NCP1654 Product Preview Power Factor Controller for Compact and Robust, Continuous Conduction Mode Pre−Converters The NCP1654 is a controller for Continuous Conduction Mode (CCM) Power Factor Correction step−up pre−converters. It controls the power switch conduction time (PWM) in a fixed frequency mode and in dependence on the instantaneous coil current. Housed in a DIP8 or SO8 package, the circuit minimizes the number of external components and drastically simplifies the PFC implementation. It also integrates high safety protection features that make the NCP1654 a driver for robust and compact PFC stages like an effective input power runaway clamping circuitry. Features • • • • • • • • • • • • • • MARKING DIAGRAMS 8 IEC1000−3−2 Compliant Average Current Continuous Conduction Mode Fast Transient Response Very Few External Components Very Low Startup Currents (<75 mA) Very Low Shutdown Currents (< 400 mA) Low Operating Consumption ±1.5 A Totem Pole Gate Drive Accurate Fully Integrated 65 kHz Oscillator Latching PWM for cycle−by−cycle Duty−Cycle Control Internally Trimmed Internal Reference 2 versions of Undervoltage Lockout with Hysteresis Soft−Start for Smoothly Startup Operation (B version only) Shutdown Function Inrush Currents Detection Overvoltage Protection Undervoltage Detection for Open Loop Detection (shutdown) Brown−Out Detection Soft−Start Accurate Overcurrent Limitation True Overpower Limitation NCP1654 AWL YYWWG PDIP−8 P SUFFIX CASE 626 8 1 1 8 SO−8 D SUFFIX CASE 751 8 Safety Features • • • • • • • http://onsemi.com 1 1 N1654 ALYW G NCP1654, N1654 = Device Code A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb−Free Package PIN CONNECTIONS Ground 1 8 Driver VM 2 7 VCC CS 3 6 Feedback Brown−Out 4 5 Vcontrol (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. Typical Applications • TV, Monitors, PC Desktop SMPS • AC Adapters SMPS • White Goods, other Off−line SMPS This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. © Semiconductor Components Industries, LLC, 2007 March, 2007 − Rev. P0 1 Publication Order Number: NCP1654/D NCP1654 Maximum Ratings Table Symbol Pin Rating Value Unit DRV 8 Output Drive Capability − Source Output Drive Capability − Sink −1.5 +1.5 A VCC 7 Power Supply voltage, VCC pin, continuous voltage −0.3, +20 V 7 Transient Power Supply voltage, duration < 10 ms, IVCC < 10 mA +25 V Vin 2, 3, 4, 5, 6 Input Voltage −0.3, +10 V 800 100 mW °C/W 450 178 mW °C/W PD(SO) RqJA(SO) Power Dissipation and Thermal Characteristics P suffix, Plastic Package, Case 626 Maximum Power Dissipation @ TA = 70°C Thermal Resistance Junction−to−Air D suffix, Plastic Package, Case 751 Maximum Power Dissipation @ TA−=−70°C Thermal Resistance Junction to Air TJ Operating Junction Temperature Range −40 to +125 °C TJmax Maximum Junction Temperature 150 °C TSmax Storage Temperature Range −65 to +150 °C TLmax Lead Temperature (Soldering, 10 s) 300 °C PD(DIP) RqJA(DIP) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Pins 1 – 8: Human Body Model 2000 V per MIL−STD−883, Method 3015. Pins 1 – 8: Machine Model Method 200 V (except pin#7 which complies 150 V) 2. This device contains Latch−up Protection and exceeds ±100 mA per JEDEC Standard JESD78. http://onsemi.com 2 NCP1654 Typical Electrical Characteristics Table (VCC = 15 V, TJ from −40°C to +125°C, unless otherwise specified) (Note 3) Symbol Rating Min Typ Max Unit Rsource Source Resistance @ Ipin8 = 100 mA − 9 20 W Rsink Sink Resistance @ Ipin8 = −100 mA − 6.6 18 W Trise Gate Drive Voltage Rise Time from 1.5 V to 13.5 V (CL = 2.2 nF) − 60 − ns Tfall Gate Drive Voltage Fall Time from 13.5 V to 1.5 V (CL = 2.2 nF) − 40 − ns Vref Voltage Reference 2.425 2.5 2.575 V IEA Error Amplifier Current Capability − ±20 − mA GEA Error Amplifier Gain 100 200 300 mS GATE DRIVE SECTION REGULATION BLOCK IBpin6 Pin 6 Bias Current @ VFB = Vref −500 − 500 nA Vcontrol Vcontrol(max) Vcontrol(min) DVcontrol Pin5 Voltage Maximum Control Voltage @ VFB = 2 V Minimum Control Voltage @ VFB = 3 V − − 2.7 3.7 0.7 3 − − 3.3 V VoutL / Vref Ratio (Vout Low Detect Thresold / Vref) 94 95 96 % HoutL / Vref Ratio (Vout Low Detect Hysteresis / Vref) − 0.5 − % IBOOST Pin 5 Source Current when (Vout Low Detect) is activated 180 220 250 mA VS Current Sense Pin Offset Voltage, (ICS = 100 mA) − 10 − mV IS(OCP) Over−Current Protection Threshold 185 200 215 mA − 4 − nA2 174 56 222 75 308 110 mA CURRENT SENSE BLOCK POWER LIMITATION BLOCK ICS x Iin Over Power Limitation Threshold ICS(OPL1) ICS(OPL2) ǒ + I CS Ǔ V BO 2 R Over−Power Current Threshold (VBO = 0.9 V, VM = 3 V) Over−Power Current Threshold (VBO = 2.67 V, VM = 3 V) PWM BLOCK Dcycle Duty Cycle Range 0−97 % OSCILLATOR / RAMP GENERATOR BLOCK Switching Frequency 58 65 72 kHz VBOH Brown−Out VoltageThreshold (rising) TBD 1.3 TBD V VBOL Brown−Out Voltage Threshold (falling) 0.65 0.7 0.75 V IIB Pin 4 Input Bias Current @ VBO = 1 V −500 − 500 nA Multiplier Output Current (Vcontrol = Vcontrol(max), VBO = 0.9 V, ICS = 25 mA Multiplier Output Current (Vcontrol = Vcontrol(max), VBO = 0.9 V, ICS = 75 mA Multiplier Output Current (Vcontrol = Vcontrol(min) + 0.2 V, VBO = 0.9 V, ICS = 25 mA Multiplier Output Current (Vcontrol = Vcontrol(min) + 0.2 V, VBO = 0.9 V, ICS = 75 mA 0.7 2.1 8.3 24.2 1.9 5.6 28.1 84.4 3.8 10.3 46.4 146 mA Fsw BROWN−OUT DETECTION BLOCK CURRENT MODULATION BLOCK IM1 IM2 IM3 IM4 OVER−VOLTAGE PROTECTION VOVP / Vref Ratio (Over Voltage Threshold / Vref) 103 105 107 % TOVP Propagation Delay (VFB – 107% Vref) to Drive Low − 500 − ns 3. The above specification gives the targeted values of the parameters. The final specification will be available once the complete circuit characterization has been performed. http://onsemi.com 3 NCP1654 Typical Electrical Characteristics Table (VCC = 15 V, TJ from −40°C to +125°C, unless otherwise specified) (Note 3) Symbol Rating Min Typ Max Unit VUVP(on)/Vref UVP Activate Threshold Ratio (TJ = 0°C to +105°C) 4 8 12 % VUVP(off)/Vref UVP Deactivate Threshold Ratio (TJ = 0°C to +105°C) 6 12 18 % VUVP(H) UVP Lockout Hysteresis − 4 − % TUVP Propagation Delay (VFB < 8% Vref) to Drive Low − 500 − ns Tlimit Thermal Shutdown Threshold 150 − − °C Htemp Thermal Shutdown Hysteresis − 30 − °C UNDER−VOLTAGE PROTECTION / SHUTDOWN THERMAL SHUTDOWN VCC UNDER−VOLTAGE LOCKOUT SECTION Vstup Start−Up Threshold (Under−Voltage Lockout Threshold, VCC rising) − Version A Start−Up Threshold (Under−Voltage Lockout Threshold, VCC rising)− Version B 12.5 9.6 13.75 10.5 15 11.4 V Vdisable Disable Voltage after Turn−On (Under−Voltage Lockout Threshold, VCC falling) Version A & B 8.25 9 9.75 V HUVLO Under−Voltage Lockout Hysteresis − Version A Under−Voltage Lockout Hysteresis − Version B 4 1 4.75 1.5 − − V Power Supply Current: Start−Up (@ VCC = 12.4 V, version A and VCC = 9.4 V, version B) Operating (@ VCC = 15 V, no load, no switching) Operating (@ VCC = 15 V, no load, switching) Shutdown Mode (@ VCC = 15 V and VFB = 0 V) − − − − − 3.7 4.7 300 75 5 6 400 mA mA mA mA DEVICE CONSUMPTION Icc_stup Icc_op1 Icc_op2 Icc_stdwn 3. The above specification gives the targeted values of the parameters. The final specification will be available once the complete circuit characterization has been performed. NOTE: IM + I cs 2 V V * Vf Iin , I + BO , I control + control Icontrol in 2 R R http://onsemi.com 4 NCP1654 Detailed Pin Description(s) Pin Number Name Function 6 Feed−Back / Shutdown 5 Vcontrol / Soft−Start The voltage of this pin Vcontrol directly controls the input impedance and hence the power factor of the circuit. This pin is connected to an external capacitor Ccontrol to limit the Vcontrol bandwidth typically below 20 Hz to achieve near unity power factor. The device provides no output when Vcontrol < 0.7 V. Vcontrol is grounded when the circuits is off. In B version, when it starts to operate, Vcontrol raises slowly by inside 20 mA current source after VFB is higher than 95% of Vref, which obtains a linear control of the increasing duty cycle as a function of time. Hence reduce the voltage and current stress on the MOSFET. Soft Start function is achieved. In A version, when it starts to operate, Vcontrol raises rapidly by inside 200 mA current source. It is to boost the PFC output in a short time before the operation of the converter behind the PFC stage. 4 Brown−Out / In Connect a resistor network among the rectified input voltage, pin4, and ground. And connect a capacitor between pin4 and ground. Pin4 detects a voltage signal proportional to the average input voltage. When VBO goes below 0.7 V, the circuit that detects too low input voltage conditions (brown− out), turns off the output driver and keeps it in low state till VBO exceeds 1.3 V (0.6 V hysteresis). This signal which is proportional to the RMS input voltage Vac is also for over−power limitation (OPL) and PFC duty cycle modulation. When the product This pin receives a feedback signal VFB that is proportional to the PFC circuits output voltage. This information is used for both the output regulation, the over−voltage protection (OVP), and output undervoltage protection (UVP). When VFB goes above 105% Vref, OVP is activated and the Drive Output is disabled. When VFB goes below 8% Vref, the device enters a low−consumption shutdown mode. ICS VBO u 4nA 2, 2 R OPL is activated and the Drive Output duty ratio is reduced by pulling down Vcontrol indirectly to reduce the input power. 3 Current Sense Input This pin sources a current ICS which is proportional to the inductor current IL. The sense current ICS is for over−current protection (OCP), over−power limitation (OPL) and PFC duty cycle modulation. When ICS goes above 200 mA, OCP is activated and the Drive Output is disabled. 2 Multiplier Voltage This pin provides a voltage VM for the PFC duty cycle modulation. The input impedance of the PFC circuits is proportional to the resistor RM externally connected to this pin. The device operates in average current mode if an external capacitor CM is connected to the pin. Otherwise, it operates in peak current mode. 1 Ground 8 Drive The high current capability of the totem pole gate drive (±1.5 A) makes it suitable to effectively drive high gate charge power MOSFET. 7 VCC This pin is the positive supply of the IC. The circuit typically starts to operate when VCC exceeds 13.75 V (version A), 10.5 V (version B) and turns off when VCC goes below 9 V. After start−up, the operating range is 9 V up to 20 V. − http://onsemi.com 5 NCP1654 Figure 1. Block Diagram http://onsemi.com 6 NCP1654 DETAILED OPERATING DESCRIPTION Introduction The NCP1654 is a PFC driver designed to operate in fixed frequency, continuous conduction mode. The fixed frequency operation eases the compliance with EMI standard and the limitation of the possible radiated noise that may pollute surrounding systems. In addition, continuous conduction operation reduces the application dI/dt and their resulting interference. More generally, the NCP1654 is an ideal candidate in systems where cost−effectiveness, reliability and high power factor are the key parameters. It incorporates all the necessary features to build a compact and rugged PFC stage: • Compactness and Flexibility: housed in a DIP8 or SO8 package, the NCP1654 requires a minimum of external components. In particular, the circuit scheme simplifies the PFC stage design and eliminates the need for any input voltage sensing. In addition, the circuit offers some functions like the Brown−Out or the true power limiting that enable the optimizations of the PFC design, • Low Consumption and Shutdown Capability: the NCP1654 is optimized to exhibit consumption as small as possible in all operation modes. The consumed current is particularly reduced during the start−up phase and in shutdown mode so that the PFC stage power losses are extremely minimized when the circuit is disabled. This feature helps meet the more stringent stand−by low power specifications. Just ground the Feed−back pin to force the NCP1654 in shutdown mode, • Safety Protections: the NCP1654 permanently monitors the output voltage, the coil current and the die temperature to protect the system from possible over−stresses. Integrated protections (over−voltage protection, coil current limitation, thermal shutdown…) make the PFC stage extremely robust and reliable: − Maximum Current Limit: the circuit permanently senses the coil current and immediately turns off the power switch if it is higher than the set current limit. The NCP1654 also prevents any turn on of the power switch as long as the coil current is not below its maximum permissible level. This feature protects the MOSFET from possible excessive stress that could result from the switching of a current higher than the one the power switch is dimensioned for. In particular, this scheme effectively protects the PFC stage during the start−up phase when large in−rush currents charge the output capacitor, − Under−Voltage Protection / Shut−down: the circuit detects when the feed−back voltage goes below than about 8% of the regulation level. In this case, the circuit turns off and its consumption drops to a very low value. This feature protects the PFC stage from starting operation in case of low AC line conditions • or in case of a failure in the feed−back network (e.g., bad connection), − Fast Transient Response: given the low bandwidth of the regulation block, the output voltage of PFC stages may exhibit excessive over or under−shoots because of abrupt load or input voltage variations (e.g. at start up). If the output voltage is too far from the regulation level: Over−Voltage Protection: NCP1654 turns off the power switch as soon as Vout exceeds the OVP threshold (105% of the regulation level). Hence a cost & size effective bulk capacitor of lower voltage rating is suitable for this application, Vout Low Detect: NCP1654 drastically speeds up the regulation loop by its internal 200 mA enhanced current source when the output voltage is below 95% of its regulation level. − Brown−Out Detection: the circuit detects low AC line conditions and disables the PFC stage in this case. This protection mainly protects the power switch from the excessive stress that could damage it in such conditions, − Over−Power Limitation: the NCP1654 computes the maximum permissible current in dependence of the average input voltage measured by the brown−out block. When the circuit detects an excessive power transfer, it resets the PWM latch and pulls down the regulation block output as long as the calculated power keeps too high, − Thermal Shutdown: an internal thermal circuitry disables the circuit gate drive and then keeps the power switch off when the junction temperature exceeds 150°C typically. The circuit resumes operation once the temperature drops below about 120°C (30°C hysteresis), − Soft Start: Vcontrol is pulled low as the IC is off, which VCC is lower than UVLO off, brown−out detection activates, or under−voltage protection activates, and no drive is provided. The soft−start function is done by disable the “200 mA enhanced current source” at start up. So there is only 20 mA to charge the Ccontrol, and makes Vcontrol increase slowly. This is to obtain a slow increasing duty cycle and hence reduce the voltage and current stress on the MOSFET. This soft−start function is designed in B version only. A version doesn’t have this soft−start function, because VCC of A version is supposed to start up by the resistors connected to input voltage and should be able to boost the PFC output as soon as possible before the 2nd stage converter operates. So at start up period, Ccontrol will be charged by 220 mA current source and the PFC output will rise rapidly. Output Stage Totem Pole: the NCP1654 incorporates a ±1.5A gate driver to efficiently drive TO220 or TO247 power MOSFETs. http://onsemi.com 7 NCP1654 ORDERING INFORMATION Package Shipping† PDIP−8 50 Units / Rail NCP1654PG PDIP−8 (Pb−Free) 50 Units / Rail NCP1654DR2 SO−8 2500 Units / Tape & Reel SO−8 (Pb−Free) 2500 Units / Tape & Reel Device NCP1654P NCP1654DR2G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. PACKAGE DIMENSIONS SO−8 D SUFFIX CASE 751−07 ISSUE AG −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 1 0.25 (0.010) M Y M 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− H 0.10 (0.004) D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0 _ 8 _ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 NCP1654 PACKAGE DIMENSIONS PDIP−8 P SUFFIX CASE 626−05 ISSUE L 8 NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5 −B− 1 4 F −A− NOTE 2 L C J −T− MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC −−− 10_ 0.76 1.01 INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC −−− 10_ 0.030 0.040 N SEATING PLANE D H DIM A B C D F G H J K L M N M K G 0.13 (0.005) M T A M B M ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 9 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NCP1654/D