CYPRESS CY28329ZXC

CY28329
133-MHz Spread Spectrum Clock Synthesizer/Driver
with Differential CPU Outputs
Features
Benefits
• Multiple output clocks at different frequencies
• Motherboard clock generator
— Four pairs of differential CPU outputs, up to 133 MHz
— Support Multiple CPUs and a chipset
— Ten synchronous PCI clocks, three free-running
— Support for PCI slots and chipset
— Six 3V66 clocks
— Supports AGP and Hub Link
— Two 48-MHz clocks
— Supports USB host controller and graphic controller
— One reference clock at 14.318 MHz
— Supports ISA slots and I/O chip
— One VCH clock
• Enables reduction of EMI and overall system cost
• Spread Spectrum clocking (down spread)
• Enables ACPI compliant designs
• Power-down features (PCI_STOP#, PD#)
• Supports up to four CPU clock frequencies
• Three Select inputs (Mode select & IC Frequency
Select)
• Enables ATE and “bed of nails” testing
• OE and Test Mode support
• Widely available, standard package enables lower cost
• 56-pin SSOP package and 56-pin TSSOP package
Logic Block Diagram
Pin Configurations
SSOP and TSSOP
Top View
XTAL
OSC
X1
X2
VDD_REF
PWR
1
56
REF
XTAL_IN
2
55
S1
XTAL_OUT
3
54
CPU3
GND_REF
4
53
CPU3#
PCI_F0
5
52
CPU0
PCI_F1
6
51
CPU0#
PCI_F2
7
50
VDD_CPU
VDD_PCI
8
49
CPU1
GND_PCI
9
48
CPU1#
PCI0
10
47
GND_CPU
VDD_PCI
PCI_F[0:2]
PCI1
11
46
VDD_CPU
PCI2
45
CPU2
PCI0:6
PCI3
12
13
44
CPU2#
VDD_PCI
14
43
MULT0
GND_PCI
PCI4
15
42
IREF
16
41
PCI5
PCI6
VDD_3V66
17
40
GND_IREF
S2
18
39
19
38
PLL Ref Freq
PLL 1
Divider
Network
Mult0
S1:2
VTTPWRGD#
VDD_CPU
CPU[0:3]
PWR
Gate
CPU[0:3]#
PWR
Stop
Clock
Control
PCI_STOP#
/2
PD#
VDD_3V66
PWR
3V66_0
3V66_[2:]4/
66BUFF0:2
PWR
3V66_5/ 66IN
PLL 2
VDD_48MHz
PWR
USB (48MHz)
DOT (48MHz)
GND_3V66
20
37
66BUFF0/3V66_2
21
36
GND_ 48 MHz
66BUFF1/3V66_3
22
35
66BUFF2/3V66_4
66IN/3V66_5
23
34
3V66_1/VCH
PCI_STOP#
24
25
33
3V66_0
32
VDD_3V66
26
31
GND_3V66
27
30
28
29
SCLK
SDATA
VTTPWRGD#
SDATA
SCLK
SMBus
Logic
Cypress Semiconductor Corporation
Document #: 38-07040 Rev. *E
•
3901 North First Street
•
USB
DOT
VDD_ 48 MHz
PD#
VDD_CORE
GND_CORE
VCH_CLK/ 3V66_1
CY28329
VDD_REF
REF
San Jose, CA 95134
•
408-943-2600
Revised January 19, 2005
CY28329
Pin Description
Name
Pins
Description
REF
56
3.3V 14.318-MHz clock output
XTAL_IN
2
14.318-MHz crystal input
XTAL_OUT
3
14.318-MHz crystal input
CPU, CPU [0:3]#
44, 45, 48, 49,
51, 52, 53, 54
Differential CPU clock outputs
3V66_0
33
3.3V 66-MHz clock output
3V66_1/VCH
35
3.3V selectable through SMBus to be 66 MHz or 48 MHz
66IN/3V66_5
24
66-MHz input to buffered 66BUFF and PCI or 66-MHz clock from internal VCO
66BUFF [0:2]
/3V66 [2:4]
21, 22, 23
66-MHz buffered outputs from 66Input or 66-MHz clocks from internal VCO
PCI_F [0:2]
5, 6, 7,
33-MHz clocks divided down from 66Input or divided down from 3V66
PCI [0:6]
10, 11, 12, 13, 16, PCI clock outputs divided down from 66Input or divided down from 3V66
17, 18
USB
39
Fixed 48-MHz clock output
DOT
38
Fixed 48-MHz clock output
S2
40
Special 3.3V 3-level input for Mode selection
S1
55
3.3V LVTTL inputs for CPU frequency selection
IREF
42
A precision resistor is attached to this pin which is connected to the internal current
reference
MULT0
43
3.3V LVTTL input for selecting the current multiplier for the CPU outputs
PD#
25
3.3V LVTTL input for Power_Down# (active LOW). Do not add any decoupling capacitors. Use an external 1.0-KΩ pull-up resistor.
PCI_STOP#
34
3.3V LVTTL input for PCI_STOP# (active LOW)
VTTPWRGD#
28
3.3V LVTTL input is a level-sensitive strobe used to determine when S[1:2] and
MULT0 inputs are valid and OK to be sampled (Active LOW). Once VTTPWRGD# is
sampled LOW, the status of this output will be ignored.
SDATA
29
SMBus-compatible SDATA
SCLK
30
SMBus-compatible Sclk
VDD_REF,
VDD_PCI,
VDD_3V66,
VDD_48 MHz,
VDD_CPU
1, 8, 14, 19, 32,
37, 46, 50
3.3V power supply for outputs
VDD_CORE
26
3.3V power supply for PLL
GND_REF,
GND_PCI,
GND_3V66,
GND_IREF,
VDD_CPU
4, 9, 15, 20, 31,
36, 41, 47
Ground for outputs
GND_CORE
27
Ground for PLL
Document #: 38-07040 Rev. *E
Page 2 of 17
CY28329
Function Table[1]
S2
CPU
(MHz)
S1
3V66[0:1](
MHz)
66BUFF[0:2]/
3V66[2:4]
(MHz)
66IN/3V66_5
(MHz)
PCI_F/PCI
(MHz)
USB/DOT
(MHz)
REF0(MHz)
Notes
1
0
100 MHz
66 MHz
66IN
66-MHz Input
66IN/2
14.318 MHz
48 MHz
2, 3, 4
1
1
133 MHz
66 MHz
66IN
66-MHz Input
66IN/2
14.318 MHz
48 MHz
2, 3, 4
0
0
100 MHz
66 MHz
66 MHz
66-MHz Input
33 MHz
14.318 MHz
48 MHz
2, 3, 4
0
1
133 MHz
66 MHz
66 MHz
66-MHz Input
33 MHz
14.318 MHz
48 MHz
2, 3, 4
Mid
0
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
5, 6
Mid
1
TCLK/2
TCLK/4
TCLK/4
TCLK/4
TCLK/8
TCLK
TCLK/2
1, 6
Swing Select Functions
Mult0
Board Target
Trace/Term Z
Reference R, IREF =
VDD/(3*Rr)
Output
Current
VOH @ Z,
0
50 ohm
Rr = 221 1%,
IREF = 5.00 mA
IOH = 4*Iref
1.0V @ 50
1
50 ohm
Rr = 475 1%,
IREF = 2.32 mA
IOH = 6*Iref
0.7V @ 50
Clock Driver Impedances
Impedance
Buffer Name
VDD Range
CPU, CPU#
Buffer Type
Min.
(Ohm)
Typ.
(Ohm)
20
40
Type X1
REF
3.135–3.465
Max.
(Ohm)
50
Type 3
60
PCI, 3V66, 66BUFF
3.135–3.465
Type 5
12
30
55
USB
3.135–3.465
Type 3A
12
30
55
DOT
3.135–3.465
Type 3B
12
30
55
Clock Enable Configuration
PD#
PCI_STOP#
CPU
CPU#
3V66
66BUFF
PCI_F
PCI
USB/DOT
VCOS/OSC
0
X
IREF*2
FLOAT
LOW
LOW
LOW
LOW
LOW
OFF
1
0
ON
ON
ON
ON
ON
OFF
ON
ON
1
1
ON
ON
ON
ON
ON
ON
ON
ON
Notes:
1. TCLK is a test clock driven in on the XTALIN input in test mode.
2. “Normal” mode of operation.
3. Range of reference frequency allowed is min. = 14.316 nominal = 14.31818 MHz, max. = 14.32 MHz.
4. Frequency accuracy of 48 MHz must be +167 PPM to match USB default.
5. Required for board level “bed of nails” testing.
6. Mid is defined a Voltage level between 1.0V and 1.8V for 3 level input functionality. Low is below 0.8V. High is above 2.0V.
Document #: 38-07040 Rev. *E
Page 3 of 17
CY28329
Serial Data Interface (SMBus)
A Block write begins with a slave address and a WRITE
condition. The R/W bit is used by the SMBus controller as a
data direction bit. A zero indicates a WRITE condition to the
clock device. The slave receiver address is 11010010 (D2h).
To enhance the flexibility and function of the clock synthesizer,
a two-signal SMBus interface is provided according to SMBus
specification. Through the Serial Data Interface, various
device functions such as individual clock output buffers, etc.
can be individually enabled or disabled. CY28329 support
both block read and block write operations.
A command code of 0000 0000 (00h) and the byte count bytes
are required for any transfer. After the command code, the
core logic issues a byte count, which describes number of
additional bytes required for the transfer, not including the
command code and byte count bytes. For example, if the host
has 20 data bytes to send, the first byte would be the number
20 (14h), followed by the 20 bytes of data. The byte count byte
is required to be a minimum of 1 byte and a maximum of 32
bytes It may not be 0. Figure 1 shows an example of a block
write.
The registers associated with the Serial Data Interface
initializes to its default setting upon power-up, and therefore
use of this interface is optional. Clock device register changes
are normally made upon system initialization, if any are
required. The interface can also be used during system
operation for power management functions.
A transfer is considered valid after the acknowledge bit corresponding to the byte count is read by the controller.
Data Protocol
The clock driver serial protocol accepts only Block Writes from
the controller. The bytes must be accessed in sequential order
from lowest to highest byte, (most significant bit first) with the
ability to stop after any complete byte has been transferred.
Indexed bytes are not allowed.
Start Slave Address
bit 1 1 0 1 0 0 1 0
1 bit
7 bits
R/W
0/1
1
A Command Code A Byte Count = A
00000000
N
1
8 bits
1
8 bits
1
Data Byte 0
A
8 bits
1
...
Data Byte N-1 A Stop
bit
8 bits
1
1 bit
From Master to Slave
From Slave to Master
Figure 1. An Example of a Block Write
Data Byte Configuration Map
Data Byte 0: Control Register (0 = Enable, 1 = Disable)
Bit
Bit 7
Affected
Pin#
5, 6, 7, 10,
11, 12, 13,
16, 17, 18,
33, 35
Name
PCI [0:6]
CPU[3:0]
3V66[1:0]
Bit 6
–
–
Bit 5
35
3V66_1/VCH
Bit 4
–
–
Bit 3
10, 11, 12,
13, 16, 17,
18
PCI [6:0]
Bit 2
40
S2
Bit 1
55
S1
Bit 0
–
–
Document #: 38-07040 Rev. *E
Description
Spread Spectrum Enable
0 = Spread Off, 1 = Spread On
Reserved, set = 0
Type
Power On
Default
R/W
0
R
0
R/W
0
R
1
R/W
1
S2
Reflects the value of the S2 pin sampled on Power-up
R
HW
S1
Reflects the value of the S1 pin sampled on Power-up
R
HW
Reserved
R
1
VCH Select 66 MHz/48 MHz
0 = 66 MHz, 1 = 48 MHz
Reserved
PCI_STOP#, 0 = stopped, 1 = running
(Does not affect PCI_F [2:0] pins)
Page 4 of 17
CY28329
Data Byte 1:
Bit
Pin#
Type
Power On
Default
R
HW
CPU3 Output Enable
1 = Enabled; 0 = Disabled
R/W
1
Name
Description
Bit 7
–
CPU Mult0 Value
Bit 6
53, 54
CPU3
CPU3#
Bit 5
–
–
Reserved, set = 0
R/W
0
Bit 4
–
–
Reserved, set = 0
R/W
0
Bit 3
–
–
Reserved, set = 0
R/W
0
Bit 2
44, 45
CPU2
CPU2#
CPU2 Output Enable
1 = Enabled; 0 = Disabled
R/W
1
Bit 1
48, 49
CPU1
CPU1#
CPU1Output Enable
1 = Enabled; 0= Disabled
R/W
1
Bit 0
51, 52
CPU0
CPU0#
CPU0 Output Enable
1 = Enabled; 0 = Disabled
R/W
1
Pin#
Name
Type
Power On
Default
Bit 7
–
–
R
0
Bit 6
18
PCI6
PCI6 Output Enable
1 = Enabled; 0 = Disabled
R/W
1
Bit 5
17
PCI5
PCI5 Output Enable
1 = Enabled; 0 = Disabled
R/W
1
Bit 4
16
PCI4
PCI4 Output Enable
1 = Enabled; 0 = Disabled
R/W
1
Bit 3
13
PCI3
PCI3 Output Enable
1 = Enabled; 0 = Disabled
R/W
1
Bit 2
12
PCI2
PCI2 Output Enable
1 = Enabled; 0 = Disabled
R/W
1
Bit 1
11
PCI1
PCI1 Output Enable
1 = Enabled; 0 = Disabled
R/W
1
Bit 0
10
PCI0
PCI0 Output Enable
1 = Enabled; 0 = Disabled
R/W
1
Pin#
Name
Type
Power On
Default
Bit 7
38
DOT
DOT 48 MHz Output Enable, 1 = enabled, 0 = disabled
R/W
1
Bit 6
39
USB
USB 48 MHz Output Enable, 1 = enabled, 0 = disabled
R/W
1
Bit 5
7
PCI_F2
Allow control of PCI_F2 with assertion of PCI_STOP#
0 = Free running; 1 = Stopped with PCI_STOP#
R/W
0
Bit 4
6
PCI_F1
Allow control of PCI_F1 with assertion of PCI_STOP#
0 = Free running; 1 = Stopped with PCI_STOP#
R/W
0
Bit 3
5
PCI_F0
Allow control of PCI_F0 with assertion of PCI_STOP#
0 = Free running; 1 = Stopped with PCI_STOP#
R/W
0
Bit 2
7
PCI_F2
PCI_F2 Output Enable, 1 = enabled, 0 = disabled
R/W
1
Bit 1
6
PCI_F1
PCI_F1Output Enable, 1 = enabled, 0 = disabled
R/W
1
Bit 0
5
PCI_F0
PCI_F0 Output Enable, 1 = enabled, 0 = disabled
R/W
1
Data Byte 2:
Bit
Pin Description
Reserved, set = 0
Data Byte 3:
Bit
Document #: 38-07040 Rev. *E
Pin Description
Page 5 of 17
CY28329
Data Byte 4:
Bit
Pin#
Bit 7
Name
–
Pin Description
Reserved, set = 0
Reserved, set = 0
Type
Power On
Default
R
0
Bit 6
–
R
0
Bit 5
33
3V66_0
3V66_0 Output Enable
1 = Enabled; 0 = Disabled
R/W
1
Bit 4
35
3V66_1/VCH
3V66_1/VCH Output Enable
1 = Enabled; 0 = Disabled
R/W
1
Bit 3
24
66IN/3V66_5
3V66_5 Output Enable
1 = Enable; 0 = Disable
Note: This bit should be used when pin 24 is configured as
3V66_5 output. do not clear this bit when pin 24 is
configured as 66IN input.
R/W
1
Bit 2
23
66BUFF2
66-MHz Buffered 2 Output Enable
1 = Enabled; 0 = Disabled
R/W
1
Bit 1
22
66BUFF1
66-MHz Buffered 1 Output Enable
1 = Enabled; 0 = Disabled
R/W
1
Bit 0
21
66BUFF0
66-MHz Buffered 0 Output Enable
1 = Enabled; 0 = Disabled
R/W
1
Type
Power On
Default
Data Byte 5:
Bit
Pin#
Name
Pin Description
Bit 7
Reserved, set = 0
R
0
Bit 6
Reserved, set = 0
R
0
R/W
0
R/W
0
Bit 5
21,22,23
66BUFF [2:0]
Tpd 66IN to 66BUFF propagation delay control
Bit 4
Bit 3
38
DOT
DOT edge rate control
Bit 2
Bit 1
39
USB
USB edge rate control
Bit 0
R/W
0
R/W
0
R/W
0
R/W
0
Byte 6: Vendor ID
Bit
Description
Type
Power On
Default
Bit 7
Revision Code Bit 3
R
0
Bit 6
Revision Code Bit 2
R
0
Bit 5
Revision Code Bit 1
R
0
Bit 4
Revision Code Bit 0
R
0
Bit 3
Vendor ID Bit 3
R
1
Bit 2
Vendor ID Bit 2
R
0
Bit 1
Vendor ID Bit 1
R
0
Bit 0
Vendor ID Bit 0
R
0
Document #: 38-07040 Rev. *E
Page 6 of 17
CY28329
Absolute Maximum Conditions
Storage Temperature (Non-Condensing).... –65°C to +150°C
(Above which the useful life may be impaired. For user guidelines, not tested.)
Supply Voltage ..................................................–0.5 to +7.0V
Max. Soldering Temperature (10 sec.) ..................... +260°C
Junction Temperature ............................................... +150°C
Package Power Dissipation.............................................. 1W
Static Discharge Voltage.........................................................
(per MIL-STD-883, Method 3015) ............................ > 2000V
over which electrical parameters are guaranteed[7]
Input Voltage ............................................ –0.5V to VDD + 0.5
Operating Conditions
Parameter
Description
VDD_REF, VDD_PCI,VDD_CORE,
VDD_3V66, VDD_48 MHz, VDD_CPU,
3.3V Supply Voltages
Min.
Max.
Unit
3.135
3.465
V
0
TA
Operating Temperature, Ambient
70
°C
Cin
Input Pin Capacitance
5
pF
CXTAL
XTAL Pin Capacitance
22.5
pF
CL
Max. Capacitive Load on
USBCLK, REF
PCICLK, 3V66
f(REF)
Reference Frequency, Oscillator Nominal Value
pF
20
30
14.318
14.318
MHz
DC Electrical Specifications Over the Operating Range
Parameter
Description
Test Conditions
Min. Max. Unit
VIH
High-level Input Voltage
Except Crystal Pads. Threshold voltage for crystal pads = VDD/2
VIL
Low-level Input Voltage
Except Crystal Pads
VOH
High-level Output Voltage
2.0
V
0.8
V
USB, REF, 3V66
IOH = –1 mA
2.4
V
PCI
IOH = –1 mA
2.4
V
VOL
Low-level Output Voltage
USB, REF, 3V66
IOL = 1 mA
PCI
IOL = 1 mA
0.55
V
IIH
Input High Current
0 < VIN < VDD
–5
5
mA
IIL
Input Low Current
0 < VIN < VDD
–5
5
mA
IOH
High-level Output Current
CPU
For IOH =6*IRef Configuration
REF, DOT, USB
Type X1, VOH = 0.65V
0.4
12.9
mA
Type X1, VOH = 0.74V
Type 3, VOH = 1.00V
14.9
–29
Type 3, VOH = 3.135V
3V66, DOT, PCI
Type 5, VOH = 1.00V
–23
–33
Type 5, VOH = 3.135V
IOL
Low-level Output Current
REF, DOT, USB
Type 3, VOL = 1.95V
–33
29
mA
Type 3, VOL = 0.4V
3V66, PCI
Type 5, VOL =1.95 V
V
27
30
Type 5, VOL = 0.4V
38
IOZ
Output Leakage Current
10
mA
IDD3
3.3V Power Supply Current VDD_CORE/VDD3.3 = 3.465V, FCPU = 133 MHz
Three-state
360
mA
IDDPD3
3.3V Shutdown Current
VDD_CORE/VDD3.3 = 3.465V and @ IREF = 2.32 mA
25
mA
IDDPD3
3.3V Shutdown Current
VDD_CORE/VDD3.3 = 3.465V and @ IREF = 5.0 mA
45
mA
Note:
7. Multiple Supplies: the voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.
Document #: 38-07040 Rev. *E
Page 7 of 17
CY28329
Switching Characteristics Over the Operating Range[8]
Min.
Max.
Unit
t1
Parameter
All
Output Duty Cycle[9]
Measured at 1.5V
45
55
%
t2
CPU
Rise Time
Measured differential waveform from
–0.35V to +0.35V
175
700
ns
t2
USB, REF,
DOT
Rising Edge Rate
Between 0.4V and 2.4V
0.5
2.0
ns
t2
PCI, 3V66
Rising Edge Rate
Between 0.4V and 2.4V
1.0
4.0
V/ns
t3
CPU
Fall Time
Measured differential waveform from
–0.35V to +0.35V
175
700
ps
t3
USB, REF,
DOT
Falling Edge Rate
Between 2.4V and 0.4V
0.5
2.0
ns
t3
PCI, 3V66
Falling Edge Rate
Between 2.4V and 0.4V
1.0
4.0
V/ns
t4
CPU
CPU-CPU Skew
Measured at Crossover
150
ps
t5
3V66 [0:1]
3V66-3V66 Skew
Measured at 1.5V
500
ps
t5
66BUFF[0:2]
66BUFF-66BUFF Skew
Measured at 1.5V
175
ps
t6
PCI
PCI-PCI Skew
Measured at 1.5V
500
ps
t7
3V66, PCI
3V66-PCI Clock Skew
3V66 leads. Measured at 1.5V
3.5
ns
t8
CPU
Cycle-Cycle Clock Jitter
Measured at Crossover t8 = t8A – t8B
With all outputs running
150
ps
t9
3V66
Cycle-Cycle Clock Jitter
Measured at 1.5V t9 = t9A – t9B
250
ps
t9
USB, DOT
Cycle-Cycle Clock Jitter
Measured at 1.5V t9 = t9A – t9B
350
ps
t9
PCI
Cycle-Cycle Clock Jitter
Measured at 1.5V t9 = t9A – t9B
500
ps
t9
REF
Cycle-Cycle Clock Jitter
Measured at 1.5V t9 = t9A – t9B
1000
ps
t10
Output
Description
Test Conditions
1.5V[10, 11]
ALL
POR timing
Measured at
CPU
Rise/Fall Matching
Measured with test loads[12, 13]
Voh
CPU
High-level Output Voltage
including overshoot
Measured with test loads[13]
Vol
CPU
Low-level Output Voltage
including undershoot
Vcrossover
CPU
Crossover Voltage
1.5
1.0
4.0
ms
235
mV
0.92
1.45
V
Measured with test loads[13]
–0.2
0.35
V
Measured with test loads[13]
0.250
0.550
V
Notes:
8. All parameters specified with loaded outputs.
9. Duty cycle is measured at 1.5V when VDD = 3.3V. When VDD = 2.5V, duty cycle is measured at 1.25V.
10. POR starts when VDD reaches 1.5V.
11. All PULL-UPs must ramp at the same rate as VDD.
12. Determined as a fraction of 2*(Trp – Trn)/(Trp +Trn) Where Trp is a rising edge and Trn is an intersecting falling edge.
13. The test load is Rs = 33.2Ω, Rp = 49.9Ω in test circuit.
Document #: 38-07040 Rev. *E
Page 8 of 17
CY28329
Definition and Application of VTTPWRGD# Signal
Vtt
VRM8.5
CPU
VTTPWRGD#
BSEL0
BSEL1
3.3V
3.3V
3.3V
NPN
VTTPWRGD#
CLOCK
S0
10K
10K
S1
10K
10K
GMCH
GENERATOR
Document #: 38-07040 Rev. *E
Page 9 of 17
CY28329
Switching Waveforms
Duty Cycle Timing
(Single-Ended Output)
t1B
t1A
Duty Cycle Timing (CPU Differential Output)
t1B
t1A
All Outputs Rise/Fall Time
VDD
OUTPUT
t3
t2
0V
CPU-CPU Clock Skew
Host_b
Host
Host_b
Host
t4
3V66-3V66 Clock Skew
3V66
3V66
t5
PCI-PCI Clock Skew
PCI
PCI
t6
Document #: 38-07040 Rev. *E
Page 10 of 17
CY28329
Switching Waveforms (continued)
3V66-PCI Clock Skew
3V66
PCI
t7
CPU Clock Cycle-Cycle Jitter
t8A
t8B
Host_b
Host
Cycle-Cycle Clock Jitter
t9A
t9B
CLK
VDD and POR Timing
1.5V
VDD
1.5V
POR
t10
Document #: 38-07040 Rev. *E
Page 11 of 17
CY28329
VTTPWRGD# Timing Diagrams
GND VRM 5/12V
PWR_GD
VID [3:0]
BSEL [1:0]
VTTPWRGD FROM
VRM
VCC CPU CORE
VTTPWRGD
0.2–0.3 ms Wait for
Sample
delay VTTPWRGD# BSELS
VCC CLOCK GEN
State 1
State 0
CLOCK STATE
State 2
State 3
OFF
ON
CLOCK VCO
OFF
CLOCK OUTPUTS
ON
Figure 2. CPU Power BEFORE Clock Power
GND VRM 5/12V
PWRGD
VID [3:0]
BSEL [1:0]
PWRGD FROM
VRM
PWRGD# FROM
NPN
VCC CPU CORE
VTTPWRGD
0.2–0.3 ms
delay
VCC CLOCK GEN
CLOCK STATE
State 0
State 1
Wait for
VTTPWRGD#
Sample
BSELS
State 2
State 3
OFF
ON
CLOCK VCO
OFF
CLOCK OUTPUTS
Document #: 38-07040 Rev. *E
ON
Figure 3. CPU Power AFTER Clock Power
Page 12 of 17
CY28329
PD# Assertion
66BUFF
PCI
Power Down Rest of Generator
PCI_F (APIC)
PD#
CPU
CPU#
3V66
66IN
UNDEF
USB
REF
PD# Deassertion
<3 ms
10–30 µs min.
100–200 µs max.
66BUFF1/GMCH
66BUFF[0:2]
PCI
PCI_F (APIC)
PD#
CPU
CPU#
3V66
66IN
USB
REF
Document #: 38-07040 Rev. *E
Page 13 of 17
CY28329
Layout Example
+3.3V Supply
FB
VDDQ3
10 µF
0.005 µF
G
C1
G
1
2
3
4
5
6
7
8
9
G
G
G
G
V
G
10
G
VDDQ3
1.0 - 4.7KΩ
G
G
V
G
G
V
G
G
V
G
CY28329
G
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
G
51
V
50
G
49
48
G 47
V 46
G 45
44
43
42
G 41
40
39
38
37
G
36
35
34
G
33
V 32
G 31
30
G 29
G
V
G
G
G
VDDQ3
10Ω
G C6
C5 G
G
FB = Dale ILB1206 - 300 or 2TDKACB2012L-120 or 2 Murata BLM21B601S
Ceramic Caps C1 = 10–22 µF
G = VIA to GND plane layer
C2 = 0.005 µF C5 = 0.1 µF C6 = 10 µF
V =VIA to respective supply plane layer
Note: Each supply plane or strip should have a ferrite bead and capacitors
Document #: 38-07040 Rev. *E
Page 14 of 17
CY28329
Test Circuit
VDD_REF, VDD_PCI,
VDD_3V66, VDD_CORE
VDD_48 MHz, VDD_CPU
4, 9, 15, 20, 31, 36, 41, 47
1, 8, 14, 19,32,37, 46, 50
Ref,USB Outputs
Test Node
CY28329
Rs
CPU
Test
Nodes
OUTPUTS
20 pF
PCI,3V66 Outputs
Test Node
Rp
30 pF
Rs
Rp
Note: Each supply pin must have an individual decoupling capacitor.
Note: All capacitors must be placed as close to the pins as is physically possible.
Ordering Information
Ordering Code
Standard
CY28329PVC
CY28329PVCT
CY28329ZC
CY28329ZCT
Lead-free
CY28329OXC
CY28329OXCT
CY28329ZXC
CY28329ZXCT
Package Type
Operating Range
56-Pin Small Shrunk Outline Package (SSOP)
56-Pin Small Shrunk Outline Package (SSOP) - Tape and Reel
56-Pin Thin Small Shrunk Outline Package (TSSOP)
56-Pin Thin Small Shrunk Outline Package (TSSOP) - Tape and Reel
Commercial
Commercial
Commercial
Commercial
56-Pin Small Shrunk Outline Package (SSOP)
56-Pin Small Shrunk Outline Package (SSOP) -Tape and Reel
56-Pin Thin Small Shrunk Outline Package (TSSOP)
56-Pin Thin Small Shrunk Outline Package (TSSOP)
Commercial
Commercial
Commercial
Commercial
Document #: 38-07040 Rev. *E
Page 15 of 17
CY28329
Package Diagrams
\
56-Lead Shrunk Small Outline Package O56
51-85062-*C
56-Lead Thin Shrunk Small Outline Package, Type II (6 mm x 12 mm) Z56
0.249[0.009]
28
1
DIMENSIONS IN MM[INCHES] MIN.
MAX.
REFERENCE JEDEC MO-153
7.950[0.313]
8.255[0.325]
PACKAGE WEIGHT 0.42gms
5.994[0.236]
6.198[0.244]
PART #
Z5624 STANDARD PKG.
ZZ5624 LEAD FREE PKG.
29
56
13.894[0.547]
14.097[0.555]
1.100[0.043]
MAX.
GAUGE PLANE
0.25[0.010]
0.20[0.008]
0.851[0.033]
0.950[0.037]
0.500[0.020]
BSC
0.170[0.006]
0.279[0.011]
0.051[0.002]
0.152[0.006]
0°-8°
SEATING
PLANE
0.508[0.020]
0.762[0.030]
0.100[0.003]
0.200[0.008]
51-85060-*C
Intel and Pentium are registered trademarks of Intel Corporation. All products and company names mentioned in this document
may be the trademarks of their respective holders.
Document #: 38-07040 Rev. *E
Page 16 of 17
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
CY28329
Document History Page
Document Title: CY28329 133-MHz Spread Spectrum Clock Synthesizer/Driver with Differential CPU Outputs
Document Number: 38-07040
REV.
ECN NO.
Issue Date
Orig. of
Change
**
115133
04/26/02
DSG
*A
122733
12/14/02
RBI
Added power-up requirements to operating conditions information.
*B
127128
06/13/03
RGL
Added t10 timing AC specification.
Added Notes 10 and 11. Added VDD to POR diagram.
Added pull-up resistor to PD# in Layout example.Verified I2C default values
Added “Use an external 1.0 to 4.7KΩ pull-up resistor” to Pin 25 description.
*C
127899
06/26/03
DMG
Changed Pin 25 description to “Use an external 1.0 KΩ pull-up resistor”.
*D
128179
06/27/03
LJN
Updated Document History Page to reflect *C changes.
*E
310457
See ECN
RGL
Added Lead-free devices
Document #: 38-07040 Rev. *E
Description of Change
Changed from Spec number: 38-01147 to 38-07040
Preliminary to Final
Page 17 of 17