CY28405 CK409-Compliant Clock Synthesizer Features • Three differential CPU clock pairs • Supports Intel Springdale/Prescott (CK409) • Selectable CPU frequencies • Dial-A-Frequency® • Supports SMBus/I2C Byte, Word, and Block Read/Write • Ideal Lexmark Spread Spectrum profile for maximum electromagnetic interference (EMI) reduction • 3.3V power supply • Nine copies of PCI clock • Four copies 3V66 clock with one optional VCH • 48-pin SSOP package CPU 3V66 PCI REF 48M • Two copies REF clock x3 x4 x9 x2 x2 Block Diagram Pin Configuration • Two copies 48-MHz USB clock XIN XOUT XTAL OSC Divider Network IREF SELVCH PLL2 2 MODE PD# USB_48 SDATA SCLK I2C Logic WD Timer Cypress Semiconductor Corporation Document #: 38-07512 Rev. *B 3901 North First Street 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VDDA VSSA IREF CPUT_ITP CPUC_ITP VSS_CPU CPUT1 CPUC1 VDD_CPU CPUT0 CPUC0 VSS DNC*** DNC*** VDD VTT_PWRGD# SDATA SCLK 3V66_0 3V66_1 VSS_3V66 VDD_3V66 3V66_2/MODE* 3V66_3/VCH/SELVCH** SSOP-48 * 150k Internal Pull-up ** 150k Internal Pull-down *** Do Not Connect RESET# • 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 CY28405 FS_[A:E] VTT_PWRGD# PLL Ref Freq ~ PLL 1 **FS_A/REF_0 **FS_B/REF_1 VDD_REF VDD_REF REF[0:1] XIN XOUT VDD_CPU VSS_REF CPUT[0:1,ITP], CPUC[0:1,ITP] *FS_C/PCIF0 *FS_D/PCIF1 *FS_E/PCIF2 VDD_PCI VSS_PCI PCI0 PCI1 VDD_3V66 3V66_[0:2] PCI2 PCI3 VDD_PCI VDD_PCI PCIF[0:2] VSS_PCI PCI[0:5] PCI4 PCI5 RESET#/PD# DOT_48 3V66_3/VCH USB_48 VSS_48 VDD_48MHz VDD_48 DOT_48 • San Jose, CA 95134 • 408-943-2600 Revised June 16, 2004 CY28405 Pin Description Pin No. 1, 2 Name REF(0:1) Type O, SE Description Reference Clock. 3.3V 14.318-MHz clock output. 1, 2, 7, 8, 9 FS_A, FS_B, FS_C, FS_D, FS_E I 3.3V LVTTL latched input for CPU frequency selection. 4 XIN I Crystal Connection or External Reference Frequency Input. This pin has dual functions. It can be used as an external 14.318-MHz crystal connection or as an external reference frequency input. 5 XOUT O, SE Crystal Connection. Connection for an external 14.318-MHz crystal output. 39, 42, 45 CPUT(0:1,ITP) O, DIF CPU Clock Output. Differential CPU clock outputs. 38, 41, 44 CPUC(0:1,ITP) O, DIF CPU Clock Output. Differential CPU clock outputs. 36, 35 DNC 30, 29 3V66(0:1) O, SE 66-MHz Clock Output. 3.3V 66-MHz clock from internal VCO. 25 3V66_3/VCH/SELVCH I/O, SE PD 48- or 66-MHz Clock Output. 3.3V selectable through external SELVCH strapping resistor and SMBus to be 66-MHz or 48-MHz. Default is 66-MHz. 0 = 66 MHz, 1 = 48 MHz 26 3V66_2/MODE I/O, SE PU 66-MHz Clock Output. 3.3V 66-MHz clock from internal VCO. Reset or Power-down Mode Select. Selects between RESET# output or PWRDWN# input for the PWRDWN#/RESET# pin. Default is RESET#. 0 = PD#, 1 = RESET 7, 8, 9 PCIF(0:2) O, SE Free Running PCI Output. 33-MHz clocks divided down from 3V66. 12, 13, 14, PCI(0:5) 15, 18, 19 O, SE PCI Clock Output. 33-MHz clocks divided down from 3V66. Do Not Connect. 22 USB_48 O, SE Fixed 48-MHz clock output. 21 DOT_48 O, SE Fixed 48-MHz clock output. 46 IREF 20 RESET#/PD# 33 VTT_PWRGD# I Current Reference. A precision resistor is attached to this pin which is connected to the internal current reference. I/O, PU 3.3V LVTTL input for Power-down# active LOW. Watchdog Timeout Reset Output I 3.3V LVTTL input is a level sensitive strobe used to latch the FS[A:E] input (active LOW). 32 SDATA I/O 31 SCLK I 48 VDDA PWR 3.3V Power supply for PLL. 47 VSSA GND Ground for PLL. 3, 10, 16, VDD(REF,PCI,48,3V66,C 24, 27, 34, PU,ITP) 40 PWR 3.3V Power supply for outputs. 6, 11, 17, VSS(REF,PCI,48,3V66, 23, 28, 37, CPU,ITP) 43 GND Ground for outputs. Document #: 38-07512 Rev. *B SMBus compatible SDATA. SMBus compatible SCLOCK. Page 2 of 19 CY28405 MODE Select Frequency Select Pins The hardware strapping MODE input pin can be used to select the functionality of the RESET#/PD# pin. The default (internal pull up) configuration is for this pin to function as a RESET# Watchdog output. When pulled LOW during device power-up, the RESET#/PD# pin will be configured to function as a Power Down input pin. Host clock frequency selection is achieved by applying the appropriate logic levels to FS_A through FS_E inputs prior to VTT_PWRGD# assertion (as seen by the clock synthesizer). Upon VTT_PWRGD# being sampled low by the clock chip (indicating processor VTT voltage is stable), the clock chip samples the FS_A through FS_E input values. For all logic levels of FS_A through FS_E, VTT_PWRGD# employs a one-shot functionality in that once a valid low on VTT_PWRGD# has been sampled, all further VTT_PWRGD# and FS_A through FS_E transitions will be ignored. Table 1. Frequency Selection Table Input Conditions Output Frequency FS_E FS_D FS_C FS_B FS_A FSEL_4 FSEL_3 FSEL_2 FSEL_1 FSEL_0 CPU 3V66 PCI VCO Freq. PLL Gear Constants (G) 0 0 0 0 0 100.7 67.1 33.6 805.6 24004009.32 0 0 0 0 1 100.2 66.8 33.4 801.6 24004009.32 0 0 0 1 0 108.0 72.0 36.0 864.0 24004009.32 0 0 0 1 1 101.2 67.5 33.7 809.6 24004009.32 0 0 1 0 0 Reserved Reserved Reserved Reserved Reserved 0 0 1 0 1 Reserved Reserved Reserved Reserved Reserved 0 0 1 1 0 Reserved Reserved Reserved Reserved Reserved 0 0 1 1 1 Reserved Reserved Reserved Reserved Reserved 0 1 0 0 0 125.7 62.9 31.4 754.2 32005345.76 0 1 0 0 1 130.3 65.1 32.6 781.6 32005345.76 0 1 0 1 0 133.6 66.8 33.4 801.6 32005345.76 0 1 0 1 1 134.2 67.1 33.6 805.2 32005345.76 0 1 1 0 0 134.5 67.3 33.6 807.0 32005345.76 0 1 1 0 1 148.0 74.0 37.0 888.0 32005345.76 0 1 1 1 0 Reserved Reserved Reserved Reserved Reserved 0 1 1 1 1 Reserved Reserved Reserved Reserved Reserved 1 0 0 0 0 Reserved Reserved Reserved Reserved Reserved 1 0 0 0 1 Reserved Reserved Reserved Reserved Reserved 1 0 0 1 0 167.4 55.8 27.9 669.6 48008018.65 1 0 0 1 1 170.0 56.7 28.3 680.0 48008018.65 1 0 1 0 0 175.0 58.3 29.2 700.0 48008018.65 1 0 1 0 1 180.0 60.0 30.0 720.0 48008018.65 1 0 1 1 0 185.0 61.7 30.8 740.0 48008018.65 1 0 1 1 1 190.0 63.3 31.7 760.0 48008018.65 1 1 0 0 0 100.9 67.3 33.6 807.2 24004009.32 1 1 0 0 1 133.9 67.0 33.5 803.4 32005345.76 1 1 0 1 0 200.9 67.0 33.5 803.6 48008018.65 1 1 0 1 1 Reserved Reserved Reserved Reserved Reserved 1 1 1 0 0 100.0 66.7 33.3 800.0 24004009.32 1 1 1 0 1 133.3 66.7 33.3 800.0 32005345.76 1 1 1 1 0 200.0 66.7 33.3 800.0 48008018.65 1 1 1 1 1 Reserved Reserved Reserved Reserved Reserved Document #: 38-07512 Rev. *B Page 3 of 19 CY28405 Serial Data Interface Data Protocol To enhance the flexibility and function of the clock synthesizer, a two-signal serial interface is provided. Through the Serial Data Interface, various device functions, such as individual clock output buffers, can be individually enabled or disabled. The registers associated with the Serial Data Interface initializes to their default setting upon power-up, and therefore use of this interface is optional. The interface can also be accessed during power-down operation. The clock driver serial protocol accepts Byte Write, Byte Read, Block Write and Block Read operation from any external I2C controller. For Block Write/Read operation, the bytes must be accessed in sequential order from lowest to highest byte (most significant bit first) with the ability to stop after any complete byte has been transferred. For Byte Write and Byte Read operations, the system controller can access individual indexed bytes. The offset of the indexed byte is encoded in the command code, as described in Table 2. The Block Write and Block Read protocol is outlined in Table 3 while Table 4 outlines the corresponding Byte Write and Byte Read protocol. The slave receiver address is 11010010 (D2h). Table 2. Command Code Definition Bit Description 7 0 = Block Read or Block Write operation 1 = Byte Read or Byte Write operation (6:0) Byte offset for Byte Read or Byte Write operation. For Block Read or Block Write operations, these bits should be ‘0000000’ Table 3. Block Read and Block Write Protocol Block Write Protocol Bit 1 2:8 Description Start Slave address – 7 bits Block Read Protocol Bit 1 2:8 Description Start Slave address – 7 bits 9 Write 9 Write 10 Acknowledge from slave 10 Acknowledge from slave 11:18 19 20:27 28 29:36 37 38:45 Command Code – 8-bit ‘00000000’ stands for block operation 11:18 Command Code – 8-bit ‘00000000’ stands for block operation Acknowledge from slave 19 Acknowledge from slave Byte Count – 8 bits 20 Repeat start Acknowledge from slave Data byte 0 – 8 bits Acknowledge from slave Data byte 1 – 8 bits 46 Acknowledge from slave .... Data Byte N/Slave Acknowledge... .... Data Byte N – 8 bits .... Acknowledge from slave .... Stop Document #: 38-07512 Rev. *B 21:27 Slave address – 7 bits 28 Read 29 Acknowledge from slave 30:37 38 39:46 47 48:55 Byte count from slave – 8 bits Acknowledge Data byte from slave – 8 bits Acknowledge Data byte from slave – 8 bits 56 Acknowledge .... Data bytes from slave/Acknowledge .... Data byte N from slave – 8 bits .... Not Acknowledge .... Stop Page 4 of 19 CY28405 Table 4. Byte Read and Byte Write Protocol Byte Write Protocol Bit 1 2:8 9 10 11:18 19 20:27 Byte Read Protocol Description Bit Start 1 Slave address – 7 bits 2:8 Write = 0 Acknowledge from slave Command Code – 8 bits ‘1xxxxxxx’ stands for byte operation, bits[6:0] of the command code represents the offset of the byte to be accessed Acknowledge from slave 29 Stop Write = 0 10 Acknowledge from slave 19 Data byte from master – 8 bits 28 Slave address – 7 bits 9 11:18 Acknowledge from slave Description Start 20 21:27 Command Code – 8 bits ‘1xxxxxxx’ stands for byte operation, bits[6:0] of the command code represents the offset of the byte to be accessed Acknowledge from slave Repeat start Slave address – 7 bits 28 Read = 1 29 Acknowledge from slave 30:37 Data byte from slave – 8 bits 38 Not Acknowledge 39 Stop Byte 0: Control Register 0 Bit @Pup 7 0 Name Description 6 1 PCIF PCI PCI Drive Strength Override 0 = Force All PCI and PCIF Outputs to Low Drive Strength 1= Force All PCI and PCIF Outputs to High Drive Strength 5 0 Reserved Reserved, Set= 0 4 HW FS_E Power up latched value of FS_E pin 3 HW FS_D Power up latched value of FS_D pin 2 HW FS_C Power up latched value of FS_C pin 1 HW FS_B Power up latched value of FS_B pin 0 HW FS_A Power up latched value of FS_A pin Reserved, Set= 0 Byte 1: Control Register 1 Bit @Pup Name 7 0 Reserved Reserved, set = 0 6 1 Reserved Reserved, set = 1 5 1 Reserved Reserved, set = 1 4 1 Reserved Reserved, set = 1 3 1 Reserved Reserved, set = 1 2 1 CPUT_ITP, CPUC_ITP CPUT/C_ITP Output Enable 0 = Disabled (three-state), 1 = Enabled 1 1 CPUT1, CPUC1 CPU(T/C)1 Output Enable, 0 = Disabled (three-state), 1 = Enabled 0 1 CPUT0, CPUC0 CPU(T/C)0 Output Enable 0 = Disabled (three-state), 1 = Enabled Document #: 38-07512 Rev. *B Description Page 5 of 19 CY28405 Byte 2: Control Register 2 Bit @Pup 7 0 Reserved Name Description 6 0 Reserved Reserved, set = 0 5 0 CPUT_ITP, CPUC_ITP CPUT/C_ITP Pwrdwn drive mode 0 = Driven in power- down, 1 = three-state 4 0 CPUT1, CPUC1 CPU(T/C)1 Pwrdwn drive mode 0 = Driven in power-down, 1 = three-state 3 0 CPUT0, CPUC0 CPU(T/C)0 Pwrdwn drive mode 0 = Driven in power-down, 1 = three-state 2 0 Reserved Reserved 1 0 Reserved Reserved 0 0 Reserved Reserved Reserved, set = 0 Byte 3: Control Register 3 Bit @Pup Name Description 7 1 SW PCI_STP Function 0= PCI_STP assert, 1= PCI_STP deassert When this bit is set to 0, all STOPPABLE PCI and PCIF outputs will be stopped in a synchronous manner with no short pulses. When this bit is set to 1, all STOPPED PCI and PCIF outputs will resume in a synchronous manner with no short pulses. 6 1 Reserved Reserved 5 1 PCI5 PCI5 Output Enable 0 = Disabled, 1 = Enabled 4 1 PCI4 PCI4 Output Enable 0 = Disabled, 1 = Enabled 3 1 PCI3 PCI3 Output Enable 0 = Disabled, 1 = Enabled 2 1 PCI2 PCI2 Output Enable 0 = Disabled, 1 = Enabled 1 1 PCI1 PCI1 Output Enable 0 = Disabled, 1 = Enabled 0 1 PCI0 PCI0 Output Enable 0 = Disabled, 1 = Enabled Byte 4: Control Register 4 Bit @Pup Name 7 0 USB_48 USB 48 Drive Strength Control 0 = High Drive Strength, 1 = Low Drive Strength 6 1 USB_48 USB_48 Output Enable 0 = Disabled, 1 = Enabled 5 0 PCIF2 Allow control of PCIF2 with assertion of SW PCI_STP 0 = Free Running, 1 = Stopped with SW PCI_STP 4 0 PCIF1 Allow control of PCIF1 with assertion of SW PCI_STP 0 = Free Running, 1 = Stopped with SW PCI_STP 3 0 PCIF0 Allow control of PCIF0 with assertion of SW PCI_STP 0 = Free Running, 1 = Stopped with SW PCI_STP 2 1 PCIF2 PCIF2 Output Enable 0 = Disabled, 1 = Enabled 1 1 PCIF1 PCIF1 Output Enable 0 = Disabled, 1 = Enabled 0 1 PCIF0 PCIF0 Output Enable 0 = Disabled, 1 = Enabled Document #: 38-07512 Rev. *B Description Page 6 of 19 CY28405 Byte 5: Control Register 5 Bit @Pup Name Description 7 1 DOT_48 6 1 Reserved Reserved 5 HW 3V66_3/VCH/SELVCH 3V66_3/VCH/SELVCH Frequency Select 0 = 3V66 mode, 1 = VCH (48MHz) mode May be written to override the power-up value. 4 1 3V66_3/VCH/SELVCH 3V66_3/VCH/SELVCH Output Enable 0 = Disabled,1 = Enabled DOT_48 Output Enable 0 = Disabled, 1 = Enabled 3 1 Reserved Reserved 2 1 3V66_2 3V66_2 Output Enable 0 = Disabled, 1 = Enabled 1 1 3V66_1 3V66_1 Output Enable 0 = Disabled, 1 = Enabled 0 1 3V66_0 3V66_0 Output Enable 0 = Disabled, 1 = Enabled Byte 6: Control Register 6 Bit @Pup 7 0 Name Description REF PCIF PCI 3V66 3V66_3/VCH/SELVCH USB_48 DOT_48 CPUT, CPUT_ITP CPUC,CPUC_ITP Test Clock Mode 0 = Disabled, 1 = Enabled When Test Clock Mode is enabled, the FS_A/REF_0 pin reverts to a dedicated FS_A input, allowing asynchronous selection between Hi-Z and REF/N mode. 6 0 Reserved Reserved, Set = 0 5 0 Reserved Reserved, Set = 0 4 0 Reserved Reserved, Set = 0 3 0 Reserved Reserved, Set = 0 2 0 PCIF PCI 3V66 CPUT,CPUT_ITP CPUC,CPUC_ITP Spread Spectrum Enable 0 = Spread Off, 1 = Spread On 1 1 REF_1 REF_1 Output Enable 0 = Disabled, 1 = Enabled 0 1 REF_0 REF_0 Output Enable 0 = Disabled, 1 = Enabled Byte 7: Vendor ID Bit @Pup Name Description 7 0 Revision Code Bit 3 6 1 Revision Code Bit 2 5 0 Revision Code Bit 1 4 0 Revision Code Bit 0 3 1 Vendor ID Bit 3 2 0 Vendor ID Bit 2 1 0 Vendor ID Bit 1 0 0 Vendor ID Bit 0 Document #: 38-07512 Rev. *B Page 7 of 19 CY28405 Byte 8: Control Register 8 Bit @Pup 7 0 6 1 5 Name Description 1 CPU PCIF PCI 3V66 Spread Spectrum Selection ‘000’ = ±0.20% triangular ‘001’ = + 0.12, – 0.62% ‘010’ = + 0.25, – 0.75% ‘011’ = –0.05, – 0.45% triangular ‘100’ = ± 0.25% ‘101’ = + 0.00, – 0.50% ‘110’ = ± 0.5% ‘111’ = ± 0.38% 4 0 FSEL_4 SW Frequency selection bits. See Table 1. 3 0 FSEL_3 2 0 FSEL_2 1 0 FSEL_1 0 0 FSEL_0 Byte 9: Control Register 9 Bit @Pup Name Description 7 0 PCIF PCIF Clock Output Drive Strength Control 0 = Low Drive strength, 1 = High Drive strength 6 0 PCI PCI Clock Output Drive Strength 0 = Low Drive strength, 1 = High Drive strength 5 0 3V66 3V66 Clock Output Drive Strength 0 = Low Drive strength, 1 = High Drive strength 4 1 REF REF Clock Output Drive Strength 0 = Low Drive strength, 1 = High Drive strength 3 1 Reserved Reserved 2 1 Reserved Reserved 1 0 Reserved Vendor Test Mode (always program to 0) 0 0 Reserved Vendor Test Mode (always program to 0) Byte 10: Control Register 10 Bit @Pup 7 0 PCI_Skew1 Name 6 0 PCI_Skew0 5 0 3V66_Skew1 4 0 3V66_Skew0 3 1 Reserved Description PCI skew control 00 = Normal 01 = –500 ps 10 = Reserved 11 = +500 ps 3V66 skew control 00 = Normal 01 = –150 ps 10 = +150 ps 11 = +300 ps Reserved, Set = 1 2 1 Reserved Reserved, Set = 1 1 1 Reserved Reserved, Set = 1 0 1 Reserved Reserved, Set = 1 Document #: 38-07512 Rev. *B Page 8 of 19 CY28405 Byte 11: Control Register 11 Bit @Pup Name Description 7 0 Reserved Vendor Test Mode (always program to 0) 6 0 Recovery_Frequency This bit allows selection of the frequency setting that the clock will be restored to once the system is rebooted 0: Use Hardware settings 1: Use Last SW table Programmed values 5 0 Watchdog Time Stamp Reload To enable this function the register bit must first be set to “0” before toggling to “1”. 0: Do not reload 1: Reset timer but continue to count. 4 0 WD_Alarm This bit is set to “1” when the Watchdog times out. It is reset to “0” when the system clears the WD_TIMER time stamp 3 0 WD_TIMER3 2 0 WD_TIMER2 1 0 WD_TIMER1 0 0 WD_TIMER0 Watchdog timer time stamp selection: 0000: Off 0001: 2 second 0010: 4 seconds 0011: 6 seconds . . . 1110: 28seconds 1111: 30seconds Byte 12: Control Register 12 Bit @Pup Name 7 0 CPU_FSEL_N8 6 0 CPU_FSEL_N7 5 0 CPU_FSEL_N6 4 0 CPU_FSEL_N5 3 0 CPU_FSEL_N4 2 0 CPU_FSEL_N3 1 0 CPU_FSEL_N2 0 0 CPU_FSEL_N1 Description If Prog_Freq_EN is set, the values programmed in CPU_FSEL_N[8:0] and CPU_FSEL_M[6:0] will be used to determine the CPU output frequency. The setting of FS_Override bit determines the frequency ratio for CPU and other output clocks. When it is cleared, the same frequency ratio stated in the Latched FS[E:A] register will be used. When it is set, the frequency ratio stated in the SEL[4:0] register will be used. Byte 13: Control Register 13 Bit @Pup 7 0 CPU_FSEL_N0 Name 6 0 CPU_FSEL_M6 5 0 CPU_FSEL_M5 4 0 CPU_FSEL_M4 3 0 CPU_FSEL_M3 2 0 CPU_FSEL_M2 1 0 CPU_FSEL_M1 0 0 CPU_FSEL_M0 Description If Prog_Freq_EN is set, the values programmed in CPU_FSEL_N[8:0] and CPU_FSEL_M[6:0] will be used to determine the CPU output frequency. The setting of FS_Override bit determines the frequency ratio for CPU and other output clocks. When it is cleared, the same frequency ratio stated in the Latched FS[E:A] register will be used. When it is set, the frequency ratio stated in the SEL[4:0] register will be used. Byte 14: Control Register 14 Bit @Pup 7 0 FS_(E:A) Name FS_Override 0 = Select operating frequency by FS(E:A) input pins 1 = Select operating frequency by FSEL(4:0) settings 6 1 Reserved Reserved, Set = 1 5 0 Reserved Reserved, Set = 0 Document #: 38-07512 Rev. *B Description Page 9 of 19 CY28405 Byte 14: Control Register 14 (continued) Bit @Pup Name Description 4 0 Reserved Reserved, Set = 0 3 0 Reserved Reserved, Set = 0 2 0 Reserved Reserved, Set = 0 1 0 Reserved Reserved, Set = 0 0 0 Pro_Freq_EN Programmable output frequencies enabled 0 = Disabled, 1 = Enabled Dial-a-Frequency Programming Crystal Recommendations When the programmable output frequency feature is enabled (Pro_Freq_EN bit is set), the CPU output frequency is determined by the following equation: The CY28405 requires a Parallel Resonance Crystal. Substituting a series resonance crystal will cause the CY28405 to operate at the wrong frequency and violate the ppm specification. For most applications there is a 300-ppm frequency shift between series and parallel crystals due to incorrect loading. Fcpu = G * N/M “N” and “M” are the values programmed in Programmable Frequency Select N-Value Register and M-Value Register, respectively. “G” stands for the PLL Gear Constant, which is determined by the programmed value of FS[E:A] or SEL[4:0]. The value is listed in Table 1. The ratio of N and M need to be greater than “1” [N/M> 1]. The following table lists set of N and M values for different frequency output ranges. This example use a fixed value for the M-Value Register and select the CPU output frequency by changing the value of the N-Value Register. Table 5. Examples of N and M Value for Different CPU Frequency Range Range of N-Value Register for Different CPU Frequency Frequency Ranges Gear Constants Fixed Value for M-Value Register 100 –125 24004009.32 48 200 – 250 126 – 166 32005345.76 48 189 – 249 167 – 200 48008018.65 48 167 – 200 Crystal Loading Crystal loading plays a critical role in achieving low ppm performance. To realize low ppm performance, the total capacitance the crystal will see must be considered to calculate the appropriate capacitive loading (CL). Figure 1 shows a typical crystal configuration using the two trim capacitors. An important clarification for the following discussion is that the trim capacitors are in series with the crystal not parallel. It’s a common misconception that load capacitors are in parallel with the crystal and should be approximately equal to the load capacitance of the crystal. This is not true. Table 6. Crystal Recommendations Frequency (Fund) Cut Loading Load Cap Drive (max.) Shunt Cap (max.) Motional (max.) Tolerance (max.) Stability (max.) Aging (max.) 14.31818 MHz AT Parallel 0.1 mW 5 pF 0.016 pF 50 ppm 50 ppm 5 ppm Document #: 38-07512 Rev. *B 20 pF Page 10 of 19 CY28405 As mentioned previously, the capacitance on each side of the crystal is in series with the crystal. This mean the total capacitance on each side of the crystal must be twice the specified load capacitance (CL). While the capacitance on each side of the crystal is in series with the crystal, trim capacitors (Ce1,Ce2) should be calculated to provide equal capacitative loading on both sides. Use the following formulas to calculate the trim capacitor values for Ce1 and Ce2. Load Capacitance (each side) Figure 1. Crystal Capacitive Clarification Ce = 2 * CL - (Cs + Ci) Calculating Load Capacitors Total Capacitance (as seen by the crystal) In addition to the standard external trim capacitors, trace capacitance and pin capacitance must also be considered to correctly calculate crystal loading. As mentioned previously, the capacitance on each side of the crystal is in series with the crystal. This means the total capacitance on each side of the crystal must be twice the specified crystal load capacitance (CL). While the capacitance on each side of the crystal is in series with the crystal, trim capacitors (Ce1,Ce2) should be calculated to provide equal capacitive loading on both sides. Cs2 Trace 2.8pF XTAL Ce1 1 Ce2 + Cs2 + Ci2 ) CL ....................................................Crystal load capacitance CLe ......................................... Actual loading seen by crystal ...................................... using standard value trim capacitors Ce ..................................................... External trim capacitors Cs ............................................. Stray capacitance (trace,etc) The PD# pin is used to shut off all clocks and PLLs without having to remove power from the device. All clocks are shut down in a synchronous manner so has not to cause glitches while transitioning to the power down state. PD# – Assertion X2 X1 1 1 ( Ce1 + Cs1 + Ci1 + PD# (Power-down) Clarification Ci2 Pin 3 to 6p Cs1 = Ci ............. Internal capacitance (lead frame, bond wires etc) Clock Chip Ci1 CLe Ce2 Trim 33pF Figure 2. Crystal Loading Example When PD# is sampled LOW by two consecutive rising edges of the CPUC clock then all clock outputs (except CPUT) clocks must be held LOW on their next HIGH to LOW transition. CPU clocks must be held with CPUT clock pin driven HIGH with a value of 2x Iref and CPUC undriven as the default condition. There exists an I2C bit that allows for the CPUT/C outputs to be three-stated during power-down. Due to the state of internal logic, stopping and holding the REF clock outputs in the LOW state may require more than one clock cycle to complete PWRDWN# CPUT, 133MHz CPUC, 133MHz 3V66, 66MHz USB, 48MHz PCI, 33MHz REF, 14.31818 Figure 3. Power-down Assertion Timing Waveforms Document #: 38-07512 Rev. *B Page 11 of 19 CY28405 PD# Deassertion The power-up latency between PD# rising to a valid logic ‘1’ level and the starting of all clocks is less than 1.8 ms. The CPUT/C outputs must be driven to greater than 200 mV is less than 300 µs. Tstable <1.8ms PWRDWN# CPUT, 133MHz CPUC, 133MHz 3V66, 66MHz USB, 48MHz PCI, 33MHz REF, 14.31818 Tdrive_PWRDN# <300µs, >200mV Figure 4. Power-down Deassertion Timing Waveforms FS_A, FS_B VTT_PWRGD# PWRGD_VRM 0.2-0.3mS Delay VDD Clock Gen Clock State Clock Outputs Clock VCO State 0 Wait for VTT_PWRGD# State 1 State 2 Off Off Device is not affected, VTT_PWRGD# is ignored Sample Sels State 3 On On Figure 5. VTT_PWRGD Timing Diagram Document #: 38-07512 Rev. *B Page 12 of 19 CY28405 S2 S1 Delay >0.25mS VTT_PWRGD# = Low Sample Inputs straps VDDA = 2.0V Wait for 1.146ms S0 Power Off S3 VDDA = off Normal Operation Enable Outputs VTT_PWRGD# = toggle Figure 6. Clock Generator Power-up/Run State Diagram Document #: 38-07512 Rev. *B Page 13 of 19 CY28405 Absolute Maximum Conditions Parameter Description Condition Min. Max. Unit VDD Core Supply Voltage –0.5 4.6 V VDDA Analog Supply Voltage –0.5 4.6 V VIN Input Voltage Relative to V SS –0.5 VDD + 0.5 VDC TS Temperature, Storage Non-functional –65 +150 °C TA Temperature, Operating Ambient Functional 0 70 °C TJ Temperature, Junction Functional – 150 °C ESDHBM ESD Protection (Human Body Model) MIL-STD-883, Method 3015 ØJC Dissipation, Junction to Case Mil-Spec 883E Method 1012.1 ØJA Dissipation, Junction to Ambient JEDEC (JESD 51) UL–94 Flammability Rating At 1/8 in. MSL Moisture Sensitivity Level 2000 – V 15 °C/W 45 °C/W V–0 1 Multiple Supplies: The voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required. DC Electrical Specifications Parameter Description Conditions Min. Max. Unit 3.135 3.465 V VDD, VDDA 3.3 Operating Voltage 3.3V ± 5% VILI2C Input Low Voltage SDATA, SCLK – – 1.0 VIHI2C Input High Voltage SDATA, SCLK 2.2 – – VIL Input Low Voltage VSS – 0.5 0.8 V VIH Input High Voltage 2.0 VDD + 0.5 V IIL Input Leakage Current Except Pull-ups or Pull-downs 0 < VIN < VDD –5 5 µA VOL Output Low Voltage IOL = 1 mA – 0.4 V VOH Output High Voltage IOH = –1 mA IOZ High-impedance Output Current CIN 2.4 – V –10 10 µA Input Pin Capacitance 2 5 pF COUT Output Pin Capacitance 3 6 pF LIN Pin Inductance – 7 nH VXIH Xin High Voltage 0.7VDD VDD V VXIL Xin Low Voltage 0 0.3VDD V IDD Dynamic Supply Current At 200 MHz and all outputs loaded per Table 9 and Figure 7 – 280 mA IPD Power-down Supply Current PD# Asserted – 1 mA Document #: 38-07512 Rev. *B Page 14 of 19 CY28405 AC Electrical Specifications Parameter Crystal TDC Description XIN Duty Cycle Conditions Min. Max. Unit The device will operate reliably with input duty cycles up to 30/70 but the REF clock duty cycle will not be within specification 47.5 52.5 % TPERIOD XIN period When Xin is driven from an external clock source 69.841 71.0 ns TR / TF XIN Rise and Fall Times Measured between 0.3VDD and 0.7VDD – 10.0 ns TCCJ XIN Cycle to Cycle Jitter As an average over 1 µs duration – 500 ps LACC Long-term Accuracy Over 150ms 300 ppm CPU at 0.7V TDC CPUT and CPUC Duty Cycle Measured at crossing point VOX 45 55 % TPERIOD 100-MHz CPUT and CPUC Period Measured at crossing point VOX 9.9970 10.003 ns TPERIOD 133-MHz CPUT and CPUC Period Measured at crossing point VOX 7.4978 7.5023 ns TPERIOD 200-MHz CPUT and CPUC Period Measured at crossing point VOX 4.9985 5.0015 ns TSKEW Any CPU to CPU Clock Skew Measured at crossing point VOX – 100 ps TCCJ CPU Cycle to Cycle Jitter Measured at crossing point VOX – 125 ps TR / TF CPUT and CPUC Rise and Fall Times Measured from VOL = 0.175 to VOH = 0.525V 175 700 ps TRFM Rise/Fall Matching Determined as a fraction of 2*(TR – TF)/ (TR + TF) – 20 % ∆TR Rise Time Variation – 125 ps ∆TF Fall Time Variation – 125 ps VHIGH Voltage High Math average, see Figure 7 660 850 mv Math average,see Figure 7 –150 – mv 250 550 mv VLOW Voltage Low VOX Crossing Point Voltage at 0.7V Swing VOVS Maximum Overshoot Voltage – VHIGH+0.3 V VUDS Minimum Undershoot Voltage –0.3 – V VRB Ring Back Voltage See Figure 7. Measure SE – 0.2 V 3V66 TDC 3V66 Duty Cycle Measurement at 1.5V 45 55 % TPERIOD Spread Disabled 3V66 Period Measurement at 1.5V 14.9955 15.0045 ns TPERIOD Spread Enabled 3V66 Period Measurement at 1.5V 14.9955 15.0799 ns THIGH 3V66 High Time Measurement at 2.4V 4.9500 – ns TLOW 3V66 Low Time Measurement at 0.4V 4.5500 – ns TR / TF 3V66 Rise and Fall Times Measured between 0.4V and 2.4V 0.5 2.0 ns TSKEW Any 3V66 to Any 3V66 Clock Skew Measurement at 1.5V – 250 ps TCCJ 3V66 Cycle to Cycle Jitter Measurement at 1.5V – 250 ps PCI/PCIF TDC PCIF and PCI Duty Cycle Measurement at 1.5V 45 55 % TPERIOD Spread Disabled PCIF/PCI Period Measurement at 1.5V 29.9910 30.0009 ns TPERIOD Spread Enabled PCIF/PCI Period Measurement at 1.5V 29.9910 30.1598 ns THIGH PCIF and PCI High Time Measurement at 2.4V 12.0 – ns Document #: 38-07512 Rev. *B Page 15 of 19 CY28405 AC Electrical Specifications (continued) Min. Max. Unit TLOW Parameter PCIF and PCI Low Time Description Measurement at 0.4V Conditions 12.0 – ns TR / TF PCIF and PCI Rise and Fall Times Measured between 0.4V and 2.4V 0.5 2.0 ns TSKEW Any PCI Clock to Any PCI Clock Skew Measurement at 1.5V – 500 ps TCCJ PCIF and PCI Cycle to Cycle Jitter Measurement at 1.5V – 250 ps DOT TDC Duty Cycle Measurement at 1.5V 45 55 % TPERIOD Period Measurement at 1.5V 20.8257 20.8340 ns THIGH DOT High Time Measurement at 2.4V 8.994 10.486 ns TLOW DOT Low Time Measurement at 0.4V 8.794 10.386 ns TR / TF Rise and Fall Times Measured between 0.4V and 2.4V 0.5 1.0 ns TCCJ Cycle to Cycle Jitter 10-µs period – 350 ps USB TDC Duty Cycle Measurement at 1.5V 45 55 % TPERIOD Period Measurement at 1.5V 20.8257 20.8340 ns THIGH USB High Time Measurement at 2.4V 8.094 10.036 ns TLOW USB Low Time Measurement at 0.4V 7.694 9.836 ns TR / TF Rise and Fall Times Measured between 0.4V and 2.4V 1.0 2.0 ns TCCJ Cycle to Cycle Jitter 125-µs period – 350 ps REF TDC REF Duty Cycle Measurement at 1.5V 45 55 % TPERIOD REF Period Measurement at 1.5V 69.827 69.855 ns TR / TF REF Rise and Fall Times Measured between 0.4V and 2.4V 1.0 4.0 V/ns TCCJ REF Cycle to Cycle Jitter Measurement at 1.5V – 1000 ps – 1.5 ms 10.0 – ns 0 – ns ENABLE/DISABLE and SET-UP TSTABLE All Clock Stabilization from Power-up TSS Stopclock Set-up Time TSH Stopclock Hold Time Table 7. Group Timing Relationship and Tolerances Offset Group Conditions Min. Max. 3V66 to PCI 3V66 Leads PCI 1.5 ns 3.5 ns Table 8. USB to DOT Phase Offset Parameter Typical Value Tolerance DOT Skew 0° 0.0 ns 1000 ps USB Skew 180° 0.0 ns 1000 ps VCH SKew 0° 0.0 ns 1000 ps Document #: 38-07512 Rev. *B Page 16 of 19 CY28405 Test and Measurement Set-up Table 9. Maximum Lumped Capacitive Output Loads Clock Max Load Units PCI Clocks 30 pF 3V66 Clocks 30 pF USB Clock 20 pF DOT Clock 10 pF REF Clock 30 pF CPUT CPUC For Differential CPU and SRC Output Signals The following diagram shows lumped test load configurations for the differential Host Clock Outputs. M e a s u re m e n t P o in t TPCB 33Ω 4 9 .9 Ω 2pF M e a s u re m e n t P o in t TPCB 33Ω 4 9 .9 Ω IR E F 2pF 475Ω Figure 7. 0.7V Load Configuration O u tp u t u n d e r T e s t P ro b e Load Cap 3 .3 V s ig n a l s tD C - - 3 .3 V 2 .4 V 1 .5 V 0 .4 V 0V Tr Tf Figure 8. Lumped Load For Single-Ended Output Signals (for AC Parameter Measurement) Table 10.CPU Clock Current Select Function Board Target Trace/Term Z Reference R, IREF – VDD (3*RREF) Output Current VOH @ Z 50 Ohms RREF = 475 1%, IREF = 2.32 mA IOH = 6*IREF 0.7V @ 50 Ordering Information Part Number Package Type Product Flow CY28405OC 48-pin Shrunk Small Outline package (SSOP) Commercial, 0° to 70°C CY28405OCT 48-pin Shrunk Small Outline package (SSOP) – Tape and Reel Commercial, 0° to 70°C CY28405OXC 48-pin Shrunk Small Outline package (SSOP) Commercial, 0° to 70°C CY28405OXCT 48-pin Shrunk Small Outline package (SSOP) – Tape and Reel Commercial, 0° to 70°C Lead Free Document #: 38-07512 Rev. *B Page 17 of 19 CY28405 Package Drawing and Dimensions 48-Lead Shrunk Small Outline Package O48 51-85061-*C Purchase of I2C components from Cypress, or one of its sublicensed Associated Companies, conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. Intel and Pentium are registered trademarks of Intel Corporation. Dial-a-Frequency is a registered trademark of Cypress Semiconductor. All product and company names mentioned in this document are trademarks of their respective holders. Document #: 38-07512 Rev. *B Page 18 of 19 © Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges. CY28405 Document History Page Document Title: CY28405 CK409-Compliant Clock Synthesizer Document Number: 38-07512 REV. ECN NO. Issue Date Orig. of Change Description of Change ** 125354 04/15/03 RGL New Data Sheet *A 127159 06/16/03 RGL Removed SRC functionality Modified the title to CK409-Compliant Clock Synthesizer *B 235894 See ECN RGL Removed all items referencing to 166MHz Added Lead Free devices in the ordering information table Document #: 38-07512 Rev. *B Page 19 of 19