NSC SLC64A

DS90CF384A/DS90CF364A
+3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD)
Link—65 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel
Display (FPD) Link—65 MHz
General Description
The DS90CF384A receiver converts the four LVDS data
streams (Up to 1.8 Gbps throughput or 227 Megabytes/sec
bandwidth) back into parallel 28 bits of CMOS/TTL data (24
bits of RGB and 4 bits of Hsync, Vsync, DE and CNTL). Also
available is the DS90CF364A that converts the three LVDS
data streams (Up to 1.3 Gbps throughput or 170 Megabytes/
sec bandwidth) back into parallel 21 bits of CMOS/TTL data
(18 bits of RGB and 3 bits of Hsync, Vsync and DE). Both
Receivers’ outputs are Falling edge strobe. A Rising edge or
Falling edge strobe transmitter (DS90C383A/DS90C363A)
will interoperate with a Falling edge strobe Receiver without
any translation logic.
The DS90CF384A / DS90CF364A devices are enhanced
over prior generation receivers and provided a wider data
valid time on the receiver output.
The DS90CF384A is also offered in a 64 ball, 0.8mm fine
pitch ball grid array (FBGA) package which provides a 44 %
reduction in PCB footprint compared to the 56L TSSOP
package.
This chipset is an ideal means to solve EMI and cable size
problems associated with wide, high speed TTL interfaces.
Features
n
n
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20 to 65 MHz shift clock support
50% duty cycle on receiver output clock
Best–in–Class Set & Hold Times on RxOUTPUTs
Rx power consumption < 142 mW (typ) @65MHz
Grayscale
Rx Power-down mode < 200µW (max)
ESD rating > 7 kV (HBM), > 700V (EIAJ)
Supports VGA, SVGA, XGA and Dual Pixel SXGA.
PLL requires no external components
Compatible with TIA/EIA-644 LVDS standard
Low profile 56-lead or 48-lead TSSOP package
DS90CF384A is also available in a 64 ball, 0.8mm fine
pitch ball grid array (FBGA) package
Block Diagrams
DS90CF384A
DS90CF364A
10087027
Order Number DS90CF384AMTD or DS90CF384ASLC
See NS Package Number MTD56 or SLC64A
10087028
Order Number DS90CF364AMTD
See NS Package Number MTD48
TRI-STATE ® is a registered trademark of National Semiconductor Corporation.
© 2006 National Semiconductor Corporation
DS100870
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DS90CF384A/DS90CF364A +3.3V LVDS Receiver 24-Bit-Color Flat Panel Display (FPD)
Link—65 MHz , +3.3V LVDS Receiver 18-Bit-Color Flat Panel Display (FPD) Link—65 MHz
February 2006
DS90CF384A/DS90CF364A
Absolute Maximum Ratings (Note 1)
SLC (FBGA) Package:
DS90CF384A
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (VCC)
−0.3V to +4V
CMOS/TTL Input Voltage
−0.3V to (VCC + 0.3V)
CMOS/TTL Output Voltage
−0.3V to (VCC + 0.3V)
LVDS Receiver Input Voltage
−0.3V to (VCC + 0.3V)
Junction Temperature
+150˚C
Storage Temperature
−65˚C to +150˚C
Lead Temperature
(Soldering, 4 sec)
DS90CF384AMTD
12.4 mW/˚C above +25˚C
DS90CF364AMTD
15 mW/˚C above +25˚C
DS90CF384ASLC
10.2 mW/˚C above +25˚C
ESD Rating
> 7 kV
> 700V
(HBM, 1.5 kΩ, 100 pF)
(EIAJ, 0Ω, 200 pF)
Recommended Operating
Conditions
+260˚C
Solder Reflow Temperature
(20 sec for FBGA)
2.0 W
Package Derating:
Min Nom Max Units
+220˚C
Supply Voltage (VCC)
Maximum Package Power
Dissipation Capacity @ 25˚C
3.0
3.3
3.6
V
−10 +25 +70
˚C
Operating Free Air
MTD56 (TSSOP) Package:
Temperature (TA )
DS90CF384A
1.61 W
Receiver Input Range
MTD48 (TSSOP) Package:
0
Supply Noise Voltage (VCC)
DS90CF364A
2.4
V
100
mVPP
1.89 W
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
CMOS/TTL DC SPECIFICATIONS (For Power Down Pin)
VIH
High Level Input Voltage
2.0
VCC
V
VIL
Low Level Input Voltage
GND
0.8
V
VCL
Input Clamp Voltage
ICL = −18 mA
−0.79
−1.5
V
IIN
Input Current
V
IN
= 0.4V, 2.5V or VCC
+1.8
+10
µA
V
IN
= GND
−10
0
µA
2.7
3.3
V
CMOS/TTL DC SPECIFICATIONS
VOH
High Level Output Voltage
VOL
Low Level Output Voltage
IOL = 2 mA
0.06
0.3
V
IOS
Output Short Circuit Current
VOUT = 0V
−60
−120
mA
IOH = −0.4 mA
LVDS RECEIVER DC SPECIFICATIONS
VTH
Differential Input High Threshold
VTL
Differential Input Low Threshold
IIN
Input Current
V
CM
= +1.2V
+100
−100
V
V
IN
= +2.4V, VCC = 3.6V
IN
= 0V, VCC = 3.6V
mV
mV
± 10
± 10
µA
µA
RECEIVER SUPPLY CURRENT
ICCRW
ICCRW
ICCRG
Receiver Supply Current
CL = 8 pF,
f = 32.5 MHz
49
65
mA
Worst Case
Worst Case Pattern,
f = 37.5 MHz
53
70
mA
DS90CF384A (Figures
1, 4 )
f = 65 MHz
81
105
mA
Receiver Supply Current
CL = 8 pF,
f = 32.5 MHz
49
55
mA
Worst Case
Worst Case Pattern,
f = 37.5 MHz
53
60
mA
DS90CF364A (Figures
1, 4 )
f = 65 MHz
78
90
mA
Receiver Supply Current,
CL = 8 pF,
f = 32.5 MHz
28
45
mA
16 Grayscale
16 Grayscale Pattern,
f = 37.5 MHz
30
47
mA
(Figures 2, 3, 4 )
f = 65 MHz
43
60
mA
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2
(Continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
10
55
µA
RECEIVER SUPPLY CURRENT
ICCRZ
Receiver Supply Current
Power Down
Power Down = Low
Receiver Outputs Stay Low during
Power Down Mode
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
Note 2: Typical values are given for VCC = 3.3V and TA = +25C.
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise
specified (except VOD and ∆V OD).
Receiver Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol
CLHT
Parameter
Min
CMOS/TTL Low-to-High Transition Time (Figure 4 )
CHLT
CMOS/TTL High-to-Low Transition Time (Figure 4 )
RSPos0
Receiver Input Strobe Position for Bit 0 (Figure 11,
Figure 12 )
RSPos1
RSPos2
Typ
Max
Units
2
5
ns
1.8
5
ns
0.7
1.1
1.4
ns
Receiver Input Strobe Position for Bit 1
2.9
3.3
3.6
ns
Receiver Input Strobe Position for Bit 2
5.1
5.5
5.8
ns
RSPos3
Receiver Input Strobe Position for Bit 3
7.3
7.7
8.0
ns
RSPos4
Receiver Input Strobe Position for Bit 4
9.5
9.9
10.2
ns
RSPos5
Receiver Input Strobe Position for Bit 5
11.7
12.1
12.4
ns
RSPos6
Receiver Input Strobe Position for Bit 6
13.9
14.3
14.6
ns
RSKM
RxIN Skew Margin (Note 4) (Figure 13 )
RCOP
RxCLK OUT Period (Figure 5)
15
T
50
ns
RCOH
RxCLK OUT High Time (Figure 5 )
5.0
7.6
9.0
ns
RCOL
RxCLK OUT Low Time (Figure 5)
5.0
6.3
9.0
RSRC
RxOUT Setup to RxCLK OUT (Figure 5 )
4.5
7.3
ns
RHRC
RxOUT Hold to RxCLK OUT (Figure 5 )
4.0
6.3
ns
RCCD
RxCLK IN to RxCLK OUT Delay @ 25˚C, VCC = 3.3V (Figure 6 )
3.5
5.0
7.5
ns
RPLLS
Receiver Phase Lock Loop Set (Figure 7 )
10
ms
RPDD
Receiver Power Down Delay (Figure 10 )
1
µs
f = 65 MHz
f = 65 MHz
f = 65 MHz
400
ps
ns
Note 4: Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account the DS90C383A transmitter pulse
positions (min and max) and the receiver input setup and hold time (internal data sampling window - RSPos). The RSKM will change when different transmitters are
used. This margin allows for LVDS interconnect skew, inter-symbol interference (both dependent on type/length of cable), and clock jitter (less than 250 ps).
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DS90CF384A/DS90CF364A
Electrical Characteristics
DS90CF384A/DS90CF364A
AC Timing Diagrams
10087002
FIGURE 1. “Worst Case” Test Pattern
10087012
FIGURE 2. “16 Grayscale” Test Pattern (DS90CF384A)(Notes 5, 6, 7, 8)
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4
DS90CF384A/DS90CF364A
AC Timing Diagrams
(Continued)
10087003
FIGURE 3. “16 Grayscale” Test Pattern (DS90CF364A)(Notes 5, 6, 7, 8)
Note 5: The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.
Note 6: The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed
to produce groups of 16 vertical stripes across the display.
Note 7: Figures 1, 3 show a falling edge data strobe (TxCLK IN/RxCLK OUT).
Note 8: Recommended pin to signal mapping. Customer may choose to define differently.
10087004
FIGURE 4. DS90CF384A/DS90CF364A (Receiver) CMOS/TTL Output Load and Transition Times
10087005
FIGURE 5. DS90CF384A/DS90CF364A (Receiver) Setup/Hold and High/Low Times
5
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DS90CF384A/DS90CF364A
AC Timing Diagrams
(Continued)
10087006
FIGURE 6. DS90CF384A/DS90CF364A (Receiver) Clock In to Clock Out Delay
10087007
FIGURE 7. DS90CF384A/DS90CF364A (Receiver) Phase Lock Loop Set Time
10087009
FIGURE 8. 28 Parallel TTL Data Inputs Mapped to LVDS Outputs - DS90CF384A
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6
DS90CF384A/DS90CF364A
AC Timing Diagrams
(Continued)
10087010
FIGURE 9. 21 Parallel TTL Data Inputs Mapped to LVDS Outputs - DS90CF364A
10087008
FIGURE 10. DS90CF384A/DS90CF364A (Receiver) Power Down Delay
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DS90CF384A/DS90CF364A
AC Timing Diagrams
(Continued)
10087025
FIGURE 11. DS90CF384A (Receiver) LVDS Input Strobe Position
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DS90CF384A/DS90CF364A
AC Timing Diagrams
(Continued)
10087026
FIGURE 12. DS90CF364A (Receiver) LVDS Input Strobe Position
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DS90CF384A/DS90CF364A
AC Timing Diagrams
(Continued)
10087011
C — Setup and Hold Time (Internal data sampling window) defined by Rspos (receiver input strobe position) min and max
Tppos — Transmitter output pulse position (min and max)
RSKM = Cable Skew (type, length) + Source Clock Jitter (cycle to cycle) (Note 9) + ISI (Inter-symbol interference) (Note 10)
Cable Skew — typically 10 ps–40 ps per foot, media dependent
Note 9: Cycle-to-cycle jitter is less than 250 ps at 65 MHz.
Note 10: ISI is dependent on interconnect length; may be zero.
FIGURE 13. Receiver LVDS Input Skew Margin
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Pin Name
RxIN+
I/O
No.
I
4
Description
Positive LVDS differentiaI data inputs.
RxIN−
I
4
Negative LVDS differential data inputs.
RxOUT
O
28
TTL level data outputs. This includes: 8 Red, 8 Green, 8 Blue, and 3 control
lines — FPLINE, FPFRAME, DRDY (also referred to as HSYNC, VSYNC, Data
Enable).
RxCLK IN+
I
1
Positive LVDS differential clock input.
RxCLK IN−
I
1
Negative LVDS differential clock input.
RxCLK OUT
O
1
TTL Ievel clock output. The falling edge acts as data strobe.
PWR DOWN
I
1
TTL level input. When asserted (low input) the receiver outputs are low.
VCC
I
4
Power supply pins for TTL outputs.
GND
I
5
Ground pins for TTL outputs.
PLL VCC
I
1
Power supply for PLL.
PLL GND
I
2
Ground pin for PLL.
LVDS VCC
I
1
Power supply pin for LVDS inputs.
LVDS GND
I
3
Ground pins for LVDS inputs.
DS90CF364A Pin Descriptions — 48L TSSOP Package — 18-Bit FPD Link
Receiver
Pin Name
I/O
No.
Description
RxIN+
I
3
RxIN−
I
3
Negative LVDS differential data inputs.
RxOUT
O
21
TTL level data outputs. This includes: 6 Red, 6 Green, 6 Blue, and 3 control lines — FPLINE,
FPFRAME, DRDY (also referred to as HSYNC, VSYNC, Data Enable).
RxCLK IN+
I
1
Positive LVDS differential clock input.
Positive LVDS differentiaI data inputs.
RxCLK IN−
I
1
Negative LVDS differential clock input.
RxCLK OUT
O
1
TTL Ievel clock output. The falling edge acts as data strobe.
PWR DOWN
I
1
TTL level input. When asserted (low input) the receiver outputs are low.
VCC
I
4
Power supply pins for TTL outputs.
GND
I
5
Ground pins for TTL outputs.
PLL VCC
I
1
Power supply for PLL.
PLL GND
I
2
Ground pin for PLL.
LVDS VCC
I
1
Power supply pin for LVDS inputs.
LVDS GND
I
3
Ground pins for LVDS inputs.
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DS90CF384A/DS90CF364A
DS90CF384A Pin Descriptions — 56L TSSOP Package — 24-Bit FPD Link
Receiver
DS90CF384A/DS90CF364A
DS90CF384A Pin Summary — 64 ball FBGA Package — FPD Link
Receiver
Pin Name
RxIN+
I/O
No.
I
4
Description
Positive LVDS differentiaI data inputs.
RxIN−
I
4
Negative LVDS differential data inputs.
RxOUT
O
28
TTL level data outputs. This includes: 8 Red, 8 Green, 8 Blue, and 4 control lines — FPLINE,
FPFRAME, DRDY (also referred to as HSYNC, VSYNC, Data Enable).
RxCLK IN+
I
1
Positive LVDS differential clock input.
RxCLK IN−
I
1
Negative LVDS differential clock input.
RxCLK OUT
O
1
TTL Ievel clock output. The falling edge acts as data strobe. Also known as FPSHIFT OUT
PWR DOWN
I
1
TTL level input. When asserted (low input) the receiver outputs are low.
VCC
I
4
Power supply pins for TTL outputs.
GND
I
5
Ground pins for TTL outputs.
PLL VCC
I
1
Power supply for PLL.
PLL GND
I
2
Ground pin for PLL.
LVDS VCC
I
1
Power supply pin for LVDS inputs.
LVDS GND
I
3
Ground pins for LVDS inputs.
6
Pins not connected.
NC
DS90CF384A Pin Descriptions — 64 ball FBGA Package — FPD Link
Receiver
By Pin
By Pin Type
Pin
Pin Name
Type
Pin
Pin Name
Type
A1
RxOUT17
O
A4
GND
G
A2
VCC
P
B1
GND
G
A3
RxOUT15
O
B6
GND
G
A4
GND
G
D8
GND
G
A5
RxOUT12
O
E3
GND
G
A6
RxOUT8
O
E5
LVDS GND
G
A7
RxOUT7
O
G3
LVDS GND
G
A8
RxOUT6
O
G7
LVDS GND
G
B1
GND
G
H5
LVDS GND
G
B2
NC
F6
PLL GND
G
B3
RxOUT16
O
G8
PLL GND
G
B4
RxOUT11
O
E6
PWR DWN
I
B5
VCC
P
H6
RxCLKIN-
I
B6
GND
G
H7
RxCLKIN+
I
B7
RxOUT5
O
H2
RxIN0-
I
B8
RxOUT3
O
H3
RxIN0+
I
C1
RxOUT21
O
F4
RxIN1-
I
C2
NC
G4
RxIN1+
I
C3
RxOUT18
O
G5
RxIN2-
I
C4
RxOUT14
O
F5
RxIN2+
I
C5
RxOUT9
O
G6
RxIN3-
I
C6
RxOUT4
O
H8
RxIN3+
I
C7
NC
E7
RxCLKOUT
O
C8
RxOUT1
O
E8
RxOUT0
O
D1
VCC
P
C8
RxOUT1
O
D2
RxOUT20
O
D5
RxOUT10
O
D3
RxOUT19
O
B4
RxOUT11
O
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By Pin
By Pin Type
D4
RxOUT13
O
A5
RxOUT12
O
D5
RxOUT10
O
D4
RxOUT13
O
D6
VCC
P
C4
RxOUT14
O
D7
RxOUT2
O
A3
RxOUT15
O
O
D8
GND
G
B3
RxOUT16
E1
RxOUT22
O
A1
RxOUT17
O
E2
RxOUT24
O
C3
RxOUT18
O
E3
GND
G
D3
RxOUT19
O
E4
LVDS VCC
P
D7
RxOUT2
O
E5
LVDS GND
G
D2
RxOUT20
O
E6
PWR DWN
I
C1
RxOUT21
O
E7
RxCLKOUT
O
E1
RxOUT22
O
E8
RxOUT0
O
F1
RxOUT23
O
F1
RxOUT23
O
E2
RxOUT24
O
F2
RxOUT26
O
G1
RxOUT25
O
F3
NC
F2
RxOUT26
O
F4
RxIN1-
H1
RxOUT27
O
I
F5
RxIN2+
I
B8
RxOUT3
O
F6
PLL GND
G
C6
RxOUT4
O
F7
PLL VCC
P
B7
RxOUT5
O
F8
NC
A8
RxOUT6
O
G1
RxOUT25
A7
RxOUT7
O
G2
NC
A6
RxOUT8
O
G3
LVDS GND
G
C5
RxOUT9
O
G4
RxIN1+
I
E4
LVDS VCC
P
G5
RxIN2-
I
H4
LVDS VCC
P
O
G6
RxIN3-
I
F7
PLL VCC
P
G7
LVDS GND
G
A2
VCC
P
G8
PLL GND
G
B5
VCC
P
H1
RxOUT27
O
D1
VCC
P
H2
RxIN0-
I
D6
VCC
P
H3
RxIN0+
I
B2
NC
H4
LVDS VCC
P
C2
NC
H5
LVDS GND
G
C7
NC
H6
RxCLKIN-
I
F3
NC
H7
RxCLKIN+
I
F8
NC
H8
RxIN3+
I
G2
NC
G: Ground
I : Input
O: Output
P: Power
NC: Not connectted
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DS90CF384A/DS90CF364A
DS90CF384A Pin Descriptions — 64 ball FBGA Package — FPD Link
Receiver (Continued)
DS90CF384A/DS90CF364A
Pin Diagram for TSSOP Packages
DS90CF364A
DS90CF384A
10087013
10087023
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14
DS90CF384A/DS90CF364A
Physical Dimensions
inches (millimeters) unless otherwise noted
56-Lead Molded Thin Shrink Small Outline Package, JEDEC
Dimensions shown in millimeters only
Order Number DS90CF384AMTD
NS Package Number MTD56
48-Lead Molded Thin Shrink Small Outline Package, JEDEC
Dimensions shown in millimeters only
Order Number DS90CF364AMTD
NS Package Number MTD48
15
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DS90CF384A/DS90CF364A +3.3V LVDS Receiver 24-Bit-Color Flat Panel Display (FPD)
Link—65 MHz , +3.3V LVDS Receiver 18-Bit-Color Flat Panel Display (FPD) Link—65 MHz
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
64 ball, 0.8mm Fine Pitch Ball Grid Array (FBGA) Package
Dimensions shown in millimeters only
Order Number DS90CF384ASLC
NS Package Number SLC64A
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
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