RICHTEK RT9205_07

RT9205/A
Preliminary
Dual Regulators - Synchronous Buck PWM DC-DC and
Linear Controller
General Description
Features
The RT9205/A is a dual-output power controllers designed
for high performance graphics cards and personal
computers. The IC integrates a synchronous buck
controller, a linear controller and protection functions into
a small 14-pin package.
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The RT9205/A uses an internal compensated voltage
mode PWM control for simplying design. An internal 0.8V
reference allows the output voltage to be precisely
regulated to meet low output voltage requirement. A fixed
300kHz oscillation frequency reduces the component size
for saving board area.
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The RT9205/A also features over voltage protection
(OVP) and under voltage lock-out (UVLO).
Ordering Information
Applications
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RT9205/A
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Package Type
S : SOP-14
Operating Temperature Range
P : Pb Free with Commercial Standard
G : Green (Halogen Free with Commercial Standard)
UVP : Hiccup Node
UVP : Latch Mode
Note :
Operates at 5V
0.8V Internal Reference
Drives Two N-MOSFET
Voltage Mode PWM Control
Fast Transient Response
Fixed 300kHz Oscillator Frequency
Dynamic 0 to 100% Duty Cycle
Internal PWM Loop Compensation
Internal Soft-Start
Adaptive Non-Overlapping Gate Driver
Over-Voltage Protection Uses Lower MOSFET
RoHS Compliant and 100% Lead (Pb)-Free
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PC Motherboard
Cable Modems, Set-Top-Box, and XDSL Modems
DSP and Core Communications Processor Supplies
Memory Power Supplies
Personal Computer Peripherals
Industrial Power Supplies
5V Input DC-DC Regulators
Low Voltage Distributed Power Supplies
Graphic Cards
Pin Configurations
RichTek Pb-free and Green products are :
}RoHS compliant and compatible with the current require-
(TOP VIEW)
ments of IPC/JEDEC J-STD-020.
}Suitable for use in SnPb or Pb-free soldering processes.
}100%matte tin (Sn) plating.
LGATE
PGND
GND
VCC
DRV
FBL
NC
2
3
4
5
6
7
14
13
12
11
10
9
8
UGATE
BOOT
NC
NC
NC
FB
NC
SOP-14
DS9205/A-08 March 2007
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1
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2
10nF
+
120
R2<1K
2
3
9
1
14
13
200
0.1uF
1N5819
10nF
200
Phase
1uF
VOUT1 = 0.8V*(1+R3/R4)
D2 5
D1 7
D2 6
PHKD6N02LT
8
S1
D1
2 G1
3 S2
4 G2
1
Phas
e
1uH
Be Careful during Layout
5V
5uH
680uF
1uF
680uF LESR
VOUT1
1.6V
Pull FB trace out after COUT
680uF LESR
+
470uF
LGATE
UGATE
FB
RT9205/A
PGND GND
FBL
DRV
1uF
VCC
BOOT
4
5V
+
1uF
390
5
0.8V 6
100uF
+
+
3.4V
VOUT2 = 0.8V*(1+R1/R2)
VOUT2
2SD1802
5V
RT9205/A
Preliminary
Typical Application Circuit
Figure 1. RT9205/A powered form 5V
DS9205/A-08 March 2007
DS9205/A-08 March 2007
470uF
+
1uF
10nF
200
R2<1K
PGND
FB
GND
3
RT9205/A
LGATE
9
1
14
200
10nF
200
PHB108NQ03LT
PHB66NQ03LT
1uH
1uF
1000uF
V OUT1 = 0.8V*(1+R3/R4)
Phase
Be Careful during Layout
1000uF 5uH
1uF
1nF
LESR
1nF
LESR
1.7V
V OUT1
Pull FB trace out after C OUT
1nF
LESR
+
430
FBL
UGATE
13
BOOT
0.1uF
5V
+
0.8V 6
DRV
4
VCC
10
+
Suggest use Transistor
5
1uF
0
12V
+
2.5V
V OUT2 = 0.8V*(1+R1/R2)
V OUT2
100uF
+
+
2SD5706
3.3V
5V
Preliminary
RT9205/A
Figure 2. RT9205/A powered from 12V
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3
RT9205/A
Preliminary
+
MU
COUT
1000uF
CVCC
1uF
G
CBOOT
CIN1
1uF
C IN2
470uF
ML
BOOT
VCC
S
+
GND
D
L
5uH
D
0.1uF
RT9205/A
G
S
GND Return
Layout Placement
Layout Notes
1. Put C1 & C2 to be near the MU drain and ML source nodes.
2. Put RT9205/A to be near the COUT
3. Put CBOOT as close as to BOOT pin
4. Put CVCC as close as to VCC pin
Function Block Diagram
6.0V
Regulation
VCC
VCC
LDO
Power on
Reset
+
+
DRV
BOOT
-
FBL
Soft Start
0.8
Reference
-
UVP
+
1V -
OVP
UGATE
+
0.5V +UVP
0.8V
FB
+
-
SS
Error
Amplifier
Control
Logic
+
+PWM
-
VCC
LGATE
GND
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4
300kHz
Oscillator
DS9205/A-08 March 2007
Preliminary
RT9205/A
Functional Pin Description
LGATE (Pin 1)
BOOT (Pin 13)
Connect the LGATE pin to the gate of lower MOSFET.
This pin provides the gate drive for the lower MOSFET.
This pin provides ground referenced bias voltage to the
upper MOSFET driver. A bootstrap circuit is used to create
a voltage that is suitable for driving a logic-level N-MOSFET
when operating at a single 5V power supply. This pin also
could be powered from ATX 12V, in this situation, an internal
6.0V regulator will supply to VCC pin for generating bias
required inside the IC.
PGND/GND (Pin 2, 3)
Signal and power ground for the IC. All voltage levels are
measured with respect to this pin.
VCC (Pin 4)
This is the main bias supply for the RT9205/A. This pin
also provides the gate bias charge for the gate of lower
MOSFET. The voltage at this pin is monitored for ensuring
a proper power-on reset (POR). This pin is also the out
of an internal 6.0V regulator that powered from the BOOT
pin when the BOOT pin is directly powered from ATX
12V.
UGATE (Pin 14)
Connect the UGATE pin to the gate of upper MOSFET.
This pin provides the gate drive for the upper MOSFET.
NC (Pin 7,8,10,11,12)
No Connection.
DRV (Pin 5)
This pin is the output of a linear controller. It should be
connected to the base of an external bypass NPN
transistor or the gate of a N-MOSFET to form a linear low
dropout regulator.
FBL (Pin 6)
This pin is connected to the output resistor-divider of an
external power transistor or a N-MOSFET based low
dropout regulator for regulating and monitoring the output
voltage. This pin is also connected to the protection
monitor and the invertering input of error amplifier of
internal linear regulator inside the IC.
FB (Pin 9)
This pin is connected to the PWM converter's output-divider
for regulating and monitoring the output voltage of buck
converter. This pin also connects to the protection monitor
and the inverting input of internal PWM error amplifier inside
the IC.
DS9205/A-08 March 2007
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5
RT9205/A
Preliminary
Absolute Maximum Ratings
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Supply Voltage VCC ------------------------------------------------------------------------------------------------ 7V
BOOT & UGATE to GND ------------------------------------------------------------------------------------------- 19V
Input, Output or I/O Voltage --------------------------------------------------------------------------------------- GND-0.3V to 7V
Package Thermal Resistance
SOP-14, θJA ----------------------------------------------------------------------------------------------------------------------------------------------------- 160° C/W
Ambient Temperature Range -------------------------------------------------------------------------------------- 0° C to +70°C
Junction Temperature Range -------------------------------------------------------------------------------------- −40° C to +125°C
Storage Temperature Range --------------------------------------------------------------------------------------- −65° C to +150°C
Lead Temperature (Soldering, 10 sec.) -------------------------------------------------------------------------- 260°C
CAUTION:
Stresses beyond the ratings specified in “ Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress only rating and operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied.
Electrical Characteristics
(VCC = 5V, TA = 25° C, Unless otherwise specified.)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
VCC Supply Current
Nominal Supply Current
ICC
UGATE, LGATE open
--
3
--
mA
VCC Regulated Voltage
V CC
VBOOT = 12V
5
6
7
V
3.8
4.1
4.4
V
--
0.5
--
V
0.784
0.8
0.816
V
250
300
350
kHz
--
1.75
--
VP-P
32
35
38
dB
Power-On Reset
Rising VCC Threshold
VCC Threshold Hysteresis
Reference
Reference Voltage
VFB
Both PWM and linear regulator
Oscillator
Free Running Frequency
Ramp Amplitude
∆ VOSC
PWM Error Amplifier
DC gain
PWM Controller Gate Driver
Upper Drive Source
RUGATE
BOOT= 12V
BOOT-VUGATE = 1V
--
7.5
11
Ω
Upper Drive Sink
RUGATE
VUGATE = 1V
--
5
8
Ω
Lower Drive Source
RLGATE
--
3.5
6
Ω
Lower Drive Sink
RLGATE
VCC - VLGATE = 1V,
VLGATE = 1V
--
2
5
Ω
VDRV = 2V
100
--
--
mA
FB Over-Voltage Trip
FB Rising
0.9
1
--
V
FB & FBL Under-Voltage Trip
FB & FBL Falling
--
0.5
0.65
V
--
2.5
--
ms
Linear Regulator
DRV Driver Source
Protection
Soft-Start Interval
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DS9205/A-08 March 2007
RT9205/A
Preliminary
Typical Operating Characteristics
Dead Time
Dead Time
VCC = 5V
VCC = 5V
UGATE
UGATE
LGATE
LGATE
Time (50ns/Div)
Time (50ns/Div)
Power On
Power Off
VCC = 5V
VOUT1 = 2.5V
VOUT2 = 1.8V
VCC
VCC = 5V
VOUT1 = 2.5V
VOUT2 = 1.8V
VCC
VOUT1
VOUT1
VOUT2
VOUT2
Time (2.5ms/Div)
Time (50ms/Div)
Load Transient
Load Transient
UGATE
UGATE
VCC = 5V
VOUT = 2.2V
COUT = 3000uF
VOUT
VCC = 5V
VOUT = 2.2V
COUT = 3000uF
Time (5us/Div)
DS9205/A-08 March 2007
VOUT
Time (5us/Div)
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RT9205/A
Preliminary
Short Hiccup
Short Hiccup (Latch Mode)
VCC = 5V
VOUT = 2.2V
VCC = 5V
VOUT = 2.2V
VOUT
VOUT
UGATE
UGATE
RT9205
RT9205A
Time (2ms/Div)
Time (2ms/Div)
Reference vs. Temperature
Bootstrap Wava Form
0.803
VCC = 5V, VOUT = 2.2V
0.802
0.801
Reference (V)
UGATE
LGATE
0.800
0.799
0.798
PHASE
0.797
0.796
-50
Time (1us/Div)
0
50
100
150
Temperature (°C)
POR (Rising/Falling) vs. Temperature
4.3
50
4.2
45
4.1
POR (V)
I OCSET (uA)
IOCSET vs. Temperature
55
40
35
4.0
3.9
30
3.8
25
3.7
20
Rising
Falling
3.6
-40
-10
20
50
80
Temperature (°C)
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8
110
140
-50
0
50
100
150
Temperature(°C)
DS9205/A-08 March 2007
Preliminary
RT9205/A
Oscillator Frequency vs. Temperature
315
Frequency (kHz) A
310
305
300
295
290
285
280
275
270
-50
0
50
100
150
Temperature (°C)
DS9205/A-08 March 2007
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9
RT9205/A
Preliminary
Application Information
VCC
R
BOOT
6.0V
Regulation
C
1uF
12V
10
UGATE
5V
+
The RT9205/A operates at either single 5V power supply
with a bootstrap UGATE driver or a 5V/12V dual-power
supply form the ATX SMPS. The dual- power supply is
recommended for high current applications, the RT9205/
A can deliver higher gate driving current while operating
with ATX SMPS based on a dual-power supply.
VCC
The Bootstrap Operation
RT9205/A
Figure 4. Dual Power Supply Operation
Power On Reset
R1
VCC
UGATE
5V
0.1uF
+
C2
1uF
D1
BOOT
LGATE
C2
1uF
In a single power supply system, the UGATE driver of
RT9205/A is powered by an external bootstrap circuit, as
shown in the Figure 3. The boot capacitor, CBOOT ,
generates a floating reference at the PHASE pin. Typically
a 0.1µF CBOOT is enough for most of MOSFETs used
with the RT9205/A. The voltage drop between BOOT and
PHASE is refreshed to a voltage of VCC − diode drop
(VD) while the lower MOSFET turning on.
The Power-On Reset (POR) monitors the supply voltage
(normal +5V) at the VCC pin and the input voltage at the
OCSET pin. The VCC POR level is set to 4.1V with 0.5V
hysteresis and the normal level at OCSET pin is set to
1.5V (see over-current protection). The POR function
initiates soft-start operation after all supply voltages
exceed their POR thresholds.
PHASE
Soft Start
VCC
LGATE
RT9205/A
Figure 3. Single 5V power Supply Operation
A built-in soft-start is used to prevent surge current from
power supply input during powering on. The soft-start
voltage is controlled by an internal digital counter. It slows
down and clamps the ramping of reference voltage at the
input of error amplifier and the pulse-width of the output
driver. The typical soft-start duration is 2.5ms.
Under Voltage and Over Voltage Protection
Dual Power Operation
The RT9205/A was designed to supply a regulated 6.0V
at VCC pin automatically when BOOT pin is powered by
a 12V. In a system with ATX 5V/12V power supply, the
RT9205/A is ideal for higher current applications due to
the higher gate driving capability, VUGATE = 12V and
VLGATE = 6.0V. A RC (10Ω/1µF) filter is also recommended
at BOOT pin to prevent the ringing induced from fast
power-on, as shown in Figure 4.
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10
The voltage presents at FB pin is monitored and protected
against OC (over current), UV (under voltage), and OV
(ov er v oltage). The UV threshold is 0.56V and
OV-threshold is 1.0V. Both UV and OV detection are with
30µs delay after triggered. When OC or UV trigged, a
hiccup re-start sequence will be initialized, as shown in
Figure 5. For RT9205, only 3 times of trigger are allowed
before latching off. But for RT9205A, UVP will be kept in
hiccup mode. Hiccup is disabled during soft-start interval.
DS9205/A-08 March 2007
RT9205/A
Preliminary
L
Q
COUNT = 2
SS
Internal
COUNT = 1
COUNT = 3
4V
VI
2V
D
R
C
VO
0V
INDUCTOR CURRENT
OVERLOAD
C.C.M.
APPLIED
TS
0A
TON
T0 T1
VI - VO
T3
T2
TIME
TOFF
VL
Figure 5
- VO
Inductor Selection
iL
uQ
The RT9205/A was designed for VIN = 5V, step-down
application mainly. Figure 6 shows the typical topology
and waveforms of step-down converter.
IL = IO
uIL
The ripple current of inductor can be calculated as follows:
ILRIPPLE =
(5V - VOUT)
L
iQ
× TON
IQ
Because operation frequency is fixed at 300kHz,
TON = 3.33 ×
VOUT
iD
5V
ID
The VOUT ripple is
VOUT
RIPPLE = ILRIPPLE × ESR
Figure 6
ESR is the equivalent series resistor of output capacitor
Table 1 shows the ripple voltage of VOUT at VIN = 5V
Table 1
VOUT
Inductor
3.3V
2.5V
1.5V
2µH
5µH
2µH
5µH
2µH
5µH
1000µF (ESR=53mΩ)
100mV
40mV
110mV
44mV
93mV
37mV
1500µF (ESR=33mΩ)
62mV
25mV
68mV
28mV
58mV
23mV
3000µF (ESR=21mΩ)
40mV
16mV
43mV
*Refer to Sanyo low ESR series (CE, DX, PX.....)
18mV
37mV
15mV
The suggested L and C are as follows:
2µH with ≥ 1500µF COUT
5µH with ≥ 1000µF COUT
DS9205/A-08 March 2007
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11
RT9205/A
Preliminary
Input / Output Capacitor
The output capacitors are necessary for filtering output
and stabilizing the close loop (see the PWM loop stability).
For powering advanced high-speed processors, it is
required to meet fast load transient requirement. Also high
ESR usually induces ripple that may trigger UV or OV
protections. So High frequency capacitors with low ESR/
ESL capacitors are recommended here.
Linear Regulator Driver
The linear controller of RT9205/A was designed to drive an
external bipolar NPN transistor or a N-MOSFET. For a NChannel MOSFET, normally DRV need to provide minimum
VOUT2+VT+gate-drive voltage to keep VOUT2 as the set
voltage. When driving MOSFET operating at a 5V power
supply, the gate-drive will be limited at 5V. At this situation,
as shown in Figure 7 a MOSFET with low VT threshold
(VT = 1V) and set Vout2 below 2.5V are suggested. In
VBOOT = 12V operation condition, as Figure 8 shown, VCC
is regulated higher than 6V, which providing higher gatedrive capability for driving the MOSFET, VOUT2 can be set
as VOUT2 ≤ 3.3V.
Suggest Low
VT MOSFET
Max. 5V
VOUT2 < 3.3V
DRV
VBOOT = 12V
6V
VCC = 5V
RT9205/A
R4<1K
R4<1K
The RT9205/A is a voltage mode buck controller designed
for 5V step-down applications. The gain of error amplifier
is fixed at 35dB for simplifying design.
The output amplitude of ramp oscillator is 1.6V, the loop
gain and loop pole/zero are calculated as follows :
DC loop gain GA = 35 dB ×
LC filter pole PO =
5
×
0.8
1.75 VOUT
1
2π LC
Error Amp pole PA = 300kHz
ESR zero ZO =
1
2π ESR × C
The RT9205/A Bode plot is as shown in Figure 9. It is
stable in most of application conditions.
VOUT = 3.3V
+
R4
VCC
R4
VCC
PWM Loop Stability
40
FBL
FBL
Figure 8
R3
BOOT
R3
BOOT
RT9205/A
VOUT2 < 2.5V
DRV
Suggest Low
VT MOSFET
Max. 6V
+
High frequency/long life decoupling capacitors should be
placed as close to the power pins of the load as physically
possible. Be careful not to add inductance to the PCB
trace, as it could eliminate the performance from utilizing
these low inductance components. Consult with the
manuf acturer of the load on specific decoupling
requirements.
30
COUT = 1500uF(33mΩ)
L = 2uH
VOUT = 1.5V
PO = 2.9kHz
VOUT = 2.5V
ZO = 3.2kHz
VOUT = 3.3V
20
Loop Gain
10
Figure 7
100
1k
10k
100k
1M
Figure 9
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12
DS9205/A-08 March 2007
RT9205/A
Preliminary
Reference Voltage
VIN
L
VOUT
+
Because RT9205/A uses a low 35dB gain error amplifier,
as shown in Figure 10. The voltage regulation is
dependent on VIN and VOUT settings. The FB reference
voltage of 0.8V were trimmed at VIN = 5V and VOUT = 2.5V.
In a fixed VIN = 5V application, the FB reference voltage
vs. VOUT voltage can be calculated as Figure 11.
COUT
C1
R1
RT9205/A
FB
I3
FB
+
I2
-
1K
VOUT = VFB × (1 +
EA
+
+
RAMP
PWM Layout Considerations
1.75V
Figure 10
0.82
VIN = 5V
FB (V)
0.81
0.80
VFB = 0.8 - (
0.78
Duty - 50
) × 6.25mV
100
10
20
30
R2
<1K
Figure 12
PWM
-
0.79
)
R2
56K
REP
0.8V
R1
40
50
60
Duty (%)
70
80
90
Figure 11
Feedback Divider
The reference of RT9205/A is 0.8V. The output voltage can
be set using a resistor-divider as shown in Figure 12. Put
the R1 and R2 as close as possible to FB pin. R2 value
should be less than 1 kΩ to avoid noise coupling issue.
The C1 capacitor is a speed-up capacitor for reducing output
ripple to meet with the requirement of fast transient load.
Typically, value between 1nF and 0.1µF is enough for C1.
DS9205/A-08 March 2007
MOSFETs switch very fast in efficiency. The speed with
which the current transitions from one device to another
causes voltage spikes across the interconnecting
impedances and parasitic circuit elements. The voltage
spikes can degrade efficiency and radiate noise, that
results in over-voltage stress on devices. Careful the
layout for component placement layout and printed circuit
design can minimize the voltage spikes induced in the
converter. Consider, as an example, the turn-off transition
of the upper MOSFET prior to turn-off, the upper MOSFET
was carrying the full load current. During turn-off, current
stops flowing in the upper MOSFET and is picked up by
the lower MOSFET or Schottky diode. Any inductance in
the switched current path generates a large voltage spike
during the switching interval. Care with component
selections, layout of the critical components, and use
shorter and wider PCB traces that help in minimizing the
magnitude of voltage spikes.
There are two sets of critical components in a DC-DC
converter using the RT9205/A. The switching power
components are most critical because they switch large
amounts of energy, and as such, they tend to generate
equally large amounts of noise. The critical small signal
components are those connected to sensitive nodes or
those supplying critical bypass current.
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13
RT9205/A
Preliminary
The power components and the PWM controller should
be placed firstly. Place the input capacitors, especially the
high-frequency ceramic decoupling capacitors, close to
the power switches. Place the output inductor and output
capacitors between the MOSFETs and the load. Also
locate the PWM controller near by MOSFETs.
A multi-layer printed circuit board is recommended. Figure
13 shows the connections of the critical components in
the converter. Note that the capacitors CIN and COUT
represent numerous physical capacitors. Use a dedicated
grounding plane and use vias to ground all critical
components to this layer. Apply another solid layer as a
power plane and cut this plane into smaller islands of
common voltage levels. The power plane should support
the input power and output power nodes. Use copper filled
polygons on the top and bottom circuit layers for the
PHASE node, but it is not necessary to oversize this
particular island. Since the PHASE node is subjected to
very high dV/dt voltages, the stray capacitance formed
between these islands and the surrounding circuitry will
tend to couple switching noise. Use the remaining printed
circuit layers for small signal routing. The PCB traces
between the PWM controller and the gate of MOSFET
and also the traces connecting source of MOSFETs
should be sized to carry 2A peak currents.
IQ1
IL
VOUT
5V
IQ2
+
+
+
Q1
LOAD
Q2
GND
GND
LGATE VCC
RT9205/A
UGATE
FB
Figure 13
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14
DS9205/A-08 March 2007
RT9205/A
Preliminary
Outline Dimension
H
A
M
J
B
F
C
I
D
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
8.534
8.738
0.336
0.344
B
3.810
3.988
0.150
0.157
C
1.346
1.753
0.053
0.069
D
0.330
0.508
0.013
0.020
F
1.194
1.346
0.047
0.053
H
0.178
0.254
0.007
0.010
I
0.102
0.254
0.004
0.010
J
5.791
6.198
0.228
0.244
M
0.406
1.270
0.016
0.050
14–Lead SOP Plastic Package
Richtek Technology Corporation
Richtek Technology Corporation
Headquarter
Taipei Office (Marketing)
5F, No. 20, Taiyuen Street, Chupei City
8F, No. 137, Lane 235, Paochiao Road, Hsintien City
Hsinchu, Taiwan, R.O.C.
Taipei County, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611
Tel: (8862)89191466 Fax: (8862)89191465
Email: [email protected]
DS9205/A-08 March 2007
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