SKS 4015F B6U 4060 V24 Characteristics Symbol Conditions min. typ. max. Unit 4015 A 2927 4319 A 2496 4993 A 2400 V Electrical Data Id Tamb = 35°C no overload 150 % overload, 60s every 10 min. 200 % overload, 60s every 10 min. VCES SEMISTACK Diode Three-phase uncontrolled bridge rectifier SKS 4015F B6U 4060 V24 Preliminary Data Features N4/250F heatsink Typical Applications • Industrial rectifiers Options • • • • • Fuse RC Reverse blocking voltage test Functional test Dielectric / isolation test No. 08757274 VDC DC voltage applied to the capacitor bank 1050 V VAC network voltage (line side), -20% / +15% 760 V Visol 50 Hz / 1 min. 2 it 2500 V Tvj = 25°C - kA2s Tvj = 175°C 3920 kA2s (di/dt)cr A/µs (dv/dt)cr V/µs VGT V IGT mA Ptot Tamb = 35°C 11702 W Rthja per component 0.072 K/W Tvj -40 +175 °C Fuse No fuse A RC No RC Ω RC No RC µF Thermal trip normally closed 112 °C Mechanical Data m3/h dv/dtAIR w approx. total weight Size Width x Depth x Height (with fan) 130 781 mm Tstg 5 60 °C Tamb 5 60 °C 1000 m Altitude 472 Installation height w/o derating Protection Pollution 706 kg IP00 EN 50178 2 Fan Data Fan included in the stack (YES ) Type 2x SKF N4-230-01 VFan Fan voltage 230 V fFAN Fan frequency 50 Hz IFAN Fan current 2.1 A PFAN Fan power 430 W B6U © by SEMIKRON Rev. 2 – 17.11.2008 1 SKS 4015F B6U 4060 V24 Fig. 1 Maximal overload factor vs nom current and ovl duration, Tamb = 35°C Fig. 2 Maximal overload factor vs nom current and ovl duration, Tamb = 45°C Fig. 3 Maximal overload duration vs nom current and ovl factor, Tamb = 35°C Fig. 4 Maximal overload duration vs nom current and ovl factor, Tamb = 45°C Fig.5 Power losses Fig. 6 Thermal impedance Zth(j-a) 2 Rev. 2 – 17.11.2008 © by SEMIKRON SKS 4015F B6U 4060 V24 Note: Stack design may vary depending upon the version. Please contact SEMIKRON for further details. This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee expressed or implied is made regarding delivery, performance or suitability. © by SEMIKRON Rev. 2 – 17.11.2008 3