DISCRETE SEMICONDUCTORS DATA SHEET BAT760 Schottky barrier diode Product specification Supersedes data of 2001 Mar 12 2004 Jan 26 Philips Semiconductors Product specification Schottky barrier diode BAT760 FEATURES PINNING • Ultra high-speed switching PIN DESCRIPTION • Very low forward voltage 1 cathode • Guard ring protected 2 anode • Very small SMD plastic package. APPLICATIONS k, 4 columns 1 2 • Ultra high-speed switching • Voltage clamping • Protection circuits. MGU328 Marking code: A4. The marking bar indicates the cathode. DESCRIPTION Planar Schottky barrier diode with an integrated guard ring for stress protection in a SOD323 (SC-76) very small SMD plastic package. Fig.1 Simplified outline (SOD323; SC-76) and symbol. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME BAT760 − DESCRIPTION VERSION plastic surface mounted package; 2 leads SOD323 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VR continuous reverse voltage − 20 V IF continuous forward current − 1 A IFSM non-repetitive peak forward current − 5 A Tstg storage temperature −65 +150 °C Tj junction temperature − 125 °C Tamb operating ambient temperature −65 +125 °C 2004 Jan 26 t = 8.3 ms half sinewave; JEDEC method 2 Philips Semiconductors Product specification Schottky barrier diode BAT760 CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL VF IR Cd PARAMETER continuous forward voltage reverse current CONDITIONS TYP. MAX. UNIT see Fig.2 and note 1 IF = 10 mA 240 270 mV IF = 100 mA 300 350 mV IF = 1 A 480 550 mV VR = 5 V 5 10 µA VR = 8 V 7 20 µA VR = 15 V 10 50 µA VR = 5 V; f = 1 MHz; see Fig.4 19 25 pF see Fig.3 and note 1 diode capacitance Note 1. Pulse test: tp = 300 µs; δ = 0.02. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS thermal resistance from junction to ambient Notes 1. Mounted on printed-circuit board 10 × 10 mm2 Cu. 2. Mounted on printed-circuit board 40 × 40 mm2 Cu. 2004 Jan 26 3 VALUE UNIT note 1 220 K/W note 2 180 K/W Philips Semiconductors Product specification Schottky barrier diode BAT760 GRAPHICAL DATA MLD562 103 handbook, halfpage MLD563 105 handbook, halfpage IR IF (mA) (µA) 102 (1) (2) 104 (1) 103 (2) (3) 10 102 (3) 1 10 10−1 0 0.2 0.4 VF (V) 1 0.6 0 5 (1) Tamb = 125 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. (1) Tamb = 125 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. Fig.2 Fig.3 Forward current as a function of forward voltage; typical values. MLD564 80 handbook, halfpage Cd (pF) 60 40 20 0 0 5 10 15 20 VR (V) Tamb = 25 °C; f = 1 MHz. Fig.4 Diode capacitance as a function of reverse voltage; typical values. 2004 Jan 26 4 10 15 20 VR (V) 25 Reverse current as a function of reverse voltage; typical values. Philips Semiconductors Product specification Schottky barrier diode BAT760 PACKAGE OUTLINE Plastic surface mounted package; 2 leads SOD323 A D E X v HD M A Q 1 2 bp A A1 (1) c Lp detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E HD Lp Q v mm 1.1 0.8 0.05 0.40 0.25 0.25 0.10 1.8 1.6 1.35 1.15 2.7 2.3 0.45 0.15 0.25 0.15 0.2 Note 1. The marking bar indicates the cathode OUTLINE VERSION SOD323 2004 Jan 26 REFERENCES IEC JEDEC JEITA SC-76 5 EUROPEAN PROJECTION ISSUE DATE 99-09-13 03-12-17 Philips Semiconductors Product specification Schottky barrier diode BAT760 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2004 Jan 26 6 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA76 © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R76/02/pp7 Date of release: 2004 Jan 26 Document order number: 9397 750 12625