KMA199
Programmable angle sensor
Rev. 01 — 26 April 2010
Product data sheet
1. Product profile
1.1 General description
The KMA199 is a magnetic angle sensor system. The MagnetoResistive (MR) sensor
bridges and the mixed signal Integrated Circuit (IC) are integrated into a single package.
This angular measurement system KMA199 is pre-programmed, pre-calibrated and
therefore, ready to use.
The KMA199 allows user specific adjustments of angular range, zero angle and clamping
voltages. The settings are stored permanently in an Electrically Erasable Programmable
Read-Only Memory (EEPROM).
1.2 Features and benefits
High precision sensor for magnetic
angular measurement
Automotive qualified in accordance with
AEC-Q100
Programmable user adjustments,
including zero angle and angular range
Fail-safe EEPROM
Independent from the magnetic field
strength above 35 kA/m
User-programmable 32-bit identifier
Ready to use
Ratiometric analog output voltage
Single package sensor system
High temperature range up to 160 °C
Built-in transient protection
Programming via One-Wire Interface
(OWI)
Magnet-loss and power-loss detection
Factory calibrated
KMA199
NXP Semiconductors
Programmable angle sensor
2. Pinning information
Table 1.
Pinning
Pin
Symbol
Description
1
VDD
supply voltage
2
GND
ground
3
OUT/DATA
analog output or data interface
Simplified outline
1
2
3
3. Ordering information
Table 2.
Ordering information
Type number
KMA199
KMA199_1
Product data sheet
Package
Name
Description
Version
-
plastic single-ended multi-chip package;
6 interconnections; 3 in-line leads
SOT880
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VDDS
VDDS
REGULATOR
VDDA
REGULATOR
VDDD
REGULATOR
LOGIC
VSSE
VDD
POWER-ON
RESET
NXP Semiconductors
Vref
Iref
4. Functional diagram
KMA199_1
Product data sheet
VDDE
VSSE
Rev. 01 — 26 April 2010
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POWER
LOST
Cblock
VSINP
MUX
AMPLIFIER
VSINN
2
2
VCOSP
A
D
D
A
OUTPUT
BUFFER
VO
OUT/
DATA
VCOSN
VSSS
TP0
TP1
TEST CONTROL
Q_PUMP
POWER
LOST
TP2
ARRAY
EEPROM
DIGITAL FILTER
OFFSET
AND
CORRECTION
AVERAGING
CORDIC
ALGORITHM
OFFSET
CALCULATION
ANGULAR
RANGE
ADJUSTMENT
ONE-WIRE
INTERFACE
OSC
DIGITAL BLOCKS (LOGIC)
VSSE
magnetoresistive
sensor bridges
008aaa233
KMA199
Functional diagram of KMA199
internal
protection
diodes
Programmable angle sensor
3 of 36
© NXP B.V. 2010. All rights reserved.
Fig 1.
signal conditioning integrated circuit
GND
KMA199
NXP Semiconductors
Programmable angle sensor
5. Functional description
The KMA199 amplifies two orthogonal differential signals which are delivered by MR
sensor bridges and converts them into the digital domain. The angle is calculated using
the COordinate Rotation DIgital Computer (CORDIC) algorithm. After a digital-to-analog
conversion the analog signal is provided to the output. Thus, the output is a linear
representation of the angular value. Zero angle, clamping voltages and angular range are
programmable. In addition, two 16-bit registers are available for customer purposes, like
sample identification.
The KMA199 comprises a Cyclic Redundancy Check (CRC) and an Error Detection and
Correction (EDC) supervision, as well as a magnet-loss detection to ensure a fail-safe
operation. A power-loss detection circuit pulls the analog output to the remaining supply
line, if either the supply voltage or the ground line is interrupted.
After multiplexing the two MR Wheatstone bridge signals and their successive
amplification, the signal is converted into the digital domain by an Analog-to-Digital
Converter (ADC). Further processing is done within an on-chip state machine. This
includes offset cancellation, calculation of the mechanical angle using the CORDIC
algorithm, as well as zero angle and angular range adjustment. The internal
Digital-to-Analog Converter (DAC) and the analog output stage are used for conversion of
the angle information into an analog output voltage, which is ratiometric to the supply
voltage.
The configuration parameters are stored in an user-programmable EEPROM. The OWI
(accessible using pin OUT/DATA) is used for accessing the memory.
5.1 Angular measurement directions
The differential signals of the MR sensor bridges depend only on the direction of the
external magnetic field strength Hext, which is applied parallel to the plane of the sensor.
In order to obtain a correct output signal, the minimum saturation field strength has to be
exceeded.
KMA199_1
Product data sheet
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Rev. 01 — 26 April 2010
© NXP B.V. 2010. All rights reserved.
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KMA199
NXP Semiconductors
Programmable angle sensor
α
Hext
001aag741
Fig 2.
Angular measurement directions
Since the Anisotropic MR (AMR) effect is periodic over 180°, the sensor output is also
180°-periodic, where the angle is calculated relative to a freely programmable zero angle.
The dashed line indicates the mechanical zero degree position.
6. Analog output
The KMA199 provides one analog output signal on pin OUT/DATA. The measured angle
α is converted linearly into a value, which is ratiometric to the supply voltage VDD. Either a
positive or a negative slope is provided for this purpose.
The following table describes the analog output behavior for a positive slope. If for
example, a magnetic field angle, above the programmed maximum angle αmax, but below
the clamp switch angle αsw(CL) is applied to the sensor, then analog output is set to the
upper clamping voltage. If the magnetic field angle is larger than the clamp switch angle,
the analog output switches from upper to lower clamping voltage. In the case of a
negative slope, the clamping voltages are changed.
Table 3.
Analog output behavior for a positive slope
Magnetic field angle
Analog output
αmax < α < αsw(CL)
V(CL)u
αsw(CL) < α < αref + 180°
V(CL)l
The analog output voltage range codes both angular and diagnostic information. A valid
angle value is between the upper and lower clamping voltage. If the analog output is in the
diagnostic range, that is below 4 %VDD or above 96 %VDD, an error condition has been
detected. The analog output repeats every 180°.
KMA199_1
Product data sheet
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KMA199
NXP Semiconductors
Programmable angle sensor
VO
(%VDD)
αrng
V(CL)u
V(CL)I
0
αref
α (deg)
αmax
180
αsw(CL)
αref + 180°
001aag811
αmax = αref + αrng
Fig 3.
Characteristic of the analog output
7. Diagnostic features
The KMA199 provides four diagnostic features:
7.1 EEPROM CRC and EDC supervision
The KMA199 system includes a supervision of the programmed data. At power-on, a CRC
of the EEPROM is performed. Furthermore the EEPROM is protected against bit errors.
Every 16-bit data word is saved internally as a 22-bit word for this purpose. The protection
logic corrects any single-bit error in a data word, while the sensor continues in normal
operation mode. Multiple bit errors per word will be detected and switches the device into
diagnostic mode.
7.2 Magnet-loss detection
If the applied magnetic field strength is not sufficient, the KMA199 raises a diagnostic
condition. In order to enter the diagnostic mode, due to EEPROM CRC or magnet-loss
detection, the device can be programmed into active diagnostic mode, where the output is
driven below 4 %VDD or above 96 %VDD.
7.3 Power-loss detection
The power-loss detection circuits enable the detection of an interrupted supply or ground
line of the KMA199. In the case of a power-loss condition, two internal switches in sensor
are closed, connecting the pin of the analog output with the supply voltage and the ground
pins.
KMA199_1
Product data sheet
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Rev. 01 — 26 April 2010
© NXP B.V. 2010. All rights reserved.
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KMA199
NXP Semiconductors
Programmable angle sensor
KMA199
VDD
ZO(pl)
OUT/DATA
ZO(pl)
GND
008aaa234
Fig 4. Equivalent output circuit in case of a power-loss condition
Table 4 shows the resulting output voltage depending on the error case and the load
resistance.
Table 4.
Power-loss behavior
Load resistance
Supply voltage lost
Ground lost
RL > 5 kΩ
VO ≤ 4 %VDD
VO ≥ 96 %VDD
7.4 Low supply voltage detection
If the supply voltage is below the switch-off threshold voltage, a status bit is set.
Table 5 describes the behavior of the analog output at different supply voltages.
Table 5.
Supply voltage behavior
Voltage range
Description
Analog output
0 V to ≈ 1.5 V
the output drives an active LOW, but the
switches of the power-loss detection circuits
are not fully opened and set the output to a
level between ground and half the supply
voltage
actively driven output to a
voltage level between ground
and half the supply voltage
≈ 1.5 V to VPOR
all modules begin to work and the power-on
reset is active
diagnostics at LOW level
VPOR to Vth(on) or
Vth(off)
all modules begin to work and the digital part is EEPROM defined diagnostic
initialized
level
Vth(on) or Vth(off) to analog output is switched on after power-on
4.5 V
time and represents the measured angle
4.5 V to 5.5 V
KMA199_1
Product data sheet
analog output of the
measured angle without the
specified accuracy
normal operation where the sensor works with analog output of the
the specified accuracy
measured angle
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© NXP B.V. 2010. All rights reserved.
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KMA199
NXP Semiconductors
Programmable angle sensor
8. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VDD
supply voltage
tinit < 200 h
Min
Max
Unit
−0.3
+5.7
V
[1]
-
6.0
V
[2]
−0.3
VDD + 0.3 V
-
150
mA
VO
output voltage
Ir
reverse current
Tamb
ambient temperature
−40
+160
°C
Tamb(pr)
programming ambient temperature
10
70
°C
Tstg
storage temperature
−40
+125
°C
Tamb = 50 °C
17
-
year
Tamb(pr) = 70 °C
100
-
cycle
Min
Typ
Max
Unit
4.5
5.0
5.5
V
−40
-
+160 °C
Tamb < 70 °C
EEPROM
tret(D)
data retention time
Nendu(W_ER) write or erase endurance
[1]
Time until sensor environment is initialized.
[2]
The maximum value of the output voltage is 5.7 V.
9. Recommended operating conditions
Table 7.
Operating conditions
In a homogenous magnetic field.
Symbol
Parameter
Conditions
[1]
VDD
supply voltage
Tamb
ambient temperature
Tamb(pr)
programming ambient temperature
10
-
70
°C
CL
load capacitance
[2]
0
-
22
nF
blocking capacitance
[3]
75
-
∞
nF
RL
load resistance
[4]
5
-
∞
kΩ
Hext
external magnetic field strength
35
-
-
kA/m
Cblock
[1]
Normal operating mode.
[2]
Between ground and analog output, as close as possible to the package for improved electromagnetic
immunity.
[3]
Between ground and supply voltage, as close as possible to the package and with a low equivalent series
resistance.
[4]
Power-loss detection is only possible with a load resistance within the specified range connected to the
supply or ground line.
10. Thermal characteristics
Table 8.
KMA199_1
Product data sheet
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance from junction to
ambient
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Rev. 01 — 26 April 2010
Typ
Unit
120
K/W
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KMA199
NXP Semiconductors
Programmable angle sensor
11. Characteristics
Table 9.
Supply current
Characteristics are valid for the operating conditions, as specified in Section 9.
Symbol
IDD
Parameter
Conditions
[1][2]
supply current
[1]
Normal operating mode.
[2]
Without load current at the analog output.
Min
Typ
Max
Unit
5
-
10
mA
Table 10. Power-on reset
Characteristics are valid for the operating conditions, as specified in Section 9.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Vth(on)
switch-on threshold
voltage
analog output switches on, if
VDD > Vth(on)
4.00
4.30
4.45
V
Vth(off)
switch-off threshold
voltage
analog output switches off, if
VDD < Vth(off)
-
4.20
4.30
V
Vhys
hysteresis voltage
Vhys = Vth(on) − Vth(off)
0.1
-
0.4
V
VPOR
power-on reset voltage
IC is initialized
2.4
-
3.3
V
Table 11. System performance
Characteristics are valid for the operating conditions, as specified in Section 9.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1]
αres
angle resolution
-
-
0.04
deg
αmax
maximum angle
programmable angular range
for V(CL)u − V(CL)l ≥ 80 %VDD
[2]
5
-
180
deg
αref
reference angle
programmable zero angle
[2]
0
-
180
deg
VO(nom)
nominal output voltage
at full supply operating range
5
-
95
%VDD
VO(udr)
upper diagnostic range
output voltage
[3]
96
-
100
%VDD
VO(ldr)
lower diagnostic range
output voltage
[3]
0
-
4
%VDD
V(CL)u
upper clamping voltage
[4]
40
-
95
%VDD
V(CL)l
lower clamping voltage
[4]
5
-
30.5
%VDD
ΔV(CL)
clamping voltage variation
deviation from programmed
value
−0.3
-
+0.3
%VDD
IO
output current
normal operation mode;
operating as sink or source
-
-
2
mA
Vn(o)(RMS)
RMS output noise voltage
equivalent power noise
Δφlin
Δφtemp
linearity error
temperature drift error
KMA199_1
Product data sheet
[5]
-
0.4
2.5
mV
temperature range
−40 °C to +160 °C
[5][6]
−1.2
-
+1.2
deg
temperature range
−40 °C to +140 °C
[5][6]
−1
-
+1
deg
temperature range
−40 °C to +160 °C
[1][5][6]
-
-
0.8
deg
temperature range
−40 °C to +140 °C
[1][5][6]
-
-
0.65
deg
[7]
[7]
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KMA199
NXP Semiconductors
Programmable angle sensor
Table 11. System performance …continued
Characteristics are valid for the operating conditions, as specified in Section 9.
Symbol
Δφtemp⏐RT
Δφhys
Δφμlin
Δφang
Parameter
temperature drift error at
room temperature
hysteresis error
microlinearity error
angular error
mang
slope of angular error
ZO(pl)
power-loss output
impedance
Conditions
Min
Typ
Max
Unit
temperature range
−40 °C to +160 °C
[6][7][8]
-
-
0.65
deg
temperature range
−40 °C to +140 °C
[6][7][8]
-
-
0.55
deg
referred to input
[5][6]
-
-
0.09
deg
referred to input
[5][6]
−0.1
-
+0.1
deg
temperature range
−40 °C to +160 °C
[5][6][9]
−1.35
-
+1.35
deg
temperature range
−40 °C to +140 °C
[5][6][9]
−1.1
-
+1.1
deg
[5][6][9]
-
-
0.04
deg/deg
-
-
210
Ω
impedance to remaining
supply line in case of lost
supply voltage or lost ground
[1]
At a nominal output voltage between 5 %VDD and 95 %VDD and a maximum angle of αmax = 180°.
[2]
In steps of resolution < 0.022°.
[3]
Activation is dependent on the programmed diagnostic mode.
[4]
In steps of 0.02 %VDD.
[5]
At a low-pass filtered analog output with a cut-off frequency of 0.7 kHz.
[6]
Definition of errors is given in Section 12.
[7]
Based on a 3σ standard deviation.
[8]
Room temperature is given for an ambient temperature of 25 °C.
[9]
Graph of angular error is shown in Figure 5.
KMA199_1
Product data sheet
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KMA199
NXP Semiconductors
Programmable angle sensor
1.40
1.35
|Δφang|
(deg)
1.10
(1)
(2)
0.75
0.65
0
−20
−16
−12.25
−1 0 1
12.25
20
16
α1 − α0 (deg)
001aal765
(1) −40 °C to +160 °C.
(2) −40 °C to +140 °C.
Fig 5.
Envelope curve for the magnitude of angular error
Table 12. Dynamics
Characteristics are valid for the operating conditions, as specified in Section 9.
Symbol
Parameter
Conditions
ton
turn-on time
fupd
update frequency
ts
settling time
tcmd(ent)
enter command mode time after power on
[1]
until first valid result
after an ideal mechanical
angle step of 45°, until 90 %
of the final value is reached;
CL = 5 nF
[1]
Min
Typ
Max
Unit
-
-
5
ms
2
3.125
-
kHz
-
-
1.8
ms
16
-
26
ms
Min
Typ
Max
Unit
After reaching the power-on threshold voltage.
Table 13. Digital interface
Characteristics are valid for the operating conditions, as specified in Section 9.
Symbol
Parameter
VIH
HIGH-level input voltage
80
-
-
%VDD
VIL
LOW-level input voltage
-
-
20
%VDD
VOH
HIGH-level output voltage
IO = 2 mA
80
-
-
%VDD
VOL
LOW-level output voltage
IO = 2 mA
-
-
20
%VDD
Iod
overdrive current
absolute value for overdriving
the output buffer
-
-
20
mA
tstart
start time
LOW level before rising edge
5
-
-
μs
KMA199_1
Product data sheet
Conditions
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KMA199
NXP Semiconductors
Programmable angle sensor
Table 13. Digital interface …continued
Characteristics are valid for the operating conditions, as specified in Section 9.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tstop
stop time
HIGH level before falling edge
5
-
-
μs
Tbit
bit period
minimum period may be
limited by the load
capacitance
10
-
100
μs
ΔTbit
bit period deviation
deviation between received
clock and sent clock
0.8Tbit
1Tbit
1.2Tbit
s
tw0
pulse width 0
0.175Tbit
0.25Tbit
0.375Tbit
s
tw1
pulse width 1
0.625Tbit
0.75Tbit
0.825Tbit
s
tto
time-out time
digital communication reset
guaranteed after maximum tto
-
-
220
μs
ttko(slv)
slave takeover time
duration of LOW level for
slave takeover
1
-
5
μs
ttko(mas)
master takeover time
duration of LOW level for
master takeover
0Tbit
-
0.5Tbit
s
tprog
programming time
for a single EEPROM address
20
-
-
ms
tcp
charge pump time
waiting time after enabling the
EEPROM charge pump clock
1
-
-
ms
12. Definition of errors
12.1 General
Angular measurement errors by the KMA199 result from linearity errors, temperature drift
errors and hysteresis errors. Figure 6 shows the output signal of an ideal sensor, where
the measured angle φmeas corresponds ideally to the magnetic field angle α. This curve
will further be denoted as angle reference line φref(α) with a slope of 0.5 %VDD/deg.
φmeas
(deg)
φref(α)
180
α (deg)
001aag812
Fig 6. Definition of the reference line
The angular range is set to αmax = 180° and the clamping voltages are programmed to
V(CL)l = 5 %VDD and V(CL)u = 95 %VDD for a valid definition of errors.
KMA199_1
Product data sheet
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KMA199
NXP Semiconductors
Programmable angle sensor
12.2 Hysteresis error
The hysteresis error Δφhys is defined as the maximum difference between the angles,
given by the device output when performing a positive (clockwise) rotation and negative
(counter clockwise) rotation over an angular range of 180°, measured at a constant
temperature.
φmeas
(deg)
Δφhys
180
α (deg)
001aag813
Fig 7. Definition of the hysteresis error
Equation 1 gives the mathematical description for the hysteresis value Δφhys:
Δφ hys(α) = φ meas(α → 180 °) – φ meas(α → 0 °)
(1)
12.3 Linearity error
The KMA199 output signal deviation from a best straight line φBSL, with the same slope as
the reference line, is defined as linearity error. The magnetic field angle is varied at fixed
temperatures for measurement of this linearity error. The output signal deviation from the
best straight line at the given temperature is the linearity error Δφlin. It is a function of the
magnetic field angle α and the temperature of the device Tamb.
φmeas
(deg)
φBSL(α, Tamb)
φref(α)
Δφlin(α, Tamb)
180
α (deg)
001aag814
Fig 8. Definition of the linearity error
KMA199_1
Product data sheet
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KMA199
NXP Semiconductors
Programmable angle sensor
12.4 Microlinearity error
The microlinearity error Δφμlin is the device output deviation from 1°, if the magnetic field
angle α is changed by Δα = 1°.
φmeas
(deg)
φref(α)
Δφmeas = 1° + Δφμlin(α)
α (deg)
Δα = 1°
001aag815
Fig 9. Definition of the microlinearity error
12.5 Temperature drift error
The temperature drift Δφtemp is defined as the envelope over the deviation of the angle
versus the temperature range. It is considered as the pure thermal effect.
φmeas
(deg)
Ty
Tx
Δφtemp
180
α (deg)
001aag816
Fig 10. Definition of the temperature drift error
Equation 2 gives the mathematical description for temperature drift value Δφtemp:
Δφ temp(α) = φ meas(α , T x) – φ meas(α , T y)
(2)
with:
Tx: temperature for maximum φmeas at angle α
Ty: temperature for minimum φmeas at angle α
KMA199_1
Product data sheet
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Programmable angle sensor
The deviation from the value at room temperature Δφtemp⏐RT describes the temperature
drift of the angle, compared to the value, which the sensor provides at room temperature:
Δφ temp
RT(α ,
T amb) = φ meas(α , T amb) – φ meas(α , T RT)
(3)
with:
TRT: room temperature (25 °C)
12.6 Angular error
The angular error Δφang is the error of angle difference measured by the sensor, if the
mechanical angle deviates from α0 to α1. Here α0 and α1 are arbitrary angles within the
angular range. The angle measurement at α0 is the initially programmed reference angle,
programmed by the customer at room temperature and zero hour upon production. The
angle measurement at α1 is made at any temperature within the ambient temperature
range:
Δφ ang = ( φ meas(α 1 , T amb) – φ meas(α 0 , T RT) ) – ( α 1 – α 0 )
(4)
with:
α0, α1: arbitrary mechanical angles within the angular range
φmeas(α0, TRT): programmed angle at α0, TRT = 25 °C and zero hour upon production
φmeas(α1, Tamb): angle measured by the sensor at α1 and any temperature within Tamb
This error comprises non-linearity and temperature drift related to the room temperature.
|Δφang|
mang
|Δφang(peak)|
|Δφμlin + Δφtemp|RT|
−α*
α0 − 1° α0 + 1°
α0
+α*
α1
001aal766
Fig 11. Definition of the angular error
Figure 11 shows the envelope curve for the magnitude of angular error |Δφang| versus α1
for all angles α0 and all temperatures Tamb within the ambient temperature range. |Δφang|
has its minimum, if α1 is in the range of ±1° around α0. Here only the microlinearity error
Δφμlin and the temperature drift related to the room temperature |Δφtemp⏐RT| occurs. If α1
deviates from α0 by more than 1° in either direction, |Δφang| can increase with a gradient
defined by slope mang.
KMA199_1
Product data sheet
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KMA199
NXP Semiconductors
Programmable angle sensor
Angular error can be expressed by Equation 5 to Equation 8:
for |α1 − α0| ≤ 1°
Δφ ang = Δφ μlin + Δφ temp
(5)
RT
for 1° < |α1 − α0| < α*
Δφ ang = Δφ μlin + Δφ temp
RT
+ m ang × ( α 1 – α 0 – 1° )
(6)
RT )
(7)
for |α1 − α0| ≥ α*
Δφ ang =
( Δφ lin ) 2 + ( Δφ temp
2
with:
Δφ ang(peak) – Δφ μlin + Δφ temp RT
α∗ = ----------------------------------------------------------------------------------- + α 0 + 1°
m ang
(8)
13. Programming
13.1 General description
The KMA199 provides an OWI to enable programming of the device which uses
pin OUT/DATA bidirectionally.
In general the device runs in analog output mode, the normal operating mode. This mode
is configured by the embedded programming data and is started after a power-on reset
once time ton has elapsed. In this mode, the magnetic field angle is converted into the
corresponding output voltage.
Command mode has to be entered to enable programming. In this mode, the customer
can adjust all required parameters (for example zero angle and angular range) to meet the
application requirements. After enabling the internal charge pump and waiting for tcp the
data is stored in the EEPROM. After changing the contents of the EEPROM, the
checksum must be recalculated and written (see Section 13.4).
In order to enter the command mode, a specific command sequence must be send after a
power-on reset and during the time slot tcmd(ent). The external source used to send the
command sequence must overdrive the output buffer of the KMA199 (I > Iod).
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Programmable angle sensor
During communication, the KMA199 is always the slave and the external programming
hardware is the master. Figure 12 illustrates the structure of the OWI data format.
write
IDLE
START COMMAND DATA BYTE 1 DATA BYTE 2 STOP
IDLE
read
IDLE
START COMMAND HANDOVER DATA BYTE 1 DATA BYTE 2 TAKEOVER STOP IDLE
001aag742
Fig 12. OWI data format
The master provides the start condition, which is a rising edge after a LOW level. Then a
command byte which can be either a read or a write command is send. Depending on the
command, the master or the slave has to send the data immediately after the command
sequence. In the case of a read command, an additional handover or takeover bit is
inserted before and after the data bytes. Each communication must be closed with a stop
condition driven by the master. If the slave does not receive a rising edge for a time longer
than tto, a time-out condition occurs. The bus is reset to the idle state and waits for a start
condition and a new command. This can be used to synchronize the device regardless of
the previous state.
All communication is based on this structure (see Figure 12), even for entering the
command mode. In this case a special write command is required, followed by the
command sequence (two data bytes). The customer can access the EEPROM, CTRL1,
TESTCTRL0 and SIGNATURE registers (described in Section 13.5). Only a power-on
reset will leave the command mode. A more detailed description of the programming is
given in the next sections.
13.2 Timing characteristics
As described in the previous section, a start and stop condition is necessary for
communication. The LOW-level duration before the rising edge of the start condition is
defined as tstart. The HIGH-level duration after the rising edge of the stop condition is
defined as tstop. These parameters, together with all other timing characteristics are
shown in Table 13.
tstart
tstop
001aag817
Fig 13. OWI start and stop condition
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Figure 14 shows the coding of a single bit with a HIGH level of VIH and a LOW level of VIL.
Here the pulse width t1 or t0 represents a logic 1 or a logic 0 of a full bit period Tbit,
respectively.
bit = 0
bit = 1
Tbit
0.175
Tbit
0.375
0.625
tw0
0.825
tw1
0.25
0.75
001aag818
Fig 14. OWI timing
13.3 Sending and receiving data
The master has to control the communication during sending or receiving data.
The command byte defines the region, address and type of command requested by the
master. In case of a read command, an additional handover or takeover bit must be
inserted before and after the two data bytes (see Figure 12). However the OWI is a serial
data transmission, whereas the Most Significant Byte (MSB) must be send at first.
Table 14.
Format of a command byte
7
6
5
4
3
2
1
0
CMD7
CMD6
CMD5
CMD4
CMD3
CMD2
CMD1
CMD0
Table 15.
Command byte bit description
Bit
Symbol
Description
7 to 5
CMD[7:5]
region bits
000 = 16-bit EEPROM
001 to 011 = reserved
100 = 16-bit register
101 to 111 = reserved
4 to 1
CMD[4:1]
address bits
0
CMD0
read/write
0 = write
1 = read
A more detailed description of all customer accessible registers is given in Section 13.5.
Both default value and the complete command including the address and write or read
request are also listed.
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Programmable angle sensor
13.3.1 Write access
To write data to the EEPROM, the internal charge pump must be enabled by setting the
bits EEP_CP_CLOCK_EN and EEP_WRITE_EN and waiting for tcp. The following
procedure must be performed:
•
•
•
•
Start condition: The master drives a rising edge after a LOW level
Command: The master sends a write command (CMD0 = 0)
Data: The master sends two data bytes
Stop condition: The master drives a rising edge after a LOW level
Figure 15 shows the write access of the digital interface. The signal OWI represents the
data on the bus from the master or slave. The signals master output enable and slave
output enable just symbolize if the master or the slave output is enabled or disabled,
respectively.
START
CMD7
CMD0
WDATA15
WDATA0
STOP
IDLE
master
output
enable
OWI
(2)
slave
output
enable
(1)
001aag743
(1) Missing rising edges generate a time-out condition and the written data is ignored.
(2) If the master does not drive the bus, the bus is defined by the bus-pull.
Fig 15. OWI write access
Note: As already mentioned in Section 13.1, the command mode has to be entered using
the write procedure. If command mode is not entered, digital communication is not
possible and the sensor operates in normal operating mode. After changing an address,
the time tprog must elapse before changing another address. Finally the checksum must
be recalculated and written, after changing the contents of the EEPROM
(see Section 13.4).
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Programmable angle sensor
13.3.2 Read access
To read data from the sensor, the following procedure must be performed:
• Start condition: The master drives a rising edge after a LOW level
• Command: The master sends a read command (CMD0 = 1)
• Handover: The master sends a handover bit, that is a logic 0 and disables the output
after a three-quarter bit period
• Takeover: The slave drives a LOW level after the falling edge for ttko(slv)
• Data: The slave sends two data bytes
• Handover: The slave sends a handover bit, that is a logic 0 and disables the output
after a three-quarter bit period
• Takeover: The master drives a LOW level after the falling edge for ttko(mas)
• Stop condition: The master drives a rising edge after a LOW level
Figure 16 shows the read access of the digital interface. The signal OWI represents the
data on the bus from the master or slave. The signals master output enable and slave
output enable just symbolize if the master or the slave output is enabled or disabled,
respectively.
START
CMD7
CMD0
HANDSHAKE
RDATA15
RDATA0
HANDSHAKE
STOP
IDLE
master
output
enable
(3)
OWI
(5)
(1)
slave
output
enable
(2)
(2)
(4)
001aag744
(1) Duration of LOW level for slave takeover ttko(slv).
(2) There is an overlap in the output enables of master and slave, because both drive a LOW level.
However this ensures the independency from having a pull-up or pull-down on the bus. In addition
it improves the ElectroMagnetic Compatibility (EMC) robustness, because all levels are actively
driven.
(3) Duration of LOW level for master takeover ttko(mas).
(4) If the master does not take over and a pull-up exists, the stop condition is generated by the pull-up.
Otherwise a time-out is generated if there is a pull-down and the slave waits for a rising edge as
start condition.
(5) If the master does not drive the bus, the bus is defined by the bus-pull.
Fig 16. OWI read access
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13.3.3 Entering the command mode
After a power-on reset, the sensor provides a time slot tcmd(ent) for entering the command
mode. A specific command sequence has to be send (see Figure 17). If command mode
is not entered, the sensor starts in the normal operating mode. However the signature can
be written by the master, if the sensor switches to diagnostic mode.
During the command mode sequence, the analog output is enabled. The external
programming hardware has to overdrive the output with the current Iod. If command mode
is activated, the analog output is disabled and pin OUT/DATA operates as a digital
interface.
tcmd(ent)
VDD
OWI
START
94h
command
9Bh
A4h
STOP
signature
001aag819
Fig 17. OWI command mode procedure
13.4 Cyclic redundancy check
As already mentioned in Section 7, there is an 8-bit checksum for the EEPROM data.
To calculate this value, the CRC needs to be generated with the MSB of the EEPROM
data word at first over all corresponding addresses in increasing order.
All addresses from 0h to Fh have to be read out for calculating the checksum. The Least
Significant Byte (LSB) of address Fh which contains the previous checksum must be
overwritten with 0h before the calculation can be started.
Finally, the internal charge pump has to be enabled for programming by setting the bits
EEP_CP_CLOCK_EN and EEP_WRITE_EN (see Table 16) and waiting for tcp.
The generator polynomial for the calculation of the checksum is:
8
2
G(x) = x + x + x + 1
(9)
With a start value of FFh and the data bits are XOR at the x8 point.
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Programmable angle sensor
13.4.1 Software example in C
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
#include <stdio.h.>
// calc_crc accepts unsigned 16-bit data in data
int calc_crc(int crc, unsigned int data)
{
const int gpoly = 0x107; // generator polynomial
int i;
//index variable
for (i = 15; i >= 0; i--)
{
crc <<= 1;
//shift left
crc |= (int) ((data & (1u<<i))>>i);
// XOR of with generator polynomial when MSB(9) = HIGH
if (crc & 0x100) crc ^= gpoly;
}
return crc;
}
int main(void)
{
int crc, crc_res, i;
// 8 LSB are CRC field filled with 0
unsigned int data_seq[] = {0x1111, 0x2222, 0x3333, 0x4444,
0x5555, 0x6666, 0x7777, 0x8888,
0x9999, 0xAAAA, 0xBBBB, 0xCCCC,
0xDDDD, 0xEEEE, 0xFFFF, 0x4200};
// calculate checksum over all data
crc = 0xFF;
// start value of crc register
printf(“Address\tValue\n”);
for (i = 0; i <= 15; i++)
{
printf(“0x%1X\t0x%04X\n”, i, data_seq[i]);
crc = calc_crc(crc, data_seq[i]);
}
crc_res = crc;
// crc_res = 0x6F
printf(“\nChecksum\n0x%02X\n”, crc_res);
// check procedure for above data sequence
crc = 0xFF;
for (i = 0; i <= 14; i++)
crc = calc_crc(crc, data_seq[i]);
// last word gets crc inserted
crc = calc_crc(crc, data_seq[i] | crc_res);
printf(“\nCheck procedure for data sequence: must be 0x00 is 0x%02X.\n”,crc);
return 1;
}
The checksum of this data sequence is 6Fh.
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Programmable angle sensor
13.5 Registers
13.5.1 Command registers
To enter the command mode, the signature given in Table 16 must be written using the
OWI into the specific register. This must be done as described in Section 13.3.3, with a
write command, followed by the signature, but after a power-on reset and not later than
tcmd(ent).
Table 16.
Command registers
Command Register
write/read
Bit
Access Field
Description
82h/83h
15
R
IN_DIAG_MODE
shows if there is a diagnostic condition present;
this bit is not affected by the setting of the register
field FORCE_DIAG_OFF
14
R/W
FORCE_DIAG_OFF
force diagnostic mode off; default: 0b
13
-
-
reserved
12
R
LOW_VOLTAGE_DET low voltage condition detected
11
R/W
EEP_CP_CLOCK_EN
charge pump clock on (must be set after setting
EEPROM write enable signal for writing to
EEPROM); default: 0b
10 and 9 -
-
reserved
8
R
EEP_ERR_CORRECT EDC: EEPROM error has been corrected; updated
every EEPROM readout and remains set once set
7
R
EEP_UNCORR_ERR
6
R
MAGNET_LOSS_DET magnet-loss detected; bit remains set even if the
condition disappears; for this detection which leads
to diagnostic mode, the magnet-loss detection
must be enabled
5
-
-
reserved
4
R
CRC_BAD
CRC check has failed (checked during start-up)
3 to 0
-
-
reserved
CTRL1
EDC: EEPROM uncorrectable error has been
detected; updated every EEPROM readout and
remains set once set
94h/-
SIGNATURE 15 to 0
W
SIGNATURE
write signature 9BA4h within tcmd(ent) to enter
command mode; see Section 13.3.3 for more
details
96h/97h
TESTCTRL0 15 to 12
-
-
reserved
W
EEP_WRITE_EN
EEPROM write enable signal (must be set before
writing to EEPROM)
11
0605h — disabled (default)
0E05h — enabled
10 to 0
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-
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Programmable angle sensor
13.5.2 EEPROM registers
The device includes several internal registers which are used for customization and
identification.
The initial signature allows read access to all areas but only write access to customer
registers. Write accesses to reserved areas are ignored. Since these registers are
implemented as EEPROM cells, writing to the registers needs a specific time tprog after
each write access to complete.
As there is no check for the programming time, the user must make sure no other
accesses to the EEPROM are made during the programming cycle. The EEPROM must
not be addressed during the time tprog.
Note: Before data can be stored in the EEPROM, the internal charge pump has to be
switched on for the programming duration by setting register CTRL1, bit 11
EEP_CP_CLOCK_EN and register TESTCTRL0, bit 11 EEP_WRITE_EN. All register
addresses have to be read out for calculating the checksum. However, some register
addresses are reserved for calibration.
Table 17.
EEPROM registers
Address Command Register
write/read
Bit
Description
Default
MSB/LSB
0h
-/01h
-
addresses are reserved for calibration purposes
[1]
1h
-/03h
2h
-/05h
3h
-/07h
4h
-/09h
5h
-/0Bh
6h
-/0Dh
7h
0Eh/0Fh
ZERO_ANGLE
15 to 0
mechanical zero degree position
00h/00h
8h
10h/11h
MAGNET_LOSS
15 to 0
magnet-loss detection
00h/00h
reserved
Note: These addresses have to be read out for
calculating the checksum.
0000h — disabled
004Fh — enabled
9h
Ah
12h/13h
14h/15h
ANG_RNG_MULT_LSB 15 to 3
CLAMP_LO
least significant bits of the angular range
multiplicator
2 to 0
undefined[2]
15 to 13
undefined[2]
12 to 0
lower clamping level output voltage
15 to 13
undefined[2]
20h/00h
01h/00h
Bh
16h/17h
CLAMP_HI
12 to 0
upper clamping level output voltage
Ch
18h/19h
ID_LO
15 to 0
lower 16 bits of identification code
00h/00h
Dh
1Ah/1Bh
ID_HI
15 to 0
upper 16 bits of identification code
00h/00h
Eh
1Ch/1Dh
CLAMP_SW_ANGLE
15 to 6
when angle is bigger than CLAMP_SW_ANGLE
the output switches to CLAMP_LO for a positive
slope
FFh/C1h
ANG_RNG_MULT_MSB 5 to 0
KMA199_1
Product data sheet
12h/FFh
most significant bits of the angular range
multiplicator
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Table 17.
EEPROM registers …continued
Address Command Register
write/read
Bit
Fh
15 and 14 undefined[2]
1Eh/1Fh
EEP_CTRL_CUST
Description
Default
MSB/LSB
0Ch/[1]
13 and 12 DIAGNOSTIC_LEVEL; diagnostic level behavior
of the analog output
00b — active LOW (in lower diagnostic range)
with driver strength of the analog output
01b — active HIGH (in upper diagnostic range)
with driver strength of the analog output
10b — reserved
11b — reserved
11 and 10 reserved; may not be changed
9
undefined[2]
8
SLOPE_DIR; slope of analog output
0b — rising (not inverted)
1b — falling (inverted)
7 to 0
[1]
Variable and individual for each device.
[2]
Undefined; must be written as zero for default.
CRC; checksum over all data (see Section 13.4)
Table 18. ZERO_ANGLE - mechanical zero degree position (address 7h) bit allocation
Data format: unsigned fixed point; resolution: 2−16.
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Value
2−1
2−2
2−3
2−4
2−5
2−6
2−7
2−8
2−9
2−10
2−11
2−12
2−13
2−14
2−15
2−16
Mechanical angular range 0000h = 0° to FFFFh = 180° − 1 LSB
Examples:
• Mechanical zero angle 0° = 0000h
• Mechanical zero angle 10° = 0E38h
• Mechanical zero angle 45° = 4000h
Table 19. ANG_RNG_MULT_LSB - least significant bits of angular range multiplicator (address 9h) bit allocation
Data format: unsigned fixed point; resolution: 2−14.
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Value
2−2
2−3
2−4
2−5
2−6
2−7
2−8
2−9
2−10
2−11
2−12
2−13
2−14
U[1]
U[1]
U[1]
[1]
Undefined; must be written as zero for default and may return any value when read.
CLAMP_HI – CLAMP_LO
180°
ANG_RNG_MULT = ------------------------------------------------------------------- × --------------------------------------------------8192
ANGULAR_RANGE
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Table 20. CLAMP_LO - lower clamping level output voltage (address Ah) bit allocation
Data format: integer (DAC values 256 to 4 864); resolution: 20.
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Value
U[1]
U[1]
U[1]
212
211
210
29
28
27
26
25
24
23
22
21
20
[1]
Undefined; must be written as zero for default and may return any value when read.
Values 0 to 255 are reserved. It is not permitted to use such values.
Examples:
• 100 %VDD = 5 120 (reserved)
• 10 %VDD = 512
• 5 %VDD = 256
Table 21. CLAMP_HI - upper clamping level output voltage (address Bh) bit allocation
Data format: integer (DAC values 256 to 4 864); resolution: 20.
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Value
U[1]
U[1]
U[1]
212
211
210
29
28
27
26
25
24
23
22
21
20
[1]
Undefined; must be written as zero for default and may return any value when read.
Values 4 865 to 5 120 are reserved. It is not permitted to use such values.
Examples:
• 100 %VDD = 5 120 (reserved)
• 95 %VDD = 4 864
• 90 %VDD = 4 608
Table 22. ANG_RNG_MULT_MSB - most significant bits of angular range multiplicator (address Eh) bit allocation
Data format: unsigned fixed point.
Bit
15
14
13
Value
12
11
10
9
8
7
6
CLAMP_SW_ANGLE
5
4
3
2
1
0
24
23
22
21
20
2−1
CLAMP_HI – CLAMP_LO
180°
ANG_RNG_MULT = ------------------------------------------------------------------- × --------------------------------------------------8192
ANGULAR_RANGE
(11)
Examples:
•
4864 – 256 180°
ANG_RNG_MULT = --------------------------- × ----------- = 0.5625
8192
180°
•
4864 – 256 180°
ANG_RNG_MULT = --------------------------- × ----------- = 1.125
8192
90°
Table 23. CLAMP_SW_ANGLE - clamp switch angle (address Eh) bit allocation
Data format: unsigned fixed point.
Bit
15
14
13
12
11
10
9
8
7
6
Value
2−1
2−2
2−3
2−4
2−5
2−6
2−7
2−8
2−9
2−10
5
4
3
2
1
0
ANG_RNG_MULT_MSB
Mechanical angular range 0000h = 0° to 3FFh = 180° − 1 LSB.
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Programmable angle sensor
1
CLAMP_HI – CLAMP_LO
1
CLAMP_SW_ANGLE = --- × ⎛ 1 + -------------------------------------------------------------------- × -----------------------------------------------⎞
2 ⎝
8192
ANG_RNG_MULT⎠
(12)
If the magnetic field angle is larger than the CLAMP_SW_ANGLE, the output switches to
CLAMP_LO for a positive slope. The value of CLAMP_SW_ANGLE can be calculated
from other EEPROM constants but must be programmed.
14. Electromagnetic compatibility
EMC is verified in an independent and certified test laboratory.
14.1 Emission (CISPR 25)
Tests according to CISPR 25 were fulfilled.
14.1.1 Conducted radio disturbance
Test of the device according to CISPR 25, third edition (2008-03), Chapter 6.2.
Class: 5.
14.1.2 Radiated radio disturbance
Test of the device according to CISPR 25, third edition (2008-03), Chapter 6.4.
Class: 5 (without addition of 6 dB in FM band).
14.2 Radiated disturbances (ISO 11452-1 third edition (2005-02),
ISO 11452-2, ISO 11452-4 and ISO 11452-5)
The common understanding of the requested function is that an effect is tolerated as
described in Table 24 during the disturbance. The reachable values are setup dependent
and may differ from the final application.
Table 24.
Failure condition for radiated disturbances
Parameter
Comment
Min
Max
Unit
Variation of output signal in analog
output mode
value measured relative to the
output at test start
-
±0.9
%VDD
14.2.1 Absorber lined shielded enclosure
Tests according to ISO 11452-2, second edition (2004-11), were fulfilled.
Test levels:
200 V/m; 200 MHz to 400 MHz (step 10 MHz)
200 V/m; 400 MHz to 1 000 MHz (step 25 MHz)
200 V/m; 1 GHz to 10 GHz (step 100 MHz)
State: A.
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Programmable angle sensor
14.2.2 Bulk-current injection
Tests according to ISO 11452-4, third edition (2005-04), were fulfilled.
Test level: 200 mA with CL = 1 nF.
State: A.
14.2.3 Strip line
Tests according to ISO 11452-5, second edition (2002-04), were fulfilled.
Test level: 200 V/m with CL = 1 nF; extended up to 1 GHz.
State: A.
14.2.4 Immunity against mobile phones
Tests according to ISO 11452-2, second edition (2004-11), were fulfilled.
State: A.
Definition of Global System for Mobile Communications (GSM) signal:
• Pulse modulation: per GSM specification (217 Hz; 12.5 % duty cycle)
• Modulation grade: ≥ 60 dB
• Sweep: linear 800 MHz to 3 GHz (duration 10 s at 890 MHz, 940 MHz and 1.8 GHz
band)
• Antenna polarization: vertical, horizontal
• Field strength: 200 V/m during on-time [calibration in Continuous Wave (CW)]
In deviation of ISO 11452-2 a GSM signal (definition see above) instead of an AM signal
was used.
14.3 Electrical transient transmission by capacitive coupling [ISO 7637-3,
first edition (1995-07)]
The common understanding of the requested function is that an effect is tolerated as
described in Table 25 during the disturbance.
Table 25.
Parameter
Failure condition for electrical transient transmission
Comment
Variation of output signal in analog value measured relative to the
output mode
output at test start
Min
Max
Unit
-
±0.9
%VDD
Tests according to ISO 7637-3 were fulfilled.
Severity level: IV (for pulse 3a and 3b).
Class: B for pulse 3a, B for pulse 3b.
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KMA199
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Programmable angle sensor
15. ElectroStatic Discharge (ESD)
To raise immunity against ESD pulses, protection diodes are implemented into the
KMA199.
15.1 Human body model
The KMA199 must not be damaged at 8 kV, according to the human body model at
100 pF and 1.5 kΩ. The test is according to AEC-Q100-002, CLASS H3A. This protection
is ensured at all external pins (OUT/DATA, VDD and GND).
Furthermore all interconnects (pins between package head and package body) must not
be damaged at 2 kV, according to AEC-Q100-002, CLASS H2.
15.2 Machine model
The KMA199 must not be damaged at 400 V, according to the machine model. The test is
according to AEC-Q100-003, CLASS M4. This protection is ensured at all external pins
(OUT/DATA, VDD and GND).
Furthermore all interconnects (pins between package head and package body) must not
be damaged at 200 V, according to AEC-Q100-003, CLASS M3.
All pins have a latch-up protection.
15.3 Charged-device model
The KMA199 must not be damaged at 750 V, according to the charged-device model.
The test is according to AEC-Q100-011, CLASS C3B. This protection is ensured at all
external pins (OUT/DATA, VDD and GND).
Furthermore all interconnects (pins between package head and package body) must not
be damaged at 500 V, according to AEC-Q100-011, CLASS C3B.
KMA199_1
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KMA199
NXP Semiconductors
Programmable angle sensor
16. Application information
VDD
pull-up to VDD or
pull-down to GND
VDD
1
KMA199
3
Cblock
2
OUT/DATA
FILTER
fg = 0.7 kHz
1st order
OUT/DATA
CL
GND
GND
KMA199 and external
capacitances
electronic control unit
008aaa235
(1) The block capacitance Cblock is used to suppress noise on the supply line of the device. For best
functionality, the capacitances should be mounted close to the pins of the device.
(2) The load capacitance CL can be used to improve the electromagnetic immunity of the device. For
best functionality, the capacitances should be mounted close to the pins of the device.
Fig 18. Application diagram of KMA199
17. Test information
17.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 - Failure mechanism based stress test qualification for integrated
circuits, and is suitable for use in automotive applications.
KMA199_1
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KMA199
NXP Semiconductors
Programmable angle sensor
18. Marking
N NNNN
2.1 min
batch
number
A
X Y Y Y Z
B
C
001aag745
Marking paint: laser
Code: see drawing
Type face: DIN 1451 condensed type
Letter height: 0.8 mm
Line spacing: 0.25 mm
Crossing of lines not allowed
A: leading letters of type number (5 characters max.)
B: number and attached letters of type number (6 characters max.)
C: day code/date code
All lines A to C to be marked in centered position
Date code: x yyy z
x: product manufacturing code; m for manufacturing Manila
Day code: x yyy z
x: --y: day of year
z: year of production (last figure)
Fig 19. Marking
19. Terminals
Lead frame material: CuZr with 99.9 % Cu and 0.1 % Zr
Lead finish: matt tin; thickness 8 μm to 13 μm
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KMA199
NXP Semiconductors
Programmable angle sensor
20. Package outline
Plastic single-ended multi-chip package; 6 interconnections; 3 in-line leads
SOT880
view A-B
HE1
A
B
E
Q1
L1
b1
D
L
(1)
(1)
HE
D1
A
A
B
(1)
Q1
A
L2
1
2
e
3
b
c
w A
v B
HE2
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
mm
1.65
1.45
b
b1
0.41 1.57
0.34 1.47
c
D
D1
0.30
0.24
4.1
3.9
8.1
7.9
E
e
5.45
2.54
5.25
HE
HE1
HE2
max
21.4 6.42
5.85
21.0 6.32
L
L1
L2
min
Q1
v
w
7.1
6.9
0.85
0.75
4.75
0.65
0.55
0.4
1.2
Note
1. Terminals within this zone are uncontrolled to allow for flow of plastic between and besides the leads.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
07-09-03
07-09-11
SOT880
Fig 20. Package outline SOT880
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KMA199
NXP Semiconductors
Programmable angle sensor
21. Handling information
(2)
0.7 (1)
0.7 (1)
R 0.25 min
(2)
0.7 (1)
R 0.25 min
006aaa246
Dimensions in mm
(1) No bending allowed.
(2) Plastic body and interface plastic body - leads: application of bending forces not allowed.
Fig 21. Bending recommendation
22. Solderability information
The solderability qualification is done according to AEC-Q100, Rev-F. Recommended
soldering process for leaded devices is wave soldering. The maximum soldering
temperature is 260 °C for maximum 5 s. Device terminals shall be compatible with laser
and electrical welding.
23. Revision history
Table 26.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
KMA199_1
20100426
Product data sheet
-
-
KMA199_1
Product data sheet
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KMA199
NXP Semiconductors
Programmable angle sensor
24. Legal information
24.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
24.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
24.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. The product is not designed, authorized or warranted to be
KMA199_1
Product data sheet
suitable for use in medical, military, aircraft, space or life support equipment,
nor in applications where failure or malfunction of an NXP Semiconductors
product can reasonably be expected to result in personal injury, death or
severe property or environmental damage. NXP Semiconductors accepts no
liability for inclusion and/or use of NXP Semiconductors products in such
equipment or applications and therefore such inclusion and/or use is at the
customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on a weakness or default in the
customer application/use or the application/use of customer’s third party
customer(s) (hereinafter both referred to as “Application”). It is customer’s
sole responsibility to check whether the NXP Semiconductors product is
suitable and fit for the Application planned. Customer has to do all necessary
testing for the Application in order to avoid a default of the Application and the
product. NXP Semiconductors does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
24.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 26 April 2010
© NXP B.V. 2010. All rights reserved.
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KMA199
NXP Semiconductors
Programmable angle sensor
25. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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Product data sheet
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Rev. 01 — 26 April 2010
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35 of 36
KMA199
NXP Semiconductors
Programmable angle sensor
26. Contents
1
1.1
1.2
2
3
4
5
5.1
6
7
7.1
7.2
7.3
7.4
8
9
10
11
12
12.1
12.2
12.3
12.4
12.5
12.6
13
13.1
13.2
13.3
13.3.1
13.3.2
13.3.3
13.4
13.4.1
13.5
13.5.1
13.5.2
14
14.1
14.1.1
14.1.2
14.2
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Angular measurement directions . . . . . . . . . . . 4
Analog output. . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Diagnostic features . . . . . . . . . . . . . . . . . . . . . . 6
EEPROM CRC and EDC supervision. . . . . . . . 6
Magnet-loss detection . . . . . . . . . . . . . . . . . . . 6
Power-loss detection . . . . . . . . . . . . . . . . . . . . 6
Low supply voltage detection . . . . . . . . . . . . . . 7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Recommended operating conditions. . . . . . . . 8
Thermal characteristics . . . . . . . . . . . . . . . . . . 8
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Definition of errors. . . . . . . . . . . . . . . . . . . . . . 12
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Hysteresis error . . . . . . . . . . . . . . . . . . . . . . . 13
Linearity error . . . . . . . . . . . . . . . . . . . . . . . . . 13
Microlinearity error . . . . . . . . . . . . . . . . . . . . . 14
Temperature drift error . . . . . . . . . . . . . . . . . . 14
Angular error. . . . . . . . . . . . . . . . . . . . . . . . . . 15
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . 16
General description . . . . . . . . . . . . . . . . . . . . 16
Timing characteristics . . . . . . . . . . . . . . . . . . . 17
Sending and receiving data . . . . . . . . . . . . . . 18
Write access . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Read access . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Entering the command mode . . . . . . . . . . . . . 21
Cyclic redundancy check . . . . . . . . . . . . . . . . 21
Software example in C . . . . . . . . . . . . . . . . . . 22
Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Command registers . . . . . . . . . . . . . . . . . . . . 23
EEPROM registers . . . . . . . . . . . . . . . . . . . . . 24
Electromagnetic compatibility . . . . . . . . . . . . 27
Emission (CISPR 25) . . . . . . . . . . . . . . . . . . . 27
Conducted radio disturbance . . . . . . . . . . . . . 27
Radiated radio disturbance. . . . . . . . . . . . . . . 27
Radiated disturbances (ISO 11452-1 third
edition (2005-02), ISO 11452-2, ISO 11452-4
and ISO 11452-5) . . . . . . . . . . . . . . . . . . . . . . 27
14.2.1
Absorber lined shielded enclosure . . . . . . . . . 27
14.2.2
14.2.3
14.2.4
14.3
15
15.1
15.2
15.3
16
17
17.1
18
19
20
21
22
23
24
24.1
24.2
24.3
24.4
25
26
Bulk-current injection . . . . . . . . . . . . . . . . . . .
Strip line . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Immunity against mobile phones . . . . . . . . . .
Electrical transient transmission by capacitive
coupling [ISO 7637-3, first edition (1995-07)]
ElectroStatic Discharge (ESD) . . . . . . . . . . . .
Human body model . . . . . . . . . . . . . . . . . . . .
Machine model. . . . . . . . . . . . . . . . . . . . . . . .
Charged-device model. . . . . . . . . . . . . . . . . .
Application information . . . . . . . . . . . . . . . . .
Test information . . . . . . . . . . . . . . . . . . . . . . .
Quality information . . . . . . . . . . . . . . . . . . . . .
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
Handling information . . . . . . . . . . . . . . . . . . .
Solderability information . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
28
28
28
28
29
29
29
29
30
30
30
31
31
32
33
33
33
34
34
34
34
34
35
36
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 26 April 2010
Document identifier: KMA199_1