MA-COM MA4SW424B-1

MA4SW424B-1
SP4T 24GHz PIN Diode Switch with Integrated Bias Network
Rev. V1
Features
♦ Frequency of Operation: 24 +/- 2 GHz
♦ Fully Integrated Bias Network
♦ Low Power Consumption
+12mA for Insertion Loss, 0V for Isolation
♦ The Device is Wire Bond Compensated at all RF
Ports for RF Matching
♦ Rugged, Monolithic, Glass Encapsulated
Construction
♦ RoHS Compliant
Description
The MA4SW424B-1 is a SP4T switch with an
integrated bias network which utilizes M/A-COM
Technology Solutions HMICTM (Heterolithic
Microwave Integrated Circuit) process, US Patent
5,268,310. This process allows the incorporation
of silicon pedestals that form series and/or shunt
diodes or vias by imbedding them in a low loss,
low dispersion glass. By using small spacing
between elements, this combination of silicon
and glass gives HMIC devices exceptional low
loss and high isolation performance with
exceptional repeatability through lower millimeter
frequencies. Five, 4.5 X 5.5 mil, RF bond pads
facilitate the use of low inductance ribbon bonds,
while gold backside metallization allows for
manual or automatic chip bonding using
electrically conductive silver epoxy. Each RF
bond pad has an adjacent tuning pad. The user
can use bias and add the appropriate wire or
ribbon (inductance) to optimize the RF match and
performance for the particular frequency of
interest.
Gold bond pads are shown here in yellow.
Absolute Maximum Ratings1
Parameter
Forward Current
Absolute Maximum
+40mA
Operating Temperature
-55°C to +125°C
Storage Temperature
-55°C to +150°C
Junction Temperature
+175°C
RF Incident Power @ +20mA
30 dBm
Applications
The MA4SW424B-1 SP4T, switch is designed for
24 GHz automotive switching applications.
Insertion loss is achieved with +12 mA @ +4 V and
isolation is achieved with 0V D.C. bias. The RF
bias network is integrated into the HMIC switch for
ease of use and space considerations.
1. Exceeding any of these limits may cause permanent
damage to the chip.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4SW424B-1
SP4T 24GHz PIN Diode Switch with Integrated Bias Network
Rev. V1
Electrical Specifications for Switch Ports @ TAMB +25°C
Parameter
Conditions
Units
Minimum
Typical
Maximum
Insertion Loss
24 GHz
dB
-
3.0
3.5
Isolation
24 GHz
dB
37
50
-
Input Return Loss
24 GHz
dB
-
9
-
1
24 GHz
nS
-
200
-
Switching Speed
Note 1: Switching speed is measured from 10% to 90% of detected RF signal driven by TTL compatible drivers using an RC
spiking network where R = 50 - 200Ω, and C = 390 - 560pF.
Operation of the MA4SW424B-1
Operation of the MA4SW424B-1 series PIN diode switch is achieved by the application of a D.C. current (12mA)
to the bias port of the selected insertion loss port and 0V bias for the isolated ports. The control currents should
be supplied by constant current sources.
D.C Bias Conditions
B2
+12mA
0 Volts
0 Volts
0 Volts
B3
0 Volts
+12mA
0 Volts
0 Volts
B4
0 Volts
0 Volts
+12mA
0 Volts
RF Output Conditions
B5
0 Volts
0 Volts
0 Volts
+12mA
J1-J2
Low Loss
Isolation
Isolation
Isolation
J1-J3
Isolation
Low Loss
Isolation
Isolation
J1-J4
Isolation
Isolation
Low Loss
Isolation
J1-J5
Isolation
Isolation
Isolation
Low Loss
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4SW424B-1
SP4T 24GHz PIN Diode Switch with Integrated Bias Network
Rev. V1
Typical Performance @ TAMB +25°C
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4SW424B-1
SP4T 24GHz PIN Diode Switch with Integrated Bias Network
Rev. V1
Typical Performance @ TAMB +25°C
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4SW424B-1
SP4T 24GHz PIN Diode Switch with Integrated Bias Network
Rev. V1
Chip Dimensions
H
I
H
G
G
F
A
E
D
C
C
B
Dimension
A
B
C
D
E
F
G
H
I
Mils
Min
100
131
61
27
64
91
25
52
19
Max
104
135
62
28
65
92
26
52
20
Millimeters
Min
Max
2.54
2.64
3.33
3.43
1.55
1.57
0.70
0.72
1.63
1.65
2.31
2.33
0.63
0.65
1.31
1.33
0.48
0.50
Notes:
1. All RF (J) bond pads are 4.5 X 5.5 mils (0.177 X .217 mm).
2. All DC (B) bond pads are 4.0 X 5.5 mils (0.157 X .217 mm).
3. Chip thickness 5 mils (.127 mm)
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4SW424B-1
SP4T 24GHz PIN Diode Switch with Integrated Bias Network
Rev. V1
Assembly Considerations
Cleanliness
These chips should be handled in a clean environment free of organic contamination.
Electro-Static Sensitivity
The MA4SW424B-1 PIN diode switch is ESD, Class 1A sensitive (HBM). The proper ESD handling procedures
must be followed.
Wire Bonding
Thermo-compression wedge bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is
recommended. A heat stage temperature of 150oC and a force of 18 to 22 grams should be used. If ultrasonic
energy is necessary, it should be adjusted to the minimum level required to achieve a good bond. RF bond wires
should be kept as short as possible.
Chip Mounting
The HMIC switches have Ti-Pt-Au back metal. They can be die mounted with conductive silver epoxy. Mounting
surface must be clean and flat. A minimum amount of epoxy, 1-2 mils thick, should be used to attach chip. A thin
epoxy fillet should be visible around the outer perimeter of the chip after placement. Cure epoxy per product
instructions. Typically 150°C for 1 hour.
Ordering Information
Part Number
MA4SW424B-1
Packaging
Die in Waffle Pack
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.