CMOS for optimum speed/power • Low active power (70 ns Commercial, Industrial, Automotive-A) — 82.5 mW (max.) (15 mA) Reading from the device is accomplished by taking Chip Enable One (CE1) and Output Enable (OE) LOW while forcing Write Enable (WE) and Chip Enable Two (CE2) HIGH. Under these conditions, the contents of the memory location specified by the address pins will appear on the I/O pins. • Low standby power (55/70 ns Commercial, Industrial, Automotive-A) — 110 µW (max.) (15 µA) • Automatic power-down when deselected • TTL-compatible inputs and outputs • Easy memory expansion with CE1, CE2, and OE options • Available in Pb-free and non-Pb-free 32-pin (450 mil-wide) SOIC, 32-pin STSOP and 32-pin TSOP-I The eight input/output pins (I/O0 through I/O7) are placed in a high-impedance state when the device is deselected (CE1 HIGH or CE2 LOW), the outputs are disabled (OE HIGH), or during a write operation (CE1 LOW, CE2 HIGH, and WE LOW). Logic Block Diagram Pin Configuration Top View SOIC I/O 0 INPUT BUFFER I/O 1 128K x 8 ARRAY I/O 2 SENSE AMPS ROW DECODER A0 A1 A2 A3 A4 A5 A6 A7 A8 I/O 3 I/O 4 I/O 5 COLUMN DECODER CE1 CE2 WE A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 GN G gnc g GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC A15 CE2 WE A13 A8 A9 A11 OE A10 CE1 I/O7 I/O6 I/O5 I/O4 I/O3 I/O 7 A9 A 10 A 11 A 12 A 13 A 14 A 15 A 16 OE I/O 6 POWER DOWN NC A16 A14 A12 Note: 1. For best-practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com. Cypress Semiconductor Corporation Document #: 001-06498 Rev. *A • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised August 3, 2006 [+] Feedback CY62128BN MoBL® Product Portfolio Power Dissipation VCC Range (V) Product CY62128BNLL Commercial Operating, ICC (mA) Standby, ISB2 (µA) Typ.[2] Max. Typ.[2] Max. Min. Typ.[2] Max. Speed (ns) 4.5 5.0 5.5 55 7.5 20 2.5 15 70 6 15 2.5 15 Industrial 55 7.5 20 2.5 15 70 6 15 2.5 15 Automotive-A 70 6 15 2.5 15 Automotive-E 70 6 25 2.5 25 Pin Configurations A11 A9 A8 A13 WE CE2 A15 VCC NC A16 A14 A12 A7 A6 A5 A4 25 26 27 28 29 30 31 32 1 2 3 4 5 6 7 8 STSOP Top View (not to scale) 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 OE A10 CE1 I/O7 I/O6 I/O5 I/O4 I/O3 GND I/O2 I/O1 I/O0 A0 A1 A2 A3 A11 A9 A8 A13 WE CE2 A15 VCC NC A16 A14 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 TSOP I Top View (not to scale) 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE1 I/O7 I/O6 I/O5 I/O4 I/O3 GND I/O2 I/O1 I/O0 A0 A1 A2 A3 Pin Definitions Input A0–A16. Address Inputs Input/Output I/O0–I/O7. Data lines. Used as input or output lines depending on operation Input/Control WE. Write Enable, Active LOW. When selected LOW, a WRITE is conducted. When selected HIGH, a READ is conducted. Input/Control CE1. Chip Enable 1, Active LOW. Input/Control CE2. Chip Enable 2, Active HIGH. Input/Control OE. Output Enable, Active LOW. Controls the direction of the I/O pins. When LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are tri-stated, and act as input data pins Ground GND. Ground for the device Power Supply VCC. Power supply for the device Note: 2. Typical values are included for reference only and are not tested or guaranteed. Typical values are an average of the distribution across normal production variations as measured at VCC = 5.0V, TA = 25°C, and tAA = 70 ns. Document #: 001-06498 Rev. *A Page 2 of 12 [+] Feedback CY62128BN MoBL® Maximum Ratings Static Discharge Voltage........................................... > 2001V (per MIL-STD-883, Method 3015) (Above which the useful life may be impaired. For user guidelines, not tested.) Latch-up Current..................................................... > 200 mA Storage Temperature ................................. –65°C to +150°C Operating Range Ambient Temperature with Power Applied............................................. –55°C to +125°C Range [3] Supply Voltage on VCC to Relative GND .... –0.5V to +7.0V DC Voltage Applied to Outputs in High-Z State[3] ....................................–0.5V to VCC + 0.5V DC Input Voltage[3] .................................–0.5V to VCC + 0.5V Commercial Industrial Ambient Temperature (TA)[4] VCC 0°C to +70°C 5V ± 10% –40°C to +85°C Automotive-A –40°C to +85°C Automotive-E –40°C to +125°C Current into Outputs (LOW) .........................................20 mA Electrical Characteristics Over the Operating Range -55 Parameter Description VOH Output HIGH Voltage Test Conditions VCC = Min., IOH = –1.0 mA Min. -70 Typ.[2] Max. 2.4 Min. Typ.[2] Max. 2.4 Unit V VOL Output LOW Voltage VCC = Min., IOL = 2.1 mA 0.4 V VIH Input HIGH Voltage 2.2 VCC + 0.3 2.2 VCC + 0.3 V VIL Input LOW Voltage[3] –0.3 0.8 –0.3 0.8 V IIX Input Leakage Current –1 +1 –1 +1 µA IOZ ICC ISB1 ISB2 Output Leakage Current VCC Operating Supply Current GND ≤ VI ≤ VCC GND ≤ VI ≤ VCC, Output Disabled VCC = Max., IOUT = 0 mA, f = fMAX = 1/tRC Commercial/ Industrial Automotive-A –1 +1 µA Automotive-E –10 +10 µA –1 +1 µA Commercial/ Industrial –1 +1 Automotive-A –1 +1 µA Automotive-E –10 +10 µA 6 15 mA Automotive-A 6 15 mA Automotive-E 6 25 mA 0.1 1 mA 0.1 1 mA 0.1 2 mA 2.5 15 µA Automotive-A 2.5 15 µA Automotive-E 2.5 25 µA Commercial/ Industrial Automatic CE Max. VCC, CE1 ≥ VIH Commercial/ Power-down Current or CE2 < VIL, Industrial —TTL Inputs VIN ≥ VIH or Automotive-A VIN ≤ VIL, f = fMAX Automotive-E Automatic CE Max. VCC, Power-down Current CE1 ≥ VCC – 0.3V, or CE2 ≤ 0.3V, —CMOS Inputs VIN ≥ VCC – 0.3V, or VIN ≤ 0.3V, f = 0 0.4 Commercial/ Industrial 7.5 0.1 2.5 20 2 15 Notes: 3. VIL (min.) = –2.0V for pulse durations of less than 20 ns. 4. TA is the “Instant On” case temperature. Document #: 001-06498 Rev. *A Page 3 of 12 [+] Feedback CY62128BN MoBL® Capacitance[5] Parameter Description CIN Input Capacitance COUT Output Capacitance Test Conditions Max. TA = 25°C, f = 1 MHz, VCC = 5.0V Unit 9 pF 9 pF Thermal Resistance[5] Parameter ΘJA Description Thermal Resistance (Junction to Ambient) ΘJC Thermal Resistance (Junction to Case) Test Conditions 32 SOIC 32 STSOP 32 TSOP Unit Test conditions follow standard test methods and procedures for measuring thermal impedance, per EIA / JESD51. 66.17 105.14 97.44 °C/W 30.87 14.09 26.05 °C/W AC Test Loads and Waveforms R1 1800Ω R1 1800Ω 5V ALL INPUT PULSES 5V OUTPUT VCC 90% OUTPUT 100 pF R2 990Ω R2 990Ω 5 pF INCLUDING JIG AND SCOPE (a) GND INCLUDING JIG AND SCOPE (b) 90% 10% 10% Fall TIme: 1 V/ns Rise TIme: 1 V/ns Equivalent to: THÉVENIN EQUIVALENT 639Ω 1.77V OUTPUT Data Retention Waveform VCC, min. tCDR VCC DATA RETENTION MODE VDR > 2V VCC, min. tR CE1 or CE2 Data Retention Characteristics (Over the Operating Range) Parameter Description VDR VCC for Data Retention ICCDR Data Retention Current tCDR Chip Deselect to Data Retention Time Conditions[6] Min. Max. Unit 1.5 15 µA 1.5 25 µA 2.0 VCC = VDR = 2.0V, CE1 ≥ VCC – 0.3V, or CE2 ≤ 0.3V, VIN ≥ VCC – 0.3V or, VIN ≤ 0.3V Commercial/ Industrial Automotive-A Automotive-E Operation Recovery Time tR Note: 5. Tested initially and after any design or process changes that may affect these parameters. 6. No input may exceed VCC + 0.5V. Document #: 001-06498 Rev. *A Typ. V 0 ns 70 ns Page 4 of 12 [+] Feedback CY62128BN MoBL® Switching Characteristics[7] Over the Operating Range CY62128BN-55 Parameter Description Min. Max. CY62128BN-70 Min. Max. Unit READ CYCLE tRC Read Cycle Time 55 tAA Address to Data Valid tOHA Data Hold from Address Change tACE CE1 LOW to Data Valid, CE2 HIGH to Data Valid 55 70 ns tDOE OE LOW to Data Valid 20 35 ns tLZOE OE LOW to Low Z tHZOE OE HIGH to High Z[7, 9] 25 ns tLZCE CE1 LOW to Low Z, CE2 HIGH to Low Z[9] 55 5 70 5 CE1 HIGH to High Z, CE2 LOW to High tPU CE1 LOW to Power-up, CE2 HIGH to Power-up tPD CE1 HIGH to Power-down, CE2 LOW to Power-down ns 5 20 0 ns 25 0 55 ns ns 0 20 Z[8, 9] ns 5 0 tHZCE WRITE CYCLE 70 ns ns 70 ns [10] tWC Write Cycle Time 55 70 ns tSCE CE1 LOW to Write End, CE2 HIGH to Write End 45 60 ns tAW Address Set-up to Write End 45 60 ns tHA Address Hold from Write End 0 0 ns tSA Address Set-up to Write Start 0 0 ns tPWE WE Pulse Width 45 50 ns tSD Data Set-up to Write End 25 30 ns tHD Data Hold from Write End 0 0 ns 5 5 ns tLZWE tHZWE WE HIGH to Low Z[9] WE LOW to High Z[8, 9] 20 25 ns Switching Waveforms Read Cycle No.1[11, 12] tRC ADDRESS tAA tOHA DATA OUT PREVIOUS DATA VALID DATA VALID Notes: 7. Test conditions assume signal transition time of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified IOL/IOH and 100-pF load capacitance. 8. tHZOE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in (b) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage. 9. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device. 10. The internal write time of the memory is defined by the overlap of CE1 LOW, CE2 HIGH, and WE LOW. CE1 and WE must be LOW and CE2 HIGH to initiate a write, and the transition of any of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write. 11. Device is continuously selected. OE, CE1 = VIL, CE2 = VIH. 12. WE is HIGH for read cycle. Document #: 001-06498 Rev. *A Page 5 of 12 [+] Feedback CY62128BN MoBL® Switching Waveforms (continued) Read Cycle No. 2 (OE Controlled)[12, 13] ADDRESS tRC CE1 CE2 tACE OE tHZOE tDOE DATA OUT tHZCE tLZOE HIGH IMPEDANCE DATA VALID tLZCE VCC SUPPLY CURRENT HIGH IMPEDANCE tPD tPU ICC 50% 50% ISB Write Cycle No. 1 (CE1 or CE2 Controlled)[14, 15] tWC ADDRESS tSCE CE1 tSA CE2 tSCE tAW tHA tPWE WE tSD DATA I/O tHD DATA VALID Notes: 13. Address valid prior to or coincident with CE1 transition LOW and CE2 transition HIGH. 14. Data I/O is high impedance if OE = VIH. 15. If CE1 goes HIGH or CE2 goes LOW simultaneously with WE going HIGH, the output remains in a high-impedance state. Document #: 001-06498 Rev. *A Page 6 of 12 [+] Feedback CY62128BN MoBL® Switching Waveforms (continued) Write Cycle No. 2 (WE Controlled, OE HIGH During Write)[14, 15] tWC ADDRESS tSCE CE1 CE2 tSCE tAW tHA tSA tPWE WE OE tSD DATA I/O tHD DATAIN VALID NOTE 16 tHZOE Write Cycle No.3 (WE Controlled, OE LOW)[14, 15] tWC ADDRESS tSCE CE1 CE2 tSCE tAW tSA tHA tPWE WE tSD DATAI/O NOTE 16 tHD DATA VALID tHZWE tLZWE Note: 16. During this period the I/Os are in the output state and input signals should not be applied. Document #: 001-06498 Rev. *A Page 7 of 12 [+] Feedback CY62128BN MoBL® Truth Table CE1 CE2 OE WE I/O0–I/O7 Mode Power H X X X High Z Power-down Standby (ISB) X L X X High Z Power-down Standby (ISB) L H L H Data Out Read Active (ICC) L H X L Data In Write Active (ICC) L H H H High Z Selected, Outputs Disabled Active (ICC) Ordering Information Speed (ns) 55 Ordering Code Package Diagram CY62128BNLL-55SC 51-85081 32-pin 450-Mil SOIC CY62128BNLL-55SXC 32-pin 450-Mil SOIC (Pb-Free) CY62128BNLL-55SI 32-pin 450-Mil SOIC CY62128BNLL-55SXI CY62128BNLL-55ZAI CY62128BNLL-55ZI 32-pin STSOP 51-85056 32-pin TSOP Type I 51-85081 32-pin 450-Mil SOIC 51-85056 32-pin TSOP Type I 32-pin TSOP Type I (Pb-Free) 51-85081 32-pin 450-Mil SOIC 51-85094 32-pin STSOP 51-85056 32-pin TSOP Type I 51-85056 32-pin TSOP Type I (Pb-Free) CY62128BNLL-70SXI CY62128BNLL-70ZAI 32-pin STSOP (Pb-Free) CY62128BNLL-70ZXI CY62128BNLL-70ZXA Industrial 32-pin 450-Mil SOIC (Pb-Free) CY62128BNLL-70ZAXI CY62128BNLL-70ZI Commercial 32-pin 450-Mil SOIC (Pb-Free) CY62128BNLL-70ZXC CY62128BNLL-70SI Industrial 32-pin TSOP Type I (Pb-Free) CY62128BNLL-70SXC CY62128BNLL-70ZC Commercial 32-pin STSOP (Pb-Free) CY62128BNLL-55ZXI CY62128BNLL-70SC Operating Range 32-pin 450-Mil SOIC (Pb-Free) 51-85094 CY62128BNLL-55ZAXI 70 Package Type 32-pin TSOP Type I (Pb-Free) CY62128BNLL-70SXA 51-85081 32-pin 450-Mil SOIC (Pb-Free) CY62128BNLL-70SXE 51-85081 32-pin 450-Mil SOIC (Pb-Free) CY62128BNLL-70ZAXE 51-85094 32-pin STSOP (Pb-Free) Automotive-A Automotive-E Please contact your local Cypress sales representative for availability of these parts Document #: 001-06498 Rev. *A Page 8 of 12 [+] Feedback CY62128BN MoBL® Package Diagrams 32-pin (450 Mil) Molded SOIC (51-85081) 16 1 0.546[13.868] 0.566[14.376] 0.440[11.176] 0.450[11.430] 17 32 0.793[20.142] 0.817[20.751] 0.006[0.152] 0.012[0.304] 0.101[2.565] 0.111[2.819] 0.118[2.997] MAX. 0.004[0.102] 0.050[1.270] BSC. 0.004[0.102] MIN. 0.014[0.355] 0.020[0.508] SEATING PLANE Document #: 001-06498 Rev. *A 0.047[1.193] 0.063[1.600] 0.023[0.584] 0.039[0.990] 51-85081-*B Page 9 of 12 [+] Feedback CY62128BN MoBL® Package Diagrams (continued) 32-pin STSOP (8 x 13.4 mm) (51-85094) 51-85094-*D Document #: 001-06498 Rev. *A Page 10 of 12 [+] Feedback CY62128BN MoBL® Package Diagrams (continued) 32-pin TSOP Type I (8 x 20 mm) (51-85056) 51-85056-*D All product and company names mentioned in this document are the trademarks of their respective holders. Document #: 001-06498 Rev. *A Page 11 of 12 © Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. [+] Feedback CY62128BN MoBL® Document History Page Document Title: CY62128BN MoBL® 1-Mbit (128K x 8) Static RAM Document Number: 001-06498 REV. ECN NO. Issue Date Orig. of Change ** 426503 See ECN NXR New Data Sheet *A 488954 See ECN NXR Added Automotive product Removed RTSOP Package Updated ordering Information table Document #: 001-06498 Rev. *A Description of Change Page 12 of 12 [+] Feedback