SC3333 ENERGY METERING IC WITH PULSE OUTPUT DESCRIPTION The SC3333 is a high accuracy electrical energy measurement IC that can provides superior stability and accuracy over extremes in environmental conditions and over time. The SC3333 does not exhibit any creep when there is no load. The SC3333 supplies average real power information on the low frequency outputs F1 and F2. This logic outputs may be used to directly drive an electromechanically counter or interface to an MCU. SOP-16-225-1.27 The CF logic output gives instantaneous real power information. This output is intended to be used for calibration purposes, or interfacing to an MCU. The SC3333 includes a power supply monitoring circuit on the VDD supply pin. If the supply falls below 4V, the SC3333 will be reset and F1, F2 will be set to logic high, CF will be set to logic low at the same ORDERING INFORMATION time. The SC3333 provides synchronous frequency output for auto- Device Package SC3333 SOP-16-225-1.27 reading meter system. The CF logic output is synchronous with the F1 and F2 logic output to ensure the show value of the meter is consonant with the real value. FEATURES * Single 5V supply, low power. * On-chip power supply monitoring. * On-chip reference with external overdrive capability. * Supplies average real power on the frequency outputs F1 and F2, which can drive for electromechanical counters directly. * The high frequency output CF is intended for calibration and supplies instantaneous real power. * Less than 0.1% error over a dynamic range of 500 to 1. * On-chip creep protection (No load threshold). * The logic output REVP can be used to indicate a potential miswiring or negative power. * A PGA in the current channel make flexible to select the shunt and burden resistance. HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:1.1 2008.04.29 Page 1 of 8 SC3333 BLOCK DIAGRAM ABSOLUTE MAXIMUM RATING (Tamb=25°C, unless otherwise specified) Characteristics Symbol Ratings Unit VDD -0.3 ~ +7 V AVIN -6 ~ +6 V Reference Input voltage to AGND VREF -0.3 ~ VDD+0.3 V Digital Input Voltage to DGND DVIN -0.3 ~ VDD+0.3 V DVOUT -0.3 ~ VDD+0.3 V PD 450 mW Operating Temperature Range TOPR -40~ +85 °C Storage Temperature TSTG -65~ +150 °C Junction Temperature TJ +150 °C VDD to AGND/DGND Analog Input Voltage to AGND V1P, V1N, V2P and V2N Digital Output Voltage to DGND Power Dissipation ELECTRICAL CHARACTERISTICS (Tamb=25°C, unless otherwise specified) Characteristics Symbol Test conditions Min. Typ. Max. Unit 4.75 -- 5.25 V Power Supply Power Supply VDD 5V±5% Analog Input Current AIDD (2mA) TYP. -- -- 3 Digital Input Current DIDD (1.5mA) TYP. -- -- 2.5 Over a dynamic range 500 to 1 -- 0.1 -- % Over a dynamic range 500 to 1 -- 0.1 -- % mA ACCURACY Measurement Gain=1 1 Error on Channel 1 Gain=16 EM (To be continued) HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:1.1 2008.04.29 Page 2 of 8 SC3333 (Continued) Characteristics Phase Error 1 Symbol Test conditions V1 Phase Lead Between 37° Channels V1 Phase Lag 60° EP Output Frequency Rejection (AC) CFA Output Frequency Rejection (DC) CFD -- V1=100mV, V2=100mV, SET=0 V1=100mV, V2=100mV, VDD=5V±250mV Min. Typ. Max. Unit -- -- ±0.1 ° -- -- ±0.1 ° -- 0.01 -- % -- 0.01 -- % -- -- ±1 V 400 -- -- kΩ -- 14 -- kHz -- -- 15 mV ANALOG INPUTS Maximum Signal Levels Input Impedance (DC) Bandwidth (-3dB) 1,2 ADC Offset Error LEVS V1P, VIN V2N and V2P to AGND IMIN CLKIN=3.58MHz BW CLKIN/256, CLKIN=3.58MHz EADC EG V1=470mV, V2=660mV -- ±4 -- % EGM External 2.5V reference -- ±0.2 -- % REFIN/OUT Input Voltage Range VINR 2.5V±8% 2.3 -- 2.7 V Input Impedance IMIN -- 3.7 -- -- kΩ Input Capacitance CIN -- -- -- 10 pF -- -- 200 mV -- 30 60 ppm/°C 1 -- 4 MHz 1 Gain Error 1 Gain Error Match REFERENCE INPUT ON-CHIP REFERENCE Reference Error ER Temperature Coefficient TC Nominal 2.5V CLKIN Input Clock Frequency CLKIN Note all specifications for CLKIN of 3.58MHz LOGIC INPUTS3 Input High Voltage VINH VDD=5V±5% 2.4 -- -- V Input Low Voltage VINL VDD=5V±5% -- -- 0.8 V Typically 10nA, VIN=0V to VDD -- -- ±3 μA -- -- 10 pF 4.5 -- -- V Input Current IIN Input Capacitance CIN LOGIC OUTPUTS3 Output High F1 and F2 Voltage Output Low Voltage Output High CF and REVP Voltage Output Low Voltage VOH ISOURCE=10mA,VDD=5V VOL ISINK=10mA, VDD=5V -- -- 0.5 V VOH ISOURCE=5mA,VDD=5V 4 -- -- V VOL ISINK=5mA, VDD=5V -- -- 0.5 V HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:1.1 2008.04.29 Page 3 of 8 SC3333 PIN CONFIGURATION 1 16 F1 V1P 2 15 F2 V1N 3 14 CF V2N 4 V2P 5 RESET 6 11 CLKOUT REFIN/OUT 7 10 CLKIN AGND 8 9 SC3333 VDD 13 DGND 12 REVP SET PIN DESCRIPTION Pin No. Symbol Description 1 VDD Power Supply. 2 V1P Positive and Negative Inputs for Channel 1 (Current Channel). Channel 1 has a 3 V1N these pins is ±1V with respect to AGND. 4 V2N Negative and Positive Inputs for Channel 2 (Voltage Channel). The maximum 5 V2P 6 RESET 7 REFIN/OUT 8 AGND 9 SET 10 CLKIN 11 CLKOUT 12 REVP 13 DGND 14 CF Calibration Frequency Logic Output.. 15 F2 Low Frequency Logic Outputs. They can be used to directly drive a stepper motor 16 F1 or electromechanical impulse counter. PGA and the gain selections are outlined in Table I. The maximum signal level at differential input voltage is ±660mV for specified operation. The maximum signal level at these pins is ±1V with respect to AGND. Reset Pin for the SC3333. A logic low is valid. Reference voltage input/output pin. Analog ground. Channel 1 gain select pin. See table 1. 3.58MHZ crystal oscillator input pin. 3.58MHZ crystal oscillator output pin. State indication pin. While negative power or a potential miswriting occurs, it will be set to logic high. Digital ground. HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:1.1 2008.04.29 Page 4 of 8 SC3333 TIMIING CHARACTERISTICS1,2 (VDD=5V±5%, AGND=DGND=0V, On-chip Reference, CLKIN=3.58MHZ, TMIN to TMAX=-40°C~+85°C.) Parameter 3 Test Condition t1 F1 and F2 Pulse-width t2 F1 and F2 Pulse Period. t3 Time Between F1 Falling Edge and F2 Falling Edge 3 t4 Test Data Units 275 ms TBD 1/2 t2 sec 90 ms TBD sec CLKIN/4 sec CF Pulse-width t5 CF Pulse Period. t6 Minimum Time Between F1 and F2 Pulse sec NOTE: 1. Sample tested during initial release and after any redesign or process change that may after this parameter. 2. See the following figure. 3. The pulse-widths of F1, F2 and CF are not fixed for higher output frequencies. Timing Diagram for Frequency outputs Timing Diagram for Frequency Outputs shows a timing diagram for the various frequency outputs of the SC3333. The low frequency outputs, F1 and F2 can drive electromechanical counters and two phase stepper motors directly. As the figure show, the F1 and F2 outputs provide two alternating low going pulses. The pulse width (t1) is set at 275ms and the time between the falling edges of F1 and F2 (t3) is approximately half the period of F1 (t2). If however the period of F1 and F2 falls below 550 ms (1.81Hz) the pulse width of F1 and F2 is set to half of their period. The frequency of F1 and F2 corresponds to the input voltages, and F= 2 （13.6*V1*V2*G）/ VREF ，The values of G can be set by consumers, and the selection of G please refer to the table I , V1 and V2 are the rms value of the two inputs, VREF is the voltage of reference, whose value is 2.5+0.2v when the internal bandgap reference of SC3333 is valid. The high frequency output, CF is intended for calibration and supplies instantaneous real power. CF produces a 90ms wide active high pulse (t4) at a frequency proportional to active power. As in the case of F1 and F2, if the period of CF (t5) falls below 180ms, the CF pulse-width is set to half the period. APPENDIX Table I. gain selection for channel 1 SET Gain Maximum Differential Signal 0 1 ±470mV 1 16 ±30mV HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:1.1 2008.04.29 Page 5 of 8 SC3333 TYPICAL APPLICATION CIRCUIT HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:1.1 2008.04.29 Page 6 of 8 SC3333 PACKAGE OUTLINE 3.9±0.3 5.72±0.25 UNIT: mm 6.0±0.4 SOP-16-225-1.27 HANDLING MOS DEVICES: Electrostatic charges can exist in many things. All of our MOS devices are internally protected against electrostatic discharge but they can be damaged if the following precautions are not taken: • Persons at a work bench should be earthed via a wrist strap. • Equipment cases should be earthed. • All tools used during assembly, including soldering tools and solder baths, must be earthed. • MOS devices should be packed for dispatch in antistatic/conductive containers. HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:1.1 2008.04.29 Page 7 of 8