FREESCALE MC33199D

Freescale Semiconductor
Technical Data
Document Number: MC33199
Rev. 4.0, 10/2006
Automotive ISO 9141 Serial Link
Driver
33199
The MC33199 is a serial interface circuit used in diagnostic
applications. It is the interface between the microcontroller and the
special K and L lines of the ISO diagnostic port. The MC33199 has
been designed to meet the «Diagnosis System ISO9141»
specification.
The device has a bi-directional bus K line driver, fully protected
against short circuits and over temperature. It also includes the L line
receiver, used during the wake up sequence in the ISO transmission.
The MC33199 has a unique feature which allow transmission Baud
rate up to 200kBaud.
LIN, ISO-9141 J-1850 PHYSICAL
INTERFACES
D SUFFIX
EF SUFFIX (PB-FREE)
PLASTIC PACKAGE
98ASB42565B
14 PIN SOIC
Features
• Electrically Compatible with Specification “Diagnosis System
ISO9141”
• Transmission speed up to 200kBaud
• Internal Voltage Reference Generator for Line Comparator
Thresholds
• TXD, RXD and LO pins are 5V CMOS Compatible
• High Current Capability of DIA pin (K line)
• Short Circuit Protection for the K Line Input
• Over Temperature Shutdown with Hysteresis
• Large Operating Range of Driver Supply Voltage
• Large Operating Temperature Range
• ESD Protected pins
• Pb-Free Packaging Designated by Suffix Code EF
ORDERING INFORMATION
Device
MC33199D
Temperature
Range (TA)
Package
-40°C to 125°C
14 SOIC
MCZ33199EF/R2
VBAT
VDD
33199
VDD
VCC
VS
LO
L
SCIRXD
RXD
I1
SCITXD
TXD
DIA
MCU
I/O
GND
Figure 1. Simplified Application Diagram
Freescale Semiconductor, Inc. reserves the right to change the detail specifications, as
may be required, to permit improvements in the design of its products.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
ISO L-LINE
(BUS)
ISO K-LINE
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VCC
33199
VS
Reference
Generator
REF-OUT
LO
Protection
L
+
–
C2
I1
Source
REF-IN-L
REF-IN-K
RXD
I1
VCC
–
+
C1
DIA
Thermal
Shutdown
TXD
Driver
GND
Current
Limit
Figure 2. 33199 Simplified Internal Block Diagram
33199
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN CONNECTIONS
PIN CONNECTIONS
33199
VCC
1
14
REF-OUT
REF-IN-L
2
13
VS
REF-IN-K
3
12
L
LO
4
11
I1
RXD
5
10
GND
TXD
6
9
DIA
NC
7
8
NC
Figure 3. 33199 Pin Connections
Table 1. Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section, beginning on page 12.
Pin Number
Pin Name
Definition
1
VCC
2
REF-IN-L
Input reference for C2 comparator.
3
REF-IN-K
Input reference for C1 comparator.
4
LO
5
RXD
Open drain output of the data on BUS. A recessive bus = a logic [1], a dominant bus = logic [0]. An
external pullup is required.
6
TXD
Data input here will appear on the BUS pin. A logic [0] will assert the bus, a logic [1] will make the bus
go to the recessive state.
7, 8
NC
No internal connection to these pins.
9
DIA
Provides a battery-level logic signal.
10
GND
Electrical Common Ground and Heat removal. A good thermal path will also reduce the die
temperature.
11
I1
Power input. An external diode is needed for reverse battery protection.
12
L
The external bus load resistor connects here to prevent bus pullup in the event of loss of module
ground.
13
VS
14
REF-OUT
5V typical power supply pin. typical supply current is less than 1.5mA
This pin control Sleep Mode, Transmit Level, and Speed. It has a weak pulldown.
This pin connects to the bus through external components.
Internal reference voltage generator output pin.
33199
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
DC Voltage Range
VS
0.5 to + 40
Transient Pulse (2)
VPULSE
2 to + 40
VCC
0.3 to + 6.0
V
- 0.5 TO + 38
V
ELECTRICAL RATINGS (1)
VS Supply Pin
V
VCC Supply DC Voltage Range
DIA and L Pins
(2)
DC Voltage Range
Transient Pulse (clamped by internal diode)
DC Source Current
DIA Low Level Sink Current
TXD DC Voltage Range
-2
V
- 50
mA
INT. LIMIT
mA
-0.3 TO VCC +0.3
V
REF-IN DC Voltage Range
V
VS < VCC
-0.3 TO VCC
VS > VCC
-0.3 TO VS
ESD Voltage Capability
VESD
+/-2000
V
TSTG
55 to + 150
°C
TJ
40 to + 150
°C
RTJA
180
C/W
PD
250
mW
TPPRT
Note 4.
°C
THERMAL RATINGS
Storage Temperature
Operating Junction Temperature
Thermal Resistance, Junction to air
Max Power Dissipation (@ TA=105 °C)
Peak Package Reflow Temperature During Reflow
(3), (4)
Notes
1. The device is compatible with Specification: “Diagnosis System ISO9141”
2. See the test Circuit (Figure 26). Transient test pulse according to ISO76371 and DIN 40839, highest test levels
3. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
4. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
33199
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics
Characteristics noted under conditions VCC from 4.5V to 5.5V, VS from 4.5V to 20V unless otherwise note. Typical values
reflect approximate mean at 25°C, nominal VCC and VS, at time of device characterization. Typical values noted reflect the
approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
VCC
4.5
ICC
0.5
Typ
Max
Unit
5.5
V
1.5
V
VCC PIN 1
VCC Supply Voltage Range
VCC Supply Current
(6)
1.0
REF-IN-L PIN 2 AND REF-IN-K PIN 3
REF-IN-L & REF-IN-K Input Voltage Range:
VINREF
V
for 0 <VS< VCC
2.0
VCC -2.0
for VCC <VS< 40V
2.0
VS -1.0
-5.0
5.0
REF-IN-L & REF-IN-K Inputs Currents
IVIN
µΑ
LO PIN 4
LO open Collector Output
VOL
V
Low Level Voltage @ IOUT = 1mA
0.34
Low Level Voltage @ IOUT = 4mA
0.7
0.8
RXD PIN 5
Pull up resistor to VCC
Low Level Voltage @ IOUT=1mA
RRXD
1.5
VOL
2.0
2.5
kΩ
0.3
0.7
V
TXD PIN 6
High Level Input Voltage
VIH
Low Level Input Voltage
VIL
0.7VCC
2.8
2.0
V
0.3VCC
V
µΑ
Input Current @ 0<VS<40V
TXD at High Level
IH
-200
30
TXD at Low Level
II
-600
-100
Low Level Output Voltage @ I = 30mA
VOL
0.0
Drive Current Limit
ILIM
40
High Level Input Threshold Voltage
VIH
VREF MIN
0.25V
VREF MIN
VREF
VREF MAX
-0.2V
-0.125V
-0.05V
DIA INPUT / OUTPUT PIN 9
(REF-IN-K connected to REF-OUT)
Low Level Input Threshold Voltage
VIL
(REF-IN-K connected to REF-OUT)
0.35
0.8
V
120
mA
VREF
VREF MAX
V
0.325V
0.4V
V
Input Hysteresis
VHYST
300
450
600
mV
Leakage Current
ILEAK
4.0
10
16
µΑ
Over temperature Shutdown
TLIM
155
°C
Notes
5. Measured with TXD=Vcc, I1=Vs, DIA & L high, no load, REF-IN-L and REF-IN-K connected to REF-OUT
33199
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics (continued)
Characteristics noted under conditions VCC from 4.5V to 5.5V, VS from 4.5V to 20V unless otherwise note. Typical values
reflect approximate mean at 25°C, nominal VCC and VS, at time of device characterization. Typical values noted reflect the
approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
VIH
VREF MIN
VREF
VREF MAX
V
0.25V
0.325V
0.4V
VREF MIN
VREF
VREF MAX
-0.2V
-0.125V
-0.05V
L INPUT PIN 12
High Level Input Threshold Voltage
(REF-IN-L connected to REF-OUT)
Low Level Input Threshold Voltage
VIL
(REF-IN-L connected to REF-OUT)
V
Input Hysteresis
VHYST
300
450
600
mV
Leakage Current
ILEAK
4.0
10
16
µΑ
I1S
-4.0
-3.0
-2.0
mA
VI1SAT
VS - 1.2
VS - 0.8
VS
V
I1D
-120
-80
-40
mA
VI1DSAT
VS - 2.7
VS - 0.85
VS
V
VS Supply Voltage Range
VS
4.5
20
V
VS Supply Current
IS
0.5
2.0
mA
L1 INPUT PIN 11
Static Source Current
Static Saturation Voltage @ I1S=-2mA
Dynamic Source Current
Dynamic Saturation Voltage @ I1S=-40mA
VS PIN 13
1.3
REF-OUT PIN 14
Output Voltage :
VREF
V
@ 3 < VS < 5.6V & IRO = +-10µΑ
2.7
3.3
@ 5.6 < VS < 18V & IRO = +-10µΑ
0.5 x VS
0.56 x VS
@ 18 < VS < 40V & IRO = +-10µΑ
8.5
10.8
50
µΑ
12
kΩ
Maximum output current
IOUT
-50
Pull-up resistor to VCC
RPU
3.0
6.
8.0
Measured with TXD=VCC, I1=VS, DIA & L high, no load, REF-IN-L and REF-IN-K connected to REF-OUT
33199
6
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. Dynamic Electrical Characteristics
Characteristics noted under conditions Vcc from 4.5V to 5.5V, Vs from 4.5V to 20V unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
Transmission Speed
1/T BIT
0.0
High or Low Bit Time
T BIT
5.0
Typ
Max
Unit
200k
Baud
DELAY TIMING
µs
Rxd Output :
ns
Low to High Transition Delay Time
tRDR
450
High to Low Transition Delay Time
tDRF
450
µs
LO Output :
Low to High Transition Delay Time
tLDR
2.0
High to Low Transition Delay Time
tLDF
2.0
Low to High Transition Delay Time
tDDR
650
High to Low Transition Delay Time
tDDF
650
DIA Output :
ns
µs
I1 Output @ VS-I1 > 2.7V :
Rise time
tI1R
Hold Time
tI1F
0.3
1.5
4.5
33199
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TIMING DIAGRAMS
+5V
+12V
5V
TXD Input
Signal
tBIT
VCC VBAT
I1
REF-OUT
0V
tDDR
REF-IN-K
Input
Signal
TxD
tDDF
Test
Point
REF-IN-L
10V
DIA
1nF
DIA Output
Signal
GND
2V
Figure 4. TXD to DIA AC Characteristic
+5V
+12V
12V
DIA and L
Input Signal
tBIT
VCC VBAT
REF-OUT
2K
REF-IN-L
L
REF-IN-K
TXD
Test
Points
0V
Input
Signal
RXD ot LO
Output
Signal
DIA
LO
RXD
tRDF / tLDF
tRDR / tLDR
GND
4.5V
0.4V
2x30pF
Figure 5. DIA to TxD and L to LO AC Characteristics
.
tBIT
5V
TXD Signal
0V
tI1F
tI1H
120mA
Typical I1
Waveform
Current Source I1
Maximum Limit
40mA
4mA
2mA
tI1R
Current Source I1
Minimum Limit
Figure 6. Current Source I1 AC Characteristics
At static HIGH or LOW level TXD, the current source I1 delivers a current of 3mA (typ). Only during LOW to HIGH transition,
does this current increase to a higher value in order to charge the K Line capacitor (Cl<4nF) in a short time.
33199
8
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
ELECTRICAL PERFORMANCE CURVES
+5V
+12V
I1 pulse
current
VCC VBAT
I1
REF-OUT
Input
Signal
REF-IN-L
REF-IN-K DIA
TXD
33nF
LO
10Ω
RXD
GND
DIA discharge
current
To Oscilloscope
Figure 7. Current Source I1 and DIA Discharge current test schematic
ELECTRICAL PERFORMANCE CURVES
Figure 10. IS Supply Voltage versus VS Supply Voltage
Figure 8. ICC Supply Current versus Temperature
-40°C
25°C
125°C
Figure 9. VS Supply Current versus VS Supply Voltage
Figure 11. VS Voltage versus IS Current
(VCC=5.5V, VDIA, L, I1=20V
33199
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
ELECTRICAL CHARACTERISTICS
ELECTRICAL PERFORMANCE CURVES
Figure 12. REF-OUT Voltage versus VS Supply Voltage
Figure 15. L and DIA Current versus L and DIA Voltage
I DIA = 40mA
Figure 13. REF-OUT Voltage versus REF-OUT Current
Figure 16. DIA Saturation Voltage versus Temperature
Figure 14. L and DIA Hysteresis versus Temperature
Figure 17. DIA Current Limit versus Temperature
33199
10
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
ELECTRICAL PERFORMANCE CURVES
Figure 18. RXD Pull-up Resistor versus Temperature
Figure 21. I1 Output DC Current versus Temperature
LO
RXD
Figure 19. TXD and LO Saturation Voltage versus
Temperature
Figure 22. I1 Output Pulse Current versus VS Supply
Voltage
I=40mA
I=2mA
Figure 20. I1 Saturation Voltage versus Temperature
Figure 23. I1 Pulse Current Width versus Temperature
33199
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The MC33199 is a serial interface circuit used in diagnostic applications. It is the interface between the microcontroller and
the special K and L lines of the ISO diagnostic port. The MC33199 has been designed to meet the «Diagnosis System ISO9141»
specification.
This product description will detail the functionality of the device (see Figure 2, 33199 Simplified Internal Block Diagram). First,
the power supply and reference voltage generator will be discussed, then the paths functions between MCU, K and L lines will
be detailed. A dedicated paragraph will tell about the special functionality of the I1 pin, which allow high Baud rates transmission.
FUNCTIONAL PIN DESCRIPTION
VCC (VCC)
5V typical power supply pin. Typical supply current is less
than 1.5mA.
REF-IN-L (REF-IN-L)
Input reference for C2 comparator. This input can be
connected directly to REF-OUT, with or without a resistor
network, or to an external reference.
REF-IN-K (REF-IN-K)
Input reference for C1 comparator. This input can be
connected directly to REF-OUT, with or without a resistor
network, or to an external reference.
circuit to VBAT (VS). When turning ON (TXD low), this pin will
pull the Bus line to Gnd, the current into DIA will be internally
limited to 60mA typ.
The internal power transistor has a thermal shutdown
circuit, which forces the DIA output OFF in case of over
temperature.
DIA is also the C1 comparator input. It is protected against
both positive and negative over voltage by a 38V zener diode.
This pin exhibits a constant input current of 7.5?A.
GND (GND)
Gnd reference for the entire device.
I1 (I1)
LO (LO)
Output of C2 comparator, normally connected to a microcontroller I/O. If L input > (REF-IN-L + Hyst/2) then output LO
is in high state. If L< (REF-IN-L - Hyst/2) then output LO is in
low state, output transistor ON.
This pin is an open collector structure. A Pull up resistor
should be added to VCC.
Drive capability of this output is 5mA.
RXD (RXD)
Receive output, normally connected to a microcontroller I/
O.
If DIA input > (REF-IN-L + Hyst/2) then output LO is in high
state.
If DIA < (REF-IN-L - Hyst/2) then output LO is in low state,
output transistor ON. This pin has an internal pull up resistor
to VCC (2Kohm typ). Drive capability of this output is 5mA
TXD (TXD)
Transmission input, is normally connected to a
microcontroller I/O.This pin controls DIA output. If Txd is high,
the output DIA transistor is OFF. If Txd is low the DIA output
transistor is ON.
DIA (DIA)
Bus source current pin. It is normally tied to DIA pin and to
the Bus line.
At static HIGH or LOW level Txd, the current source I1
delivers a current of 3mA (typ). Only during LOW to HIGH
transition, does this current increase to a higher value in
order to charge the key line capacitor (Cl<4nF) in a short time
(see fig 3 and 4).
L (L)
Input for C2 comparator. This pin is protected against both
positive and negative over voltage by a 38V zener diode.
This L line is a second independent input. It can be used
for wake up sequence in ISO diagnosis or as an additional
input bus line.
This pin exhibits a constant input current of 7.5µΑ.
VS (VS)
12V typical, or Vbat supply pin for the device. This pin is
protected against over voltage transients.
REF-OUT (REF-OUT)
Internal reference voltage generator output pin. Its value
depends on Vs (Vbat) values. This output can be directly
connected to REF-IN L and REF-IN-K, or through a resistor
network. Maximum current capability is 50µΑ.
Input / Output Diagnosis Bus line pin. This pin is an open
collector structure, protected against over current and short
33199
12
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
FUNCTIONAL DEVICE OPERATION
POWER SUPPLIES AND REFERENCE VOLTAGE
The device has two power supplies :
A 5V supply, VCC, normally connected to the MCU supply
voltage. This pin sinks typically 1mA during operation. A
VBAT supply voltage, VS, normally tied to the car battery
voltage. This pin can sustain up to 40V DC. Care should be
taken for reverse battery protection and transient voltages
higher than 40V.
The voltage reference generator is supplied from both
VCC and VBAT. It provides reference voltage for the K and L
lines comparators thresholds. The reference voltage is
dependant on VBAT voltage : it is linear versus VBAT
voltage, for VBAT from 5.6V to 18V. Below 5.6V and over
18V the reference voltage is clamped (see Figure 12). The
reference is connected externally to the device, through REFOUT pin. It is available for other needs. It can supplied 50µΑ
max (see Figure 13).
PATH FUNCTIONS BETWEEN MCU, K AND L
LINES
The path function from the MCU to the K line is composed
of a driver interfacing directly with the MCU through the TXD
pin. The TXD pin is CMOS compatible. This driver controls a
power transistor which can be turned ON or OFF. When it is
ON, it pull the DIA pin low. This pin is known as K line in the
ISO 9141 specification. The DIA pin structure is open
collector, without pull up component. This allow the
connection of several MC33199 on the K line and the use of
a single pull up resistor per system (see Figure 25). In order
to protect the DIA pin against short circuits to VBAT, the
device incorporates a current limitation (see Figure 17) and a
thermal shutdown. This current limitation will also act when
the device drives a K line bus exhibiting large parasitic
capacitor value (see Special functionality of I1 pin).
The path from this DIA pin, or K line, to the MCU is done
through a comparator. The comparator threshold voltage is
connected to REF-IN-K pin. It can be tied to the REF-OUT
voltage, if the VBAT dependant threshold is to be achieved.
The second input of this comparator is internally connected
to DIA pin. The output of the comparator is available on RXD
output pin, normally connected to a MCU I/O port. RXD pin
has a 2kOhms internal pull up resistor.
The path from the L line, used during wake-up sequence
of the transmission, to the MCU is done through a second
comparator. The comparator threshold voltage is connected
to REF-IN-L pin. As the REF-IN-K pin, it can be tied to the
REFOUT voltage, if the VBAT dependant threshold need to
be achieved. The second input of this comparator is internally
connected to L pin. The output of the comparator is available
on LO output pin, which is an open collector structure. LO is
normally connected to a MCU I/O port.
The DIA, and L pins can sustain up to 38V DC. Care
should be taken for reverse battery protection and transient
voltages higher than 38V.
The DIA and L pins both have internal pull down current
source of typically 7.5µΑ (see Figure 15). So the L line
exhibits a 10µΑ pull down current. The DIA pin has the same
behavior when it is in OFF state, that is when TXD is at logic
high level.
SPECIAL FUNCTIONALITY OF I1 PIN
The MC33199 has a unique feature which allows the
transmission Baud rate to be up to 200kBaud. In practice, the
K line can be several meters long, and thus can have a large
parasitic capacitor value. This parasitic capacitor value will
slow down the low to high transition of the K line, and indeed
will limit the Baud rate transmission. For the K line to go from
low to high level, the parasitic capacitor need to be charged,
and it can only be charged by the pull up resistor. A low pull
up resistor value would result in fast charge time of the
capacitor, but also in large output current, and large power
dissipation in the driver.
To avoid this problem, the MC33199 incorporates a
dynamic current source, which is temporary activated at the
low to high transition of the TXD pin, that is when the DIA pin
or K line should switch from low to high level (see Figure 6 &
Figure 7).
This current source is available at I1 pin. It has a typical
value of 80mA. It is activated for 4µs (see Figure 22 &
Figure 23) and is automatically disabled after this time.
During that time it will charge the K line parasitic capacitor.
This extra current will quickly rise the K line voltage up to the
Vbat, and will result in reduce rise time on the K line. With this
feature the MC33199 can ensure Baud rate transmission of
up to 200kBaud.
During high to low transition on the K line, the parasitic
capacitor of the bus line will be discharged by the output
transistor of the DIA pin. In this case, the total current may
exceed the internal current limitation of the DIA pin. If so, the
current limitation will act, and discharge current will be limited
to typically 60mA (See Figure 7 & Figure 17).
If a high Baud rate is necessary, the I1 pin need to be
connected to the DIA as shown in the typical application
Figure 24. The I1 pin can also be left open, if the I1
functionality and high Baud rate are not suited in the
application.
33199
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
TYPICAL APPLICATIONS
TYPICAL APPLICATIONS
+VBAT
VCC : 5V
REF-OUT
VS
Reference
Generator
Protection
LO
C2
L
+
L Line
-
REF-IN-L
I1
source
REF-IN-K
RXD
RPU
I1
TxD
Vcc
C1
+
DIA
K Line
RxD
Thermal
Shutdown
MCU
TXD
Driver
GND
SERVICE TESTER
or
End of Line
manufacturer
programmation or
checking system
Current
Limit
CAR ELECTRONIC CONTROL UNIT
Figure 24. Logic Diagram and Application Schematic
33199
14
Analog Integrated Circuit Device Data
Freescale Semiconductor
TYPICAL APPLICATIONS
+Vbat
RPU
L Line
K Line
MC33199
MCU
E.C.U # 1
SERVICE TESTER
or
End of Line
manufacturer
programmation or
checking system
CAR ISO DIAGNOSTIC CONNECTOR
MC33199
MCU
E.C.U # 2
CAR
Other ECUs
Fig 6 : Typical application with several ECUs
Figure 25. Typical Application with Several ECUs
+12V
D2
100nF
VBAT
I1
D1
Schaffner
Generator
2x1nF
L
DIA
GND
2x330pF
Figure 26. Test Circuit for Transient Schaffner Pulses
Test pulses are directly applied to VS and via a capacitor of 1nF to DIA and L. The voltage VS is limited to -2V/38V by the
transient suppressor diode D1. Pulses can occor simultaneously or separately.
33199
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
PACKAGING
PACKAGE DIMENSIONS
PACKAGING
PACKAGE DIMENSIONS
For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below.
D SUFFIX
EF-SUFFIX (PB-FREE)
PLASTIC PACKAGE
98ASB42565B
ISSUE H
33199
16
Analog Integrated Circuit Device Data
Freescale Semiconductor
REVISION HISTORY
REVISION HISTORY
Revision
Date
Description of Changes
2.0
8/2006
•
•
•
•
•
Implemented Revision History page
Added EF Pb-FREE suffix
Revised Figure 1, Simplified Application Drawing.
Converted to Freescale format and updated to the prevailing form and style
Removed MC33199EF/R2 and replaced with MCZ33199EF/R2 in the Ordering Information block
3.0
9/2006
•
Made unit label corrections on Transmission Speed, High or Low Bit Time, LO Output :, and I1
Output @ VS-I1 > 2.7V : on page 7.
4.0
10/2006
•
Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from
Maximum Ratings on page 4. Added note with instructions to obtain this information from
www.freescale.com.
33199
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
How to Reach Us:
Home Page:
www.freescale.com
E-mail:
[email protected]
RoHS-compliant and/or Pb-free versions of Freescale products have the functionality
and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free
counterparts. For further information, see http://www.freescale.com or contact your
Freescale sales representative.
For information on Freescale’s Environmental Products program, go to http://
www.freescale.com/epp.
USA/Europe or Locations Not Listed:
Freescale Semiconductor
Technical Information Center, CH370
1300 N. Alma School Road
Chandler, Arizona 85224
+1-800-521-6274 or +1-480-768-2130
[email protected]
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
[email protected]
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064
Japan
0120 191014 or +81 3 5437 9125
[email protected]
Asia/Pacific:
Freescale Semiconductor Hong Kong Ltd.
Technical Information Center
2 Dai King Street
Tai Po Industrial Estate
Tai Po, N.T., Hong Kong
+800 2666 8080
[email protected]
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Denver, Colorado 80217
1-800-441-2447 or 303-675-2140
Fax: 303-675-2150
[email protected]
MC33199
Rev. 4.0
10/2006
Information in this document is provided solely to enable system and software
implementers to use Freescale Semiconductor products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.
Freescale Semiconductor reserves the right to make changes without further notice to
any products herein. Freescale Semiconductor makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale Semiconductor assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. “Typical” parameters that may be
provided in Freescale Semiconductor data sheets and/or specifications can and do vary
in different applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer application by
customer’s technical experts. Freescale Semiconductor does not convey any license
under its patent rights nor the rights of others. Freescale Semiconductor products are
not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which the failure of the Freescale Semiconductor product
could create a situation where personal injury or death may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended or
unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Freescale
Semiconductor was negligent regarding the design or manufacture of the part.
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners.
© Freescale Semiconductor, Inc., 2006. All rights reserved.