DISCRETE SEMICONDUCTORS DATA SHEET M3D883 BAT54CM Schottky barrier double diode Product specification 2003 Nov 11 Philips Semiconductors Product specification Schottky barrier double diode BAT54CM PINNING FEATURES • Low forward voltage PIN • Leadless ultra small plastic package (1.0 × 0.6 × 0.5 mm) • Boardspace 1.17 mm2 (approx. 10% of SOT23) • Power dissipation comparable to SOT23. DESCRIPTION 1 anode (a1) 2 anode (a2) 3 common cathode APPLICATIONS • Ultra high-speed switching • Voltage clamping handbook, halfpage 1 • Protection circuits 3 • Mobile communications, digital (still) cameras, PDAs and PCMCIA cards. 2 cathode mark DESCRIPTION Planar Schottky barrier double diode encapsulated in a SOT883 leadless ultra small plastic package. Top view MARKING 1 TYPE NUMBER MARKING CODE BAT54CM 3 2 S3 Bottom view Fig.1 MLE232 Simplified outline (SOT883) and symbol. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME BAT54CM 2003 Nov 11 − DESCRIPTION leadless ultra small plastic package; 3 solder lands; body 1.0 × 0.6 × 0.5 mm 2 VERSION SOT883 Philips Semiconductors Product specification Schottky barrier double diode BAT54CM LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VR continuous reverse voltage − 30 V IF continuous forward current − 200 mA IFRM repetitive peak forward current tp ≤ 1 s; δ ≤ 0.5 − 300 mA IFSM non-repetitive peak forward current tp < 10 ms − 600 mA Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C Ptot total power dissipation (per package) Tamb ≤ 25 °C; note 1 − 250 mW Note 1. Refer to SOT883 standard mounting conditions (footprint); FR4 with 60 µm copper strip line. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient CONDITIONS note 1 VALUE UNIT 500 K/W Note 1. Refer to SOT883 standard mounting conditions (footprint), FR4 with 60 µm copper strip line. Soldering Reflow soldering is the only recommended soldering method. ELECTRICAL CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MAX. UNIT Per diode VF forward voltage see Fig.2; IF = 0.1 mA 240 mV IF = 1 mA 320 mV IF = 10 mA 400 mV IF = 30 mA 500 mV IF = 100 mA 800 mV IR continuous reverse current VR = 25 V; note 1; see Fig.3 2 µA Cd diode capacitance f = 1 MHz; VR = 1 V; see Fig.4 10 pF Note 1. Pulsed test: tp ≤ 300 µs; δ ≤ 0.02. 2003 Nov 11 3 Philips Semiconductors Product specification Schottky barrier double diode BAT54CM MSA892 IF (mA) MSA893 10 3 3 10halfpage handbook, IR (µA) (1) (2) (3) 10 2 (1) 10 2 (2) 10 10 1 10 1 (1) (2) (3) 1 (3) 10 1 0 0.4 0.8 VF (V) 0 1.2 10 (1) Tamb = 125 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. (1) Tamb = 125 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. Fig.2 Fig.3 Forward current as a function of forward voltage; typical values. MSA891 15 handbook, halfpage Cd (pF) 10 5 0 0 10 20 VR (V) 30 f = 1 MHz; Tamb = 25 °C. Fig.4 Diode capacitance as a function of reverse voltage; typical values. 2003 Nov 11 4 20 VR (V) 30 Reverse current as a function of reverse voltage; typical values. Philips Semiconductors Product specification Schottky barrier double diode BAT54CM PACKAGE OUTLINE Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm L SOT883 L1 2 b 3 e b1 1 e1 A A1 E D 0 0.5 1 mm scale DIMENSIONS (mm are the original dimensions) UNIT A (1) A1 max. b b1 D E e e1 L L1 mm 0.50 0.46 0.03 0.20 0.12 0.55 0.47 0.62 0.55 1.02 0.95 0.35 0.65 0.30 0.22 0.30 0.22 Note 1. Including plating thickness OUTLINE VERSION SOT883 2003 Nov 11 REFERENCES IEC JEDEC JEITA SC-101 5 EUROPEAN PROJECTION ISSUE DATE 03-02-05 03-04-03 Philips Semiconductors Product specification Schottky barrier double diode BAT54CM DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Nov 11 6 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA75 © Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R76/01/pp7 Date of release: 2003 Nov 11 Document order number: 9397 750 11909