CYPRESS CY7C1021BN-12ZC

CY7C1021BN
CY7C10211BN
1-Mbit (64K x 16) Static RAM
Features
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O1 through I/O8), is
written into the location specified on the address pins (A0
through A15). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O9 through I/O16) is written into the location
specified on the address pins (A0 through A15).
• Temperature Ranges
— Commercial: 0°C to 70°C
— Industrial: –40°C to 85°C
— Automotive-A: –40°C to 85°C
Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O1 to I/O8. If Byte High Enable (BHE) is
LOW, then data from memory will appear on I/O9 to I/O16. See
the truth table at the back of this data sheet for a complete
description of read and write modes.
— Automotive-E: –40°C to 125°C
• High speed
— tAA = 10 ns (Commercial)
— tAA = 15 ns (Automotive)
• CMOS for optimum speed/power
• Low active power
— 825 mW (max.)
• Automatic power-down when deselected
• Independent control of upper and lower bits
• Available in Pb free and non Pb free 44-pin TSOP II and
44-pin 400-mil-wide SOJ
Functional Description[1]
The CY7C1021BN/CY7C10211BN is a high-performance
CMOS static RAM organized as 65,536 words by 16 bits. This
device has an automatic power-down feature that significantly
reduces power consumption when deselected.
The input/output pins (I/O1 through I/O16) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE
are disabled (BHE, BLE HIGH), or during a write operation (CE
LOW, and WE LOW).
The CY7C1021BN/CY7C10211BN is available in standard
44-pin TSOP Type II and 44-pin 400-mil-wide SOJ packages.
Customers should use part number CY7C10211BN when
ordering parts with 10 ns tAA, and CY7C1021BN when
ordering 12 ns and 15 ns tAA.
Logic Block Diagram
PinConfigurations
64K x 16
RAM Array
512 X 2048
SOJ / TSOP II
Top View
SENSE AMPS
A7
A6
A5
A4
A3
A2
A1
A0
ROW DECODER
DATA IN
DRIVERS
A4
A3
A2
A1
A0
CE
I/O1
I/O2
I/O3
I/O4
VCC
VSS
I/O5
I/O6
I/O7
I/O8
WE
A15
A14
A13
A12
NC
I/O1–I/O8
I/O9–I/O16
COLUMN DECODER
A8
A9
A10
A11
A12
A13
A14
A15
BHE
WE
CE
OE
BLE
1
44
2
3
43
42
4
41
40
39
38
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A5
A6
A7
OE
BHE
BLE
I/O16
I/O15
I/O14
I/O13
VSS
VCC
I/O12
I/O11
I/O10
I/O9
NC
A8
A9
A10
A11
NC
Note:
1. For best-practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com
Cypress Semiconductor Corporation
Document #: 001-06494 Rev. *A
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised September 28, 2006
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CY7C1021BN
CY7C10211BN
Selection Guide
Maximum Access Time (ns)
Maximum Operating Current (mA)
Com’l / Ind’l
7C10211B-10
7C1021B-12
7C1021B-15
10
12
15
150
140
130
Automotive-A
130
Automotive-E
130
Maximum CMOS Standby Current (mA) Com’l / Ind’l
Com’l / Ind’l (L version)
10
10
0.5
0.5
10
0.5
Automotive-A (L version)
0.5
Automotive-E
15
Pin Definitions
Pin Name
SOJ, TSOP–Pin Number
A0–A15
1–5,18–21, 24–27, 42–44
I/O1–I/O16
7–10, 13–16, 29–32,
35–38
I/O Type
Input
Description
Address Inputs used to select one of the address locations.
Input/Output Bidirectional Data I/O lines. Used as input or output lines depending
on operation.
NC
22, 23, 28
WE
17
Input/Control Write Enable Input, active LOW. When selected LOW, a Write is
conducted. When deselected HIGH, a Read is conducted.
CE
6
Input/Control Chip Enable Input, active LOW. When LOW, selects the chip. When
HIGH, deselects the chip.
BHE, BLE
40, 39
Input/Control Byte Write Select Inputs, active LOW. BHE controls I/O16–I/O9,
BLE controls I/O8–I/O1, .
OE
41
Input/Control Output Enable, active LOW. Controls the direction of the I/O pins.
When LOW, the I/O pins are allowed to behave as outputs. When
deasserted HIGH, I/O pins are tri-stated, and act as input data pins.
VSS
12, 34
VCC
11, 33
Document #: 001-06494 Rev. *A
No Connect
Ground
No Connects. Not connected to the die.
Ground for the device. Should be connected to ground of the
system.
Power Supply Power Supply inputs to the device.
Page 2 of 10
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CY7C1021BN
CY7C10211BN
Maximum Ratings
Static Discharge Voltage............................................ >2001V
(per MIL-STD-883, Method 3015)
(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature ................................. –65°C to +150°C
Latch-Up Current ..................................................... >200 mA
Operating Range
Ambient Temperature with
Power Applied............................................. –55°C to +125°C
Range
Ambient
Temperature (TA)[3]
VCC
0°C to +70°C
5V ± 10%
Supply Voltage on VCC Relative to GND[2] .... –0.5V to +7.0V
Commercial
DC Voltage Applied to Outputs
in High Z State[2] ......................................–0.5V to VCC+0.5V
Industrial
–40°C to +85°C
Automotive-A
–40°C to +85°C
Automotive-E
–40°C to +125°C
DC Input Voltage[2] ...................................–0.5V to VCC+0.5V
Current into Outputs (LOW) .........................................20 mA
Electrical Characteristics Over the Operating Range
Parameter
-10
Test
Conditions
Description
Min.
-12
Max.
Min.
-15
Max.
VOH
Output HIGH
Voltage
VCC = Min., IOH = –4.0 mA
VOL
Output LOW
Voltage
VCC = Min., IOL = 8.0 mA
VIH
Input HIGH
Voltage
2.2
6.0
2.2
6.0
VIL
Input LOW
Voltage[2]
−0.5
0.8
–0.5
IIX
Input Leakage
Current
−1
+1
–1
GND < VI < VCC
2.4
2.4
0.4
ICC
ISB1
ISB2
VCC Operating VCC = Max.,
Supply Current IOUT = 0 mA,
f = fMAX = 1/tRC
Unit
V
0.4
V
2.2
6.0
V
0.8
–0.5
0.8
V
+1
–1
+1
µA
–1
+1
µA
–4
+4
µA
–1
+1
µA
Automotive-A
–1
+1
µA
Automotive-E
–4
+4
µA
130
mA
Com’l / Ind’l
0.4
Automotive-A
Output Leakage GND < VI < VCC,
Current
Output Disabled
Max.
2.4
Automotive-E
IOZ
Min.
−1
Com’l / Ind’l
Com’l / Ind’l
+1
150
–1
+1
140
Automotive-A
130
Automotive-E
130
Automatic CE
Power-Down
Current—TTL
Inputs
Max. VCC,
Com’l / Ind’l
CE > VIH
Automotive-A
VIN > VIH or
VIN < VIL, f = fMAX Automotive-E
40
40
40
Automatic CE
Power-Down
Current—
CMOS Inputs
Max. VCC,
Com’l / Ind’l
CE > VCC – 0.3V,
Com’l / Ind’l (L)
VIN > VCC – 0.3V,
or VIN < 0.3V, f = 0 Automotive-A (L)
10
10
10
0.5
0.5
0.5
mA
40
50
mA
0.5
Automotive-E
15
Capacitance[4]
Parameter
Description
CIN
Input Capacitance
COUT
Output Capacitance
Test Conditions
TA = 25°C, f = 1 MHz,
VCC = 5.0V
Max.
Unit
8
pF
8
pF
Notes:
2. VIL (min.) = –2.0V and VIH(max) = VCC + 0.5V for pulse durations of less than 20 ns.
3. TA is the “Instant On” case temperature.
4. Tested initially and after any design or process changes that may affect these parameters.
Document #: 001-06494 Rev. *A
Page 3 of 10
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CY7C1021BN
CY7C10211BN
Thermal Resistance[4]
Parameter
ΘJA
Description
Test Conditions
44-pin SOJ
44-pin TSOP-II
Unit
64.32
76.89
°C/W
31.03
14.28
°C/W
Thermal Resistance Test conditions follow standard test methods
(Junction to Ambient) and procedures for measuring thermal
Thermal Resistance impedance, per EIA / JESD51.
ΘJC
(Junction to Case)
AC Test Loads and Waveforms
R 481Ω
5V
R 481Ω
5V
OUTPUT
ALL INPUT PULSES
3.0V
90%
OUTPUT
R2
255
255Ω
30 pF
R2
255
255Ω
5 pF
INCLUDING
JIG AND
SCOPE
(a)
INCLUDING
JIG AND
SCOPE
(b)
OUTPUT
Equivalent to: THÉVENIN
EQUIVALENT
167
90%
10%
10%
GND
Rise Time: 1 V/ns
Fall Time: 1 V/ns
1.73V
30 pF
Switching Characteristics[5] Over the Operating Range
7C10211B-10
Parameter
Description
Min.
Max.
7C1021B-12
Min.
Max.
7C1021B-15
Min.
Max.
Unit
Read Cycle
tRC
Read Cycle Time
tAA
Address to Data Valid
tOHA
Data Hold from Address Change
tACE
CE LOW to Data Valid
10
12
15
ns
tDOE
OE LOW to Data Valid
5
6
7
ns
tLZOE
OE LOW to Low
10
Z[6]
10
3
tHZOE
OE HIGH to High
CE LOW to Low Z[6]
12
5
15
6
ns
7
3
ns
ns
tHZCE
CE HIGH to High
tPU
CE LOW to Power-Up
tPD
CE HIGH to Power-Down
10
12
15
ns
tDBE
Byte Enable to Data Valid
5
6
7
ns
tLZBE
Byte Enable to Low Z
tHZBE
Byte Disable to High Z
0
6
ns
ns
0
3
5
ns
3
0
3
Z[6, 7]
15
3
0
Z[6, 7]
tLZCE
12
0
0
0
0
5
7
ns
0
6
ns
ns
7
ns
Notes:
5. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
IOL/IOH and 30-pF load capacitance.
6. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.
7. tHZOE, tHZBE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state
voltage.
Document #: 001-06494 Rev. *A
Page 4 of 10
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CY7C1021BN
CY7C10211BN
Switching Characteristics[5] Over the Operating Range (continued)
7C10211B-10
Parameter
Write Cycle
Description
Min.
7C1021B-12
Max.
Min.
Max.
7C1021B-15
Min.
Max.
Unit
[8]
tWC
Write Cycle Time
10
12
15
ns
tSCE
CE LOW to Write End
8
9
10
ns
tAW
Address Set-Up to Write End
7
8
10
ns
tHA
Address Hold from Write End
0
0
0
ns
tSA
Address Set-Up to Write Start
0
0
0
ns
tSD
Data Set-Up to Write End
5
6
8
ns
tHD
Data Hold from Write End
0
0
0
ns
3
3
3
ns
[6]
WE HIGH to Low Z
tLZWE
[6, 7]
tHZWE
WE LOW to High Z
tBW
Byte Enable to End of Write
5
7
6
7
8
9
ns
ns
Switching Waveforms
Read Cycle No. 1[9, 10]
tRC
ADDRESS
tAA
tOHA
DATA OUT
PREVIOUS DATA VALID
DATA VALID
Read Cycle No. 2 (OE Controlled)[10, 11]
ADDRESS
tRC
CE
tACE
OE
tHZOE
tDOE
BHE, BLE
tLZOE
tHZCE
tDBE
tLZBE
DATA OUT
HIGH IMPEDANCE
tLZCE
VCC
SUPPLY
CURRENT
tHZBE
HIGH
IMPEDANCE
DATA VALID
tPD
tPU
50%
IICC
CC
50%
IISB
SB
Notes:
8. The internal write time of the memory is defined by the overlap of CE LOW, WE LOW and BHE / BLE LOW. CE, WE and BHE / BLE must be LOW to initiate a
write, and the transition of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that
terminates the write.
9. Device is continuously selected. OE, CE, BHE and/or BHE = VIL.
10. WE is HIGH for read cycle.
Document #: 001-06494 Rev. *A
Page 5 of 10
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CY7C1021BN
CY7C10211BN
Switching Waveforms (continued)
Write Cycle No. 1 (CE Controlled)[12, 13]
tWC
ADDRESS
CE
tSA
tSCE
tAW
tHA
tPWE
WE
tBW
BHE, BLE
tSD
tHD
DATA I/O
Write Cycle No. 2 (BLE or BHE Controlled)
tWC
ADDRESS
BHE, BLE
tSA
tBW
tAW
tHA
tPWE
WE
tSCE
CE
tSD
tHD
DATA I/O
Notes:
11. Address valid prior to or coincident with CE transition LOW.
12. Data I/O is high impedance if OE or BHE and/or BLE= VIH.
13. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state.
Document #: 001-06494 Rev. *A
Page 6 of 10
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CY7C1021BN
CY7C10211BN
Switching Waveforms (continued)
Write Cycle No. 3 (WE Controlled, OE LOW)
tWC
ADDRESS
tSCE
CE
tAW
tHA
tSA
tPWE
WE
tBW
BHE, BLE
tHZWE
tSD
tHD
DATA I/O
tLZWE
Truth Table
CE
OE
H
X
X
X
X
High Z
High Z
Power-Down
Standby (ISB)
L
L
H
L
L
Data Out
Data Out
Read - All bits
Active (ICC)
L
H
Data Out
High Z
Read - Lower bits only
Active (ICC)
H
L
High Z
Data Out
Read - Upper bits only
Active (ICC)
L
L
Data In
Data In
Write - All bits
Active (ICC)
L
H
Data In
High Z
Write - Lower bits only
Active (ICC)
H
L
High Z
Data In
Write - Upper bits only
Active (ICC)
L
X
WE
L
BLE
BHE
I/O1–I/O8
I/O9–I/O16
Mode
Power
L
H
H
X
X
High Z
High Z
Selected, Outputs Disabled
Active (ICC)
L
X
X
H
H
High Z
High Z
Selected, Outputs Disabled
Active (ICC)
Document #: 001-06494 Rev. *A
Page 7 of 10
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CY7C1021BN
CY7C10211BN
Ordering Information
Speed
(ns)
Package
Diagram
Ordering Code
10
12
CY7C10211BN-10ZXC
51-85087
44-pin TSOP Type II
Commercial
CY7C1021BN-12VC
51-85082
44-pin (400-Mil) Molded SOJ
Commercial
CY7C1021BN-12VXC
44-pin (400-Mil) Molded SOJ (Pb-Free)
CY7C1021BN-12ZC
51-85087
CY7C1021BN-12ZXC
44-pin TSOP Type II
44-pin TSOP Type II (Pb-Free)
CY7C1021BN-12VI
51-85082
CY7C1021BN-12VXI
15
Operating
Range
Package Type
44-pin (400-Mil) Molded SOJ
Industrial
44-pin (400-Mil) Molded SOJ (Pb-Free)
CY7C1021BN-15VC
51-85082
CY7C1021BN-15VXC
44-pin (400-Mil) Molded SOJ
Commercial
44-pin (400-Mil) Molded SOJ (Pb-Free)
CY7C1021BNL-15VXC
CY7C1021BN-15ZC
44-pin (400-Mil) Molded SOJ (Pb-Free)
51-85087
44-pin TSOP Type II
CY7C1021BN-15ZXC
44-pin TSOP Type II (Pb-Free)
CY7C1021BNL-15ZC
44-pin TSOP Type II
CY7C1021BNL-15ZXC
CY7C1021BN-15VI
44-pin TSOP Type II (Pb-Free)
51-85082
44-pin (400-Mil) Molded SOJ
51-85087
44-pin TSOP Type II
CY7C1021BN-15VXI
Industrial
44-pin (400-Mil) Molded SOJ (Pb-Free)
CY7C1021BN-15ZI
CY7C1021BNL-15ZI
44-pin TSOP Type II
CY7C1021BN-15ZXI
44-pin TSOP Type II (Pb-Free)
CY7C1021BNL-15ZXI
44-pin TSOP Type II (Pb-Free)
CY7C1021BNL-15ZSXA
51-85087
44-pin TSOP Type II (Pb-Free)
Automotive-A
Automotive-E
CY7C1021BN-15VXE
51-85082
44-pin (400-Mil) Molded SOJ (Pb-Free)
CY7C1021BN-15ZSXE
51-85087
44-pin TSOP Type II (Pb-Free)
Package Diagrams
44-pin (400-Mil) Molded SOJ (51-85082)
44
23
DIMENSIONS IN INCHES MIN.
MAX.
0.395
0.405
0.435
0.445
22
1
SEATING PLANE
1.120
1.130
0.095
0.115
0.045
MAX.
0.128
0.148
0.023
0.033
0.013
0.023
Document #: 001-06494 Rev. *A
0.082
MIN.
0.007
0.013
0.004
0.050
TYP.
0.025
MIN.
0.365
0.375
0°-10°
51-85082-*B
Page 8 of 10
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CY7C1021BN
CY7C10211BN
Package Diagrams (continued)
44-Pin TSOP II (51-85087)
51-85087-*A
All products and company names mentioned in this document may be the trademarks of their respective holders.
Document #: 001-06494 Rev. *A
Page 9 of 10
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
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CY7C10211BN
Document History Page
Document Title: CY7C1021BN/CY7C10211BN (64K x 16) Static RAM
Document Number: 001-06494
REV.
ECN NO. Issue Date
Orig. of
Change
Description of Change
**
423877
See ECN
NXR
New Data Sheet
*A
505726
See ECN
NXR
Removed IOS parameter from DC Electrical Characteristics table.
Added Automotive products
Updated ordering Information table
Document #: 001-06494 Rev. *A
Page 10 of 10
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