CY28409 Clock Synthesizer with Differential SRC and CPU Outputs Features • • • • • • • • • • Three differential CPU clock pairs One differential SRC clock I2C support with readback capabilities Ideal Lexmark Spread Spectrum profile for maximum EMI reduction • 56-pin SSOP and TSSOP packages Supports Intel Pentium 4-type CPUs Selectable CPU frequencies 3.3V power supply Ten copies of PCI clocks Five copies of 3V66 with one optional VCH Two copies 48-MHz USB clocks FS_[A:B] VTT_PWRGD# PLL1 VDD_REF REF0:1 PLL Ref Freq VDD_CPU CPUT[0:2], CPUC[0:2] Divider Network VDD_SRC SRCT, SRCC IREF VDD_3V66 3V66_[0:3] PCI REF 48M x5 x 10 x2 x2 2 PCI[0:6] 3V66_4/VCH VDD_48MHz DOT_48 PD# USB_48 I2C Logic REF_0 REF_1 VDD_REF XIN XOUT VSS_REF PCIF0 PCIF1 PCIF2 VDD_PCI VSS_PCI PCI0 PCI1 PCI2 PCI3 VDD_PCI VSS_PCI PCI4 PCI5 PCI6 PD# 3V66_0 3V66_1 VDD_3V66 VSS_3V66 3V66_2 3V66_3 SCLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 CY28409 VDD_PCI PCIF[0:2] PLL2 SDATA SCLK 3V66 x1 Pin Configuration ~ CPU_STP# PCI_STP# XTAL OSC SRC x3 [1] Block Diagram XIN XOUT CPU 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 FS_B VDD_A VSS_A VSS_IREF IREF FS_A CPU_STP# PCI_STP# VDD_CPU CPUT2 CPUC2 VSS_CPU CPUT1 CPUC1 VDD_CPU CPUT0 CPUC0 VSS_SRC SRCT SRCC VDD_SRC VTT_PWRGD# VDD_48 VSS_48 DOT_48 USB_48 SDATA 3V66_4/VCH 56 SSOP/TSSOP Note: 1. Signals marked with [*] and [**] have internal pull-up and pull-down resistors, respectively. Cypress Semiconductor Corporation Document #: 38-07445 Rev. *B • 3901 North First Street • San Jose, CA 95134 • 408-943-2600 Revised August 26, 2003 CY28409 Pin Description Pin No. Name 1, 2 REF(0:1) 4 XIN Type Description O, SE Reference Clock. 3.3V 14.318-Mz clock output. I Crystal Connection or External Reference Frequency Input. This pin has dual functions. It can be used as an external 14.318-MHz crystal connection or as an external reference frequency input. 5 XOUT O, SE Crystal Connection. Connection for an external 14.318-MHz crystal output. 41,44,47 CPUT(0:2) O, DIF CPU Clock Output. Differential CPU clock outputs. See Table 1 for frequency configuration 40,43,46 CPUC(0:2) O, DIF CPU Clock Output. Differential CPU clock outputs. See Table 1 for frequency configuration 38, 37 SRCT, SRCC O, DIF Differential serial reference clock. 22,23,26,27 3V66(0:3) O, SE 66-MHz Clock Output. 3.3V 66-MHz clock from internal VCO. 29 3V66_4VCH O, SE 48-/66-MHz Clock Output. 3.3V selectable through SMBus to be 66 or 48 MHz. 7,8,9 PCIF(0:2) O, SE Free-running PCI Output. 33-MHz clocks divided down from 3V66. 12,13,14, 15,18,19,20 PCI(0:6) O, SE PCI Clock Output. 33-MHz clocks divided down from 3V66. 31, USB_48 O, SE Fixed 48-MHz clock output. 32 DOT_48 O, SE Fixed 48-MHz clock output. 51,56 FS_A, FS_B I 3.3V LVTTL input for CPU frequency selection. 52 IREF I Current Reference. A precision resistor is attached to this pin which is connected to the internal current reference. 21 PD# I, PU 3.3V LVTTL input for PowerDown# active low. 50 CPU_STP# I, PU 3.3V LVTTL input for CPU_STP# active low. 49 PCI_STP# I, PU 3.3V LVTTL input for PCI_STP# active low. 35 VTT_PWRGD# 30 SDATA I I/O 3.3V LVTTL input is a level sensitive strobe used to latch the FS_A and FS_B inputs (active low). SMBus-compatible SDATA. 28 SCLK I SMBus-compatible SCLOCK. 53 VSS_IREF GND Ground for current reference. 55 VDD_A PWR 3.3V power supply for PLL. 54 VSS_A GND 42,48 VDD_CPU PWR 3.3V power supply for outputs. 45 VSS_CPU GND 36 VDD_SRC PWR 3.3V power supply for outputs. 39 VSS_SRC GND 34 VDD_48 PWR 3.3V power supply for outputs. 33 VSS_48 GND 10,16 VDD_PCI PWR 3.3V power supply for outputs. 11,17 VSS_PCI GND 24 VDD_3V66 PWR 3.3V power supply for outputs. 25 VSS_3V66 GND 3 VDD_REF PWR 3.3V power supply for outputs. 6 VSS_REF GND Document #: 38-07445 Rev. *B Ground for PLL. Ground for outputs. Ground for outputs. Ground for outputs. Ground for outputs. Ground for outputs. Ground for outputs. Page 2 of 18 CY28409 VTT_PWRGD# has been sampled low, all further VTT_PWRGD#, FS_A and FS_B transitions will be ignored. In the case where FS_B is at mid level when VTT_PWRGD# is sampled low, the clock chip will assume “Test Clock Mode”. Once “Test Clock Mode” has been invoked, all further FS_B transitions will be ignored and FS_A will asynchronously select between the Hi-Z and REF/N mode. Exiting test mode is accomplished by cycling power with FS_B in a high or low state. Frequency Select Pins (FS_A, FS_B) Host clock frequency selection is achieved by applying the appropriate logic levels to FS_A and FS_B inputs prior to VTT_PWRGD# assertion (as seen by the clock synthesizer). Upon VTT_PWRGD# being sampled low by the clock chip (indicating processor VTT voltage is stable), the clock chip samples the FS_A and FS_B input values. For all logic levels of FS_A and FS_B except MID, VTT_PWRGD# employs a one-shot functionality in that once a valid low on Table 1. Frequency Select Table (FS_A FS_B) FS_A FS_B CPU SRC 3V66 PCIF/PCI REF0 REF1 USB/DOT 0 0 100 MHz 100/200 MHz 66 MHz 33 MHz 14.3 MHz 14.31 MHz 48 MHz 0 MID REF/N REF/N REF/N REF/N REF/N REF/N REF/N 0 1 200 MHz 100/200 MHz 66 MHz 33 MHz 14.3 MHz 14.31 MHz 48 MHz 1 0 133 MHz 100/200 MHz 66 MHz 33 MHz 14.3 MHz 14.31 MHz 48 MHz 1 MID Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Table 2. Frequency Select Table (FS_A FS_B) SMBus Bit 5 of Byte 6 = 1 FS_A FS_B CPU SRC 3V66 PCIF/PCI REF0 REF1 USB/DOT 0 0 200 MHz 100/200 MHz 66 MHz 33 MHz 14.3 MHz 14.31 MHz 48 MHz 0 1 400 MHz 100/200 MHz 66 MHz 33 MHz 14.3 MHz 14.31 MHz 48 MHz 1 0 266 MHz 100/200 MHz 66 MHz 33 MHz 14.3 MHz 14.31 MHz 48 MHz Serial Data Interface Data Protocol To enhance the flexibility and function of the clock synthesizer, a two-signal serial interface is provided. Through the Serial Data Interface, various device functions, such as individual clock output buffers, can be individually enabled or disabled. The registers associated with the Serial Data Interface initializes to their default setting upon power-up, and therefore use of this interface is optional. Clock device register changes are normally made upon system initialization, if any are required. The interface cannot be used during system operation for power management functions. The clock driver serial protocol accepts byte write, byte read, block write, and block read operations from the controller. For block write/read operation, the bytes must be accessed in sequential order from lowest to highest byte (most significant bit first) with the ability to stop after any complete byte has been transferred. For byte write and byte read operations, the system controller can access individually indexed bytes. The offset of the indexed byte is encoded in the command code, as described in Table 3. The block write and block read protocol is outlined in Table 4 while Table 5 outlines the corresponding byte write and byte read protocol. The slave receiver address is 11010010 (D2h). Table 3. Command Code Definition Bit 7 (6:0) Description 0 = Block read or block write operation, 1 = Byte read or byte write operation Byte offset for byte read or byte write operation. For block read or block write operations, these bits should be '0000000' Table 4. Block Read and Block Write Protocol Block Write Protocol Bit 1 2:8 Description Start Slave address – 7 bits 9 Write = 0 10 Acknowledge from slave 11:18 19 Command Code – 8 Bit '00000000' stands for block operation Acknowledge from slave Document #: 38-07445 Rev. *B Block Read Protocol Bit 1 2:8 Description Start Slave address – 7 bits 9 Write = 0 10 Acknowledge from slave 11:18 19 Command Code – 8 Bit '00000000' stands for block operation Acknowledge from slave Page 3 of 18 CY28409 Table 4. Block Read and Block Write Protocol(continued) Block Write Protocol Bit 20:27 28 29:36 37 38:45 Block Read Protocol Description Bit Byte Count – 8 bits 20 Acknowledge from slave 21:27 Data byte 1 – 8 bits 28 Acknowledge from slave 29 Data byte 2 – 8 bits 30:37 46 Acknowledge from slave .... ...................... 38 .... Data Byte (N–1) –8 bits 47 .... Acknowledge from slave 48:55 39:46 Description Repeat start Slave address – 7 bits Read = 1 Acknowledge from slave Byte count from slave – 8 bits Acknowledge from master Data byte from slave – 8 bits Acknowledge from master Data byte from slave – 8 bits .... Data Byte N –8 bits 56 Acknowledge from master .... Acknowledge from slave .... Data byte N from slave – 8 bits .... Stop .... Acknowledge from master .... Stop Table 5. Byte Read and Byte Write protocol Byte Write Protocol Bit 1 2:8 Byte Read Protocol Description Bit Start 1 Slave address – 7 bits 2:8 Description Start Slave address – 7 bits 9 Write = 0 9 Write = 0 10 Acknowledge from slave 10 Acknowledge from slave 11:18 19 20:27 Command Code – 8 bits '100xxxxx' stands for byte operation, bits[4:0] of the command code represents the offset of the byte to be accessed 11:18 Command Code – 8 bits '100xxxxx' stands for byte operation, bits[4:0] of the command code represents the offset of the byte to be accessed Acknowledge from slave 19 Acknowledge from slave Data byte from master – 8 bits 20 Repeat start 28 Acknowledge from slave 29 Stop 21:27 Slave address – 7 bits 28 Read = 1 29 Acknowledge from slave 30:37 Data byte from slave – 8 bits 38 Acknowledge from master 39 Stop Control Registers Byte 0:Control Register 0 Bit @Pup 7 0 Reserved Name Reserved, Set = 0 6 1 PCIF PCI PCI Drive Strength Override 0 = Force All PCI and PCIF Outputs to Low Drive Strength 1 = Force All PCI and PCIF Outputs to High Drive Strength 5 0 Reserved Reserved, Set = 0 4 0 Reserved Reserved, Set = 0 Document #: 38-07445 Rev. *B Description Page 4 of 18 CY28409 Byte 0:Control Register 0 (continued) Bit @Pup Name Description 3 Externally Selected PCI_STP# PCI_STP# reflects the current value of the external PCI_STP# pin. 0 =PCI_STP# pin is low. 2 Externally Selected CPU_STP# CPU_STP# reflects the current value of the external CPU_STP# pin. 0 = CPU_STP# pin is low. 1 Externally Selected FS_B FS_B reflects the value of the FS_B pin sampled on power-up. 0 Externally Selected FS_A FS_A reflects the value of the FS_A pin sampled on power-up. Byte 1: Control Register 1 Bit @Pup 7 0 Name SRCT, SRCC Description Allows control of SRCT/C with assertion of PCI_STP# or SW PCI_STP 0 = Free Running, 1 = Stopped with PCI_STP# 6 1 SRCT, SRCC SRCT/C Output Enable; 0 = Disabled (Hi-z), 1 = Enabled 5 1 Reserved Reserved, Set = 1 4 1 Reserved Reserved, Set = 1 3 1 Reserved Reserved, Set = 1 2 1 CPUT2, CPUC2 CPUT/C2 Output Enable; 0 = Disabled (Hi-z), 1 = Enabled 1 1 CPUT1, CPUC1 CPUT/C1 Output Enable; 0 = Disabled (Hi-z), 1 = Enabled 0 1 CPUT0, CPUC0 CPUT/C0 Output Enable; 0 = Disabled (Hi-z), 1 = Enabled Byte 2: Control Register 2 Bit @Pup Name Description 7 0 SRCT, SRCC SRCT/C Pwrdwn Drive Mode 0 = Driven during power-down, 1 = Three-state during power-down 6 0 SRCT, SRCC SRCT/C Stop Drive Mode 0 = Driven during PCI_STP, 1 = Three-state during PCI_STP 5 0 CPUT2, CPUC2 CPUT/C2 Pwrdwn Drive Mode 0 = Driven during power-down, 1 = Three-state during power-down 4 0 CPUT1, CPUC1 CPUT/C1 Pwrdwn Drive Mode 0 = Driven during power ‘down, 1 = Three-state during power-down 3 0 CPUT0, CPUC0 CPUT/C0 Pwrdwn Drive Mode 0 = Driven during power-down, 1 = Three-state during power-down 2 0 CPUT2, CPUC2 CPUT/C2 stop Drive Mode 0 = Driven when stopped, 1 = Three-state when stopped 1 0 CPUT1, CPUC1 CPUT/C1 stop Drive Mode 0 = Driven when stopped, 1 = Three-state when stopped 0 0 CPUT0, CPUC0 CPUT/C0 stop Drive Mode 0 = Driven when stopped, 1 = Three-state when stopped Byte 3: Control Register 3 Bit @Pup Name 7 1 SW PCI STOP SW PCI_STP Function 0= PCI_STP assert, 1= PCI_STP deassert When this bit is set to 0, all STOPPABLE PCI, PCIF and SRC outputs will be stopped in a synchronous manner with no short pulses. When this bit is set to 1, all STOPPED PCI,PCIF and SRC outputs will resume in a synchronous manner with no short pulses. 6 1 PCI6 PCI6 Output Enable 0 = Disabled, 1 = Enabled Document #: 38-07445 Rev. *B Description Page 5 of 18 CY28409 Byte 3: Control Register 3 Bit @Pup Name Description 5 1 PCI5 PCI5 Output Enable 0 = Disabled, 1 = Enabled 4 1 PCI4 PCI4 Output Enable 0 = Disabled, 1 = Enabled 3 1 PCI3 PCI3 Output Enable 0 = Disabled, 1 = Enabled 2 1 PCI2 PCI2 Output Enable 0 = Disabled, 1 = Enabled 1 1 PCI1 PCI1 Output Enable 0 = Disabled, 1 = Enabled 0 1 PCI0 PCI0 Output Enable 0 = Disabled, 1 = Enabled Byte 4: Control Register 4 Bit @Pup Name Description 7 0 USB_48 USB_48 Drive Strength 0 = High drive strength, 1 = Low drive strength 6 1 USB_48 USB_48 Output Enable 0 = Disabled, 1 = Enabled 5 0 PCIF2 Allow control of PCIF2 with assertion of PCI_STP# or SW PCI_STP 0 = Free Running, 1 = Stopped with PCI_STP# 4 0 PCIF1 Allow control of PCIF1 with assertion of PCI_STP# or SW PCI_STP 0 = Free Running, 1 = Stopped with PCI_STP# 3 0 PCIF0 Allow control of PCIF0 with assertion of PCI_STP# or SW PCI_STP 0 = Free Running, 1 = Stopped with PCI_STP# 2 1 PCIF2 PCIF2 Output Enable 0 = Disabled, 1 = Enabled 1 1 PCIF1 PCIF1 Output Enable 0 = Disabled, 1 = Enabled 0 1 PCIF0 PCIF0 Output Enable 0 = Disabled, 1 = Enabled Byte 5: Control Register 5 Bit @Pup 7 1 DOT_48 Name DOT_48 Output Enable 0 = Disabled, 1 = Enabled 6 1 Reserved Reserved, Set = 1 5 0 3V66_4/VCH VCH Select 66 MHz/48 MHz 0 = 3V66 mode, 1 = VCH (48 MHz) mode 4 1 3V66_4/VCH 3V66_4/VCH Output Enable 0 = Disabled, 1 = Enabled 3 1 3V66_3 3V66_3 Output Enable 0 = Disabled, 1 = Enabled 2 1 3V66_2 3V66_2 Output Enable 0 = Disabled, 1 = Enabled 1 1 3V66_1 3V66_1 Output Enable 0 = Disabled, 1 = Enabled 0 1 3V66_0 3V66_0 Output Enable 0 = Disabled, 1 = Enabled Document #: 38-07445 Rev. *B Description Page 6 of 18 CY28409 Byte 6: Control Register 6 Bit @Pup Name Description 7 0 Reserved Reserved, Set = 0 6 0 Reserved Reserved, Set = 0 5 0 CPUC0, CPUT0 CPUC1, CPUT1 CPUC2, CPUT2 FS_A & FS_B Operation 0 = Normal, 1 = Test mode 4 0 SRCT, SRCC SRC Frequency Select 0 = 100Mhz, 1 = 200MHz 3 0 PCIF PCI 3V66 SRCT,SRCC CPUT_ITP,CPUC_ITP Spread Spectrum Mode 0 = down (default), 1 = center 2 0 PCIF PCI 3V66 SRCT,SRCC CPUT_ITP,CPUC_ITP Spread Spectrum Enable 0 = Spread Off, 1 = Spread On 1 1 REF_1 REF_1 Output Enable 0 = Disabled, 1 = Enabled 0 1 REF_0 REF_0 Output Enable 0 = Disabled, 1 = Enabled Byte 7: Vendor ID Bit @Pup Name Description 7 0 Revision ID Bit 3 Revision ID Bit 3 6 1 Revision ID Bit 2 Revision ID Bit 2 5 0 Revision ID Bit 1 Revision ID Bit 1 4 0 Revision ID Bit 0 Revision ID Bit 0 3 1 Vendor ID Bit 3 Vendor ID Bit 3 2 0 Vendor ID Bit 2 Vendor ID Bit 2 1 0 Vendor ID Bit 1 Vendor ID Bit 1 0 0 Vendor ID Bit 0 Vendor ID Bit 0 Crystal Recommendations The CY28409 requires a Parallel Resonance Crystal. Substituting a series resonance crystal will cause the CY28409 to operate at the wrong frequency and violate the ppm specification. For most applications there is a 300-ppm frequency shift between series and parallel crystals due to incorrect loading. Table 6. Crystal Recommendations Frequency (Fund) Cut Loading Load Cap Drive (max.) Shunt Cap (max.) Motional (max.) Tolerance (max.) Stability (max.) Aging (max.) 14.31818 MHz AT Parallel 0.1 mW 5 pF 0.016 pF 50 ppm 50 ppm 5 ppm 20 pF Crystal Loading Crystal loading plays a critical role in achieving low ppm performance. To realize low ppm performance, the total capacitance the crystal will see must be considered to calculate the appropriate capacitive loading (CL). Document #: 38-07445 Rev. *B Page 7 of 18 CY28409 The following diagram shows a typical crystal configuration using the two trim capacitors. An important clarification for the following discussion is that the trim capacitors are in series with the crystal not parallel. It’s a common misconception that load capacitors are in parallel with the crystal and should be approximately equal to the load capacitance of the crystal. This is not true. Load Capacitance (each side) Ce = 2 * CL – (Cs + Ci) Total Capacitance (as seen by the crystal) 1 CLe = 1 1 ( Ce1 + Cs1 ) + Ci1 + Ce2 + Cs2 + Ci2 CL ....................................................Crystal load capacitance CLe ......................................... Actual loading seen by crystal using standard value trim capacitors Ce ..................................................... External trim capacitors Cs ..............................................Stray capacitance (terraced) Ci .......................................................... Internal capacitance (lead frame, bond wires etc.) PD# (Power-down) Clarification Figure 1. Crystal Capacitive Clarification Calculating Load Capacitors In addition to the standard external trim capacitors, trace capacitance and pin capacitance must also be considered to correctly calculate crystal loading. As mentioned previously, the capacitance on each side of the crystal is in series with the crystal. This means the total capacitance on each side of the crystal must be twice the specified crystal load capacitance (CL). While the capacitance on each side of the crystal is in series with the crystal, trim capacitors (Ce1,Ce2) should be calculated to provide equal capacitive loading on both sides. C lo c k C h ip (C Y 2 8 4 0 9 ) C i2 C i1 P in 3 to 6 p X2 X1 C s1 The PD# (Power-down) pin is used to shut off ALL clocks prior to shutting off power to the device. PD# is an asynchronous active LOW input. This signal is synchronized internally to the device powering down the clock synthesizer. PD# is an asynchronous function for powering up the system. When PD# is low, all clocks are driven to a LOW value and held there and the VCO and PLLs are also powered down. All clocks are shut down in a synchronous manner so as not to cause glitches while changing to the low ‘stopped’ state. PD# Assertion When PD# is sampled low by two consecutive rising edges of the CPUC clock then all clock outputs (except CPU) clocks must be held low on their next high to low transition. CPU clocks must be held with CPU clock pin driven high with a value of 2 x Iref and CPUC undriven. Due to the state of internal logic, stopping and holding the REF clock outputs in the LOW state may require more than one clock cycle to complete C s2 T ra c e 2 .8 p F XTAL Ce1 Ce2 T r im 33pF Figure 2. Crystal Loading Example Use the following formulas to calculate the trim capacitor values fro Ce1 and Ce2. Document #: 38-07445 Rev. *B Page 8 of 18 CY28409 PD# CPUT, 133MHz CPUC, 133MHz SRCT 100MHz SRCC 100MHz 3V66, 66MHz USB, 48MHz PCI, 33MHz REF Figure 3. Power-down Assertion Timing Waveform PD# Deassertion The power-up latency between PD# rising to a valid logic ‘1’ level and the starting of all clocks is less than 1.8 ms. Tstable <1.8nS PD# CPUT, 133MHz CPUC, 133MHz SRCT 100MHz SRCC 100MHz 3V66, 66MHz USB, 48MHz PCI, 33MHz REF Tdrive_PWRDN# <300µS, >200mV Figure 4. Power-down Deassertion Timing Waveform Document #: 38-07445 Rev. *B Page 9 of 18 CY28409 CPU_STP# Assertion The CPU_STP# signal is an active low input used for synchronous stopping and starting the CPU output clocks while the rest of the clock generator continues to function. When the CPU_STP# pin is asserted, all CPU outputs that are set with the SMBus configuration to be stoppable via assertion of CPU_STP# will be stopped after being sampled by two rising edges of the internal CPUT clock. The final states of the stopped CPU signals are CPUT = HIGH and CPUC = LOW. There is no change to the output drive current values during the stopped state. The CPUT is driven HIGH with a current value equal to (Mult 0 ‘select’) x (Iref), and the CPUC signal will not be driven. Due to the external pull-down circuitry, CPUC will be LOW during this stopped state. CPU_STP# CPUT CPUC Figure 5. CPU_STP# Assertion Waveform CPU_STP# Deassertion The de-assertion of the CPU_STP# signal will cause all CPU outputs that were stopped to resume normal operation in a synchronous manner. Synchronous manner meaning that no short or stretched clock pulses will be produce when the clock resumes. The maximum latency from the deassertion to active outputs is no more than two CPU clock cycles CPU_STP# CPUT CPUC CPU Internal Tdrive_CPU_STP#,10nS>200mV Figure 6. CPU_STP# Deassertion Waveform Document #: 38-07445 Rev. *B Page 10 of 18 CY28409 PCI_STP# Assertion[2] The PCI_STP# signal is an active LOW input used for synchronous stopping and starting the PCI outputs while the rest of the clock generator continues to function. The set-up time for capturing PCI_STP# going LOW is 10 ns (tSU). (See Figure 7.) The PCIF clocks will not be affected by this pin if their corresponding control bit in the SMBus register is set to allow them to be free-running. Tsu PCI_STP# PCI_F PCI SRC 100MHz Figure 7. PCI_STP# Assertion Waveform PCI_STP# Deassertion The deassertion of the PCI_STP# signal will cause all PCI and stoppable PCIF clocks to resume running in a synchronous manner within two PCI clock periods after PCI_STP# transitions to a high level. Tsu Tdrive_SRC PCI_STP# PCI_F PCI SRC 100MHz Figure 8. PCI_STP# Deassertion Waveform Note: 2. The PCI STOP function is controlled by two inputs. One is the device PCI_STP# pin number 34 and the other is SMBus byte 0 bit 3. These two inputs are logically ANDed. If either the external pin or the internal SMBus register bit is set low then the stoppable PCI clocks will be stopped in a logic low state. Reading SMBus Byte 0 Bit 3 will return a 0 value if either of these control bits are set LOW thereby indicating the device’s stoppable PCI clocks are not running. Document #: 38-07445 Rev. *B Page 11 of 18 CY28409 FS_A, FS_B VTT_PWRGD# PWRGD_VRM 0.2-0.3mS Delay VDD Clock Gen Clock State Clock Outputs Clock VCO State 0 Wait for VTT_PWRGD# State 1 Device is not affected, VTT_PWRGD# is ignored Sample Sels State 2 Off State 3 On On Off Figure 9. VTT_PWRGD# Timing Diagram S2 S1 Delay >0.25mS VTT_PWRGD# = Low Sample Inputs straps VDDA = 2.0V Wait for <1.8ms S0 Power Off S3 VDDA = off Normal Operation Enable Outputs VTT_PWRGD# = toggle Figure 10. Clock Generator Power-up/Run State Diagram Document #: 38-07445 Rev. *B Page 12 of 18 CY28409 Absolute Maximum Conditions Parameter Description Condition Min. Max. Unit Core Supply Voltage –0.5 4.6 V VDD VDD_A Analog Supply Voltage –0.5 4.6 V VIN Input Voltage Relative to VSS –0.5 VDD + 0.5 VDC Temperature, Storage Non-functional –65 150 °C TS TA Temperature, Operating Ambient Functional 0 70 °C TJ Temperature, Junction Functional – 150 °C Dissipation, Junction to Case Mil-Spec 883E Method 1012.1 – 15 °C/W ØJC ØJA Dissipation, Junction to Ambient JEDEC (JESD 51) – 45 °C/W ESDHBM ESD Protection (Human Body Model) MIL-STD-883, Method 3015 2000 – V UL–94 Flammability Rating @ 1/8 in. V–0 MSL Moisture Sensitivity Level 1 Multiple Supplies: The Voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required. DC Electrical Specifications Parameter VDD_A, VDD_REF, VDD_PCI, VDD_3V66, VDD_48, VDD_CPU VILI2C VIHI2C VIL VIH IIL IIH VOL VOH IOZ IDD CIN COUT LIN VXIH VXIL IPD3.3V Description 3.3V Operating Voltage Input Low Voltage Input High Voltage Input Low Voltage Input High Voltage Input Low Leakage Current Input High Leakage Current Output Low Voltage Output High Voltage High-impedance Output Current Dynamic Supply Current Input Pin Capacitance Output Pin Capacitance Pin Inductance Xin High Voltage Xin Low Voltage Power-down Supply Current Document #: 38-07445 Rev. *B Condition 3.3 ± 5% SDATA, SCLK SDATA, SCLK Min. 3.135 Max. 3.465 – 1.0 2.2 – VSS – 0.5 0.8 2.0 VDD + 0.5 except internal pull-ups resistors, 0 < VIN < VDD –5 except internal pull-down resistors, 0 < VIN < VDD 5 IOL = 1 mA – 0.4 IOH = –1 mA 2.4 – –10 10 All outputs loaded per Table 9 and Figure 11 – 350 2 5 3 6 – 7 0.7VDD VDD 0 0.3VDD PD# Asserted – 1 Unit V V V V V µA µA V V µA mA pF pF nH V V mA Page 13 of 18 CY28409 AC Electrical Specifications Parameter Description Crystal TDC XIN Duty Cycle TPERIOD XIN Period TR / TF XIN Rise and Fall Times TCCJ XIN Cycle to Cycle Jitter LACC Long-term Accuracy CPU at 0.7V TDC CPUT and CPUC Duty Cycle 100-MHz CPUT and CPUC Period TPERIOD TPERIOD 133-MHz CPUT and CPUC Period 200-MHz CPUT and CPUC Period TPERIOD TSKEW Any CPUT/C to CPUT/C Clock Skew TCCJ CPUT/C Cycle to Cycle Jitter CPUT and CPUC Rise and Fall Times TR / TF TRFM Rise/Fall Matching ∆TR Rise Time Variation Fall Time Variation ∆TF VHIGH Voltage High VLOW Voltage Low Crossing Point Voltage at 0.7V Swing VOX VOVS Maximum Overshoot Voltage VUDS Minimum Undershoot Voltage Ring Back Voltage VRB SRC TDC SRCT and SRCC Duty Cycle TPERIOD 100 MHz SRCT and SRCC Period 200 MHz SRCT and SRCC Period TPERIOD TCCJ SRCT/C Cycle to Cycle Jitter LACC SRCT/C Long Term Accuracy TR / TF SRCT and SRCC Rise and Fall Times TRFM Rise/Fall Matching Rise Time Variation ∆TR ∆TF Fall Time Variation VHIGH Voltage High Voltage Low VLOW VOX Crossing Point Voltage at 0.7V Swing VOVS Maximum Overshoot Voltage Minimum Undershoot Voltage VUDS VRB Ring Back Voltage 3V66 TDC 3V66 Duty Cycle TPERIOD Spread Disabled 3V66 Period TPERIOD Spread Enabled 3V66 Period THIGH 3V66 High Time TLOW 3V66 Low Time Document #: 38-07445 Rev. *B Condition The device will operate reliably with input duty cycles up to 30/70 but the REF clock duty cycle will not be within specification When XIN is driven from an external clock source Measured between 0.3VDD and 0.7VDD As an average over 1-µs duration Over 150 ms Min. Max. Unit 47.5 52.5 % 69.841 71.0 ns – – 10.0 500 300 ns ps ppm Measured at crossing point VOX 45 55 Measured at crossing point VOX 9.9970 10.003 Measured at crossing point VOX 7.4978 7.5023 Measured at crossing point VOX 4.9985 5.0015 Measured at crossing point VOX – 100 Measured at crossing point VOX – 125 Measured from VOL = 0.175 to VOH = 0.525V 175 700 Determined as a fraction of 2*(TR – TF)/(TR + TF) – 20 – 125 – 125 Math averages Figure 11 660 850 Math averages Figure 11 –150 – 250 550 – VHIGH + 0.3 –0.3 – See Figure 11. Measure SE – 0.2 % ns ns ns ps ps ps % ps ps mv mv mv V V V Measured at crossing point VOX 45 55 Measured at crossing point VOX 9.9970 10.003 Measured at crossing point VOX 4.9985 5.0015 Measured at crossing point VOX – 125 Measured at crossing point VOX – 300 Measured from VOL = 0.175 to VOH = 0.525V 175 700 Determined as a fraction of 2*(TR – TF)/(TR + TF) – 20 – 125 – 125 Math averages Figure 11 660 850 Math averages Figure 11 –150 – 250 550 – VHIGH + 0.3 –0.3 – See Figure 11. Measure SE – 0.2 % ns ns ps ppm ps % ps ps mv mv mV V V V Measurement at 1.5V Measurement at 1.5V Measurement at 1.5V Measurement at 2.0V Measurement at 0.8V 45 14.9955 14.9955 4.9500 4.5500 55 15.0045 15.0799 – – % ns ns ns ns Page 14 of 18 CY28409 AC Electrical Specifications (continued) Parameter Description 3V66 Rise and Fall Times TR / TF TSKEW Any 3V66 to Any 3V66 Clock Skew 3V66 Cycle to Cycle Jitter TCCJ PCI/PCIF TDC PCI Duty Cycle TPERIOD Spread Disabled PCIF/PCI Period Spread Enabled PCIF/PCI Period TPERIOD THIGH PCIF and PCI high time TLOW PCIF and PCI low time PCIF and PCI rise and fall times TR / TF Any PCI clock to Any PCI clock Skew TSKEW TCCJ PCIF and PCI Cycle to Cycle Jitter DOT TDC Duty Cycle TPERIOD Period TSKEW Any 48-MHz to 48-MHz Clock Skew USB high time THIGH TLOW USB low time TR / TF Rise and Fall Times Cycle to Cycle Jitter TCCJ USB TDC Duty Cycle TPERIOD Period Any 48-MHz to 48-MHz Clock Skew TSKEW THIGH USB high time TLOW USB low time Rise and Fall Times TR / TF TCCJ Cycle to Cycle Jitter REF TDC REF Duty Cycle REF Period TPERIOD TSKEW Any REF to REF Clock Skew TR / TF REF Rise and Fall Times TCCJ REF Cycle to Cycle Jitter ENABLE/DISABLE and SET-UP TSTABLE Clock Stabilization from Power-up Stopclock Set-up Time TSS TSH Stopclock Hold Time Condition Measured between 0.8V and 2.0V Measurement at 1.5V Measurement at 1.5V Min. 0.5 – – Max. 2.0 250 250 Unit ns ps ps Measurement at 1.5V Measurement at 1.5V Measurement at 1.5V Measurement at 2.0V Measurement at 0.8V Measured between 0.8V and 2.0V Measurement at 1.5V Measurement at 1.5V 45 29.9910 29.9910 12.0 12.0 0.5 – – 55 30.0009 30.1598 – – 2.0 500 250 % ns ns ns ns ns ps ps Measurement at 1.5V Measurement at 1.5V Measured at crossing point VOX Measurement at 2.0V Measurement at 0.8V Measured between 0.8V and 2.0V Measurement at 1.5V 45 20.8271 – 8.994 8.794 0.5 – 55 20.8396 500 10.486 10.386 1.0 350 % ns ps ns ns ns ps Measurement at 1.5V Measurement at 1.5V Measured at crossing point VOX Measurement at 2.0V Measurement at 0.8V Measured between 0.8V and 2.0V Measurement at 1.5V 45 20.8271 – 8.094 7.694 1.0 – 55 20.8396 500 10.036 9.836 2.0 350 % ns ps ns ns ns ps Measurement at 1.5V Measurement at 1.5V Measured at crossing point VOX Measured between 0.8V and 2.0V Measurement at 1.5V 45 69.827 – 0.5 – 55 69.855 500 2.0 1000 % ns ps ns ps – 10.0 0 1.8 – – ms ns ns Table 7. Group Timing Relationship and Tolerances Group 3V66 to PCI Conditions 3V66 Leads PCI Document #: 38-07445 Rev. *B Offset Min. Max. 1.5 ns 3.5 ns Table 8. USB to DOT Phase Offset Parameter Typical Value Tolerance DOT Skew 0° 0.0 ns 1000 ps USB Skew 180° 0.0 ns 1000 ps VCH SKew 0° 0.0 ns 1000 ps Page 15 of 18 CY28409 Table 9. Maximum Lumped Capacitive Output Loads Clock PCI Clocks 3V66 Clocks USB Clock DOT Clock REF Clock Max Load 30 30 20 10 30 Unit pF pF pF pF pF Test and Measurement Set-up For Differential CPU and SRC Output Signals The following diagram shows lumped test load configurations for the differential Host Clock Outputs. CPUT CPUC M e a s u re m e n t P o in t T PCB 33Ω 4 9 .9 Ω 33Ω 2pF M e a s u re m e n t P o in t T PCB 4 9 .9 Ω IR E F 2pF 475Ω Figure 11. 0.7V Load Configuration O u tp u t u n d e r T e s t P ro b e Load C ap 3 . 3 V s ig n a l s tD C - - 3 .3 V 2 .0 V 1 .5 V 0 .8 V 0V Tr Tf Figure 12. Lumped Load For Single-ended Output Signals (for AC Parameters Measurement) Table 10. CPU Clock Current Select Function Board Target Trace/Term Z Reference R, IREF – VDD (3*RREF) Output Current Voh @ Z 50 Ohms RREF = 475 1%, IREF = 2.32 mA IOH = 6*IREF 0.7V @ 50 Ordering Information Part Number Package Type Product Flow CY28409OC 56-pin SSOP Commercial, 0° to 70°C CY28409OCT 56-pin SSOP – Tape and Reel Commercial, 0° to 70°C CY28409ZC 56-pin TSSOP Commercial, 0° to 70°C CY28409ZCT 56-pin TSSOP – Tape and Reel Commercial, 0° to 70°C Document #: 38-07445 Rev. *B Page 16 of 18 CY28409 Package Drawings and Dimensions 56-lead Shrunk Small Outline Package O56 51-85062-*C 56-lead Thin Shrunk Small Outline Package, Type II (6 mm x 14 mm) Z56 51-85060-*B Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. Intel and Pentium are registered trademarks of Intel Corporation. All product and company names mentioned in this document are the trademarks of their respective holders. Document #: 38-07445 Rev. *B Page 17 of 18 © Cypress Semiconductor Corporation, 2003. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges. CY28409 Document History Page Document Title: CY28409 Clock Synthesizer with Differential SRC and CPU Outputs Document Number: 38-07445 REV. ECN NO. Issue Date Orig. of Change Description of Change ** 121414 12/04/02 RGL New Data Sheet *A 124795 07/07/03 RGL Changed revision code to 4 Corrected rise/fall time value on DOT from 1.0/2.0 to 0.5/1.0 ns, respectively Changed USB and DOT from long-term jitter to cycle-to-cycle jitter Changed USB and DOT period value from 28.8257/28.8340 to 20.8271/20.8396 ns, respectively *B 128864 08/29/03 RGL Fixed the I2C registers to match the actual device Removed all items referencing to 166 MHz Document #: 38-07445 Rev. *B Page 18 of 18