CY7C6431x CY7C64345, CY7C6435x enCoRe™ V Full-Speed USB Controller Features Powerful Harvard Architecture Processor ❐ M8C processor speeds running up to 24 MHz ❐ Low power at high processing speeds ❐ Interrupt controller ❐ 3.0V to 5.5V operating voltage without USB ❐ Operating voltage with USB enabled: • 3.15 to 3.45V when supply voltage is around 3.3V • 4.35 to 5.25V when supply voltage is around 5.0V ❐ Temperature range: 0°C to 70°C ■ Flexible On-Chip Memory ❐ Up to 32K Flash program storage 50,000 erase/write cycles ❐ Up to 2048 bytes SRAM data storage ❐ Flexible protection modes ❐ In-System Serial Programming (ISSP) ■ Complete Development Tools ❐ Free development tool (PSoC Designer™) ❐ Full featured, in-circuit emulator and programmer ❐ Full speed emulation ❐ Complex breakpoint structure ❐ 128K trace memory ■ Precision, Programmable Clocking ❐ Crystal-less oscillator with support for an external crystal or resonator ❐ Internal ±5.0% 6, 12, or 24 MHz main oscillator ❐ Internal low speed oscillator at 32 kHz for watchdog and sleep. The frequency range is 19–50 kHz with a 32 kHz typical value ❐ 0.25% accuracy for USB with no external components ■ Programmable Pin Configurations ❐ 25 mA sink current on all GPIO Pull Up, High Z, Open Drain, CMOS drive modes on all GPIO Configurable inputs on all GPIO ❐ Low dropout voltage regulator for Port 1 pins. Programmable to output 3.0, 2.5, or 1.8V at the IO pins ❐ Selectable, regulated digital IO on Port 1 • Configurable input threshold for Port 1 • 3.0V, 20 mA total Port 1 source current • Hot-swappable ❐ 5 mA strong drive mode on Ports 0 and 1 ■ enCoRe V Block Diagram Port 4 Port 3 ❐ ❐ ■ Full-Speed USB (12 Mbps) ❐ Eight unidirectional endpoints ❐ One bidirectional control endpoint ❐ USB 2.0 compliant ❐ Dedicated 512 bytes buffer ❐ No external crystal required ■ Additional System Resources ❐ Configurable communication speeds 2 ❐ I C™ slave • Selectable to 50 kHz, 100 kHz, or 400 kHz • Implementation requires no clock stretching • Implementation during sleep modes with less than 100 µA • Hardware address detection ❐ SPI™ master and SPI slave • Configurable between 93.75 kHz and 12 MHz ❐ Three 16-bit timers ❐ 8-bit ADC used to monitor battery voltage or other signals with external components ❐ Watchdog and sleep timers ❐ Integrated supervisory circuit Port 2 Port 1 Port 0 Prog. LDO enCoRe V CORE System Bus SRAM 2048 Bytes SROM Flash 32K CPU Core (M8C) Interrupt Controller Sleep and Watchdog 6/12/24 MHz Internal Main Oscillator 3 16-Bit Timers I2C Slave/SPI Master-Slave POR and LVD System Resets Full Speed USB SYSTEM RESOURCES Cypress Semiconductor Corporation Document Number: 001-12394 Rev. *F • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised October 7, 2008 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Functional Overview The enCoRe V family of devices are designed to replace multiple traditional full-speed USB microcontroller system components with one, low cost single-chip programmable component. Communication peripherals (I2C/SPI), a fast CPU, Flash program memory, SRAM data memory, and configurable IO are included in a range of convenient pinouts. The architecture for this device family, as illustrated in enCoRe V Block Diagram Block Diagram, is comprised of three main areas: the CPU core, the system resources, and the full-speed USB system. Depending on the enCoRe V package, up to 36 general purpose IO (GPIO) are also included. This product is an enhanced version of Cypress’ successful full-speed USB peripheral controllers. Enhancements include faster CPU at lower voltage operation, lower current consumption, twice the RAM and Flash, hot-swappable IOs, I2C hardware address recognition, new very low current sleep mode, and new package options. The enCoRe V Core The enCoRe V Core is a powerful engine that supports a rich instruction set. It encompasses SRAM for data storage, an interrupt controller, sleep and watchdog timers, and IMO (internal main oscillator) and ILO (internal low speed oscillator). The CPU core, called the M8C, is a powerful processor with speeds up to 24 MHz. The M8C is a four-MIPS, 8-bit Harvard architecture microprocessor. ■ Low Voltage Detection (LVD) interrupts can signal the application of falling voltage levels, while the advanced POR (power on reset) circuit eliminates the need for a system supervisor. ■ The 5V maximum input, 1.8, 2.5, or 3V selectable output, low dropout regulator (LDO) provides regulation for IOs. A register controlled bypass mode allows the user to disable the LDO. ■ Standard Cypress PSoC IDE tools are available for debugging the enCoRe V family of parts. Getting Started The quickest path to understanding the PSoC silicon is by reading this data sheet and using the PSoC Designer Integrated Development Environment (IDE). This data sheet is an overview of the PSoC integrated circuit and presents specific pin, register, and electrical specifications. For in-depth information, along with detailed programming information, reference the PSoC Mixed-Signal Array Technical Reference Manual, which can be found on http://www.cypress.com/psoc. For up-to-date Ordering, Packaging, and Electrical Specification information, reference the latest PSoC device data sheets on the web at http://www.cypress.com. Development Kits System resources provide additional capability, such as a configurable I2C slave and SPI master-slave communication interface and various system resets supported by the M8C. Development Kits are available from the following distributors: Digi-Key, Avnet, Arrow, and Future. The Cypress Online Store contains development kits, C compilers, and all accessories for PSoC development. Go to the Cypress Online Store web site at http://www.cypress.com/shop/. Under Product Categories click PSoC® Mixed Signal Arrays to view a current list of available items. Additional System Resources Technical Training Modules System resources, some of which have been previously listed, provide additional capability useful to complete systems. Additional resources include low voltage detection and power on reset. Brief statements describing the merits of each system resource are presented below. Free PSoC technical training modules are available for users new to PSoC. Training modules cover designing, debugging, advanced analog and CapSense. Go to http://www.cypress.com/techtrain. ■ Full-speed USB (12 Mbps) with nine configurable endpoints and 512 bytes of dedicated USB RAM. No external components are required except two series resistors. It is specified for commercial temperature USB operation. For reliable USB operation, ensure the supply voltage is between 4.35V and 5.25V, or around 3.3V. ■ 10-bit on-chip ADC shared between system performance manager (used to calculate parameters based on temperature for flash write operations) and the user. ■ The I2C slave and SPI master-slave module provides 50, 100, or 400 kHz communication over two wires. SPI communication over 3 or 4 wires runs at speeds of 46.9 kHz to 3 MHz (lower for a slower system clock). ■ In I2C slave mode, the hardware address recognition feature reduces the already low power consumption by eliminating the need for CPU intervention until a packet addressed to the target device is received. Document Number: 001-12394 Rev. *F Consultants Certified PSoC Consultants offer everything from technical assistance to completed PSoC designs. To contact or become a PSoC Consultant go to http://www.cypress.com, click on Support located at the top of the web page, and select CYPros Consultants. Technical Support PSoC application engineers take pride in fast and accurate response. They can be reached with a four hour guaranteed response at http://www.cypress.com/support. Application Notes A long list of application notes assists you in every aspect of your design effort. To view the PSoC application notes, go to the http://www.cypress.com web site and select Application Notes under the Documentation list located at the top of the web page. Application notes are sorted by date by default. Page 2 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Development Tools PSoC Designer™ is a Microsoft® Windows-based, integrated development environment for the Programmable System-on-Chip (PSoC) devices. The PSoC Designer IDE and application runs on Windows XP and Windows Vista. This system provides design database management by project, an integrated debugger with In-Circuit Emulator, in-system programming support, and built-in support for third-party assemblers and C compilers. PSoC Designer also supports C language compilers developed specifically for the devices in the PSoC family. PSoC Designer Software Subsystems System-Level View The system-level view is a drag-and-drop visual embedded system design environment based on PSoC Express. In this view you solve design problems the same way you might think about the system. Select input and output devices based upon system requirements. Add a communication interface and define the interface to the system (registers). Define when and how an output device changes state based upon any/all other system devices. Based upon the design, PSoC Designer automatically selects one or more PSoC Mixed-Signal Controllers that match your system requirements. PSoC Designer generates all embedded code, then compiles and links it into a programming file for a specific PSoC device. Chip-Level View The chip-level view is a more traditional integrated development environment (IDE) based on PSoC Designer 4.x. You choose a base device to work with and then select different onboard analog and digital components called user modules that use the PSoC blocks. Examples of user modules are ADCs, DACs, Amplifiers, and Filters. You configure the user modules for your chosen application and connect them to each other and to the proper pins. Then you generate your project. This prepopulates your project with APIs and libraries that you can use to program your application. The tool also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic reconfiguration allows for changing configurations at run time. Hybrid Designs You can begin in the system-level view, allow it to choose and configure your user modules, routing, and generate code, then switch to the chip-level view to gain complete control over on-chip resources. All views of the project share common code editor, builder, and common debug, emulation, and programming tools. Document Number: 001-12394 Rev. *F Code Generation Tools PSoC Designer supports multiple third-party C compilers and assemblers. The code generation tools work seamlessly within the PSoC Designer interface and have been tested with a full range of debugging tools. The choice is yours. Assemblers. The assemblers allow assembly code to be merged seamlessly with C code. Link libraries automatically use absolute addressing or are compiled in relative mode, and linked with other software modules to get absolute addressing. C Language Compilers. C language compilers are available that support the PSoC family of devices. The products allow you to create complete C programs for the PSoC family devices. The optimizing C compilers provide all the features of C tailored to the PSoC architecture. They come complete with embedded libraries providing port and bus operations, standard keypad and display support, and extended math functionality. Debugger PSoC Designer has a debug environment that provides hardware in-circuit emulation, allowing you to test the program in a physical system while providing an internal view of the PSoC device. Debugger commands allow the designer to read and program and read and write data memory, read and write IO registers, read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The debugger also allows the designer to create a trace buffer of registers and memory locations of interest. Online Help System The online help system displays online, context-sensitive help for the user. Designed for procedural and quick reference, each functional subsystem has its own context-sensitive help. This system also provides tutorials and links to FAQs and an Online Support Forum to aid the designer in getting started. In-Circuit Emulator A low cost, high functionality ICE (In-Circuit Emulator) is available for development support. This hardware has the capability to program single devices. The emulator consists of a base unit that connects to the PC by way of a USB port. The base unit is universal and operates with all PSoC devices. Emulation pods for each device family are available separately. The emulation pod takes the place of the PSoC device in the target board and performs full speed (24 MHz) operation. Page 3 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Designing with PSoC Designer The development process for the PSoC device differs from that of a traditional fixed function microprocessor. The configurable analog and digital hardware blocks give the PSoC architecture a unique flexibility that pays dividends in managing specification change during development and by lowering inventory costs. These configurable resources, called PSoC Blocks, have the ability to implement a wide variety of user-selectable functions. The PSoC development process can be summarized in the following four steps: 1. Select Components 2. Configure Components 3. Organize and Connect 4. Generate, Verify, and Debug Select Components Organize and Connect You build signal chains at the chip level by interconnecting user modules to each other and the IO pins, or connect system-level inputs, outputs, and communication interfaces to each other with valuator functions. In the system-level view selecting a potentiometer driver to control a variable speed fan driver and setting up the valuators to control the fan speed based on input from the pot selects, places, routes, and configures a programmable gain amplifier (PGA) to buffer the input from the potentiometer, an analog-to-digital converter (ADC) to convert the potentiometer’s output to a digital signal, and a PWM to control the fan. In the chip-level view, you perform the selection, configuration, and routing so that you have complete control over the use of all on-chip resources. Both the system-level and chip-level views provide a library of pre-built, pre-tested hardware peripheral components. In the system-level view these components are called “drivers” and correspond to inputs (a thermistor, for example), outputs (a brushless DC fan, for example), communication interfaces (I2C-bus, for example), and the logic to control how they interact with one another (called valuators). Generate, Verify, and Debug In the chip-level view the components are called “user modules.” User modules make selecting and implementing peripheral devices simple, and come in analog, digital, and mixed-signal varieties. Both system-level and chip-level designs generate software based on your design. The chip-level design provides application programming interfaces (APIs) with high-level functions to control and respond to hardware events at run time and interrupt service routines that you can adapt as needed. The system-level design also generates a C main() program that completely controls the chosen application and contains placeholders for custom code at strategic positions allowing you to further refine the software without disrupting the generated code. Configure Components Each of the components you select establishes the basic register settings that implement the selected function. They also provide parameters and properties that allow you to tailor their precise configuration to your particular application. For example, a Pulse Width Modulator (PWM) User Module configures one or more digital PSoC blocks, one for each 8 bits of resolution. The user module parameters permit you to establish the pulse width and duty cycle. Configure the parameters and properties to correspond to your chosen application. Enter values directly or by selecting values from drop-down menus. Both the system-level drivers and chip-level user modules are documented in data sheets that are viewed directly in PSoC Designer. These data sheets explain the internal operation of the component and provide performance specifications. Each data sheet describes the use of each user module parameter or driver property, and other information you may need to successfully implement your design. Document Number: 001-12394 Rev. *F When you are ready to test the hardware configuration or move on to developing code for the project, you perform the “Generate Configuration Files” step. This causes PSoC Designer to generate source code that automatically configures the device to your specification and provides the software for the system. A complete code development environment allows you to develop and customize your applications in C, assembly language, or both. The last step in the development process takes place inside PSoC Designer’s Debugger (access by clicking the Connect icon). PSoC Designer downloads the HEX image to the In-Circuit Emulator (ICE) where it runs at full speed. PSoC Designer debugging capabilities rival those of systems costing many times more. In addition to traditional single-step, run-to-breakpoint and watch-variable features, the debug interface provides a large trace buffer and allows you to define complex breakpoint events that include monitoring address and data bus values, memory locations and external signals. Page 4 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Document Conventions Acronyms Used Units of Measure The following table lists the acronyms that are used in this document. A units of measure table is located in the Electrical Specifications section. Table 7 on page 14 lists all the abbreviations used to measure the enCoRe V devices. Acronym Description API application programming interface CPU central processing unit GPIO general purpose IO GUI graphical user interface ICE in-circuit emulator ILO internal low speed oscillator IMO internal main oscillator IO input/output LSb least significant bit LVD low voltage detect MSb most significant bit POR power on reset PPOR precision power on reset PSoC® Programmable System-on-Chip™ SLIMO slow IMO SRAM static random access memory Document Number: 001-12394 Rev. *F Numeric Naming Hexadecimal numbers are represented with all letters in uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or ‘3Ah’). Hexadecimal numbers may also be represented by a ‘0x’ prefix, the C coding convention. Binary numbers have an appended lowercase ‘b’ (for example, 01010100b’ or ‘01000011b’). Numbers not indicated by an ‘h’, ‘b’, or 0x are decimal. Page 5 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Pin Configuration The enCoRe V USB device is available in a variety of packages which are listed and illustrated in the subsequent tables. 16-Pin Part Pinout P2[5] P0[1] P0[3] P0[7] 15 14 13 7 8 D– P0[4] XRES P1[4] P1[0] Vdd 6 D+ 12 QFN 11 (Top View) 10 9 5 P1[5] P1[1] 1 2 3 4 Vss P2[3] P1[7] 16 Figure 1. CY7C64315/CY7C64316 16-Pin enCoRe V Device Table 1. 16-Pin Part Pinout (QFN) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Type IO IOHR IOHR IOHR Power USB line USB line Power IOHR IOHR Input IOH IOH IOH IOH IO Name P2[3] P1[7] P1[5] P1[1](1, 2) Vss D+ D– Vdd P1[0](1, 2) P1[4] XRES P0[4] P0[7] P0[3] P0[1] P2[5] Description Digital IO, Crystal Input (Xin) Digital IO, SPI SS, I2C SCL Digital IO, SPI MISO, I2C SDA Digital IO, ISSP CLK, 12C SCL, SPI MOSI Ground connection USB PHY USB PHY Supply Digital IO, ISSP DATA, I2C SDA, SPI CLK Digital IO, optional external clock input (EXTCLK) Active high external reset with internal pull down Digital IO Digital IO Digital IO Digital IO Digital IO, Crystal Output (Xout) LEGEND I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output Notes 1. During power up or reset event, device P1[0] and P1[1] may disturb the I2C bus. Use alternate pins if issues are encountered. 2. These are the in-system serial programming (ISSP) pins that are not High Z at power on reset (POR). Document Number: 001-12394 Rev. *F Page 6 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x 32-Pin Part Pinout P0[3] P0[5] P0[7] Vdd P0[6] P0[4] P0[2] 30 29 28 27 26 25 Vss 32 31 Figure 2. CY7C64345 32-Pin enCoRe V USB Device P0[1] 1 P2[5] P2[3] 2 23 P2[6] P2[1] P1[7] 3 4 QFN 22 21 P2[4] P2[2] 5 ( Top View) 20 P2[0] P1[5] 6 19 P3[2] P1[3] P1[1] 7 8 18 P3[0] 17 XRES 11 12 13 14 15 16 D– Vdd P1[0] P1[2] P1[4] P1[6] D+ 9 10 Vss 24 P0[0] Table 2. 32-Pin Part Pinout (QFN) Pin No. Type 1 IOH P0[1] Name 2 IO P2[5] Digital IO, Crystal Output (Xout) 3 IO P2[3] Digital IO, Crystal Input (Xin) 4 IO P2[1] Digital IO 5 IOHR P1[7] Digital IO, I2C SCL, SPI SS 6 IOHR P1[5] Digital IO, I2C SDA, SPI MISO 7 IOHR P1[3] Digital IO, SPI CLK 8 IOHR P1[1](1, 2) Digital IO, ISSP CLK, I2C SCL, SPI MOSI 9 Power Vss Ground 10 IO D+ USB PHY 11 IO D– USB PHY 12 Power Vdd Supply voltage 13 IOHR P1[0](1, 2) Digital IO, ISSP DATA, I2C SDA, SPI CLK 14 IOHR P1[2] Digital IO 15 IOHR P1[4] Digital IO, optional external clock input (EXTCLK) 16 IOHR P1[6] Digital IO 17 Reset XRES Active high external reset with internal pull down 18 IO P3[0] Digital IO 19 IO P3[2] Digital IO 20 IO P2[0] Digital IO 21 IO P2[2] Digital IO 22 IO P2[4] Digital IO 23 IO P2[6] Digital IO Document Number: 001-12394 Rev. *F Description Digital IO Page 7 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Table 2. 32-Pin Part Pinout (QFN) (continued) Pin No. Type Name Description 24 IOH P0[0] Digital IO 25 IOH P0[2] Digital IO 26 IOH P0[4] Digital IO 27 IOH P0[6] Digital IO 28 Power Vdd Supply voltage 29 IOH P0[7] Digital IO 30 IOH P0[5] Digital IO 31 IOH P0[3] Digital IO 32 Power Vss Ground CP Power Vss Ensure the center pad is connected to ground LEGEND I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output Document Number: 001-12394 Rev. *F Page 8 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x 48-Pin Part Pinout P0[0] 38 37 39 Vdd P0[6] P0[4] P0[2] 42 41 40 NC NC P0[7] 43 P0[5] 45 44 46 47 5 6 QFN (Top View) 18 19 20 21 22 23 24 Vss D+ DVdd P1[0] 26 25 P2[6] P2[4] P2[2] P2[0] P4[2] P4[0] P3[6] P3[4] P3[2] P3[0] XRES P1[6] P1[4] 17 P1[2] 16 P1[1] 15 13 14 11 12 30 29 28 27 P1[3] 7 8 9 10 36 35 34 33 32 31 3 4 P1[5] P2[3] P2[1] P4[3] P4[1] P3[7] P3[5] P3[3] P3[1] P1[7] 1 2 NC NC NC P2[7] P2[5] 48 P0[1] Vss P0[3] Figure 3. CY7C64355/CY7C64356 48-Pin enCoRe V USB Device Table 3. 48-Pin Part Pinout (QFN) Pin No. Type Pin Name Description 1 NC NC No connection 2 IO P2[7] Digital IO 3 IO P2[5] Digital IO, Crystal Out (Xout) 4 IO P2[3] Digital IO, Crystal In (Xin) 5 IO P2[1] Digital IO 6 IO P4[3] Digital IO 7 IO P4[1] Digital IO 8 IO P3[7] Digital IO 9 IO P3[5] Digital IO 10 IO P3[3] Digital IO 11 IO P3[1] Digital IO 12 IOHR P1[7] Digital IO, I2C SCL, SPI SS 13 IOHR P1[5] Digital IO, I2C SDA, SPI MISO 14 NC NC No connection 15 NC NC No connection 16 IOHR P1[3] Digital IO, SPI CLK 17 IOHR P1[1](1, 2) Digital IO, ISSP CLK, I2C SCL, SPI MOSI 18 Power Vss Supply ground 19 IO D+ USB 20 IO D– USB 21 Power Vdd Supply voltage 22 IOHR P1[0](1, 2) Digital IO, ISSP DATA, I2C SDA, SPI CLK 23 IOHR P1[2] Digital IO, 24 IOHR P1[4] Digital IO, optional external clock input (EXTCLK) 25 IOHR P1[6] Digital IO Document Number: 001-12394 Rev. *F Page 9 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Table 3. 48-Pin Part Pinout (QFN) (continued) Pin No. Type 26 XRES 27 IO Pin Name Description Ext Reset Active high external reset with internal pull down P3[0] Digital IO 28 IO P3[2] Digital IO 29 IO P3[4] Digital IO 30 IO P3[6] Digital IO 31 IO P4[0] Digital IO 32 IO P4[2] Digital IO 33 IO P2[0] Digital IO 34 IO P2[2] Digital IO 35 IO P2[4] Digital IO 36 IO P2[6] Digital IO 37 IOH P0[0] Digital IO 38 IOH P0[2] Digital IO 39 IOH P0[4] Digital IO 40 IOH P0[6] Digital IO 41 Power Vdd Supply voltage 42 NC NC No connection 43 NC NC No connection 44 IOH P0[7] Digital IO 45 IOH P0[5] Digital IO 46 IOH P0[3] Digital IO 47 Power Vss Supply ground 48 IOH P0[1] Digital IO LEGEND I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output Document Number: 001-12394 Rev. *F Page 10 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Register Reference The section discusses the registers of the enCoRe V device. It lists all the registers in mapping tables, in address order. Register Conventions Register Mapping Tables The register conventions specific to this section are listed in the following table. The enCoRe V device has a total register address space of 512 bytes. The register space is also referred to as IO space and is broken into two parts: Bank 0 (user space) and Bank 1 (configuration space). The XIO bit in the Flag register (CPU_F) determines which bank the user is currently in. When the XIO bit is set, the user is said to be in the “extended” address space or the “configuration” registers. Table 4. Register Conventions Convention Description R Read register or bits W Write register or bits O Only a read/write register or bits L Logical register or bits C Clearable register or bits # Access is bit specific Document Number: 001-12394 Rev. *F Page 11 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Table 5. Register Map Bank 0 Table: User Space Name PRT0DR PRT0IE Addr (0,Hex) Access Name 00 RW EP1_CNT0 01 RW EP1_CNT1 02 EP2_CNT0 03 EP2_CNT1 PRT1DR 04 RW EP3_CNT0 PRT1IE 05 RW EP3_CNT1 06 EP4_CNT0 07 EP4_CNT1 PRT2DR 08 RW EP5_CNT0 PRT2IE 09 RW EP5_CNT1 0A EP6_CNT0 0B EP6_CNT1 PRT3DR 0C RW EP7_CNT0 PRT3IE 0D RW EP7_CNT1 0E EP8_CNT0 0F EP8_CNT1 PRT4DR 10 RW PRT4IE 11 RW 12 13 14 15 16 17 18 PMA0_DR 19 PMA1_DR 1A PMA2_DR 1B PMA3_DR 1C PMA4_DR 1D PMA5_DR 1E PMA6_DR 1F PMA7_DR 20 21 22 23 24 PMA8_DR 25 PMA9_DR 26 PMA10_DR 27 PMA11_DR 28 PMA12_DR SPI_TXR 29 W PMA13_DR SPI_RXR 2A R PMA14_DR SPI_CR 2B # PMA15_DR 2C TMP_DR0 2D TMP_DR1 2E TMP_DR2 2F TMP_DR3 30 USB_SOF0 31 R USB_SOF1 32 R USB_CR0 33 RW USBIO_CR0 34 # USBIO_CR1 35 # EP0_CR 36 # EP0_CNT0 37 # EP0_DR0 38 RW EP0_DR1 39 RW EP0_DR2 3A RW EP0_DR3 3B RW EP0_DR4 3C RW EP0_DR5 3D RW EP0_DR6 3E RW EP0_DR7 3F RW Gray fields are reserved; do not access these fields. Document Number: 001-12394 Rev. *F Addr (0,Hex) Access 40 # 41 RW 42 # 43 RW 44 # 45 RW 46 # 47 RW 48 # 49 RW 4A # 4B RW 4C # 4D RW 4E # 4F RW 50 51 52 53 54 55 56 57 58 RW 59 RW 5A RW 5B RW 5C RW 5D RW 5E RW 5F RW 60 61 62 63 64 RW 65 RW 66 RW 67 RW 68 RW 69 RW 6A RW 6B RW 6C RW 6D RW 6E RW 6F RW 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7D 7E 7F # Access is bit specific. Name PT0_CFG PT0_DATA1 PT0_DATA0 PT1_CFG PT1_DATA1 PT1_DATA0 PT2_CFG PT2_DATA1 PT2_DATA0 Addr (0,Hex) 80 81 82 83 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF Access Name I2C_XCFG I2C_XSTAT I2C_ADDR I2C_BP I2C_CP CPU_BP CPU_CP I2C_BUF CUR_PP STK_PP IDX_PP MVR_PP MVW_PP I2C_CFG I2C_SCR I2C_DR INT_CLR0 INT_CLR1 INT_CLR2 INT_CLR3 INT_MSK2 INT_MSK1 INT_MSK0 INT_SW_EN INT_VC RES_WDT INT_MSK3 RW RW RW RW RW RW RW RW RW CPU_F CPU_SCR1 CPU_SCR0 Addr (0,Hex) C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF Access RW R RW R R RW R RW RW RW RW RW RW RW # RW RW RW RW RW RW RW RW RW RC W RW RL # # Page 12 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Table 6. Register Map Bank 1 Table: Configuration Space Name PRT0DM0 PRT0DM1 Addr (1,Hex) Access Name Addr (1,Hex) Access 00 RW PMA4_RA 40 RW 01 RW PMA5_RA 41 RW 02 PMA6_RA 42 RW 03 PMA7_RA 43 RW PRT1DM0 04 RW PMA8_WA 44 RW PRT1DM1 05 RW PMA9_WA 45 RW 06 PMA10_WA 46 RW 07 PMA11_WA 47 RW PRT2DM0 08 RW PMA12_WA 48 RW PRT2DM1 09 RW PMA13_WA 49 RW 0A PMA14_WA 4A RW 0B PMA15_WA 4B RW PRT3DM0 0C RW PMA8_RA 4C RW PRT3DM1 0D RW PMA9_RA 4D RW 0E PMA10_RA 4E RW 0F PMA11_RA 4F RW PRT4DM0 10 RW PMA12_RA 50 RW PRT4DM1 11 RW PMA13_RA 51 RW 12 PMA14_RA 52 RW 13 PMA15_RA 53 RW 14 EP1_CR0 54 # 15 EP2_CR0 55 # 16 EP3_CR0 56 # 17 EP4_CR0 57 # 18 EP5_CR0 58 # 19 EP6_CRO 59 # 1A EP7_CR0 5A # 1B EP8_CR0 5B # 1C 5C 1D 5D 1E 5E 1F 5F 20 60 21 61 22 62 23 63 24 64 25 65 26 66 27 67 28 68 SPI_CFG 29 RW 69 2A 6A 2B 6B 2C TMP_DR0 6C RW 2D TMP_DR1 6D RW 2E TMP_DR2 6E RW 2F TMP_DR3 6F RW USB_CR1 30 # 70 31 71 32 72 USBIO_CR2 33 RW 73 PMA0_WA 34 RW 74 PMA1_WA 35 RW 75 PMA2_WA 36 RW 76 PMA3_WA 37 RW 77 PMA4_WA 38 RW 78 PMA5_WA 39 RW 79 PMA6_WA 3A RW 7A PMA7_WA 3B RW 7B PMA0_RA 3C RW 7C PMA1_RA 3D RW 7D PMA2_RA 3E RW 7E PMA3_RA 3F RW 7F Gray fields are reserved; do not access these fields. # Access is bit specific. Document Number: 001-12394 Rev. *F Name Addr (1,Hex) Access Name 80 81 82 83 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C IO_CFG 9D OUT_P1 9E 9F A0 OSC_CR0 A1 ECO_CFG A2 OSC_CR2 A3 VLT_CR A4 VLT_CMP A5 A6 A7 A8 IMO_TR A9 ILO_TR AA AB SLP_CFG AC SLP_CFG2 AD SLP_CFG3 AE AF B0 B1 B2 B3 B4 B5 B6 B7 CPU_F B8 B9 BA BB BC BD BE BF Addr (1,Hex) C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF Access RW RW RW # RW RW R W W RW RW RW RL Page 13 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Electrical Specifications This section presents the DC and AC electrical specifications of the enCoRe V USB devices. For the most up to date electrical specifications, verify that you have the most recent data sheet available by visiting the company web site at http://www.cypress.com Figure 4. Voltage versus CPU Frequency Figure 5. IMO Frequency Trim Options 5.5V 5.5V Vdd Voltage Vdd Voltage lid ng Va rati n e io O p eg R SLIMO Mode = 01 SLIMO Mode = 00 SLIMO Mode = 10 3.0V 3.0V 750 kHz 3 MHz 24 MHz 750 kHz CPU Frequency 3 MHz 6 MHz 12 MHz 24 MHz IMO Frequency The following table lists the units of measure that are used in this section. Table 7. Units of Measure Symbol oC dB fF Hz KB Kbit kHz kΩ MHz MΩ µA µF µH µs µV µVrms Unit of Measure degree Celsius decibels femto farad hertz 1024 bytes 1024 bits kilohertz kilohm megahertz megaohm microampere microfarad microhenry microsecond microvolts microvolts root-mean-square Document Number: 001-12394 Rev. *F Symbol µW mA ms mV nA ns nV Ω pA pF pp ppm ps sps s V Unit of Measure microwatts milli-ampere milli-second milli-volts nanoampere nanosecond nanovolts ohm picoampere picofarad peak-to-peak parts per million picosecond samples per second sigma: one standard deviation volts Page 14 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x ADC Electrical Specifications Table 8. ADC Electrical Specifications Symbol Description Min Typ Max Units Conditions Vss 1.3 Volts 5 pF 8 10 Bits Settings 8, 9, or 10 Input Input Voltage Range Input Capacitance Resolution This gives 72% of maximum code 8-Bit Sample Rate 23.4375 ksps Data Clock set to 6 MHz. Sample Rate = 0.001/(2^Resolution/Data clock) 10-Bit Sample Rate 5.859 ksps Data Clock set to 6 MHz. Sample Rate = 0.001/(2^Resolution/Data clock) +2 LSB For any configuration For any configuration DC Accuracy DNL -1 INL -2 Offset Error 0 Operating Current Data Clock +2 LSB 15 90 mV 275 350 µA 12 MHz 2.25 Monotonicity Source is chip’s internal main oscillator. See device data sheet of accuracy. Not guaranteed. See DNL Power Supply Rejection Ration PSRR (Vdd>3.0V) 24 dB PSRR (2.2 < Vdd < 3.0) 30 dB PSRR (2.0 < Vdd < 2.2) 12 dB PSRR (Vdd < 2.0) 0 dB Gain Error Input Resistance Document Number: 001-12394 Rev. *F 1 5 1/(500fF*D 1/(400fF*D 1/(300fF*D ata-Clock) ata-Clock) ata-Clock) %FSR For any resolution Ω Equivalent switched cap input resistance for 8-, 9-, or 10-bit resolution. Page 15 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Electrical Characteristics Absolute Maximum Ratings Storage Temperature (TSTG) (3) ............................................. ..............................................................-55oC to 125oC (Typical +25oC) Supply Voltage Relative to Vss (Vdd) .................................... ......................................................................................... -0.5V to +6.0V DC Input Voltage (VIO)........................................................... .........................................................................Vss - 0.5V to Vdd + 0.5V DC Voltage Applied to Tri-state (VIOZ) ................................... .........................................................................Vss - 0.5V to Vdd + 0.5V Maximum Current into any Port Pin (IMIO)............................. .................................................................................... -25mA to +50 mA Electro Static Discharge Voltage (ESD) (4) ............................ ......................................................................................................2000V Latch-up Current (LU) (5) ....................................................... ................................................................................................... 200 mA Operating Conditions Ambient Temperature (TA) ..................................................... .............................................................................................0oC to 70oC Operational Die Temperature (TJ)(6) ...................................... .............................................................................................0oC to 85oC DC Electrical Characteristics DC Chip Level Specifications Table 9 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 9. DC Chip Level Specifications Parameter Description Conditions Min Typ Max Units 3.0 – 5.5 V Vdd Supply Voltage See table titled DC POR and LVD Specifications on page 18. IDD24 Supply Current, IMO = 24 MHz Conditions are Vdd = 3.0V, TA = 25oC, CPU = 24 MHz, No USB/I2C/SPI. – – 3.1 mA IDD12 Supply Current, IMO = 12 MHz Conditions are Vdd = 3.0V, TA = 25oC, CPU = 12 MHz, No USB/I2C/SPI. – – 2.0 mA IDD6 Supply Current, IMO = 6 MHz Conditions are Vdd = 3.0V, TA = 25oC, CPU = 6 MHz, No USB/I2C/SPI. – – 1.5 mA ISB0 Deep Sleep Current Vdd = 3.0V, TA = 25oC, IO regulator turned off. – 0.1 – µA ISB1 Standby Current with POR, LVD, and Sleep Timer Vdd = 3.0V, TA = 25oC, IO regulator turned off. – – 1.5 µA Notes 3. Higher storage temperatures reduce data retention time. Recommended storage temperature is +25°C ± 25°C. Extended duration storage temperatures above 85oC degrade reliability. 4. Human Body Model ESD. 5. According to JESD78 standard. 6. The temperature rise from ambient to junction is package specific. See Thermal Impedances on page 27. The user must limit the power consumption to comply with this requirement. Document Number: 001-12394 Rev. *F Page 16 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Table 10.DC Characteristics – USB Interface Symbol Min Typ Max Units USB D+ Pull Up Resistance With idle bus 0.900 - 1.575 kΩ Rusba USB D+ Pull Up Resistance While receiving traffic 1.425 - 3.090 kΩ Vohusb Static Output High 2.8 - 3.6 V - 0.3 V Rusbi Description Conditions Volusb Static Output Low Vdi Differential Input Sensitivity 0.2 - Vcm Differential Input Common Mode Range 0.8 - 2.5 V Vse Single Ended Receiver Threshold 0.8 - 2.0 V Cin Transceiver Capacitance Iio High Z State Data Line Leakage Rps2 PS/2 Pull Up Resistance Rext External USB Series Resistor On D+ or D- line In series with each USB pin -10 V - 50 pF - +10 µA 3 5 7 kΩ 21.78 22.0 22.22 Ω DC General Purpose IO Specifications Table 11 lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 3.0V to 5.5V and 0°C ≤ TA ≤ 70°C. Typical parameters apply to 5V and 3.3V at 25°C. These are for design guidance only. Table 11. 3.0V and 5.5V DC GPIO Specifications Symbol RPU VOH1 VOH2 VOH3 VOH4 VOH5 VOH6 VOH7 VOH8 VOH9 VOH10 Description Pull Up Resistor High Output Voltage Port 0, 2, or 3 Pins High Output Voltage Port 0, 2, or 3 Pins High Output Voltage Port 1 Pins with LDO Regulator Disabled High Output Voltage Port 1 Pins with LDO Regulator Disabled High Output Voltage Port 1 Pins with LDO Regulator Enabled for 3V Out High Output Voltage Port 1 Pins with LDO Regulator Enabled for 3V Out High Output Voltage Port 1 Pins with LDO Enabled for 2.5V Out High Output Voltage Port 1 Pins with LDO Enabled for 2.5V Out High Output Voltage Port 1 Pins with LDO Enabled for 1.8V Out High Output Voltage Port 1 Pins with LDO Enabled for 1.8V Out Document Number: 001-12394 Rev. *F Conditions Min 4 IOH < 10 µA, Vdd > 3.0V, maximum of 10 mA Vdd - 0.2 source current in all IOs. IOH = 1 mA Vdd > 3.0, maximum of 20 mA Vdd - 0.9 source current in all IOs. IOH < 10 µA, Vdd > 3.0V, maximum of 10 mA Vdd - 0.2 source current in all IOs. Typ 5.6 – Max 8 – Units kΩ V – – V – – V IOH = 5 mA, Vdd > 3.0V, maximum of 20 mA source current in all IOs. Vdd - 0.9 – – V IOH < 10 µA, Vdd > 3.1V, maximum of 4 IOs all sourcing 5 mA 2.85 3.00 3.3 V IOH = 5 mA, Vdd > 3.1V, maximum of 20 mA source current in all IOs 2.20 – – V IOH < 10 µA, Vdd > 3.0V, maximum of 20 mA source current in all IOs 2.35 2.50 2.75 V IOH = 2 mA, Vdd > 3.0V, maximum of 20 mA source current in all IOs 1.90 – – V IOH < 10 µA, Vdd > 3.0V, maximum of 20 mA source current in all IOs 1.60 1.80 2.1 V IOH = 1 mA, Vdd > 3.0V, maximum of 20 mA source current in all IOs 1.20 – – V Page 17 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Table 11. 3.0V and 5.5V DC GPIO Specifications Symbol VOL Description Low Output Voltage Conditions IOL = 20 mA, Vdd > 3.3V, maximum of 60 mA sink current on even port pins (for example, P0[2] and P1[4]) and 60 mA sink current on odd port pins (for example, P0[3] and P1[5]). Vdd = 3.3 to 5.5. Vdd = 3.3 to 5.5. VIL VIH VH IIL CPIN Input Low Voltage Input High Voltage Input Hysteresis Voltage Input Leakage (Absolute Value) Pin Capacitance Package and pin dependent. Temp = 25oC. Min – Typ – Max 0.75 Units V – 2.0 50 – 0.5 – – 60 0.001 1.7 0.8 V V mV µA pF 200 1 5 DC POR and LVD Specifications Table 12 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 12. DC POR and LVD Specifications Symbol Description VPPOR Vdd Value for PPOR Trip PORLEV[1:0] = 10b, HPOR = 1 VLVD0 VLVD1 VLVD2 VLVD3 VLVD4 VLVD5 VLVD6 VLVD7 Vdd Value for LVD Trip VM[2:0] = 000b VM[2:0] = 001b VM[2:0] = 010b(7) VM[2:0] = 011b VM[2:0] = 100b VM[2:0] = 101b VM[2:0] = 110b VM[2:0] = 111b Min Typ Max Units – 2.82 2.95 V – – 2.85 2.95 3.06 – – 4.62 – – 2.92 3.02 3.13 – – 4.73 – – 2.99 3.09 3.20 – – 4.83 – – V V V – – V Note 7. Always greater than 50 mV above VPPOR (PORLEV = 10) for falling supply. Document Number: 001-12394 Rev. *F Page 18 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x DC Programming Specifications Table 13 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 13. DC Programming Specifications Symbol VddIWRITE IDDP VILP VIHP IILP Description Supply Voltage for Flash Write Operations Supply Current During Programming or Verify Input Low Voltage During Programming or Verify Input High Voltage During Programming or Verify Input Current when Applying Vilp to P1[0] or P1[1] During Programming or Verify(8) IIHP Input Current when Applying Vihp to P1[0] or P1[1] During Programming or Verify(8) VOLV Output Low Voltage During Programming or Verify VOHV Output High Voltage During Programming or Verify FlashENPB Flash Write Endurance(9) FlashDR Flash Data Retention(10) Min 3.0 – – VIH – Typ – 5 – – – Max – 25 VIL – 0.2 Units V mA V V mA – – 1.5 mA – Vdd - 0.9 50,000 10 – – – 20 Vss + 0.75 Vdd – – V V Cycles Years AC Electrical Characteristics AC Chip Level Specifications The following tables list guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 14. AC Chip Level Specifications Symbol FMAX FCPU F32K1 FIMO24 FIMO12 FIMO6 DCIMO TRAMP Description Maximum Operating Frequency(11) Maximum Processing Frequency(12) Internal Low Speed Oscillator Frequency Internal Main Oscillator Stability for 24 MHz ± 5%(13) Internal Main Oscillator Stability for 12 MHz(13) Internal Main Oscillator Stability for 6 MHz(13) Duty Cycle of IMO Supply Ramp Time Min 24 24 19 22.8 11.4 5.7 40 0 Typ – – 32 24 12 6.0 50 – Max – – 50 25.2 12.6 6.3 60 – Units MHz MHz kHz MHz MHz MHz % µs Notes 8. Driving internal pull down resistor. 9. Erase/write cycles per block. 10. Following maximum Flash write cycles at Tamb = 55C and Tj = 70C 11. Vdd = 3.0V and TJ = 85oC, digital clocking functions. 12. Vdd = 3.0V and TJ = 85oC, CPU speed. 13. Trimmed for 3.3V operation using factory trim values. Document Number: 001-12394 Rev. *F Page 19 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Table 15.AC Characteristics – USB Data Timings Min Typ Max Units Tdrate Symbol Full speed data rate Description Average bit rate Conditions 12–0.25% 12 12 + 0.25% MHz Tdjr1 Receiver data jitter tolerance To next transition -18.5 – 18.5 ns Tdjr2 Receiver data jitter tolerance To pair transition -9 – 9 ns Tudj1 Driver differential jitter To next transition -3.5 – 3.5 ns Tudj2 Driver differential jitter To pair transition -4.0 – 4.0 ns Tfdeop Source jitter for differential transition To SE0 transition -2 – 5 ns 175 Tfeopt Source SE0 interval of EOP 160 – Tfeopr Receiver SE0 interval of EOP 82 – Tfst Width of SE0 interval during differential transition ns ns – 14 ns Min Typ Max Units 4 – 20 ns Table 16.AC Characteristics – USB Driver Symbol Tr Description Conditions Transition rise time 50 pF Tf Transition fall time 50 pF TR Rise/fall time matching Vcrs Output signal crossover voltage Document Number: 001-12394 Rev. *F 4 – 20 ns 90.00 – 111.1 % 1.3 – 2.0 V Page 20 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x AC General Purpose IO Specifications Table 17 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 17. AC GPIO Specifications Symbol FGPIO TRise23 TRise01 TFall Description GPIO Operating Frequency Rise Time, Strong Mode Ports 2, 3 Rise Time, Strong Mode Ports 0, 1 Fall Time, Strong Mode All Ports Conditions Normal Strong Mode, Ports 0, 1 Vdd = 3.3 to 5.5V, 10% - 90% Min 0 15 Typ – – Max 12 80 Units MHz ns Vdd = 3.3 to 5.5V, 10% - 90% 10 – 50 ns Vdd = 3.3 to 5.5V, 10% - 90% 10 – 50 ns Max Units Figure 6. GPIO Timing Diagram 90% GPIO Pin Output Voltage 10% TRise23 TRise01 TFall AC External Clock Specifications Table 18 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 18. AC External Clock Specifications Symbol Description Min Typ FOSCEXT Frequency 0.750 – 25.2 MHz – High Period 20.6 – 5300 ns – Low Period 20.6 – – ns – Power Up IMO to Switch 150 – – µs Document Number: 001-12394 Rev. *F Page 21 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x AC Programming Specifications Table 19 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 19. AC Programming Specifications Symbol TRSCLK TFSCLK TSSCLK THSCLK FSCLK TERASEB TWRITE TDSCLK1 TDSCLK2 Description Rise Time of SCLK Fall Time of SCLK Data Setup Time to Falling Edge of SCLK Data Hold Time from Falling Edge of SCLK Frequency of SCLK Flash Erase Time (Block) Flash Block Write Time Data Out Delay from Falling Edge of SCLK, Vdd > 3.6V Data Out Delay from Falling Edge of SCLK, 3.0V<Vdd<3.6V Min 1 1 40 40 0 – – – – Typ – – – – – – – – – Max 20 20 – – 8 18 25 60 85 Units ns ns ns ns MHz ms ms ns ns Figure 7. Timing Diagram - AC Programming Cycle AC SPI Specifications Table 20 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 20. AC SPI Specifications Symbol Description Min Typ Max Units – – 12 MHz Maximum Input Clock Frequency Selection, Slave – – 12 MHz Width of SS_ Negated Between Transmissions 50 – – ns FSPIM Maximum Input Clock Frequency Selection, Master(14) FSPIS TSS Notes 14. Output clock frequency is half of input clock rate. Document Number: 001-12394 Rev. *F Page 22 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x AC I2C Specifications Table 21 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 21. AC Characteristics of the I2C SDA and SCL Pins Symbol Description FSCLI2C SCL Clock Frequency THDSTAI2C Hold Time (repeated) START Condition. After this period, the first clock pulse is generated. TLOWI2C LOW Period of the SCL Clock THIGHI2C HIGH Period of the SCL Clock TSUSTAI2C Setup Time for a Repeated START Condition THDDATI2C Data Hold Time TSUDATI2C Data Setup Time TSUSTOI2C Setup Time for STOP Condition TBUFI2C Bus Free Time Between a STOP and START Condition Pulse Width of spikes are suppressed by the input filter. TSPI2C Standard Mode Min Max 0 100 4.0 – 4.7 4.0 4.7 0 250 4.0 4.7 – – – – – – – – – Fast Mode Min Max 0 400 0.6 – 1.3 0.6 0.6 0 100(15) 0.6 1.3 0 Units kHz µs µs µs µs µs ns µs µs ns – – – – – – – 50 Figure 8. Definition of Timing for Fast/Standard Mode on the I2C Bus SDA TLOWI2C TSUDATI2C THDSTAI2C TSPI2C TBUFI2C SCL S THDSTAI2C THDDATI2C THIGHI2C TSUSTAI2C Sr TSUSTOI2C P S Notes 15. A Fast mode I2C bus device can be used in a standard mode I2C bus system, but the requirement tSU;DAT ≥ 250 ns must then be met. This is automatically the case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the standard mode I2C bus specification) before the SCL line is released. Document Number: 001-12394 Rev. *F Page 23 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Package Diagram This section illustrates the packaging specifications for the enCoRe V USB device, along with the thermal impedances for each package. Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of the enCoRe V emulation tools and their dimensions, refer to the development kit. Packaging Dimensions Figure 9. 16-Pin (3 x 3 mm) QFN 001-09116 *D Document Number: 001-12394 Rev. *F Page 24 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Figure 10. 32-Pin (5 x 5 x 0.55 mm) QFN 001-42168 *B Document Number: 001-12394 Rev. *F Page 25 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Figure 11. 48-Pin (7 x 7 x 0.9 mm) QFN 001-13191 *C Document Number: 001-12394 Rev. *F Page 26 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Thermal Impedances Table 22. Thermal Impedances per Package Typical θJA (16) 32.69 oC/W 19.51 oC/W 17.68oC/W Package 16 QFN 32 QFN(17) 48 QFN(17) Solder Reflow Peak Temperature Following is the minimum solder reflow peak temperature to achieve good solderability. Table 23.Solder Reflow Peak Temperature Package Minimum Peak Temperature(18) Maximum Peak Temperature 16 QFN 240oC 260oC 32 QFN 240oC 260oC 48 QFN 240oC 260oC Ordering Information Ordering Code Package Information CY7C64315-16LKXC 16-Pin QFN (3x3 mm) 16K 1K 11 Mid-tier FS USB dongle, RC-host module CY7C64315-16LKXCT 16-Pin QFN (Tape and Reel) (3x3 mm) 16K 1K 11 Mid-tier FS USB dongle, RC-host module CY7C64316-16LKXC 16-Pin QFN (3x3 mm) 32K 2K 11 Hi-end FS USB dongle, RC-host module CY7C64316-16LKXCT 16-Pin QFN (Tape and Reel) (3x3 mm) 32K 2K 11 Hi-end FS USB dongle, RC-host module CY7C64345-32LQXC 32-Pin QFN (5x5x0.55 mm) 16K 1K 25 Full-speed USB mouse CY7C64345-32LQXCT 32-Pin QFN (Tape and Reel) (5x5x0.55 mm) 16K 1K 25 Full-speed USB mouse CY7C64355-48LTXC 48-Pin QFN (7x7x0.9 mm) 16K 1K 36 Full-speed USB keyboard CY7C64355-48LTXCT 48-Pin QFN (Tape and Reel) (7x7x0.9 mm) 16K 1K 36 Full-speed USB keyboard CY7C64356-48LTXC 48-Pin QFN (7x7x0.9 mm) 32K 2K 36 Hi-end FS USB keyboard CY7C64356-48LTXCT 48-Pin QFN (Tape and Reel) (7x7x0.9 mm) 32K 2K 36 Hi-end FS USB keyboard Flash SRAM No. of GPIOs Target Applications Notes 16. TJ = TA + Power x θJA. 17. To achieve the thermal impedance specified for the package, solder the center thermal pad to the PCB ground plane. 18. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications. Document Number: 001-12394 Rev. *F Page 27 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Document History Page Document Title: CY7C6431x, CY7C64345, CY7C6435x, enCoRe™ V Full-Speed USB Controller Document Number: 001-12394 Rev. ECN No. Orig. of Change Submission Date Description of Change ** 626256 TYJ See ECN New data sheet. *A 735718 TYJ/ARI See ECN Filled in TBDs, added new block diagram, and corrected some values. Part numbers updated as per new specifications. *B 1120404 ARI See ECN Corrected the block diagram and Figure 3, which is the 16-pin enCoRe V device. Corrected the description to pin 29 on Table 2, the Typ/Max values for ISB0 on the DC chip-level specifications, the current value for the latch-up current in the Electrical Characteristics section, and corrected the 16 QFN package information in the Thermal Impedance table. Corrected some of the bulleted items on the first page. Added DC Characteristics–USB Interface table. Added AC Characteristics–USB Data Timings table. Added AC Characteristics–USB Driver table. Corrected Flash Write Endurance minimum value in the DC Programming Specifications table. Corrected the Flash Erase Time max value and the Flash Block Write Time max value in the AC Programming Specifications table. Implemented new latest template. Include parameters: Vcrs, Rpu (USB, active), Rpu (USB suspend), Tfdeop, Tfeopr2, Tfeopt, Tfst. Added register map tables. Corrected a value in the DC Chip-Level Specifications table. *C 1241024 TYJ/ARI See ECN Corrected Idd values in Table 6 - DC Chip-Level Specifications. *D 1639963 AESA See ECN Post to www.cypress.com *E 2138889 TYJ/PYRS See ECN Updated Ordering Code table: - Ordering code changed for 32-QFN package: From -32LKXC to -32LTXC - Added a new package type – “LTXC” for 48-QFN - Included Tape and Reel ordering code for 32-QFN and 48-QFN packages Changed active current values at 24, 12 and 6MHz in table “DC Chip-Level Specifications” - IDD24: 2.15 to 3.1mA - IDD12: 1.45 to 2.0mA - IDD6: 1.1 to 1.5mA Added information on using P1[0] and P1[1] as the I2C interface during POR or reset events *F 2583853 TYJ/PYRS/ HMT 10/10/08 Converted from Preliminary to Final Added operating voltage ranges with USB ADC resolution changed from 10-bit to 8-bit Rephrased battery monitoring clause in page 1 to include “with external components” Included ADC specifications table Included Voh7, Voh8, Voh9, Voh10 specs Flash data retention – condition added to Note [11] Input leakage spec changed to 25 nA max Under AC Char, Frequency accuracy of ILO corrected GPIO rise time for ports 0,1 and ports 2,3 made common AC Programming specifications updated Included AC Programming cycle timing diagram AC SPI specification updated Spec change for 32-QFN package Input Leakage Current maximum value changed to 1 µA Updated VOHV parameter in Table 13 Updated thermal impedances for the packages Update Development Tools, add Designing with PSoC Designer. Edit, fix links and table format. Update TMs. Document Number: 001-12394 Rev. *F Page 28 of 29 [+] Feedback CY7C6431x CY7C64345, CY7C6435x Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at cypress.com/sales. Products PSoC Solutions PSoC psoc.cypress.com Clocks & Buffers Wireless Memories clocks.cypress.com General Low Power/Low Voltage psoc.cypress.com/solutions psoc.cypress.com/low-power wireless.cypress.com Precision Analog memory.cypress.com LCD Drive psoc.cypress.com/lcd-drive CAN 2.0b psoc.cypress.com/can USB psoc.cypress.com/usb Image Sensors image.cypress.com psoc.cypress.com/precision-analog © Cypress Semiconductor Corporation, 2006-2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 001-12394 Rev. *F Revised October 7, 2008 Page 29 of 29 enCoRe™, PSoC Designer™, Programmable System-on-Chip™, and PSoC Express™ are trademarks and PSoC® is a registered trademark of Cypress Semiconductor Corporation. All other trademarks or registered trademarks referenced herein are property of the respective corporations. Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. All products and company names mentioned in this document may be the trademarks of their respective holders. [+] Feedback