ETC H11B815.300W

4-PIN PHOTODARLINGTON
OPTOCOUPLER
H11B815
PACKAGE
SCHEMATIC
ANODE 1
4 COLLECTOR
4
4
CATHODE 2
1
3 EMITTER
1
4
1
DESCRIPTION
The H11B815 consists of a gallium arsenide infrared emitting diode driving a silicon Darlington phototransistor in a 4-pin dual
in-line package.
FEATURES
•
•
•
•
Compact 4-pin package
Current Transfer Ratio: 600% minimum (at IF = 1 mA)
High isolation voltage between input and output (5300 VRMS)
UL recognized (File # E90700)
APPLICATIONS
•
•
•
•
•
Power Supply Monitors
Relay Contact Monitor
Telephone/Telegraph Line Receiver
Twisted Pair Line Receiver
Digital Logic/Digital Logic
© 2002 Fairchild Semiconductor Corporation
Page 1 of 8
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4-PIN PHOTODARLINGTON
OPTOCOUPLER
H11B815
ABSOLUTE MAXIMUM RATINGS (No derating required up to 85°C)
Parameter
Symbol
Value
Units
Storage Temperature
TSTG
-55 to +150
°C
Operating Temperature
TOPR
-55 to +100
°C
Lead Solder Temperature
TSOL
260 for 10 sec
°C
PD
250
mW
DC/Average Forward Input Current
IF
80
mA
Reverse Input Voltage
VR
6
V
IF(pk)
1
A
140
mW
1.33
mW/°C
TOTAL DEVICE
Total Device Power Dissipation @ TA = 25°C
EMITTER
Forward Current - Peak (1µs pulse, 300pps)
LED Power Dissipation @ TA = 25°C
PD
Derate above 25°C
DETECTOR
Collector-Emitter Voltage
VCEO
35
V
Emitter-Collector Voltage
VECO
6
V
IC
200
mA
200
mW
2.0
mW/°C
Continuous Collector Current
Detector Power Dissipation @ TA = 25°C
PD
Derate above 25°C
ELECTRICAL CHARACTERISTICS (TA = 25°C Unless otherwise specified.)
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameter
Test Conditions
Symbol
Min
Typ**
Max
Unit
EMITTER
Input Forward Voltage
(IF = 20 mA)
VF
1.2
1.50
V
Reverse Leakage Current
(VR = 6.0 V)
IR
0.001
10
µA
DETECTOR
Collector-Emitter Breakdown Voltage
(IC = 1.0 mA, IF = 0)
BVCEO
35
60
V
Emitter-Collector Breakdown Voltage
(IE = 100 µA, IF = 0)
BVECO
6
8
V
(VCE = 10 V, IF = 0)
ICEO
0.005
(VCE = 0 V, f = 1 MHz)
CCE
8
Collector-Emitter Dark Current
Capacitance
© 2002 Fairchild Semiconductor Corporation
Page 2 of 8
1
µA
pF
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4-PIN PHOTODARLINGTON
OPTOCOUPLER
H11B815
TRANSFER CHARACTERISTICS
DC Characteristic
Test Conditions
Current Transfer Ratio, Collector-Emitter
Saturation Voltage
Symbol
Min
(IF = 1 mA, VCE = 2 V)
CTR
600
(IF = 20 mA, IC = 5 mA)
VCE(sat)
Typ**
Max
Units
7,500
%
1.0
V
0.8
Rise Time (non saturated)
(IC = 10 mA, VCE = 2 V, RL = 100V)
tr
300
µs
Fall Time (non saturated)
(IC = 10 mA, VCE = 2 V, RL = 100V)
tf
250
µs
ISOLATION CHARACTERISTICS
Characteristic
Input-Output Isolation Voltage
Isolation Resistance
Isolation Capacitance
Test Conditions
Symbol
Min
Typ**
(II-O [ 1 µA, 1 min.)
VISO
5300
Vac(rms)
(VI-O = 500 VDC)
RISO
1011
Ω
(VI-O = &, f = 1 MHz)
CISO
0.5
Max
Units
pf
** All typicals at TA = 25°C
© 2002 Fairchild Semiconductor Corporation
Page 3 of 8
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4-PIN PHOTODARLINGTON
OPTOCOUPLER
H11B815
Typical Performance Curves
Fig. 2 Normalized Current Transfer Ratio
vs. Ambient Temperature
1.4
1.2
NORMALIZED CURRENT TRANSFER RATIO - CTR
NORMALIZED CURRENT TRANSFER RATIO - CTR
Fig. 1 Normalized Current Transfer Ratio
vs. Forward Current
VCE = 2 V
NORMALIZED TO IF = 1 mA
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.1
1
1.0
0.8
0.6
0.4
0.2
IF = 1 mA, VCE = 2 V
NORMALIZED TO TA = 25˚C
0.0
-55
10
-25
IF - FORWARD CURRENT (mA)
Fig. 3 Normalized Collector Current
vs. Collector Emitter Voltage
50
75
100
100000
ICEO - COLLECTOR-EMITTER DARK CURRENT (nA)
10 mA
IC - NORMALIZED COLLECTOR CURRENT
25
Fig. 4 Collector-Emitter Dark Current
vs. Ambient Temperature
4.0
3.5
3.0
5 mA
2.5
2.0
2 mA
1.5
1 mA
1.0
0.5
IF = 0.5 mA
NORMALIZED TO IF =1 mA, VCE = 2 V
0.0
0
0
TA - AMBIENT TEMPERATURE (˚C)
1
2
3
4
5
VCE = 10 V
10000
1000
100
10
1
0.1
0
VCE - COLLECTOR-EMITTER VOLTAGE (V)
20
40
60
80
100
TA - AMBIENT TEMPERATURE (˚C)
Fig. 5 LED Forward Voltage vs. Forward Current
1.8
VF - FORWARD VOLTAGE (V)
1.7
1.6
1.5
1.4
TA = 55˚C
1.3
TA = 25˚C
1.2
TA = 100˚C
1.1
1.0
1
10
100
IF - LED FORWARD CURRENT (mA)
© 2002 Fairchild Semiconductor Corporation
Page 4 of 8
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4-PIN PHOTODARLINGTON
OPTOCOUPLER
H11B815
Recommended Thermal Reflow Profile for Surface Mount DIP Package
Temperature (°C)
225°C
250
220°C: 10 sec to 40 sec
200
150
Time > 183°C: 120 sec to 180 sec
100
50
0
0
© 2002 Fairchild Semiconductor Corporation
1
2
3
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4
5
Time (Min)
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4-PIN PHOTODARLINGTON
OPTOCOUPLER
H11B815
Package Dimensions (Through Hole)
Package Dimensions (Surface Mount)
0.270 (6.86)
0.250 (6.35)
0.270 (6.86)
0.250 (6.35)
0.270 (6.86)
0.250 (6.35)
0.190 (4.83)
0.175 (4.45)
SEATING PLANE
SEATING PLANE
0.190 (4.83)
0.175 (4.45)
0.200 (5.08)
0.115 (2.92)
0.200 (5.08)
0.115 (2.92)
0.154 (3.90)
0.120 (3.05)
0.154 (3.90)
0.120 (3.05)
0.004 (0.10)
MIN
0.020 (0.51)
MIN
15°
0.100 (2.54)
TYP
0.270 (6.86)
0.250 (6.35)
0.016 (0.40)
0.008 (0.20)
0.100 (2.54)
TYP
0.300 (7.62)
typ
Package Dimensions (0.4” Lead Spacing)
0.016 (0.40)
0.008 (0.20)
0.400 (10.16)
TYP
0 to 15°
4-Pin Dip
0.070 (1.78)
0.270 (6.86)
0.250 (6.35)
0.060 (1.52)
SEATING PLANE
0.100 (2.54)
0.300 (7.62)
TYP
0.190 (4.83)
0.175 (4.45)
0.295 (7.49)
0.415 (10.54)
0.200 (5.08)
0.115 (2.92)
0.070 (1.78)
0.045 (1.14)
0.020 (0.51)
MIN
0.022 (0.56)
0.016 (0.41)
0.315 (8.00)
MIN
0.405 (10.30)
MAX
0.030 (0.76)
0.016 (0.40)
0.008 (0.20)
0.100 (2.54)
TYP
Lead Coplanarity 0.004 (0.10) MAX
NOTE
All dimensions are in inches (millimeters)
© 2002 Fairchild Semiconductor Corporation
Page 6 of 8
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4-PIN PHOTODARLINGTON
OPTOCOUPLER
H11B815
ORDERING INFORMATION
Option
Order Entry Identifier
Description
S
.S
Surface Mount Lead Bend
SD
.SD
Surface Mount; Tape and reel
W
.W
0.4" Lead Spacing
300
.300
VDE 0884
300W
.300W
VDE 0884, 0.4" Lead Spacing
3S
.3S
VDE 0884, Surface Mount
3SD
.3SD
VDE 0884, Surface Mount, Tape & Reel
Carrier Tape Specifications (“D” Taping Orientation)
12.0 ± 0.1
5.00 ± 0.20
0.30 ± 0.05
4.0 ± 0.1
4.0 ± 0.1
Ø1.55 ± 0.05
1.75 ± 0.10
7.5 ± 0.1
16.0 ± 0.3
13.2 ± 0.2
4.95 ± 0.20
0.1 MAX
10.30 ± 0.20
Ø1.6 ± 0.1
User Direction of Feed
NOTE
All dimensions are in millimeters
© 2002 Fairchild Semiconductor Corporation
Page 7 of 8
6/14/02
4-PIN PHOTODARLINGTON
OPTOCOUPLER
H11B815
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
© 2002 Fairchild Semiconductor Corporation
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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