MA4SW210B-1 MA4SW310B-1 HMIC™ Silicon PIN Diode Switches with Integrated Bias Network RoHS Compliant MA4SW210B-1 Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ Rev. V4 Broad Bandwidth Specified 2 to 18 GHz Usable up to 26 GHz Integrated Bias Network Low Insertion Loss / High Isolation Rugged, Fully Monolithic Glass Encapsulate Construction Polymer Protective Coating Description The MA4SW210B-1 and MA4SW310B-1 devices are SP2T and SP3T broad band switches with integrated bias networks utilizing M/A-COM's HMIC TM (Heterolithic Microwave Integrated Circuit) Process, US Patent 5,268,310. This process allows the incorporation of silicon pedestals that form series and shunt diodes or vias by imbedding them in low loss, low dispersion glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices low loss and high isolation performance with exceptional repeatability through low millimeter frequencies. MA4SW310B-1 Large bond pads facilitate the use of low inductance ribbon bonds, while gold backside metallization allows for manual or automatic chip bonding via 80Au/20Sn, Sn62/Pb36/Ag2 solders or electrically conductive silver epoxy. Parameter Operating Temperature Storage Temperature Junction Temperature Applied Reverse Voltage RF C.W. Incident Power Bias Current +25°C Absolute Maximum -65oC to +125oC -65oC to +150oC +175oC - 50V +30dBm C.W. ± 20mA Max. operating conditions for a combination of RF power, D.C. bias and temperature: +30dBm CW @ 15mA (per diode) @+85°C Yellow areas indicate bond pads 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW210B-1 MA4SW310B-1 HMIC™ Silicon PIN Diode Switches with Integrated Bias Network RoHS Compliant Rev. V4 MA4SW210B-1 (SPDT) Electrical Specifications @ TAMB = +25oC, 20mA Bias current Parameter Insertion Loss Isolation Input Return Loss Switching Speed1 Frequency Minimum Nominal Maximum Units 2 GHz 1.5 1.8 dB 6 GHz 0.70 1.0 dB 12 GHz 0.90 1.2 dB 18 GHz 1.2 1.8 dB 2 GHz 55 60 dB 6 GHz 47 50 dB 12 GHz 40 45 dB 18 GHz 36 40 dB 2 GHz 14 dB 6 GHz 15 dB 12 GHz 18 GHz - 15 13.0 50 dB dB ns MA4SW310B-1 (SP3T) Electrical Specifications @ TAMB = +25oC, 20mA Bias current Parameter Insertion Loss Isolation Input Return Loss Switching Speed1 Frequency 2 GHz 6 GHz 12 GHz 18 GHz 2 GHz 6 GHz 12 GHz 18 GHz 2 GHz 6 GHz 12 GHz 18 GHz - Minimum 54 47 40 36 Nominal Maximum Units 1.6 0.8 1.0 1.3 59 50 45 40 14 15 16 14 50 2.0 1.1 1.3 1.9 dB dB dB dB dB dB dB dB dB dB dB dB ns Note: 1. Typical switching speed measured from 10% to 90% of detected RF signal driven by TTL compatible drivers using RC output spiking network, R = 50 – 200Ω , C = 390 – 560pF. 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW210B-1 MA4SW310B-1 HMIC™ Silicon PIN Diode Switches with Integrated Bias Network RoHS Compliant Rev. V4 Typical RF Performance at TAMB = +25°C, 20mA Bias Current ISOLATION vs FREQUENCY MA4SW310B-1 0 -10 -20 -30 -40 -50 -60 -70 ISOLATION, dB ISOLATION, dB ISOLATION vs FREQUENCY MA4SW210B-1 0 2 4 0 -10 -20 -30 -40 -50 -60 -70 6 8 10 12 14 16 18 20 22 24 26 0 2 4 6 8 10 12 14 16 18 20 22 24 26 FREQUENCY, GHz FREQUENCY, GHz INSERTION LOSS vs FREQUENCY MA4SW310B-1 2 2 INSERTION LOSS, dB INSERTION LOSS, dB INSERTION LOSS vs FREQUENCY MA4SW210-B1 0 -2 -4 -6 -8 0 2 4 6 -6 2 4 6 8 10 12 14 16 18 20 22 24 26 FREQUENCY, GHz FREQUENCY, GHz RETURN LOSS vs FREQUENCY MA4SW210B-1 RETURN LOSS vs FREQUENCY MA4SW310B-1 RETURN LOSS, dB RETURN LOSS, dB -4 0 0 -10 -15 -20 -25 -30 -35 -40 2 -2 -8 8 10 12 14 16 18 20 22 24 26 -5 0 0 4 6 8 10 12 14 16 18 FREQUENCY, GHz 20 22 24 26 0 -5 -10 -15 -20 -25 -30 -35 -40 0 2 4 6 8 10 12 14 16 18 20 22 24 26 FREQUENCY, GHz 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW210B-1 MA4SW310B-1 HMIC™ Silicon PIN Diode Switches with Integrated Bias Network RoHS Compliant Rev. V4 MA4SW210B-1 Series Diode Junction Temperature vs. Incident Power at 8 GHz 140 5 mA 120 Series Diode_5mA Series Diode_10mA Series Diode_20mA Tjunction ( Deg. C ) 100 Series Diode_40mA 10 mA 80 20 mA 60 40 mA 40 20 10.00 15.00 20.00 25.00 30.00 35.00 C.W. Incident Power ( dBm ) MA4SW210B-1 Compression Power vs. Incident Power at 8 GHz 0.80 Series Diode_5mA 0.70 Series Diode_10mA Series Diode_20mA Compression Power ( dB ) 0.60 5 mA Series Diode_40mA 0.50 10 mA 0.40 20 mA 0.30 40 mA 0.20 0.10 0.00 10.00 15.00 20.00 25.00 30.00 35.00 C.W. Incident Power ( dBm ) Note: The MA4SW310B-1 contains the same PIN diodes and will have similar performance. 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW210B-1 MA4SW310B-1 HMIC™ Silicon PIN Diode Switches with Integrated Bias Network RoHS Compliant Rev. V4 Operation of the MA4SW 210B-1 and MA4SW310B-1 Operation of the MA4SW210B-1 and MA4SW310B-1 PIN diode switches is achieved by simultaneous application of DC currents to the bias pads. The required levels for the different states are shown in the tables below. The control currents should be supplied by constant current sources. The nominal 40Ω - 60Ω pull-up resistor voltage @ J4 and J5 is usually -1V for –20mA and +20mA for +1V. Driver Connections MA4SW210B-1 Control Level IDC @ Condition of RF Output Condition of RF Output J4 J5 J1 - J2 J1 - J3 -20mA +20mA Low Loss Isolation +20mA -20mA Isolation Low Loss Equivalent Circuit MA4SW210B-1 Driver Connections MA4SW310B-1 Condition Condition Condition of of of RF Output RF Output RF Output Control Level IDC @ J5 J6 J7 J1 - J2 J1 - J3 J1 - J4 -20mA +20mA +20mA Low Loss Isolation Isolation +20 mA -20mA +20mA Isolation Low Loss Isolation +20mA +20mA -20mA Isolation Isolation Low Loss Equivalent Circuit MA4SW310B-1 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW210B-1 MA4SW310B-1 HMIC™ Silicon PIN Diode Switches with Integrated Bias Network RoHS Compliant Rev. V4 Wire Bonding Thermosonic wedge bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is recommended. A heat stage temperature of 150oC and a force of 18 to 22 grams should be used. If ultrasonic energy is necessary, it should be adjusted to the minimum level required to achieve a good bond. RF bond wires should be kept as short as possible. Chip Mounting The HMIC switches have Ti-Pt-Au back metal. They can be die mounted with a gold-tin eutectic solder preform or conductive epoxy. Mounting surface must be clean and flat. Eutectic Die Attachment: An 80/20, gold-tin, eutectic solder preform is recommended with a work surface temperature of 255oC and a tool tip temperature of 265oC. When hot gas is applied, the temperature at the chip should be 290oC. The chip should not be exposed to temperatures greater than 320oC for more than 20 seconds. No more than three seconds should be required for attachment. Solders rich in tin should not be used. Epoxy Die Attachment: A minimum amount of epoxy, 1-2 mils thick, should be used to attach chip. A thin epoxy fillet should be visible around the outer perimeter of the chip after placement. Cure epoxy per product instructions. Typically 150°C for 1 hour. MA4SW210B-1 Chip Outline1,2 & Dimensions INCHES DIM MILLIMETERS MIN MAX MIN MAX A 0.066 0.070 1.680 1.780 B 0.048 0.052 1.230 1.330 C 0.004 0.006 0.100 0.150 D 0.004 0.006 0.090 0.140 E 0.012 0.013 0.292 0.317 F 0.029 0.030 0.735 0.760 G 0.030 0.031 0.766 0.791 H 0.029 0.030 0.732 0.757 J 0.005 REF. 0.129 REF. K 0.005 REF. 0.129 REF. Notes: 1. 6 2. Topside and backside metallization is gold , 2.5µm thick typical. Yellow areas indicate wire bonding pads ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SW210B-1 MA4SW310B-1 HMIC™ Silicon PIN Diode Switches with Integrated Bias Network RoHS Compliant Rev. V4 MA4SW310B-1 Chip Outline1,2 & Dimensions INCHES DIM MILLIMETERS MIN MAX MIN MAX A 0.0697 0,0736 1.770 1.870 B 0.0693 0.0732 1.760 1.860 C 0.0039 0.0059 0.100 0.150 D 0.0310 0.0319 0.787 0.812 E 0.0289 0.0299 0.734 0.759 F 0.0055 0.0075 0.140 0.190 G 0.0035 0.0055 0.089 0.139 H 0.0044 0.0064 0.113 0.163 J 0.0338 0.0358 0.859 0.909 K 0.0632 0.0652 1.610 1.660 L 0.0660 0.0680 1.680 1.730 M 0.0051 REF. 0.1290 REF. N 0.0046 REF. 0.1180 REF. Notes: 1. 2. Topside and backside metallization is gold , 2.5µm thick typical. Yellow areas indicate wire bonding pads Ordering Information Part Number Package MA4SW210B-1 Gel Pack MA4SW310B-1 Gel Pack 7 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.