FAIRCHILD H11AG2

PHOTOTRANSISTOR OPTOCOUPLERS
H11AG1
H11AG2
H11AG3
DESCRIPTION
The H11AG series consists of a Gallium-AluminumArsenide IRED emitting diode coupled with a silicon
phototransistor in a dual in-line package. This device
provides the unique feature of the high current transfer
ratio at both low output voltage and low input current.
This makes it ideal for use in low power logic circuits,
telecommunications equipment and portable electronics
isolation applications.
6
FEATURES
• High efficiency low degradation liquid epitaxial IRED
• Logic level compatible, input and output currents, with
CMOS and LS/TTL
• High DC current transfer ratio at low input currents
• Underwriters Laboratory (UL) recognized File #E90700
6
SCHEMATIC
1
1
ANODE 1
6 BASE
CATHODE 2
6
APPLICATIONS
1
5 COL
N/C 3
4 EMITTER
• CMOS driven solid state reliability
• Telephone ring detector
• Digital logic isolation
ABSOLUTE MAXIMUM RATINGS
Parameters
Symbol
Device
Value
Units
TSTG
All
-55 to +150
°C
Operating Temperature
TOPR
All
-55 to +100
°C
Lead Solder Temperature
TSOL
All
260 for 10 sec
°C
260
mW
3.5
mW/°C
TOTAL DEVICE
Storage Temperature
Total Device Power Dissipation @ 25°C (LED plus detector)
Derate Linearly From 25°C
EMITTER
Continuous Forward Current
Reverse Voltage
Forward Current - Peak (1 µs pulse, 300 pps)
LED Power Dissipation 25°C Ambient
Derate Linearly From 25°C
PD
All
IF
All
50
mA
VR
All
6
V
IF(pk)
All
3.0
A
75
mW
1.0
mW/°C
PD
All
PD
All
DETECTOR
Detector Power Dissipation @ 25°C
Derate Linearly from 25°C
Continuous Collector Current
 2001 Fairchild Semiconductor Corporation
DS300213
1/28/02
All
1 OF 8
150
mW
2.0
mW/°C
50
mA
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PHOTOTRANSISTOR OPTOCOUPLERS
H11AG1
H11AG2
ELECTRICAL CHARACTERISTICS
H11AG3
(TA = 0-70°C Unless otherwise specified.)
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameters
Test Conditions
Symbol
Device
Min
Typ
Max
Units
IF = 1 mA
VR = 5 V, TA = 25°C
VF
All
1.5
V
IR
All
10
µA
VR = 5 V, TA = 70°C
IR
All
100
µA
V = 0, f = 1.0 MHz
CJ
All
100
pF
IC = 1.0 mA, IF = 0
BVCEO
All
30
Collector to Base
IC = 100 µA, IF = 0
BVCBO
All
70
V
V
Emitter to Collector
IC = 100 µA, IF = 0
BVECO
All
7
V
VCE = 10 V, IF = 0
ICEO
All
5
VCE = 10 V, f = 1 MHz
CCE
All
2
EMITTER
Input Forward Voltage
Reverse Leakage Current
Capacitance
DETECTOR
Breakdown Voltage
Collector to Emitter
Leakage Current
Collector to Emitter
Capacitance
10
µA
pF
ISOLATION CHARACTERISTICS
Parameters
Input-Output Isolation Voltage
TRANSFER CHARACTERISTICS
DC Characteristics
Test Conditions
Symbol
Min
II-0 ≤ 1 µA, t = 1 min.
VISO
5300
Saturation Voltage
AC Characteristics
Non-Saturated Switching Times
Turn-On Time
Turn-Off Time
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Max
Units
Vac(rms)
(TA = 25°C Unless otherwise specified.)
Test Conditions
IF = 1 mA, VCE = 5 V
Current Transfer Ratio
Typ
IF = 1 mA, VCE = 0.6 V
Symbol
CTR
CTR
Device
Min
H11AG1
300
H11AG2
200
H11AG3
H11AG1
100
100
H11AG2
50
H11AG3
20
H11AG1
100
H11AG2
50
Typ
Max
Units
%
IF = 0.2 mA, VCE = 1.5 V
CTR
IF = 2.0 mA, IC = 0.5 mA
VCE(SAT)
All
Test Conditions
Symbol
Device
RL = 100 Ω, IF = 1 mA, VCC = 5 V
ton
All
5
µS
RL = 100 Ω, IF = 1 mA, VCC = 5 V
toff
All
5
µS
2 OF 8
Min
Typ
.40
V
Max
Units
1/28/02
DS300213
PHOTOTRANSISTOR OPTOCOUPLERS
H11AG1
H11AG2
H11AG3
Figure 2. Normalized Current Transfer Ratio vs. Forward Current
1.2
1.8
1.0
NORMALIZED CTRCE
VF - FORWARD VOLTAGE (V)
Figure 1. LED Forward Voltage vs. Forward Current
2.0
1.6
1.4
o
TA = -55 C
TA = 25 oC
1.2
0.8
0.6
0.4
T A = 100 oC
1.0
NORMALIZED TO:
I F = 5mA
VCE = 5V
o
TA = 25 C
0.2
0.8
0.1
1
10
100
0.1
1.6
NORMALIZED CTR CE
I F = 10mA
I F = 2mA
I F = 5mA
TA = 25 C
o
1.0
0.8
I F = 1mA
0.6
I F = 0.5mA
0.4
I F = 0.2mA
0.2
-40
-20
0
20
40
60
TA - AMBIENT TEMPERATURE -oC
80
100
NORMALIZED ICE - COLLECTOR - EMITTER CURRENT
10
NORMALIZED TO:
I F = 5mA
V = 5V
CE
0.0
-60
100
Figure 4. Normalized Collector vs. Collector - Emitter Voltage
Figure 3. Normalized CTR vs. Temperature
1.2
10
IF - FORWARD CURRENT - mA
I F - LED FORWARD CURRENT (mA)
1.4
1
I F = 10mA
1
I F = 5mA
I F = 2mA
I F = 1mA
0.1
I F = 0.5mA
I F = 0.2mA
0.01
0.001
0.0001
0.1
NORMALIZED TO:
I F = 5mA
VCE = 5V
TA = 25 o C
1
10
VCE - COLLECTOR - EMITTER VOLTAGE - V
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PHOTOTRANSISTOR OPTOCOUPLERS
H11AG1
H11AG2
H11AG3
Figure 6. Normalized Collector - Base Current vs. Temperature
30
10
NORMALIZED COLLECTOR - BASE CURRENT
NORMALIZED ICB - COLLECTOR BASE PHOTOCURRENT
Figure 5. Normalized Collector Base Photocurrent Ratio vs. Forward Current
25
20
15
10
NORMALIZED TO:
I F = 5mA
VCB = 5V
TA = 25 o C
5
0
0
10
20
30
40
50
60
70
80
90
I F = 10mA
I F = 5mA
1
I F = 2mA
I F = 1mA
0.1
I F = 0.5mA
I F = 0.2mA
0.01
100
NORMALIZED TO:
IF = 5mA
VCB = 5V
o
TA = 25 C
0.001
-60
IF - FORWARD CURRENT - mA
-40
-20
0
20
40
60
80
100
TA - AMBIENT TEMPERATURE - oC
Figure 7. Collector-Emitter Dark Current vs. Ambient Temperature
10000
I F = 0mA
VCE = 10V
ICEO - DARK CURRENT (nA)
1000
100
10
1
0.1
0
10
20
30
40
50
60
70
80
90
100
TA - AMBIENT TEMPERATURE ( oC)
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PHOTOTRANSISTOR OPTOCOUPLERS
H11AG1
H11AG2
H11AG3
47Ω
75KΩ
≤ 25A
LOAD
SC160B
47Ω
120V
60Hz
SUPPLY
1.5MΩ
+5V
15K
V130LA20A
22K
H11AG1
C203D
DT230H
(4)
2N4256
150pF
0.1
CMOS
CONTROL
≥ 0.16mA
Figure 8. CMOS Input, 3KW, Zero Voltage Switching Solid State Relay
The H11AG1’s superior performance at low input currents allows standard CMOS logic circuits to directly operate a 25A solid state relay.
Circuit operation is as follows: power switching is provided by the SC160B, 25A triac. Its gate is controlled by the C203B via the DT230H
rectifier bridge. The C203B turn-on is inhibited by the 2N4256 when line voltage is above 12V and/or the H11AG is off. False trigger and
dv/dt protection are provided by the combination of the MOV varistor and RC snubber network.
3V ≤ VCC ≤ 10V
47KΩ
4093 or
74HC14
R1
H11AG1
AC
INPUT
VOLTAGE
1N148
C1
4.7MΩ
C2
0.1
4.7KΩ
INPUT
R1
40-90 VRMS
75 K
20 Hz
1/10 W
95-135 VRMS 180 K
60 Hz
1/10 W
200-280 VRMS 390 K
50/60 Hz
1/4 W
C1
0.1 µF
100 V
12 ηF
200 V
6.80 ηF
400 V
Z
109K
285K
550K
DC component of input voltage is ignored due to C1
Figure 9. Telephone Ring Detector/A.C. Line CMOS Input Isolator
The H11AG1 uses less input power than the neon bulb traditionally used to monitor telephone and line voltages. Additionally. response
time can be tailored to ignore telephone dial tap, switching transients and other undesired signals by modifying the value of C2. The high
impedance to line voltage also can simply board layout spacing requirements.
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PHOTOTRANSISTOR OPTOCOUPLERS
H11AG1
H11AG2
Package Dimensions (Through Hole)
H11AG3
Package Dimensions (Surface Mount)
PIN 1
ID.
0.350 (8.89)
0.330 (8.38)
3
0.270 (6.86)
0.240 (6.10)
2
PIN 1
ID.
1
SEATING PLANE
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
4
5
6
0.070 (1.78)
0.045 (1.14)
0.300 (7.62)
TYP
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.135 (3.43)
0.200 (5.08)
0.165 (4.18)
0.016 (0.41)
0.008 (0.20)
0.020 (0.51)
MIN
0.154 (3.90)
0.100 (2.54)
0.022 (0.56)
0.016 (0.41)
0° to 15°
0.020 (0.51)
MIN
0.022 (0.56)
0.016 (0.41)
0.016 (0.40)
0.008 (0.20)
0.100 (2.54)
TYP
0.300 (7.62)
TYP
0.016 (0.40) MIN
0.315 (8.00)
MIN
0.405 (10.30)
MAX
0.100 (2.54)
TYP
Lead Coplanarity : 0.004 (0.10) MAX
Package Dimensions (0.4”Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
0.270 (6.86)
0.240 (6.10)
0.070 (1.78)
0.060 (1.52)
SEATING PLANE
0.350 (8.89)
0.330 (8.38)
0.070 (1.78)
0.045 (1.14)
0.415 (10.54)
0.295 (7.49)
0.200 (5.08)
0.135 (3.43)
0.154 (3.90)
0.100 (2.54)
0.100 (2.54)
0.004 (0.10)
MIN
0.030 (0.76)
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.022 (0.56)
0.016 (0.41)
0.100 (2.54) TYP
0.400 (10.16)
TYP
NOTE
All dimensions are in inches (millimeters)
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PHOTOTRANSISTOR OPTOCOUPLERS
H11AG1
H11AG2
H11AG3
Order Entry Identifier
Option
S
Description
.S
Surface Mount Lead Bend
SD
.SD
Surface Mount; Tape and reel
W
.W
0.4” Lead Spacing
300
.300
VDE 0884
300W
.300W
VDE 0884, 0.4” Lead Spacing
3S
.3S
VDE 0884, Surface Mount
3SD
.3SD
VDE 0884, Surface Mount, Tape & Reel
Carrier Tape Specifications (“D” Taping Orientation)
12.0 ± 0.1
4.85 ± 0.20
4.0 ± 0.1
0.30 ± 0.05
4.0 ± 0.1
Ø1.55 ± 0.05
1.75 ± 0.10
7.5 ± 0.1
16.0 ± 0.3
13.2 ± 0.2
9.55 ± 0.20
0.1 MAX
10.30 ± 0.20
Ø1.6 ± 0.1
User Direction of Feed
NOTE
All dimensions are millimeters
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PHOTOTRANSISTOR OPTOCOUPLERS
H11AG1
H11AG2
H11AG3
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE
TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT
ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT
DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE
RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical
implant into the body,or (b) support or sustain life,
and (c) whose failure to perform when properly
used in accordance with instructions for use provided
in labeling, can be reasonably expected to result in a
significant injury of the user.
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2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
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