VISHAY VLMS3100-GS18

VLMS310.
Vishay Semiconductors
Standard SMD LED PLCC-2
FEATURES
• Lead (Pb)-free product - RoHS compliant
• SMD LED with exceptional brightness
• Luminous intensity categorized
e3
• Compatible with automatic placement
equipment
• EIA and ICE standard package
• Compatible with infrared, vapor phase and wave
solder processes according to CECC
• Available in 8 mm tape
• Low profile package
• Non-diffused lens: excellent for coupling to light
pipes and backlighting
• Low power consumption
• Luminous intensity ratio in one packaging unit
IVmax/IVmin ≤ 1.6
• Lead (Pb)-free device
• preconditioning: acc. to JEDEC level 2a
• ESD-withstand voltage:
up to 1 kV according to JESD22-A114-B
94 8553
DESCRIPTION
This device has been designed for applications
requiring narrow brightness and color selection.
The package of this device is the PLCC-2.
It consists of a lead frame which is embedded in a
white thermoplast. The reflector inside this package is
filled up with clear epoxy.
PRODUCT GROUP AND PACKAGE DATA
• Product group: LED
• Package: SMD PLCC-2
• Product series: standard
• Angle of half intensity: ± 60°
APPLICATIONS
• Automotive: backlighting in dashboards and
switches
• Telecommunication: indicator and backlighting in
telephone and fax
• Indicator and backlight for audio and video
equipment
• Indicator and backlight in office equipment
• Flat backlight for LCDs, switches and symbols
• General use
PARTS TABLE
PART
VLMS3100-GS08
COLOR, LUMINOUS INTENSITY
TECHNOLOGY
Red, IV > 2.8 mcd
GaAsP on GaP
VLMS3100-GS18
Red, IV > 2.8 mcd
GaAsP on GaP
VLMS3101-GS08
Red, IV = (4.5 to 11.2) mcd
GaAsP on GaP
VLMS3101-GS18
Red, IV = (4.5 to 11.2) mcd
GaAsP on GaP
Document Number 81214
Rev. 1.1, 30-Aug-07
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1
VLMS310.
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS1) VLMS310.
PARAMETER
TEST CONDITION
SYMBOL
VALUE
VR
6
V
Tamb ≤ 60 °C
IF
30
mA
tp ≤ 10 µs
IFSM
0.5
A
Tamb ≤ 60 °C
PV
100
mW
Tj
100
°C
Operating temperature range
Tamb
- 40 to + 100
°C
Storage temperature range
Tstg
- 40 to + 100
°C
t≤5s
Tsd
260
°C
mounted on PC board (pad size > 16 mm2)
RthJA
400
K/W
Reverse voltage2)
DC Forward current
Surge forward current
Power dissipation
Junction temperature
Soldering temperature
Thermal resistance junction/ambient
UNIT
Note:
1)
Tamb = 25 °C, unless otherwise specified
2)
Driving LED in reverse direction is suitable for short term application
OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMS310., RED
PARAMETER
TEST CONDITION
PART
SYMBOL
MIN
TYP.
VLMS3100
IV
2.8
7.1
MAX
UNIT
mcd
Luminous intensity2)
IF = 10 mA
IV
4.5
Dominant wavelength
IF = 10 mA
λd
624
Peak wavelength
IF = 10 mA
λp
640
Angle of half intensity
IF = 10 mA
ϕ
± 60
Forward voltage
IF = 20 mA
VF
2.0
Reverse voltage
IR = 10 µA
VR
VR = 0, f = 1 MHz
Cj
7
pF
Temperature coefficient of VF
IF = 20 mA
TCVF
- 1.8
mV/K
Temperature coefficient of λd
IF = 10 mA
TCλd
0.05
nm/K
Junction capacitance
VLMS3101
11.2
630
636
mcd
nm
nm
deg
2.6
6
V
V
Note:
1) T
amb = 25 °C, unless otherwise specified
2)
In one Packing Unit IVmax/IVmin ≤ 1.6
LUMINOUS INTENSITY CLASSIFICATION
GROUP
STANDARD
H
J
K
L
LIGHT INTENSITY (MCD)
In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any
one reel.
In order to ensure availability, single wavelength groups will not be
orderable.
OPTIONAL
MIN
MAX
1
2.80
3.55
2
3.55
4.50
1
4.50
5.60
2
5.60
7.10
VISHAY
OSRAM
1
7.10
9.00
VLMS3100
LST670-J1L2
2
9.00
11.20
VLMS3101
LST670-J1K2
1
11.20
14.00
2
14.00
18.00
CROSSING TABLE
Note:
Luminous intensity is tested at a current pulse duration of 25 ms and
an accuracy of ± 11 %.
The above Type Numbers represent the order groups which include
only a few brightness groups. Only one group will be shipped on
each reel (there will be no mixing of two groups on each reel).
In order to ensure availability, single brightness groups will not be orderable.
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2
Document Number 81214
Rev. 1.1, 30-Aug-07
VLMS310.
Vishay Semiconductors
TYPICAL CHARACTERISTICS
Tamb = 25 °C, unless otherwise specified
100
50
Super-red
I F - Forward Current (mA)
IF - Forward Current (mA)
60
40
30
20
10
10
1
0.1
0
0
20
40
60
80
0
100
Figure 1. Forward Current vs. Ambient Temperature
IV rel - Relative Luminous Intensity
1000
0.02
0.05
0.2
0.5
DC
10
0.1
5
1
10
0.8
0.4
0°
10°
40°
1.0
0.9
50°
0.8
60°
70°
0.7
80°
0.2
0
0.2
40
60
80
100
Figure 5. Rel. Luminous Intensity vs. Ambient Temperature
0.4
200
150
100
50
0
- 50
- 100
- 150
- 200
- 250
- 300
0
0.6
16636
Figure 3. Rel. Luminous Intensity vs. Angular Displacement
Document Number 81214
Rev. 1.1, 30-Aug-07
20
Tamb - Ambient Temperature (°C)
20°
30°
0.4
0
16635
Figure 2. Forward Current vs. Pulse Length
0.6
1.2
100
t p - Pulse Length (ms)
95 9985
super red
1.6
0.0
0.1
VF - Change of Forward Voltage (mV)
I F - Forward Current (mA)
0.01
1
0.01
IV rel - Relative Luminous Intensity
4
2.0
Tamb < 60 °C
t p /T = 0.005
95 10319
3
Figure 4. Forward Current vs. Forward Voltage
10000
100
2
1
VF - Forward Voltage (V)
16634
Tamb - Ambient Temperature (°C)
95 10905
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Figure 6. Change of Forward Voltage vs. Ambient Temperature
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3
VLMS310.
Vishay Semiconductors
1.2
IV rel - Relative Luminous Intensity
IVrel - Relative Luminous Intensity
10
super red
1
0.1
0.01
1
16638
10
IF - Forward Current (mA)
0.8
0.6
0.4
0.2
0.0
550
100
590
630
670
710
750
- Wavelength (nm)
16639
Figure 7. Relative Luminous Intensity vs. Forward Current
Figure 9. Relative Luminous Intensity vs. Wavelength
5
4
3
2
1
0
-1
-2
d
- Change of Dom. Wavelength (nm)
Super-red
1.0
-3
0
16637
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Figure 8. Change of Dominant Wavelength vs.
Ambient Temperartue
PACKAGE DIMENSIONS in millimeters
3.5 ± 0.2
0.9
1.75 ± 0.10
technical drawings
according to DIN
specifications
Mounting Pad Layout
Pin identification
area covered with
solder resist
4
2.6 (2.8)
A
2.8
C
2.2
+ 0.15
1.2
4
1.6 (1.9)
?
3
2.4
+ 0.15
Drawing-No.: 6.541-5025.01-4
Issue: 8; 22.11.05
95 11314-1
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4
Document Number 81214
Rev. 1.1, 30-Aug-07
VLMS310.
Vishay Semiconductors
METHOD OF TAPING/POLARITY AND TAPE AND REEL
SMD LED (VLM.3 - SERIES)
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with
DIN IEC 40 (CO) 564) for automatic component
insertation. The blister tape is a plastic strip with
impressed component cavaties, covered by a top tape.
REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS18
(= 8000 PCS.) PREFERRED
10.4
8.4
120°
4.5
3.5
13.00
12.75
2.5
1.5
Adhesive Tape
62.5
60.0
Identification
Label:
Vishay
Type
Group
Tape Code
Production
Code
Quantity
Blister Tape
Component Cavity
18857
Figure 12. Reel dimensions - GS18
94 8670
TAPING OF VLM.3...
14.4 max.
321
329
SOLDERING PROFILE
2.2
2.0
3.5
3.1
IR Reflow Soldering Profile for lead (Pb)-free soldering
Preconditioning acc. to JEDEC Level 2a
300
5.75
5.25
1.85
1.65
1.6
1.4
4.1
3.9
0.25
4.1
3.9
2.05
1.95
94 8668
Figure 10. Tape dimensions in mm for PLCC-2
240 °C
217 °C
200
max. 30 s
150
0
0
50
100
180
178
250
300
max. 2 cycles allowed
TTW Soldering
948626-1
(acc. to CECC00802)
5s
Lead Temperature
250
13.00
12.75
63.5
60.5
Label:
Vishay
Type
Group
Tape Code
Production
Code
Quantity
200
Figure 13. Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020C)
10.0
9.0
Identification
150
Time (s)
19470-2
14.4 max.
Temperature (°C)
2.5
1.5
max. Ramp Down 6 °C/sec
max. Ramp Up 3 °C/sec
300
4.5
3.5
max. 100 sec
max. 120 sec
100
50
REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS08
(= 1500 PCS.)
120°
max. 260 °C
245 °C
255
255°C°C
250
Temperature (°C)
3.6
3.4
4.0
3.6
8.3
7.7
200
second
wave
235 °C...260 °C
first wave
full line: typical
dotted line: process limits
ca. 2 K/s
ca. 200 K/s
150
100 °C...130 °C
100
ca. 5 K/s
2 K/s
50
forced cooling
94 8665
0
Figure 11. Reel dimensions - GS08
0
50
100
150
200
250
Time (s)
Figure 14. Double wave soldering of opto devices (all packages)
Document Number 81214
Rev. 1.1, 30-Aug-07
www.vishay.com
5
VLMS310.
Vishay Semiconductors
BAR CODE PRODUCT LABEL
106
H
A
VISHAY
37
B
C
D
E
F
G
19785
A) Type of component
B) Manufacturing plant
C) SEL - selection code (bin):
e.g.: R2 = code for luminous intensity group
3 = code for color group
D) Date code year/week
E) Day code (e.g. 3: Wednesday)
F) Batch no.
G) Total quantity
H) Company code
DRY PACKING
The reel is packed in an anti-humidity bag to protect
the devices from absorbing moisture during
transportation and storage.
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the
aluminum bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 672 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover
to the former condition by drying under the following
condition:
192 h at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device
containers or
24 h at 100 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC standard JESD22-A112 level 2a label
is included on all dry bags.
L E V E L
CAUTION
This bag contains
MOISTURE –SENSITIVE DEVICES
2a
1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH)
2. After this bag is opened devices that will be subjected to infrared reflow,
vapor-phase reflow, or equivalent processing (peak package body temp.
260°C) must be:
a) Mounted within 672 hours at factory condition of < 30°C/60%RH or
b) Stored at <10% RH.
3. Devices require baking before mounting if:
a)
Humidity Indicator Card is >10% when read at 23°C + 5°C or
b)
2a or 2b is not met.
4. If baking is required, devices may be baked for:
192 hours at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen)
or
o
or
96 hours at 60±5 Cand <5%RH
For all device containers
24 hours at 100±5°C
Not suitable for reels or tubes
Bag Seal Date: ______________________________
(If blank, see bar code label)
Aluminum bag
Note: LEVEL defined by EIA JEDEC Standard JESD22-A113
19786
Example of JESD22-A112 level 2a label
Label
Reel
15973
FINAL PACKING
The sealed reel is packed into a cardboard box. A
secondary cardboard box is used for shipping
purposes.
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6
ESD PRECAUTION
Proper storage and handling procedures should be
followed to prevent ESD damage to the devices
especially when they are removed from the antistatic
shielding bag. Electro-static sensitive devices warning
labels are on the packaging.
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
The Vishay Semiconductors standard bar code labels
are printed at final packing areas. The labels are on
each packing unit and contain Vishay Semiconductors
specific data.
Document Number 81214
Rev. 1.1, 30-Aug-07
VLMS310.
Vishay Semiconductors
OZONE DEPLETING SUBSTANCES POLICY STATEMENT
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as their
impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of
ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or
unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and
expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such
unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Document Number 81214
Rev. 1.1, 30-Aug-07
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7
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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1