SEMIKRON SEMIX171KH16S

SEMiX171KH16s
Absolute Maximum Ratings
Symbol
Conditions
Values
Unit
A
Chip
Tc = 85 °C
170
Tc = 100 °C
125
A
Tj = 25 °C
5400
A
Tj = 130 °C
4800
A
Tj = 25 °C
146
kA2s
Tj = 130 °C
115
kA2s
VRSM
1700
V
VRRM
1600
V
IT(AV)
ITSM
i2t
2
it
®
SEMiX 1s
sinus 180°
10 ms
10 ms
VDRM
(di/dt)cr
Tj = 130 °C
Rectifier Thyr./Diode Module
(dv/dt)cr
Tj = 130 °C
SEMiX171KH16s
Tj
Preliminary Data
Module
Features
Visol
Terminal height 17 mm
Chips soldered directly to isolated
substrate
Typical Applications
Input Bridge Rectifier for
AC/DC motor control
power supply
Tstg
AC sinus 50Hz
1600
V
200
A/µs
1000
V/µs
-40 ... 130
°C
-40 ... 125
°C
1 min
4000
V
1s
4800
V
Characteristics
Symbol
Conditions
min.
typ.
max.
Unit
Chip
VT
Tj = 25 °C, IT = 500 A
1.6
V
VT(TO)
Tj = 130 °C
0.85
V
rT
Tj = 130 °C
1.5
mΩ
IDD;IRD
Tj = 130 °C, VDD = VDRM; VRD = VRRM
60
mA
tgd
Tj = 25 °C, IG = 1 A, diG/dt = 1 A/µs
1
µs
tgr
VD = 0.67 * VDRM
2
µs
tq
Tj = 130 °C
IH
Tj = 25 °C
µs
150
400
mA
300
1000
mA
IL
Tj = 25 °C, RG = 33 Ω
VGT
Tj = 25 °C, d.c.
2
V
IGT
Tj = 25 °C, d.c.
150
mA
VGD
Tj = 130 °C, d.c.
IGD
Tj = 130 °C, d.c.
0.25
10
V
mA
Rth(j-c)
per thyristor
Rth(j-c)
per thyristor
0.18
K/W
per diode
0.18
K/W
K/W
per diode
sin. 180°
Rth(j-c)
K/W
per thyristor
K/W
per diode
K/W
Module
Rth(c-s)
K/W
per module
0.075
K/W
Ms
to heat sink (M5)
3
5
Nm
Mt
to terminals (M6)
2.5
5
Nm
5 * 9,81
m/s2
a
w
145
g
KH
© by SEMIKRON
Rev. 1 – 09.12.2008
1
SEMiX171KH16s
Fig. 1L: Power dissipation per thyristor/diode vs.
on-state current
Fig. 1R: Power dissipation per thyristor/diode vs.
ambient temperature
Fig. 2L: Power dissipation of one module vs. rms current
Fig. 2R: Power dissipation of one module vs. case
temperature
Fig. 3L: Power dissipation of two modules vs. direct
current
Fig. 3R: Power dissipation of two modules vs. case
temperature
2
Rev. 1 – 09.12.2008
© by SEMIKRON
SEMiX171KH16s
Fig. 4L: Power dissipation of three modules vs. direct
current
Fig. 4R: Power dissipation of three modules vs. case
temperature
Fig. 5: Recovered charge vs. current decrease
Fig. 6: Transient thermal impedance vs. time
Fig. 7: On-state characteristics
Fig. 8: Surge overload current vs. time
© by SEMIKRON
Rev. 1 – 09.12.2008
3
SEMiX171KH16s
Fig. 9: Gate trigger characteristics
KH
SEMiX 1s
This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee expressed or implied
is made regarding delivery, performance or suitability.
4
Rev. 1 – 09.12.2008
© by SEMIKRON