CAT4103 3-Channel Constant-Current RGB LED Driver FEATURES DESCRIPTION 3 independent current sinks rated to 25V LED current to 175mA per channel set by separate external resistors High-speed 25MHz 4-wire serial interface Buffered output drivers to ensure data integrity Cascadable devices Low dropout current source (0.4V at 175mA) 3V to 5.5V logic supply Thermal shutdown protection RoHS-compliant 16-lead SOIC package The CAT4103 is a 3-channel, linear based constantcurrent LED driver designed for RGB LED control, requiring no inductor and provides a low noise operation. LED channel currents up to 175mA are programmed independently via separate external resistors. Low output voltage operation of 0.4V at 175mA allows for more power efficient designs across wider supply voltage range. The three LED pins are compatible with high voltage up to 25V supporting applications with long strings of LEDs. APPLICATIONS Multi-color, intelligent LED, architectural lighting High-visual impact LED signs and displays LCD backlight ORDERING INFORMATION Part Number Package Quantity per Reel Package Marking CAT4103V-GT2 SOIC-16* 2,000 CAT4103V A high-speed 4-wire 25MHz serial interface controls each individual channel using a shift register and latch configuration. Output data pins allow multiple devices to be cascaded and programmed via one serial interface with no need for external drivers or timing considerations. The device also includes a blanking control pin (BIN) that can be used to disable all channels independently of the interface. Thermal shutdown protection is incorporated in the device to disable the LED outputs whenever the die temperature exceeds 150ºC. The device is available in a 16-lead SOIC package. * Lead Finish NiPdAu PIN CONFIGURATION TYPICAL APPLICATION CIRCUIT 16-Lead SOIC (W) Top View VIN 5V to 25V GND 1 16 VDD BIN 2 15 BOUT VDD 3V to 5.5V C1 1µF VDD LIN 3 14 LOUT SIN 4 13 SOUT RED LED1 LIN CONTROLLER CAT4103 CIN 5 12 COUT 6 11 LED1 CIN RSET2 7 10 LED2 GND RSET1 RSET1 8 9 LED3 SIN LOUT SOUT NEXT CAT4103 DEVICE COUT R1 1 BLUE LED3 BOUT BIN RSET3 © 2008 SCILLC. All rights reserved. Characteristics subject to change without notice GREEN LED2 RSET2 R2 RSET3 R3 Doc. No. MD-5038, Rev. A CAT4103 ABSOLUTE MAXIMUM RATINGS Parameter VDD Voltage Input Voltage Range (SIN, BIN, CIN, LIN) Output voltage range (SOUT, BOUT, COUT, LOUT) LED1, LED2, LED3 Voltage DC Output Current on LED1 to LED3 Storage Temperature Range Junction Temperature Range Lead Soldering Temperature (10sec.) ESD Rating: All Pins Human Body Model Machine Model Rating Units 6 -0.3V to VDD+0.3V -0.3V to VDD+0.3V 25 200 -55 to +160 -40 to +150 300 V V V V mA °C °C °C 2000 200 V Range Units 3.0 to 5.5 up to 25 up to 6* 2 to 175 -40 to +85 V V V mA °C RECOMMENDED OPERATING CONDITIONS Parameter VDD Voltage applied to LED1 to LED3, outputs off Voltage applied to LED1 to LED3, outputs on Output Current on LED1 to LED3 Ambient Temperature Range * Keeping the LEDx pin voltage below 6V in operation is recommended to minimize thermal dissipation in the package. ELECTRICAL OPERATING CHARACTERISTICS DC CHARACTERISTICS Min and Max values are over recommended operating conditions unless specified otherwise. Typical values are at VIN = 5.0V, TAMB = 25°C Symbol Name IDD1 IDD2 IDD3 IDD4 ILKG RLIN RBIN Supply Current Outputs Off Supply Current Outputs Off Supply Current Outputs On Supply Current Outputs On LED Output Leakage LIN Pull-down Resistance BIN Pull-up Resistance VIH VIL Logic high input voltage Logic low input voltage IIL VOH VOL VRSET TSD THYS VLED = 5V, RSET = 24.9kΩ VLED = 5V, RSET = 5.23kΩ VLED = 0.5V, RSET = 24.9kΩ VLED = 0.5V, RSET = 5.23kΩ VLED = 5V, Outputs Off RSETx Regulated Voltage Thermal Shutdown Thermal Hysteresis -1 140 140 Typ Max Units 2 4 2 4 5 10 5 10 1 250 250 mA mA mA mA µA kΩ kΩ 0.7x VDD V 5 µA 180 180 -5 100mA LED Current 0 VCC-0.3V 0.3 1.17 Undervoltage Lockout (UVLO) Threshold Doc. No. MD-5038, Rev. A Min 0.3x VDD Logic Input Leakage Current VI = VDD or GND (CIN, SIN) xOUT Logic High Output Voltage IOH = -1mA xOUT Logic Low Output Voltage IOL = 1mA ILED/IRSET RSET to LED Current Gain ratio VUVLO Conditions 1.2 150 20 V °C °C 400 1.8 2 1.23 V V © 2008 SCILLC. All rights reserved. Characteristics subject to change without notice CAT4103 TIMING CHARACTERISTICS Min and Max values are over recommended operating conditions unless specified otherwise. Typical values are at VIN = 5.0V, TAMB = 25°C Symbol Name Conditions Min Typ Max Units 25 MHz CIN fcin CIN Clock Frequency tcwh CIN Pulse Width High 18 ns tcwl CIN Pulse Width Low 18 ns tssu Setup time SIN to CIN 4 ns tsh Hold time SIN to CIN 4 ns Tlwh LIN Pulse width 20 ns tlchd Hold time LIN to CIN 4 ns tlcsu Setup time LIN to CIN 8 ns SIN LIN LEDn tledplon Turn on Propagation delay LIN LIN to LED(n) on 380 ns tledploff Turn off Propagation delay LIN LIN to LED(n) off 130 ns tledpbon Turn on Propagation delay BIN BIN to LED(n) on 380 ns tledpboff Turn off Propagation delay BIN BIN to LED(n) off 130 ns tledr LED rise time (10% to 90%) Pullup resistor = 50Ω to 3.0V 160 ns tledf LED fall time (90% to 10%) Pullup resistor = 50Ω to 3.0V 140 ns SOUT tsr SOUT rise time (10% to 90%) CL = 15pF 5 ns tsf SOUT fall time (90% to 10%) CL = 15pF 5 ns tsdf Propagation delay time SOUT CIN falling to SOUT falling 6 18 ns tsdr Propagation delay time SOUT CIN falling to SOUT rising 6 18 ns tcr COUT rise time (10% to 90%) CL = 15pF 5 ns tcf COUT fall time (90% to 10%) CL = 15pF 5 ns tcdf Propagation delay time COUT CIN falling to COUT falling 4 10 ns tcdr Propagation delay time COUT CIN rising to COUT rising 4 10 ns tlr LOUT rise time (10% to 90%) CL = 15pF 5 ns tlf LOUT fall time (90% to 10%) CL = 15pF 5 ns tldf Propagation delay time LOUT LIN falling to LOUT falling 4 10 ns tldr Propagation delay time LOUT LIN rising to LOUT rising 5 10 ns tbr BOUT rise time (10% to 90%) CL = 15pF 5 ns tbf BOUT fall time (90% to 10%) CL = 15pF 5 ns tbdf Propagation delay time BOUT BIN falling to BOUT falling 6 20 ns tbdr Propagation delay time BOUT BIN rising to BOUT rising 8 20 ns COUT LOUT BOUT © 2008 SCILLC. All rights reserved. Characteristics subject to change without notice 3 Doc. No. MD-5038, Rev. A CAT4103 1/fcin CIN tssu tsh tcwl tcwh SIN tsdf tlchd tlcsu tsdr SOUT tlwd LIN Figure 2. Timing Diagram A tledploff tledplon LIN tledpboff BIN tledpbon LED(n) Figure 3. Timing Diagram B Doc. No. MD-5038, Rev. A 4 © 2008 SCILLC. All rights reserved. Characteristics subject to change without notice CAT4103 TYPICAL PERFORMANCE CHARACTERISTICS VIN = 5V, VDD = 5V, C1 = 1μF, TAMB = 25°C unless otherwise specified. Quiescent Current vs. Input Voltage (ILED = 0mA) Quiescent Current vs. RSET Current 8.0 QUIESCENT CURRENT [mA] QUIESCENT CURRENT [mA] 1.2 No Load 1.0 0.8 0.6 0.4 3.5 4.0 4.5 5.0 INPUT VOLTAGE [V] 2.0 5.5 0 Quiescent Current vs. Input Voltage (ILED = 175mA) 100 200 300 RSET CURRENT [μA] 400 LED Current vs. LED Pin Voltage 6.0 200 Full Load LED CURRENT [mA] QUIESCENT CURRENT [mA] 4.0 0.0 3.0 5.5 5.0 4.5 4.0 160 120 80 40 0 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE [V] 5.5 0.0 0.2 0.4 0.6 0.8 LED PIN VOLTAGE [V] 1.0 LED Current Change vs. Temperature LED Current Change vs. Input Voltage 200 200 160 160 LED CURRENT [mA] LED CURRENT [mA] 6.0 120 80 40 0 120 80 40 0 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE [V] © 2008 SCILLC. All rights reserved. Characteristics subject to change without notice 5.5 -40 5 0 40 80 TEMPERATURE [ºC] 120 Doc. No. MD-5038, Rev. A CAT4103 TYPICAL PERFORMANCE CHARACTERISTICS VIN = 5V, VDD = 5V, C1 = 1μF, TAMB = 25°C unless otherwise specified. RSET Pin Voltage vs. Input Voltage RSET Pin Voltage vs. Temperature 1.30 RSET VOLTAGE [V] RSET VOLTAGE [V] 1.30 1.25 1.20 1.15 1.25 1.20 1.15 1.10 1.10 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE [V] -40 5.5 0 40 80 TEMPERATURE [ºC] 120 BIN Transient Response LED Current vs. RSET Resistor LED CURRENT [mA] 200 160 120 80 40 0 0 Doc. No. MD-5038, Rev. A 15 30 RSET [kΩ] 45 60 6 © 2008 SCILLC. All rights reserved. Characteristics subject to change without notice CAT4103 PIN DESCRIPTIONS Name Pin Number Function GND 1 Ground Reference BIN 2 Blank input pin LIN 3 Latch Data input pin SIN 4 Serial Data input pin CIN 5 Serial Clock input pin RSET3 6 LED current set pin for LED3 RSET2 7 LED current set pin for LED2 RSET1 8 LED current set pin for LED1 LED3 9 LED channel 3 cathode terminal LED2 10 LED channel 2 cathode terminal LED1 11 LED channel 1 cathode terminal COUT 12 Serial Clock output pin SOUT 13 Serial Data output pin LOUT 14 Latch Data output pin BOUT 15 Blank output pin VDD 16 Device Supply pin PIN FUNCTION GND is the ground reference pin for the entire device. This pin must be connected to the ground plane on the PCB. LED1 to LED3 are the LED current sink inputs. These pins are connected to the bottom cathodes of the LED strings. The current sinks bias the LEDs with a current equal to 400 times the RSET pin current. For the LED sink to operate correctly, the voltage on the LED pin must be above 0.4V. Each LED channel can withstand and operate with voltages up to 25V. BIN is the blank input used to disable all channels. When low, all LED channels are enabled according to the output latch content. When high, all LED channels are turned off. This pin can be used to turn all the LEDs off while preserving the data in the output latches. COUT is a driven output of CIN and can be connected to the next device in the cascade. LIN is the latch data input. On the rising edge of LIN, data is loaded from the 3-bit serial shift register into the output register latch. On the falling edge of LIN the data is latched in the output register and isolated from the state of the serial shift register. SOUT is the output of the 3-bit serial shift register. Connect to SIN of the next device in the cascade. SOUT is clocked on the falling edge of CIN. LOUT is a driven output of LIN and can be connected to the next chip in the cascade. SIN is the serial data input. Data is loaded into the internal register on each rising edge of CIN. BOUT is a driven output of BIN and can be connected to the next chip in the cascade. CIN is the serial clock input. On each rising CIN edge, data is transferred from SIN to the internal 3-bit serial shift register. VDD is the positive supply pin voltage for the entire device. A small 1µF ceramic capacitor is recommended close to the pin. RSET1 to RSET3 are the LED current set inputs. The current pulled out of these pins will be mirrored in the corresponding LED channel with a gain of 400. © 2008 SCILLC. All rights reserved. Characteristics subject to change without notice 7 Doc. No. MD-5038, Rev. A CAT4103 BLOCK DIAGRAM LED1 LED2 LED3 Upon power-up, an under-voltage lockout circuit clears all latches and shift registers and sets all outputs to off. Once the VDD supply voltage is greater than the under-voltage lockout threshold, the device can be programmed. 1.2V Ref RSET1 Current Setting RSET2 + VDD Current Setting CURRENT SINKS Current Setting BIN Pull-up and pull-down resistors are internally provided to set the state of the BIN and LIN pins to low current off state when not externally driven. RSET3 BOUT A high-speed 4-wire interface is provided to program the state of each LED channel ON or OFF. BLANK LATCH LIN L0 L1 L2 The 4-wire interface contains a 3-bit serial-to-parallel shift register (S0-S2) and a 3-bit latch (L0-L2). The shift register operates on a first-in first-out (FIFO) basis. The most significant bit S2 corresponds to the first data entered in from SIN. Programming the serial-to-parallel register is accomplished via SIN and CIN input pins. On each rising edge of the CIN signal the data from SIN is moved through the shift register serially. Data is also moved out of SOUT to the next device if programming more than one device on the same interface. LOUT SIN CIN SHIFT REGISTER S0 S1 S2 D Q SOUT CK CLOCK COUT GND Figure 1. CAT4103 Functional Block Diagram BASIC OPERATION On the rising edge of LIN, the data content of the serial to parallel shift register is reflected in the latches. On the falling edge of LIN, the state of the serial-to-parallel register at that particular time is saved in the latches and does not change regardless of the content of the serial to parallel register. The CAT4103 uses 3 independent current sinks to accurately regulate the current in each LED channel to 400 times the current sink from the corresponding RSET pin. Each of the resistors tied to the RSET1, RSET2, RSET3 pins set the current respectively in the LED1, LED2, and LED3 channels. Table 1 shows some standard resistor values for RSET and the corresponding LED current. BIN is used to disable all LEDs off at one time while still maintaining the data contents of the latch register. BIN is an active low input pin. When low the outputs reflect the data in the latches. When high the outputs are all high impedance (LEDs off). Table 1. RSET Resistor Settings LED Current [mA] RSET[kΩ] 20 24.9 60 8.45 100 5.23 175 3.01 All 4-wire inputs have a corresponding output driver for cascaded systems (SOUT, COUT, LOUT, BOUT). These output buffers allow many CAT4103 drivers to be cascaded without signal and timing degradation due to long wire interconnections. Tight current regulation for all channels is possible over a wide range of input and LED voltages due to independent current sensing circuitry on each channel. The LED channels have a low dropout of 0.4V or less for all current ranges and supply voltages. This helps improve heat dissipation and efficiency over other competing solutions. Doc. No. MD-5038, Rev. A 8 © 2008 SCILLC. All rights reserved. Characteristics subject to change without notice CAT4103 APPLICATION INFORMATION CASCADING MULTIPLE DEVICES The CAT4103 is designed to be cascaded for driving multiple RGD LEDs. Figure 5 shows three CAT4103 drivers cascaded together. The programming data from the controller travels serially through each device. Figure 4 shows a programming example turning on the following LED channels: BLUE3, GREEN2 and RED1. The programming waveforms are measured from the controller to the inputs of the first CAT4103. Figure 4. Programming Example 5V C1 1µF RED1 CONTROLLER VDD LED1 GREEN1 LED2 BIN LIN SIN CAT4103 #1 CIN GND RSET1 R1 RSET2 R2 BLUE1 LED3 C2 1µF VDD LED1 BOUT BIN LOUT LIN SOUT SIN COUT CIN RSET3 R3 RED2 GREEN2 LED2 CAT4103 #2 GND RSET1 R4 RSET2 R5 BLUE2 LED3 C3 1µF VDD LED1 BOUT BIN LOUT LIN SOUT SIN COUT CIN RSET3 R6 RED3 GREEN3 LED2 BLUE3 LED3 BOUT CAT4103 #3 LOUT SOUT COUT GND RSET1 R7 RSET2 R8 RSET3 R9 Figure 5. Three Cascaded CAT4103 Devices © 2008 SCILLC. All rights reserved. Characteristics subject to change without notice 9 Doc. No. MD-5038, Rev. A CAT4103 POWER DISSIPATION RECOMMENDED LAYOUT The power dissipation (PD) of the CAT4103 can be calculated as follows: Bypass capacitor C1 should be placed as close to the IC as possible. RSET resistors should be directly connected to the GND pin of the device. For better thermal dissipation, multiple via can be used to connect the GND pad to a large ground plane. It is also recommended to use large pads and traces on the PCB wherever possible to spread out the heat. The LEDs for this layout are driven from a separate supply (VLED+), but they can also be driven from the same supply connected to VDD. PD = (VDD × IDD ) + Σ(VLEDN × ILEDN ) where VLEDN is the voltage at the LED pin, and ILEDN is the associated LED current. Combinations of high VLED voltage or high ambient temperature can cause the CAT4103 to enter thermal shutdown. In applications where VLEDN is high, a resistor can be inserted in series with the LED string to lower PD. Thermal dissipation of the junction heat consists primarily of two paths in series. The first path is the junction to the case (θJC) thermal resistance which is defined by the package style, and the second path is the case to ambient (θCA) thermal resistance, which is dependent on board layout. The overall junction to ambient (θJA) thermal resistance is equal to: θJA = θJC + θCA For a given package style and board layout, the operating junction temperature TJ is a function of the power dissipation PD, and the ambient temperature, resulting in the following equation: TJ = TAMB + PD (θJC + θCA) = TAMB + PD θJA When mounted on a double-sided printed circuit board with two square inches of copper allocated for “heat spreading”, the resulting θJA is about 74°C/W. Figure 6. Recommended Layout For example, at 60°C ambient temperature, the maximum power dissipation is calculated as follow: PDmax = (TJmax - TAMB ) (150 - 60) = = 1.2W θJA 74 Doc. No. MD-5038, Rev. A 10 © 2008 SCILLC. All rights reserved. Characteristics subject to change without notice CAT4103 PACKAGE OUTLINE DRAWING SOIC 16-LEAD 150MILS (V) (1)(2) 0 E1 SYMBOL MIN A 1.35 1.75 A1 0.10 0.25 E MAX b 0.33 0.51 c 0.19 0.25 D 9.80 9.90 10.00 E 5.80 6.00 6.20 E1 3.80 3.90 4.00 e PIN#1 IDENTIFICATION NOM 1.27 BSC h 0.25 0.50 L 0.40 1.27 θ 0º 8º TOP VIEW D h θ A e b A1 SIDE VIEW c L END VIEW For current Tape and Reel information, download the PDF file from: http://www.catsemi.com/documents/tapeandreel.pdf. Notes: (1) All dimensions in millimeters. Angle in degrees. (2) Compiles with JEDEC standard-012. © 2008 SCILLC. All rights reserved. Characteristics subject to change without notice 11 Doc. No. MD-5038, Rev. A CAT4103 EXAMPLE OF ORDERING INFORMATION (1) 1F1F1F Prefix CAT Device # Suffix 4103 V – G Package V: SOIC Company ID T2 Tape & Reel T: Tape & Reel 2: 2,000/Reel Product Number 4103 Lead Finish G: NiPdAu Blank: Matte-Tin Notes: (1) All packages are RoHS-compliant (Lead-free, Halogen-free). (2) The standard plated finish is NiPdAu. (3) The device used in the above example is a CAT4103V-GT2 (SOIC, NiPdAu, Tape & Reel, 2,000/Reel). (4) For additional temperature options, please contact your nearest ON Semiconductor Sales office. Doc. No. MD-5038, Rev. A 12 © 2008 SCILLC. All rights reserved. Characteristics subject to change without notice CAT4103 REVISION HISTORY Date Revision Description 31-Oct-08 A Initial Issue ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: [email protected] © 2008 SCILLC. All rights reserved. Characteristics subject to change without notice N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center: Phone: 81-3-5773-3850 13 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative Doc. No. MD-5038, Rev. A