PolyZen Devices PolyZen Devices Polymer Protected Zener Diode PolyZen devices are polymer enhanced precision Zener diode micro-assemblies that help protect sensitive electronics from damage caused by inductive voltage spikes, voltage transients, use of incorrect power supplies and reverse bias. The PolyZen micro-assembly incorporates a stable Zener diode for precise voltage clamping and a resistively non-linear, polymeric positive temperature coefficient (PPTC) layer that responds to either diode heating or overcurrent events by transitioning from a low to high resistance state. 4 PolyZen devices help provide resettable protection against damage caused by multi-watt fault events and require only 0.7W power dissipation. In the event of sustained high power conditions, the PPTC element of the device “trips” to limit current and generate voltage drop. This functionality helps protect both the Zener and the follow-on electronics, effectively increasing the diode’s power handling capacity. Benefits Features • Helps shield downstream electronics from overvoltage and reverse bias • RoHS compliant • Trip events shut out overvoltage and reverse bias sources • Hold currents up to 2.3A • Analog nature of trip events minimize upstream inductive spikes • Time delayed, reverse bias trip • Helps reduce design costs with single component placement and minimal heat sinking requirements • Integrated device construction • Overvoltage transient suppression • Time delayed, overvoltage trip • Power handling on the order of 30 watts Applications • Portable media players • Cellphone charger port and USB power • Global positioning systems • Automotive peripheral input power • Hard disk drives 5V & 12V bus • DC power port protection • Solid State Drives (SSD) 5V bus • Industrial handheld POS 27 Figure PZ1 Typical Application Block Diagram for PolyZen Devices Power Supply Protected Electronics (External or internal) 2 VIN 1 + PolyZen Device 3 GND VOUT RLOAD Regulated Output Protected downstream electronics Table PZ1 Electrical Characteristics for PolyZen Devices 4 (Performance ratings @ 25°C unless otherwise specified) VZ(V) NEW VINT MAX IHOLD @ 20°C (A) RTyp (Ω) R1MAX (Ω) IFLT MAX Test Current (A) IFLT MAX (A) Test Voltage (V) Part Number Min. Typ. Max. IZt (A) ZEN056V130A24LS 5.45 5.6 5.75 0.1 1.3 0.12 0.16 24V 3A +10/-40 +24/-16V ZEN065V130A24LS 6.35 6.5 6.65 0.1 1.3 0.12 0.16 24V 3A +6/-40 +24/-16V +24/-16V VINT MAX (V) ZEN098V130A24LS 9.60 9.8 10.00 0.1 1.3 0.12 0.16 24V 3A +3.5/-40 ZEN132V130A24LS 13.20 13.4 13.60 0.1 1.3 0.12 0.16 24V 3A +2/-40 +24/-16V ZEN164V130A24LS 16.10 16.4 16.60 0.1 1.3 0.12 0.16 24V 3A +1.25/-40 +24/-16V ZEN056V230A16LS 5.45 5.6 5.75 0.1 2.3 0.04 0.06 16V 5A +5/-40 +16/-12V ZEN065V230A16LS 6.35 6.5 6.65 0.1 2.3 0.04 0.06 16V 5A +3.5/-40 +16/-12V ZEN132V230A16LS 13.20 13.4 13.60 0.1 2.3 0.04 0.06 16V 5A +2/-40 +20/-12V ZEN056V075A48LS 5.45 5.6 5.75 0.1 0.75 0.28 0.45 48V 3A +10/-40 +48/-16V ZEN132V075A48LM 13.20 13.4 13.60 0.1 0.75 0.28 0.45 48V 3A +2/-40 +48/-16V NEW ZEN056V115A24LS 5.45 5.6 5.75 0.1 1.15 0.15 0.18 24V 3A +10/-40 +24/-16V NEW ZEN056V130A24GS 5.45 5.6 5.75 0.1 1.30 0.12 0.18 24V 3A +6/-40 +24/-16V Coming* Soon ZEN059V130A24LS† 5.80 5.9 6.00 0.1 1.30 0.12 0.16 24V 3A +6/-40 +24/-16V * Data is preliminary † Maximum Reverse Leakage Current = 650µ[email protected] meets USB suspend mode specification Table PZ2 Definitions of Terms for PolyZen Devices VZ Zener clamping voltage measured at current IZt and 20°C. IZt Test current at which VZ is measured. IHOLD Maximum steady state current IPTC that will not generate a trip event at the specified temperature. Ratings assume IFLT = 0A. RTyp Typical resistance between VIN and VOUT pins when the device is at room temperature. R1MAX The maximum resistance between VIN and VOUT pins, at room temperature, one hour after first trip or after reflow soldering. IFLT Current flowing through the Zener diode. IFLT MAX Maximum RMS fault current the Zener diode component of the device can withstand and remain resettable; testing is conducted at rated voltage with no load connected to VOUT. VINT MAX The voltage (VIN - VOUT “post trip”) at which typical qualification devices (98% devices, 95% confidence) survived at least 100 trip cycles and 24 hours trip endurance when “tripped” at the specified voltage and current (IPTC). Trip Event 28 A condition where the PPTC transitions to a high resistance state, thereby limiting IPTC, and significantly increasing the voltage drop between VIN and VOUT. RoHS Compliant, ELV Compliant Polymer PTC VIN VOUT Zener Diode GND IPTC IOUT VIN VOUT IFLT GND PolyZen Devices Figure PZ2-PZ9 Typical Performance Curves for PolyZen Devices Figure PZ2 Figure PZ3 VOUT Peak vs IFLT RMS (IOUT = 0) Time-to-Trip vs IFLT RMS (IOUT = 0) 22.0 10 20.0 E 18.0 A = ZEN056V1yyA24LS/GS B = ZEN065V130A24LS B = ZEN065V130A24LS C = ZEN098V130A24LS D C = ZEN098V130A24LS Time-to-Trip (Sec) 16.0 VOUT Peak (V) A = ZEN056V1yyA24LS/GS D = ZEN132V130A24LS 14.0 E = ZEN164V130A24LS 12.0 C 10.0 8.0 B A 6.0 D = ZEN132V130A24LS 1 E = ZEN164V130A24LS E 0.1 D B C A 4.0 2.0 0 0.01 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 IFLT RMS (A) Figure PZ4 6 7 8 9 10 Figure PZ5 VOUT Peak vs IFLT RMS (IOUT = 0) 4 Time-to-Trip vs IFLT RMS (IOUT = 0) 22.0 100 A = ZEN056V230A16LS 20.0 A = ZEN056V230A16LS B = ZEN065V230A16LS 18.0 B = ZEN065V230A16LS C = ZEN132V230A16LS Time-to-Trip (Sec) C 16.0 VOUT Peak (V) 5 IFLT RMS (A) 14.0 12.0 10.0 8.0 B A 6.0 C = ZEN132V230A16LS 10 1 0.1 B C A 4.0 2.0 0.01 0 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 IFLT RMS (A) Figure PZ6 6 8 9 10 Time-to-Trip vs IFLT RMS (IOUT = 0) 0.0 100 A = ZENxxxV1yyA24LS/GS A = ZENxxxV1yyA24LS/GS B = ZENxxxV230A16LS -0.2 B = ZENxxxV230A16LS 10 Time-to-Trip (Sec) C = ZENxxxV075A48LS/M -0.4 -0.6 -0.8 C = ZENxxxV075A48LS/M 1 0.1 B 0.01 -1.0 A B -1.2 -50 C -40 -30 A C 0.001 -20 -10 0 -50 -40 -30 IFLT RMS (A) -20 -10 0 IFLT RMS (A) Figure PZ8 Figure PZ9 Temperature Effect on IHOLD (IFLT = 0) Time-to-Trip vs IPTC RMS (IFLT = 0) 10 3.5 A = ZENxxxV130A24LS/GS 3.0 A = ZENxxxV1yyA24LS/GS B = ZENxxxV230A16LS B B = ZENxxxV230A16LS 2.5 Time-to-Trip (Sec) C = ZENxxxV075A48LS/M IHOLD (A) 7 Figure PZ7 VOUT Peak vs IFLT RMS (IOUT = 0) VOUT Peak (V) 5 IFLT RMS (A) D = ZENxxxV115A24LS 2.0 A 1.5 D 1.0 C C = ZENxxxV075A48LS/M 1 0.1 0.01 B 0.5 C A 0.001 0.0 -40 -20 0 20 40 Ambient Temperature (˚C) RoHS Compliant 60 80 100 0 5 10 15 20 25 30 35 40 45 IPTC RMS (A) 29 Table PZ3 General Characteristics for PolyZen Devices Operating temperature range Storage temperature ESD withstand Diode capacitance Construction -40° to +85°C -40° to +85°C 15kV 4200pF RoHS compliant Human body model Typical @ 1MHz, 1V RMS Figure PZ10-PZ22 Basic Operation Examples for PolyZen Devices Figure PZ10 Hot-Plug Response ZEN056V130A24LS vs a 22V/120W Universal Power Supply 350 35 C Capacitive Current Spike Voltage (V) and Current (A) Current Pulled to GND via diode 25 B = VOUT Supply Voltage returns to normal Supply Voltage dropped by current 300 C = CURRENT (IFLT) D = POWER 250 A Power (Watts) 30 4 A = VIN 200 20 D 15 PPTC switches to high resistance 10 150 Output Voltage remains clamped 100 A B B 5 50 D VOUT Peak C 0 0 0.01 0.02 0 0.03 0.04 0.05 0.06 0.07 0.08 Time (Sec) Figure PZ11 Figure PZ12 Typical Fault Response: ZEN056V115A24LS 20V, 3.5A Current Limited Source (IOUT=0) 20 18 B = VOUT (V) 16 Voltage (V) or Current (A) Voltage (V) or Current (A) 20 A A = VIN (V) 18 Typical Fault Response: ZEN056V130A24LS 24V, 3.5A Current Limited Source (IOUT=0) C = IFLT (A) 14 12 10 8 B 6 4 2 16 A A = VIN (V) B = VOUT (V) C = IFLT (A) 14 12 10 8 B 6 4 2 C 0 -0.02 0.02 0.06 0.10 0.14 C 0 -0.02 0.18 0.02 0.06 Time (s) 0.18 Figure PZ14 Typical Fault Response: ZEN065V130A24LS 24V, 5.0A Current Limited Source (IOUT=0) Typical Fault Response: ZEN098V130A24LS 24V, 3.5A Current Limited Source (IOUT=0) 26 24 24 A = VIN (V) 22 B = VOUT (V) 20 C = IFLT (A) A Voltage (V) or Current (A) Voltage (V) or Current (A) 0.14 Time (s) Figure PZ13 18 16 14 12 10 B 8 6 22 A = VIN (V) 20 B = VOUT (V) 18 C = IFLT (A) A 16 14 B 12 10 8 6 4 4 2 2 C 0 0 0.01 0.02 0.03 0.04 0.05 Time (s) 30 0.10 RoHS Compliant, ELV Compliant 0.06 0.07 0.08 0.09 0.10 0 0.00 C 0.05 0.10 Time (s) 0.15 Figure PZ15 Typical Fault Response: ZEN164V130A24LS 24V, 1.0A Current Limited Source (IOUT=0) 30 30 A = VIN (V) B = VOUT (V) 25 Voltage (V) or Current (A) A = VIN (V) Voltage (V) or Current (A) Cont’d Figure PZ16 Typical Fault Response: ZEN132V130A24LS 24V, 2.0A Current Limited Source (IOUT=0) A C = IFLT (A) 20 B 15 10 5 B = VOUT (V) 25 A C = IFLT (A) 20 B 15 10 5 C C 0 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0 0.00 0.50 0.10 0.20 Time (s) 0.40 0.50 Figure PZ18 Typical Fault Response: ZEN056V230A16LS 16V, 5.0A Current Limited Source (IOUT=0) 4 Typical Fault Response: ZEN065V230A16LS 16V, 3.5A Current Limited Source (IOUT=0) 20 20 A = VIN (V) A = VIN (V) Voltage (V) or Current (A) Voltage (V) or Current (A) 0.30 Time (s) Figure PZ17 A B = VOUT (V) C = IFLT (A) 15 10 B 5 B = VOUT (V) A C = IFLT (A) 15 10 B 5 C 0 0.00 0.10 0.20 C 0 0.00 0.30 0.10 0.20 Time (s) 0.30 Time (s) Figure PZ19 Figure PZ20 Typical Fault Response: ZEN056V075A48LS 48V, 10.0A Current Limited Source (IOUT=0) Typical Fault Response: ZEN132V230A16LS 20V, 2.0A Current Limited Source (IOUT=0) 50 22 A A = VIN (V) 20 A = VIN (V) B = VOUT (V) 18 Voltage (V) or Current (A) Voltage (V) or Current (A) PolyZen Devices Figure PZ16-PZ22 Basic Operation Examples for PolyZen Devices C = IFLT (A) 16 B 14 12 10 8 6 4 A B = VOUT (V) 40 C = IFLT (A) 30 20 10 B 2 C 0 0 0.05 0.10 0.15 0.20 0.25 C 0 0.00 0.30 0.01 0.02 Figure PZ21 Figure PZ22 Typical Fault Response: ZEN132V075A48LM 48V, 2.0A Current Limited Source (IOUT=0) Typical Fault Response: ZEN056V130A24GS 24V, 1.0A Current Limited Source (IOUT=0) 24 50 Voltage (V) or Current (A) Voltage (V) or Current (A) A A = VIN (V) 45 B = VOUT (V) 40 0.04 Time (s) Time (s) C = IFLT (A) 35 30 25 20 B 15 10 A 22 A = VIN (V) 20 B = VOUT (V) 18 C = IFLT (A) 16 14 12 10 8 B 6 4 5 0 0.03 2 C 0 0.02 0.04 0.06 0.08 0.10 Time (s) RoHS Compliant 0.12 0.14 0.16 C 0 0.18 0.20 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Time (s) 31 Table PZ4 Packaging and Marking Information for PolyZen Devices Part Number Bag Quantity Tape & Reel Quantity Standard Package ZENxxxVyyyAzzLS/M - 3,000 15,000 ZENxxxVyyyAzzGS - 4,000 20,000 Table PZ5 Dimensions for PolyZen Devices ZENxxxVyyyAzzLS/M Devices A mm inch B C Min. Max. Min. Max. Min. 3.85 4.15 3.85 4.15 1.4 2.0 (0.055) (0.081) (0.152) (0.163) (0.152) (0.163) Max. C A 4 B ZENxxxVyyyAzzGS Devices L mm inch W Min. Max. 3.85 4.15 (0.152) (0.163) H Min. Max. 3.85 4.15 (0.152) (0.163) Min. W Max. 1.16 1.25 (0.046) (0.049) L H Table PZ6 Pad Layout and Configuration Information for PolyZen Devices Pin Number Pin Name 1 VIN Pin Function 2 GND GND = Ground 3 VOUT VOUT = Zener regulated voltage output VIN = Protected input to Zener diode Pin Configuration (Top View) Pad Dimensions 0.94mm (0.037”) 2 GND 0.33mm (0.013”) 2.21mm (0.087”) VIN 1 0.94mm (0.037”) 3 VOUT 0.56mm (0.022”) 32 RoHS Compliant, ELV Compliant 2.88mm (0.1135”) 0.56mm (0.022”) PolyZen Devices Solder Reflow and Rework Recommendation for PolyZen Devices Classification Reflow Profiles Profile Feature Average ramp up rate (TsMAX to Tp) Preheat • Temperature min. (TsMIN) • Temperature max. (TsMAX) • Time (tsMIN to tsMAX) Time maintained above: • Temperature (TL) • Time (tL) Peak/Classification temperature (Tp) Time within 5°C of actual peak temperature Time (tp) Ramp down rate Time 25°C to peak temperature Pb-Free Assembly 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds 260°C 20-40 seconds 6°C/second max. 8 minutes max. 4 Note: All temperatures refer to topside of the package, measured on the package body surface. Figure PZ23 tp Critical Zone TL to Tp Tp Ramp up Temperature TL tL TsMAX TsMIN ts Preheat 25 Ramp down t 25˚C to Peak Time Reflow Profile Tape and Reel Specifications for PolyZen Devices (in Millimeters) Figure PZ24 EIA Referenced Taped Component Dimensions for PolyZen Devices (in Millimeters) Description ZENxxxVyyyAzzLS/M Devices ZENxxxVyyyAzzGS Devices A0 4.35 4.35 B0 4.35 4.35 K0 2.30 1.80 8.00 ø1.5 + 0.1 / -0.0 4.00Note 1 ø1.50 Min 0.35 ± 0.05 0.25 R 2.00 ± 0.05Note 3 A 1.75 ± 0.10 R 0.3 Max 5.50 ± 0.05Note 3 B0 12.0 ± 0.3 K0 A0 0.25 A Notes: 1. 10 sprocket hole pitch cumulative tolerance ±0.2 2. Camber in compliance with EIA 481 3. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole RoHS Compliant 33 Figure PZ25 Reel Dimensions for PolyZen Devices (in Millimeters) Matte Fi nish These Area Description Dimension (mm) AMax 330 NMin 102 W1 8.4 W2 11.1 Lock Feature (6 places) NMin ø20.0 Min AMax +0.25 330.0 –4.00 +0.5 ø13.0 –0.2 102.0 Ref 2.0 +/– 0.5 Detail A See “Detail A” W1 (measured at hub) W2 (measured at hub) Part Numbering System for PolyZen Devices 4 ZEN 056V 130A 24 LS/M & GS Special Labeling LS or M = Module Height of 2.0mm GS = Module Height of 1.25mm VINT Max Rating (24 = 24V) PPTC Hold Current Group (130 = 1.3A) Zener Voltage Group (056 = 5.6V) PolyZen Series Part Marking System for PolyZen Devices ZENxxxVyyyAzzLS/M Devices t056 12345 Zener Diode Voltage Rating 056 = 5.6V 059 = 5.9V 065 = 6.5V 098 = 9.8V 132 = 13.4V 164 = 16.4V ZENxxxVyyyAzzGS Devices Zener Diode Voltage Rating 056 = 5.6V t056 1234567 Batch Number Batch Number Warning : All information, including illustrations, is believed to be accurate and reliable. Users, however, should independently evaluate the suitability of and test each product selected for their application. Tyco Electronics Corporation makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use. Tyco Electronics’ only obligations are those in the Tyco Electronics’ Standard Terms and Conditions of Sale for this product, and in no case will Tyco Electronics be liable for any incidental, indirect, or consequential damages arising from the sale, resale, use, or misuse of the product. Specifications are subject to change without notice. In addition, Tyco Electronics reserves the right to make changes to materials or processing that do not affect compliance with any applicable specification without notification to Buyer. 34 RoHS Compliant, ELV Compliant