CYPRESS CYII5FM1300AB_09

IBIS5-B-1300 CYII5FM1300AB
1.3 MP CMOS Image Sensor
Description
Table 1.
The IBIS5-B-1300 is a solid state CMOS image sensor that
integrates the functionality of complete analog image acquisition,
digitizer, and digital signal processing system on a single chip.
This 1.3-mega pixel (1280 x 1024) CMOS active pixel sensor
dedicated to industrial vision applications features both rolling
and snapshot (or global) shutter. Full frame readout time is 36 ms
(max. 27.5 fps), and readout speed are boosted by windowed
region of interest (ROI) readout. Another feature includes the
double and multiples slope functionality to capture high dynamic
range scenes. The sensor is available in a Monochrome version
or Bayer (RGB) patterned color filter array.
User programmable row and column start/stop positions allow
windowing down to a 2x1 pixel window for digital zoom. Sub
sampling or viewfinder mode reduces resolution while
maintaining the constant field of view and an increased frame
rate. An on-chip analog signal pipeline processes the analog
video output of the pixel array. Double sampling (DS) eliminates
the fixed pattern noise. The programmable gain and offset
amplifier maps the signal swing to the ADC input range. A 10-bit
ADC converts the analog data to a 10-bit digital word stream. The
sensor uses a 2-wire, I2C™-compatible interface, a 3-wire serial
parallel (SPI) interface, or a 16-bit parallel interface. It operates
with a 3.3V power supply and requires only one master clock for
operation up to 40 MHz. It is housed in an 84-pin ceramic LCC
package.
Key Performance Parameters
Parameter
1280 (H) x 1024 (V)
Pixel size
6.7 μm x 6.7 μm
Optical format
2/3 inch
Shutter type
Snapshot (global) shutter
rolling shutter
Maximum data rate /
master clock
40 MPS / 40 MHz
Frame rate
27 fps (1280 x 1024)
106 fps (640 x 480)
ADC resolution
10-bit, on-chip
Sensitivity (@ 650 nm)
715 V.m2/W.s
8.40 V/lux.s
S/N ratio
64 dB
Full well charge
62.500 e–
Temporal noise
40 e–
Dark current
7.22 mV/s
High dynamic range
Multiple slope
Supply voltage
Analog: 3.0V–4.5V
Digital: 3.3V
I/O: 3.3V
Power consumption
175 mW
Operating temperature
–30°C to +65°C
Color filter array
Mono
RGB Bayer pattern
Packaging
84-pins LCC
Applications
■
Machine vision
■
Inspection
■
Robotics
■
Traffic monitoring
Typical Value
Active pixels
IBIS5-B-1300
Cypress Semiconductor Corporation
Document #: 38-05710 Rev. *E
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised October 14, 2009
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IBIS5-B-1300 CYII5FM1300AB
Ordering Information
Marketing Part Number
Description
CYII5SM1300AB-QDC
Mono with Glass
CYII5SM1300AB-QWC
Mono without Glass
Package
CYII5SC1300AB-QDC
Color with Glass
CYII5FM1300AB-QDC
Mono with thicker Epi with Glass
84 pin LCC
CYII5FM1300AB-QWC
Mono with thicker Epi without Glass
CYII5SM1300-EVAL
Mono Demo Kit
CYII5SC1300-EVAL
Color Demo Kit
CYII5FM1300-EVAL
Mono with thicker Epi Demo Kit
Demo kit
Architecture and Operation
This section presents detailed information about the most important sensor blocks.
Floor Plan
Figure 1. Block Diagram of the IBIS5-B-1300 Image Sensor
Sensor
Imager core
Reset
C
Pixel
Y-left
addressing
Select
Sample
Y-right
addressing
Column output
Pixel core
Sequencer
Column amplifiers
Analog multiplexer
System clock
40 MHz
Output
amplifier
External
connection
X-addressing
Figure 1 shows the architecture of the IBIS5-B-1300 image
sensor. It consists basically of a pixel array, one X- and two
Y-addressing registers for the readout in X- and Y-direction,
column amplifiers that correct for the fixed pattern noise, an
analog multiplexer, and an analog output amplifier.
Use the left Y-addressing register for readout operation. Use the
right Y-addressing register for reset of pixel rows. In multiple
slope synchronous shutter mode, the right Y-addressing register
resets the whole pixel core with a lowered reset voltage. In rolling
curtain shutter mode, use the right Y-addressing register for the
Document #: 38-05710 Rev. *E
ADC
reset pointer in single and double slope operation to reset one
pixel row.
The on-chip sequencer generates most of the signals for the
image core. Some basic signals (like start/stop integration, line
and frame sync signals, and others.) are generated externally.
A 10-bit ADC is implemented on chip but electrically isolated
from the image core. You must route the analog pixel output to
the analog ADC input on the outside.
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IBIS5-B-1300 CYII5FM1300AB
Pixel
A description of the pixel architecture and the color filter array
follows.
Green1 pixels are located on a blue-green row, green2 pixels are
located on a green-red row. Figure 4 shows the response of the
color filter array as function of the wavelength. Note that this
response curve includes the optical cross talk of the pixels.
Architecture
Figure 3. Color Filter Arrangement on the Pixels
The pixel architecture used in the IBIS5-B-1300 is a 4-transistor
pixel as shown in Figure 2. Implement the pixel using the high fill
factor technique as patented by Cypress (US patent No.
6,225,670 and others). The 4T-pixel features a snapshot shutter
but can also emulate the 3T-pixel by continuously closing
sampling switch M2. Using M4 as a global sample transistor for
all pixels enables the snapshot shutter mode. Due to this pixel
architecture, integration during read out is not possible in
synchronous shutter mode.
Red
Green2
Green1
Blue
Red
Green2
Red
Green2
Green1
Blue
Green1
Blue
Figure 2. Architecture of the 4T-pixel
M1
reset
C
M2
M3
sample
Pixel 0,0
mux
Frame Rate
M4
column
output
Color Filter Array
The IBIS5-B-1300 is also processed with a Bayer RGB color
pattern. Pixel (0,0) has a green filter and is situated on a
green-blue row. Green1 and green2 have a slightly different
spectral response due to cross talk from neighboring pixels.
The pixel rate for this sensor is high enough to support a frame
rate of >100 Hz for a window size of 640 x 480 pixels (VGA
format). Taking into account a row blanking time of 3.5 µs (as
baseline, see also “Internal clock granularities (bits 4, 5, 6 and
7).” on page 14), this requires a minimum pixel rate of nearly
40 MHz. The final bandwidth of the column amplifiers, output
stage, and others is determined by external bias resistors. With
a nominal pixel rate of 40 MHz, a full frame rate of a little more
than 27 frames per second is obtained.
Figure 4. Color Filter Response
Wavelength (nm)
Document #: 38-05710 Rev. *E
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IBIS5-B-1300 CYII5FM1300AB
The frame period of the IBIS5-B-1300 sensor depends on the
shutter type.
Rolling Shutter
=> Frame period = (Nr. Lines * (RBT + pixel period * Nr. Pixels))
with:
Nr. Lines
Nr. Pixels
RBT
Pixel period
Number of lines read out each frame (Y)
Number of pixels read out each line (X)
Row blanking time = 3.5 µs (typical)
1/40 MHz = 25 ns
Example Read out time of the full resolution at nominal speed
(40-MHz pixel rate):
=> Frame period = (1024 * (3.5 µs + 25 ns * 1280)) = 36.4 ms
=> 27.5 fps
Snapshot shutter
=> Frame period = Tint + Tread out
= Tint + (Nr. Lines * (RBT + pixel period * Nr. Pixels))
with:
Tint
Nr. Lines
Nr. Pixels
RBT
Integration (exposure) time
Number of lines read out each frame (Y)
Number of pixels read out each line (X)
Row blanking time = 3.5 µs (typical)
Document #: 38-05710 Rev. *E
Pixel period 1/40 MHz = 25 ns
Example Read out time of the full resolution at nominal speed
(40 MHz pixel rate) with an integration time of 1 ms:
=> Frame period = 1 ms + (1024 * (3.5 µs + 25 ns * 1280)) =
37.4 ms => 26.8 fps
Region-Of-Interest (ROI) Read Out
Windowing is easily achieved by uploading the starting point of
the X- and Y-shift registers in the sensor registers using the
various interfaces. This downloaded starting point initiates the
shift register in the X- and Y-direction triggered by the Y_START
(initiates the Y-shift register) and the Y_CLK (initiates the X-shift
register) pulse. The minimum step size for the x-address is two
(only even start addresses are chosen) and one for the
Y-address (every line is addressable). The frame rate increases
almost linearly when fewer pixels are read out. Table 2 gives an
overview of the achievable frame rates (in rolling shutter mode)
with various ROI dimensions.
Table 2.
Frame Rate vs. Resolution
Image
Resolution
(X*Y)
1280 x 1024
Frame
Frame Rate Readout
Time
[frames/s]
[ms]
27
36
Comment
Full resolution.
640 x 480
100
10
ROI read out.
100 x 100
1657
0.6
ROI read out.
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Image Core Operation
Image Core Operation and Signalling
Figure 5 is a functional representation of the image core without
sub-sampling and column/row swapping circuits. Most of the
signals involved are not available from the outside because they
are generated by the X-sequencer and SS-sequencer blocks.
The integration of the pixels is controlled by internal signals such
as reset, sample, and hold which are generated by the on-chip
SS-sequencer that is controlled with the external signals
SS_START and SS_STOP. Reading out the pixel array starts
by applying a Y_START together with a Y_CLOCK signal; internally this is followed by a calibration sequence to calibrate the
output amplifiers (during the row blanking time). Signals
necessary to do this calibration are generated by the on-chip
X-sequencer. This calibration sequence takes typically 3.5 μs
and is necessary to remove ‘Fixed Pattern Noise’ of the pixels
and of the column amplifiers themselves by means of a double
sampling technique. After the row blanking time, the pixels are
fed to the output amplifier. The pixel rate is equal to the
SYS_CLOCK frequency.
Image Core Supply Considerations
The image sensor has several supply voltages:
VDDH is the voltage that controls the sample switches. Do not
apply a higher voltage than this to the chip.
The VDDR_LEFT voltage is the highest (nominal) reset voltage
of the pixel core.
Figure 5. Image Core
Vddreset
VDDR_LEFT
SAMPLE
RESET
HOLD
VDDH
VDDR_RIGHT
Pixel row
Pixel
A
Y-left addressing
Pixel
B
Y-right addressing
Pixel column
Y_START
Y_CLOCK
Y_START
Y_CLOCK
VDDC
Column amplifiers
Read-pointer
Output amplifier
BUS_A
BUS_B
SYS_CLOCK
Document #: 38-05710 Rev. *E
PXL_OUT
X addressing
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IBIS5-B-1300 CYII5FM1300AB
The VDDR_RIGHT voltage is generated from the VDDR_LEFT
voltage using a circuit that is programmed with the
KNEEPOINT_LSB/MSB bits in the sequencer register (see also
“Pixel reset knee-point for multiple slope operation (bits 8, 9, and
10).” on page 15). You can disconnect the VDDR_RIGHT pin
from the circuit and apply an external voltage to supply the
multiple slope reset voltage by setting the VDDR_RIGHT_EXT
bit in the SEQUENCER register. When no external voltage is
applied (recommended), connect the VDDR_RIGHT pin to a
capacitor (recommended value = 1µF). VDDC is the pixel core
supply. VDDA is the image core and periphery analog supply.
VDDD is the image core and periphery digital supply.
Note that the IBIS5-B-1300 image sensor has no on-chip power
rejection circuitry. As a consequence all variations on the analog
supply voltages can contribute to random variations (noise) on
the analog pixel signal, which is seen as random noise in the
image. During the camera design, take precautions to supply the
sensor with very stable supply voltages to avoid this additional
noise. The pixel array (VDDR_LEFT, VDDH and VDDC) analog
supplies are especially vulnerable to this.
Snapshot Shutter Supply Considerations
The recommended supply voltage settings listed in Table 3 are
used when the IBIS5-B-1300 sensor is in snapshot shutter mode
only.
Table 3.
Snapshot Shutter Recommended Supply Settings
Parameter
Description
Typ
Unit
VDDH
Voltage on HOLD switches.
+4.5
V
VDDR_LEFT
Highest reset voltage.
+4.5
V
VDDC
Pixel core voltage.
+3.3
V
VDDA
Analog supply voltage of the
image core.
+3.3
V
VDDD
Digital supply voltage of the
image core.
+3.3
V
GNDA
Analog ground.
0
V
GNDD
Digital ground.
0
V
GND_AB
Anti-blooming ground.
0
V
Table 5.
Dual Shutter Supply Considerations
If you analyze the supply settings listed in Table 3, you can see
some fixed column non-uniformities (FPN) when operating in
rolling shutter mode. If a dual shutter mode (both rolling and
snapshot shutter) is required during operation, you must apply
the supply settings listed in Table 4 to achieve the best possible
image quality.
Table 4.
Dual Shutter Recommended Supply Settings
Parameter
Description
Typ
Unit
VDDH
Voltage on HOLD switches.
+4.5
V
VDDR_LEFT
Highest reset voltage.
+4.5
V
VDDC
Pixel core voltage.
+3.0
V
VDDA
Analog supply voltage of the
image core.
+3.3
V
VDDD
Digital supply voltage of the
image core.
+3.3
V
GNDA
Analog ground.
0
V
GNDD
Digital ground.
0
V
GND_AB
Anti-blooming ground.
0
V
Image Core Biasing Signals
Table 5 summarizes the biasing signals required to drive the
IBIS5-A-1300. For optimizations reasons, with respect to speed
and power dissipation of all internal blocks, several biasing
resistors are needed.
Each biasing signal determines the operation of a corresponding
module in the sense that it controls the speed and power dissipation. The tolerance on the DC-level of the bias levels can vary
±150 mV due to process variations.
Overview of Bias Signals
Signal
Comment
Related module
DC-Level
DEC_CMD
Connect to VDDA with R = 50 kΩ and decouple to GNDA with C = 100 nF. Decoder stage.
1.0V
DAC_VHIGH
Connect to VDDA with R = 0Ω.
High level of DAC.
3.3V
DAC_VLOW
Connect to GNDA with R = 0Ω.
Low level of DAC.
0.0V
AMP_CMD
Connect to VDDA with R = 50 kΩ and decouple to GNDA with C = 100 nF. Output amplifier stage.
1.2V
COL_CMD
Connect to VDDA with R = 50 kΩ and decouple to GNDA with C = 100 nF. Columns amplifiers stage.
1.0V
PC_CMD
Connect to VDDA with R = 25 kΩ and decouple to GNDA with C = 100 nF. Pre-charge of column
busses.
1.1V
ADC_CMD
Connect to VDDA with R = 50 kΩ and decouple to GNDA with C = 100 nF. Analog stage of ADC.
1.0V
ADC_VHIGH
Connect to VDDA with R = 360Ω and decouple to GNDA with C = 100 nF. High level of ADC.
2.7V
ADC_VLOW
Connect to GNDA with R = 1200Ω and decouple to GNDA with C = 100 nF. Low level of ADC.
1.8V
Document #: 38-05710 Rev. *E
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IBIS5-B-1300 CYII5FM1300AB
X-Addressing
Because of the high pixel rate, the X-shift register selects two
columns at a time for readout, so it runs at half the system clock
speed. All even columns are connected to bus A; all odd columns
to bus B. In the output amplifier, bus A and bus B are combined
into one stream of pixel data at system clock speed.
Because every register addresses two columns at a time, the
addressable pixels range in sub-sample mode is from zero to half
the maximum number of pixels in a row (only even values). For
instance: 0, 2, 4, 6, 8… 638.
Table 6.
X_SUB
At the end of the row blanking time, the X_SYNC switch is closed
while all other switches are open and the decoder output is fed
to the register. The decoder loads a logical one in one of the
registers and a logical zero in the rest. This defines the starting
point of the window in the X direction. As soon as the X_SYNC
signal is released, the register starts shifting from the start
position.
When no sub-sampling is required, X_SUB is inactive. The
pointer in the shift-register moves one bit at a time.
When sub-sampling is enabled, X_SUB is activated. The shift
register moves two bits at a time. Taking into account that every
register selects two columns, hence two pixels sub-sampling
results in the pattern ’XXOOXXOO’ when eight pixels are
considered. Suppose the columns are numbered from left to right
starting with 0 (zero) and sub-sampling is enabled:
X–Sub-sample Patterns
X_SWAP12 X_SWAP30 Sub-Sample Pattern
0
0
0
XXXXXXXX
1
0
0
XXOOXXOO
1
1
0
XOXOXOXO
1
0
1
OXOXOXOX
1
1
1
OOXXOOXX
Y-addressing
For symmetry reasons, the sub-sampling modes in the
Y-direction are the same as in X-direction.
Table 7.
Y–Sub-Sample Patterns
Y_SUB
0
1
1
1
1
If columns 1 and 2, 5 and 6, 9 and 10 … are swapped using the
SWAP_12 switches, a normal sub-sampling pattern of
’XOXOXOXO’ is obtained.
If columns 3 and 4, 7 and 8, 11 and 12 … are swapped using the
SWAP_30 switches, the pattern is ’OXOXOXOX’.
If both the SWAP_12 and SWAP_30 switches are closed, pattern
’OOXXOOXX’ is obtained.
Y_SWAP12 Y_SWAP30 Sub-Sample Pattern
0
0
XXXXXXXX
0
0
XXOOXXOO
1
0
XOXOXOXO
0
1
OXOXOXOX
1
1
OOXXOOXX
Figure 6. Column Structure
COL(i)
COL(i+2)
COL(i+1)
COL(i+3)
X_SWAP30
X_SWAP12
A
B
A
B
A
B
Column
amplifiers
BUS_A
BUS_B
Reg(n)
SYS_CLOCK
Reg(n+1)
Reg(n+2)
Output
amplifier
1/2
X_SUB
X_SYNC
DEC(n+1)
Document #: 38-05710 Rev. *E
DEC(n+2)
Page 7 of 41
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Figure 7. Row Structure
Y_SYNC Y_SUB
Y_SWAP12
Y_SWAP30
Reg(n)
DEC(n+1)
DEC(n+2)
DEC(n+3)
DEC(n+4)
Reg(n+1)
SRH
Reg(n+2)
SRH
Reg(n+3)
SRH
Reg(n+4)
SRH
In normal mode, the pointer for the pixel row is shifted one at a
time.
When sub-sampling is enabled, Y_SYNC is activated. The
Y-shift register shifts 2 succeeding bits and skips the 2 next bits.
This results in pattern ’XXOOXXOO’.
Activating Y_SWAP12 results in pattern ’XOXOXOXO’.
Activating Y_SWAP30 results in pattern ’OXOXOXOX’.
Activating both Y_SWAP12 and Y_SWAP30 results in pattern
’OOXXOOXX’.
The addressable pixel range when Y-sub sampling is enabled is:
0–1, 4–5, 8–9, 12–13, … 1020–1021
Output Amplifier
Architecture and Settings
The output amplifier stage is user programmable for gain and
offset level. Gain is controlled by 4-bit wide word; offset by a 7-bit
wide word. Gain settings are on an exponential scale. Offset is
controlled by a 7-bit wide DAC, which selects the offset voltage
between two reference voltages (DAC_VHIGH and
DAC_VLOW) on a linear scale.
The amplifier is designed to match the specifications of the
imager array output. This signal has a data rate of 40 MHz and
is located between 1.17V and 2.95V. The output impedance of
the amplifier is 260Ω.
The output signal has a range between 1.17V and 2.95V,
depending on the gain and offset settings of the amplifier. At unity
gain and with a mid-range offset value, the amplifier outputs a
signal in between 1.59V (light) and 2.70V (dark). This analog
range must fit to the input range of the ADC, external or internal.
The output swing in unity gain is approximately 1.11V and
maximum 1.78V at the highest gain settings.
Figure 8 on page 9 shows the architecture of the output amplifier.
The odd and even column amplifiers sample both pixel and reset
value to perform a double sampling FPN correction. You can
adjust two different offsets using the on-chip DAC (7 bit):
DAC_FINE and DAC_RAW. DAC_FINE is used to tune the
difference between odd and even columns; DAC_RAW is used
to add a general (both even and odd columns) to the FPN
Document #: 38-05710 Rev. *E
ROW(n+1)
ROW(n+2)
ROW(n+3)
ROW(n+4)
corrected pixel value. This pixel value is fed to the first amplifier
stage which has an adjustable gain, controlled by a 4-bit word
(’GAIN [0…3]’).
After this, a unity feedback amplifier buffers the signal and the
signal leaves the chip. This second amplifier stage determines
the maximal readout speed, that is, the bandwidth and the slew
rate of the output signal. The whole amplifier chain is designed
for a data rate of 40 Mpix/s (@20 pF).
Output Amplifier Gain Control
The output amplifier gain is controlled by a 4-bit word set in the
AMPLIFIER register (see section “Amplifier Register (6:0)” on
page 16). An overview of the gain settings is given in Table 8.
Table 8.
Overview Gain Settings
Bits
0000
0001
0010
0011
0100
0101
0110
0111
DC Gain
1.37
1.62
1.96
2.33
2.76
3.50
4.25
5.20
Bits
1000
1001
1010
1011
1100
1101
1110
1111
DC Gain
6.25
7.89
9.21
11.00
11.37
11.84
12.32
12.42
Setting of the DAC Reference Voltage
In the output amplifier, the offset is trimmed by loading registers
DACRAW_REG and DACFINE_REG. DAC_RAW is used to
adjust the offset of the output amplifier and DAC_FINE is used
to tune the offset between the even and odd columns. These
registers are inputs for two DACs (see Figure 9 on page 9) that
operate on the same resistor that is connected between pins
DAC_VHIGH and DAC_VLOW. The range of the DAC is defined
using a resistive division with RVHIGH, RDAC and RVLOW.
The internal resistor RDAC has a value of approximately 7.88 kΩ.
The recommend resistor values for both DAC_VLOW and
DAC_VHIGH are 0Ω.
Page 8 of 41
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IBIS5-B-1300 CYII5FM1300AB
Figure 8. Output Structure
S
odd
R
even
+
S
A
1
PXL_OUT
+
R
DAC_FINE
GAIN [0…3]
unity gain
DAC_VHIGH
DAC_FINE [6:0]
DAC_RAW [6:0]
DAC_RAW
DAC_VLOW
Figure 9. In- and External DAC Connections
RDAC_VHIGH
DAC_VHIGH = 3.3V
Analog to Digital Converter
The IBIS5-B-1300 has a 10-bit flash analog digital converter
running nominally at 40 Msamples/s. The ADC is electrically
separated from the image sensor. Tie the input of the ADC
(ADC_IN; pin 69) externally to the output (PXL_OUT1; pin 28) of
the output amplifier.
Table 9.
RDAC
external
internal
7.88 kΩ
DAC_VLOW = 0V
internal
external
RDAC_VLOW
ADC Specifications
Input range
1–3V[1]
Quantization
10 Bits
Nominal data rate
40 Msamples/s
DNL (linear conversion mode)
Typ. < 0.5 LSB
INL (linear conversion mode)
Typ. < 3 LSB
Input capacitance
< 20 pF
Power dissipation @ 40 MHz
Typ. 45 mA * 3.3V = 150 mW
Conversion law
Linear / Gamma-corrected
ADC Timing
At the rising edge of SYS_CLOCK, the next pixel is fed to the
input of the output amplifier. Due to internal delays of the
SYS_CLOCK signal, it takes approximately 20 ns before the
output amplifier outputs the analog value of the pixel as shown
in Figure 10 on page 10.
The ADC converts the pixel data on the rising edge of the
ADC_CLOCK, but it takes two clock cycles before this pixel data
is at the output of the ADC. Figure 10 shows this pipeline delay.
Note
1. The internal ADC range is typically 100 mV lower then the external applied ADC_VHIGH and ADC_VLOW voltages due to voltage drops over parasitic internal resistors
Document #: 38-05710 Rev. *E
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Figure 10. ADC Timing
Due to these delays, it is advisable that a variable phase
difference is foreseen between the ADC_CLOCK and the
SYS_CLOCK to tune the optimal sample moment of the ADC.
Setting of the ADC Reference Voltages
Figure 11. In- and External ADC Connections
Non-linear and Linear Conversion Mode—’gamma’ Correction
Figure 12 on page 11 shows the ADC transfer characteristic. The
non-linear (exponential) ADC conversion is intended for
gamma-correction of the images. It increases contrast in dark
areas and reduces contrast in bright areas. The non-linear
transfer function is given by:
2
a*x + b*x
Vin = ADC_VHIGH + ( ADC_VHIGH – ADC_VLOW ) * ----------------------------------------------a*1023 + b*1023 2
With:
RADC_VHIGH
ADC_VHIGH ~ 2.7V
b = 0.027
external
internal
RADC
ADC_VLOW ~ 1.8V
external
The internal resistor RADC has a value of approximately 585Ω.
This results in the following values for the external resistors:
Resistor
Value (O)
360
RADC
585
RADC_VLOW
1200
Note that the recommended ADC resistor values yield in a
conversion of the full analog output swing at unity gain
(VDARK_ANALOG < ADC_VHIGH and VLIGHT_ANALOG >
ADC_VLOW).
The values of the resistors depend on the value of RADC. To
assure proper working of the ADC, make certain the voltage
difference between ADC_VLOW and ADC_VHIGH is at least
1.0V.
Document #: 38-05710 Rev. *E
x = digital output code
Electronic Shutter Types
The IBIS5-B-1300 has two different shutter types: a rolling
(curtain) shutter and a snapshot (synchronous) shutter.
RADC_VLOW
RADC_VHIGH
a=5
Rolling (Curtain) Shutter
The name is due to the fact that the effect is similar to a curtain
shutter of a SLR film camera. Although it is a pure electronic
operation, the shutter seems to slide over the image. A rolling
shutter is easy and elegant to implement in a CMOS sensor.
Notice that in Figure 13 on page 11, there are two Y-shift
registers. One of them points to the row that is currently being
read out. The other shift register points to the row that is currently
being reset. Both pointers are shifted by the same Y-clock and
move over the focal plane. The integration time is set by the
delay between both pointers.
Figure 13 on page 11 graphically displays the relative shift of the
integration times for different lines during the rolling shutter
operation. Each line is read and reset in a sequential way. The
integration time is the same for all lines, but is shifted in time. You
can vary the integration time through the INT_TIME register (in
number of lines).
This indicates that all pixels are light sensitive at another period
of time, and can cause some blurring if a fast moving object is
captured.
When the sensor is set to rolling shutter mode, make certain to
hold the input SS_START and SS_STOP low.
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Figure 12. Linear and Non-linear ADC Conversion Characteristic
Figure 13. Rolling Shutter Operation
x
Reset line
Read line
y
x
y
Line number
Reset sequence
Time axis
Frame time
Document #: 38-05710 Rev. *E
Integration time
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Figure 14. Synchronous Shutter Operation
COMMON SAMPLE&HOLD
Flash could occur here
COMMON RESET
Line number
Time axis
Integration time
Snapshot (Synchronous) Shutter
A synchronous (global, snapshot) shutter solves the inconvenience found in the rolling shutter. Light integration takes place
on all pixels in parallel, although subsequent readout is
sequential.
Figure 14 shows the integration and read out sequence for the
synchronous shutter. All pixels are light sensitive at the same
period of time. The whole pixel core is reset simultaneously and
after the integration time all pixel values are sampled together on
the storage node inside each pixel. The pixel core is read out line
by line after integration. Note that the integration and read out
cycle is carry-out in serial; that causes that no integration is
possible during read out.
During synchronous shutter mode, the input pins SS_START
and SS_STOP are used to start and stop the synchronous
shutter.
Sequencer
Figure 5 on page 5 shows a number of control signals that are
needed to operate the sensor in a particular sub-sampling mode
with a certain integration time, output amplifier gain, and so on.
Document #: 38-05710 Rev. *E
Burst Readout time
Most of these signals are generated on-chip by the sequencer
that uses only a few control signals. Make certain that these
control signals are generated by the external system:
■
SYS_CLOCK (X-clock) defines the pixel rate
■
Y_START pulse indicates the start of a new frame read out
■
Y_CLOCK selects a new row and starts the row blanking
sequence, including the synchronization and loading of the
X-register
■
SS_START and SS_STOP control the integration period in
snapshot shutter mode.
The relative position of the pulses is determined by a number of
data bits that are uploaded in internal registers through the serial
or parallel interface.
Internal Registers
Table 10 on page 13 shows a list of the internal registers with a
short description. In the next section, the registers are explained
in more detail.
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Table 10. Internal Registers
Register
Bit
0 (0000)
11:0
Name
Description
SEQUENCER register
Default value <11:0>: ’000011000100’
0
SHUTTER_TYPE
1 = rolling shutter
0 = synchronous shutter
1
FRAME_CAL_MODE
0 = fast
1 = slow
2
LINE_CAL_MODE
0 = fast
1 = slow
3
CONT_CHARGE
1 = ’Continuous’ precharge enabled
4
GRAN_X_SEQ_LSB
Granularity of the X sequencer clock
5
GRAN_X_SEQ_MSB
6
GRAN_SS_SEQ_LSB
7
GRAN_SS_SEQ_MSB
8
KNEEPOINT_LSB
Granularity of the SS sequencer clock
Sets reset voltage for multiple slope operation
9
KNEEPOINT_MSB
10
KNEEPOINT_ENABLE
1 = Enables multiple slope operation in synchronous shutter mode
11
VDDR_RIGHT_EXT
1 = Disables circuit that generates VDDR_RIGHT voltage; this allows
the application of an external voltage
1 (0001)
11:0
NROF_PIXELS
Number of pixels to count (maximum 1280/2)
Default value <11:0>: ’001001111111’
2 (0010)
11:0
NROF_LINES
Number of lines to count
Default value <11:0>: ’001111111111’
3 (0011)
11:0
INT_TIME
Integration time
Default value <11:0>: ’111111111111’
4 (0100)
10:0
X_REG
X start position (maximum 1280/2)
Default value <10:0>: ’00000000000’
5 (0101)
10:0
YL_REG
Y-left start position
Default value <10:0>: ’00000000000’
6 (0110)
10:0
YR_REG
Y-right start position
Default value <10:0>: ’00000000000’
7 (0111)
7:0
IMAGE CORE register
Default value <7:0>: ’00000000’
TEST_EVEN
Test even columns
0
8 (1000)
1
TEST_ODD
Test odd columns
2
X_SUBSAMPLE
Enable sub-sampling in X-direction
3
X_SWAP12
Swap columns 1-2, 5-6, …
4
X_SWAP30
Swap columns 3-4, 7-8, …
5
Y_SUBSAMPLE
Enable sub-sampling in Y-direction
6
Y_SWAP12
Swap rows 1-2, 5-6, …
7
Y_SWAP30
Swap rows 3-4, 7-8, …
AMPLIFIER register
Default value <6:0>: ’1010000’
0
GAIN<0>
Output amplifier gain setting
1
GAIN<1>
2
GAIN<2>
3
GAIN<3>
4
UNITY
1 = Amplifier in unity gain mode
5
DUAL_OUT
1 = Activates second output
6
STANDBY
0 = Amplifier in standby mode
6:0
Document #: 38-05710 Rev. *E
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Table 10. Internal Registers (continued)
Register
Bit
Name
Description
9 (1001)
6:0
DACRAW_REG
Amplifier DAC raw offset
Default value <6:0>: ’1000000’
10 (1010)
6:0
DACFINE_REG
Amplifier DAC fine offset
Default value <6:0>: ’1000000’
11 (1011)
2:0
ADC register
Default value <2:0>: ’011’
0
TRISTATE_OUT
0 = Output bus in tri-state
1
GAMMA
0 = Gamma-correction on
2
BIT_INV
1 = Bit inversion on output bus
12 (1100)
Reserved
13 (1101)
Reserved
14 (1110)
Reserved
15 (1111)
Reserved
Detailed Description of the Internal Registers
Sequencer register (7:0)
1. Shutter type (bit 0).
The IBIS5-B-1300 image sensor has two shutter types:
0 = synchronous shutter.
1 = rolling shutter.
2. Output amplifier calibration (bits 1 and 2).
Bits FRAME_CAL_MODE and LINE_CAL_MODE define the
calibration mode of the output amplifier.
pixel signals on the two buses are combined into one pixel
stream at the same frequency as SYS_CLOCK.
Use the bits GRAN_SS_SEQ_MSB (bit 7) and
GRAN_SS_SEQ_LSB (bit 6) to program the clock that drives
the ’snapshot’ or synchronous shutter sequencer.
This way the integration time in synchronous shutter mode is
a multiple of 32, 64, 128, or 256 times the system clock period.
To overcome global reset issues, use the longest SS granularity (bits 6 and 7 set to '1').
Table 11. SS Sequencer Clock Granularities
During every row-blanking period, a calibration is done of the
output amplifier. There are two calibration modes. The FAST
mode (= 0) forces a calibration in one cycle but is not so accurate and suffers from KTC noise. The SLOW mode (= 1)
only makes incremental adjustments and is noise free.
GRAN_SS_SEQ_MSB/
LSB
SS-Sequencer
Clock
Integration
Time Step[2]
00
32 x SYS_CLOCK
800 ns
01
64 x SYS_CLOCK
1.6 μs
Approximately 200 or more ’slow’ calibrations have the same
effect as one ’fast’ calibration.
10
128 x SYS_CLOCK
3.2 μs
11
256 x SYS_CLOCK
6.4 μs
Different calibration modes are set at the beginning of the
frame (FRAME_CAL_MODE bit) and for every subsequent
line that is read (LINE_CAL_MODE bit). The Y_START input
defines the beginning of a frame, Y_CLOCK defines the beginning of a new row.
3. Continuous charge (bit 3).
Some applications may require the use continuous charging
of the pixel columns instead of a pre-charge on every line
sample operation.
Setting bit CONT_CHARGE to ’1’ activates this function. The
resistor connected to pin PC_CMD controls the current level
on every pixel column.
4. Internal clock granularities (bits 4, 5, 6 and 7).
The clock that drives the X-sequencer is a multiple of 4, 8, 16,
or 32 times the system clock. Clocking the X-sequencer at a
slower rate (longer row blanking time; pixel read out speed is
always equal to the SYSTEM_CLOCK) results in more signal
swing for the same light conditions.
Table 12. X Sequencer Clock Granularities
GRAN_X_SEQ_MSB/
LSB
X-Sequencer
Clock
Row Blanking
Time[2]
00
4 x SYS_CLOCK
3.5 μs
01
8 x SYS_CLOCK
7 μs
The system clock is divided several times on-chip.
10
16 x SYS_CLOCK
14 μs
Half the system clock rate clocks the X-shift-register that controls the column/pixel readout. Odd and even pixel columns
are switched to two separate buses. In the output amplifier the
11
32 x SYS_CLOCK
28 μs
Note
2. Using a SYS_CLOCK of 40 MHz (25 ns period).
Document #: 38-05710 Rev. *E
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5. Pixel reset knee-point for multiple slope operation (bits 8, 9,
and 10).
In normal (single slope) mode the pixel reset is controlled from
the left side of the image core using the voltage applied on pin
VDDR_LEFT as pixel reset voltage.
In multiple slope operation, apply one or more variable pixel
reset voltages.
Bits KNEE_POINT_MSB and KNEE_POINT_LSB select the
on chip-generated pixel reset voltage.
Bit KNEE_POINT_ENABLE set to ’1’ switches control to the
right side of the image core so the pixel reset voltage
(VDDR_RIGHT), selected by bits KNEE_POINT_MSB/LSB,
is used.
Use bit KNEE_POINT_ENABLE only for multiple slope operation in synchronous shutter mode. In rolling shutter mode,
use only the bits KNEE_POINT_MSB/LSB to select the second knee-point in dual slope operation. The actual knee-point
depends on VDDH, VDDR_LEFT and VDDC applied to the
sensor.
Table 13. Multiple Slope Register Settings
KNEE_POINT
Pixel Reset Voltage Knee-point
(V)VDDR_RIGHT
(V)
MSB/LSB
ENABLE
00
0 or 1
VDDR_LEFT
0
01
1
VDDR_LEFT – 0.76
+ 0.76
10
1
VDDR_LEFT – 1.52
+ 1.52
11
1
VDDR_LEFT – 2.28
+ 2.28
6. External Pixel Reset Voltage for Multiple Slope (bit 11)
Setting bit VDDR_RIGHT_EXT to ’1’ disables the circuit that
generates the variable pixel reset voltage and uses the voltage externally applied to pin VDDR_RIGHT as the double/multiple slope reset voltage.
Setting bit VDDR_RIGHT_EXT to ’0’ allows you to monitor the
variable pixel reset voltage (used for multiple slope operation)
on pin VDDR_RIGHT.
NROF_PIXELS Register (11:0)
After the internal x_sync is generated (start of the pixel readout
of a particular row), the PIXEL_VALID signal goes high. The
PIXEL_VALID signal goes low when the pixel counter reaches
the value loaded in the NROF_PIXEL register. Due to the fact
that two pixels are read at the same clock cycle, you must divide
this number by 2 (NROF_PIXELS = (width of ROI / 2) – 1).
ROF_LINES Register (11:0)
After the internal yl_sync is generated (start of the frame readout
with Y_START), the line counter increases with each Y_CLOCK
pulse until it reaches the value loaded in the NROF_LINES
register and generates a LAST_LINE pulse.
INT_TIME Register (11:0)
Use the INT_TIME register to set the integration time of the
electronic shutter. The interpretation of the INT_TIME depends
on the chosen shutter type (rolling or synchronous).
1. Synchronous shutter.
After the SS_START pulse is applied an internal counter
counts the number of SS granulated clock cycles until it
reaches the value loaded in the INT_TIME register and generates a TIME_OUT pulse. Use this TIME_OUT pulse to generate the SS_STOP pulse to stop the integration. When the
INT_TIME register is used, the maximum integration time is:
TINT_MAX = 212 * 256 (maximum granularity) * (40 MHZ) – 1
= 26.2 ms.
You can increase this maximum time if you use an external
counter to trigger SS_STOP. Ten is the minimal value that you
can load into the INT_TIME register (see also “Internal clock
granularities (bits 4, 5, 6 and 7).” on page 14).
2. Rolling shutter.
When the Y_START pulse is applied (start of the frame readout), the sequencer generates the yl_sync pulse for the left
Y-shift register (read out Y-shift register). This loads the left
Y-shift register with the pointer loaded in YL_REG register. At
each Y_CLOCK pulse, the pointer shifts to the next row and
the integration time counter increases until it reaches the value loaded in the INT_TIME register. At that moment, the sequencer generates the yr_sync pulse for the right Y-shift register; it loads the right Y-shift register (reset Y-shift register)
with the pointer loaded in YR_REG register (see Figure 15).
The integration time counter is reset when the sync for the left
Y-shift register is asserted. Both shift registers keep moving
until the next sync is asserted (it generates the Y_START for
the left Y-shift register and the sync for the right Y-shift register
when the integration time counter reaches the INT_TIME value).
Treg_int Difference between the left and right pointer = value
set in the INT_TIME register (number of lines).
The actual integration time is given by:
Tint Integration time [# lines] = NROF_LINES register
– INT_TIME register.
Figure 15. Synchronization of the Shift Registers in Rolling Shutter Mode
Sync of left
shift-register
Last line, followed by
sync of left shift-register
Sync of right
shift-register
Sync
Line n
Document #: 38-05710 Rev. *E
Tint
Treg_int
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4. STANDBY
X_REG Register (10:0)
The X_REG register determines the start position of the window
in the X-direction. In this direction, there are 640 possible starting
positions (two pixels are addressed at the same time in one clock
cycle). If sub sampling is enabled, only the even pixels are set
as starting position (for instance: 0, 2, 4, 6, 8… 638).
YL_REG (10:0) and YR_REG (10:0)
The YL_REG and YR_REG registers determine the start position
of the window in the Y-direction. In this direction, there are 1024
possible starting positions. In rolling shutter mode the YL_REG
register sets the start position of the read (left) pointer and the
YR_REG sets the start position of the reset (right) pointer. For
both shutter types YL_REG is always equal to YR_REG.
If STANDBY = 0, the complete output amplifier is put in standby. For normal use, set STANDBY to ‘1’.
DAC_RAW Register (6:0) and DAC_FINE (6:0) Register
These registers determine the black reference level at the output
of the output amplifier. Bit setting 1111111 for the DAC_RAW
register gives the highest offset voltage. Bit setting 0000000 for
the DAC_RAW register gives the lowest offset voltage. Ideally, if
the two output paths have no offset mismatch, the DAC_FINE
register is set to 1000000. Deviation from this value is used to
compensate the internal mismatch (see “Output Amplifier” on
page 8).
ADC Register (2:0)
Image Core Register (7:0)
1. TRISTATE_OUT (bit 0)
Bits 1:0 of the IMAGE_CORE register define the test mode of the
image core. Setting 00 is the default and normal operation mode.
In case the bit is set to ‘1’, the odd (bit 1) or even (bit 0) columns
are tight to the reset level. If the internal ADC is used, bits 0 and
1 are used to create test pattern to test the sample moment of
the ADC. If the ADC sample moment is not chosen correctly, the
created test pattern is not black-white-black-etc. (IMAGE_CORE
register set at 1 or 2) or black-black-white-white-black-black
(IMAGE_CORE register set at 9) but grey shadings if the sensor
is saturated.
In case TRISTATE = 0, the ADC_D<9:0> outputs are in
tri-state mode. TRISTATE = 1 for normal operation mode.
2. GAMMA (bit 1)
Bits 7:2 of the IMAGE_CORE register define the sub-sampling
mode in the X-direction (bits 4:2) and in the Y-direction (bits 7:5).
The sub-sampling modes and corresponding bit setting are
given in Table 6 on page 7 and Table 7 on page 7.
Amplifier Register (6:0)
1. GAIN (bits 3:0)
If GAMMA is set to ‘1’, the ADC input to output conversion is
linear; otherwise the conversion follows a 'gamma' law (more
contrast in dark parts of the window, lower contrast in the
bright parts).
3. BIT_INV (bit 2)
If BIT_INV = 1, 0000000000 is the conversion of the lowest
possible input voltage, otherwise the bits are inverted.
Data Interfaces
Two different data interfaces are implemented. They are
selected using pins IF_MODE (pin 12) and SER_MODE (pin 6).
Table 14. Serial and Parallel Interface Selection
The gain bits determine the gain setting of the output amplifier. They are only effective if UNITY = 0. The gains and corresponding bit setting are given in Table 8 on page 8.
2. UNITY (bit 4)
IF_MODE
SER_MODE
1
X
Parallel
0
1
Serial 3 Wire
In case UNITY = 1, the gain setting of GAIN is bypassed and
the gain amplifier is put in unity feedback.
3. DUAL_OUT (bit 5)
0
0
Serial 2 Wire.
If DUAL_OUT = 1, the two output amplifiers are active. If
DUAL_OUT = 0, the signals from the two buses are multiplexed to output PXL_OUT1 which connects to ADC_IN. The
gain amplifier and output driver of the second path are put in
standby.
Selected interface
Parallel Interface
The parallel interface uses a 16-bit parallel input (P_DATA
(15:0)) to upload new register values. Asserting P_WRITE loads
the parallel data into the internal register of the IBIS5-B-1300
where it is decoded. (See Figure 16. P_DATA (15:12) address
bits REG_ADDR (3:0); P_DATA (11:0) data bits REG_DATA
(11:0)).
Figure 16. Parallel Interface Timing
Document #: 38-05710 Rev. *E
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Figure 17. Serial 3-Wire Interface Timing
Serial 3-Wire Interface
Serial 2-Wire Interface
The serial 3-wire interface (or serial-to-parallel Interface) uses a
serial input to shift the data in the register buffer. When the
complete data word is shifted into the register buffer the data
word is loaded into the internal register where it is decoded. (See
Figure 17. S_DATA (15:12) address bits REG_ADDR (3:0);
S_DATA (11:0) data bits REG_DATA (11:0). When S_EN is
asserted the parallel data is loaded into the internal registers of
the IBIS5-A-1300. The maximum tested frequency of S_DATA is
2.5 MHz.)
The serial 2-wire interface is a unidirectional interface (you can
only write register values to the sensor; you cannot read anything
out). Therefore, the R/W_N bit (bit 8) is ignored internally. An
acknowledge pulse is asserted each time a data word is received
successfully. The maximum tested frequency of S_DATA is 2.5
MHz. (See Figure 18. S_DATA (15:12)
address bits
REG_ADDR (3:0); S_DATA (11:0) data bits
REG_DATA
(11:0)).
Figure 18. Serial 2-Wire Interface Timing
1-7
S_CLK
8
9
1-7
8
9
1-7
8
9
S_DATA
Start
SI2
R/ Ack
address W_N
Data(15:8)
Ack
Data(7:0)
Ack
Stop
REG_LOAD (internal)
Document #: 38-05710 Rev. *E
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Timing Diagrams
Synchronous Shutter: Single Slope Integration
Timing Requirements
There are six control signals that operate the image sensor:
• SS_START
• SS_STOP
• Y_CLOCK
• Y_START
• X_LOAD
• SYS_CLOCK
SS_START and SS_STOP must change on the falling edge of
the SYS_CLOCK (Tsetup and Thold > 7.5 ns). Make certain that
the pulse width of both signals is a minimum of 1 SYS_CLOCK
cycle. As long as SS_START or SS_STOP are asserted, the
sequencer stays in a suspended state. (See Figure 21.)
T1—Time counted by the integration timer until the value of
INT_TIME register is reached. The integration timer is clocked
by the granulated SS-sequencer clock.
T2—TIME_OUT signal stays
SS-sequencer clock period.
high
for
one
granulated
The external system generates these control signals with
following time constraints to SYS_CLOCK (rising edge = active
edge):
T3—There are no constraints for this time. Use the TIME_OUT
signal to trigger the SS_STOP pin (or use an external counter to
trigger SS_STOP); you cannot tie both signals together.
TSETUP >7.5 ns
T4—During this time, the SS-sequencer applies the control
signals to reset the image core and start integration. This takes
four granulated SS-sequencer clock periods. The integration
time counter starts counting at the first rising edge after the falling
edge of SS_START.
THOLD > 7.5 ns
It is important that these signals are free of any glitches.
Figure 19 shows a recommended schematic for generating the
basic signals and to avoid any timing problems.
Figure 19. Recommended Schematic for Generating
Basic Signals
FF
T5—The SS-sequencer puts the image core in a readable state.
It takes two granulated SS-sequencer clock periods.
Tint—The ’real’ integration or exposure time.
SS_START
SS_STOP
Y_CLOCK
Y_START
X_LOAD
SYS_CLOCK_N
SYS_CLOCK
Figure 20. Relative Timing of the 5 Sequencer Control Signal
Figure 21. Synchronous Shutter: Single Slope Integration
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Figure 22. Synchronous Shutter: Pixel Read Out
Synchronous Shutter: Pixel Readout
Basic Operation
Y_START and Y_CLOCK must change on the falling edge of the
SYS_CLOCK (Tsetup and Thold > 7.5 ns). Make certain that the
pulse width is a minimum of one clock cycle for Y_CLOCK and
three clock cycles for Y_START. As long as Y_CLOCK is applied,
the sequencer stays in a suspended state. (See Figure 22.)
T1—Row blanking time: During this period, the X-sequencer
generates the control signals to sample the pixel signal and pixel
reset levels (double sampling fpn-correction), and starts the
readout of one line. The row blanking time depends on the granularity of the X-sequencer clock (see Table 15).
Table 15. Row Blanking Time as Function of X-Sequencer
Granularity
Granularity
NGRAN
T1(µs)
GRAN_X_SEQ
= 35 x NGRAN x TSYS_CLOCK
MSB/LSB
x4
140 x TSYS_CLOCK = 3.5
00
x8
280 x TSYS_CLOCK = 7.0
01
x 16
560 x TSYS_CLOCK = 14.0
10
x 32
1120 x TSYS_CLOCK = 28.0
11
T2—Pixels counted by pixel counter until the value of
NROF_PIXELS register is reached. PIXEL_VALID goes high
when the internal X_SYNC signal is generated, in other words
when the readout of the pixels is started. PIXEL_VALID goes low
when the pixel counter reaches the value loaded in the
NROF_PIXELS register (after a complete row read out).
T3—LAST_LINE goes high when the line counter reaches the
value loaded in the NROF_LINES register and stays high for one
line period (until the next falling edge of Y-CLOCK).
On Y_START the left Y-shift-register of the image core is loaded
with the YL-pointer that is loaded in to register YL_REG.
Pixel Output
The pixel signal at the PXL_OUT1 output becomes valid after
five SYS_CLOCK cycles when the internal X_SYNC (= start of
PIXEL_VALID output or external X_LOAD pulse) pulse is
asserted. (See Figure 23.)
T1—Row blanking time (see Table 15).
T2—5 SYS_CLOCK cycles.
T3—Time for new X-pointer position upload in X_REG register
(see “Windowing in X-direction” on page 21 for more details).
Figure 23. Pixel Output
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Synchronous Shutter: Multiple Slope Integration
Figure 24. Multiple Slope Integration
Use up to four different pixel reset voltages during multiple slope
operation in synchronous shutter mode. This is done by
uploading
new
values
to
register
bits
KNEEPOINT_MSB/LSB/ENABLE before a new SS_START
pulse is applied.
Set bit KNEEPOINT_ENABLE high to do a pixel reset with a
lower voltage.
Set bits KNEEPOINT_MSB/LSB/ENABLE back to ‘0’ before the
SS_STOP pulse is applied. Every time an SS_START pulse is
applied, the integration time counter is reset.
Table 16. Multiple Slope Register Settings
Kneepoint
MSB/LSB
Enable
Initial Setup
00
0
1st Register Upload
01
1
2nd Register Upload
10
1
3th Register Upload
11
1
4th Register Upload
Document #: 38-05710 Rev. *E
00
0
Upload the register after time Tstable, otherwise, the change
affects the SS-sequencer resulting in a bad pixel reset. Tstable
depends on the granularity of the SS-sequencer clock (see
Table 17).
Table 17. Tstable for Different Granularity Settings
Granularity
Tstable (µs)
NGRAN
= 5 x NGRAN x TSYS_CLOCK
x 32
GRAN_SS_SEQ
MSB/LSB
160 x TSYS_CLOCK = 4
00
x 64
320 x TSYS_CLOCK = 8
01
x 128
640 x TSYS_CLOCK = 16
10
x 256
1280 x TSYS_CLOCK = 32
11
Tupload depends on the interface mode used to upload the
registers.
Table 18. Tupload for Different Interface Modes
Interface Mode
Tupload (µs)
Parallel
1
Serial 3-wire
8
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Rolling Shutter Operation
Figure 25. Rolling Shutter Operation
The integration of the light in the image sensor is done during
readout of the other lines.
The only difference with synchronous shutter is that the
TIME_OUT pin is used to indicate when the Y_SYNC pulse for
the right Y-shift-register (reset Y-shift register) is generated. This
loads the right Y-shift-register with the pointer loaded in register
YR_REG. The Y_SYNC pulse for the left Y-shift register (read
Y-shift register) is generated with Y_START.
The INT_TIME register defines how many lines to count before
the Y_SYNC of the right Y-shift-register is generated, hence
defining the integration time. See also “INT_TIME Register
(11:0)” on page 15 for a detailed description of the rolling shutter
operation.
Tint Integration time [# lines] = register(NROF_LINES) –
register(INT_TIME)
Note For normal operation the values of the YL_REG and
YR_REG registers are equal.
Windowing in X-direction
An X_LOAD pulse overrides the internal X_SYNC signal, loading
a new X-pointer (stored in the X_REG register) into the
X-shift-register.
The X_LOAD pulse has to appear on the falling edge of
SYS_CLOCK and has to remain high for two SYS_CLOCK
cycles overlapping two rising edges of SYS_CLOCK. The new
X-pointer is loaded on one of the two rising edges of
SYS_CLOCK.
The available time to upload the register is Tload; it is defined
from the previous register load to the rising edge of X_LOAD. It
depends on the settling time of the register and the X-decoder.
The actual time to load the register itself depends on the
interface mode that is used.
The parallel interface is the fastest.
Table 19. Tload for Different Interfaces
Interface Mode
Tload (µs)
Parallel interface
1
(about 40 SYS_CLOCK cycles)
Serial 3 Wire
16
(at 2.5 MHz data rate)
Figure 26. Windowing in the X-Direction
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IBIS5-B-1300 CYII5FM1300AB
Windowing in Y-direction
Figure 27. Windowing in the Y-Direction
Reapply the Y_START pulse after loading a new Y-pointer value
into the YL_REG and YR_REG registers to load a new Y-pointer
into the Y-shift-register.
Every time a Y_START pulse appears, a frame calibration of the
output amplifier occurs.
Initialization (Start-Up Behavior)
After power on of the image sensor, apply SYS_RESET for a
minimum of five SYS_CLOCK periods to ensure a proper reset
of the on-chip sequencer and timing circuitry. All internal
registers are set to ‘0’ after SYS_RESET is applied.
Since all the IBIS5-B-1300 control signals are active high, apply
a low level (before SYS_RESET occurs) to these pins at start up
to avoid latch up.
To avoid any high current consumption at start-up, apply the
SYS_CLOCK signal as soon as possible after or even before
power on of the image sensor.
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IBIS5-B-1300 CYII5FM1300AB
Pin List
The IBIS5-B-1300 image sensor is packaged in a leadless ceramic carrier (LCC package). Table 20 lists all the pins and their functions.
There are 84 pins total.
Table 20. Pin List[3, 4, 5]
Pin
Pin Name
Pin Type
Input
Pin Description
1
P_DATA<8>
Digital input. Data parallel interface.
2
P_WR
Input
Digital input (active high). Parallel write.
3
S_CLK
Input
Digital input. Clock signal of serial interface.
4
S_DATA
Input
Digital input/output. Data of serial interface.
5
S_EN
Input
Digital input (active low). Enable of serial 3-wire interface.
6
SER_MODE
Input
Digital input. Serial mode enable (1 = Enable serial 3-wire, 0 = Enable serial 2-wire).
7
VDDC
Supply
Analog supply voltage. Supply voltage of the pixel core [3.3V].
8
VDDA
Supply
Analog supply voltage. Analog supply voltage of the image sensor [3.3V].
9
GNDA
Ground
Analog ground. Analog ground of the image sensor.
10
GNDD
Ground
Digital ground. Digital ground of the image sensor.
11
VDDD
Supply
Digital supply voltage. Digital supply voltage of the image sensor [3.3V].
12
IF_MODE
Input
Digital input. Interface mode (1 = parallel; 0 = serial).
13
DEC_CMD
Input
Analog input. Biasing of decoder stage. Connect to VDDA with R = 50 kΩ and decouple with
C = 100 nF to GNDA.
14
Y_START
Input
Digital input (active high). Start frame read out.
15
Y_CLOCK
Input
Digital input (active high). Line clock.
16
LAST_LINE
Output
Digital output. Generates a high level when the last line is read out.
17
X_LOAD
Input
Digital input (active high). Loads new X-position during read out.
18
SYS_CLOCK
Input
Digital input. System (pixel) clock (40 MHz).
19
PXL_VALID
Output
Digital output. Generates high level during pixel read out.
20
SS_START
Input
Digital input (active high). Start synchronous shutter operation.
21
SS_STOP
Input
Digital input (active high). Stop synchronous shutter operation.
22
TIME_OUT
Output
Digital output.
Synchronous shutter: pulse when timeout reached. It is used to trigger SS_STOP; do not tie
both signals together.
Rolling shutter: pulse when second Y-sync appears.
23
SYS_RESET
Input
Digital input (active high). Global system reset.
24
EL_BLACK
Input
Digital input (active high). Enables electrical black in output amplifier.
25
EOSX
Output
Digital output. Diagnostic end-of-scan of X-register.
26
DAC_VHIGH
Input
Analog reference input. Biasing of DAC for output dark level. Use this to set the output range
of DAC.
Default: Connect to VDDA with R = 0Ω.
27
DAC_VLOW
Input
Analog reference input. Biasing of DAC for output dark level. Use this to set the output range
of DAC.
Default: Connect to GND A with R = 0Ω.
28
PXL_OUT1
Output
Analog output. Analog pixel output 1.
Notes
3. You can connect all pins with the same name together.
4. All digital input are active high (unless mentioned otherwise).
5. Tie all digital inputs that are not used to GND (inactive level).
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IBIS5-B-1300 CYII5FM1300AB
Table 20. Pin List[3, 4, 5] (continued)
Pin
Pin Name
Pin Type
Pin Description
29
PXL_OUT2
Output
Analog output. Analog pixel output 2. Leave not connected if not used.
30
AMP_CMD
Input
Analog input. Biasing of the output amplifier. Connect to VDDA with R = 50 kΩ and decouple
with C = 100 nF to GNDA.
31
COL_CMD
Input
Analog input. Biasing of the column amplifiers. Connect to VDDA with R = 50 kΩ and decouple
with C = 100 nF to GNDA.
32
PC_CMD
Input
Analog input. Pre-charge bias. Connect to VDDA with R = 25 kΩ and decouple with C = 100
nF to GNDA.
33
VDDD
Supply
Digital supply. Digital supply voltage of the image sensor [3.3V].
34
GNDD
Ground
Digital ground. Digital ground of the image sensor.
35
GNDA
Ground
Analog ground. Analog ground of the image sensor.
36
VDDA
Supply
Analog supply voltage. Analog supply voltage of the image sensor [3.3V].
37
VDDC
Supply
Analog supply voltage. Supply voltage of the pixel core [3.3V].
38
P_DATA<0>
Input
Digital input. Data parallel interface (LSB).
39
P_DATA<1>
Input
Digital input. Data parallel interface.
40
P_DATA<2>
Input
Digital input. Data parallel interface.
41
P_DATA<3>
Input
Digital input. Data parallel interface.
42
P_DATA<4>
Input
Digital input. Data parallel interface.
43
P_DATA<5>
Input
Digital input. Data parallel interface.
44
P_DATA<6>
Input
Digital input. Data parallel interface.
45
P_DATA<7>
Input
Digital input. Data parallel interface.
46
SI2_ADDR<0>
Input
Digital input. Sets I2C address.
47
SI2_ADDR<1>
Input
Digital input. Sets I2C address.
48
SI2_ADDR<2>
Input
Digital input. Sets I2C address.
49
SI2_ADDR<3>
Input
Digital input. Sets I2C address.
50
SI2_ADDR<4>
Input
Digital input. Sets I2C address.
51
GNDAB
Supply
Analog supply voltage. Anti-blooming ground.
52
VDDR_RIGHT
Supply
Analog supply voltage. Variable reset voltage (multiple slope operation). Decouple with 1 μF
to GNDA.
53
ADC_VLOW
Input
Analog reference input. ADC low reference voltage.Default: Connect to GNDA with
R = 1200Ω and decouple with C = 100 nF to GNDA.
54
ADC_GNDA
Ground
Analog ground. ADC analog ground.
55
ADC_VDDA
Supply
Analog supply voltage. ADC analog supply voltage [3.3V].
56
ADC_GNDD
Ground
Digital ground. ADC digital ground.
57
ADC_VDDD
Supply
Digital supply voltage. ADC digital supply voltage [3.3V].
58
ADC_CLOCK
Input
Digital input. ADC clock (40 MHz).
59
ADC_OUT<9>
Output
Digital output. ADC data output (MSB).
60
ADC_OUT<8>
Output
Digital output. ADC data output.
61
ADC_OUT<7>
Output
Digital output. ADC data output.
62
ADC_OUT<6>
Output
Digital output. ADC data output.
63
ADC_OUT<5>
Output
Digital output. ADC data output.
64
ADC_OUT<4>
Output
Digital output. ADC data output.
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IBIS5-B-1300 CYII5FM1300AB
Table 20. Pin List[3, 4, 5] (continued)
Pin
Pin Name
Pin Type
Pin Description
65
ADC_OUT<3>
Output
Digital output. ADC data output.
66
ADC_OUT<2>
Output
Digital output. ADC data output.
67
ADC_OUT<1>
Output
Digital output. ADC data output.
68
ADC_OUT<0>
Output
Digital output. ADC data output (LSB).
69
ADC_IN
Input
Analog input. ADC analog input.
70
ADC_CMD
Input
Analog input. Biasing of the input stage of the ADC. Connect to ADC_VDDA with R = 50 kΩ
and decouple with C = 100 nF to ADC_GNDA.
71
ADC_VDDD
Supply
Digital supply voltage. ADC digital supply voltage [3.3V].
72
ADC_GNDA
Ground
Analog ground. ADC analog ground.
73
ADC_GNDD
Ground
Digital ground. ADC digital ground.
74
ADC_VDDA
Supply
Analog supply voltage. ADC analog supply voltage [3.3V].
75
ADC_VHIGH
Input
Analog reference input. ADC high reference volt age.Default: Connect to VDDA with
R = 360Ω and decouple with C = 100 nF to GNDA.
76
VDDR_LEFT
Supply
Analog supply voltage. High reset level [4.5V].
77
VDDH
Supply
Analog supply voltage. High supply voltage for HOLD switches in the image core [4.5V]
78
P_DATA<15>
Input
Digital input. Data parallel interface (MSB).
79
P_DATA<14>
Input
Digital input. Data parallel interface.
80
P_DATA<13>
Input
Digital input. Data parallel interface.
81
P_DATA<12>
Input
Digital input. Data parallel interface.
82
P_DATA<11>
Input
Digital input. Data parallel interface.
83
P_DATA<10>
Input
Digital input. Data parallel interface.
84
P_DATA<9>
Input
Digital input. Data parallel interface.
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IBIS5-B-1300 CYII5FM1300AB
Specifications
Electro-Optical Specifications
General Specifications.
Overview
Table 21. General Specifications
Table 22. Electro-Optical Specifications
Parameter
Specification
Pixel architecture 4T-pixel
Pixel size
6.7 μm x 6.7 μm
Resolution
1280 x 1024
Pixel rate
40 MHz
Shutter type
Full frame rate
• Electronic
rolling shutter
• Snapshot
shutter
Remarks
High fill factor square
pixels (based on the high
fill factor active pixel
sensor technology of
Cypress). Patents
pending.
The resolution and pixel
size results in a 2/3"
optical format.
Using a 40 MHz system
clock.
• Continuous imaging.
• Triggered global
shutter with
integration and
readout separate in
time.
27 frames/second Increases with ROI read
out and/or sub sampling.
Parameter
Specification
Remarks
FPN (local)
<0.20%
RMS % of saturation
signal.
PRNU (local)
<10%
Peak-to-peak of signal
level.
Conversion gain
17.6 µV/electron @ output (measured).
Output signal
amplitude
1V
Saturation charge
62.500 e-
Sensitivity (peak)
715V.m2/W.s
8.40 V/lux.s
At nominal conditions.
@ 650 nm
(85 lux = 1 W/m2).
Sensitivity (visible) 572 V.m2/W.s
3.51 V/lux.s
400-700 nm
(163 lux = 1 W/m2).
Peak QE * FF Peak 30%0.16 A/W
Spectral Resp.
Average QE*FF = 22%
(visible range).
Average SR*FF = 0.1
A/W (visible range).
See spectral response
curve.
Fill factor
40%
Light sensitive part of
pixel (measured).
Dark current
7.22 mV/s
410e-/s
Typical value of average
dark current of the whole
pixel array (@ 21 °C).
Dark Signal Non
Uniformity
7 mV/s
400 e-/s
Dark current RMS value
(@ 21 °C).
Temporal noise
40 RMS e-
Measured at digital
output (in the dark).
S/N Ratio
1563:1 (64 dB)
Measured at digital
output (in the dark).
Spectral sensitivity 400 - 1000 nm
range
Optical cross talk
Document #: 38-05710 Rev. *E
16%
To the first neighboring
pixel.
Parasitic Sensitivity 3%
Averaged over spectrum
Power dissipation
Typical (including ADCs).
175 mWatt
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IBIS5-B-1300 CYII5FM1300AB
Spectral Response Curve
Figure 28. Spectral response curve
CYII5SM1300AB
CYII5FM1300AB
0.225
QE 40%
QE 30%
0.2
0.175
QE 20%
Spec res [A/W]
0.15
0.125
0.1
QE 10%
0.075
0.05
0.025
0
400
500
600
700
800
900
1000
Wavelenght [nm]
Figure 28 shows the spectral response characteristic for the IBIS5-B-1300 (CYII5SM1300AB) and the IBIS-5-BE-1300
(CYII5FM1300AB). The curve is measured directly on the pixels. It includes effects of non-sensitive areas in the pixel, for example,
interconnection lines. The sensor is light sensitive between 400 and 1000 nm. The peak QE * FF is 30%, approximately around 650
nm. In view of a fill factor of 40%, the QE is thus close to 75% between 500 and 700 nm. The IBIS5-BE-1300 has superior response
in the NIR region (700-900 nm). For more information about the IBIS5-B-1300, refer to “IBIS5-BE-1300 (CYII5FM1300AB)” on
page 28.
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IBIS5-B-1300 CYII5FM1300AB
Electro-voltaic Response Curve
Figure 29. Electro-Voltaic Response Curve
1,2
Output swing [V]
1
0,8
0,6
0,4
0,2
0
0
10000
20000
30000
40000
50000
60000
70000
80000
# electrons
Figure 29 shows the pixel response curve in linear response mode. This curve is the relation between the electrons detected in the
pixel and the output signal. The resulting voltage-electron curve is independent of any parameters (integration time, and others). The
voltage to electrons conversion gain is 17.6 µV/electron.
IBIS5-BE-1300 (CYII5FM1300AB)
The IBIS5-BE-1300 is processed on a thicker epitaxial Si layer featuring a superb sensitivity in the NIR (Near Infra Red) wavelengths
(700–900 nm). The spectral response curves of the two IBIS5-B-1300 image sensors are shown in Figure 28 on page 27. As many
machine vision applications use light sources in the NIR, the IBIS5-BE-1300 sensor has a significant sensitivity advantage in the NIR.
A drawback of the thicker epitaxial layer is a slight performance decrease in MTF (Modular Transfer Function or electrical pixel to pixel
cross-talk) as indicated in the Table 23.
Table 23. MTF comparison
Direction
Wavelength
IBIS5-B-1300
0.58
IBIS5-BE-1300
0.37
Horizontal
600
Horizontal
700
0.18
Horizontal
800
0.16
Horizontal
900
Vertical
600
0.07
Vertical
700
0.16
Vertical
800
0.13
Vertical
900
0.11
0.53
0.26
The resulting image sharpness is hardly affected by this decreased MTF value.
Both IBIS5-B-1300 versions are fully pin compatible and have identical timing and biasing
Document #: 38-05710 Rev. *E
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IBIS5-B-1300 CYII5FM1300AB
Features and General Specifications
Table 24. Features and General Specifications
Feature
Specification/Description
Electronic shutter types
1. Rolling curtain shutter.
2. Synchronous (snapshot) shutter.
Windowing (ROI)
Implemented as scanning of lines/columns from an uploaded position.
Sub-sampling modes:
1:2 sub-sampling.
Sub-sampling patterns:
XXOOXXOO (for Bayer pattern color filter)
OOXXOOXX (for Bayer pattern color filter)
XOXOXOXOOXOXOXOX
Identical sub-sample patterns in X- and Y-direction.
Extended dynamic range
In rolling shutter: Normal (1) or double (2) slope.
In Synchronous shutter: 1, 2, 3 or 4 slopes.
Digital output
10 bit ADC @ 40 MSamples/s.
Programmable gain range
x1 to x12, in 16 steps of approx. 1.5 dB using 4-bit programming.
Programmable offset
128 steps (7 bit).
Supply voltage VDD
Image core supply: Range from 3.0V to 4.5V
Analog supply: Nominal 3.3V
Digital: Nominal 3.3V
Logic levels
3.3 V (Digital supply).
Operational temperature range –30°C to 65°C, with degradation of dark current.
Die size (with scribe lines)
10.1 mm by 9.3 mm (x by y).
Package
84 pins LCC.
Electrical Specifications
Absolute Maximum Ratings
Table 25. Absolute Maximum Ratings
Parameter
Description
Value
Unit
–0.5 to 4.5
V
VDD
DC supply voltage
VIN
DC input voltage
–0.5 to 3.8
V
VOUT
DC output voltage
–0.5 to 3.8
V
IIO
DC current drain per pin; any single input or output.
± 50
mA
TL
Lead temperature (5 seconds soldering).
350
°C
–30 to +85
°C
TST
Storage temperature
H
Humidity (relative)
85% at 85°C
ESD
ESD susceptibility
2000
V
VDD = VDDD = VDDA (VDDD is supply to digital circuit, VDDA to analog circuit).
Stresses beyond those listed under the section Absolute Maximum Ratings can cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated in the operational
sections are not implied. Exposure to absolute maximum rating conditions for extended periods can affect device reliability.
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IBIS5-B-1300 CYII5FM1300AB
Recommended Operating Conditions
Table 26. Recommended Operating Conditions
Parameter
Description
Min
Typ
Max
Unit
VDDH
Voltage on HOLD switches.
+3.3
+4.5
+4.5
V
VDDR_LEFT
Highest reset voltage.
+3.3
+4.5
+4.5
V
VDDC
Pixel core voltage.
+2.5
+3.0
+3.3
V
VDDA
Analog supply voltage of the image core.
+3.0
+3.3
+3.6
V
VDDD
Digital supply voltage of the image core.
+3.0
+3.3
+3.6
V
GNDA
Analog ground
–0.5
0
+0.5
V
GNDD
Digital ground
–0.5
0
+0.5
V
GND_AB
Anti-blooming ground.
–0.5
0
+0.5
V
TA
Commercial operating temperature.
0
30
60
°C
All parameters are characterized for DC conditions after thermal equilibrium is established.
Always tie unused inputs to an appropriate logic level, for example, either VDD or GND.
This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields. However, take normal
precautions to avoid application of any voltages higher than the maximum rated voltages to this high impedance circuit.
DC Electrical Characteristics
Table 27. DC Electrical Characteristics
Parameter
Characteristic
Condition
Min
VIH
Input high voltage
VIL
Input low voltage
IIN
Input leakage current
VIN = VDD or GND
–10
VOH
Output high voltage
VDD = min; IOH = –100 mA
2.2
VOL
Output low voltage
VDD = min; IOH = 100 mA
IDD
Maximum operating current
System clock <= 40 MHz
Document #: 38-05710 Rev. *E
Max
2.1
40
Unit
V
0.6
V
+10
µA
V
0.5
V
60
mA
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IBIS5-B-1300 CYII5FM1300AB
Pad position and Packaging
Bare Die
The IBIS5-B-1300 image sensor has 84 pins, 21 pins on every edge. The die size from pad-edge to pad-edge (without scribe-line) is:
10156.5 µm (x) by 9297.25 µm (y). Scribe lines take about 100 to 150 µm extra on each side. Pin 1 is located in the middle of the left
side, indicated by a ‘1’ on the layout. A logo and some identification tags are on the top right of the die.
Figure 30. IBIS5-B-1300 Bare Die Dimensions (All dimensions in µm)
Test structure
Document #: 38-05710 Rev. *E
Identification
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IBIS5-B-1300 CYII5FM1300AB
IBIS5-B-1300 in 84-pin LCC Package
Technical Drawing of 84-pin LCC Package (spec 001-05461-**)
Figure 31. Top View of the 84-Pin LCC Package (all dimensions in mm)
Figure 32. Side View of the 84-pin LCC Package (all dimensions in mm
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IBIS5-B-1300 CYII5FM1300AB
Table 28. Side View Dimensions
Dimension
Description
(Inch)
(mm)
Min
Typ
Max
Min
Typ
Max
A
Glass (thickness) - mono
0.020
0.022
0.024
0.500
0.550
0.600
B
Cavity (depth)
0.060
0.069
0.078
1.520
1.750
1.980
C
Die - Si (thickness) - mono
0.029
0.740
D
Bottom layer (thickness)
0.020
0.500
E
Die attach-bondline (thickness)
0.001
0.002
0.004
0.030
0.060
0.090
F
Glass attach-bondline (thickness)
0.001
0.003
0.004
0.030
0.070
0.110
G
Imager to lid-outer surface
0.062
1.570
H
Imager to lid-inner surface
0.037
0.950
J
Imager to seating plane of package
0.050
0.051
0.052
1.270
1.300
1.330
Figure 33. Side View Dimensions
Figure 34. Bottom View of the 84-pin LCC Package (all dimensions in mm)
Pin 1
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IBIS5-B-1300 CYII5FM1300AB
Bonding of the IBIS5-B-1300 Sensor in the 84-Pin LCC Package
Figure 35. Bonding of the IBIS5-B-1300 in the 84-Pin LCC Package
Document #: 38-05710 Rev. *E
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IBIS5-B-1300 CYII5FM1300AB
Die Placement of the IBIS5-B-1300 in the 84-Pin LCC Package
Figure 36. Die Placement of the IBIS5-B-1300 in the 84-Pin LCC Package
Tolerance on the die placement in X- and Y-directions is maximal ±50 μm.
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IBIS5-B-1300 CYII5FM1300AB
Cover Glass
A D263 glass lid (which has a refraction index of 1.52) is used as a protection glass lid on top of all IBIS5-B-1300 sensors. Figure 37
shows the transmission characteristics of the D263 glass.
Figure 37. Transmission Characteristics of the D263 Glass
100
90
Transmission [%]
80
70
60
50
40
30
20
10
0
400
500
600
700
800
900
Wavelength [nm]
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IBIS5-B-1300 CYII5FM1300AB
Storage and Handling
Precautions and Cleaning
Storage Conditions
Table 29. Storage Conditions
Description
Temperature
Minimum
Maximum
Units
–30
+85
°C
Avoid spilling solder flux on the cover glass; bare glass and
particularly glass with antireflection filters are adversely affected
by the flux. Avoid mechanical or particulate damage to the cover
glass. Use isopropyl alcohol (IPA) as a solvent for cleaning the
image sensor glass lid. When using other solvents, make certain
to confirmed beforehand whether or not the solvent can dissolve
the package and/or the glass lid.
Handling and Soldering Conditions
X-ray inspection
Take special care when soldering image sensors with color filter
arrays (RGB color filters) onto a circuit board since color filters
are sensitive to high temperatures. Prolonged heating at
elevated temperatures can result in deterioration of the performance of the sensor. The following recommendations are made
to ensure that sensor performance is not compromised during
end-users' assembly processes.
X-ray inspection to check the solder leads of the image sensor
is not recommended because the high energetic radiation can
permanently damage the devices or cause image artefacts.
Board Assembly
Place the device onto boards in accordance with strict ESD
controls for Class 0, JESD22 Human Body Model, and Class A,
JESD22 Machine Model devices. Assembly operators must
always wear all designated and approved grounding equipment;
use grounded wrist straps at ESD protected workstations
including the ionized blowers. Use only ESD protected tools.
Manual Soldering
Observe the following conditions when using a soldering iron:
Use a soldering iron with temperature control at the tip. The
soldering iron tip temperature must not exceed 350°C. Make
certain that the soldering period for each pin is less than five
seconds.
Reflow Soldering
Figure 38 shows the maximum recommended thermal profile for
a reflow soldering system. If the temperature/time profile
exceeds these recommendations, damage to the image sensor
can occur. See Figure 38 for more details.
RoHS (Pb-free) Compliance
This paragraph reports the use of hazardous chemical
substances as required by the RoHS Directive (excluding
packing material).
Table 30. The Chemical Substances and Information About
Any Intentional Content
Chemical
Substance
Intentional
content?
Where is the intentional
content contained?
Lead
NO
-
Cadmium
NO
-
Mercury
NO
-
Hexavalent
Chromium
NO
-
PBB
(Polybrominated
biphenyls)
NO
-
PBDE
(Polybrominated
diphenyl ethers)
NO
-
Figure 38. Reflow Soldering Temperature Profile
Document #: 38-05710 Rev. *E
Page 37 of 41
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IBIS5-B-1300 CYII5FM1300AB
Information on Pb-Free Soldering:
IBIS5-B-1300-M2 (serial numbers beyond 3694): the product
was tested successfully for Pb-free soldering processes, using a
reflow temperature profile with maximum 260°C, minimum 40s
at 255°C and minimum 90s at 217°C.
Note ‘Intentional content’ is defined as any material demanding
special attention that is allowed into the product as follows:
1. A chemical composition is added into the inquired product
intentionally in order to produce and maintain the required
performance and function of the product.
2. A chemical composition which is used intentionally in the
manufacturing process, that is allowed into the product.
Document #: 38-05710 Rev. *E
The following case is not treated as ‘intentional content’:
1. The above material is contained as an impurity into raw materials or parts of the intended product. The impurity is defined
as a substance that cannot be removed industrially, or it is
produced using a process such as chemical composing or
reaction, and it cannot be removed technically.
Page 38 of 41
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IBIS5-B-1300 CYII5FM1300AB
Appendix A: IBIS5 Evaluation System
For evaluating purposes an IBIS5 evaluation kit is available.
The IBIS5 evaluation kit consists of a multifunctional digital board
(memory, sequencer and IEEE 1394 Fire Wire interface) and an
analog image sensor board.
Visual Basic software (under Win 2000™ or XP™) allows the
grabbing and display of images and movies from the sensor.
Store all acquired images and movies in different file formats (8
or 16-bit). You can adjust all setting on the fly to evaluate the
sensors specifications. You can load default register values to
start the software in a wanted state.
Figure 39. Content of the IBIS5 Evaluation Kit
Document #: 38-05710 Rev. *E
Page 39 of 41
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Appendix B: IBIS5-1300 Revision Overview
Table 31. IBIS5-1300 Revision Differences
Parameter
IBIS5-1300
IBIS5-A-1300
IBIS5-AE-1300
IBIS5-B-1300
Status
Obsolete
Production
Production
Sampling
QE * FF (peak)
0.13 A/W
(@ 650 nm)
0.16 A/W
(@ 650 nm)
0.21 A/W
(@ 760 nm)
0.16 A/W
(@ 650 nm)
Full well charge
120.000 e-
62.500 e-
62.500 e-
62.500 e-
Output signal swing
1V (unity gain)
1.8V (max.)
1.1V (unity gain)
1.8V (max)
1.1V (unity gain)
1.8V (max)
1.1V (unity gain)
1.8V (max)
Conversion gain
12 μV/e–
17.6 μV/e–
17.6 μV/e–
17.6 μV/e–
Temporal noise
85 e–
40 e–
40 e–
40 e–
S/N ratio
1412:1 / 63 dB
1563:1 / 64 dB
1563:1 / 64 dB
1563:1 / 64 dB
FPN
0.34 (% of fw)
0.15 (% of fw)
0.15 (% of fw)
0.15 (% of fw)
PRNU (at Qsat/2)
< 10% (p-p)
< 10% (p-p)
< 10% (p-p)
< 10% (p-p)
Dark current (average)
66 mV/s
7.22 mV/s
7.22 mV/s
7.22 mV/s
Pixel output rate
40 MHz
40 MHz
40 MHz
40 MHz
Frame rate
27.5 fps[6]
27.5 fps[6]
27.5 fps[6]
27.5 fps[6]
Interface
Serial
Serial 3-wire
Parallel
Serial 3-wire
Parallel
Serial 3-wire
Parallel
Serial 2-wire[7]
Serial 3-wire
Parallel
Extended dynamic range
Double/multiple slope
Double/multiple slope
Double/multiple slope
Double/multiple slope
Timing
See “Timing Diagrams” Identical
on page 18
Identical
Identical
50 kΩ
5 kΩ
10 kΩ
50 kΩ
50 kΩ
25 kΩ
50 kΩ
130Ω
240Ω
50 kΩ
0Ω
0Ω
50 kΩ
50 kΩ
25 kΩ
50 kΩ
90Ω
360Ω
50 kΩ
0Ω
0Ω
50 kΩ
50 kΩ
25 kΩ
50 kΩ
360Ω
1200Ω
Biasing:
2-wire[7]
DEC_CMD
DAC_VHIGH
DAC_VLOW
AMP_CMD
COL_CMD
PC_CMD
ADC_CMD
ADC_VHIGH
ADC_VLOW
50 kΩ
0Ω
0Ω
50 kΩ
50 kΩ
25 kΩ
50 kΩ
90Ω
360Ω
Notes
6. Rolling shutter mode (see also paragraph ).
7. The serial 2-wire interface is a write-only I2C-compatible interface.
Document #: 38-05710 Rev. *E
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IBIS5-B-1300 CYII5FM1300AB
Document History Page
Document Title: IBIS5-B-1300 CYII5FM1300AB 1.3 MP CMOS Image Sensor
Document Number: 38-05710
Rev.
ECN No.
Orig. of
Change
Submission
Date
**
310213
FVK
See ECN
New Data Sheet
*A
649064
FPW
See ECN
Ordering information update and new layout.
Implemented the new template. Moved figure captions to the top of the
figures and moved notes to the bottom of the page per new template.
Verified all cross-referencing. Moved the specifications towards the back.
Corrected one variable on the Master pages. Spelled checked.
*B
1162847
FPW/ARI
See ECN
BGA package information removed. Implemented new template. Edited for
template compliance.
*C
1417584
FPW
See ECN
Die placement drawing update
*D
2765859
NVEA
09/18/09
Updated Ordering Information table
*E
2786518
SHEA
10/14/09
Minor ECN to correct copyright year
Description of Change
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress offers standard and customized CMOS image sensors for consumer as well as industrial and professional applications.
Consumer applications include solutions for fast growing high speed machine vision, motion monitoring, medical imaging, intelligent
traffic systems, security, and barcode applications. Cypress's customized CMOS image sensors are characterized by very high pixel
counts, large area, very high frame rates, large dynamic range, and high sensitivity.
Cypress maintains a worldwide network of offices, solution centers, manufacturer's representatives, and distributors. For more
information on Image sensors, please contact [email protected].
© Cypress Semiconductor Corporation, 2005-2009. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document #: 38-05710 Rev. *E
Revised October 14, 2009
Page 41 of 41
PSoC Designer™, Programmable System-on-Chip™, and PSoC Express™ are trademarks and PSoC® is a registered trademark of Cypress Semiconductor Corp. All other trademarks or registered
trademarks referenced herein are property of the respective corporations. Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the
Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. All products and company names
mentioned in this document may be the trademarks of their respective holders.
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