CY7C604XX enCoRe™ V Low Voltage Microcontroller Features ■ Powerful Harvard Architecture processor ❐ M8C processor speeds running up to 24 MHz ❐ Low power at high processing speeds ❐ Interrupt controller ❐ 1.71 V to 3.6 V operating voltage ❐ Commercial temperature range: 0 °C to +70 °C ■ Flexible on-chip memory ❐ Up to 32 K flash program storage • 50,000 erase and write cycles • Flexible protection modes ❐ Up to 2048 bytes SRAM data storage ❐ In-system serial programming (ISSP) ■ Complete development tools ® ❐ Free development tool (PSoC Designer™) ❐ Full-featured, in-circuit emulator and programmer ❐ Full-speed emulation ❐ Complex breakpoint structure ❐ 128 K trace memory ■ Precision, programmable clocking ❐ Crystal-less oscillator with support for an external crystal or resonator ❐ Internal ±5.0% 6, 12, or 24 MHz main oscillator ❐ Internal low-speed oscillator at 32 kHz for watchdog and sleep. The frequency range is 19 to 50 kHz with a 32 kHz typical value ■ Programmable pin configurations ❐ Up to 36 GPIO (depending on package) ❐ 25 mA sink current on all GPIO ❐ Pull-up, High Z, open drain, CMOS drive modes on all GPIO ❐ CMOS drive mode (5 mA source current) on Ports 0 and 1: • 20 mA (at 3.0 V) total source current ❐ Low dropout voltage regulator for Port 1 pins: • Programmable to output 3.0, 2.5, or 1.8V ❐ Selectable, regulated digital I/O on Port 1 ❐ Configurable input threshold for Port 1 ❐ Hot-swappable capability on Port 1 ■ Additional system resources ❐ Configurable communication speeds 2 ❐ I C Slave • Selectable to 50 kHz, 100 kHz, or 400 kHz • Implementation requires no clock stretching • Implementation during sleep modes with less than 100 mA • Hardware address detection ❐ SPI master and SPI slave • Configurable between 46.9 kHz and 12 MHz ❐ Three 16-bit timers ❐ 10-bit ADC used to monitor battery voltage or other signals with external components ❐ Watchdog and sleep timers ❐ Integrated supervisory circuit enCoRe V LV Block Diagram Port 4 Port 3 Port 2 Port 1 Port 0 Prog. LDO enCoRe V CORE System Bus SRAM 2048 Bytes SROM 8 K / 16 K / 32 K Flash Sleep and Watchdog CPU Core (M8C) Interrupt Controller 6 / 12 / 24 MHz Internal Main Oscillator 3 16-Bit Timers ADC I2C Slave/SPI Master-Slave POR and LVD System Resets System Resources Cypress Semiconductor Corporation Document Number: 001-12395 Rev. *N • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised April 24, 2013 CY7C604XX Contents Functional Overview ........................................................ 3 The enCoRe V LV Core .............................................. 3 10-bit ADC ................................................................... 3 SPI ............................................................................... 4 I2C Slave ..................................................................... 4 Additional System Resources ..................................... 5 Getting Started .................................................................. 5 Application Notes ........................................................ 5 Development Kits ........................................................ 5 Training ....................................................................... 5 CYPros Consultants .................................................... 5 Solutions Library .......................................................... 5 Technical Support ....................................................... 5 Development Tools .......................................................... 6 PSoC Designer Software Subsystems ........................ 6 Designing with PSoC Designer ....................................... 7 Select User Modules ................................................... 7 Configure User Modules .............................................. 7 Organize and Connect ................................................ 7 Generate, Verify, and Debug ....................................... 7 Pin Configuration ............................................................. 8 16-Pin Part Pinout ....................................................... 8 32-Pin Part Pinout ....................................................... 9 48-Pin Part Pinout ..................................................... 11 Register Reference ......................................................... 13 Register Conventions .................................................... 13 Register Mapping Tables ............................................... 13 Electrical Specifications ................................................ 16 Absolute Maximum Ratings ....................................... 17 Operating Temperature ............................................. 17 Document Number: 001-12395 Rev. *N DC Electrical Characteristics ........................................ 18 DC Chip Level Specifications .................................... 18 DC General Purpose I/O Specifications .................... 19 ADC Electrical Specifications .................................... 21 DC POR and LVD Specifications .............................. 22 DC Programming Specifications ............................... 22 AC Electrical Characteristics ........................................ 23 AC Chip Level Specifications .................................... 23 AC General Purpose IO Specifications ..................... 24 AC External Clock Specifications .............................. 25 AC Programming Specifications ................................ 25 AC I2C Specifications ................................................ 26 Package Diagram ............................................................ 28 Packaging Dimensions .................................................. 28 Package Handling ........................................................... 30 Thermal Impedances ..................................................... 30 Capacitance on Crystal Pins .................................... 30 Solder Reflow Peak Temperature ................................. 30 Ordering Information ...................................................... 31 Ordering Code Definitions ......................................... 31 Acronyms ........................................................................ 32 Document Conventions ................................................. 32 Units of Measure ....................................................... 32 Appendix: Errata Document for enCoRe™ V – CY7C643xx and enCoRe™ V LV – CY7C604xx ........................................ 33 CY7C643xx and CY7C604xx Errata Summary ......... 33 Document History Page ................................................. 35 Sales, Solutions, and Legal Information ...................... 38 Worldwide Sales and Design Support ....................... 38 Products .................................................................... 38 PSoC Solutions ......................................................... 38 Page 2 of 38 CY7C604XX Functional Overview The enCoRe V LV family of devices are designed to replace multiple traditional low voltage microcontroller system components with one, low cost single chip programmable component. Communication peripherals (I2C/SPI), a fast CPU, flash program memory, SRAM data memory, and configurable I/O are included in a range of convenient pinouts. Figure 1. ADC System Performance Block Diagram VIN TEMP SENSOR/ ADC The architecture for this device family, as illustrated in enCoRe V LV Block Diagram, is comprised of two main areas: the CPU core and the system resources. Depending on the enCoRe V LV package, up to 36 GPIO are also included. Enhancements over the Cypress’s legacy low-voltage microcontrollers include faster CPU at lower voltage operation, lower current consumption, twice the RAM and flash, hot-swapable I/Os, I2C hardware address recognition, new very low-current sleep mode, and new package options. The enCoRe V LV Core The enCoRe V LV Core is a powerful engine that supports a rich instruction set. It encompasses SRAM for data storage, an interrupt controller, sleep and watchdog timers, and IMO (internal main oscillator) and ILO (internal low-speed oscillator). The CPU core, called the M8C, is a powerful processor with speeds up to 24 MHz. The M8C is a four-MIPS, 8-bit Harvard architecture microprocessor. TEMP DIODES ADC SYSTEM BUS INTERFACE BLOCK COMMAND/ STATUS System Resources provide additional capability, such as a configurable I2C slave and SPI master-slave communication interface and various system resets supported by the M8C. 10-bit ADC The ADC on enCoRe V LV device is an independent block with a state machine interface to control accesses to the block. The ADC is housed together with the temperature sensor core and can be connected to this or the Analog Mux Bus. As a default operation, the ADC is connected to the temperature sensor diodes to give digital values of the temperature. Interface to the M8 C ( Processor ) Core The ADC User Module contains an integrator block and one comparator with positive and negative input set by the MUXes. The input to the integrator stage comes from the Analog Global Input Mux or the temperature sensor with an input voltage range of 0 V to 1.3 V, where 1.3 V is 72% of full scale. In the ADC only configuration (the ADC MUX selects the Analog Mux Bus, not the default temperature sensor connection), an external voltage can be connected to the input of the modulator for voltage conversion. The ADC is run for a number of cycles set by the timer, depending upon the resolution of the ADC desired by the user. A counter counts the number of trips by the comparator, which is proportional to the input voltage. The Temp Sensor block clock speed is 36 MHz and is divided down to 1 to 12 MHz for ADC operation. Document Number: 001-12395 Rev. *N Page 3 of 38 CY7C604XX SPI The serial peripheral interconnect (SPI) 3-wire protocol uses both edges of the clock to enable synchronous communication without the need for stringent setup and hold requirements. Figure 2. Basic SPI Configuration Data is output by Data is registered at the both the Master input of both devices on the and Slave on opposite edge of the clock. one edge of the clock. SCLK MOSI MISO A device can be a master or slave. A master outputs clock and data to the slave device and inputs slave data. A slave device inputs clock and data from the master device and outputs data for input to the master. Together, the master and slave are essentially a circular Shift register, where the master generates the clocking and initiates data transfers. A basic data transfer occurs when the master sends eight bits of data, along with eight clocks. In any transfer, both master and slave transmit and receive simultaneously. If the master only sends data, the received data from the slave is ignored. If the master wishes to receive data from the slave, the master must send dummy bytes to generate the clocking for the slave to send data back. SPI configuration register (SPI_CFG) sets master/slave functionality, clock speed and interrupt select. SPI control register (SPI_CR) provides four control bits and four status bits for device interfacing and synchronization. The SPIM hardware has no support for driving the Slave Select (SS_) signal. The behavior and use of this signal is application and enCoRe V device dependent and, if required, must be implemented in firmware. There is an additional data input in the SPIS, Slave Select (SS_), which is an active low signal. SS_ must be asserted to enable the SPIS to receive and transmit. SS_ has two high level functions: 1) To allow for the selection of a given slave in a multi-slave environment, and 2) To provide additional clocking for TX data queuing in SPI modes 0 and 1. I2C Slave The I2C slave enhanced communications block is a serial-to-parallel processor, designed to interface the enCoRe V LV device to a two-wire I2C serial communications bus. To eliminate the need for excessive CPU intervention and overhead, the block provides I2C-specific support for status detection and generation of framing bits. By default, the I2C Slave Enhanced module is firmware compatible with the previous generation of I2C slave functionality. However, this module provides new features that are configurable to implement significant flexibility for both internal and external interfacing. Figure 4. I2C Block Diagram Figure 3. SPI Block Diagram I2C Plus Slave SPI Block SCLK DATA_IN DATA_OUT CLK_IN CLK_OUT SCLK INT SYSCLK I2C Core MOSI, MISO SS_ Buffer Module CPU Port SDA_IN To/From SCL_IN I2C Basic Configuration I2C_BUF I2C_CFG GPIO Pins SDA_OUT SCL_OUT I2C_EN I2C_SCR 32 Byte RAM I2C_DR HW Addr Cmp I2C_ADDR Buffer Ctl I2C_BP Registers Plus Features SYSCLK I2C_CP CONFIGURATION[7:0] CONTROL[7:0] I2C_XCFG MCU_BP TRANSMIT[7:0] RECEIVE[7:0] I2C_XSTAT MCU_CP Document Number: 001-12395 Rev. *N System Bus MOSI, MISO STANDBY Page 4 of 38 CY7C604XX The basic I2C features include: ■ ✟Slave, ■ ✟Byte transmitter, and receiver operation processing for low CPU overhead ■ ✟Interrupt or polling CPU interface ■ ✟Support for clock rates of up to 400 kHz ■ ✟7- or 10-bit addressing (through firmware support) ■ ✟SMBus operation (through firmware support) Getting Started The quickest way to understanding the enCoRe V silicon is by reading this datasheet and using the PSoC Designer Integrated Development Environment (IDE). This datasheet is an overview of the enCoRe V integrated circuit and presents specific pin, register, and electrical specifications. For in-depth information, along with detailed programming information, refer to the PSoC Programmable System-on-Chip Technical Reference Manual, for CY8C28xxx PSoC devices. ■ ✟Support for 7-bit hardware address compare For up-to-date ordering, packaging, and electrical specification information, reference the latest enCoRe V device datasheets on the web at http://www.cypress.com. ■ ✟Flexible data buffering schemes Application Notes Enhanced features of the I2C Slave Enhanced Module include: ■ ✟A ‘no bus stalling’ operating mode ■ ✟A low power bus monitoring mode Cypress application notes are an excellent introduction to the wide variety of possible PSoC designs. The I2C block controls the data (SDA) and the clock (SCL) to the external I2C interface through direct connections to two dedicated GPIO pins. When I2C is enabled, these GPIO pins are not available for general purpose use. The enCoRe V LV CPU firmware interacts with the block through I/O register reads and writes, and firmware synchronization is implemented through polling and/or interrupts. Development Kits In the default operating mode, which is firmware compatible with previous versions of I2C slave modules, the I2C bus is stalled upon every received address or byte, and the CPU is required to read the data or supply data as required before the I2C bus continues. However, this I2C Slave Enhanced module provides new data buffering capability as an enhanced feature. In the EZI2C buffering mode, the I2C slave interface appears as a 32-byte RAM buffer to the external I2C master. Using a simple predefined protocol, the master controls the read and write pointers into the RAM. When this method is enabled, the slave never stalls the bus. In this protocol, the data available in the RAM (this is managed by the CPU) is valid. Free PSoC technical training (on demand, webinars, and workshops), which is available online via www.cypress.com, covers a wide variety of topics and skill levels to assist you in your designs. Additional System Resources System Resources, some of which have been previously listed, provide additional capability useful to complete systems. Additional resources include low voltage detection and power on reset. The following statements describe the merits of each system resource: ■ Low-voltage detection (LVD) interrupts can signal the application of falling voltage levels, while the advanced power-on reset (POR) circuit eliminates the need for a system supervisor. ■ The 3.6 V maximum input, 1.8, 2.5, or 3 V selectable output, low dropout regulator (LDO) provides regulation for I/Os. A register controlled bypass mode enables the user to disable the LDO. ■ Standard Cypress PSoC IDE tools are available for debugging the enCoRe V LV family of parts. Document Number: 001-12395 Rev. *N PSoC Development Kits are available online from and through a growing number of regional and global distributors, which include Arrow, Avnet, Digi-Key, Farnell, Future Electronics, and Newark. Training CYPros Consultants Certified PSoC consultants offer everything from technical assistance to completed PSoC designs. To contact or become a PSoC consultant go to the CYPros Consultants web site. Solutions Library Visit our growing library of solution focused designs. Here you can find various application designs that include firmware and hardware design files that enable you to complete your designs quickly. Technical Support Technical support – including a searchable Knowledge Base articles and technical forums – is also available online. If you cannot find an answer to your question, call our Technical Support hotline at 1-800-541-4736. Page 5 of 38 CY7C604XX Development Tools PSoC Designer™ is the revolutionary integrated design environment (IDE) that you can use to customize PSoC to meet your specific application requirements. PSoC Designer software accelerates system design and time to market. Develop your applications using a library of precharacterized analog and digital peripherals (called user modules) in a drag-and-drop design environment. Then, customize your design by leveraging the dynamically generated application programming interface (API) libraries of code. Finally, debug and test your designs with the integrated debug environment, including in-circuit emulation and standard software debug features. PSoC Designer includes: ■ Application editor graphical user interface (GUI) for device and user module configuration and dynamic reconfiguration ■ Extensive user module catalog ■ Integrated source-code editor (C and assembly) ■ Free C compiler with no size restrictions or time limits ■ Built-in debugger ■ In-circuit emulation ■ Built-in support for communication interfaces: 2 ❐ Hardware and software I C slaves and masters ❐ Full-speed USB 2.0 ❐ Up to four full-duplex universal asynchronous receiver/transmitters (UARTs), SPI master and slave, and wireless PSoC Designer supports the entire library of PSoC 1 devices and runs on Windows XP, Windows Vista, and Windows 7. PSoC Designer Software Subsystems Design Entry In the chip-level view, choose a base device to work with. Then select different onboard analog and digital components that use the PSoC blocks, which are called user modules. Examples of user modules are analog-to-digital converters (ADCs), digital-to-analog converters (DACs), amplifiers, and filters. Configure the user modules for your chosen application and connect them to each other and to the proper pins. Then generate your project. This prepopulates your project with APIs and libraries that you can use to program your application. The tool also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic reconfiguration makes it possible to change configurations at run time. In essence, this lets you to use more than 100 percent of PSoC's resources for an application. Document Number: 001-12395 Rev. *N Code Generation Tools The code generation tools work seamlessly within the PSoC Designer interface and have been tested with a full range of debugging tools. You can develop your design in C, assembly, or a combination of the two. Assemblers. The assemblers allow you to merge assembly code seamlessly with C code. Link libraries automatically use absolute addressing or are compiled in relative mode, and linked with other software modules to get absolute addressing. C Language Compilers. C language compilers are available that support the PSoC family of devices. The products allow you to create complete C programs for the PSoC family devices. The optimizing C compilers provide all of the features of C, tailored to the PSoC architecture. They come complete with embedded libraries providing port and bus operations, standard keypad and display support, and extended math functionality. Debugger PSoC Designer has a debug environment that provides hardware in-circuit emulation, allowing you to test the program in a physical system while providing an internal view of the PSoC device. Debugger commands allow you to read and program and read and write data memory, and read and write I/O registers. You can read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The debugger also lets you to create a trace buffer of registers and memory locations of interest. Online Help System The online help system displays online, context-sensitive help. Designed for procedural and quick reference, each functional subsystem has its own context-sensitive help. This system also provides tutorials and links to FAQs and an Online Support Forum to aid the designer. In-Circuit Emulator A low-cost, high-functionality in-circuit emulator (ICE) is available for development support. This hardware can program single devices. The emulator consists of a base unit that connects to the PC using a USB port. The base unit is universal and operates with all PSoC devices. Emulation pods for each device family are available separately. The emulation pod takes the place of the PSoC device in the target board and performs full-speed (24 MHz) operation. Page 6 of 38 CY7C604XX Designing with PSoC Designer The development process for the PSoC device differs from that of a traditional fixed-function microprocessor. The configurable analog and digital hardware blocks give the PSoC architecture a unique flexibility that pays dividends in managing specification change during development and lowering inventory costs. These configurable resources, called PSoC blocks, have the ability to implement a wide variety of user-selectable functions. The PSoC development process is: 1. Select user modules. 2. Configure user modules. 3. Organize and connect. 4. Generate, verify, and debug. Select User Modules PSoC Designer provides a library of prebuilt, pretested hardware peripheral components called “user modules.” User modules make selecting and implementing peripheral devices, both analog and digital, simple. Configure User Modules Each user module that you select establishes the basic register settings that implement the selected function. They also provide parameters and properties that allow you to tailor their precise configuration to your particular application. For example, a PWM User Module configures one or more digital PSoC blocks, one for each eight bits of resolution. Using these parameters, you can establish the pulse width and duty cycle. Configure the parameters and properties to correspond to your chosen application. Enter values directly or by selecting values from drop-down menus. All of the user modules are documented in datasheets that may be viewed directly in PSoC Designer or on the Cypress website. These user module datasheets explain the internal operation of the user module and provide performance specifications. Each datasheet describes the use of each user module parameter, and other information that you may need to successfully implement your design. Document Number: 001-12395 Rev. *N Organize and Connect Build signal chains at the chip level by interconnecting user modules to each other and the I/O pins. Perform the selection, configuration, and routing so that you have complete control over all on-chip resources. Generate, Verify, and Debug When you are ready to test the hardware configuration or move on to developing code for the project, perform the “Generate Configuration Files” step. This causes PSoC Designer to generate source code that automatically configures the device to your specification and provides the software for the system. The generated code provides APIs with high-level functions to control and respond to hardware events at run time, and interrupt service routines that you can adapt as needed. A complete code development environment lets you to develop and customize your applications in C, assembly language, or both. The last step in the development process takes place inside PSoC Designer's Debugger (accessed by clicking the Connect icon). PSoC Designer downloads the HEX image to the ICE where it runs at full-speed. PSoC Designer debugging capabilities rival those of systems costing many times more. In addition to traditional single-step, run-to-breakpoint, and watch-variable features, the debug interface provides a large trace buffer. It lets you to define complex breakpoint events that include monitoring address and data bus values, memory locations, and external signals. Page 7 of 38 CY7C604XX Pin Configuration 16-Pin Part Pinout Vdd (Top View) 10 9 P0[4] XRES P1[4] P1[2] P1[0] 7 8 3 4 5 6 P1[7] P1[5] 12 QFN/COL11 P1[1] Vss 1 2 P1[3] P2[5] P2[3] 14 13 P0[3] P0[7] 16 15 P0[1] Figure 5. CY7C60413 16-Pin enCoRe V LV Device Table 1. 16-Pin Part Pinout (QFN) Pin No. Type 1 I/O P2[5] Name Digital I/O, crystal out (Xout) Description 2 I/O P2[3] Digital I/O, crystal in (Xin) 3 IOHR P1[7] Digital I/O, I2C SCL, SPI SS 4 IOHR P1[5] Digital I/O, I2C SDA, SPI MISO 5 IOHR P1[3] Digital I/O, SPI CLK 6 IOHR P1[1](1, 2) Digital I/O, ISSP CLK, I2C SCL, SPI MOSI 7 Power Vss Ground pin 8 IOHR P1[0](1, 2) Digital I/O, ISSP DATA, I2C SDA, SPI CLK 9 IOHR P1[2] Digital I/O 10 IOHR P1[4] Digital I/O, optional external clock input (EXTCLK) 11 Input XRES Active high external reset with internal pull-down 12 IOHR P0[4] Digital I/O 13 Power Vdd Power pin 14 IOHR P0[7] Digital I/O 15 IOHR P0[3] Digital I/O 16 IOHR P0[1] Digital I/O LEGEND I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output. Notes 1. During power up or reset event, device P1[0] and P1[1] may disturb the I2C bus. Use alternate pins if issues are encountered. 2. These are the ISSP pins, that are not High Z at POR. Document Number: 001-12395 Rev. *N Page 8 of 38 CY7C604XX 32-Pin Part Pinout QFN (Top View) 24 23 22 21 20 19 18 17 P0[0] P2[6] P2[4] P2[2] P2[0] P3[2] P3[0] XRES P1[4] P1[6] 9 10 11 12 13 14 15 16 1 2 3 4 5 6 7 8 P1[5] P1[3] P1[1] Vss P1[0] P1[2] P0[1] P2[7] P2[5] P2[3] P2[1] P3[3] P3[1] P1[7] 26 25 Vdd P0[6] P0[4] P0[2] 32 31 30 29 28 27 Vss P0[3] P0[5] P0[7] Figure 6. CY7C60445 32-Pin enCoRe V LV Device Table 2. 32-Pin Part Pinout (QFN) Pin No. Type 1 IOH P0[1] Name Digital I/O 2 I/O P2[7] Digital I/O 3 I/O P2[5] Digital I/O, crystal out (Xout) 4 I/O P2[3] Digital I/O, crystal in (Xin) 5 I/O P2[1] Digital I/O 6 I/O P3[3] Digital I/O 7 I/O P3[1] Digital I/O 8 IOHR P1[7] Digital I/O, I2C SCL, SPI SS 9 IOHR P1[5] Digital I/O, I2C SDA, SPI MISO 10 IOHR P1[3] Digital I/O, SPI CLK 11 IOHR P1[1](1,2) Digital I/O, ISSP CLK, I2C SCL, SPI MOSI 12 Power Vss Ground connection 13 IOHR P1[0](1,2) Digital I/O, ISSP DATA, I2C SDA, SPI CLK 14 IOHR P1[2] Digital I/O 15 IOHR P1[4] Digital I/O, optional external clock input (EXTCLK) 16 IOHR P1[6] Digital I/O 17 Reset Input XRES Active high external reset with internal pull-down 18 I/O P3[0] Digital I/O 19 I/O P3[2] Digital I/O 20 I/O P2[0] Digital I/O 21 I/O P2[2] Digital I/O 22 I/O P2[4] Digital I/O 23 I/O P2[6] Digital I/O 24 IOH P0[0] Digital I/O 25 IOH P0[2] Digital I/O 26 IOH P0[4] Digital I/O 27 IOH P0[6] Digital I/O Document Number: 001-12395 Rev. *N Description Page 9 of 38 CY7C604XX Table 2. 32-Pin Part Pinout (QFN) (continued) Pin No. Type Name Description 28 Power Vdd Supply voltage 29 IOH P0[7] Digital I/O 30 IOH P0[5] Digital I/O 31 IOH P0[3] Digital I/O 32 Power Vss Ground connection CP Power Vss Center pad must be connected to ground LEGEND I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output. Document Number: 001-12395 Rev. *N Page 10 of 38 CY7C604XX 48-Pin Part Pinout P0[0] 37 P0[4] P0[6] P0[2] 38 39 Vdd 40 P0[7] 42 41 P0[5] 44 NC NC P0[3] 45 43 Vss 46 P0[1] 48 47 Figure 7. CY7C60455/CY7C60456 48-Pin enCoRe V LV Device 36 P2[6] 2 35 P2[4] 3 34 P2[2] P2[3] 4 33 P2[0] P2[1] P4[3] 5 32 P4[2] 31 P4[0] P4[1] 7 30 P3[6] P3[7] 8 P3[4] P3[5] P3[0] XRES NC 1 P2[7] P2[5] QFN 6 (Top View) 16 17 18 19 20 21 22 23 24 P1[1] Vss NC NC Vdd P1[0] P1[2] P3[2] P1[6] P1[4] 15 26 25 P1[3] 12 NC 11 P1[7] 14 P3[1] 13 10 27 NC P3[3] P1[5] 9 29 28 Table 3. 48-Pin Part Pinout (QFN) Pin No. Type Name 1 NC NC No connection 2 I/O P2[7] Digital I/O 3 I/O P2[5] Digital I/O, crystal out (Xout) 4 I/O P2[3] Digital I/O, crystal in (Xin) 5 I/O P2[1] Digital I/O 6 I/O P4[3] Digital I/O 7 I/O P4[1] Digital I/O 8 I/O P3[7] Digital I/O 9 I/O P3[5] Digital I/O 10 I/O P3[3] Digital I/O 11 I/O P3[1] Digital I/O 12 IOHR P1[7] Digital I/O, I2C SCL, SPI SS 13 IOHR P1[5] Digital I/O, I2C SDA, SPI MISO 14 NC NC No connection 15 NC NC No connection 16 IOHR P1[3] Digital I/O, SPI CLK 17 IOHR P1[1](1,2) Digital I/O, ISSP CLK, I2C SCL, SPI MOSI 18 Power Vss Supply ground 19 NC NC No connection 20 NC NC No connection 21 Power Vdd Supply voltage Document Number: 001-12395 Rev. *N Description Page 11 of 38 CY7C604XX Table 3. 48-Pin Part Pinout (QFN) (continued) Pin No. Type Name 22 IOHR (1,2) P1[0] Digital I/O, ISSP DATA, I2C SDA, SPI CLK 23 IOHR P1[2] Digital I/O 24 IOHR P1[4] Digital I/O, optional external clock input (EXTCLK) 25 IOHR P1[6] Digital I/O 26 XRES Ext Reset Active high external reset with internal pull-down 27 I/O P3[0] Digital I/O 28 I/O P3[2] Digital I/O 29 I/O P3[4] Digital I/O 30 I/O P3[6] Digital I/O 31 I/O P4[0] Digital I/O 32 I/O P4[2] Digital I/O 33 I/O P2[0] Digital I/O 34 I/O P2[2] Digital I/O 35 I/O P2[4] Digital I/O 36 I/O P2[6] Digital I/O 37 IOH P0[0] Digital I/O 38 IOH P0[2] Digital I/O 39 IOH P0[4] Digital I/O 40 IOH P0[6] Digital I/O 41 Power Vdd Supply voltage 42 NC NC No connection 43 NC NC No connection 44 IOH P0[7] Digital I/O 45 IOH P0[5] Digital I/O 46 IOH P0[3] Digital I/O 47 Power Vss Supply ground P0[1] Digital I/O Vss Center pad must be connected to ground 48 IOH CP Power Description LEGEND I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output Document Number: 001-12395 Rev. *N Page 12 of 38 CY7C604XX Register Reference The section discusses the registers of the enCoRe V LV device. It lists all the registers in mapping tables, in address order. Register Conventions Register Mapping Tables The register conventions specific to this section are listed in the following table. The enCoRe V LV device has a total register address space of 512 bytes. The register space is also referred to as I/O space and is broken into two parts: Bank 0 (user space) and Bank 1 (configuration space). The XIO bit in the Flag register (CPU_F) determines which bank the user is currently in. When the XIO bit is set, the user is said to be in the ‘extended’ address space or the ‘configuration’ registers. Table 4. Register Conventions Convention Description R Read register or bits W Write register or bits L Logical register or bits C Clearable register or bits # Access is bit specific Document Number: 001-12395 Rev. *N Page 13 of 38 CY7C604XX Table 5. Register Map Bank 0 Table: User Space Addr (0,Hex) Access PRT0DR Name 00 RW Name Addr (0,Hex) 40 Access Name Addr (0,Hex) 80 Access Name Addr (0,Hex) C0 PRT0IE 01 RW 41 81 C1 02 42 82 C2 03 43 83 C3 PRT1DR 04 RW 44 84 C4 PRT1IE 05 RW 45 85 C5 06 46 86 C6 07 47 87 Access C7 PRT2DR 08 RW 48 88 I2C_XCFG C8 PRT2IE 09 RW 49 89 I2C_XSTAT C9 R 4A 8A I2C_ADDR CA RW R 0A 0B RW 4B 8B I2C_BP CB PRT3DR 0C RW 4C 8C I2C_CP CC R PRT3IE 0D RW 4D 8D CPU_BP CD RW 0E 4E 8E CPU_CP CE R 0F 4F 8F I2C_BUF CF RW PRT4DR 10 RW 50 90 CUR_PP D0 RW PRT4IE 11 RW 51 91 STK_PP D1 RW 12 52 92 13 53 93 IDX_PP D3 RW 14 54 94 MVR_PP D4 RW 15 55 95 MVW_PP D5 RW 16 56 96 I2C_CFG D6 RW 17 57 97 I2C_SCR D7 # 18 58 98 I2C_DR D8 RW D2 19 59 99 1A 5A 9A INT_CLR0 DA D9 RW 1B 5B 9B INT_CLR1 DB RW 1C 5C 9C INT_CLR2 DC RW 1D 5D 9D INT_CLR3 DD RW 1E 5E 9E INT_MSK2 DE RW 1F 5F 9F INT_MSK1 DF RW 20 60 A0 INT_MSK0 E0 RW 21 61 A1 INT_SW_EN E1 RW 22 62 A2 INT_VC E2 RC 23 63 A3 RES_WDT E3 W 24 64 A4 INT_MSK3 E4 RW 25 65 A5 E5 26 66 A6 E6 27 67 A7 E7 28 68 A8 E8 SPI_TXR 29 W 69 A9 E9 SPI_RXR 2A R 6A AA EA 2B # SPI_CR 6B AB EB 2C 6C AC EC 2D 6D AD ED 2E 6E AE EE 2F 6F AF 30 70 PT0_CFG B0 RW F0 31 71 PT0_DATA1 B1 RW F1 32 72 PT0_DATA0 B2 RW F2 33 73 PT1_CFG B3 RW F3 34 74 PT1_DATA1 B4 RW F4 35 75 PT1_DATA0 B5 RW F5 36 76 PT2_CFG B6 RW 37 77 PT2_DATA1 B7 RW 38 78 PT2_DATA0 B8 RW EF F6 CPU_F F7 RL F8 39 79 B9 F9 3A 7A BA FA 3B 7B BB FB 3C 7C BC FC 3D 7D BD 3E 7E BE CPU_SCR1 FE # 3F 7F BF CPU_SCR0 FF # Gray fields are reserved and should not be accessed. FD # Access is bit specific. Document Number: 001-12395 Rev. *N Page 14 of 38 CY7C604XX Table 6. Register Map Bank 1 Table: Configuration Space Name PRT0DM0 PRT0DM1 Addr (1,Hex) Access 00 RW Name Addr (1,Hex) 40 Access Name Addr (1,Hex) 80 Access Name Addr (1,Hex) C0 01 RW 41 81 C1 02 42 82 C2 03 43 83 C3 PRT1DM0 04 RW 44 84 C4 PRT1DM1 05 RW 45 85 C5 06 46 86 C6 07 47 87 C7 PRT2DM0 08 RW 48 88 C8 PRT2DM1 09 RW 49 89 C9 0A 4A 8A CA 0B 4B 8B CB PRT3DM0 0C RW 4C 8C CC PRT3DM1 0D RW 4D 8D CD 0E 4E 8E CE 0F 4F 8F CF Access PRT4DM0 10 RW 50 90 D0 PRT4DM1 11 RW 51 91 D1 12 52 92 D2 13 53 93 D3 14 54 94 D4 15 55 95 D5 16 56 96 D6 17 57 97 D7 18 58 98 D8 19 59 99 D9 1A 5A 9A DA 1B 5B 9B 1C 5C 9C IO_CFG DC RW 1D 5D 9D OUT_P1 DD RW 1E 5E 9E 1F 5F 9F 20 60 A0 OSC_CR0 E0 RW 21 61 A1 ECO_CFG E1 # 22 62 A2 OSC_CR2 E2 RW 23 63 A3 VLT_CR E3 RW 24 64 A4 VLT_CMP E4 R 25 65 A5 E5 26 66 A6 E6 27 67 A7 28 68 A8 IMO_TR E8 W 69 A9 ILO_TR E9 W 6A AA SPI_CFG 29 RW 2A 2B 6B DB DE DF E7 EA AB SLP_CFG EB RW 2C TMP_DR0 6C RW AC SLP_CFG2 EC RW 2D TMP_DR1 6D RW AD SLP_CFG3 ED RW 2E TMP_DR2 6E RW AE EE 2F TMP_DR3 6F RW AF EF 30 70 B0 F0 31 71 B1 F1 32 72 B2 F2 33 73 B3 F3 34 74 B4 F4 35 75 B5 F5 36 76 B6 37 77 B7 38 78 B8 F8 F6 CPU_F F7 39 79 B9 F9 3A 7A BA FA 3B 7B BB FB 3C 7C BC FC 3D 7D BD FD 3E 7E BE FE 3F 7F BF FF Gray fields are reserved and should not be accessed. RL # Access is bit specific. Document Number: 001-12395 Rev. *N Page 15 of 38 CY7C604XX Electrical Specifications This section presents the DC and AC electrical specifications of the enCoRe V LV devices. For the most up to date electrical specifications, verify that you have the most recent datasheet available by visiting the company web site at http://www.cypress.com. Figure 9. IMO Frequency Trim Options Figure 8. Voltage versus CPU Frequency 3.6V 3.6V Vdd Voltage Vdd Voltage lid ng Va rati n e io Op eg R SLIMO Mode = 01 SLIMO Mode = 00 SLIMO Mode = 10 1.71V 1.71V 5.7 MHz 24 MHz CPU Frequency Document Number: 001-12395 Rev. *N 750 kHz 3 MHz 6 MHz 12 MHz 24 MHz IMO Frequency Page 16 of 38 CY7C604XX Absolute Maximum Ratings Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested. Table 7. Absolute Maximum Ratings Symbol Description [3] Conditions Min Typ Max Units Higher storage temperatures reduces data retention time. Recommended storage temperature is +25 °C ± 25 °C. Extended duration storage temperatures above 85 °C degrades reliability. –55 +25 +125 °C –0.5 – +6.0 V TSTG Storage temperature Vdd Supply voltage relative to Vss VIO DC input voltage Vss – 0.5 – Vdd + 0.5 V VIOZ DC voltage applied to tristate Vss –0.5 – Vdd + 0.5 V IMIO Maximum current into any Port pin ESD Electro static discharge voltage Human body model ESD LU Latch up current In accordance with JESD78 standard –25 – +50 mA 2000 – – V – – 200 mA Min Typ Max Units 0 +70 °C 0 +85 °C Operating Temperature Table 8. Operating Temperature Symbol Description TAC Ambient commercial temperature TJC Operational commercial die temperature[4] Conditions The temperature rise from ambient to junction is package specific. Refer the table “Thermal Impedances” on page 30. The user must limit the power consumption to comply with this requirement. Notes 3. Higher storage temperatures reduce data retention time. Recommended storage temperature is +25 °C ± 25 °C. Extended duration storage temperatures above 85 °C degrade reliability. 4. The temperature rise from ambient to junction is package specific. See Thermal Impedances on page 30. The user must limit the power consumption to comply with this requirement. Document Number: 001-12395 Rev. *N Page 17 of 38 CY7C604XX DC Electrical Characteristics DC Chip Level Specifications Table 9 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 9. DC Chip Level Specifications Symbol [5, 6] Description Conditions Min Typ Max Units 1.71 – 3.6 V Vdd Supply voltage See table titled DC POR and LVD Specifications on page 22. IDD24 Supply current, IMO = 24 MHz Conditions are Vdd 3.0 V, TA = 25 °C, CPU = 24 MHz No I2C/SPI – 2.9 4.0 mA IDD12 Supply current, IMO = 12 MHz Conditions are Vdd 3.0 V, TA = 25 °C, CPU = 12 MHz No I2C/SPI – 1.7 2.6 mA IDD6 Supply current, IMO = 6 MHz Conditions are Vdd 3.0 V, TA = 25 °C, CPU = 6 MHz No I2C/SPI – 1.2 1.8 mA ISB1 Standby current with POR, LVD, and Sleep timer Vdd 3.0V, TA = 25 °C, I/O regulator turned off – 1.1 1.5 A ISB0 Deep sleep current Vdd 3.0 V, TA = 25 °C, I/O regulator turned off – 0.1 – A Notes 5. When Vdd remains in the range from 1.71 V to 1.9 V for more than 50 µsec, the slew rate when moving from the 1.71 V to 1.9 V range to greater than 2 V must be slower than 1 V/500 µsec to avoid triggering POR. The only other restriction on slew rates for any other voltage range or transition is the SRPOWER_UP parameter. 6. If powering down in standby sleep mode, to properly detect and recover from a VDD brown out condition any of the following actions must be taken: ❐ Bring the device out of sleep before powering down. ❐ Assure that VDD falls below 100 mV before powering backup. ❐ Set the No Buzz bit in the OSC_CR0 register to keep the voltage monitoring circuit powered during sleep. ❐ Increase the buzz rate to assure that the falling edge of VDD is captured. The rate is configured through the PSSDC bits in the SLP_CFG register. For the referenced registers, refer to the enCoRe V Technical Reference Manual. In deep sleep mode, additional low power voltage monitoring circuitry allows VDD brown out conditions to be detected for edge rates slower than 1 V/ms. Document Number: 001-12395 Rev. *N Page 18 of 38 CY7C604XX DC General Purpose I/O Specifications The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 1.71 V to 3.6 V and 0 °C TA 70 °C. Typical parameters apply to 3.3 V at 25 °C. These are for design guidance only. Table 10. 3.0 V to 3.6 V DC GPIO Specifications Symbol Description Conditions Min Typ Max Units 4 5.6 8 k IOH < 10 A, maximum of 10 mA source current in all I/Os Vdd – 0.2 – – V High output voltage Port 2 or 3 pins IOH = 1 mA, maximum of 20 mA source current in all I/Os Vdd – 0.9 – – V VOH3 High output voltage Port 0 or 1 pins with LDO regulator disabled for Port 1 IOH < 10 A, maximum of 10 mA source current in all I/Os Vdd – 0.2 – – V VOH4 High output voltage Port 0 or 1 pins with LDO regulator disabled for Port 1 IOH = 5 mA, maximum of 20 mA source current in all I/Os Vdd – 0.9 – – V VOH5 IOH < 10 A, Vdd > 3.1 V, maximum of High output voltage Port 1 pins with LDO regulator enabled 4 I/Os all sourcing 5 mA for 3 V out 2.85 3.00 3.3 V VOH6 IOH = 5 mA, Vdd > 3.1 V, maximum of High output voltage Port 1 pins with LDO regulator enabled 20 mA source current in all I/Os for 3 V out 2.20 – – V VOH7 High output voltage IOH < 10 A, Vdd > 2.7 V, maximum of Port 1 pins with LDO enabled for 2.5 V 20 mA source current in all I/Os out 2.35 2.50 2.75 V VOH8 High output voltage IOH = 2 mA, Vdd > 2.7 V, maximum of Port 1 pins with LDO enabled for 2.5 V 20 mA source current in all I/Os out 1.90 – – V VOH9 IOH < 10 A, Vdd > 2.7 V, maximum of High output voltage Port 1 pins with LDO enabled for 1.8 V 20 mA source current in all I/Os out 1.60 1.80 2.1 V VOH10 High output voltage IOH = 1 mA, Vdd > 2.7 V, maximum of Port 1 pins with LDO enabled for 1.8 V 20 mA source current in all I/Os out 1.20 – – V VOL Low output voltage IOL = 25 mA, Vdd > 3.3 V, maximum of 60 mA sink current on even port pins (for example, P0[2] and P1[4]) and 60 mA sink current on odd port pins (for example, P0[3] and P1[5]) – – 0.75 V VIL Input low voltage – – – 0.80 V RPU Pull-up resistor – VOH1 High output voltage Port 2 or 3 pins VOH2 VIH Input high voltage – 2.00 – – V VH Input hysteresis voltage – – 80 – mV IIL Input leakage (absolute value) – – 0.001 1 µA CPIN Pin capacitance Package and pin dependent Temp = 25 °C 0.5 1.7 5 pF Document Number: 001-12395 Rev. *N Page 19 of 38 CY7C604XX Table 11. 2.4 V to 3.0 V DC GPIO Specifications Symbol RPU VOH1 Conditions – IOH < 10 A, maximum of 10 mA source current in all I/Os IOH = 0.2 mA, maximum of 10 mA source current in all I/Os IOH < 10 A, maximum of 10 mA source current in all I/Os Min 4 Vdd – 0.2 Typ 5.6 – Max 8 – Units k V Vdd – 0.4 – – V Vdd – 0.2 – – V IOH = 2 mA, maximum of 10 mA source current in all I/Os Vdd – 0.5 – – V 1.50 1.80 2.10 V 1.20 – – V VOL Description Pull-up resistor High output voltage Port 2 or 3 pins High output voltage Port 2 or 3 pins High output voltage Port 0 or 1 pins with LDO regulator disabled for Port 1 High output voltage Port 0 or 1 pins with LDO regulator disabled for Port 1 High output voltage Port 1 pins with LDO enabled for 1.8 V out High output voltage Port 1 pins with LDO enabled for 1.8 V out Low output voltage – – 0.75 V VIL Input low voltage – 0.72 V Input high voltage 1.4 – – V VH Input hysteresis voltage – 80 – mV IIL Input leakage (absolute value) – – – – – VIH – 0.001 1 µA CPIN Capacitive load on pins 0.5 1.7 5 pF Min Typ Max Units 4 5.6 8 k VOH2 VOH3 VOH4 VOH5A VOH6A IOH < 10 A, Vdd > 2.4V, maximum of 20 mA source current in all I/Os. IOH = 1 mA, Vdd > 2.4V, maximum of 20 mA source current in all I/Os IOL = 10 mA, maximum of 30 mA sink current on even port pins (for example, P0[2] and P1[4]) and 30 mA sink current on odd port pins (for example, P0[3] and P1[5]) Package and pin dependent Temp = 25 °C Table 12. 1.71 V to 2.4 V DC GPIO Specifications Symbol Description Conditions RPU Pull-up resistor – VOH1 High output voltage Port 2 or 3 pins IOH = 10 A, maximum of 10 mA source current in all I/Os Vdd – 0.2 – – V VOH2 High output voltage Port 2 or 3 pins IOH = 0.5 mA, maximum of 10 mA source current in all I/Os Vdd – 0.5 – – V VOH3 High output voltage Port 0 or 1 pins with LDO regulator disabled for Port 1 IOH = 100 A, maximum of 10 mA source current in all I/Os Vdd – 0.2 – – V VOH4 High output voltage Port 0 or 1 pins with LDO regulator disabled for Port 1 IOH = 2 mA, maximum of 10 mA source current in all I/Os Vdd – 0.5 – – V VOL Low output voltage IOL = 5 mA, maximum of 20 mA sink current on even port pins (for example, P0[2] and P1[4]) and 30 mA sink current on odd port pins (for example, P0[3] and P1[5]) – – 0.4 V VIL Input low voltage – – – 0.3 x Vdd V VIH Input high voltage – 0.65 x Vdd – – V VH Input hysteresis voltage – – 80 – mV IIL Input leakage (absolute value) – – 0.001 1 µA CPIN Capacitive load on pins Package and pin dependent. Temp = 25 ° 0.5 1.7 5 pF Document Number: 001-12395 Rev. *N Page 20 of 38 CY7C604XX ADC Electrical Specifications Table 13.ADC User Module Electrical Specifications Symbol Description Conditions Min Typ Max Units 0 – VREFADC V – 5 pF 1/(500fF × data clock) 1/(400fF × data clock) 1/(300fF × data clock) Input VIN Input voltage range CIIN Input capacitance – RIN Input resistance Equivalent switched cap input resistance for 8-, 9-, or 10-bit resolution ADC reference voltage – 1.14 – 1.26 V FCLK Data clock Source is chip’s internal main oscillator. See AC Chip-Level Specifications for accuracy 2.25 – 6 MHz S8 8-bit sample rate Data Clock set to 6 MHz. Sample Rate = 0.001/ (2^Resolution/Data Clock) – – – ksps S10 10-bit sample rate Data Clock set to 6 MHz. Sample Rate = 0.001/ (2^Resolution/Data Clock) – 5.859 – ksps RES Resolution Can be set to 8-, 9-, or 10-bit 8 – 10 bits DNL Differential nonlinearity – –1 – +2 LSB INL Integral nonlinearity – –2 – +2 LSB EOffset Offset error – Reference VREFADC Conversion Rate DC Accuracy 8-bit resolution 0 3.2 19.2 LSB 10-bit resolution 0 12.8 76.8 LSB Gain error For any resolution –5 – +5 %FSR IADC Operating current – – 2.1 2.6 mA PSRR Power supply rejection ratio PSRR (Vdd > 3.0 V) – 24 – dB PSRR (Vdd < 3.0 V) – 30 – dB Egain Power Document Number: 001-12395 Rev. *N Page 21 of 38 CY7C604XX DC POR and LVD Specifications Table 14 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 14. DC POR and LVD Specifications Symbol Description VPPOR0 VPPOR1 VPPOR2 VPPOR3 Vdd Value for PPOR Trip PORLEV[1:0] = 00b, HPOR = 0 PORLEV[1:0] = 00b, HPOR = 1 PORLEV[1:0] = 01b, HPOR = 1 PORLEV[1:0] = 10b, HPOR = 1 VLVD0 VLVD1 VLVD2 VLVD3 VLVD4 VLVD5 VLVD6 Vdd Value for LVD Trip VM[2:0] = 000b(8) VM[2:0] = 001b(9) VM[2:0] = 010b(10) VM[2:0] = 011b VM[2:0] = 100b VM[2:0] = 101b VM[2:0] = 110b(11) Min Typ Max Units 1.61 1.66 2.36 2.60 2.82 1.71 2.41 2.66 2.95 V V V V 2.40 2.64 2.85 2.95 3.06 1.84 1.75 2.45 2.71 2.92 3.02 3.13 1.9 1.8 2.51 2.78 2.99 3.09 3.20 2.32 1.84 V V V V V V V (7) DC Programming Specifications Table 15 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 15. DC Programming Specifications Symbol VddIWRITE IDDP VILP VIHP IILP IIHP VOLP VOHP FlashENPB FlashDR Description Supply voltage for flash write operations Supply current during programming or verify Input low voltage during programming or verify Input high voltage during programming or verify Input current when applying Vilp to P1[0] or P1[1] during programming or verify(12) Input current when applying Vihp to P1[0] or P1[1] during programming or verify(12) Output low voltage during programming or verify Output high voltage during programming or verify Flash write endurance(14) Flash data retention(15) Min 1.71 – – 1.71 – Typ – 5 – – – VddIWRITE +0.3 0.2 Units V mA V V mA – – 1.5 mA – – – – 20 Vss + 0.75 VddIWRITE – – V V Cycles Years VddIWRITE - 0.9 V 50,000 10 Max 5.25 25 VIL[11] Notes 7. Vdd must be greater than or equal to 1.71 V during startup, reset from the XRES pin, or reset from watchdog. 8. Always greater than 50 mV above VPPOR1 for falling supply. 9. Always greater than 50 mV above VPPOR2 for falling supply. 10. Always greater than 50 mV above VPPOR3 for falling supply. 11. Always greater than 50 mV above VPPOR0 voltage for falling supply. 12. Driving internal pull-down resistor. 13. See appropriate DC General Purpose I/O Specifications table. 14. Erase/write cycles per block. 15. Following maximum Flash write cycles at Tamb = 55C and Tj = 70C. Document Number: 001-12395 Rev. *N Page 22 of 38 CY7C604XX AC Electrical Characteristics AC Chip Level Specifications Table 16 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 16. AC Chip Level Specifications Symbol FCPU F32K1 Description Processing frequency Internal low speed oscillator frequency F32K_U Internal low speed oscillator (ILO) untrimmed frequency) F32K2 Internal low speed oscillator frequency FIMO24 Internal main oscillator stability for 24 MHz ± 5% FIMO12 Internal main oscillator stability for 12 MHz FIMO6 Internal main oscillator stability for 6 MHz DCIMO Duty Cycle of IMO DCILO Internal low speed oscillator duty cycle SRPOWER_UP Power supply slew rate TXRST External reset pulse width at power up TXRST2 External reset pulse width after power up[16] Conditions Min 5.7 19 Typ – 32 Max 25.2 50 Units MHz kHz 13 32 82 kHz 13 32 82 kHz – 22.8 24 25.2 MHz – 11.4 12 12.6 MHz – 5.7 6.0 6.3 MHz – – 40 40 50 50 60 60 % % – After supply voltage is valid – 1 – – 250 – V/ms ms Applies after part has booted 10 – – s Trimmed for 3.3 V operation using factory trim values – Untrimmed Note 16. The minimum required XRES pulse length is longer when programming the device (see Table Document Number: 001-12395 Rev. *N 19 on page 25). Page 23 of 38 CY7C604XX AC General Purpose IO Specifications Table 17 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 17. AC GPIO Specifications Symbol FGPIO Description GPIO operating frequency Conditions Normal strong mode, port 0, 1 Normal strong mode, Port 2, 3 Rise time, strong mode, cload = 50 pF Ports 2 or 3 TRise23L Rise time, strong mode low supply, cload = 50 pF Ports 2 or 3 TRise01 Rise time, strong mode, cload = 50 pF Ports 0 or 1 TRise01L Rise time, strong mode low supply, cload = 50 pF Ports 0 or 1 TFall Fall time, strong mode, cload = 50 pF, All Ports TFallL Fall time, strong mode low supply, cload = 50 pF, all ports TRise23 Min 0 Typ – Max 6 MHz for 1.71 V < Vdd < 2.4 V 0 – 0 – 12 MHz for 2.4 V < Vdd < 3.6 V 3 MHz for 1.71 V < Vdd < 2.4 V Units MHz MHz Vdd = 3.0 to 3.6 V, 10% – 90% 15 – 6 MHz for 3.0 V< Vdd < 3.6 V 80 Vdd = 1.71 to 3.0 V, 10% – 90% 15 – 80 ns Vdd = 3.0 to 3.6 V, 10% – 90% LDO enabled or disabled 10 – 50 ns Vdd = 1.71 to 3.0 V, 10% – 90% LDO enabled or disabled 15 – – 80 ns Vdd = 3.0 to 3.6 V, 10% – 90% 10 – 50 ns Vdd = 1.71 to 3.0 V, 10% - 90% 10 – 70 ns ns Figure 10. GPIO Timing Diagram 90% GPIO Pin Output Voltage 10% TRise23 TRise01 Document Number: 001-12395 Rev. *N TFall Page 24 of 38 CY7C604XX AC External Clock Specifications Table 18 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 18. AC External Clock Specifications Symbol FOSCEXT – – – Description Frequency High period Low period Power up IMO to switch Conditions – – – – Min 0.750 20.6 20.6 150 Typ – – – – Max 25.2 5300 – – Units MHz ns ns s AC Programming Specifications Table 19 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 19. AC Programming Specifications Symbol TRSCLK TFSCLK TSSCLK THSCLK FSCLK TERASEB TWRITE TDSCLK1 TDSCLK2 TXRST3 Description Rise time of SCLK Fall time of SCLK Data set up time to falling edge of SCLK Data hold time from falling edge of SCLK Frequency of SCLK Flash erase time (block) Flash block write time Data out delay from falling edge of SCLK Data out delay from falling edge of SCLK External reset pulse width after power up Conditions – – – Min 1 1 40 Typ – – – Max 20 20 – Units ns ns ns – 40 – – ns – – – 3.0 V < Vdd < 3.6 V 0 – – – – – – – 8 18 25 85 MHz ms ms ns 1.71 V < Vdd < 3.0 V – – 130 ns 263 – – s Required to enter programming mode when coming out of sleep Figure 11. Timing Diagram - AC Programming Cycle Document Number: 001-12395 Rev. *N Page 25 of 38 CY7C604XX AC I2C Specifications Table 20 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 20. AC Characteristics of the I2C SDA and SCL Pins Symbol FSCLI2C THDSTAI2C TLOWI2C THIGHI2C TSUSTAI2C THDDATI2C TSUDATI2C TSUSTOI2C TBUFI2C TSPI2C Description SCL clock frequency Hold time (repeated) START condition. After this period, the first clock pulse is generated. LOW period of the SCL clock HIGH period of the SCL clock Setup Time for a Repeated START condition Data hold time Data setup time Setup time for STOP condition Bus free time between a STOP and START condition Pulse width of spikes are suppressed by the input filter Standard Mode Min Max 0 100 4.0 – 4.7 4.0 4.7 0 250 4.0 4.7 – – – – – – – – – Fast Mode Min Max 0 400 0.6 – 1.3 0.6 0.6 0 100(17) 0.6 1.3 0 – – – – – – – 50 Units kHz s s s s s ns s s ns Figure 12. Definition of Timing for Fast/Standard Mode on the I2C Bus SDA TLOWI2C TSUDATI2C THDSTAI2C TSPI2C TBUFI2C SCL S THDSTAI2C THDDATI2C THIGHI2C TSUSTAI2C Sr TSUSTOI2C P S Note 17. A fast mode I2C bus device can be used in a standard mode I2C bus system, but the requirement tSU;DAT Š 250 ns must then be met. This is automatically the case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the standard mode I2C bus specification) before the SCL line is released. Document Number: 001-12395 Rev. *N Page 26 of 38 CY7C604XX Table 21. SPI Master AC Specifications Symbol Description Conditions FSCLK SCLK clock frequency VDD 2.4 V VDD < 2.4 V Min Typ Max Units – – 6 3 MHz DC SCLK duty cycle – – 50 – % TSETUP MISO to SCLK setup time VDD 2.4 V VDD < 2.4 V 60 100 – – ns THOLD SCLK to MISO hold time – 40 – – ns TOUT_VAL SCLK to MOSI valid time – – – 40 ns TOUT_HIGH MOSI high time – 40 – – ns Min Typ Max Units – – 12 6 MHz Table 22.SPI Slave AC Specifications Symbol Description Conditions FSCLK SCLK clock frequency VDD 2.4 V VDD < 2.4 V TLOW SCLK low time – 41.67 – – ns THIGH SCLK high time – 41.67 – – ns TSETUP MOSI to SCLK setup time – 30 – – ns THOLD SCLK to MOSI hold time – 50 – – ns TSS_MISO SS high to MISO valid – – – 153 ns TSCLK_MISO SCLK to MISO valid – – – 125 ns TSS_HIGH SS high time – – – 50 ns TSS_CLK Time from SS low to first SCLK – 2/SCLK – – ns TCLK_SS Time from last SCLK to SS high – 2/SCLK – – ns Document Number: 001-12395 Rev. *N Page 27 of 38 CY7C604XX Package Diagram This section illustrates the packaging specifications for the enCoRe V LV device, along with the thermal impedances for each package. Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of the enCoRe V LV emulation tools and their dimensions, refer to the development kit. Packaging Dimensions Figure 13. 16-Pin (3 x 3 mm) QFN (001-09116) 001-09116 *H Document Number: 001-12395 Rev. *N Page 28 of 38 CY7C604XX Figure 14. 32-Pin (5 x 5 x 0.55 mm) QFN (001-42168) 001-42168 *E Figure 15. 48-Pin QFN (7 x 7x 0.90 mm) Sawn (001-13191) 001-13191 *G Document Number: 001-12395 Rev. *N Page 29 of 38 CY7C604XX Package Handling Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving the factory. A label on the package has details about the actual bake temperature and the minimum bake time to remove this moisture. The maximum bake time is the aggregate time that the parts exposed to the bake temperature. Exceeding this exposure may degrade device reliability. Table 23.Package Handling Parameter Description TBAKETEMP Bake Temperature TBAKETIME Bake Time Minimum Typical Maximum Unit 125 See package label °C 72 hours – See package label – Thermal Impedances Typical JA (18) 32.69 °C/W 19.51 °C/W 17.68 °C/W Package 16 QFN 32 QFN(19) 48 QFN(19) Capacitance on Crystal Pins Table 24. Typical Package Capacitance on Crystal Pins Package Package Capacitance 32 QFN 3.2 pF 48 QFN 3.3 pF Solder Reflow Peak Temperature Following is the minimum solder reflow peak temperature to achieve good solderability. Package Minimum Peak Temperature(20) Maximum Peak Temperature 16 QFN 240 °C 260 °C 32 QFN 240 °C 260 °C 48 QFN 240 °C 260 °C Notes 18. TJ = TA + Power x JA. 19. To achieve the thermal impedance specified for the package, solder the center thermal pad to the PCB ground plane. 20. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5 °C with Sn-Pb or 245 ± 5 °C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications. Document Number: 001-12395 Rev. *N Page 30 of 38 CY7C604XX Ordering Information Ordering Code Flash SRAM No. of GPIOs Target Applications 8K 1K 13 Feature-rich wireless mouse CY7C64013-16LKXCT 16-Pin QFN - (Tape and Reel) (3X3 mm) 8K 1K 13 Feature-rich wireless mouse CY7C60445-32LQXC 16 K 1K 28 Feature-rich wireless mouse CY7C60445-32LQXCT 32-Pin QFN - (Tape and Reel) (5x5x0.55 mm) 16 K 1K 28 Feature-rich wireless mouse CY7C60455-48LTXC 48-Pin QFN (7x7x0.9 mm) 16 K 1K 36 Mid-tier wireless keyboard CY7C60455-48LTXCT 48-Pin QFN - (Tape and Reel) (7x7x0.9 mm) 16 K 1K 36 Mid-tier wireless keyboard CY7C60456-48LTXC 48-Pin QFN (7x7x0.9 mm) 32 K 2K 36 Feature-rich wireless keyboard CY7C60456-48LTXCT 48-Pin QFN - (Tape and Reel) (7x7x0.9 mm) 32 K 2K 36 Feature-rich wireless keyboard CY7C60413-16LKXC Package Information 16-Pin QFN (3x3 mm) 32-Pin QFN (5x5x0.55 mm) Ordering Code Definitions CY 7 C XXXXX XX X CT Temperature Grade: C = Commercial, I = Industrial Pb-free Package Type Family Technology: CMOS Marketing Code: 7 = SRAM Company ID: CY = Cypress Document Number: 001-12395 Rev. *N Page 31 of 38 CY7C604XX Acronyms Document Conventions The following table lists the acronyms that are used in this document. Units of Measure Acronym Description The following table lists the units of measure that are used in this document. API application programming interface CPU central processing unit o degree Celsius GPIO general purpose IO dB decibels ICE in-circuit emulator fF femto farad ILO internal low speed oscillator Hz hertz IMO internal main oscillator KB 1024 bytes IO input/output Kbit 1024 bits LSb least significant bit kHz kilohertz LVD low voltage detect k kilohm MSb most significant bit MHz megahertz POR power on reset M megaohm PPOR precision power on reset A microampere PSoC Programmable System-on-Chip F microfarad SLIMO slow IMO H microhenry SRAM static random access memory s microsecond V microvolts Symbol C Vrms microvolts root-mean-square W microwatts mA milli-ampere ms milli-second mV milli-volts nA nanoampere ns nanosecond nV nanovolts ohm pA picoampere pF picofarad pp peak-to-peak ppm Document Number: 001-12395 Rev. *N Unit of Measure parts per million ps picosecond sps samples per second sigma: one standard deviation V volts Page 32 of 38 CY7C604XX Appendix: Errata Document for enCoRe™ V – CY7C643xx and enCoRe™ V LV – CY7C604xx This section describes the errata for the enCoRe V – CY7C643xx and enCoRe V LV – CY7C604xx. Details include errata trigger conditions, scope of impact, available workarounds, and silicon revision applicability. Contact your local Cypress Sales Representative if you have questions. CY7C643xx and CY7C604xx Errata Summary The following Errata item applies to the CY7C643xx and CY7C604xx data sheets. 1. Latch up susceptibility when maximum I/O sink current exceeded ■ PROBLEM DEFINITION P1[3], P1[6], and P1[7] pins are susceptible to latch up when the I/O sink current exceeds 25 mA per pin on these pins. ■ PARAMETERS AFFECTED LU – Latch up current. Per JESD78A, the maximum allowable latch up current per pin is 100 mA. Cypress internal specification is 200 mA latch up current limit. ■ TRIGGER CONDITIONS Latch up occurs when both the following conditions are met: A. The offending I/O is externally connected to a voltage higher than the I/O high state, causing a current to flow into the pin that exceeds 25 mA. B. A Port1 I/O (P1[1], P1[4], and P1[5] respectively) adjacent to the offending I/O is connected to a voltage lower than the I/O low state. This causes a signal that drops below Vss (signal undershoot) and a current greater than 200 mA to flow out of the pin. ■ SCOPE OF IMPACT The trigger conditions outlined in this item exceed the maximum ratings specified in the CY7C643xx and CY7C604xx data sheets. ■ WORKAROUND Add a series resistor > 300 to P1[3], P1[6], and P1[7] pins to restrict current to within latch up limits. ■ FIX STATUS This issue will be corrected in the next new silicon revision. The following errata item applies only to the CY7C643xx data sheet. 2. Does not meet USB 2.0 specification for D+ and D- rise/fall matching when supply voltage is under 3.3 V ■ PROBLEM DEFINITION Rising to falling rate matching of the USB D+ and D- lines has a corner case at lower supply voltages, such as those under 3.3 V. ■ PARAMETERS AFFECTED Rising to falling rate matching of the USB data lines. ■ TRIGGER CONDITION(S) Operating the VCC supply voltage at the low end of the chip’s specification (under 3.3 V) may cause a mismatch in the rising to falling rate. ■ SCOPE OF IMPACT This condition does not affect USB communications but could cause corner case issues with USB lines’ rise/fall matching specification. Signal integrity tests were run using the Cypress development kit and excellent eye was observed with supply voltage of 3.15 V. Document Number: 001-12395 Rev. *N Page 33 of 38 CY7C604XX Figure 16. Eye Diagram ■ ■ WORKAROUND Avoid the trigger condition by using lower tolerance voltage regulators. FIX STATUS This issue will not be corrected in the next new silicon revision. Document Number: 001-12395 Rev. *N Page 34 of 38 CY7C604XX Document History Page Document Title: CY7C604XX, enCoRe™ V Low Voltage Microcontroller Document Number: 001-12395 Rev. ECN No. Orig. of Change Submission Date ** 626516 TYJ See ECN New data sheet *A 735721 TYJ / ARI See ECN Added new block diagram, replaced TBDs, corrected values, updated pinout information, changed part number to reflect new specifications. *B 1120504 ARI See ECN Corrected the description to pin 29 on Table 1, the Typ/Max values for ISB0 on the DC chip-level specifications, and the Min voltage value for VddIWRITE in the DC Programming Specifications table. Corrected Flash Write Endurance minimum value in the DC Programming Specifications table. Corrected the Flash Erase Time max value and the Flash Block Write Time max value in the AC Programming Specifications table. Implemented new latest template. *C 1225864 AESA / ARI See ECN Corrected the description to pin 13, 29 on Table 1 and 22,44 on Table 2. Added sections Register Reference, Register Conventions and Register Mapping Tables. Corrected Max values on the DC Chip-Level Specifications table. *D 1446763 AESA See ECN Changed TERASEB parameter, max value to 18ms in Table 13, AC Programming Specification. *E 1639963 AESA See ECN Post to www.cypress.com *F 2138889 TYJ / PYRS See ECN Updated Ordering Code table: - Ordering code changed for 32-QFN package: From -32LKXC to -32LTXC - Added a new package type – “LTXC” for 48-QFN - Included Tape and Reel ordering code for 32-QFN and 48-QFN packages Changed active current values at 24, 12 and 6MHz in table “DC Chip-Level Specifications” - IDD24: 2.15 to 3.1mA - IDD12: 1.45 to 2.0mA - IDD6: 1.1 to 1.5mA Added information on using P1[0] and P1[1] as the I2C interface during POR or reset events Document Number: 001-12395 Rev. *N Description of Change Page 35 of 38 CY7C604XX Document History Page (continued) Document Title: CY7C604XX, enCoRe™ V Low Voltage Microcontroller Document Number: 001-12395 Rev. ECN No. Orig. of Change Submission Date Description of Change *G 2583853 TYJ / PYRS / HMT 10/10/08 Converted from Preliminary to Final ADC resolution changed from 10-bit to 8-bit On Page1, SPI Master and Slave – speeds changed Rephrased battery monitoring clause in page 1 to include “with external components” Included ADC specifications table Voh5, Voh7, Voh9 specs changed Flash data retention – condition added to Note [15] Input leakage spec changed to 25 nA max Under AC Char, Frequency accuracy of ILO corrected GPIO rise time for ports 0,1 and ports 2,3 made common AC Programming specifications updated Included AC Programming cycle timing diagram AC SPI specification updated Spec change for 32-QFN package Input Leakage Current maximum value changed to 1 uA Maximum specification for VOH5A parameter changed from 2.0 to 2.1V Minimum voltages for FSPIM and FSPIS specifications changed from 1.8V to 1.71V (Table 18) Updated VOHV parameter in Table 13 Updated Thermal impedance values for the packages - Table 20. Update Development Tools, add Designing with PSoC Designer. Edit, fix links and table format. Update TMs. Update maximum data in Table 12. DC POR and LVD Specifications. *H 2653717 DVJA / PYRS 02/04/09 Changed master page from CY7C60445, CY7C6045X to CY7C604XX. Updated Features, Functional Overview, Development Tools, and Designing with PSoC Designer sections. Removed ‘GUI - graphical user interface’ from Document Conventions acronym table. Added Figure 1 and Table 1 (16-pin part information) to Pin Configurations section. Removed ‘O - Only a read/write register or bits’ in Table 4 Edited Table 8: removed 10-bit resolution information and corrected units column. Added Figure 9 (16-pin part information) to Package Dimensions section. Added ‘Package Handling’ section. Added 8K part ‘CY7C60413-16LKXC’ to Ordering Information. *I 2714694 DVJA / AESA 06/04/2009 Updated Block Diagram. Added 10-bit ADC, SPI, and I2C Slave sections. ADC Resolution changed from 8-bit to 10-bit Updated Figure 9: 5.7 MHz minimum CPU frequency Updated Table 15 AC Chip Level Specs Figure 8: Changed minimum CPU Frequency from 750 kHz to 5.7 MHz *J 2764460 DVJA / AESA 09/15/2009 Added footnote #5 to Table 10: DC Chip Level Specs Added F32K2 (Untrimmed) spec to Table 17: AC Chip level Specs Changed TRAMP spec to SRPOWER_UP in Table 17: AC Chip Level Specs Changed Table 14: ADC Specs Added Table 25: Typical Package Capacitance on Crystal Pins *K 2811903 DVJA 11/23/2009 Added Note 6 on page 18. Changed VIHP in Table 15 on page 22 *L 3075921 NXZ 11/01/2010 Added Ordering Code Definition. *M 3283876 DIVA 06/15/2011 Updated Getting Started, Development Tools, and Designing with PSoC Designer. Document Number: 001-12395 Rev. *N Page 36 of 38 CY7C604XX Document History Page (continued) Document Title: CY7C604XX, enCoRe™ V Low Voltage Microcontroller Document Number: 001-12395 Rev. ECN No. Orig. of Change Submission Date *N 3980412 CSAI 04/24/2013 Description of Change Updated Packaging Dimensions: spec 001-09116 – Changed revision from *E to *H. spec 001-42168 – Changed revision from *D to *E. spec 001-13191 – Changed revision from *E to *G. Added Appendix: Errata Document for enCoRe™ V – CY7C643xx and enCoRe™ V LV – CY7C604xx. Document Number: 001-12395 Rev. *N Page 37 of 38 CY7C604XX Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. Products Automotive Clocks & Buffers Interface Lighting & Power Control PSoC Solutions cypress.com/go/automotive cypress.com/go/clocks psoc.cypress.com/solutions cypress.com/go/interface PSoC 1 | PSoC 3 | PSoC 5 cypress.com/go/powerpsoc cypress.com/go/plc Memory Optical & Image Sensing PSoC Touch Sensing USB Controllers Wireless/RF cypress.com/go/memory cypress.com/go/image cypress.com/go/psoc cypress.com/go/touch cypress.com/go/USB cypress.com/go/wireless © Cypress Semiconductor Corporation, 2006-2013. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 001-12395 Rev. *N Revised April 24, 2013 ® Page 38 of 38 enCoRe™, PSoC Designer™ and Programmable System-on-Chip™ are trademarks and PSoC is a registered trademark of Cypress Semiconductor Corporation. All other trademarks or registered trademarks referenced herein are property of the respective corporations. Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. All products and company names mentioned in this document may be the trademarks of their respective holders.