April 1995 BS270 N-Channel Enhancement Mode Field Effect Transistor General Description Features These N-Channel enhancement mode field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. These products have been designed to minimize on-state resistance while provide rugged, reliable, and fast switching performance. They can be used in most applications requiring up to 500mA DC. These products are particularly suited for low voltage, low current applications such as small servo motor control, power MOSFET gate drivers, and other switching applications. 400mA, 60V. RDS(ON) = 2Ω @ VGS = 10V. High density cell design for low RDS(ON). Voltage controlled small signal switch. Rugged and reliable. High saturation current capability. ________________________________________________________________________________ D G S Absolute Maximum Ratings Symbol Parameter VDSS T A = 25°C unless otherwise noted BS270 Units Drain-Source Voltage 60 V VDGR Drain-Gate Voltage (RGS < 1MΩ) 60 V VGSS Gate-Source Voltage - Continuous ±20 V - Non Repetitive (tp < 50µs) ID Drain Current - Continuous PD Maximum Power Dissipation - Pulsed Derate Above 25°C ±40 400 mA 2000 625 mW 5 mW/°C TJ,TSTG Operating and Storage Temperature Range -55 to 150 °C TL Maximum Lead Temperature for Soldering Purposes, 1/16" from Case for 10 Seconds 300 °C 200 °C/W THERMAL CHARACTERISTICS RθJA Thermal Resistacne, Junction-to-Ambient © 1997 Fairchild Semiconductor Corporation BS270.SAM Electrical Characteristics (TA = 25°C unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units OFF CHARACTERISTICS BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 10 µA IDSS Zero Gate Voltage Drain Current VDS = 60 V, VGS = 0 V 60 V TJ = 125oC 1 µA 500 µA IGSSF Gate - Body Leakage, Forward VGS = 20 V, VDS = 0 V 10 nA IGSSF Gate - Body Leakage, Reverse VGS = -20 V, VDS = 0 V -10 nA 2.5 V 1.2 2 Ω 2 3.5 VGS = 4.5 V, ID = 75 mA 1.8 3 VGS = 10 V, ID = 500 mA 0.6 1 0.14 0.225 ON CHARACTERISTICS (Note 1) VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 µA RDS(ON) Static Drain-Source On-Resistance VGS = 10 V, ID = 500 mA 1 TJ = 125oC VDS(ON) Drain-Source On-Voltage ID(ON) On-State Drain Current gFS Forward Transconductance VGS = 4.5 V, ID = 75 mA VGS = 10 V, VDS > 2 VDS(on) 2000 2.1 2700 VGS = 4.5 V, VDS > 2 VDS(on) 400 600 VDS > 2 VDS(on), ID = 200 mA 100 320 V mA mS DYNAMIC CHARACTERISTICS Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance VDS = 25 V, VGS = 0 V, f = 1.0 MHz 20 50 pF 11 25 pF 4 5 pF 10 ns 10 ns 400 mA 2000 mA 1.2 V SWITCHING CHARACTERISTICS (Note 1) ton Turn-On Time toff Turn-Off Time VDD = 30 V, ID = 500 m A, VGS = 10 V, RGEN = 25 Ω DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS IS Maximum Continuous Drain-Source Diode Forward Current ISM Maximum Pulsed Drain-Source Diode Forward Current VSD Drain-Source Diode Forward Voltage VGS = 0 V, IS = 400 mA (Note 1) 0.88 Note: 1. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%. BS270.SAM Typical Electrical Characteristics 2 3 9.0 V GS =4.0V 8.0 , DRAIN-SOURCE CURRENT (A) 7.0 RDS(on) , NORMALIZED 1.5 6.0 1 5.0 0.5 I D 4.0 DRAIN-SOURCE ON-RESISTANCE VGS = 10V 3.0 0 0 1 2 3 V DS , DRAIN-SOURCE VOLTAGE (V) 4 5.0 6 .0 2 7.0 8.0 1.5 9.0 10 1 0.5 5 0 0.8 1.2 I D , DRAIN CURRENT (A) 1.6 2 Figure 2. On-Resistance Variation with Gate Voltage and Drain Current. 2 3 1.75 V GS = 10V R DS(on) , NORMALIZED ID = 500mA 1.5 1.25 1 0.75 0.5 -50 -25 0 25 50 75 100 TJ , JUNCTION TEMPERATURE (°C) 125 DRAIN-SOURCE ON-RESISTANCE R DS(ON) , NORMALIZED DRAIN-SOURCE ON-RESISTANCE 0.4 Figure 1. On-Region Characteristics. V G S = 10V 2.5 TJ = 125°C 2 1.5 25°C 1 -55°C 0.5 0 150 0 Figure 3. On-Resistance Variation with Temperature. 0.4 0.8 1.2 I D , DRAIN CURRENT (A) 1.6 2 Figure 4. On-Resistance Variation with Drain Current and Temperature. 1.1 VDS = 10V T J = -55°C 25°C 125°C Vth , NORMALIZED 1.6 1.2 0.8 0.4 0 0 2 V GS 4 6 8 , GATE TO SOURCE VOLTAGE (V) Figure 5. Transfer Characteristics. 10 GATE-SOURCE THRESHOLD VOLTAGE 2 ID , DRAIN CURRENT (A) 4.5 2.5 V DS = VGS I D = 1 mA 1.05 1 0.95 0.9 0.85 0.8 -50 -25 0 25 50 75 100 TJ , JUNCTION TEMPERATURE (°C) 125 150 Figure 6. Gate Threshold Variation with Temperature. BS270.SAM Typical Electrical Characteristics (continued) 2 ID = 10µA 1.05 1.025 1 0.975 0.95 0.925 -50 -25 0 25 50 75 100 TJ , JUNCTION TEMPERATURE (°C) 125 0.5 TJ = 125°C 0.1 25°C 0.05 -55°C 0.01 0.005 0.001 0.2 150 0.4 0.6 V SD 0.8 1 1.2 1.4 , BODY DIODE FORWARD VOLTAGE (V) Figure 8. Body Diode Forward Voltage Variation with Current and Temperature. Figure 7. Breakdown Voltage Variation with Temperature. 10 60 40 V GS , GATE-SOURCE VOLTAGE (V) 20 C oss 10 5 C rss f = 1 MHz V GS = 0V 2 V DS = 25V ID = 5 0 0 m A C iss CAPACITANCE (pF) V GS = 0V 1 1.075 IS , REVERSE DRAIN CURRENT (A) , NORMALIZED DSS BV DRAIN-SOURCE BREAKDOWN VOLTAGE 1.1 1 8 6 4 2 0 1 2 3 V DS 5 10 20 30 50 0 0.4 0.8 , DRAIN TO SOURCE VOLTAGE (V) Figure 9. Capacitance Characteristics. t on t d(on) R GEN t d(off) tf 90% 90% V OUT Output, Vout 10% 10% 90% DUT G Input, Vin S Figure 11. Switching Test Circuit. 2 t off tr RL D VGS 1.6 Figure 10. Gate Charge Characteristics. VDD V IN 1.2 Q g , GATE CHARGE (nC) Inverted 50% 50% 10% Pulse Width Figure 12. Switching Waveforms. BS270.SAM Typical Electrical Characteristics (continued) 3 2 I D , DRAIN CURRENT (A) 1 RD S( ON im )L 10 it 1m 0.5 0u s s 10 ms 10 0m s 1s 0.1 10 s DC 0.05 V GS = 10V SINGLE PULSE T A = 25°C 0.01 0.005 1 2 5 10 20 30 V DS , DRAIN-SOURCE VOLTAGE (V) 60 80 Figure 13. Maximum Safe Operating Area. r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE 1 0.5 D = 0.5 0.1 R θJA (t) = r(t) * R θJA 0.2 0.2 R θJA = (See Datasheet) 0.1 P(pk) 0.05 0.05 t1 0.02 0.02 0.01 0.0001 Single Pulse 0.001 t2 TJ - T A = P * Rθ JA (t) Duty Cycle, D = t1 /t2 0.01 0.01 0.1 t 1, TIME (sec) 1 10 100 300 Figure 14. Transient Thermal Response Curve. BS270.SAM TO-92 Tape and Reel Data and Package Dimensions TO-92 Packaging Configuration: Figure 1.0 TAPE and REEL OPTION FSCINT Label sample FAIRCHILD SEMICONDUCTOR CORPORATION LOT: NSID: D/C1: CBVK741B019 QTY: PN2222N See Fig 2.0 for various Reeling Styles HTB:B 10000 SPEC: D9842 SPEC REV: FSCINT Label B2 QA REV: 5 Reels per Intermediate Box (FSCINT) Customized Label F63TNR Label sample LOT: CBVK741B019 QTY: 2000 FSID: PN222N SPEC: D/C1: D9842 D/C2: QTY1: QTY2: SPEC REV: CPN: F63TNR Label Customized Label QARV: (F63TNR) 375mm x 267mm x 375mm Intermediate Box TO-92 TNR/AMMO PACKING INFORMATION Packing Style Quantity EOL code Reel A 2,000 D26Z B 2,000 D11Z C 2,000 D28Z D 2,000 D10Z E 2,000 D27Z F 2,000 D81Z G 2,000 D29Z H 2,000 D89Z M 2,000 D74Z P 2,000 D75Z Unit weight Reel weight with components Ammo weight with components Max quantity per intermediate box = 0.22 gm = 1.04 kg = 1.02 kg = 10,000 units Ammo AMMO PACK OPTION See Fig 3.0 for 2 Ammo Pack Options FSCINT Label 327mm x 158mm x 135mm Immediate Box Customized Label (TO-92) BULK PACKING INFORMATION EOL CODE DESCRIPTION QUANTITY TO-18 OPTION STD NO LEAD CLIP 2.0 K / BOX J22Z TO-18 OPTION STD 0.120 ” - 0.150 “ 3.5 K / BOX J14Z TO-18 OPTION STD 0.150 “ - 0.180 “ 3.0 K / BOX J35Z TO-18 OPTION REVERSE NO LEAD CLIP 2.0 K / BOX TO-18 OPTION REVERSE 0.120 ” - 0.150 “ 3.5 K / BOX TO-18 OPTION REVERSE 0.150 “ - 0.180 “ 3.0 K / BOX J05Z TO-5 OPTION STD NO LEAD CLIP 1.5 K / BOX J24Z TO-5 OPTION STD 0.120 ” - 0.150 “ 3.5 K / BOX J25Z TO-5 OPTION STD 0.150 “ - 0.180 “ 3.0 K / BOX J60Z TO-5 OPTION REVERSE NO LEAD CLIP 1.5 K / BOX J59Z TO-5 OPTION REVERSE 0.120 ” - 0.150 “ 3.5 K / BOX NO EOL CODE J61Z NO EOL CODE L34Z TO-5 OPTION REVERSE 0.150 “ - 0.180 “ 3.0 K / BOX IN LINE 0.200 SPACING NO LEADCLIP 1.5 K / BOX NO LEADCLIP 2.0 K / BOX NO LEADCLIP 2.0 K / BOX TO-92 STANDARD STRAIGHT STRAIGHT LEAD/NO CLIP/LF ( FOR PKG 97 AND 98 ) NO EOL CODE EMITTER LEAD CUT J21Z CENTER LEAD CUT JO5A JO5B JO5C MICROSOFT LEADFORM REQ'T MICROSOFT LEADFORM REQ'T MICROSOFT LEADFORM REQ'T 0.028 “ MAX LEAD CUT 0.028 “ MAX LEAD CUT Customized Label F63TNR Label 333mm x 231mm x 183mm Intermediate Box BULK OPTION LEADCLIP DIMENSION J18Z NO EOL CODE NO EOL CODE 5 Ammo boxes per Intermediate Box See Bulk Packing Information table FSCINT Label 2000 units per EO70 box for std option Anti-static Bubble Sheets 114mm x 102mm x 51mm Immediate Box 5 EO70 boxes per Intermediate Box Customized Label 530mm x 130mm x 83mm Intermediate box 2.0 K / BOX 2.0 K / BOX NO LEADCLIP 1.5 K/ BOX 0.120 ” - 0.150 “ 1.5 K/ BOX 0.150 “ - 0.180 “ 1.5 K/ BOX FSCINT Label 10,000 units maximum per intermediate box for std option November 1998, Rev. A TO-92 Tape and Reel Data and Package Dimensions, continued TO-92 Reeling Style Configuration: Figure 2.0 Machine Option “A” (H) Machine Option “E” (J) Style “A”, D26Z, D70Z (s/h) Style “E”, D27Z, D71Z (s/h) Style “B”, D11Z Style “F”, D81Z Style “C”, D28Z, D72Z (s/h) Style “G”, D29Z, D73Z (s/h) Style “D”, D10Z Style “H”, D89Z TO-92 Radial Ammo Packaging Configuration: Figure 3.0 FIRST WIRE OFF IS COLLECTOR ADHESIVE TAPE IS ON THE TOP SIDE FLAT OF TRANSISTOR IS ON TOP ORDER STYLE D74Z (M) FIRST WIRE OFF IS EMITTER ADHESIVE TAPE IS ON BOTTOM SIDE FLAT OF TRANSISTOR IS ON BOTTOM FIRST WIRE OFF IS EMITTER ADHESIVE TAPE IS ON THE TOP SIDE FLAT OF TRANSISTOR IS ON BOTTOM ORDER STYLE D75Z (P) FIRST WIRE OFF IS COLLECTOR ADHESIVE TAPE IS ON BOTTOM SIDE FLAT OF TRANSISTOR IS ON TOP November 1998, Rev. A TO-92 Tape and Reel Data and Package Dimensions, continued TO-92 Tape and Reel Taping Dimension Configuration: Figure 4.0 Hd P Pd b Ha W1 d L H1 HO L1 S WO t W2 W t1 P1 F1 DO P2 PO User Direction of Feed TO-92 Reel Configuration: Figure 5.0 ITEM DESCRIPTION SYMBOL DIMENSION Base of Package to Lead Bend b 0.098 (max) Component Height Ha 0.928 (+/- 0.025) Lead Clinch Height HO 0.630 (+/- 0.020) Component Base Height H1 0.748 (+/- 0.020) Component Alignment ( side/side ) Pd 0.040 (max) Component Alignment ( front/back ) Hd 0.031 (max) Component Pitch P 0.500 (+/- 0.020) Feed Hole Pitch PO 0.500 (+/- 0.008) Hole Center to First Lead P1 0.150 (+0.009, -0.010) Hole Center to Component Center P2 0.247 (+/- 0.007) Lead Spread F1/F2 0.104 (+/- 0 .010) Lead Thickness d 0.018 (+0.002, -0.003) Cut Lead Length L 0.429 (max) Taped Lead Length L1 0.209 (+0.051, -0.052) Taped Lead Thickness t 0.032 (+/- 0.006) Carrier Tape Thickness t1 0.021 (+/- 0.006) Carrier Tape Width W 0.708 (+0.020, -0.019) Hold - down Tape Width WO 0.236 (+/- 0.012) Hold - down Tape position W1 0.035 (max) Feed Hole Position W2 0.360 (+/- 0.025) Sprocket Hole Diameter DO 0.157 (+0.008, -0.007) Lead Spring Out S 0.004 (max) Note : All dimensions are in inches. ELECTROSTATIC SENSITIVE DEVICES D4 D1 D2 F63TNR Label ITEM DESCRIPTION SYSMBOL MINIMUM MAXIMUM Reel Diameter D1 13.975 14.025 Arbor Hole Diameter (Standard) D2 1.160 1.200 D2 0.650 0.700 Core Diameter D3 3.100 3.300 Hub Recess Inner Diameter D4 2.700 3.100 Hub Recess Depth W1 0.370 0.570 Flange to Flange Inner Width W2 1.630 Hub to Hub Center Width W3 Customized Label (Small Hole) W1 1.690 2.090 W3 W2 Note: All dimensions are inches D3 November 1998, Rev. A TO-92 Tape and Reel Data and Package Dimensions, continued TO-92; TO-18 Lead Form STD (FS PKG Code 97) 1:1 Scale 1:1 on letter size paper Part Weight per unit (gram): 0.2201 September 1998, Rev. A TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ CoolFET™ CROSSVOLT™ E2CMOSTM FACT™ FACT Quiet Series™ FAST® FASTr™ GTO™ HiSeC™ ISOPLANAR™ MICROWIRE™ POP™ PowerTrench™ QS™ Quiet Series™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 TinyLogic™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. 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